Packaging Specification © 2005 Microchip Technology Inc. DS00049AC Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, Accuron, and may be superseded by updates. It is your responsibility to dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, ensure that your application meets with your specifications. PRO MATE, PowerSmart, rfPIC, and SmartShunt are MICROCHIP MAKES NO REPRESENTATIONS OR WAR- registered trademarks of Microchip Technology Incorporated RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, in the U.S.A. and other countries. WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, PICMASTER, SEEVAL, SmartSensor and The Embedded MERCHANTABILITY OR FITNESS FOR PURPOSE. Control Solutions Company are registered trademarks of Microchip disclaims all liability arising from this information and Microchip Technology Incorporated in the U.S.A. its use. Use of Microchip’s products as critical components in Analog-for-the-Digital Age, Application Maestro, dsPICDEM, life support systems is not authorized except with express dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, written approval by Microchip. No licenses are conveyed, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial implicitly or otherwise, under any Microchip intellectual property Programming, ICSP, ICEPIC, MPASM, MPLIB, MPLINK, rights. MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS00049AC-page ii © 2005 Microchip Technology Inc. M Packaging Index CERAMIC SIDE BRAZED DUAL IN-LINE FAMILY 8-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil Body....................................... 3 14-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil Body................................... 4 28-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil Body..................................... 5 CERAMIC DUAL IN-LINE (CERDIP) FAMILY 8-Lead Ceramic Dual In-line (JA) – 300 mil Body (CERDIP) ................................................................ 6 8-Lead Ceramic Dual In-line with Window (JW) – 300 mil Body (CERDIP) .......................................... 7 14-Lead Ceramic Dual In-line (JD) – 300 mil Body (CERDIP) .............................................................. 8 14-Lead Ceramic Dual In-line with Window (JW) – 300 mil Body (CERDIP) ........................................ 9 16-Lead Ceramic Dual In-line (JE) – 300 mil Body (CERDIP) ............................................................ 10 18-Lead Ceramic Dual In-line with Window (JW) – 300 mil Body (CERDIP) ...................................... 11 20-Lead Ceramic Dual In-line with Window (JW) – 300 mil Body (CERDIP) ...................................... 12 24-Lead Ceramic Dual In-line (JG) – 600 mil Body (CERDIP)............................................................ 13 28-Lead Ceramic Dual In-line (JJ) – 600 mil Body (CERDIP)............................................................. 14 28-Lead Ceramic Dual In-line with Window (JW) – 300 mil Body (CERDIP) ...................................... 15 28-Lead Ceramic Dual In-line with Window (JW) – 600 mil Body (CERDIP) ...................................... 16 40-Lead Ceramic Dual In-line (JK) – 600 mil Body (CERDIP) ............................................................ 17 40-Lead Ceramic Dual In-line with Window (JW) – 600 mil Body (CERDIP) ...................................... 18 CERAMIC CHIP CARRIER (CERQUAD) FAMILY 68-Lead Ceramic Leaded (CL) Chip Carrier with Window – Square (CERQUAD) ............................. 19 84-Lead Ceramic Leaded (CL) Chip Carrier with Window – Square (CERQUAD) ............................. 20 SMALL OUTLINE TRANSISTOR FAMILY 3-Lead Plastic Transistor Outline (TO) (TO-92) ..................................................................................21 3-Lead Plastic Small Outline Transistor Header (MB) (SOT-89)......................................................... 22 5-Lead Plastic Small Outline Transistor Header (MT) (SOT-89) ......................................................... 23 5-Lead Plastic Transistor Outline (AB) (TO-220).................................................................................24 5-Lead Thin Small Outline Transistor (OS) (TSOT) ............................................................................ 25 3-Lead Plastic Small Outline Transistor (TT) (SOT-23)....................................................................... 26 3-Lead Plastic Small Outline Transistor (TT) (SOT-23A) .................................................................... 27 5-Lead Plastic Small Outline Transistor (OT) (SOT-23) ...................................................................... 28 6-Lead Plastic Small Outline Transistor (CH or OT) (SOT-23)............................................................ 29 3-Lead Plastic Small Outline Transistor (LB) (SC-70)......................................................................... 30 5-Lead Plastic Small Outline Transistor (LT) (SC-70) ......................................................................... 31 Leadless Wedge Module Plastic Small Outline Transistor (WM) (SOT-385) ...................................... 32 DOUBLE DECA-WATT PACKAGE (DDPAK) FAMILY 3-Lead Plastic (EB) (DDPAK).............................................................................................................. 33 5-Lead Plastic (ET) (DDPAK).............................................................................................................. 34 7-Lead Plastic (EK) (DDPAK).............................................................................................................. 35 © 2005 Microchip Technology Inc. DS00049AC-page iii M Packaging Index PLASTIC DUAL IN-LINE (PDIP) FAMILY 8-Lead Plastic Dual In-line (P) – 300 mil Body (PDIP).........................................................................36 14-Lead Plastic Dual In-line (P) – 300 mil Body (PDIP)....................................................................... 37 16-Lead Plastic Dual In-line (P) – 300 mil Body (PDIP)....................................................................... 38 18-Lead Plastic Dual In-line (P) – 300 mil Body (PDIP)....................................................................... 39 20-Lead Plastic Dual In-line (P) – 300 mil Body (PDIP)....................................................................... 40 24-Lead Plastic Dual In-line (P) – 600 mil Body (PDIP)....................................................................... 41 24-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP) ........................................................ 42 28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP) ........................................................ 43 28-Lead Plastic Dual In-line (P) – 600 mil Body (PDIP)....................................................................... 44 40-Lead Plastic Dual In-line (P) – 600 mil Body (PDIP)......................................................................