SkyLight Glass Keep It Glassy TM Group #13 Ben Farris 一 Computer Engineering Paul Fedi 一 Electrical Engineering Blake Loeb 一 Computer Engineering William Tyback 一 Computer Engineering Table of Contents 1. Executive Summary................................................................................................... 1 2. Project Narrative........................................................................................................ 2 2.1. Motivation...................................................................................................... 2 2.2. Project Goals and Objectives......................................................................... 2 2.3. Marketing and Engineering Requirements.................................................... 3 2.4. House of Quality............................................................................................ 4 2.5. Block Diagram of the System........................................................................ 5 2.6. Preliminary Sketches of the System.............................................................. 5 3. Research and Strategic Part Selection........................................................................7 3.1. Related Technologies..................................................................................... 7 3.1.1. Smart Glass........................................................................................ 7 3.1.1.1. Active Smart Glass................................................................ 7 3.1.1.2. Passive Smart Glass............................................................... 13 3.1.2. Light Emitting Diodes (LED)............................................................ 15 3.1.2.1. Dual In-Line Package (DIP).................................................. 19 3.1.2.2. Surface Mounted Devices (SMD).......................................... 20 3.1.2.3. Chip on Board (COB)............................................................ 21 3.1.3. Power Supply Concepts..................................................................... 21 3.1.4. Power Control.................................................................................... 23 3.1.5. Light Control Considerations............................................................. 25 3.1.5.1. Sunlight.................................................................................. 26 3.1.5.2. Internet Data...........................................................................27 3.1.5.3. Light Sensors......................................................................... 27 3.1.6. Temperature Considerations.............................................................. 30 3.1.6.1. Temperature Sensors.............................................................. 31 3.1.7. Real Time Clock................................................................................ 33 3.1.7.1. MCP7940M........................................................................... 34 3.1.7.2. AB-RTCMC........................................................................... 35 3.1.7.3. DS1307.................................................................................. 35 3.1.8. Keypad............................................................................................... 35 3.1.8.1. Keypad Analysis.................................................................... 36 3.1.9. Microcontroller Options.................................................................... 38 3.1.9.1. Architecture........................................................................... 38 3.1.9.2. MSP430FG4618.................................................................... 39 3.1.9.3. CC2640RF............................................................................. 40 3.1.9.4. CC3200.................................................................................. 41 3.1.9.5. ATmega328P......................................................................... 42 3.1.10. Microcontroller Software................................................................... 43 3.1.10.1. Code Composer Studio.......................................................... 43 3.1.10.2. Arduino IDE...........................................................................43 3.1.11. Bluetooth and Wireless Communication........................................... 44 3.1.11.1. Serial Communication........................................................... 44 3.1.11.2. Bus Contention...................................................................... 44 i 3.1.11.3. Serial vs Parallel Communication.......................................... 45 3.1.11.4. Synchronous vs. Asynchronous Communication.................. 45 3.1.11.5. Implementation of Asynchronous Technology...................... 46 3.1.12. Bluetooth Module.............................................................................. 47 3.1.12.1. Hardware for Data Transfer................................................... 48 3.1.12.2. UART..................................................................................... 49 3.1.12.3. Bluetooth Features................................................................. 50 3.1.12.4. Power Consumption............................................................... 51 3.1.12.5. Breakout Boards and Bluetooth............................................. 52 3.1.13. Bluetooth Software............................................................................ 52 3.1.13.1. Pairing.................................................................................... 53 3.1.13.2. Permissions for Bluetooth Application Software.................. 53 3.1.13.3. Setting Up Bluetooth............................................................. 54 3.1.13.4. Finding SkyLight Glass via Bluetooth................................... 54 3.1.13.5. Master and Slave Piconet....................................................... 56 3.1.14. Smartphone Application.................................................................... 56 3.2. Major Part Selection...................................................................................... 58 3.2.1. Smart Film Vendors........................................................................... 58 3.2.1.1. Smart Tint® by Smart Tint, Inc............................................. 58 3.2.1.2. SONTE Film by SONTE....................................................... 59 3.2.1.3. InvisiShade 4.0 by InvisiShade™.......................................... 60 3.2.1.4. Polyvision™ by Polytronix™................................................ 61 3.2.2. Smart Film Selection..........................................................................62 3.2.3. LED Vendors..................................................................................... 64 3.2.3.1. 6W E27 LED Bulbs by LEDENET®.................................... 64 3.2.3.2. 2 Chip SMD LED Light Strip by Super Bright LEDs, Inc... 64 3.2.4. LED Selection.................................................................................... 65 3.2.5. Relay Selection.................................................................................. 67 3.2.6. Power Component Selection.............................................................. 68 3.2.7. Light Sensor Selection....................................................................... 70 3.2.8. Temperature Sensor Selection........................................................... 70 3.2.9. Real Time Clock Selection................................................................ 71 3.2.10. Microcontroller Selection.................................................................. 72 3.2.11. Bluetooth Module Selection.............................................................. 74 3.3. Major Component Overview......................................................................... 75 4. Standards and Constraints.......................................................................................... 77 4.1. Standards........................................................................................................ 77 4.1.1. UL Standard UL8750......................................................................... 77 4.1.2. IEEE PAR1789.................................................................................. 78 4.1.3. IEEE 802.15.1: Bluetooth.................................................................. 80 4.1.4. IEEE 802.15.1: WPAN...................................................................... 83 4.1.5. TIA RS-232 UART Serial Communication....................................... 87 4.1.6. IPC-7251 Standards........................................................................... 88 4.2. Design Constraints......................................................................................... 88 ii 4.2.1. Power................................................................................................. 88 4.2.2. Bluetooth…………............................................................................ 89 4.2.3. Ethical, Social, and Political.............................................................. 90 4.2.4. Health and Safety............................................................................... 90 4.2.5. Economics and Time……..................................................................91 5. Subsystem Design and Testing.................................................................................. 93 5.1. LED Subsystem............................................................................................