The Hong Kong Polytechnic University Knowledge Update Course for Industrial Centre Secondary Computer Teachers Basic Computer Maintenance and Troubleshooting Techniques • Assemble your own computer system • Installing O/S • Tweaking BIOS settings • Advanced chipset features Computer Organisation • Installing hardware PC Maintenance & • Awareness of compatibility Hardware vs hardware Troubleshooting Software vs hardware Software vs software Edw ard Cheung • Dual-booting email: [email protected] 25 July, 2003. 030725 CIT A PC M aintenanc e. ppt 1 030725 CIT A PC M aintenanc e. ppt 2 Basic Computer Maintenance Basic Troubleshooting Techniques •Power Check • Power Supply • Disk defragmentation • Reboot • System backup • Flash the BIOS • System fine-tuning •System recovery Temporary files handling • Virus check Memory management • Release system resources • Over-clocking • System performance enhancement and optimization Processor rating Over-clocking vs over-heating Fans and cooling systems 030725 CIT A PC M aintenanc e. ppt 3 030725 CIT A PC M aintenanc e. ppt 4 Modern PC Components/FRUs of a PC • Modern PC is a modular design and composed of many •Enclosures replaceable components. They are sometimes known as field replaceable units (FRU). • Power Supply • There are a number of form factors for motherboard and • Motherboard – mainboard & extension board chassis which limits the expansion capability and the • Processor – CPU chip selection of chipset. • Chassis selection depends on applications, the number and • DRAM – DRAM modules type of drive bays, power supply and Motherboard • Video System – video graphics adapter selection. • Sound System – sound card • Common form factors for motherboards are ATX, LPX, NLX, WTX & mini-ITX • Storage Devices – hard disk / floppy disk / CD/DVD • The smallest desktop unit is the mini-ITX supported by devices VIA only. • Communication Adapter – network adapter http://www.formfactors.org/ http://www.mini-ITX.com • Input Devices – keyboard / mouse / pen input 030725 CIT A PC M aintenanc e. ppt 5 030725 CIT A PC M aintenanc e. ppt 6 Example – Assemble your own computer system Power Supply •Chassis • Power supply convert AC power and supply DC power to the Material computer system. • Aluminium Alloy vs. Mild • For ordinary PC, power supply should comply with the ATX Steel requirement on size and pin-out. (not on power rating) Secuity • Watch for proprietary power supply connectors on brand name Robustness products. Read the rating label before connecting power. Finishing E.g. Dell Dimension 8100 P4 2GHz Power supply is not a standard • Number of drive bays ATX power supply (use 24-pin connector instead of 20-pin) HDD/FDD Detail connector pin assignment is available at: CD Drives • http://support.ap.dell.com/docs/systems/dsleest/techovu.htm#dc_pow More for SCSI/RAID er_connector_pin_assignments • Location of connectors Dell Dimension XPS B Series P3 series use 20-pin connector but USB with different pin-out. Firewire • http://support.ap.dell.com/docs/systems/dmag/techovu.htm#dc_power • Ventilation _connector_pin_assignments Number of fans in chass is • New models of Dell have reverted to use the ATX specification. • Cable dressing and accessibility 030725 CIT A PC M aintenanc e. ppt 7 030725 CIT A PC M aintenanc e. ppt 8 Pin-out of an ATX Power Supply Power Requirement for a PC Selection Criteria Desc. Pin # Desc. Pin # • type of chassis and motherboard 3V3 11 3V3 1 • safety approval markings means that the power supply model has been -12V 12 3V3 2 following a fabrication control procedure and have complied with national/international standards on electrical and fire safety. COM 13 COM 3 • Usually the manufacturer will obtain approval from test authorities such as Underwriter Laboratory(UL) for USA, Canadian Standard Association (CSA PS-ON 14 5V 4 or C-UL) and European approval such as VDE or TUV from Germany. There COM 15 COM 5 are fail safe mechanisms if the power supply model comply with national / international standards. COM 16 5V 6 COM 17 COM 7 Typical Power Supply Requirements for PC -5V 18 POK 8 Common Enclosures Power Supply 5V 19 5VSB 9 Baby Case 130W - 175W 5V 20 12V 10 Desktop Cases 200W – 250W This 20-pin ATX pow er connector is used by virtually all current systems w ith ATX, Tower Cases >300W Micro-ATX and NLX motherboards Server Chassis 400W - 600W There are tw o additional connectors; 6-pin 5Vn & 3V3 auxiliary pow er connector (Molex) for >250W pow er supply and 4-pin ATX12V connector for P4 board. *Some server power supply may reach 800W 030725 CIT A PC M aintenanc e. ppt 9 030725 CIT A PC M aintenanc e. ppt 10 A Typical Power Supply Rating Label Major Selection Considerations for Motherboard •Processor speed and package • Form factor Number and type of bus slots • PCI – 32 vs 64 bit; ISA is fading out • AGP - match the display controller • DRAM system Type and Number of DRAM Slots;DDR, parity DRAM capacity; can the motherboard support 4GB? • On board features Network – Ethernet 10/100/1000 Sound chips Location and type of Interfaces • SCSI, serial, USB 2.0, Firewire, etc. 030725 CIT A PC M aintenanc e. ppt 11 030725 CIT A PC M aintenanc e. ppt 12 Processor Chipset • Intel Celeron or Pentium 4 or AMD • Selection of chipset depends largely on the processor Duron or Athlon • Normally is 2 chips per set known as the north bridge and the south bridge • Intel has announced Pentium 4 • The 82845G Memory Control Hub (MCH) is packaged in a 593 Flip Chip Ball processor at 3.06GHz on 14/11. Grid Array (FCBGA) Current model is around 1.8 to 2.4 • Some chipset provide on-board graphic adapter. For example, the MCH needs GHz on 2 speed system bus:- to balance memory usage between graphics and application for optimal system performance and video takes up system memory. 533 MHz system bus : • 2.26GHz to 3.06GHz 400 MHz system bus : • 1.70GHz to 2.60GHz • The Intel® Pentium® 4 processor is available in package types OOI 423-pin(400MHz bus, PGA-423 form factor) or FC-PGA2 478- pin(400/533MHz bus, mPGA-478 form factor). 030725 CIT A PC M aintenanc e. ppt 13 030725 CIT A PC M aintenanc e. ppt 14 Intel 845G Chipset Architecture Intel 845 Chipset Features • Each chipset contains two Chipset 845 845E 845G North Bridge 82845 MCH 82845 MCH 82845 MCH main components: South Bridge 82801BA ICH2 82801BA ICH2 82801BA ICH2 Graphics and Memory 400 MHz system bus X X X 533 MHz system bus X X Controller Hub (GMCH) Intel Hub Architecture X X X for the host bridge and Intel Extreme Graphics Technology X Inte l Dynamic Video Output X I/O Controller Hub(ICH) Inte rfac e for the I/O subsystem. DDR200 or DDR266 SDRAM X X X PC133 SDRAM X X The GMCH provides the AGP interface 4X 4X 4X processor interface, LAN connect interface X X X system memory interface, Alert on LAN 1.0 1.0 1.0 USB ports US B 1.1 Hi-Speed USB 2.0 Hi-Speed USB 2.0 hub interface, and ( 4 ports ) ( 6 ports ) ( 6 ports ) IDE interface Ultra ATA / 100 Ultra ATA / 100 Ultra ATA / 100 additional interfaces. Inte l App lication Acc eler ator X X X Each GMCH contains an AC97 Controller X X X integrated graphics Dual DMA Au dio E ngines X Communications Network Riser X X X controller (IGD). Both the Card 845G chipset and 845GL Low-power sleep mode X X X chipset use the 82801DB. 030725 CIT A PC M aintenanc e. ppt 15 030725 CIT A PC M aintenanc e. ppt 16 VIA P4X333 Chipset System Block Diagram Memory Features:- •Type • For Int el Pent ium4 processor 72-pin SIMM - Single in line memory module – obsolete 400/533MHz FSB •AGP 2X/4X/8X 168-pin DIMM with SDRAM Synchronous Dynamic RAM • Support up to 3.0GB DR200/266/333 chips – fading out SD RAM • 8X V-Link 533MB/s high bandwidth RDRAM RIMM – Rambus Inline Memory Module – fading Nort h/Sout h Bridge int erconnect out • Support for Advanced • Work in pair Communications Riser (ACR) Card St an dar d • Need terminator in empty slot • Int egrat ed 6 channel Surround Sound 184-pin DDR Double Data Rate SDRAM AC-97 Audio • This is the main stream • Int egrat ed MC-97 Modem • Int egrat ed 10/100 Ethernet MAC • Capacity • Support for ATA 33/66/100/133 • Support for USB 2.0, 6 USB ports, Motherboard typically has 4 memory slots (Taiwan UHCI compliant motherboard) and proprietary system has 2 to 4 memory • Advanced power management slots. capabilities including ACPI/OnNow 030725 CIT A PC M aintenanc e. ppt 17 030725 CIT A PC M aintenanc e. ppt 18 Memory Modules Memory Bandwidth Synchronous RAM ( SDRAM ) 168 pin DIMM Module • Rambus ( RDRAM ) : Peak Bandwidth = ( Memory Bus Width ) x ( Data Rate ) x Number of Channels where Data Rate = ( Memory Bus Speed x Operations/Clock Cycle ) Each standard RIMM module is 16 bits wide, or 2 Bytes in width Rambus Memory ( RDRAM ) 184 pin RIMM Module (1 byte = 8 bits ). • Peak bandwi dth for PC800 RIMM Modules ( single memory channel) (2 Bytes) x (800 MHz Data Rate) x 1 channel = 1,600 MB/s or 1.6 GB/s. Double Data Rate RAM ( DDR RAM) 184 pin DIMM Module • Peak bandwi dth for PC800 RIMM Modules (dual memory channel) (2 Bytes) x (800 MHz Data Rate) x 2 channels = 3,200 MB/s or 3.2 GB/s. 030725 CIT A PC M aintenanc e. ppt 19 030725 CIT A PC M aintenanc e. ppt 20 Memory Bandwidth (cont.) Summary of Memory Bandwidth • Double Data Rate RAM ( DDR RAM ) : Peak Bandwidth = ( Memory Bus Width ) x ( Data Rate ) where PC100 PC133 Single- Dual- PC1600 PC2100 PC2700 SDRAM SDRAM Channel Channel DDR DDR DDR Data Rate = ( Memory Bus Speed x Operations/Clock Cycle ) PC 800 PC800 Each DIMM module is 64 bits wide, or 8 Bytes in width.