Invent the new reality. Intel Architecture = Embedded + Dynamic + Visual Pat Gelsinger Senior Vice President and Co-General Manager Digital Enterprise Group In Retrospect “The vision of a billion connected “Our vision is for a billion phones and a billion connected interconnected computers “We are heading toward a handsets is happening . By 2010, attached to the Internet. The world of a billion — a those same trends will give us a mobile or wireless vision is a billion connected 1.5B connected PCs, except this billion subscribers who can talk computers.” time, it's broadband . Those same to each other and also have trends will give us 2.5B Internet access.” connected handsets.” Andrew S. Grove Craig Barrett Paul Otellini Chairman & CEO, Intel Corporation CEO, Intel Corporation President & COO, Intel Corporation IDF, February 17, 1998 IDF August 22, 2000 IDF, Sept 23, 2003 The Internet Today: 3rd Generation Ubiquitous Many Researchers Mainframes Servers, PC’s Cell Phones The Embedded Internet: 4th Stage Pervasive Ubiquitous Many Researchers Mainframes Servers, PC’s Cell Phones Embedded Internet – 7x24, Every Modality of Life The Embedded Internet by 2015 15B Devices Pervasive Ubiquitous Many Researchers Mainframes Servers, PC’s Cell Phones Embedded Internet – 7x24, Every Modality of Life The Next Wave of Devices “Personal” “Public” Towards 15B Devices by 2015 Top Barriers Reliability and Long Life Software Scalability Low Power and Low Cost Privacy and Data Security IPv4 Addressing Open Standards Towards 15B Devices by 2015 Top Barriers Solutions Reliability and Long Life Intel® Products Software Scalability Intel Architecture Low Power and Low Cost Intel® Atom™ Processor and SoCs Privacy and Data Security Encryption, Standards, Policy IPv4 Addressing Drive Towards IPv6 by 2012 Wifi, WiMAX, RFID, Bluetooth Open Standards ZigBee, Z-Wave, LTE, P2P SIP, Open IPTV Serving the Embedded Segment Since 1976 1970’s 1980’s 1990’s 2000 2005 1st Integrated Silicon Chipset For Embedded Intel Creates 1st Embedded Ecosystem Ecosystem Program Intel Enters Keynote at Intel Intel st Embedded 1 Embedded Revenue Revenue Market Market Systems $500M+ In $1B+ In Segment Conference Embedded Embedded Embedded Market Segment Is Growing Celebrating 30+ Years in Embedded The Preferred Architecture for Embedded Internet Scalable Architecture Long Life Cycle Support PC Embedded Solutions from <1W-130W Intel Architecture Purpose Built Solutions World’s Best Ecosystem and Tools Embedded Products Today and Future Traditional Embedded IA Desktop Mobile Embedded Products Today and Future Traditional New Low Power IA Embedded IA Introduced: April 2008 Fan-less <5W Platform Small Footprint ~700 Embedded Customer Design Engagements Accelerating Conversion From Other Architectures Desktop Mobile Embedded Products Today and Future Traditional New Low Power IA and SoCs for Embedded Embedded IA Announced July 2008 First IA SOC since 80386EX in 1994 – Intel® QuickAssist Technology – Communications I/O Industrial temperature offering 45% area savings*, 30% power savings* Q3’08 production Desktop Mobile 2008 Embedded Products Today and Future Traditional New Low Power IA and SoCs for Embedded Embedded IA Q1’09 2H’09 Desktop Mobile 2008 Home Automation Open Architecture Low-power Small Form Factor IP Media Phones: Resetting Expectations For The Home Phone In-Vehicle Infotainment: Bringing IT to the Car Emerging Open Infotainment Platform Design Services TV: Terrestrial/Satellite Middleware and Rich 3D GPS Applications Social Networking Board Vendors/ODMs Online Gaming Video On Demand Operating Systems Office Synch Complimentary Auto Silicon NG Remote Diagnostics Supported by Broad Eco-System Industry Momentum “BMW Group welcomes Intel’s “A more open and standard “With open infotainment commitment to the approach to infotainment platforms, our traditional tier automotive infotainment product development will 1 suppliers could concentrate space, enabling us to bridge enable the automotive on using their engineering the gap between current industry to more quickly meet power to create new automotive implementations the consumer demands for innovations for us. I also and the consumer sector.” Multimedia and Internet expect quality improvements access.” since multiple suppliers will Christoph Grote be able to use and test the Senior Vice President Information & Tsuguo NOBE same software." Communication Systems General Manager BMW Group NISSAN MOTOR CO., LTD. Mr Häussermann VP Infotainment Development Daimler - Mercedes Benz BMW Group In-Vehicle Infotainment Alex Busch Information and Communication Systems BMW Group “… the solution for the future could be to add vehicle-specific components and requirements to existing IT technology and make it suitable for use in cars.” (Source: BMW Group press release, March 12, 2008, http://www.press.bmwgroup.com/pressclub/gb02.nsf, BMW Innovation Day 2008) The Embedded Internet by 2015 15B Devices Pervasive Ubiquitous Many Researchers Mainframes Servers, PC’s Cell Phones Embedded Internet – 7x24, Every Modality of Life Intel Architecture Embedded + Dynamic + Visual Tick-Tock Development Model: Predictable, Sustained Microprocessor Leadership Intel® Core™ Nehalem microarchitecture Future uArch Merom Penryn Nehalem Westmere Sandy Bridge NEW NEW NEW NEW NEW Microarchitecture Process Microarchitecture Process Microarchitecture 65nm 45nm 45nm 32nm 32nm TOCK TICK TOCK TICK TOCK Montecito / Tukwila Poulson Montvale NEW NEW NEW Microarchitecture Microarchitecture Microarchitecture 90nm 65nm 32nm Forecast All dates, product descriptions, availability and plans are forecasts and subject to change without notice. Next Generation Intel® Itanium® (Tukwila) st “With Intel’s upcoming 1 2B transistor chip quad-core Tukwila processor, Windows Built for mission critical enterprise Server solutions running on Itanium-based – On-die error protection systems will provide an even more scalable and – RAS reliable datacenter foundation for our – Advanced power and thermal management customers.” 2nd generation Virtualization Technology Bill Laing Strong roadmap with Poulson and Kittson Corporate Vice President Windows Server Division, Microsoft Business Critical Capabilities for Most Demanding Systems Intel® Xeon® 7400 Series (Dunnington) Virtualization platform of choice – just got better Cores Cores Investment Protection Cache – Intel VT FlexMigration System Interface – Socket compatible with Xeon™ 7300 Cores Cache 45 nm high-k – 6 cores – 16MB shared L3 cache Extending MP Leadership in September 2008 Intel® Xeon® Processor 7400 Series: Setting New Enterprise Performance Records TPC Benchmark* C - DB2 TPC Benchmark* C – SQL Server 1,200,632 tpmC 634,825 tpmC First 8S 1 M+ TPC-C database result for Xeon! SPECjbb*2005 - – Java HotSpot TPC Benchmark* E JVM 671.4 tpsE 531,669 bops vConsolidate – SPECint*_rate2006 VMware* ESX 39% better** 277 peak score Unquestioned Expandable Server Leadership **Intel Xeon X7460 (16M cache, 2.66GHz, 1066FSB) 6-Core compared to Intel Xeon X7350 (4M cache, 2.93GHz, 1066FSB) Quad-Core Nehalem Family Server and Efficient Expandable (4S+) Workstation Performance (2S) Business and High End Mainstream Consumer Desktop Client Clients Thin and Light Notebook Nehalem: Next Generation Micro-architecture Energy Efficient Performance Turbo Mode Intel Hyper-Threading Dynamic Power Management Technology Nehalem 3x Memory Bandwidth Intel’s 2nd Generation Virtualization Best in Class Bandwidth with QPI Industry’s First Dynamically Scalable Architecture Rajesh Kumar Intel Fellow Director, Circuit & Low Power Technologies Intel Corporation Integrated Power Gate Clock Gate – Standard in all Intel CPUs VCC – Eliminates switching power – Leakage power remains Power Gate: New Core0 Core1 Core2 Core3 – Eliminates switching and leakage power Memory System, Cache, I/O VTT – Enables idle cores to go to near zero power (C6) independently – Transparent to platform and software – No incremental platform cost Power Gates Silicon Technology Polymer M9 7 mm Cu M1-8 Package Like Metal (M9) Deposited On Specialized, Ultra-low Leakage Transistor Silicon to Create Low On-resistance Developed for High Off-resistance Intel Design and Process Technology Co-development Power Management: Power Control Unit Vcc BCLK Core 0 Vcc PLL Frequency PLL Sensors Core 1 • Integrated microcontroller Vcc Frequency PLL • Controlled by firmware Sensors • Real time sensors for Core 2 current/ power, voltage, PCU Vcc temperature Frequency PLL Sensors • Enables sophisticated Core 3 algorithms for current Uncore , operating conditions Vcc LLC Frequency PLL Sensors Frequency (F) Core 0 No Turbo Core 1 Core 2 Core 3 Lightly Threaded Workload <TDP Workload Threaded Lightly Nehalem TurboMode Frequency (F) Core 0 Core 1 Core 2 Core 3 Frequency (F) Core 0 No Turbo Core 1 Core 2 Core 3 Lightly Threaded Workload <TDP Workload Threaded Lightly Near Zero Power For Inactive Cores Inactive For Power Zero Near Nehalem TurboMode Power Gates Frequency (F) Core 0 Core 1 Core 2 Core 3 Nehalem Turbo Mode Power Gates Turbo Mode Near Zero Power For Inactive Cores Adds Additional Performance Bins* In Response To Workload No Turbo Lightly Threaded Workload < TDP Core 1 Core 2 Core 3 Core 1 Core 0 Core 0 Frequency (F) Frequency Frequency (F) Frequency *within power and thermal constraints Nehalem Turbo Mode Power Gates Turbo Mode Near Zero Power For Inactive Cores Adds Additional Performance Bins* In Response To Workload No Turbo Lightly Threaded Workload < TDP Core 1 Core 2 Core 3 Core 1 Core 0 Core 0 Frequency