UCF Senior Design II Department of Electrical Engineering and Computer Science & Center for Research and Education in Optics and Lasers University of Central Florida Directed High Frequency, Open-air Communication Group 29 Sandy Cline Photonics [email protected] Ryan Heitz Computer Engineering [email protected] Shane Zweibach Computer Engineering [email protected] Brian Ascencio Electrical Engineering [email protected] i This page is intentionally left blank ii Table of Contents 1.0 EXECUTIVE SUMMARY .................................................................................................. 1 2.0 PROJECT DESCRIPTION.................................................................................................. 3 2.1 MOTIVATION ............................................................................................................. 4 2.2 OBJECTIVES ................................................................................................................ 4 2.3 REQUIREMENT SPECIFICATIONS ............................................................................... 5 2.4 HOUSE OF QUALITY ................................................................................................... 5 2.5 USERS......................................................................................................................... 7 3.0 RESEARCH ..................................................................................................................... 8 3.1 Existing Products ....................................................................................................... 8 3.1.1 NASA Laser Communication ............................................................................... 8 3.1.2 Light Fidelity (Li-Fi) .............................................................................................. 9 3.1.3 RONJA ............................................................................................................... 12 3.2 Microcontroller ....................................................................................................... 12 3.2.1 Microcontroller considerations ........................................................................ 12 3.2.2 Microcontroller comparisons ........................................................................... 17 3.3 Complex Single Board Computers ........................................................................... 19 3.3.1 Raspberry PI ...................................................................................................... 19 3.4 Market Analysis ....................................................................................................... 21 3.5 Relevant Technology ............................................................................................... 23 3.5.1 Storage .............................................................................................................. 23 3.5.2 SD Cards: a viable alternative? ......................................................................... 24 3.6 Developmental Tools .............................................................................................. 26 3.6.1 Integrated Development Environment (IDE) .................................................... 26 3.6.2 Soldering Iron ................................................................................................... 28 3.6.3 Oscilloscopes .................................................................................................... 28 3.6.4 Function generators ......................................................................................... 28 3.6.5 Cymometer ....................................................................................................... 28 3.6.6 Multimeters ...................................................................................................... 29 3.7 Serial Communication Technologies ....................................................................... 29 3.7.1 SPI ..................................................................................................................... 29 3.7.2 I2C ...................................................................................................................... 30 3.7.3 UART ................................................................................................................. 31 iii 3.8 Photosensor selection ............................................................................................. 32 3.8.1 p-n junction photodiode ................................................................................... 32 3.8.2 p-i-n photodiode ............................................................................................... 33 3.8.3 Avalanche Photodiode (APD) ........................................................................... 33 3.8.4 Schottky junction photodetector ..................................................................... 34 3.8.5 Phototransistor ................................................................................................. 35 3.8.6 Sensor selection ................................................................................................ 35 3.9 Light source selection .............................................................................................. 37 3.9.1 LED .................................................................................................................... 37 3.9.2 Fabry-Perot semiconductor laser diode ........................................................... 39 3.9.3 VCSEL ................................................................................................................ 42 3.9.4 Quantum Cascade Laser (QCL) ......................................................................... 43 3.9.5 DFB and DBR lasers ........................................................................................... 44 3.9.6 ECDL .................................................................................................................. 45 3.9.7 Gas lasers & Chemical lasers ............................................................................ 45 3.9.8 Laser diode selection ........................................................................................ 45 3.9.8 Considerations for optical components ............................................................... 46 3.9.9 Simulation & Modeling ........................................................................................ 47 3.10 Bluetooth Connectivity ......................................................................................... 47 3.11 File System Types .................................................................................................. 48 3.11.1 FAT32 .............................................................................................................. 48 3.11.2 NTFS ................................................................................................................ 49 3.11.3 exFAT .............................................................................................................. 49 3.12 Project Management Software ............................................................................. 50 3.12.1 Beyond Compare ............................................................................................ 50 3.12.2 GitHub ............................................................................................................. 50 3.12.3 Slack ................................................................................................................ 51 3.12.4 GroupMe......................................................................................................... 51 3.13 Microcontroller Choice ......................................................................................... 52 4.0 RELATED STANDARDS & DESIGN CONSTRAINTS ........................................................ 53 4.1 RELATED STANDARDS .............................................................................................. 53 4.1.1 RoHS Standards ................................................................................................ 53 4.1.2 Coding Standards .............................................................................................. 54 iv 4.1.3 Soldering Safety ................................................................................................ 56 4.1.4 Open Systems Interconnection model (OSI) .................................................... 57 4.1.5 Ethernet technologies ...................................................................................... 58 4.1.6 TCP/IP Protocol Suite and UDP ......................................................................... 59 4.1.7 Line Coding for 10BASE-T and USB 2.0 ............................................................. 60 4.1.8 ANSI Z 136 ......................................................................................................... 61 4.2 DESIGN CONSTRAINTS ............................................................................................. 62 4.2.1 TIME CONSTRAINTS .......................................................................................... 62 4.2.2 ECONOMIC CONSTRAINTS ................................................................................ 63 4.2.3 SAFETY CONSTRAINTS ...................................................................................... 63 4.2.4 ENVIRONMENTAL