Giant Magnetoresistance: Basic Concepts, Microstructure, Magnetic Interactions and Applications

Giant Magnetoresistance: Basic Concepts, Microstructure, Magnetic Interactions and Applications

sensors Review Giant Magnetoresistance: Basic Concepts, Microstructure, Magnetic Interactions and Applications Inga Ennen 1,*, Daniel Kappe 1, Thomas Rempel 1, Claudia Glenske 2 and Andreas Hütten 1 1 Faculty of Physics, University of Bielefeld, P.O. Box 100131, 33501 Bielefeld, Germany; [email protected] (D.K.); [email protected] (T.R.); [email protected] (A.H.) 2 Sensitec GmbH, Georg-Ohm-Straße 11, 35633 Lahnau, Germany; [email protected] * Correspondence: [email protected]; Tel.: +49-521-106-5418 Academic Editors: Subhas Mukhopadhyay and Chinthaka Pasan Gooneratne Received: 4 May 2016; Accepted: 3 June 2016; Published: 17 June 2016 Abstract: The giant magnetoresistance (GMR) effect is a very basic phenomenon that occurs in magnetic materials ranging from nanoparticles over multilayered thin films to permanent magnets. In this contribution, we first focus on the links between effect characteristic and underlying microstructure. Thereafter, we discuss design criteria for GMR-sensor applications covering automotive, biosensors as well as nanoparticular sensors. Keywords: giant magnetoresistance; granular GMR; automotive applications; biosensors; nanoparticular sensors 1. Introduction It has been almost 30 years since one of the most fascinating advances in solid state physics occurred, the discovery of the giant magnetoresistance effect (GMR) by Grünberg and Fert in 1988 [1,2]. In thin metallic film systems, they observed that the magnetization of adjacent ferromagnetic films, separated by a thin non-magnetic interlayer, spontaneously align parallel or antiparallel, depending on the thickness of the interlayer. The orientation of the magnetization in the ferromagnetic layers strongly influences the resistance of the system. A parallel orientation is characterized by an electrical state of low resistance, while an antiparallel orientation is a state of high resistance. Due to the fact that the spacer layer thickness determines the initial configuration, an initially antiparallel orientation can be realized. The charm of this system lies in the fact that it enables a sensing of external magnetic field strengths in electrical units in between the two electric states of resistance. This discovery triggered an extensive research activity in this field in order to understand the underlying physical phenomenon as well as to exploit its technological potential. A remarkably short period, only a decade, lies between the discovery of the GMR effect and its first commercial realization in the form of magnetic field sensors and hard-disk read-heads [3]. Nowadays the spectrum of successful applications of GMR technology is impressively broad, ranging from applications in the air- and space or automotive industry, non-destructive material testing, or the compass functionality in mobile phones to biomedical techniques, like biometric measurements of eyes and biosensors, e.g., for the detection of viruses [3–5]. Thus, the potential of magnetoresistive technology seems to be far from being exhausted. Nowadays the underlying physics of GMR and the interlayer exchange coupling are broadly understood. Nevertheless, when it comes to detail, discrepancies between experimental observations and theoretical models can arise: a realistic theoretical description of electron scattering at lattice discontinuities, disorder or defects is still a crucial factor [6,7]. Sensors 2016, 16, 904; doi:10.3390/s16060904 www.mdpi.com/journal/sensors Sensors 2016, 16, 904 2 of 24 Sensors 2016, 16, 904 2 of 24 In this review, we intend to provide an overview of different aspects of the GMR effect. The first In this review, we intend to provide an overview of different aspects of the GMR effect. The first section will focus on some of the ideas used to describe GMR effects theoretically in multilayers and to section will focus on some of the ideas used to describe GMR effects theoretically in multilayers and extend them into granular systems. Thereafter, we will have a look at different systems in which GMR to extend them into granular systems. Thereafter, we will have a look at different systems in which can occur, with emphasis on the application-relevant side. GMR can occur, with emphasis on the application-relevant side. 2. Theory 2. Theory 2.1. Giant Magnetoresistance in Magnetic Multilayered Systems 2.1. Giant Magnetoresistance in Magnetic Multilayered Systems The giant magnetoresistance effect is the change of electric conductivity in a system of metallic layersThe when giant an magnetoresistance external magnetic fieldeffect changes is the change the magnetization of electric conductivity of the ferromagnetic in a system layers of metallic relative tolayers each when other. an A external parallel magnetic alignment, field like changes it is depicted the magnetization in Figure1a,has of the usually ferromagnetic a lower resistance layers relative than anto each antiparallel other. A alignment, parallel alignment, Figure1b. like The it effect is depicted size is in defined Figure as: 1a, has usually a lower resistance than an antiparallel alignment, Figure 1b. The effect size is defined as: DR RÒÓ ´ RÒÒ Δ“ ↑↓−↑↑ (1) R = RÒÒ (1) ↑↑ where R and R are the resistivity’s for parallel and antiparallel alignment, respectively. where ÒÒ↑↑ and ÒÓ↑↓ are the resistivity’s for parallel and antiparallel alignment, respectively. Alternatively the ratio is sometimes defined with R as denominator. The effect originates from Alternatively the ratio is sometimes defined with ÒÓ↑↓ as denominator. The effect originates from spin-dependentspin-dependent transporttransport ofof electronselectrons inin magneticmagnetic metals.metals. Figure 1. GMR double layer in Current in Plane (CIP) configuration. (a) Layer magnetization parallel; Figure 1. GMR double layer in Current in Plane (CIP) configuration. (a) Layer magnetization parallel; (b) antiparallel in respect to each other. (b) antiparallel in respect to each other. This section will introduce the Boltzmann equation approach for treating the GMR effect in multilayersThis section in a classical will introduce picture. theThere Boltzmann are also a equationlot of publications approach presenting for treating quantum the GMR mechanical effect in multilayerstreatments of in athe classical GMR,picture. which Therewill not are be also discussed a lot of publications here. The Kubo presenting formalism quantum [8] mechanicaluses linear treatmentsresponse theory of the to GMR, calculate which the will effe notct of be small discussed electric here. fields The on Kubo currents. formalism Examples [8] uses for linear this ansatz response are theoryworks toby calculateCamblong the [9], effect Camblong, of small Levy electric and fields Zhang on currents.[10] and Levy, Examples Zhang for and this Fert ansatz [11]. are A works detailed by Camblongdescription [ 9and], Camblong, additional Levy literature and Zhang may [be10] obta andined Levy, in Zhang the extensive and Fert [treatment11]. A detailed of CPP description GMR in andmultilayers additional by Gijs literature and Bauer may be[12]. obtained in the extensive treatment of CPP GMR in multilayers by Gijs andThe Bauersemi-classical [12]. Boltzmann equation is used to describe the transport of electrons in metals. The modelThe semi-classical builds on the Boltzmann work of Fuchs equation and Sondheim is used toer describe who used the it transport to calculate of electrons the dependence in metals. of Thefilm modelthickness builds on onthe the conductivity work of Fuchs of thin and metal Sondheimer films [13,14]. who used The itBoltzmann to calculate theory the dependence describes the of filmdistribution thickness of oncarriers, the conductivity here electrons, ofthin of wave metal vector films k [ 13in ,vicinity14]. The of Boltzmann position r theorywith the describes distribution the distribution of carriers, here electrons, of wave vector k in vicinity of position r with the distribution() function (). The distribution function changes through processes of diffusion , the B fkprq function fk prq. The distribution function() changes through processes () of diffusion Bt , the influence of the external field and due to scattering . The total rate ofdi change f f B fprq B f prq ´ ¯ influence of the external field k and due to scattering k . The total rate of change vanishes in the steady state case whichBt f ield leads to: Bt scatt vanishes in the steady state case´ which¯ leads to: ´ ¯ () () () =− B f prq B f prq Bf prq (2) k diff` k field “ ´ k scatt (2) Bt di f f Bt f ield Bt scatt or after inserting the suitableˆ expressions:˙ ˆ ˙ ˆ ˙ () () ⋅() ⋅=− (3) scatt with the velocity, the energy, the charge of the electrons and the electric field. At this point the description varies depending on the system at hand. In case of a Current In Plane (CIP) Sensors 2016, 16, 904 3 of 24 or after inserting the suitable expressions: B f prq B f prq v ¨ r f prq ` e k v ¨ E “ ´ k (3) k k BE k Bt ˆ k ˙ ˆ ˙scatt Sensors 2016, 16, 904 3 of 24 with vk the velocity, Ek the energy, e the charge of the electrons and E the electric field. At this point the descriptiongeometry, see varies Figure depending 2b, where on th thee current system atis hand.applied In parallel case of ato Current the layers, In Plane the electric (CIP) geometry, field will see Figurebe homogenous2b, where thethroughout current is the applied layers, parallel which to simplifies the layers, the the equation electric field significantly.E will be homogenousIn case of a throughoutCurrent Perpendicular the layers, whichto Plane simplifies (CPP) geometry, the equation see significantly.Figure 2a, the In electric case of fiel a Currentd differs Perpendicular from layer to tolayer. Plane This (CPP) description geometry, will see be Figure limited2a, on the the electric simpler field CIP differs case, a from treatment layer to of layer. the CPP This geometry description can willbe derived be limited from on [15]. the simpler CIP case, a treatment of the CPP geometry can be derived from [15]. Figure 2. Simple double layer stacks in CPP (a) and CIP (b) configuration. CPP leads to a Figure 2. Simple double layer stacks in CPP (a) and CIP (b) configuration.

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