AMD CPU Roadmap Justin Boggs Sr. Developer Relations Engineer Sunnyvale, CA, USA July 2007 The New AMD: Capabilities Server Workstation Desktop Game Notebook DTV Handheld Segments consoles Geography Greater Latin Europe North Korea Japan Strengths China America America Customers/ Distribution PC OEM Retail Digital ODM Consumer Partners Handheld Media Microprocessors Customer Best-in- Chipset Graphics & Media Products Focus Class Products Processors 64-bit Multi- Hyper- Tech-Centric CrossFire Avivo Low H.264 Tech Core Transport Culture Power MFG Fabs and Process Technology Foundry Partnerships Blending world-class knowledge, cultures and people 4 The Next Major x86 Inflection Point 1981 1990’s 2000’s 2010’s Legacy Processing Era Single Core CPUs/GPUs Traditionally Optimized Platforms Multi-Core CPUs/GPUs Accelerated Processing Era Platform Level Silicon Level The Era of Accelerated Computing is coming, and AMD is again leading the way 7 Continuum of Solutions Accelerated Computing “Fusion" "Torrenza" Accelerator Accelerator C CPU P U HTX Accelerator AMD NB Processor PCI-E Chipset Silicon level Package level integration Accelerator integration PCIe Accelerator (MCM) Add-in Chipset Accelerator Accelerated Processors Opteron Socket Fusion – AMD’s code name for: Accelerated "Stream" Socket Processors (integrated acceleration) general compatible Torrenza – AMD’s code name for: purpose GPU accelerator slot or socket based acceleration Stream – Specific example of a GPGPU Slot or Socket Acceleration accelerator under Torrenza 8 First AMD Accelerated Processor Combining CPU and GPU Create the optimal computing experience for an increasingly mobile, graphics- and Fusion media-centric world Vision Deliver step-function improvements in microprocessor performance-per-watt-per- dollar over today’s CPU-only architectures 9 A New Level of Innovation Fab 36 Fab 38 Build/Own • High value capture in mfg • Process Foundry innovation high •Design •Design innovation high innovation high Risk • Process innovation New York* moderate Reward * Potential AMD Fab facility 10 Manufacturing: Continuing to Set the Standard - AMD Dresden Fab 36 Fab 30 / Fab 38 y 300mm microprocessor Fab y 200mm microprocessor Fab with y Output continues to increase 300mm transition to Fab38 started in 1H07 y 65nm volume production underway y New “Bump and Test” facility y Reached full 65nm conversion in completed Q107 mid-2007 y Ramped 65nm at mature yields with extremely low defect densities y First 65nm production wafers left Fab36 in October 2006 11 Quad-Core AMD Opteron™ Advantage More than just four cores y Significant CPU Core Enhancements y Significant Cache Enhancements World-class performance y Native Quad-Core – Faster data sharing between cores y Enhanced AMD-V™ – Nested paging acceleration for virtual environments Reducing total cost of ownership y Performance/Watt leadership – Consistent 95W thermal design point – Low power 68W solutions y Drop-in upgrade – Socket F compatibility – BIOS upgrade – Leverage existing platform infrastructure y Common Core Architecture – One core technology top-to-bottom – Top-to-bottom platform feature consistency 13 AMD Desktop Platform Roadmap 2006 2007 2008 Processor Dual Core, Quad Core Dual Core HT 1.0/2.0 DDR2/DDR3 Shared L3 Cache HT 3.0 Socket AM2/AM3 Dual Core, Single Core Quad Core Dual Single Core HT 1.0/2.0 L2 Cache, HT 3.0 Core Single Core Platform 125W/89W/76W/65W/62W/45W DDR2 Memory Technology DDR2/DDR23 HyperTransport™ Technology (HT) 1.0/2.0 HT 3.0 Chipsets CrossFireTM dual-graphics, HD audio CrossFire dual-graphics, HT 3.0 PCIe Gen 2 DirectX10 integrated graphics DirectX9 integrated graphics, HD audio PCIe Gen 2, HT 3.0 14 Introducing AMD Phenom™ Processors May 14, 2007, we announced our vision and strategy for true quad-core client technology with the unveiling of the AMD Phenom™ processor family Next-generation AMD Phenom processors allow users to… experience the Phenomenal Native, true multi-core capability for an experience that is Exquisitely powerful True dual to quad-core architecture in an elegant design for ultimate performance with extreme bandwidth and a hair-trigger response Intensely visual Immersive and media-rich compute experiences to help users realize new possibilities and find new inspiration Strikingly Efficient Intelligent use of energy and system resources – stable, reliable, virtualization-ready and energy astute Based on AMD’s next-generation processor architecture 15 AMD Desktop Products 2H’07 AMD Phenom™ FX processors AM2+ Package,Ultimate Shared Performance L3 Cache, 128-bit FPU True Quad-core AMD Phenom™ X4 and X2 processors AM2+ Package,Phenomenal Shared L3Experience Cache, 128-bit FPU True Quad- and Dual-core AMD Athlon™ X2 processors AM2 Package,Do More L2 In Cache, Less Time 64-bit FPU Dual-core AMD Sempron™ processors AM2 Package,Everyday L2 ComputingCache, 64-bit FPU Single-core 16 AMD Mobile Platform Roadmap 2006 2007 2008 Processor AMD TurionTM 64 X2 Mobile Technology, Dual-Core, 90nm125 “Hawk” “Griffin” Mobile AMD Sempron Processor 65nm 65nm Single-Core, 90nm Platform Hybrid Disk Drives Hybrid Graphics “Fusion” 802.11a/b/g 802.11a/b/g/Draft-n 802.11a/b/g/n WWAN Chipsets DX9 DX10 DVI HDMI DisplayPort UVD PCI-E Gen I PCI-E Gen II DDR-2 Memory Technology HyperTransport™ Technology 1.0 HT 3.0 “Kite” “Kite” Refresh “Puma” 17.