SOT1456-1 5 5 1 A plastic very-very-thin fine-pitch ball grid array package; 155 G B F W balls, 0.5 mm pitch, 7.5 mm x 7.5 mm x 0.76 mm body 29 October 2018 Package information 1 Package summary Terminal position code B (bottom) Package type descriptive code WFBGA155 Package style descriptive code BGA (ball grid array) Package body material type P (plastic) Mounting method type S (surface mount) Issue date 06-04-2016 Manufacturer package code SOT1456 Table 1. Package summary Parameter Min Nom Max Unit package length 7.4 7.5 7.6 mm package width 7.4 7.5 7.6 mm seated height 0.72 0.76 0.8 mm package height 0.48 0.51 0.54 mm nominal pitch - 0.5 - mm actual quantity of termination - 155 - NXP Semiconductors SOT1456-1 plastic very-very-thin fine-pitch ball grid array package; 155 balls, 0.5 mm pitch, 7.5 mm x 7.5 mm x 0.76 mm body 2 Package outline WFBGA155: plastic very-very-thin profile fine-pitch ball grid array package; 155 balls; SOT1456-1 D B A ball A1 index area A2 E A A1 detail X e1 C Ø v C A B e b y1 C y Ø w C R P N M L K e J H e2 G F E D C B A ball A1 1 3 5 7 9 11 13 15 2 4 6 8 10 12 14 index area X 0 10 mm scale Dimensions (mm are the original dimensions) Unit A A1 A2 b D E e e1 e2 v w y y1 max 0.80 0.26 0.54 0.35 7.6 7.6 mm nom 0.76 0.23 0.51 0.32 7.5 7.5 0.5 7.0 7.0 0.15 0.05 0.08 0.1 min 0.72 0.20 0.48 0.29 7.4 7.4 sot1456-1_po Outline References European Issue date version IEC JEDEC JEITA projection 15-09-21 SOT1456-1 - - - 15-09-22 Figure 1. Package outline WFBGA155 (SOT1456-1) SOT1456-1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved. Package information 29 October 2018 2 / 5 NXP Semiconductors SOT1456-1 plastic very-very-thin fine-pitch ball grid array package; 155 balls, 0.5 mm pitch, 7.5 mm x 7.5 mm x 0.76 mm body 3 Soldering Footprint information for reflow soldering of WFBGA155 package SOT1456-1 Hx ball A1 P P Hy see detail X SL SP occupied area solder resist opening (SR) SR detail X solder land (SL) solder paste deposit (SP) solder land plus solder paste Dimensions in mm recommend stencil thickness: 0.1 mm P SL SP SR Hx Hy 0.50 0.28 0.34 0.38 7.75 7.75 18-10-16 Issue date sot1456-1_fr 18-10-29 Figure 2. Reflow soldering footprint for WFBGA155 (SOT1456-1) SOT1456-1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved. Package information 29 October 2018 3 / 5 NXP Semiconductors SOT1456-1 plastic very-very-thin fine-pitch ball grid array package; 155 balls, 0.5 mm pitch, 7.5 mm x 7.5 mm x 0.76 mm body 4 Legal information Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT1456-1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved. Package information 29 October 2018 4 / 5 NXP Semiconductors SOT1456-1 plastic very-very-thin fine-pitch ball grid array package; 155 balls, 0.5 mm pitch, 7.5 mm x 7.5 mm x 0.76 mm body Contents 1 Package summary ...............................................1 2 Package outline ...................................................2 3 Soldering ..............................................................3 4 Legal information ................................................4 © NXP B.V. 2018. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 29 October 2018.