FlexRay Communications System Electrical Physical Layer Conformance Test Specification Version 2.1 Revision B FlexRay Physical Layer Conformance Test Specification Disclaimer Disclaimer This Specification as released by the FlexRay Consortium is intended for the purpose of information only. The FlexRay Consortium will not be liable for any use of this Specification for other purposes. The material contained in this Specification document is protected by copyright and other types of Intellectual Property Rights. The commercial exploitation of the material in this specification may require a license to such Intellectual Property Rights. A license can be obtained by becoming a member of the FlexRay consortium. Licenses for commercial exploitation will be made available to non- members by way of a separate written License Agreement following the completion of the development of the FlexRay Communications System Specifications. Such licenses shall be contingent upon Licensees granting reciprocal licenses to all Core Partners and non-assertions in favor of all Premium Associate Members and Associate Members. This Specification document may be reproduced in electronic or paper form or utilized for informational purposes only. Reproduction or utilization for any other purposes as well as any modification of the Specification document, in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the FlexRay Consortium is explicitly forbidden. The word FlexRay and the FlexRay logo are registered trademarks. Copyright © 2006 - 2008 FlexRay Consortium. All rights reserved. The Core Partners of the FlexRay Consortium are Daimler AG, BMW AG, Adam Opel GmbH, Freescale Semiconductor, Inc., NXP B.V., Robert Bosch GmbH and Volkswagen AG. Version 2.1 Revision B June 2008 Page 2 of 553 FlexRay Physical Layer Conformance Test Specification Table of Contents Table of Contents 1 Introduction ........................................................................................................ 11 1.1 Scope......................................................................................................... 11 1.2 References................................................................................................. 11 1.3 Terms and definitions................................................................................. 11 1.4 Acronyms and abbreviations...................................................................... 12 1.5 Notational conventions............................................................................... 13 2 Test Environment............................................................................................... 14 2.1 Test case architecture................................................................................ 14 2.2 Test method............................................................................................... 14 2.2.1 Upper tester........................................................................................ 15 2.2.2 Lower tester........................................................................................ 17 2.2.3 Supervisor........................................................................................... 17 2.3 Test environment ....................................................................................... 17 2.4 Test topology ............................................................................................. 18 2.4.1 Cable overview of the test topology .................................................... 22 2.4.2 Shield.................................................................................................. 24 2.4.3 ESD protection.................................................................................... 25 2.4.4 Termination......................................................................................... 26 2.4.5 Common mode chokes....................................................................... 28 2.4.6 Active star........................................................................................... 29 2.4.7 Passive star ........................................................................................ 30 2.4.8 Passive bus ........................................................................................ 32 2.4.9 Cables................................................................................................. 33 2.4.10 Connectors ......................................................................................... 34 2.5 Test equipment .......................................................................................... 34 2.5.1 General............................................................................................... 34 2.5.2 Power supply V BAT .............................................................................. 35 2.5.3 Power supply V CC ............................................................................... 36 2.5.4 Power supply V IO ................................................................................ 36 Version 2.1 Revision B June 2008 Page 3 of 553 FlexRay Physical Layer Conformance Test Specification Table of Contents 2.5.5 Ground shift generator........................................................................ 37 2.5.6 Low battery generator......................................................................... 38 2.5.7 Signal generator ................................................................................. 38 2.5.8 Analog signal measurement ............................................................... 39 2.5.9 Digital signal measurement................................................................. 39 2.5.10 Data acquisition unit ........................................................................... 40 2.5.11 Broadband amplifier............................................................................ 40 2.5.12 Arbitrary function generator ................................................................ 41 3 Stress Conditions............................................................................................... 42 3.1 Ground shift ............................................................................................... 42 3.2 Low battery voltage inside operational range............................................. 43 3.3 Undervoltage.............................................................................................. 44 3.4 Dynamic low battery voltage ...................................................................... 45 3.5 Failures ...................................................................................................... 46 3.6 Babbling idiot ............................................................................................. 51 3.7 Dynamic ground shift ................................................................................. 52 3.8 EMC........................................................................................................... 53 3.9 ESD ........................................................................................................... 53 3.10 Temperature tests...................................................................................... 53 4 Parameter List.................................................................................................... 54 4.1 Static test cases......................................................................................... 55 4.2 Communication.......................................................................................... 55 4.2.1 Delay................................................................................................... 55 4.2.2 Signal shape....................................................................................... 56 4.2.3 Threshold............................................................................................ 57 4.2.4 Timing................................................................................................. 58 4.2.5 Truncation........................................................................................... 59 4.3 Mode.......................................................................................................... 60 4.3.1 Active star........................................................................................... 62 4.3.2 Bus driver............................................................................................ 62 Version 2.1 Revision B June 2008 Page 4 of 553 FlexRay Physical Layer Conformance Test Specification Table of Contents 4.4 Power supply ............................................................................................. 63 4.5 Environment............................................................................................... 64 4.6 Dynamic low battery voltage ...................................................................... 64 4.7 Ground shift ............................................................................................... 64 4.8 Failure........................................................................................................ 64 4.8.1 Babbling idiot ...................................................................................... 65 4.8.2 Loss .................................................................................................... 65 4.8.3 Short circuit........................................................................................
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