THE GREAT MINIATURIZATION: SYSTEMS AND PACKAGING Technology Enabling Systems in your Pocket and Beyond PARTICIPATING COMPANIES: • ADVANCED BIONICS • JAWBONE • ALTERA CORPORATION • KYOCERA CORPORATION • AMKOR TECHNOLOGY • MULTEK CORPORATION • ANALOG DEVICES, INC. • SARCINA TECHNOLOGY LLC • ASE (US) INC. • SILICIUM ENERGY • ASE TAIWAN • SILICON CATALYST • CACTUS SEMICONDUCTOR INC. • STANFORD UNIVERSITY • CADENCE DESIGN SYSTEMS, INC. • TECHSEARCH INTERNATIONAL, INC. • GEORGIA INSTITUTE OF TECHNOLOGY • XILINX INC. • GLOBALFOUNDRIES INC. NOVEMBER 10 &11, 2015 BILTMORE HOTEL, SANTA CLARA, CA Diamond Sponsor Gold Sponsor Gold Sponsor Gold Sponsor Reception Sponsor Association Sponsor Media Sponsors 2015 MEPTEC/SEMI SYMPOSIUM - THE GREAT MINIATURIZATION: SYSTEMS AND PACKAGING CONTENTS AGENDA SPONSOR AND EXHIBITOR DIRECTORIES PARTICIPANT BIOGRAPHIES DAY ONE – NOVEMBER 10TH SESSION ONE THE GENIUS OF CARS – AND WHY SEMICONDUCTORS MATTER Session Chair: Joel Camarda, SemiOps SESSION TWO HIGH SPEED COMPONENTS AND PACKAGING Session Chair: Li Li, Cisco Systems, Inc. KEYNOTE ENABLING A CONNECTED WORLD IN THE AGE OF INTELLIGENCE Joan Vrtis, Ph.D., Multek Corporation SESSION THREE MEDICAL AND WEARABLES FOR HUMAN HEALTH: CONNECTING THE DOTS FROM SILICON THROUGH PACKAGING Session Chair: Sesh Ramaswami, Applied Materials SESSION FOUR POWER MANAGEMENT AND ENERGY HARVESTING: OPPOSITE SIDES OF THE SAME Session Chair: Paul Werbaneth, Invetac DAY TWO – NOVEMBER 11TH SESSION FIVE MULTI DIE INTEGRATION Session Chair: Ivor Barber, Xilinx Inc. SESSION SIX ON THE ROAD TO SIP AND MODULES Session Chair: Eelco Bergman, ASE KEYNOTE ENABLING THE NEXT GENERATION OF SEMICONDUCTOR STARTUPS Tarun Verma, Ph.D., Silicon Catalyst SESSION SEVEN IC-PACKAGE-SYSTEM CO-DEVELOPMENT IN THE NEW SIP-ERA Session Chair: Jenny Jiang, Altera Corporation SESSION EIGHT WRAP-UP PANEL DISCUSSION – THE GREAT CONSOLIDATION Session Chair: Paul Werbaneth, Invetac TUESDAY, NOVEMBER 10 & WEDNESDAY, NOVEMBER 11, 2015 • SANTA CLARA, CALIFORNIA 2015 MEPTEC/SEMI SYMPOSIUM - THE GREAT MINIATURIZATION: SYSTEMS AND PACKAGING THE GREAT MINIATURIZATION: SYSTEMS AND PACKAGING Technology Enabling Systems in your Pocket and Beyond DAY ONE - NOVEMBER 10TH MORNING AGENDA 7:30 am Registration Opens 8:45 am – 9:00 am Welcome and Introduction SESSION ONE THE GENIUS OF CARS – AND WHY SEMICONDUCTORS MATTER 9:00 am - 9:30 am System Scaling, A New Fundamental Electronics Frontier Technology Professor Rao Tummala, Georgia Institute of Technology 9:30 am - 10:00 am Packaging ICs to Survive The Automotive Environment Prasad Dhond, Amkor Technology 10:00 am - 10:30 am Title TBA Presenter TBA 10:30 am - 11:00 am Morning Break and Exhibits SESSION TWO HIGH SPEED COMPONENTS AND PACKAGING 11:00 am - 11:30 am High Speed ASIC Packaging Trend: Integration, SKU, and 25G Larry Zu, Ph.D., Sarcina Technology 11:30 am - 12:00 pm Narrowing the Gap Between Packaging and System Ou Li, ASE Group 12:00 pm - 12:30 pm Package Technology and Design Enablement to 56Gbps Transceivers Hong Shi, Ph.D., Xilinx Inc. 12:30 pm - 1:30 pm Lunch and Exhibits TUESDAY, NOVEMBER 10 & WEDNESDAY, NOVEMBER 11, 2015 • SANTA CLARA, CALIFORNIA 2015 MEPTEC/SEMI SYMPOSIUM - THE GREAT MINIATURIZATION: SYSTEMS AND PACKAGING THE GREAT MINIATURIZATION: SYSTEMS AND PACKAGING Technology Enabling Systems in your Pocket and Beyond DAY ONE - NOVEMBER 10TH AFTERNOON AGENDA 1:30 pm - 2:00 pm KEYNOTE Enabling a Connected World in the Age of Intelligence Joan Vrtis, Ph.D., Multek Corporation SESSION THREE MEDICAL AND WEARABLES FOR HUMAN HEALTH: CONNECTING THE DOTS FROM SILICON THROUGH PACKAGING 2:00 pm - 2:30 pm Miniaturization of Cochlear Implants Kurt Koester, Advanced Bionics Medical 2:30 pm - 3:00 pm Integrated Circuit Design for Miniature Implantable Medical Devices Andy Kelly, Cactus Semiconductor 3:00 pm - 3:30 pm Afternoon Break and Exhibits SESSION FOUR POWER MANAGEMENT AND ENERGY HARVESTING: OPPOSITE SIDES OF THE SAME COIN BATTERY? 3:30 pm – 4:00 pm Gallium Nitride: A New Multifunctional Sensing Platform Debbie Senesky, Ph.D., Stanford University 4:00 pm – 4:30 pm 22FDX Technology Enables Energy Harvesting Solutions Jamie Schaeffer, Ph.D., GLOBALFOUNDRIES Inc. 4:30 pm – 5:00 pm Energy Harvesting Technology Based on Next-generation Thermoelectric Devices Douglas Tham, Ph.D., Silicium Energy 5:00 pm – 6:30 pm Reception and Exhibits TUESDAY, NOVEMBER 10 & WEDNESDAY, NOVEMBER 11, 2015 • SANTA CLARA, CALIFORNIA 2015 MEPTEC/SEMI SYMPOSIUM - THE GREAT MINIATURIZATION: SYSTEMS AND PACKAGING THE GREAT MINIATURIZATION: SYSTEMS AND PACKAGING Technology Enabling Systems in your Pocket and Beyond DAY TWO - NOVEMBER 11TH MORNING AGENDA 7:15 am Registration Opens 8:15 am – 8:30 am Welcome and Introduction SESSION FIVE MULTI DIE INTEGRATION 8:30 am – 9:00 am Cost Effective Multi Die Integration Solutions for IoT Trevor Yancey, TechSearch International, Inc. 9:00 am – 9:30 am Silicon Interposers for Multi Die Integration Ivor Barber, Xilinx Inc. 9:30 am – 10:00 am Challenges in the Development of Cost Effective Multi Die Integration Solutions Vincent Liao, ASE 10:00 am – 10:30 am Morning Break SESSION SIX ON THE ROAD TO SIP AND MODULES 10:30 am – 11:00 am SiP and Heterogeneous Integration: An IC Manufacturer’s Perspective Mike DeLaus, Analog Devices, Inc. 11:00 am – 11:30 am Co-Design for High Density SiP Module: OSAT Point of Vie Harrison Chang, Ph.D. , ASE Taiwan 11:30 am – 12:00 pm SiP from a Systems Perspective Ilyas Mohammed, Ph.D., Jawbone 12:00 pm - 1:00 pm Lunch TUESDAY, NOVEMBER 10 & WEDNESDAY, NOVEMBER 11, 2015 • SANTA CLARA, CALIFORNIA 2015 MEPTEC/SEMI SYMPOSIUM - THE GREAT MINIATURIZATION: SYSTEMS AND PACKAGING THE GREAT MINIATURIZATION: SYSTEMS AND PACKAGING Technology Enabling Systems in your Pocket and Beyond DAY TWO - NOVEMBER 11TH AFTERNOON AGENDA 1:00 pm – 1:30 pm KEYNOTE Enabling the Next Generation of Semiconductor Startups Tarun Verma, Ph.D., Silicon Catalyst SESSION SEVEN IC-PACKAGE-SYSTEM CO-DEVELOPMENT IN THE NEW SIP-ERA 1:30 pm – 2:00 pm Product Co-Development in the New SiP Era Hui Lui, Altera Corporation 2:00 pm – 2:30 pm Chip-Package-Board Pathway Design Flows Tom Whipple, Cadence Design Systems, Inc. 2:30 pm – 3:00 pm Advanced Organic Package Technologies Including Interposer and Embedded Package Tomoyuki Yamada, Kyocera Corporation 3:00 pm – 3:30 pm Afternoon Break SESSION EIGHT WRAP-UP PANEL DISCUSSION – THE GREAT CONSOLIDATION 3:30 pm – 4:30 pm Panel Moderator: Paul Werbaneth, Intevac, Inc. TUESDAY, NOVEMBER 10 & WEDNESDAY, NOVEMBER 11, 2015 • SANTA CLARA, CALIFORNIA 2015 MEPTEC/SEMI SYMPOSIUM - THE GREAT MINIATURIZATION: SYSTEMS AND PACKAGING A SPECIAL THANKS TO OUR EVENT SPONSORS DIAMOND SPONSOR GOLD SPONSOR GOLD SPONSOR Kulicke & Soffa Amkor Technology www.kns.com www.amkor.com Kulicke & Soffa is a global leader in the design and manufacture of semiconductor, LED and elec- Amkor Technology, Inc. is one of the world’s larg- tronic assembly equipment. As a pioneer in this ASE Group est providers of advanced semiconductor assem- industry, K&S has provided customers with mar- bly and test services. Founded in 1968, Amkor www.aseglobal.com ket leading packaging solutions for decades. K&S has become a strategic manufacturing partner Alongside a broad portfolio of established comprehensive solutions include ball bonding, for many of the world’s leading semiconductor technologies, ASE is also delivering innovative wedge bonding, wafer level bonding, thermo- companies and electronics OEMs, providing a advanced packaging and System-in-Package compression bonding, flip chip, FOWLP, WLP, SIP, broad array of advanced package design, assem- solutions to meet growth momentum across a PoP and Embedded Die. K&S has also increase bly and test solutions. Amkor’s operational base broad range of end markets. For more about our its participation in the automotive and industrial encompasses more than 5 million square feet of advances in Cu Wire, SiP, WLP, Fan Out, Flip Chip, markets via Advanced SMT. Combined with its manufacturing facilities, product development MEMS & Sensors, and, 2.5D, 3D & TSV technolo- extensive expertise in process technology, K&S is centers, and sales & support offices in Asia, Europe gies, all ultimately geared towards applications well positioned to help customers meet the chal- and the United States. Amkor offers a suite of to improve lifestyle and efficiency, please visit our lenges of assembling the next-generation semi- services, including electroplated wafer bumping, website. conductor, LED devices and electronic devices. probe, assembly and final test. Amkor is a leader in advanced copper pillar bump and packaging technologies which enables next generation flip chip interconnect. GOLD SPONSOR RECEPTION SPONSOR ASSOCIATION SPONSOR Global Semiconductor Alliance SMART Microsystems www.gsaglobal.org www.smartmicrosystems.com The Global Semiconductor Alliance (GSA) is the SMART Microsystems creates turn-key solutions Advanced Component Labs voice of the global semiconductor industry with for microelectronic package assembly challenges www.aclusa.com nearly 400 member companies throughout 32 to move your MEMS sensor technology from Advanced Component Labs, Inc. is the USA’s countries and representing over 75% of the indus- development to production. With an engineering try revenues. GSA provides a neutral environ- team experienced in manufacturing and state-of- leading fabricator of “Time Critical” High Density Interconnects. With a sharp focus directed ment for semiconductor executives to meet and the-art facilities, SMART Microsystems