026-1602 Rev 3 4-11-01 Einstein BX Building Controller U s e r ’ s G u i d e Computer Process Controls, Inc. 1640 Airport Road Suite #104 Kennesaw, GA 31044 Phone (770) 425-2724 Fax (770) 425-9319 ALL RIGHTS RESERVED The information contained in this manual has been carefully checked and is believed to be accurate. However, Computer Process Controls, Inc. assumes no responsibility for any inaccuracies that may be contained herein. In no event will Computer Process Controls, Inc. be liable for any direct, indirect, special, incidental, or consequential damages resulting from any defect or omission in this manual, even if advised of the possibility of such damages. In the interest of continued product development, Com- puter Process Controls, Inc. reserves the right to make improvements to this manual, and the products described herein, at any time without notice or obligation. Revision History 026-1602 Rev 3 4-11-01 • Removed support for old Lighting Control and RT-100 applications • Added documentation of Enhanced Lighting application • Added ARTC graphic illustration guide • Added ARTC board numbering instructions • "Cold Reset" and "Cold Reset Button" now called "Clean Out" and "Clean Out Button." • Split "Quick Start" section into full-sized chapters on AHU, Zone Control, ARTC, Time Scheduling, and Enhanced Lighting • Added instructions for using Holiday Schedules • SP1, SP2, SP3, and SP4, previously used as days of the week for holiday dates, now appear as HD1, HD2, HD3, and HD4. • Added "In vs. Out Enthalpy" strategy of economization control to AHUs and Zone Control. • "Average KW" in Power Monitoring now means the average of all KW samples taken in a one-minute window. • Added section about input and output alarm setup. • Added warning to power down Einstein before plugging internal modem into the PC-104 slot • Appendix C Network ID Worksheets changed to 8-1/2" by 11" format (were 11x17 fold-outs). • Included index Revision History • v Table of Contents REVISION HISTORY ................................................................................................................................................ I-V 1 INTRODUCTION...................................................................................................................................................... 1-1 1.1 EINSTEIN BX MODELS .............................................................................................................................................. 1-1 1.2 THE EINSTEIN RX...................................................................................................................................................... 1-1 1.3 INTRODUCTION TO EINSTEIN NETWORKING.............................................................................................................. 1-1 1.3.1 The Einstein BX’s I/O Network.......................................................................................................................... 1-1 1.3.2 The Einstein BX’s Echelon Lonworks Network ................................................................................................. 1-2 1.3.3 Interconnection With Other Einsteins................................................................................................................ 1-3 1.4 EINSTEIN DOCUMENTATION ...................................................................................................................................... 1-3 2 HARDWARE OVERVIEW...................................................................................................................................... 2-1 2.1 EINSTEIN PROCESSOR ................................................................................................................................................ 2-1 2.2 ASSOCIATED CIRCUIT BOARDS ................................................................................................................................. 2-1 2.2.1 16AI.................................................................................................................................................................... 2-1 2.2.2 The 8RO Relay Board ........................................................................................................................................ 2-2 2.2.3 4AO .................................................................................................................................................................... 2-2 2.2.4 8IO Combination Input/Output Board............................................................................................................... 2-2 2.2.5 8DO Digital Output Board and PMAC II Anti-Sweat Controller ..................................................................... 2-3 2.2.6 Advanced Rooftop Controller ............................................................................................................................ 2-3 2.3 THE ECHELON®NETWORK....................................................................................................................................... 2-4 2.3.1 The 16AIe ........................................................................................................................................................... 2-4 2.3.2 The 8ROe............................................................................................................................................................ 2-4 3 HARDWARE MOUNTING...................................................................................................................................... 3-1 3.1 THE EINSTEIN ............................................................................................................................................................ 3-1 3.1.1 Location ............................................................................................................................................................. 3-1 3.1.2 Mounting ............................................................................................................................................................ 3-1 3.1.2.1 Hinged Box .............................................................................................................................................................. 3-1 3.1.2.2 Flush Mount ............................................................................................................................................................. 3-1 3.2 MOUNTING I/O BOARDS............................................................................................................................................ 3-1 3.2.1 Single/Double Enclosure Mounting for I/O Boards ......................................................................................... 3-1 3.2.2 8IO/ARTC Weather Resistant Enclosure Mounting........................................................................................... 3-2 3.2.3 16AI, 8RO, 8DO, and 4AO Boards Without Enclosures ................................................................................... 3-2 3.2.3.1 8IOs/ARTCs Without Enclosures Mounting........................................................................................................... 3-3 3.2.3.2 4AO Boards Without Enclosures Mounting............................................................................................................ 3-3 3.3 MOUNTING THE INTERNAL MODEM .......................................................................................................................... 3-3 3.4 MOUNTING REPEATERS ............................................................................................................................................. 3-4 3.4.1 Mounting for Internal Repeaters........................................................................................................................ 3-4 3.4.2 Mounting for External Repeaters....................................................................................................................... 3-4 3.5 SENSORS AND TRANSDUCERS.................................................................................................................................... 3-4 3.5.1 Inside Temperature Sensor ................................................................................................................................ 3-4 3.5.1.1 Location ................................................................................................................................................................... 3-4 3.5.1.2 Mounting.................................................................................................................................................................. 3-4 3.5.2 Outside (Ambient) Temperature Sensor............................................................................................................. 3-5 3.5.2.1 Location ................................................................................................................................................................... 3-5 3.5.2.2 Mounting.................................................................................................................................................................. 3-5 3.5.3 Insertion Temperature Probe............................................................................................................................. 3-5 3.5.3.1 Location ..................................................................................................................................................................