Technical Explanation Revision: 4.5 ® MiniSKiiP Issue date: 2018-08-22 Prepared by: Thomas Hürtgen Generation II Approved by: Stefan Hopfe Keyword: MiniSKiiP, spring, topology, 600V, 1200V, 1700V, board, pressure lid, order code Table of Contents 1. Introduction ............................................................................................................................... 3 1.1 Key Features ........................................................................................................................ 3 1.2 Advantages .......................................................................................................................... 3 2. Topologies ................................................................................................................................. 4 3. Selection Guide .......................................................................................................................... 6 3.1 600V Fast Switching Modules .................................................................................................. 6 3.2 600V Modules with Trench IGBT .............................................................................................. 7 3.3 1200V Modules with Trench 4 IGBT ......................................................................................... 8 3.4 1700V Modules with Trench IGBT ............................................................................................ 9 3.5 3-Level Modules .................................................................................................................... 9 3.6 Half Bridge Modules ............................................................................................................. 10 3.7 Twin 6-pack Modules ........................................................................................................... 10 ® 4. MiniSKiiP Qualification ............................................................................................................. 11 5. Storage & Shelf Life Conditions .................................................................................................. 12 ® 6. MiniSKiiP Contact System ........................................................................................................ 12 ® 6.1 PCB Specification for the MiniSKiiP Contact System................................................................ 12 6.1.1 Conductive Layer Thickness Requirements ....................................................................... 12 6.1.2 NiAu as PCB Surface Finish ............................................................................................. 12 6.1.3 PCB Design .................................................................................................................. 12 6.1.4 PCB Soldering Process and Landing Pads .......................................................................... 14 6.2 Spring Contact Specification ................................................................................................. 14 6.3 Contact Resistance .............................................................................................................. 15 6.4 Electromigration and Whisker Formation ................................................................................ 16 6.5 Qualification of Contact System ............................................................................................. 17 7. Safe Operating Areas for IGBTs .................................................................................................. 18 7.1 Safe Operating Area during Turn-on and Turn-off (SOA, RBSOA)............................................... 18 7.2 Safe Operating Area During Short Circuit (SCSOA) .................................................................. 18 8. Definition and Measurement of R th and Z th ................................................................................... 19 8.1 Measuring Thermal Resistance R th(j-s) ..................................................................................... 19 8.2 Transient Thermal Impedance (Z th ) ....................................................................................... 20 9. Specification of the Integrated Temperature Sensor ...................................................................... 21 9.1 Electrical Characteristics (PTC) .............................................................................................. 22 9.2 Electrical Characteristics (NTC) ............................................................................................. 23 9.3 Electrical Isolation ............................................................................................................... 24 10. Creepage- and Clearance distances ............................................................................................ 25 11. Thermal Material Data ............................................................................................................... 26 12. Silicon Nitride AMB Substrates ................................................................................................... 27 13. Laser Marking .......................................................................................................................... 28 © by SEMIKRON / 2018-08-22 / Technical Explanation / MiniSKiiP ® Generation II Page 1/39 PROMGT.1023/ Rev.4/ Template Technical Explanation 14. RoHS Compliance ..................................................................................................................... 28 15. Packing Specification ................................................................................................................ 29 15.1 Packing Box ........................................................................................................................ 29 15.2 Marking of Packing Boxes ..................................................................................................... 30 16. Type Designation System .......................................................................................................... 31 17. Caption of the Figures in the Data Sheets .................................................................................... 31 17.1 Caption of Figures in the Data Sheets of “065”, “066” and “126” Modules................................... 31 17.2 Caption of Figures in the Data Sheets of “12T4” and “176” Modules .......................................... 32 17.3 Calculation of max. DC-Current Value for “12T4” IGBTs ........................................................... 33 17.4 Internal and External Gate Resistors ...................................................................................... 33 18. Accessories .............................................................................................................................. 34 18.1 Evaluation Boards ............................................................................................................... 34 18.1.1 Static Test Boards ......................................................................................................... 35 18.1.2 Dynamic Test Boards ..................................................................................................... 35 18.1.3 Order Codes for Evaluation Boards .................................................................................. 36 18.2 Pressure Lid........................................................................................................................ 37 18.3 Pre-Applied Thermal Paste .................................................................................................... 37 18.4 Mechanical Sample .............................................................................................................. 37 19. Ordering Codes ........................................................................................................................ 38 20. Disclaimer ............................................................................................................................... 39 © by SEMIKRON / 2018-08-22 / Technical Explanation / MiniSKiiP ® Generation II Page 2/39 1. Introduction 1.1 Key Features • 600V/650V Trench and 600V ultrafast (NPT) IGBTs Figure 1: MiniSKiiP ® housing sizes • 1200V and 1700V Trench and Trench 4 IGBTs • SEMIKRON inverse and freewheeling diodes in CAL technology • SEMIKRON thyristors for controlled rectifiers • SEMIKRON rectifier diodes with high surge currents • Four different housing sizes • Current range 4A to 400A for power range up to 90 kW • Comprehensive setup of circuit topologies: CIBs, 6-pack, twin 6-pack, H-bridge, half bridge, 3-level, uncontrolled/half controlled input bridges with brake chopper and custom specific modules for various applications • Solderless and rugged spring contact technology for all power and auxiliary connections • Fast and easy mounting with one or two screw(s) • Full isolation and low thermal resistance due to DCB ceramic without base plate • Integrated PTC or NTC temperature sensor 1.2 Advantages Utilising the reliability of pressure contact technology the patented MiniSKiiP ® is a rugged, high-integrated system including converter, inverter, brake (CIB) topologies for standard drive applications up to 90 kW motor power. An integrated temperature sensor for monitoring the heat sink temperature enables an over temperature shut down. All components integrated in one package greatly reduce handling. The reduced number