NEMI 2006 iNEMI Optoelectronic Substrates Project Report Optoelectronic Substrates Project Report 1 November 1, 2006 The 2002 iNEMI Roadmap identified the potential for an optoelectronics interconnection system to replace existing copper interconnect systems for high bandwidth applications. The unresolved issues were, what bandwidth will be required for various applications, and at what bandwidth will the cost of optoelectronics interconnect systems become cost effective. The optoelectronic system would have an optoelectronics substrate on which to mount optoelectronic components including devices and connectors. An Optoelectronics Substrates Project group was formed in 2003 to address this emerging issue. Many iNEMI member companies were interested in participating. This project was the result of these discussions. The group has served as an excellent forum for interaction among members of the current progress, future direction, and implications of optoelectronic developments within the industry. Now four years later, it is not as clear as to when optoelectronic substrates will be needed by industry. Firms are continuing to improve the performance of copper systems, and wireless systems are rapidly expanding. This report serves to document the accomplishments of this project over the past four years. If future roadmaps identify the impending need of optoelectronic substrates, it is hoped that this report can serve as a starting point for future projects. Sincerely Robert Pfahl Vice President of Operations iNEMI Optoelectronic Substrates Project Report 2 Table of Contents EXECUTIVE SUMMARY ............................................................................................. 4 INTRODUCTION............................................................................................................. 4 BACKGROUND - TECHNOLOGY OVERVIEW ....................................................... 4 PURPOSE OF THE PROJECT ...................................................................................... 5 MATERIALS AND METHODS ..................................................................................... 6 RESULTS ........................................................................................................................ 10 Cost Model Factors .......................................................................................................................10 Existing Waveguide Technology Analysis...................................................................................11 Polymer waveguide technology:...................................................................................................11 ANALYSIS OF SUCCESS............................................................................................. 12 APPENDICES................................................................................................................. 13 Appendix 1 - Industry Requirements: Reliability and Performance Table for Multimode Optical Interconnections.............................................................................................................. 13 Appendix 2 - Results from Analysis of Existing Optical Waveguide Technology ...................20 Appendix 3 - Copper Technology Roadmap...............................................................................29 PARTICIPATING ORGANIZATIONS....................................................................... 30 INDIVIDUAL PARTICIPANTS................................................................................... 30 BIBLIOGRAPHY FROM PROJECT .......................................................................... 32 Optoelectronic Substrates Project Report 3 Executive Summary The Optoelectronics Substrate Project was an outgrowth of needs identified in the 2002 iNEMI Roadmap.. The ultimate decision by the project group was to perform a generic cost analysis comparing the use of traditional copper interconnections for a communications industry backplane versus the use of optoelectronic technology. The original goal was to identify the conditions under which copper interconnections would not be able to handle the higher speed signals needed. Results from the project include: • The development of a copper backplane product emulator with an initial cost analysis • A Generic Copper Bandwidth Technology Roadmap, which is included in this report • Reliability and Performance Tables for Multimode Optical Interconnections • Results from Analysis of Existing Optical Waveguide Technology The project has provided a valuable forum for the industry to continue discussion on the applicability of using optoelectronic technology in future high speed systems. However, based on input from the iNEMI OEM membership that there is little or no planned activity in the use of optoelectronic substrates, the iNEMI Technical Committee has recommended that this project be suspended as of this report. The project may be re- started if optoelectronic substrates are identified as a gap for future new product developments. Introduction This project was the outgrowth of the recognition by the industry that optoelectronic devices could have an impact on system design in many of the areas in which iNEMI members were doing business. The Technical Committee reviewed the 2002 iNEMI Roadmap gap analysis and, as a result, an Optoelectronics Technology Integration Group (TIG) was formed in 2003 to address this emerging issue. Many iNEMI member companies were interested in participating. This Optoelectronics Substrate Project was the initial project for this TIG. Background - Technology Overview At the end of 2001, much of the buried optical fiber, which comprises the global telecommunication, and internet-worldwide web network, was dark or unlit fiber, carrying no traffic. It is widely reported that somewhat less than 20% of buried fiber, which makes up the backbone, or superhighway, of this long haul (or long reach) network is actually being used. Meanwhile, advancements in Wavelength Division Multiplexing (WDM) are rapidly adding to the information carrying capacity, or bandwidth, of much of this buried fiber. Parallel advancements in laser transmission and receiver technology promise the near term deployment of 10 Gb/s transmitters and receivers. Early 40 Gb/s transmit/receive systems are in evaluation or latter stages of development. Approximately 20 million miles of advanced fiber was added to the long haul backbone in the past 2-3 Optoelectronic Substrates Project Report 4 years. This fiber, and most of the fiber deployed since 1995, has the chemistry and characteristics to support these new technologies. The growing use of Dense WDM (DWDM) systems, and the advanced Erbium Doped Fiber Amplifiers, and Raman amplifiers, will vastly increase the bandwidth of the existing backbone, especially when used with the emerging 10 and 40 Gb/s transmitter-receiver technologies. While it is true that much of the fiber buried before 1995 may not be able to support these new DWDM and 10-40Gb/s technologies, this legacy fiber is performing well in the healthy and busy internet-telecommunication backbone of today. How will all of this backbone capacity be utilized in the future? It is projected that telephony will consume a continually diminishing portion of network capacity, as data transmission demands continue to escalate. Within five years or less, telephony may consume less than 5% of network bandwidth, implying that telephony markets will not light up the dark fiber. Data demand from individual users in offices, through campus networks, and at home will gradually grow to fill the available bandwidth. Currently, the datacom or premise networks are connected with relatively low bandwidth optical pipes to the backbone. Most home users are connected through low bandwidth modems due to service provider limitations. The users at these access points in the business complexes, educational institutions, and neighborhoods will supply the data demand-pull if given the local capability. This local capability could be provided by extensions of fiber optic networks to provide convenient and low cost broadband to these users, creating a huge demand. Assessments of electronic and optoelectronic equipment demands for various telecommunication network segments predict that the value of the equipment needed for each mile of deployed fiber will increase radially from the backbone to the access rim. Equipment values per mile of fiber may be 100 times, or more the value of backbone optoelectronics. It is apparent that demand from the network rim will drive growth in the telecommunications industry and that much of this growth will be in the form of optoelectronics. This enormous volume demand will require very low cost laser transmit- receive hardware. Most of the optoelectronic industry is focusing on the cost reduction of backbone optoelectronic hardware. While this is necessary, success in this area will not light up the network, consume existing bandwidth, begin to consume the bandwidth of promised 40 Gb/s DWDM systems, and provide a growth stimulant to the telecommunication industry. Focus needs to shift to providing real broadband connectivity to the network rim, and to manufacture of truly low cost optoelectronic hardware for individual users and the local area networks. As the consumers become accustomed to the freedom of portable electronics, the trend to wireless is accelerating. This trend makes fiber optics, its components and design characteristics, and all of its system issues extremely