Packaging Information Mechanical Dimensions DIP-16 Unit: mm(inch) New Product Changed to PDIP-16 (2013.10) 7.320(0.288) 0.700(0.028) 3.710(0.146) 7.920(0.312) 1.524(0.060) TYP 4.310(0.170) 5° 6° 6° 4° 3.200(0.126) 4° 3.600(0.142) Φ3.000(0.118) Depth 0.050(0.002) 0.150(0.006) 0.204(0.008) 0.360(0.014) 2.540(0.100) 0.510(0.020)MIN 0.360(0.014) 0.560(0.022) TYP 3.000(0.118) 8.200(0.323) 3.600(0.142) 9.400(0.370) 6.200(0.244) 6.600(0.260) 18.800(0.740) 19.200(0.756) R0.750(0.030) Note: Eject hole, oriented hole and mold mark is optional. Dec. 2014 BCD Semiconductor Manufacturing Limited Packaging Information Mechanical Dimensions DIP-16 (Special for AZ4052) Unit: mm(inch) 7.320(0.288) 0.700(0.028) 3.710(0.146) 7.920(0.312) 1.524(0.060)T YP 4.310(0.170) 5 ° 6 ° 6 ° 4 ° 3.200(0.126) 4 ° 3.600(0.142) Φ3.000(0.118) Depth 0.050(0.002) 0.150(0.006) 0.204(0.008) 0.360(0.014) 2.540(0.100) 0.510(0.020)MIN 0.360(0.014 ) 0.560(0.022) TYP 3.000(0.118) 8.500(0.335) 3.600(0.142) TYP 6.200(0.244) 6.600(0.260) 18.800(0.740) 19.200(0.756) R0.750(0.030) Note: Eject hole, oriented hole and mold mark is optiona.l Dec. 2014 BCD Semiconductor Manufacturing Limited Packaging Information Mechanical Dimensions SOIC-16 Unit: mm(inch) New Product Changed to SO-16 (2013.10) D D1 7 ° 0.310(0.012) 0.510(0.020) 7 ° A 20:1 B 0.250(0.010) 0.400(0.016) 1.270(0.050) ) ) 2 6 0 8 4 3 . 0 ° . 0 0 ( ( ° 0 8 0 0 0 2 8 . 0 ) 9 1 R 0.070(0.003) 0 5 0.200(0.008) 0 . C 0 ( S 0 0.070(0.003) B R 7 2 . 0.200(0.008) 1 0.200(0.008) 5.800(0.228) 0.050(0.002) 0.250(0.010) ) ) 7 0 6.240(0.246) 0.250(0.010) 0 1 C-C 0 0 . 0 0 50:1 ( ( 3.800(0.150) 0 0 7 5 4.040(0.159) B 1 2 8 ° . 0 0 9 .5 20:1 ° ) 9 3 0 C . 0.200(0.008) 0 ( 0 ° Sφ 1.000(0.039) 0 3 0 . 7 ° 8 ° Depth 0.200(0.008) 1 A 0.150(0.006) C 8 ° ×45° 0.400(0.016) Note: Eject hole, oriented hole and mold mark is optional. D D1 Symbol min(mm) max(mm) min(inch) max(inch) min(mm) max(mm) min(inch) max(inch) Option1 1.350 1.750 0.053 0.069 1.250 1.650 0.049 0.065 . Option2 - 1.260 - 0.050 1.020 - 0.040 - Dec. 2014 BCD Semiconductor Manufacturing Limited Packaging Information Mounting Pad Layout SOIC-16 Z G Y X E Z G X Y E Dimensions (mm)/(inch) (mm)/(inch) (mm)/(inch) (mm)/(inch) (mm)/(inch) Value 6.900/0.272 3.900/0.154 0.650/0.026 1.500/0.059 1.270/0.050 Dec. 2014 BCD Semiconductor Manufacturing Limited Packaging Information Mechanical Dimensions WSOP-16 Unit: mm(inch) 9.950(0.392) 10.400(0.409) 0.050(0.002) 0.200(0.008) 5.000(0.197) 7.400(0.291) 5.600(0.220) 8.200(0.323) 0.300(0.012) 0.700(0.028) 1.270(0.050) TYP 0.350(0.014) 0.130(0.005) 0.550(0.022) 0.200(0.008) 2.250(0.089) MAX Note: Eject hole, oriented hole and mold mark is optional. Dec. 2014 BCD Semiconductor Manufacturing Limited Packaging Information Mechanical Dimensions DIP-14 Unit: mm(inch) New Product Changed to PDIP-14 (2013.10) 0.700(0.028) 7.620(0.300)TYP 1.524(0.060) TYP 1.600(0.063) 5° 1.800(0.071) 10° 10° 4° 4° Φ3.000(0.118) Depth 0.100(0.004) 0.200(0.008) 0.204(0.008) 0.254(0.010) 0.360(0.014) 2.540(0.100)TYP 0.360(0.014) 8.200(0.323) 0.560(0.022) 3.000(0.118) 9.400(0.370) 0.510(0.020)MIN 3.600(0.142) 1.600(0.063) 1.800(0.071) 0.130(0.005)MIN 6.200(0.244) 6.600(0.260) 18.800(0.740) 19.200(0.756) R1.000(0.039) Note: Eject hole, oriented hole and mold mark is optional. Dec. 2014 BCD Semiconductor Manufacturing Limited Packaging Information Mechanical Dimensions SOIC-14 Unit: mm(inch) New Product Changed to SO-14 (2013.10) A 0.250(0.010)×45° 0.700(0.028) 0.500(0.020)×45° 8 ° 0.100(0.004) 5° 8 ° 15° 0.250(0.010) 0 ° 8 ° 7 ° 9.5 ° 8.550(0.337) ° ) ) 8 3 9 ) 8.750(0.344) 5 6 ) 4 0 0 0 . 0 1 0 0 0 0 ( ( . 0 0 0 0 ( ( 5 5 0 0 3 7 3.800(0.150) . 0 5 1 1 1 2 . 4.000(0.157) . 0 0 0.310(0.012) 1.270(0.050) 0.510(0.020) A ) 9 20:1 3 0 . 0.200(0.008)MIN 0 ( 0 ) ) 0 8 4 0 2 4 . R0.200(0.008) 2 2 1 . 0 0 ( ( R0.200(0.008) 0 0 0 0 8 2 . 5 6 0° 8° ) 1 5 0 . 0.400(0.016) 0 ( 0 1.270(0.050) 0 3 0.250(0.010) . 1 φ2.000(0.079) Depth 0.060(0.002) 0.100(0.004) Note: Eject hole, oriented hole and mold mark is optional. Dec. 2014 BCD Semiconductor Manufacturing Limited Packaging Information Mounting Pad Layout SOIC-14 Z G Y X E Z G X Y E Dimensions (mm)/(inch) (mm)/(inch) (mm)/(inch) (mm)/(inch) (mm)/(inch) Value 6.900/0.272 3.900/0.154 0.650/0.026 1.500/0.059 1.270/0.050 Dec. 2014 BCD Semiconductor Manufacturing Limited Packaging Information Mechanical Dimensions DIP-8 Unit: mm(inch) New Product Changed to PDIP-8 (2013.10) 0.700(0.028) 7.620(0.300)TYP 1.524(0.060) TYP 5° 6° 6° 3.200(0.126) 3.710(0.146) 3.600(0.142) 4.310(0.170) 4° 4° 0.510(0.020)MIN 3.000(0.118) 3.600(0.142) 0.204(0.008) 0.254(0.010)TYP 0.360(0.014) 0.360(0.014) 2.540(0.100 ) TYP 8.200(0.323) 0.560(0.022) 9.400(0.370) 0.130(0.005)MIN 6.200(0.244) R0.750(0.030) 6.600(0.260) Φ3.000(0.118) Depth 0.100(0.004) 0.200(0.008) 9.000(0.354) 9.600(0.378) Note: Eject hole, oriented hole and mold mark is optional. Dec. 2014 BCD Semiconductor Manufacturing Limited Packaging Information Mechanical Dimensions TDIP-8 Unit: mm(inch) 1.500(0.059) 0.500(0.020)MIN 1.700(0.067) 0.600(0.024) 7.570(0.298) 3.300(0.130)MAX 0.800(0.031) 8.200(0.323) 3.100(0.122) 3.500(0.138) 0.390(0.015) 8.200(0.323) 0.940(0.037) 0.550(0.022) 1.040(0.041) 9.400(0.370) 1.470(0.058) 1.670(0.066) 2.540(0.100) BCS 9.150(0.360) 9.350(0.368) 6.250(0.246) 6.450(0.254) Note: Eject hole, oriented hole and mold mark is optional. Dec. 2014 BCD Semiconductor Manufacturing Limited Packaging Information Mechanical Dimensions DIP-7 Unit: mm(inch) New Product Changed to PDIP-7 (2013.10) 7.320(0.288) 7.920(0.312) 0.204(0.008) 0.360(0.014) 3.200(0.126) 3.710(0.146) 3.600(0.142) 4.310(0.170) 0.510(0.020)MIN 3.000(0.118) 3.600(0.142) 0.380(0.015) 1.524(0.060) BSC 0.570(0.022) 2.540(0.100)BSC 8.400(0.331) 9.000(0.354) 6.200(0.244) 6.600(0.260) 9.000(0.354) 9.400(0.370) Note: Eject hole, oriented hole and mold mark is optiona.l Dec. 2014 BCD Semiconductor Manufacturing Limited Packaging Information Mechanical Dimensions TDIP-7 Unit: mm(inch) 1.500(0.059) 0.500(0.020)MIN 1.700(0.067) 0.600(0.024) 7.570(0.298) 3.300(0.130)MAX 0.800(0.031) 8.200(0.323) 3.100(0.122) 3.500(0.138) 0.390(0.015) 8.200(0.323) 0.940(0.037) 0.550(0.022) 1.040(0.041) 9.400(0.370) 1.470(0.058) 1.670(0.066) 2.540(0.100) BCS 9.150(0.360) 9.350(0.368) 6.250(0.246) 6.450(0.254) Note: Eject hole, oriented hole and mold mark is optional. Dec. 2014 BCD Semiconductor Manufacturing Limited Packaging Information Mechanical Dimensions TSSOP-8 Unit: mm(inch) 2.900(0.114) SEE DETAIL A 3.100(0.122) 0.050(0.002) 0.090(0.004) 1.200(0.047) 0.150(0.006) MAX 0.200(0.008) 0.800(0.031) 1.050(0.041) 12 ° TOP & BOTTOM R0.090(0.004) R0.090(0.004) ) ) ) 9 7 2 6 7 5 1 1 2 .