AMD Opteron™ 4000 Series Platform Quick Reference Guide The AMD Opteron™ 4100 Series processor, the world’s lowest power per core processor1, sets the foundation for cloud workloads and affordability for mainstream infrastructure servers with prices starting at $992. AMD Opteron™ 4100 Series Processor END USER BENEFITS Outstanding Performance-Per-Watt > Designed from the ground up to handle demanding server workloads at the lowest available energy draw, beating the competition by as much as 40% (per/core).1 Business Value > The world’s first 1P and 2P capable processor at sub $100 pricing.2 Easy to Purchase and Operate > Scalable solutions with feature, component and platform consistency. PRODUCT FEATURES New AMD-P 2.0 Power Savings Features: > Ultra-low power platforms provide power efficiency beyond just the processor, 3 SOUNDBITE for both 1P and 2P server configurations. THE WORLD’S LOWEST POWER PER CORE SERVER PROCESSOR1 > APML (Advanced Platform Management Link)4 provides an interface for processor and systems management monitoring and controlling of system resources such as platform power Quick Features consumption via p-state limits and CPU thermals to closely monitor power and cooling. AMD-P 2.0: > Link Width PowerCap which changes all 16-bit links to 8-bit links5 can help power conscious Ultra-low power platform > customers improve performance-per-watt. > Advanced Platform Management Link (APML)4 > AMD CoolSpeed Technology reduces p-states when a temperature limit is reached to allow a > Link Width PowerCap server to operate if the processor’s thermal environment exceeds safe operational limits. > AMD CoolSpeed Technology > When C1E5,6 is enabled, the cores, southbridge and memory controller enter a sleep state that > C1E6 can equate to significant power savings in the datacenter depending on system configuration. > Support for LV-DDR3 Memory up to 1333 > LV-DDR3 memory support helps to reduce overall system power consumption.6 Direct Connect Architecture 2.0 > Direct Connect Architecture 2.0: > Dual Channel Memory Support > Dual Channel DDR3 Memory enables improved overall system performance and investment > Support for R/U-DDR3 up to 1333 Memory protection compared to earlier technologies. > HyperTransport™ Technology Assist [HT Assist] > R/U-DDR3 Memory up to 1333 enables improved overall system performance compared to > HyperTransport™ 3.0 Technology (HT3) at 6.4GT/s earlier memory technologies. ™ ™ AMD Virtualization (AMD-V ) Technology 2.0 > HyperTransport™ Technology Assist [HT Assist] helps increases HyperTransport™ > I/O Level Virtualization technology efficiency by reducing probe traffic and resolving probe issues. > AMD-V™ with Rapid Virtualization Indexing > HyperTransport™ 3.0 Technology (HT3) with increased speed over prior generations, > Tagged TLB up to 6.4GT/s helps improve overall system balance and scalability. > AMD Extended Migration > AMD-V™ 2.0 supports I/O level virtualization to provide direct control of device by a VM7 and improve I/O performance within a virtual machine. AMD Confidential – NDA Only 1 As of March 15, 2010, AMD Opteron™ processor Models 4158 EE/4160 EE have the lowest known power per core of any server processor, at 5.83W (35W/6 = 5.83W/core). Intel’s L5609 is 10W/core (40W/4 = 10W/core; see http://intel.com/p/en_US/products/server/processor/xeon5000/sprecifications. 2 Planned AMD Opteron™ processor 4122 1ku pricing at time of introduction. 3 Cooperative designs using AMD Opteron™ 4100 Series processor and power optimized platforms (energy efficient AMD chipset, LV RDDR3 memory support, AMD-P 2.0 technology and overall platform-level power management support) are capable of drawing less power than previous generation EE models. 4 In APML-enabled platforms. 5 Manually enabled through BIOS. 6 Standard power 4-core 2.6GHz and 2.2GHz processors do not support LV-DDR3 and C1E. 7 Enabled by the SR5690/SR5670/SR5650 chipsets . AMD Opteron™ 4100 Series Processor Quick Reference Guide AMD Opteron™ 4100 Series Processor Product Specifications AMD Opteron™ 4100 Series Processor Product Model Comparison Cache Sizes Total Cache: 9.8MB (6 core), 8.6MB (4 core) L1 Cache: 64KB (Data) + 64KB (Instruction) (per core) L2 Cache: 512KB (per core) Model Number Core Core I/O Bus Max I/O CMOS L3 Cache L2 Cache ACP4 Count Frequency Frequency2 Bandwidth3,5 Tech L3 Cache: 6MB (per socket) 4184 6 2.8GHz 2.2GHz 51.2GB/s 45nm SOI 6MB 512KB/core 75W Process Technology 45-nanometer SOI (silicon-on-insulator) technology 4180 6 2.6GHz 2.2GHz 51.2GB/s 45nm SOI 6MB 512KB/core 75W HyperTransport™ Technology Two x16 HT3 links @ up to 6.4GT/s per link*; (Power-optimized 41301 4 2.6Ghz 2.2GHz 51.2GB/s 45nm SOI 6MB 512KB/core 75W (HT3) Links platform: Three x16 HT1 links @ up to 2.0GT/s per link, dual-cHT1) 41221 4 2.2GHz 2.2GHz 51.2GB/s 45nm SOI 6MB 512KB/core 75W SR5690 chipset supports up to 5.2 GT/s per link (non-coherently) 4176 HE 6 2.4GHz 2.2GHz 51.2GB/s 45nm SOI 6MB 512KB/core 50W Integrated DDR3 memory controller – With DDR3-1333 support up Memory 4174 HE 6 2.3GHz 2.2GHz 51.2GB/s 45nm SOI 6MB 512KB/core 50W to 21.3 GB/s memory bandwidth per CPU for Socket C32 4170 HE 6 2.1GHz 2.2GHz 51.2GB/s 45nm SOI 6MB 512KB/core 50W Number of Channels/Types of Dual Channel support for DDR3 and LV-DDR3 up to 1333 Memory 4164 EE 6 1.8GHz 1.8GHz 51.2GB/s 45nm SOI 6MB 512KB/core 32W 2 4162 EE 6 1.7GHz 1.8GHz 51.2GB/s 45nm SOI 6MB 512KB/core 32W Die Size 346mm *Optional 3rd HT link available. If the third link is exercised the board must be provisioned for the increase in power. Packaging Socket C32 - 1207 Organic Land Grid Array (OLGA) SR5650, SR5670, SR5690 Product Specifications—Northbridge SP5100 Product Specifications—Southbridge USB ports 12 USB 2.0 + 2 USB 1.1 ® Number of Model PCI Express ® Max. TDP/ Process Number Processor interface PCI Express® PCIe Ports/ Virtualization Error Detection/Isolation Idle Technology Package engines PCI Bus support PCI rev 2.3 SATA 3.0Gb/s with AHCI 1.1 HyperTransport error handling, Serial ATA Hyper Transport™ 3.0 22 lanes/ AMD-Vi PCIe® Advanced Error Reporting, 29 x 29mm SW RAID Support via DotHill RAID Stac SR5650 technology (5.2GT/s) 2.0 v1.0 8 engines (IOMMU 1.2) PCIe® end-to-end Cycle 13W/7.1W TSMC 65nm FCBGA Redundancy Check SATA Ports 6 (can be independently disabled) Max. TDP/Idle 4W/1W HyperTransport error handling, Process technology TSMC .13um 1Hyper Transport™ 3.0 30 lanes/ AMD-Vi PCIe® Advanced Error Reporting, 29 x 29mm SR5670 technology (5.2GT/s) 2.0 v1.0 9 engines (IOMMU 1.2) PCIe® end-to-end Cycle 17W/7.3W TSMC 65nm FCBGA Redundancy Check Package 528 ball FCBGA, 21x21mm, 0.8mm pitch HyperTransport error handling, Hyper Transport™ 3.0 42 lanes/ AMD-Vi PCIe® Advanced Error Reporting, 29 x 29mm SR5690 technology (5.2GT/s) 2.0 v1.0 11 engines (IOMMU 1.2) PCIe® end-to-end Cycle 18W/7.5W TSMC 65nm FCBGA Redundancy Check AMD Confidential – NDA Only 1 The standard power 4-core 2.6 and 2.2 processors do not support LV-DDR3 and C1E. 2 Using HyperTransport™ technology. 3 Chipset supports up to 20.8GB/s (5.2 GT/s) non-coherently. 4 ACP stands for Average CPU power. See www.amd.com/ACP. 5 The low power 6-core 1.8 and 1.7 EE processors can be supported with HT3 for up to 51.2GB/s max bandwidth or with HT1 for up to 16.0GB/S max bandwidth depending on platform design. ©2010 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, AMD Opteron, AMD Virtualization, AMD-V, and combinations thereof are trademarks of Advanced Micro Devices, Inc. HyperTransport is a licensed trademark of the HyperTransport Technology Consortium. Other names are for informational purposes only and may be trademarks of their respective owners. PID 48410A.