Final Announcement and Advance Program

CONFERENCE at a GLANCE

SAT 1:00 pm - 5:00 pm Conference and Short Course Registration

SUN 7:00 am - 9:30 am Short Course Registration 9:00 am - 5:00 pm Short Courses 4:00 pm - 8:30 pm Registration 6:00 pm - 8:30 pm Welcome Reception (Marriott Copley Place)

MON 7:00 am - 5:30 pm Registration 8:30 am - 9:00 am Opening Program 9:00 am - 9:35 am Plenary Session 1A1.1 9:35 am - 10:10 am Plenary Session 1A1.2 10:10 am - 10:50 am Break and Exhibit Inspection 10:50 am - 11:25 am Plenary Session 1A2.1 11:25 am - 12:00 pm Plenary Session 1A2.2 12:00 pm - 1:30 pm Lunch Break and Exhibit Inspection

SESSION A SESSION B SESSION C SESSION D

1:30 pm - 3:10 pm 1A3 1B3 1C3 1D3 Fluidic On-Chip Chemical Accelerometers Manipulation Power Sensors Systems 3:10 pm - 3:50 pm Break and Exhibit Inspection

3:50 pm - 5:30 pm 1A4 1B4 1C4 1D4 In-Vivo Gas Sensing Microvalves Gyros Biosensors Systems & Pumps

6:30 pm - 9:30 pm Reception at the Museum of Fine Arts

TUE 7:00 am - 5:30 pm Registration

8:10 am - 9:40 am 2A1 2B1 2C1 2D1 Nanostructure Optical Genomics Audio Fabrication I Microsystems & DNA & Ultrasound Processing Technology 9:40 am - 10:20 am Break and Exhibit Inspection

10:20 am - 12:00 pm 2A2 2B2 2C2 2D2 Nanostructure Microrobotic Micro Analytical Magnetic Fabrication II Actuators Systems & Infrared Components Sensors 12:00 pm - 1:30 pm Lunch Break and Exhibit Inspection

1:30 pm - 3:10 pm 2A3 2B3 2C3 2D3 Micro Large Droplet Fluid Resonator Displacement Dispensing Sensing Damping Actuators Systems & Late News 3:10 pm - 5:30 pm Tuesday Poster Session with Refreshments

Device and Materials Characterization Droplet Generators Electrostatic Actuators Force and Mass Sensors Gas Sensors Micro Grippers Micro-Optical Systems Microfluidic Actuators Microfluidic Systems and Components Micropower Generation New Materials Polymer Microfabrication Technologies RF MEMS: Components and Packaging Ultrasound, Accoustic and Pressure Sensors

8:00 pm - 10:00 pm Optional: Boston Pops

1 Transducers ’03 CONFERENCE at a GLANCE continued

WED 7:00 am - 5:30 pm Registration

SESSION A SESSION B SESSION C SESSION D

8:10 am - 9:40 am 3A1 3B1 3C1 3D1 RF MEMS I Biomedical Integrated Polymer Prosthesis Biosystems Microsystems

9:40 am - 10:20 am Break and Exhibit Inspection

10:20 am - 12:00 pm 3A2 3B2 3C2 3D2 Micromanipulation Biophysical Cell Sensing Integrated and Sensing Sensors and Fabrication Manipulation Technologies 12:00 pm - 1:30 pm Lunch Break and Exhibit Inspection

1:30 pm - 3:10 pm 3A3 3B3 3C3 3D3 Dynamics of Energy Biotechnology Non-Silicon Microscale and Force & Late News Materials Systems Sensors Fabrication 3:10 pm - 5:30 pm Wednesday Poster Session with Refreshments

Bio Sensing Devices Biochips Device Design and Simulation Fabrication and Packaging of Microfluidic Devices Gas Sensing Systems Inertial Sensors Micro Actuators Micro Needles Micro Optical Components Micro Stage Actuators Microfabrication with Metals Microvalves Modeling and Control Physical Sensors Silicon Microfabrication Technologies Wireless Microsystems

7:00 pm - 10:00 pm Optional: Conference Banquet (Marriott Copley Place)

THUR 7:00 am - 3:00 pm Registration

8:10 am - 9:40 am 4A1 4B1 4C1 4D1 RF Integrated Bio Physical Optical MEMS Microsystems Chemical Interfaces Technologies Microprocessing 9:40 am - 10:20 am Break

10:20 am - 12:00 pm 4A2 4B2 4C2 4D2 RF MEMS II Nano Fluidic Packaging and Physical Manipulation I Encapsulation I Models

12:00 pm - 1:30 pm Lunch Break

1:30 pm - 3:10 pm 4A3 4B3 4C3 4D3 Environmental Nano Fluidic Packaging and Gas Phase Sensors and Manipulation II Encapsulation II Microsystems Systems & Late News 3:10 PM Conference Adjourns

Transducers ’03 2 Table of Contents

Conference at a Glance ...... 1 Invitation to Attend ...... 4 General Information ...... 5 Registration Information ...... 6 Short Courses ...... 7 Social Events ...... 11 Spouse and Guest Tours ...... 13 Hotel Accommodations ...... 17 Travel Information ...... 18 Conference Organizers and Committee Members . . . .19 Contributors and Exhibitors ...... 21 Technical Program Information ...... 22 Technical Program: Monday ...... 23 Tuesday ...... 26 Tuesday - Posters ...... 30 Wednesday ...... 39 Wednesday - Posters ...... 43 Thursday ...... 52 Hotel Registration Form ...... 57 Conference Registration Form ...... 58

3 Transducers ’03 You’re Inv ited!

e are pleased to invite you to Transducers’03: The 12th WInternational Conference on Solid-State Sensors, Actuators and Microsystems. This series of biennial conferences has been the premier forum for reporting research results in microsensors, microactuators, MEMS and microsystems. Transducers’03 will be held from June 8 – 12, 2003, returning to historic Boston, Massachusetts, where it began in 1981. All technical sessions will be held at the Boston Marriott Copley Place, which also will provide accommodations for attendees.

Transducers’03 will bring important new advances in materials and microfabrication processes; innovative designs for physical, chemical and bio sensors and microactuators; applications areas such as optical MEMS and RF MEMS, and micro total analysis systems; interface electronics; and modeling and CAD tools. The Technical Program covers four days of presentations, including the Plenary Session which opens the conference with four presentations from world famous speakers. Twelve invited speakers in different technical areas will open the morning sessions on the subsequent three days. There are nearly 200 contributed oral papers in 44 sessions and over 250 poster papers in two sessions, making Transducers the largest meeting of its kind worldwide. The Advance Technical Program is shown in detail in this brochure.

On Sunday, June 8th, preceding the start of the Technical Program, a set of eight day-long short courses are being offered on a wide range of subjects of interest to conference participants.

In addition to the Technical Program, an exciting series of social events has been planned to allow attendees the opportunities for informal interactions. This begins with a Welcome Reception at the Marriott on Sunday evening, June 8th. A Monday Evening Reception will be held at the beautiful Museum of Fine Arts a short distance from the Marriott. An optional concert by the Boston Pops Orchestra at Symphony Hall is available on Tuesday night, June 10th. The Conference Banquet at the Marriott on Wednesday night will provide an evening of conversation and entertainment. A rich program of optional events for spouses and guests has been assembled, including several tours of Boston-area historic sights and museums as well as a whale-watching expedition.

We would like to thank the 63 members of the three Regional Technical Program Committees, headed by Thomas Kenny (Americas), Kazuo Sato (Asia) and Gilles Delapierre (Europe), for their hard work in reviewing the nearly 1000 abstracts submitted and for arranging the excellent Technical Program described in this brochure.

We are particularly grateful to the IEEE for sponsoring Transducers’03, and for the financial support provided by our Contributors and Exhibitors listed.

In addition to the Advance Technical Program, this brochure contains an outline of other events, and information on registration. For all of the details and the latest information, please refer frequently to the Transducers’03 website at http://www.transducers03.org. We hope that you will be able to join us in Boston and look forward to seeing you there.

G. Benjamin Hocker Roger T. Howe General Chair Technical Program Chair

Transducers ’03 4 GENERAL INFORMATION

Conference Location All sessions and short courses will be held at the Boston Marriott Copley Place.

Boston Marriott Copley Place 110 Huntington Avenue, Boston, MA 02116 USA, Phone 1-800-228-9290, Fax 1-617-937-5685 Information/Message Board The information/Message Board will be located near the Registration Desk. Messages will be posted in this area throughout the conference. Conference Management All questions and requests should be directed to:

Preferred Meeting Management, Inc. 2320 6th Avenue San Diego, CA 92101-1643 Phone: 1-619-232-9499 Fax: 1-619-232-0799 E-mail: [email protected]

Conference Website www.transducers03.org Shipping Service A shipping service for the Technical Digest will be available on Wednesday, June 11th, and Thursday, June 12th. Shipping is to be made at attendees own expense.

Official Language The official language of the conference is English and will be used for all presentations and printed materials. Passport and Visa All foreign visitors desiring to enter the United States must have a valid passport. Participants from countries requiring visas should apply to the American Consular offices or diplomatic mission in their countries. For details, please consult your travel agent or the nearest American consulate. Conference Management can send you a letter of invitation to the conference. Send a request by email to [email protected]. No funds are available to assist with travel and registration fees cannot be waived. Climate The weather in Boston in June is pleasant with the following temperatures: Normal High: 76˚ / 24˚C Normal Low: 58˚ / 14˚C Currency Exchange Only US dollars are acceptable at regular stores and restaurants. The exchange rate fluctuates daily. Visit http://europe.onada.com Traveller’s Checks and Credit Cards Credit cards, including MasterCard®, Diners Club®, Visa® and American Express®, and traveller’s checks are accepted at most hotels, restaurants, department stores, and souvenir shops. Tipping 15% is standard for meals. $1.00/bag to skycaps, doormen, porters, and bellmen. Electricity Electricity throughout the United States is 110V, 60 Hz. Insurance The organizer cannot accept liability for accidents, injuries and losses which might occur. Participants are encouraged to obtain travel insurance (medical, personal accident, and luggage) in their home country prior to departure.

5 Transducers ’03 REGISTRATION INFORMATION

The conference begins with registration for the Conference and the Short Courses at the Boston Marriott Copley Place on Saturday, June 7th from 1:00 p.m. - 5:00 p.m. Short Courses are on Sunday, June 8th from 9:00 a.m. - 5:00 p.m. . An informal Welcome Reception will be held in conjunction with registration from 6:00 p.m. - 8:30 p.m. on Sunday, June 8th. The official technical program will begin Monday morning at 8:30 a.m. and adjourns on Thursday, June 12th, at approx. 3:10 p.m. Registration Fees Registration Fee Before 4/15/03 After 4/15/03 After 5/23/03

IEEE Member $595.00 $660.00 $760.00 Non-Member $740.00 $825.00 $900.00 Student $550.00 $625.00 $700.00

Short Courses $375.00 $425.00

Additional Technical Digest Your registration fee includes (1) Technical Digest. IEEE Member...... $180.00 (each) Non-Member...... $200.00 (each) (Price does not include shipping) Registration & Information Desk The Registration and Information desk will be open during the following times: Saturday June 7th ...... 1:00 p.m. - 5:00 p.m. Sunday, June 8th ...... 7:00 a.m. - 9:30 a.m. Sunday, June 8th ...... 4:00 p.m. - 8:30 p.m. Monday, June 9th ...... 7:00 a.m. - 5:30 p.m. Tuesday, June 10th ...... 7:00 a.m. - 5:30 p.m. Wednesday, June 11th ...... 7:00 a.m. - 5:30 p.m. Thursday, June 12th ...... 7:00 a.m. - 3:00 p.m.

Registration is an electronic process. To register for the conference, short courses, all social events, and optional tours, please visit the website (www.transducers03.org). All attendees are encouraged to register in advance to avoid delays in registering at the conference. If you are unable to register online, a registration form is provided for you in the back of this brochure.

Registration payment, in U.S. Dollars only, is due upon submission of registration. The registration fee includes program material, (1) Technical Digest and CD ROM, exhibit hall access, welcome reception, Monday Night Reception at the Museum of Fine Arts, refreshment breaks, and a 20% non-refundable cancellation fee. A $50.00 fee will be charged for all substitutions. A $5 fee will be assessed for lost or duplicate nametags.

Luncheons are not included in the registration fee. There are two restaurants located in the Boston Marriott and numerous restaurants can be found in the shopping mall connected to the Boston Marriott Copley Place.

Cancellation Policy A 20% non-refundable cancellation fee will be assessed to all cancellations on or before May 16, 2003. No refunds will be made after that date. Cancellation notice and refunds must be requested in writing.

TransducersTransducers ’03’03 6 SHORT COURSES

Short Courses in selected areas will be offered on Sunday, June 8, 2003 at the Boston Marriott Copley Place. There are a total of eight full day short courses presented by experts in the field. The courses are scheduled from 9:00 a.m. - 5:00 p.m. On-site registration is very limited because course materials have to be prepared prior to conference time, so early registration is recommended. Indicate your choice of the short courses on the registration form. (visit www.transducers03.org or see form at the end of this brochure.)

Short Course 1 Introduction to Packaging of Micro Electro-Mechanical Systems (MEMS) Instructor: Victor M. Bright, University of Colorado, USA

MEMS technology uses advanced microfabrication techniques to produce miniaturized electro-mechanical systems that have feature sizes in the regime of 1 micron. Controllable motions from nanometers to millimeters can be realized with this technology for applications in the area of optics, wireless communication, information storage, and industrial and consumer instrumentation and control.

Fabrication and packaging of micro electromechanical systems (MEMS) is the subject of immense interest. MEMS packaging and integration with other components is challenging and unlike IC packaging, have different set of demands driven largely by application specific nature of MEMS components. Material selection and choice of package impacts performance, reliability, manufacturing yield and cost.

Traditional packaging materials and methods may not be adequate to meet the requirements of advanced microsystem designs. In response, numerous novel materials and packaging methodologies have been, and are continuing to be developed. This course is designed to provide a brief overview of MEMS technology and MEMS applications followed by survey of packaging techniques for MEMS-enabled microsystems.

Packaging of MEMS is discussed at device level, die level, and hybrid integration with other microelectronic components. Applications of established methods from microelectronics are discussed to package MEMS and/or build advanced microsystems at device level. The attendees will be given a clear overview of the available fabrication, packaging and integration techniques for MEMS so that they can envision applicability of the technology to their specific industry.

Short Course 2 Introduction to MEMS and Micromachining Technology Instructor: Carol Livermore, Massachusetts Institute of Technology, USA

MEMS fabrication techniques enable the creation of a variety of devices from a broad range of materials systems. This short course will cover MEMS-specific fabrication techniques, including surface and bulk micromachining, patterning techniques, wafer bonding, and MEMS process design.

The discussion of surface and bulk micromachining will include specific techniques (i.e. structure release, DRIE, bulk wet etching, etch stops, plated structures), along with nonidealities, typical problems, and the impact of various parameters on the final result.

Techniques for patterning complex three dimensional structures will be presented, including masking materials, nested masks, and shadow masking.

The discussion of wafer bonding will include different types of bonding (silicon fusion, anodic, eutectic, ther-mocompression), requirements to achieve bonding, characterization of bond quality, and special appli-cations like packaging or vacuum sealing.

The discussions on MEMS and micromachining technology will also address both device and process design, with an emphasis on packaging, materials, and pro-cess compatibility issues for various device and system applications.

7 Transducers ’03 SHORT COURSES continued

Short Course 3 Analog Circuit Design for Sensor Interfaces Instructor: Willy Sansen, Katholieke Universiteit Leuven, BELGIUM

This course is aimed at designers of analogue circuits who have already some experience. It focusses on systematic approaches of design tasks for sensor interface circuits. The emphasis is on amplifiers for resistive and capacitive sources with low offset, noise, power consumption, etc. It handles both technologies MOST and bipolar strictly in parallel.

The course contains five lectures (of 1.25 hour) for a full day. Most material is taken from the Laker- Sansen book (MacGrawHill, 1994).

• 00. Introduction on sensor interfaces (short) • 01. Simple MOST and bipolar-transistor models for elementary circuit blocks • 02. Noise performance of elementary transistor stages for resistive and capacitive source impedances • 03. Systematic design of operational amplifiers for low power consumption • 04. Important single- and fully-differential opamp configurations • 05. Offset and CMRR; random and systematic

Short Course 4 MEMS for RF/Wireless Communications Instructor: Hector De Los Santos, NanoMEMS Research LLC, USA

Microelectromechanical systems (MEMS) technology is on the verge of revolution- izing RF and Microwave wireless applications [1], [2]. As the requirements of present day and future wireless systems for lower weight, volume, power consumption and cost with increased functionality, frequency of operation and component integration become more and more demanding, the potentialities of the RF MEMS arsenal to meet these requirements, by enabling new wireless components and system architectures, are becoming ever more attractive. In this course we address the fundamentals and emerging applications of this exciting technology.

We begin by clearly stating the ubiquitous wireless communications problem, in particular, as it relates to the technical challenges to meet the extreme levels of appliance functionality, in the context of low power consumption, demanded by consumers in their quest for connectivity at home, while on the move or on a global basis. Next, we review those salient points in the discipline of RF circuit design, that are key to its successful practice, and which are intimately related to the successful exploitation of RF MEMS devices in circuits. In particular, the subjects of skin effect, the performance of transmission lines on thin substrates, self-resonance frequency, quality factor, moding (packaging), DC biasing, and impedance mismatch are discussed.

We then undertake an in-depth examination of the arsenal of MEMS-based devices, on which RF MEMS circuit design is predicated, namely, capacitors, inductors, varactors, switches, and resonators, including pertinent information on their operation, models, and fabrication, and concluding with a discussion of a paradigm for modeling RF MEMS devices using 3-dimensional mechanical and full-wave electromagnetic tools, in the context of self-consistent mechanical and microwave design. Next, we present a sample of the many novel devices and circuits that have been enabled by exploitation of the degrees of design freedom afforded by RF MEMS fabrication techniques, in particular, reconfigurable circuit elements, such as inductors, capacitors, LC resonators, and distributed matching networks, reconfigurable circuits, such as stub-tuners, filters, oscillator tuning systems, RF front-ends, phase shifters, and reconfigurable antennas, such as, tunable dipole and tunable microstrip patch-array antennas.

The course culminates with a number of case studies, which integrate all the material previously presented, as it examines perhaps the most important RF MEMS circuits, namely, phase shifters, filters, and oscillators.

Transducers ’03 8 SHORT COURSES continued

Short Course 5 Optical MEMS In Communication and Sensing: Fabrication, Design and Scaling of Optical Microsystems Instructor: Olav Solgaard, Stanford University, USA

The toolbox developed for fabrication of integrated circuits and MEMS is excep- tionally well suited for realization of optical devices and systems. There are several reasons for this. First, the dimensions, and dimensional control, of micromachined structures can be on the order of or smaller than the wavelength of light, which enables accurate control of optical fields. Second, even relatively weak MEMS actuators provide more than sufficient force for manipulation of photons. Finally, actuated micromirror and micrograting arrays enable optical functions that cannot practically be implemented using traditional optical fabrication technology.

MEMS technology therefore has the potential to revolutionize optical science and technology by providing miniaturized, low-cost, massively parallel, highly- functionalized, optical microsystems. At present, the biggest impacts of optical MEMS technology are in high-resolution projection displays and fiber-optic communications. Other promising application areas include adaptive optics, free- space communication, spectroscopy, tunable lasers, and interferometric sensors.

This course describes the materials, processes, and devices that form the foundation of optical microsystems, and discusses the prospects for further developments. Both proven, commercial fabrication technology, as well as emerging techniques, will be presented. Design of microoptical devices and systems will be discussed with an emphasis on fundamentals of optical interactions in microstructures. Case studies focussing on displays, diffractive optics, fiber optics, spectroscopy, and microsensors will be used to illustrate fundamentals and provide practical information about applications.

Short Course 6 BioMEMS (Biomedical Microelectromechanical Systems) Instructor: Dorian Liepmann, University of California at Berkeley, USA

Course objective: First objective of this course is to build basic foundation for understanding of mechanisms on microscale electrical, mechanical, chemical, and optical transducers in the context of biomedical applications. Second objective is to teach critical thinking in microengineering design issues, biomaterial compatibility, working in biofluidic circuits, cellular interaction at the interface, and other bioengineering considerations. Third objective is to review current biomedical applications of MEMS (BioMEMS) activities along with the examination of the viabili- ty of nano-scale devices and BioMEMS technology in a particular biomedical application.

Intended audience: This course is designed for technical staffs, engineers, techni- cians, managers, and sales professionals in the biotechnology, equipment, and medical industries. Individuals who want to understand BioMEMS and micro- and nanoscale bioengineering will benefit from this course. A basic understanding of biological and physical science is recommended.

Prerequisites: BS in engineering/biology/chemistry/physics, equivalent practical experience, or consent of instructor.

Upon completing this course participants should be able to: Understand basic understanding of functions, issues, needs, trends, and roadmaps of BioMEMS and critical thinking in microengineering design issues and biofluidic circuits for biotechnology as well as the importance in nano-scale surface controls in BioMEMS and tissue engineering applications.

Instructional methods to be used: It is designed to provide a comprehensive overview of BioMEMS, without the lengthy advanced mathematics or the details of biochemistry usually associated with traditional microdevice physics and biotechnology courses.

9 Transducers ’03 SHORT COURSES continued

Short Course 7 Simulation of Micro and Nanosystems: Foundations, Emerging Techniques and Challenges Instructor: Narayana R. Aluru, University of Illinois, USA

The objectives of this short course are to cover fundamental issues, emerging techniques and challenges in modeling and simulation of micro and nanosystems. Simulation of micro and nanosystems is challenging because of several reasons - inadequate characterization of new materials, different processing technologies, complex device geometries, presence of several mixed energy domains, break-down of classical physics or continuum theories, lack of automatic techniques to generate compact models or reduced-order models, inadequate tools for system-level analysis and several others. A range of topics will be covered in this short course to high- light the simulation issues specific to MEMS and nanotechnology.

The topics to be covered in this course include:

• Introduction of sensor and actuator technologies at micro and nanoscales.

• Device modeling of micro and nanoscale devices including classical computational methods (finite-element and accelerated boundary- element methods), new computational methods (meshless methods for interior and exterior analysis), fast algorithms, algorithms for mixed- technology integration and multiscale methods combining classical and non-classical physics.

• Microfluidics including gas and liquid flows; pressure driven and electroosmotic flows; break-down of continuum theories; new continuum models; fundamentals in nanofluidics including fluid flow through carbon nanotubes and slit capillaries.

• Simulation of new materials (e.g. pH, electrically responsive and biomolecule responsive gels) for Bio-MEMS applications.

• Molecular techniques such as Monte Carlo and molecular dynamics methods.

• Dynamic analysis of micro and nanosystems including classical implicit and explicit methods, lumped models, reduced-order models based on basis-function and other approaches and compact models.

• Techniques for system-level analysis of MEMS and microfluidics.

Short Course 8 Engineering with the Engines of Creation Instructor: Carlo D. Montemagno, University of California, USA

Advances in single molecule manipulation coupled with a more complete understanding of biomolecular processes have enabled the development of a new class of materials. These materials have the potential to emulate much of the functionality associated with living systems such as the active transport and transformation of matter and information and the transduction of energy into different forms.

This course will present the details of the technological demands and the results of efforts associated with the production of functional materials. Elements of the discussion will include the genetic engineering of active biological molecules into engineering building blocks, the precision assembly of these molecules into a stable, “active” material and, finally the potential of embedding intelligent behavior into the matrix of assembled matter.

Transducers ’03 10 SOCIAL EVENTS

An exciting series of social events has been planned to allow attendees ample opportunity to interact informally while enjoying the sights and richness of Boston. Of the four social events shown below, the Welcome Reception and the Evening Reception at the Museum of Fine Arts are included in the registration fee, while the Transducers’03 Evening at the Boston Pops Concert and the Conference Banquet are optional and may be purchased separately.

Welcome Reception Sunday Evening, June 8, 6:00 p.m. - 8:30 p.m.

Conference registration and an informal welcome reception will be held at the Marriott Copley Place.

Evening Reception at the Museum of Fine Arts Monday Evening, June 9, 6:30 p.m. - 9:30 p.m.

A reception will be held at the Museum of Fine Arts on Monday evening. The Museum is one of the world’s great international art museums with treasures from all of the world’s major civilizations. The Museum has the largest collection of Monets outside of Paris as well as renowned collections of European and American paintings, Egyptian, Asian and Classical art, sculpture and drawings.

This event is included in the registration fee. Additional tickets may be purchased for guests when you register. Cost of additional tickets is $75.00 each.

Transducers’03 Night at the BOSTON POPS CONCERT at SYMPHONY HALL Tuesday evening, June 10, 8:00 p.m. - 10:00 p.m.

On Saturday, July 11, 1885, a large and fashionable crowd showed up at the Boston Music Hall for the first ever Promenade Concert. The Boston Symphony had prom- ised them that the “programme for these concerts will be made up largely of light music of the best class.” It was the start of one of America's most-loved musical institutions, the Boston Pops. Symphony Hall opened on October 15, 1900. It was the first concert hall designed with acoustical principles in mind and is regarded as one of the two or three finest halls in the world. With the exception of the wooden floors, the Hall is built of brick, steel, and plaster, with only a moderate amount of decoration. It seats 2,625 people during the BSO season and 2,371 during the Pops season. Springtime brings delightful Pops performances to Symphony Hall, which is transformed into a relaxed, cabaret-style setting. The Pops dazzles millions more each summer with outdoor concerts on the Charles River Esplanade and a special live television broadcast on July 4. The Boston Pops also tours various U.S. cities - from the West Coast to the Heartland and the South - making musical memories for countless American audiences! The Boston Pops is composed of distinguished musicians, many of whom are also members of the Boston Symphony Orchestra. The twentieth Conductor of the Pops and only the third Conductor since the famous Arthur Fiedler, Keith Lockhart was appointed in February 1995. He was 35 years old - the same age Arthur Fiedler had been at the time of his appointment. As the Conductor of the Pops, Lockhart has conducted more than 300 concerts and made 33 television shows, including 20 new programs for PBS’s “Evening at Pops” and the annual “Pops Goes The Fourth!” shown nationally on A&E.

Orchestra-Front Floor ...... $83.00 Orchestra-Mid Floor ...... $63.00

11 Transducers ’03 SOCIAL EVENTS continued

Conference Banquet Wednesday Evening, June 11, 7:00 p.m. - 10:00 p.m.

The Conference Banquet is scheduled for Wednesday evening in the Ballroom of the Marriott Copley Place. The banquet will feature entertainment from the Smith- Houlihan Irish Dance Company. This remarkable Dance Troupe, based in Boston, is recognized as one of the premier Irish Dance Companies in North America. Their flawless and fast-paced exhibitions of contemporary and traditional Irish dance will leave you mesmerized. The Smith-Houlihan Irish Dance Company is the grand prize winner of the 1997 Riverdance Aspiring Artists Award, over 30 All World solo and team dance awards, and they are the proud recipients of the 1995 All World championship title won in Galway, Ireland. In addition to the awards bestowed upon the Company at the British Nationals, Australian Nationals, and the All Scotland and All Ireland Championships, this eight-time North American championship group has trained dancers chosen to perform with the touring companies of Riverdance, Lord of the Dance, and the Trinity Irish Dance Troupe.

Tickets for the dinner should be purchased when you register for the conference. Banquet Tickets ...... $90.00

ATTENTION! The Transducers’03 Night at the Boston Pops Concert and the conference banquet are optional events. Tickets may be purchased when you register online. Tickets must be purchased in advance and may be sold out, so order your tickets early!

Photos by Christian Steiner & Michael Lutch

Boston Symphony Orchestra conducted by Keith Lockhart

Transducers ’03 12 SPOUSE and GUEST TOUR INFORMATION

On behalf of Transducers’03 we invite you to experience a true taste of Boston. With a mix of colonial charm and urban sophistication, Boston is a dynamic site. Boston’s role in shaping American history is unique among all other cities. See the places where the American Revolution was conceived and began. From Paul Revere’s House to the Boston Tea Party Ship to the Old North church, history is on every corner. Boston’s many museums, concert halls, theatres and nightclubs are always abuzz with activity and excitement. With a wide array of diverse and inter- esting attractions, visitors to Boston are never at a loss for something to do.

An exciting program of activities is planned for the spouses and guests of participants!

SUNDAY, JUNE 8

Tour 1 Min. 40 people 5.5 Hours 8:30 a.m. - 2:00 p.m. “Gentle Giants” - Whale Watching Expedition $65.00 per person

“Thar she blows” is the cry heard as you depart Boston harbor and head out to sea on your fascinating whale watch cruise. Enjoy the comfort of your modern boat as you cruise to Stellwagen Bank, feeding ground of the whales. Known as “nature’s grocery store for whales”, Stellwagen Bank is an underwater plateau 100 feet deep and 21 miles long – attracting humpback, minke, fin back, and North American right whales in addition to basking sharks, sea turtles and dolphins. Be sure to have your cameras ready for these magnificent creatures may swim along side the boat!

Tour 2a Min. 40 people 2.5 Hours 12:30 p.m. - 3:00 p.m. Tour 2b Min. 40 people 2.5 Hours 3:30 p.m. - 6:00 p.m. Basically Beantown Coach Tour $45.00 per person

Discover what makes this compact city of 600,000 a world-class destination. Preserving the heritage of the old and blending it with the new and exciting, this city tour presents history, architecture, and landmark events in a fascinating package. Tour past the graceful red brick townhouses of the early 1800’s on Beacon Hill, still the most elite address in Boston. Drive by the Cheers! Bar of television fame, and into the “modern” Back Bay of the late 1800’s, an elegant Victorian neighborhood of homes, with designer shops and sidewalk cafes along chic Newbury Street. See where the old meet the new in Copley Square, as our nation’s first all glass high rise, the stunning mirrored Hancock Tower, reflects H.H. Richardson’s Romanesque style Trinity Church, known as one of the most beautiful buildings in the world, nestled at its feet. View the European style Public Garden with its exotic seasonal plantings, striking statues, and duck lagoon with its diminutive suspension bridge. Ride by Freedom Trail sites of Revolutionary War fame, including the Old State House, the Boston Common, and the Granary Burying Ground. View Faneuil Hall’s famous golden grasshopper weathervane and popular Quincy Market, restored bustling marketplace. Drive past the newly restored Old South Meeting House, where Sam Adams met with the populace and brewed the Boston Tea Party. See Boston’s Little Italy (the North End) and Chinatown, two different neighbor- hoods that add to the city’s diversity. Catch a view of the Theater District, home to many pre-Broadway tryouts. A stop will be made today at the newly renovated Mapparium. This stained-glass globe in the Christian Science Publishing Society gives you a unique experience – the opportunity to “step inside the world.” Your local guide will present the rich heritage and modern facets of this important American city in this comprehensive tour.

13 Transducers ’03 SPOUSE and GUEST TOUR INFORMATION continued

MONDAY, JUNE 9

Tour 3 Min. 30 people 4 Hours 8:00 a.m. - 12:00 p.m. Lexington and Concord, with Harvard Yard $49.00 per person

Leave the city for a scenic drive through the countryside past fine estates, farmers’ fields, stonewalls, and breathtaking seasonal landscapes. See the suburban and rural areas where New Englanders have made their homes for centuries. Clapboard colonial homes, barns, fields and landscaped grounds serenely await your discovery in this tranquil region. Across the Charles River from Boston, disembark by Cambridge’s Harvard Yard for an opportunity to “go through” prestigious Harvard University. Through green lawns past hallowed halls of red brick, see the famous seated bronze statue of John Harvard, cast by D.C.French, the sculptor of the Lincoln Memorial. Drive through bustling, eclectic Harvard Square and through the toney mansion district of Cambridge. The coach pauses by the Georgian style home of poet Henry Wadsworth Longfellow on Tory Row, street of Revolution era homes of wealthy Loyalists. With your guide, trace the steps of the colonial troops across the Lexington Green. Surrounded by the old tavern and authentic pre- Revolutionary homes, it looks much as it did in April, 1775, when Minutemen and Red Coats first skirmished. Hear the story of the brave men who lost their lives in 1775 so that we might pursue our independence today. Make a stop inside the Visitor’s Center to view the detailed diorama, which accurately depicts the fateful morning’s events, and browse in the gift shop for souvenirs. Follow your guide to the stirring monuments and plaques of the Green. In neighboring Concord, stretch your legs on the North Bridge, spanning the peaceful Concord River, set amidst con- servation land preserving the lush beauty of this now quiet, reflective spot where once the Colonial farmers dared open fire on the Queen’s army. The story of the bridge where “once the embattled farmers stood and fired the shot heard ‘round the world,” will come to life again. View the Concord Minuteman statue, the heralded work of D.C. French. Pause at the rural homes of the renowned authors of the 1800’s: Ralph Waldo Emerson’s mansion, Louisa May Alcott’s Orchard House, Nathaniel Hawthorne’s Wayside, and Henry David Thoreau’s territory, he who sought refuge in the countryside.

TUESDAY, JUNE 10

Tour 4 Min. 30 people 8 Hours 8:00 a.m. - 4:00 p.m. “The Gilded Era” Newport Tour $107.00 per person (includes lunch) Depart Boston this morning with your Tour Guide, as you drive to Newport, Rhode Island, (approximately 1 hour ride). Amongst many things, the seaside resort community of Newport is renowned for its opulent mansions and as the former home of the America’s Cup Races. Your tour of Newport begins with a ride along the oceanfront Ten-Mile Drive, where each home surpasses the last. Your guide will give insights to life in Newport as you view the magnificent mansions built in the “Great Gatsby” style by the Astors and the Vanderbilts. Learn about the yachting history of the city, galleries, unusual art and antique shops, and lovely boutiques. Next, stop for a visit to one of the most well-known summer estates - The Breakers. This “summer cottage” with over 37,000 square feet of space was home to Cornelius Vanderbilt II. Modeled after a seventeenth-century Italian palace, the Breakers offers insight into the lavish lifestyles of our country’s first millionaires. After, enjoy lunch overlooking the grass courts at La Forge Casino, adjacent to the Tennis Hall of Fame or another popular Newport venue, and later take time to explore the Brick Marketplace and the scenic harbor front area before returning to Boston.

Transducers ’03 14 SPOUSE and GUEST TOUR INFORMATION continued

Tour 5 Min. 30 people 4 Hours 1:00 p.m. - 5:00 p.m. Freedom Trail Walking Tour, with USS Constitution & Bunker Hill $53.00 per person

Boston is known as America’s Walking City and this tour highlights why. Explore the historic streets of old Boston in a small group with your knowledgeable local walking tour guides. The Freedom Trail connects sites from the colonial era of the 1700’s in a compact walking tour through the city; past churches, government buildings, meeting houses and burial grounds. See over a dozen restored, original buildings and sites from our country’s birth. Start with a stroll through the oldest public park in America, the Boston Common, where public meetings, punishments, and hangings took place, and once the British Red Coats camped in tents. Pass the gold domed State House, originally John Hancock’s pasture land, and view one of the most beautiful war memorials in our country, a bronze tribute to Robert Gould Shaw’s 54th regiment. On to the Granary Burying Ground graves of Hancock, Sam Adams, and Paul Revere, and learn of the symbolism of the earliest carved Puritan gravestones of the 1600’s. See the spot where colonial men fell in the Boston Massacre in front of the Old State House of 1713, a precious brick jewel of a building adorned with golden and silver lion and unicorn statues by the balcony where the Declaration of Independence was read aloud in 1776. Have a seat in Faneuil Hall, made famous by speakers Sam Adams, Susan B. Anthony, and JFK, among others, and see its gilded grasshopper weathervane. Hear the story of the Boston Tea Party and see where it was plotted by the Sons of Liberty in the 1729 Puritan Old South Meeting House. In the presently Italian North End, the Old North Church welcomes you into its high-sided box pews surrounded by artifacts of the congre- gation of the1700’s. Hear of the two signal lanterns hung in the spire to warn of the Red Coats march as Paul Revere made his famous midnight ride in April of 1775. Take time to browse in the Museum and gift shop for tasteful souvenirs. See (from the outside) the oldest wooden house in Boston, purchased by Paul Revere in 1770 for his growing family. Beautifully restored by his descendents, the Revere House structure dates from 1677, in the waterfront community of the North End. Crossing over the mouth of the Charles River see the Bunker Hill Monument before heading to the Charlestown Navy Yard, where we stop for photos at the oldest commissioned ship still afloat in the world - the U.S.S. Constitution - better known as “Old Ironsides”. Browse in the Constitution gift shop for maritime related souvenirs. Though not a strenuous walk, it is recommended for those who are com- fortable walking about 2 miles.

WEDNESDAY,JUNE 11

Tour 6 Min. 30 people 3.5 Hours 11:00 a.m. - 2:30 p.m. Isabella Stewart Gardner Museum in Depth $88.00 per person

Today’s tour highlights one of Boston’s unique treasures with a visit to the Isabella Stewart Gardner Museum. “Mrs. Jack Gardner was a unique individual with a style and grace of her own. Her desire was to create her Isabella Stewart Gardner Museum as a 15th century Venetian palace and fill it with artwork and artifacts from many eras and many places. Her eclectic collection began in the late 1800’s in Europe, and encompasses the masters; Rembrandt, Rubens, Boticcelli, along with tapestries, furniture, garden statuary, and many fine works on canvas and wood. Known for her singular style, Mrs. Jack’s three-story courtyard is always filled with magnificent flowers and trees. The surrounding galleries of paintings, drawings, and furnishings must remain unmoved, in the same position as first decreed by Mrs. Gardner. Every room is a gallery of impressive and uniquely arranged artwork, and brings surprise and delight to the visitor. We will have a private docent guided tour (1 hour) of this amazing venue and collection. Exploring the Museum in further in depth, we have also included a 30 minute tour of the Greenhouse. A member of the horticulture staff will lead your group on a behind the scenes tour of the Gardner Museum’s on-site greenhouse, leaving plenty of time for any questions. Due to the restricted hours of the Greenhouse, the tour will run during the lunch hour. Please make note of this and make necessary arrangements to eat before or after the tour.

15 Transducers ’03 SPOUSE and GUEST TOUR INFORMATION continued

THURSDAY,JUNE 12

Tour 7 Min. 30 people 3 Hours 9:00 a.m. - 12:00 p.m. JFK Library Visit $48.00 per person

Travel today a few miles south of Boston, to peaceful Dorchester Bay, where a striking I.M Pei designed building rests on the tip of Colombia Point – the John F. Kennedy Library and Museum. Situated on the ocean that JFK cherished, the exhibits and collections give a detailed look at the administration of the first Irish American president. Upon arrival, be seated in the theater for a 17-minute intro- ductory film, narrated in part by JFK. Next, enter the firstexhibit area, filled with 1960’s memorabilia and campaign items, and then move on to a series of stately rooms, decorated with artifacts and artwork from the Kennedy administration. Modeled after the architecture of the White House, each room offers seating and a viewing of a continuous video of one of the famous speeches of JFK. Have a seat in a studio set and watch the first ever televised debate between Nixon and Kennedy, enter a paneled office and hear the Berlin Wall speech, or the moving Inaugural Address; “Ask not what your country,” speech. Stand in the Oval Office at the President’s hand carved oak desk, and hear the address to the nation on civil rights. A tribute to first lady Jacqueline Bouvier Kennedy presents a video of her televised tour of the White House, and the Emmy Award it won. View other posses- sions, gifts received, and an original outfit on display in this special exhibition.

• Registration for Spouse and Guest Tours will close once they are filled.

• Payment may be made by credit card (Visa®, MasterCard®), bank wire, check or money order payable to Transducers’03 in U.S. dollars.

• Please contact us at [email protected] for bank wire information.

• Individual tour cancellations prior to May 2, 2003 will be subject to a $5.00 handling fee.

• Refunds will not be given after May 2, 2003. Refunds for tours, which may be canceled (subject to registration), will be credited to your charge card or mailed to you.

• Tours leave from the Marriott Copley Place, Carriage Entrance on Huntington Street.

• If you have a special need (such as a wheelchair accessible vehicle) please notify us by May 2, 2003.

• Price includes guide, deluxe motor coach transportation and admissions, unless otherwise noted.

The U.S. Custom House Tower & Faneuil Hall Marketplace

Transducers ’03 16 HOTEL ACCOMMODATIONS

In the heart of Boston’s historic Back Bay, The Boston Marriott Copley Place is an anchor hotel in Boston's posh 9 1/2 acre Copley Place development. The hotel has easy access to over 200 upscale shops and restaurants and an 11-screen cinema.

Reservations can be made on the website at www.Marriott.com/bosco/copley.

To ensure that you receive the special group rates, use the internet code: TRDTRDA to make your reservations. Alternatively, fax or mail your hotel reservation form directly to the Boston Marriott Copley Place by May 16th, 2003.

Transducers’03 Boston Marriott Copley Place 110 Huntington Avenue Boston, MA 02116 USA 1-800-228-9290 or 1-617-236-5800 Fax 1-617-937-5685 www.Marriott.com/bosco/copley

When calling, please identify yourself as an attendee of the Transducers’03 group. Reservations made after May 16, 2003 will be confirmed subject to availability of space and special group rates. Hotel confirmations will be sent directly to you from the Boston Marriott.

For more information on the Boston Marriott Copley Place please visit their website at:

www.Marriott.com/bosco/copley

A credit card is required to guarantee all reservations. Reservations must be cancelled 48 hours in advance of arrival date. Any phone call placed outside the hotel has an access fee of $1.00. Check-in time is 4:00 p.m. Check-out time for all guests is 12:00 p.m.

Trinity Church and the Paul Revere Statue

17 Transducers ’03 TRAVEL INFORMATION

Airfare

The Conference has selected American Airlines as the official airline. To begin your meeting successfully with American Airlines, follow these simple steps:

Call American Airline Reservations at 1-800-433-1790. Refer to File Number: 9663AG

Additional Airlines These airlines also serve the Boston Logan Airport. British Airways ...... 1-800-662-2912 ...... www.us.britishairways.com Continental Airlines . . . .1-800-295-4983 ...... www.continental.com Delta Air Lines ...... 1-800-221-1212, 1-617-561-2745 ...... www.delta.com Northwest Airline ...... 1-800-225-2525 ...... www.nwa.com Southwest Airlines . . . . .1-800-435-9792, 1-401-739-0563 . . . . .www.southwest.com United Airlines ...... 1-800-241-6522 ...... www.ual.com US Airways ...... 1-800-428-4322, 1-978-535-6695 . . . . .www.usairways.com

Car Rental

The Conference has selected Hertz as the official car rental company. To begin your meeting successfully with Hertz, follow these simple steps:

Call 1-800-654-2240 in the U.S.; 1-800-263-0600 in Canada; 1-416-620-9620 in Toronto; or outside these areas at 1-405-749-4434

Refer to CV#: 022J0888

Meeting rates are guaranteed from one week prior through one week after the meeting dates and are subject to availability. Advance reservations are recommended; blackout dates may apply. Government surcharges, taxes, tax reimbursement, airport related fees, vehicle licensing fees and optional items, such as refueling or additional driver fees, are extra. Minimum rental age is 25 (exceptions apply). Standard rental conditions and qualifications apply. In the continental U.S., weekend rentals are available for pick-up between noon Thursday and noon Sunday and must be returned no later than Monday at 11:59 p.m. Weekend rentals have a minimum two-day keep and Thursday pick-up requires a minimum three-day keep. Weekly rentals are from five to seven days. Extra day rate for Weekly rentals will be charged at 1/4 of the Weekly Rate.

Airport Shuttle

The conference has selected Back Bay Coach for airport shuttle transportation. The cost is $8.00 one way. Once you have picked up your baggage at Logan Airport, proceed outside to the blue poles for van pick-ups. Shuttles run from 6:00 a.m. to 10:30 p.m. every 15 minutes.

To make on-line reservations go to www.backbay-coach.com and scroll to bottom of the page and enter frequent ID # TRANS to receive discounted fare. OR Visit www.transducers03.org/attendees/travel.html and print out their COUPON and hand it to the driver when you pay for your fare.

Transducers ’03 18 CONFERENCE ORGANIZERS and COMMITTEE MEMBERS

General Conference Chairman: G. Benjamin Hocker, Honeywell Laboratories, USA

Technical Program Chairman: Roger T. Howe, University of California - Berkeley, USA

Executive Program Committee

G.B. Hocker, Honeywell Laboratories, USA General Conference Chairman R.T. Howe, Univ. of California - Berkeley, USA Technical Program Chairman S.D. Senturia, MIT, USA Local Arrangements Co-Chair M. Judy, Analog Devices, USA Local Arrangements Co-Chair J.M. Giachino, University of Michigan, USA Finance Chairman A.P. Pisano, Univ. of California - Berkeley, USA Publication Chairman L. Spangler, Aspen Technologies, USA Short Course Chairman C.J. Kim, Univ. of California - L.A., USA Promotion Chairman R. Grace, Roger Grace Associates, USA Development Chairman K.K. Cline, PMMI, USA Conference Coordinator

Technical Program Committee

Roger T. Howe, Univ. of California - Berkeley, USA, Chairman

Regional Co-Chairman Thomas Kenny, Stanford University, USA Americas Region Kazuo Sato, University of Nagoya, JAPAN Asia/Oceania Region Gilles Delapierre, CEA-LETI, FRANCE Europe/Africa Region

Americas Program Committee T. Kenny Stanford University, USA, Chairman S. Arney Lucent Technologies, USA A. Ayón Sony Semiconductor, USA A. Berlin Intel Corporation, USA K. Böhringer University of Washington, USA R. Brennan Agilent Laboratories, USA V. Bright University of Colorado, USA M. DeBoer Sandia National Labs, USA D. DeVoe University of Maryland, USA A. Duwell C. S. Draper Laboratory, USA B. Frazier Georgia Technical University, USA J. Gilbert Coventor, USA C.J. Kim University of California - Los Angeles, USA D. Liepmann University of California - Berkeley, USA A. Lal Cornell University, USA G. Lin University of California - Irvine, USA L. Lin University of California - Berkeley, USA R. Maboudian University of California - Berkeley, USA K. Markus Cronos/JDS Uniphase, USA K. Turner University of California - Santa Barbara, USA D. Wilson University of Washington, USA

Asia / Oceania Program Committee K. Sato University of Nagoya JAPAN, Chairman P.-Z. Chang National Taiwan University, TAIWAN Y. Cheng Tsinghua University, P.R. CHINA K. Chun Seoul National University, KOREA K. Hane Tohoku University, JAPAN M. Ishida Toyohashi University of Technology, JAPAN Y.-K. Kim Seoul National University, KOREA S. Konishi Ritsumeikan University, JAPAN D.-D. Lee Kyongbook University, KOREA K. Maenaka Himeji Institute of Technology, JAPAN T. Nakamoto Tokyo Institute of Technology, JAPAN O. Oshiro AIST, JAPAN

19 Transducers ’03 CONFERENCE ORGANIZERS and COMMITTEE MEMBERS continued

R. Sawada NTT Applied Electronics Laboratory, JAPAN S. Shoji Waseda University, JAPAN K. Toko Kyushu University, JAPAN W.-Y. Wang Shanghai Inst. Metallurgy, P.R. CHINA M. Washizu Kyoto University, JAPAN M. Wong Hong Kong Univ. of Science & Technology, HONG KONG E. Yoon KAIST, KOREA Europe / Africa Program Committee G. Delapierre CEA-LETI, FRANCE, Chairman T. Akin Middle East Technical University, TURKEY A. D’Amico University of Tor Vergata-Roma, ITALY N. De Rooij University of Neuchâtel, SWITZERLAND P. French Delft University of Technology, THE NETHERLANDS R.S. Jachowicz Warsaw University of Technology, POLAND N. Jaffrezic-Renault Ecole Centrale de Lyon, FRANCE H. Jakobsen Sensonor, NORWAY A. Manz Imperial College, UNITED KINGDOM J. Ramon Morante University of Barcelona, SPAIN R. Puers Katholieke Universiteit Leuven, BELGIUM P. Ripka Czech Technical University, CZECH REPUBLIC H. Sandmaier HSG-IMIT, GERMANY H. Seidel Conti Temic microelectronic GmbH, GERMANY G. Stemme Royal Institute of Technology, SWEDEN J. Suski Schlumberger, FRANCE A. Van den Berg University of Twente, THE NETHERLANDS B. Vigna STMicroelectronics, ITALY Y.G. Vlasov St. Petersburg State University, RUSSIA G. Wachutka Technical University of Munich, GERMANY

International Steering Committee

G.B. Hocker Honeywell Laboratories, USA, Chairman E. Obermeier Berlin Univ. of Technology, GERMANY, Vice-Chairman European Members H. Baltes ETH Zurich, SWITZERLAND J. Brignell University of Southampton, UK G. Delapierre LETI, FRANCE J.R. Morante University of Barcelona, SPAIN P. Ohlckers University of Oslo, NORWAY J.-A. Schweitz Uppsala University, SWEDEN H. Seidel TEMIC, GERMANY A. van den Berg University of Twente, THE NETHERLANDS

North American Members D.J. Harrison University of Alberta, CANADA G.B. Hocker Honeywell Laboratories, USA R.T. Howe University of California - Berkeley, USA K. Najafi University of Michigan, USA K. Petersen Cepheid, USA A.J. Ricco ACLARA Biosciences, USA M.A. Schmidt Massasuchsets Institute of Technology, USA

Asian Members S. Ando University of Tokyo, JAPAN M. Bao Fudan University, CHINA M. Esashi Tohoku University, JAPAN H. Fujita University of Tokyo, JAPAN T. Moriizumi Tokyo Institute of Technology, JAPAN B.-K. Sohn Kyungpook National University, KOREA C.-Y. Wu Industrial Technology Research Institute, TAIWAN, ROC

Transducers ’03 20 CONTRIBUTORS and EXHIBITORS

We gratefully acknowledge, at the time of printing this brochure, the financial contributors to the conference from the following: Contributors

Please see the web-site (http://www.transducers03.org) for more detailed information on each contributor.

Media Partners

Exhibitors

• Alcatel Micro Machining Systems • Berkeley Sensor & Actuator Center • Center for Wireless Integrated MicroSystems (WIMS) an NSF Engineering Research Center at the University of Michigan • Conferences and Technical Digests / Preferred Meeting Management, Inc. • Corning IntelliSense Corporation • EV Group, Inc. • Heidelberg Instruments • IEEE Sensors Council • Institute of Physics Publishing • Kluwer Academic Publishing • MANCEF • MEMS Industry Group • microFAB Bremen GmbH • mstnews magazine of VDI/VDE - Technologezentrum Informationstechnik GmbH • NASA Technical Briefs • Polytec PI, Inc. - Nano Positioning Group • Polytec PI, Inc. - Vibrometer • Protron Mikrotechnik GmbH • Sensors and Actuators - Elsevier • Silicon Microstructures, Inc. (SMI) • Sony Semiconductor San Antonio • SRI International • SUSS MicroTec • Tronic’s microsystems • Veeco Metrology Group • Xactix, Inc.

The Transducers’03 Conference exhibit area will provide your company or organization with the opportunity to inform and display your latest products, services, equipment, books, journals and publications to the 1000+ professionals from around the world. Please visit the web-site for further information on exhibiting at this conference.

21 Transducers ’03 TECHNICAL PROGRAM INFORMATION

The technical program consists of two plenary sessions, four parallel oral sessions of contributed papers, and two poster sessions. All oral sessions will be held on the fourth floor of the Boston Marriott Copley Place. Session and paper titles are included in this brochure.

Plenary Sessions The plenary sessions will be held on Monday morning, June 9th at 8:30 a.m.

Parallel Oral Sessions There will be four parallel oral sessions each day.

Poster Session Two poster sessions will be held in the University of Massachusetts Exhibit Hall from 3:10 p.m. to 5:30 p.m. on Tuesday, June 10th and Wednesday, June 11th. Authors will be available for questions during these times. Posters will be on display from Monday at 10:10 a.m. through Wednesday at 5:30 p.m. All poster papers are listed in this program with their number and the day that they are on display.

Guide to Understanding Paper/Session Numbering Each session and paper in the technical program is assigned a unique number which clearly indicates when and where the paper is presented. The number of each paper is shown on the top left-hand side, before the title, in the Advance Program. A typical number is shown below

Typical Paper Number: 2B3.4

The first number (i.e., 2) indicates the day of the conference: 1=Monday 2=Tuesday 3=Wednesday 4=Thursday

The second letter (i.e., B) shows the location of the paper which is one of the four session rooms (A, B, C,or D). A=Salon E B=Salon F C=Salon G D=Salon H-K

The third number for sessions (i.e., 3) shows the session number of the day (1=early morning, 2=mid morning, 3=early afternoon and 4=late afternoon). The third number for posters (i.e., 131) is their program order.

The number after the point (.) shows the number of the paper in the session in sequence starting at 1.

Finally, if the paper is a poster, the letter P appears at the end of the paper number.

Technical Digest and CD-ROM An extended abstract of each paper presented at the Conference will be published in a Technical Digest and on a CD-ROM, which will be distributed to participants at the Conference. One copy of the Digest and the CD-ROM is included in the registration fee. Additional copies may be ordered at the time of registration, or purchased at the Conference. Purchase price of the Technical Digest will increase after the conference. Be sure to order your additional copies in advance.

Transducers ’03 22 ADVANCE PROGRAM

SATURDAY June 7, 2003

1:00 p.m. - 5:00 p.m. Conference and Short Course Registration

SUNDAY June 8, 2003

7:00 a.m. - 9:30 a.m. Short Course Registration 9:00 a.m. - 5:00 p.m. Short Courses 4:00 p.m. - 8:30 p.m. Conference Registration 6:00 p.m. - 8:30 p.m. Welcome Reception

MONDAY June 9, 2003

7:00 a.m. - 5:30 p.m. Registration 8:30 a.m. - 9:00 a.m. Opening Ceremony

9:00 a.m. - 9:35 a.m. Plenary 1A1.1 Lateral Thinking: The Challenge of Microsystems Bruno Murari, STMicroelectronics, ITALY

9:35 a.m. - 10:10 a.m. Plenary 1A1.2 Molecule Cascades: Nanometer-Scale Molecular Architectures that Compute Donald Eigler, IBM Almaden Research Center, USA

10:10 a.m. - 10:50 a.m. Break and Exhibit Inspection

10:50 a.m. - 11:25 a.m. Plenary 1A2.1 Single Molecule Nano-Bioscience Toshio Yanagida, Osaka University, JAPAN

11:25 a.m. - 12:00 p.m. Plenary 1A2.2 Perspective on MEMS Past and Future, The Tortuous Pathway from Bright Ideas to Real Products Stephen D. Senturia, Massachusetts Institute of Technology, USA

12:00 p.m. - 1:30 p.m. Lunch Break and Exhibit Inspection

Salon E Salon F Salon G Salon H-K

Fluidic On-Chip Chemical Accelerometers Manipulation Power Sensors Systems 1:30 PM - 1:50 PM 1A3.1 1B3.1 1C3.1 1D3.1 Dispensing Well Nanopower Betavoltaic Electrochemical Micro Micromechanical Plate (DWP): A Highly Microbatteries Analysis System for Triaxial Acceleration Integrated Nanoliter H. Guo and A. Lal Heavy Metal Ions Sensor for Automotive Dispensing System Cornell University, USA H. Suzuki1, S. Nagaoka1 Applications P. Koltay1, R. Steger1, and M. Loughran2 R. Reichenbach1, S. Taoufik1, B. Bohl1, 1University of Tsukuba, D. Schubert1, and H. Sandmaier2, JAPAN, and 2National G. Gerlach2 and R. Zengerle1 Institute of Advanced 1Robert Bosch GmbH, 1University of Freiburg, Industrial Science and GERMANY and GERMANY and Technology, JAPAN 2Technical University of 2HSG-IMIT, GERMANY Dresden, GERMANY

1:50 PM - 2:10 PM 1A3.2 1B3.2 1C3.2 1D3.2 An AC Electroosmotic Micro Combustion- Mercury Droplet A Monolithic Three- Processor for Thermionic Power Microelectrode Sensor Axis Silicon Capacitive Biomolecules Generation: Feasibility, on Lab-on-a-Chip for Accelerometer With P.K. Wong1, C.-Y. Chen2, Design, and Initial Heavy Metal Ion Micro-g Resolution J.T.-H. Wang3, Results Detection J. Chae, H. Kulah, and and C.-M. Ho1 C. Zhang, K. Najafi, X. Zhu, C. Gao, K. Najafi 1University of California L.P. Bernal, and J.-W. Choi, P.L. Bishop, University of Michigan, Los Angeles, USA, P.D. Washabaugh and C.H. Ahn USA 2GeneFluidics Inc., USA, University of Michigan, University of Cincinnati, and 3Johns Hopkins USA USA University, USA

23 Transducers ’03 ADVANCE PROGRAM continued

Salon E Salon F Salon G Salon H-K

Fluidic On-Chip Chemical Accelerometers Manipulation Power Sensors Systems 2:10 PM - 2:30 PM 1A3.3 1B3.3 1C3.3 1D3.3 Temperature Gradient Micromachined CMOS Field Effect Transistor Inertial Transducer Gel Electrophoresis in Thermoelectric Type CO2 Sensor Design for an Integrated Generators as On-Chip Attached With Metal Manufacturability and Polycarbonate Power Supply Carbonate Auxiliary Performance at Microsystem M. Strasser1,R.Aigner1, Phase Motorola C.A. Kimball, J.S. Buch, C. Lauterbach1, K. Shimanoe, K. Goto, J. Hammond, D.L. DeVoe, and C. Lee T.F. Sturm1, K. Obata, S. Nakata, A. McNeil, D. Koury, University of Maryland, M. Franosch1, G. Sakai, and R. August USA and G. Wachutka2 and N. Yamazoe Motorola Sensor 1Infineon Technologies Kyushu University, Products, USA AG, GERMANY and JAPAN 2Munich University of Technology, GERMANY 2:30 PM - 2:50 PM 1A3.4 1B3.4 1C3.4 1D3.4 Controlled Fission of Integrated 5.7 GHz The Chemoreceptive A Piezoresistive Droplet Emulsions in Chip-Size Antenna for Neuron MOS Accelerometer With Bifurcating Microfluidic Wireless Sensor Transistors (CvMOS): Axially Stressed Tiny Devices Networks A Novel Floating-Gate Beams for Both Much Y.C. Tan, J. Collins, P.M. Mendes1, Device for Molecular Increased Sensitivity and A. Lee A. Polyakov2,M.Bartek2, and Chemical Sensing and Much Broadened University of California J.N. Burghartz2, N.Y. Shen, Z. Liu, Frequency Bandwidth Irvine, USA and J.H. Correia1 B.A. Minch, S.S. Huang, X.X. Li, 1University of Minho, and E.C. Kan Y.L.Wang,J.Jiao,X.Ge, PORTUGAL and 2Delft Cornell University, USA D. Lu, L. Che, K. Zhang, University of Technology, and B. Xiong THE NETHERLANDS Chinese Academy of Sciences, P.R. CHINA

2:50 PM - 3:10 PM 1A3.5 1B3.5 1C3.5 1D3.5 A Water Spectroscopy Radioisotape-Powered Dependence of Heat Noise Analysis and Microsystem With Cantilever for Vacuum Distribution in Micro Characterization of a Integrated Discharge Sensing With RF Hotplates on Heater Sigma-Delta Capacitive Source, Dispersion Transmission Geometry and Heating Silicon Optics, and Sample H. Li and A. Lal Mode Microaccelerometer Delivery Cornell University, USA M. Ehmann, H. Kulah, J. Chae, and L. Que, C.G. Wilson, T. Lindemann, P. Ruther, K. Najafi J.A.E. De La Rode, and O. Paul University of Michigan, and Y.B. Gianchandani University of Freiburg, USA University of Michigan, GERMANY USA

3:10 p.m. - 3:50 p.m. Break and Exhibit Inspection

In-Vivo Gas SensingMicrovalves Gyros Biosensors Systems & Pumps

3:50 PM - 4:10 PM 1A4.1 1B4.1 1C4.1 1D4.1 A Microneedle-Based Nanoscale Manipulation A Thermo-Pneumatic A Wide Dynamic Range Glucose Monitor: and Control of Tin In-Channel Microvalve Silicon-on-Insulator Fabricated on a Wafer- Oxide Nanostructures With PDMS Diaphragm MEMS Gyroscope With Level Using In-Device on Large Area Arrays of for Integrated Blood Digital Force Feedback Enzyme Immobilization Microhotplates Examination System M. Kranz1, P. Ruffin2, S. Zimmermann, B. Panchapakesan1, on Silicon S. Burgett2, T. Hudson2, D. Fienbork, B. Stoeber, D.L. DeVoe2, H. Takao1, P. Ashley2, M. Buncick3, A.W. Flounders, R.E. Cavicchi3, K. Miyamura2,H.Ebi2, and J. McKee1 and D. Liepmann and S. Semancik3 M. Ashiki1,K.Sawada1, 1Morgan Research, USA, University of California 1University of Delaware, and M. Ishida1 2U.S. Army Aviation Berkeley, USA USA, 2University of 1Toyohashi University of and Missile Command, Maryland, USA, and Technology, JAPAN and USA, and 3Aegis 3National Institute of 2HORIBA Ltd., JAPAN Technologies, USA Standards and Technology, USA

Transducers ’03 24 ADVANCE PROGRAM continued

Salon E Salon F Salon G Salon H-K

In-Vivo Gas SensingMicrovalves Gyros Biosensors Systems & Pumps

4:10 PM - 4:30 PM 1A4.2 1B4.2 1C4.2 1D4.2 Microfabricated Smart Single-Chip Low-Leakage Micro MEMS Gyroscope With Iridium Oxide CMOS Microhotplate Gate Valves Double Gimbal Reference Electrode for Array for Metal-Oxide- J.A. Frank Structure Continuous Glucose Based Gas Sensors and A.P. Pisano K. Maenaka1,N.Sawai1, Monitoring Sensor M. Graf, D. Barrettino, University of California S. Ioku1,H.Sugimoto2, H. Yang, S.K. Kang, P. Kaeser, J. Cerda, Berkeley, USA H. Suzuki3, T. Fujita1, D.-H. Shin, H. Kim, A. Hierlemann, and Y. Takayama1 and Y.T. Kim and H. Baltes 1Himeji Institute of Electronics and ETH Zurich, Technology, JAPAN, Telecommunications SWITZERLAND 2Dainichi Denshi Co. Research Institute Ltd., JAPAN, and (ETRI), SOUTH 3NASDA, JAPAN KOREA

4:30 PM - 4:50 PM 1A4.3 1B4.3 1C4.3 1D4.3 Low-Cost Microfilter for Evaluation of Carbon Fabrication and Cross-Coupling of the Red Blood Cell Nanotubes as Gas Characterization of Oscillation Modes of Membrane Stiffness Sensing Materials in Stop Flow Valves for Vibratory Gyroscopes Measurement Using Micro Gas Sensors Fluid Handling M. Braxmaier1, Photosensitive BCB S.I. Moon1,2,D.J.Lee1, G. Egidi, F. Herrera, A. Gaißer1, T. Link1, P. Turmezei, A. Polyakov, Y.T. Jang1, S.W. Kim2, G.C. Fiaccabrino, A. Schumacher1, J.R. Mollinger, Y.H. Lee2, and B.K. Ju1 and N.F. de Rooij I. Simon1,J.Frech1, M. Bartek, A. Bossche, 1Korea Institute of University of Neuchâtel, H. Sandmaier1,2, and J.N. Burghartz Science and Technology, SWITZERLAND and W. Lang1,3 Delft University of SOUTH KOREA, 2Korea 1HSG-IMIT, GERMANY, Technology, THE University, SOUTH 2University of Stuttgart, NETHERLANDS KOREA, and GERMANY, and 3IMSAS, 3Chungwoon University, Bremen, GERMANY SOUTH KOREA

4:50 PM - 5:10 PM 1A4.4 1B4.4 1C4.4 1D4.4 Calcium Measurement High Sensitivity Three- Silicon Electroosmotic An Integrated, Vertical- Method by Fluorescent Stage Microfabricated Micropumps for Drive, In-Plane-Sense Analyses Using a Glass Preconcentrator-Focuser Integrated Circuit Microgyroscope Micro Injector for Micro Gas Thermal Management S.A. Bhave1, J.I. Seeger1, S. Nagasawa Chromatography D.J. Laser1,A.M.Myers2, X. Jiang1, B.E. Boser1, and I. Shimoyama W.-C. Tian, H.K. Chan, S. Yao1, K.F. Bell1, R.T. Howe1, University of Tokyo, S.W. Pang, C.-J. Lu, K.E. Goodson1, and J. Yasaitis2 JAPAN and E.T. Zellers J.G. Santiago1, 1University of California University of Michigan, and T.W. Kenny1 Berkeley, USA and USA 1Stanford University, 2Analog Devices Inc., USA and 2Intel USA Corporation, USA

5:10 PM - 5:30 PM 1A4.5 1B4.5 1C4.5 1D4.5 A Remotely Adjustable Realization of a New Micro Capillary Force Mechanical Reliability Check-Valve Array With Sensor Concept: Fluidic Pressure of Epipoly-MEMS- an Electrochemical Improved CCFET and Source/Accumulator Structures Under Release Mechanism for SGFET Type Gas E.D. Hobbs Shock Load Implantable Biomedical Sensors in Hybrid and A.P. Pisano U. Wagner1, R. Müller- Microsystems Flip-Chip Technology University of California Fiedler1, J. Bagdahn1, T. Pan, W. Zheng, R. Pohle1,E.Simon1, Berkeley, USA B. Michel2, and O. Paul3 M. Lei, B. Cavanagh, M. Fleischer1, 1Robert Bosch GmbH, and B. Ziaie H. Meixner1, GERMANY, University of Minnesota, H.P. Frerichs2, 2Fraunhofer IZM, USA M. Lehmann2, GERMANY, and and H. Verhoeven2 3University of Freiburg, 1Siemens AG, GERMANY GERMANY and 2Micronas GmbH, GERMANY

6:30 p.m. - 9:30 p.m. Reception at the Museum of Fine Arts

25 Transducers ’03 ADVANCE PROGRAM continued

TUESDAY June 10, 2003

7:00 a.m. - 5:30 p.m. Registration

Salon E Salon F Salon G Salon H-K

Nanostructure Optical Genomics & DNA Audio & Ultrasound Fabrication I Microsystems Processing Technology

8:10 AM - 8:40 AM 2A1.1 - Invited Speaker 2B1.1 - Invited Speaker 2C1.1 - Invited Speaker 2D1.1 - Invited Speaker Technology for Nano- Integrated Optics: Nanopore Technology Arrayed Ultrasonic Structure Fabrication Overview of Glass for DNA Sequencing Sensor Chip: and Creation of New and Silicon D. Branton Ferroelectric Thin Film Industry M.S. Valette Harvard University, USA for Sensors S. Matsui CEA Grenoble, FRANCE M. Okuyama Himeji Institute of Osaka University, JAPAN Technology, JAPAN

8:40 AM - 9:00 AM 2A1.2 2B1.2 2C1.2 2D1.2 Nanomechanical Photolithography on Microfabricated DNA A Fully Integrated Structures With an Optical Fiber and Amplification Device CMOS-MEMS Audio Integrated Carbon Micro-Fabrication of Monolithically Microphone Nanotube Fiber-Optic Devices Integrated With J.J. Neumann, Jr. H. Miyashita, T. Ono, Controlling Evanescent Advanced Sample and K.J. Gabriel and M. Esashi Field Pre-Treatment Carnegie Mellon Tohoku University, K. Hane, J.-H. Song, J. El-Ali, I.R. Perch- University, USA JAPAN M. Sasaki, Y. Taguchi, Nielsen, C.R. Poulsen, and H. Shimoda M. Jensen, P. Telleman, Tohoku University, and A. Wolff JAPAN Technical University of Denmark, DENMARK

9:00 AM - 9:20 AM 2A1.3 2B1.3 2C1.3 2D1.3 Localized Synthesis of Strain-Tuning of An Ejection Microarray Fabrication of High- Silicon Nanowires Periodic Optical for In-Situ Quality PZT-Based O. Englander, Devices: Tunable Oligonucleotide Piezoelectric D. Christensen, Gratings and Photonic Synthesis On DNA Microphone M. Chiao, J. Kim, Crystals Chips H.-J. Zhao, T.-L. Ren, and L. Lin C.W. Wong, Y.B. Jeon, A.M. Gué, T. Phou, L.-T. Liu, and Z.-J. Li University of California G. Barbastathis, and D. Jugieu Tsinghua University, Berkeley, USA and S.-G. Kim LAAS-CNRS, FRANCE P.R. CHINA Massachusetts Institute of Technology, USA

9:20 AM - 9:40 AM 2A1.4 2B1.4 2C1.4 2D1.4 Uniform Patterned Tunable Microfluidic Potentiostatic Digital Sound Synthesis of Vertically- Dye Laser Deposition and Reconstruction Using Aligned Carbon B. Bilenberg, B. Helbo, Detection of DNA on Arrays of CMOS- Nanotubes on Low- J.P. Kutter, Conductive Nitrogen MEMS Microspeakers Stress Micromechanical and A. Kristensen Doped Diamond-Like B.M. Diamond, Structures Technical University of Carbon Film J.J. Neumann, W.H. Teh1, C.G. Smith1, Denmark, DENMARK A. Zeng1, V.D. Samper2, and K.J. Gabriel K.B.K. Teo1, S.N. Tan1, D.P. Poenar1, Carnegie Mellon R.G. Lacerda1, T.M. Lim3, University, USA G.A.J. Amaratunga1, and C.K. Heng3 W.I. Milne1, 1Nanyang Technological M. Castignolles2, 3, University, and A. Loiseau2, 3 SINGAPORE, 2Institute 1University of of Microelectronics, Cambridge, UK, SINGAPORE, and 2University of 3National University of Montpellier, FRANCE, Singapore, SINGAPORE and 3CNRS-ONERA, FRANCE

9:40 a.m. - 10:20 a.m. Break and Exhibit Inspection

Transducers ’03 26 ADVANCE PROGRAM continued

Salon E Salon F Salon G Salon H-K

Nanostructure Microrobotic Micro Analytical Magnetic and Fabrication II Actuators Systems Components Infrared Sensors

10:20 AM - 10:40 AM 2A2.1 2B2.1 2C2.1 2D2.1 Scanning Probe Two-DOF Robot Leg Micro Impedance Low Noise CMOS Nanolithography Using Operation and Tomography for Micro-Fluxgate Self-Assembled Reversible Inchworm Biophysical Magnetometer Monolayer for Motors Characterization of P.M. Drljaca, P. Kejik, Fabrication of Single S. Hollar, S. Bergbreiter, Thin Film Biomaterials F. Vincent, Electron Transistors and K.S.J. Pister P. Linderholm, and R.S. Popovic Y. Isono 1, University of California R. Schoch, Swiss Federal Institute K. Shimamoto1, Berkeley, USA and P. Renaud of Technology G. Hashiguchi2, Swiss Federal Institute Lausanne, Y. Mihara 2,H.Mimura3, of Technology, SWITZERLAND T. Hiramoto4, SWITZERLAND and H. Fujita4 1Ritsumeikan University, JAPAN, 2Kagawa University, JAPAN, 3Tohoku University, JAPAN, and 4University of Tokyo, JAPAN

10:40 AM - 11:00 AM 2A2.2 2B2.2 2C2.2 2D2.2 A Novel Protruding Integrated Micro Surface Magnetic Flux Micromachining Microgripper With Chamber for Living Cell Imager Using CMOS Process for the Force Amplification and Analysis With Negligible Three-Phase Lock-in Fabrication of Parallel Jaw Motion for Dead Volume Sample Camera Monocrystalline In-Situ Sample Injector S. Ando Si-Membranes Using Manipulation in SEM M. Kanai1,2,H.Abe1, University of Tokyo, Porous Silicon and FIB-Machines T. Munaka1, JAPAN S. Armbruster1, G.J.M. Krijnen1, Y. Fujiyama1, D. Uchida2, F. Schäfer1,G.Lammel1, R. Haanstra1,E.Potters2, A. Yamayoshi3, H. Artmann1, J.W. Berenschot1, H. Nakanishi1, C. Schelling1,H.Benzel1, S. von Harrach3, A. Murakami3, S. Finkbeiner1, and M. Elwenspoek1 and S. Shoji2 F. Lärmer1,P.Ruther2, 1University of Twente, 1Shimadzu Corporation, and O. Paul2 THE NETHERLANDS, JAPAN, 2Waseda 1Robert Bosch GmbH, 2Philips Centre for University, JAPAN, and GERMANY and Industrial Technology, 3Kyoto Institute of 2University of Freiburg, THE NETHERLANDS, Technology, JAPAN GERMANY and 3FEI Electron Optics, THE NETHERLANDS

11:00 AM - 11:20 AM 2A2.3 2B2.3 2C2.3 2D2.3 A Simple, Robust and An Electrostatic 2- Planar Coil-Based A High Performance Controllable Nano- Dimensional Micro- Microsystem for the Single-Chip Uncooled Structures Fabrication Gripper for Nano Long-Range Transport a-Si TFT Infrared Technique Using Structure of Magnetic Bead Sensor Standard Silicon Wafers M. Mita, H. Kawara, A. Rida, V. Fernandez, L. Dong, R.F. Yue, A. Tixier-Mita, Y. Mita, H. Toshiyoshi, M. Ataka, and M.A.M. Gijs and L.T. Liu and H. Fujita and H. Fujita Swiss Federal Institute of Tsinghua University, University of Tokyo, University of Tokyo, Technology - Lausanne, CHINA JAPAN JAPAN SWITZERLAND

11:20 AM - 11:40 AM 2A2.4 2B2.4 2C2.4 2D2.4 Silicon Carbide Micro-Finger First Particle A Low-Cost 64x64 Microfabrication by Articulation by Measurements with Uncooled Infrared an Integrated Coulter Silicon Lost Molding for Pneumatic Parylene Counter Based on Detector Array in Glass Press Molds Balloons 2-Dimensional Standard CMOS T. Itoh1, S. Tanaka1, Y.W. Lu and C.J. Kim Aperture Control S. Eminoglu, J.F. Li2, R. Watanabe1, University of California J.H. Nieuwenhuis1, M.Y. Tanrikulu, 1 2 1 Los Angeles, USA F. Kohl , J. Bastemeijer , and T. Akin and M. Esashi and M.J. Vellekoop1 1Tohoku University, 1Vienna University of Middle East Technical JAPAN and 2Tsinghua Technology, AUSTRIA University, TURKEY 2 University, CHINA and Delft University of Technology, THE NETHERLANDS

27 Transducers ’03 ADVANCE PROGRAM continued

Salon E Salon F Salon G Salon H-K

Nanostructure Microrobotic Micro Analytical Magnetic and Fabrication II Actuators Systems Components Infrared Sensors

11:40 AM - 12:00 PM 2A2.5 2B2.5 2C2.5 2D2.5 A Novel Micromachining Micro Gripper Driven A Microfluidic System A Low-Cost CMOS Technology for by SDAs Coupled to an for the Measurement of Compatible Serpentine- Structuring Borosilicate Amplification Chemical Structured Polysilicon- Glass Substrates Mechanism Concentration and Based Microbolometer P. Merz 1, H.J. Quenzer1, O. Millet1, Density Array B. Wagner1,H.Bernt1, P. Bernardoni2, D. Sparks, R. Smith, E. Socher, Y. Sinai, and M. Zoberbier2 S. Regnier3, P. Bidaud3, M.Straayer,J.Cripe, and Y. Nemirovsky 1Fraunhofer Institute D. Collard1, R. Schneider, Technion-Israel Institute for Silicon Technology, and L. Buchaillot1 S.M. Ansari, of Technology, ISRAEL GERMANY and 2SUSS 1IEMN, FRANCE, and N. Najafi MicroTec, GERMANY 2Laboratoire de Integrated Sensing Robotique de Paris, Systems Inc. (ISSYS), FRANCE, and USA 3CEA-LIST, FRANCE

12:00 p.m. - 1:30 p.m. Lunch Break and Exhibit Inspection

Micro Resonator Large Droplet Fluid Damping Displacement Dispensing Sensing Actuators Systems 1:30 PM - 1:50 PM 2A3.1 2B3.1 2C3.1 2D3.1 Thermoelastic Damping A High Performance Droplet Release in a A Micromachined in High Aspect-Ratio Dipole Surface Drive for Highly Parallel, Pressure Kelvin Probe for Trench-Refilled Large Travel and Force Driven Nanoliter Surface Potential Polysilicon Resonators S. Hoen1,Q.Bai1, Dispenser Measurements in R. Abdolvand, G.K. Ho, J.A. Harley1, O. Gutmann1, Microfluidic Channels F. Ayazi, and A. Erbil D.A. Horsley2, F. Matta1, R. Niekrawietz1, and Solid-State Georgia Institute of T.B. Verhoeven1, C.P. Steinert1, Applications Technology, USA J. Williams1, M. Daub1,B.de Heij1, L.L. Chu1, K. Takahata1, and K.R. Williams1 H. Sandmaier2, P. Selvaganapathy1, 1Agilent Laboratories, S. Messner2, J.L. Shohet2, USA and 2Onix and R. Zengerle1 and Y.B. Gianchandani1 Microsystems, USA 1University of Freiburg, 1University of Michigan, GERMANY and USA an 2University of 2HSG-IMIT, GERMANY Wisconsin, USA

1:50 PM - 2:10 PM 2A3.2 2B3.2 2C3.2 2D3.2 Fabrication of Heavily Electrothermally-Driven Micro-Jet Nozzle Array Surface Micromachined Boron Doped Long Stretch Micro for Precise Droplet and Integrated Mechanical Resonators Drive With Monolithic Metering and Steering Capacitive Sensors for K. Kakushima1, Cascaded Actuation Having Increased Microfluidic T. Noguchi2, Units in Compact Droplet Deflection Applications M. Nagashio3,T.Sarnet2, Arrangement C.N. Anagnostopoulos, J. Shih, J. Xie, G. Kerrien2, C.P. Hsu, T.S. Liao, J.M. Chwalek, and Y.C. Tai J. Boulmer2,D.Debarre2, and W. Hsu C.N. Delametter, California Institute of T. Bourouina4, National Chiao Tung G.A. Hawkins, Technology, USA H. Kawakatsu1, University, TAIWAN D.L. Jeanmaire, J.A. Lebens, A.G. Lopez, and H. Fujita1 and D.P. Trauernicht 1University of Tokyo, Eastman Kodak JAPAN, 2Institut Company, USA d'Electronique Fondamentale, FRANCE, 3Tokyo Denki University, JAPAN, and 4Ecole Superieure d'Ingenieurs en Electrotechnique et Electronique, FRANCE

Transducers ’03 28 ADVANCE PROGRAM continued

Salon E Salon F Salon G Salon H-K

Micro Resonator Large Droplet Fluid Damping Displacement Dispensing Sensing Actuators Systems 2:10 PM - 2:30 PM 2A3.3 2B3.3 2C3.3 2D3.3 Investigation of Energy A Large-Travel Vertical A Modular High In-Channel Loss Mechanisms in Planar Actuator With Density Multi-Channel Micromechanical Plate Micromechanical Improved Stability Dispenser for Micro- for the Measurement of Resonators E.R. Deutsch1, Array Printing Viscosity R.N. Candler1,H.Li1, J.P. Bardhan2, A. Kuoni, M. Boillat, D.A. Czaplewski1, M. Lutz2,W.-T.Park1, S.D. Senturia1,2, and N.F. de Rooij B. Ilic1, A. Partridge2,G.Yama2, G.B. Hocker3, University of Neuchâtel, M. Zalalutdinov1, and T.W. Kenny1 D.W. Youngner3, SWITZERLAND W.L. Olbricht1, 1Stanford University, M.B. Sinclair4, A.T. Zehnder1, USA and 2Robert Bosch and M.A. Butler1 H.G. Craighead1, Corporation, USA 1Polychromix Inc., USA, and T.A. Michalske2 2Massachusetts Institute 1Cornell University, USA of Technology, USA, and 2Sandia National 3Honeywell Laboratories, Labs, USA USA, and 4Sandia National Laboratories, USA

2:30 PM - 2:50 PM 2A3.4 2B3.4 2C3.4 2D3.4 Crystallographic Electrostaic Actuator An Improved 24 Fabrication of a Micro- Influence on With Long Range of Channel Picoliter Riblet Film and Drag Nanomechanics of Translation Dispenser Based On Reduction Effects on Ultra-Thin Silicon M.V. Shutov, Direct Liquid Curved Objects Resonators D.L. Howard, Displacement M. Han, J.-K. Huh, D.F. Wang, T. Ono, R.L. Smith, C.P. Steinert1,I.Goutier1, H.C. Lim, S.S. Lee, and M. Esashi and S.D. Collins B. de Heij1, and S.-J. Lee Tohoku University, University of California O. Gutmann1, M. Daub1, Pohang University of JAPAN Davis, USA H. Sandmaier2, Science and Technology, S. Messner2, SOUTH KOREA and R. Zengerle1 1University of Freiburg, GERMANY and 2HSG-IMIT, GERMANY

2:50 PM - 3:10 PM 2A3.5 - Late News 2B3.5 2C3.5 2D3.5 Low-Loss RF MEMS Pull-In Suppression and Firing Frequency A Single Crystal SiC Metal-to-Metal Contact Torque Magnification in Improvement of Back Plug-and-Play High Switch With CSP Parallel Plate Shooting Inkjet Temperature Drag Structure Electrostatic Actuators Printhead by Thermal Force Transducer S. Tomonori, S. Shobu, With Side Electrodes Management R.S. Okojie1, M. Takahiro, K. Isamu, T.D. Kudrle1, S.J. Shin1,K.Kuk1, G.C. Fralick1,G.J.Saad1, and I. Koichi G.M. Shedd2, J.W. Shin1, C.S. Lee1, C.A. Blaha2, OMRON Corporation, C.C. Wang1, J.C. Hsiao1, Y.S. Oh1, and S.O. Park2 J.J. Adamczyk1, JAPAN M.G. Bancu1, 1Samsung Advanced and J.M. Feiereisen3 G.A. Kirkos1, N. Yazdi1, Institute of Technology, 1NASA Glenn Research 2A3.6 - Late News M. Waelti3, H.S. Sane1, SOUTH KOREA and Center, USA, 2Akima Free-Free Beam Silicon and C.H. Mastrangelo1 2Korea Advanced Corporation, USA, and Carbide 1Corning Intellisense Institute of Science and 3Pratt Whitney, USA Nanomechanical Corporation, USA, Technology (KAIST), Resonators 2Corning Incorporated, SOUTH KOREA X.M.H. Huang1, USA, and 3Phonak AG, M.K. Prakash1, SWITZERLAND C.A. Zorman2, M. Mehregany2, and M.L. Roukes1 1California Institute of Technology, USA and 2Case Western Reserve University, USA

29 Transducers ’03 ADVANCE PROGRAM continued

3:10 p.m. - 5:30 p.m. Tuesday Poster Session and Refreshments

Device and Materials Characterization 2E1.P 2E2.P 2E3.P 2E4.P Microslip Plays an Micro-Spring Force The Thermal Sensing Mechanisms of Important Role in Characterization and Characteristics of High Temperature MEMS Friction Applications in Contacts in MEMS Silicon Carbide Field- Characteristics Integrated Circuit Switches Effect Devices D.L. Luck1, Packaging and Scanning X.Yan1,N.E.McGruer1, P. Tobias, R.N. Ghosh, M.P. de Boer1, Probe MEMS S. Majumder2, and B. Golding W.R. Ashurst2, Metrology G.G. Adams1, Michigan State and M.S. Baker1 E.M. Chow, and L. Chen1 University, USA 1Sandia National T. Hantschel, K. Klein, 1Northeastern Laboratories, USA and D.K. Fork, University, USA and 2University of California K. Van Schuylenbergh, 2Radant Technologies, Berkeley, USA L. Wong, and C.L. Chua USA Palo Alto Research Center, USA

2E5.P 2E6.P 2E7.P 2E8.P Confocal Optoelectronic Characterization of A Testing Procedure Symmetry Transitions Holography Microscope Out-of-Plane High at Wafer Level for of Compressively for Structural Frequency Microelectrodes Prestressed Long Characterization and Microresonators by Using a Gel Membranes under Optimization of MEMS AFM M.G. Kindlundh and Pressure C. Furlong, A.M. Siegel, S. Ryder, K.B. Lee, P.H. Norlin T. Kramer and O. Paul P. Heft i, X. Meng, and L. Lin Acreo AB, SWEDEN University of Freiburg, and R.J. Pryputniewicz University of California GERMANY Worcester Polytechnic Berkeley, USA Institute, USA

2E9.P 2E10.P 2E11.P 2E12.P Reliability of Packaging Test Chip for A Method for A Precision SOI-CMOS Micromachined Flip-Chip and Wire Measuring the Fracture Front-End Amplifier for Membranes under Bonding Process Toughness of Smart Microsensors Particle Impact Characterization Micrometer-Sized Single Applicable to Severe U. Wagner1, J. Schwizer1, W.H. Song1, Crystal Silicon by Operation Environment W. Bernhard1, M. Mayer2,O.Brand3, Tensile Test With Large R. Müller-Fiedler1, and H. Baltes1 X.P. Li1, T. Kasai1, Temperature Variation B. Michel2, and O. Paul3 1ETH Zurich, S. Nakao1,T.Ando1, H. Takao, F. Ina, 1Robert Bosch GmbH, SWITZERLAND, 2ESEC M. Shikida1,K.Sato1, T. Douzaka, K. Sawada, GERMANY, 2Fraunhofer Cham, SWITZERLAND, and H. Tanaka2 and M. Ishida Institute IZM, and 3Georgia Institute 1Nagoya University, Toyohashi University of GERMANY, and of Technology, USA JAPAN and 2DENSO Technology, JAPAN 3University of Freiburg, Corporation, JAPAN GERMANY

2E13.P 2E14.P 2E15.P A Reliable Test Key for Elevated Temperature A Test Chip and Step- Thin Film Mechanical Tensile/Creep Test of by-Step Procedure for Property UV-LIGA Nickel Thin MEMS Material Characterization Film for Design of Property Determination H.-C. Tsai, W. Fang, High-Density Micro Using Micromachined J.M.-L .Tsai, Connector Structures and H.-C. Chang Y. Isono, J. Tada, C.H. Pan National Tsing Hua T. Watanabe, T. Unno, National Chin-Yi University, TAIWAN S. Sugiyama, Institute of Technology, and T. Toriyama TAIWAN, ROC Ritsumeikan University, JAPAN

Transducers ’03 30 ADVANCE PROGRAM continued

Droplet Generators 2E16.P 2E17.P 2E18.P 2E19.P Mercury Droplet Pico Liter Droplet T-Jet: A Novel Thermal A Thermal Droplet Microswitch for Manipulation Based on Inkjet Head With Generator With Re-Configurable a Novel Continuous Monolithically Monolithic Circuit Interconnect Opto-Electrowetting Fabricated Nozzle Plate Photopolymer Nozzle W. Shen1, R.T. Edwards2, Mechanism on SOI Wafer Plate and C.-J. Kim1 P.Y. Chiou, Z. Chang, S.S. Baek, H.T. Lim, Y.J. Chuang, F.G. Tseng, 1University of California and M.C. Wu H. Song, Y.S. Kim, and W.K. Lin Los Angeles, USA and University of California K.D. Bae, J.H. Cho, National Tsing Hua 2Johns Hopkins Los Angeles, USA C.S. Lee, J.W. Shin, University, TAIWAN University, USA S.J. Shin, K. Kuk, ROC and Y.S. Oh Samsung Advanced Institute of Technology, SOUTH KOREA

Electrostatic Actuators 2E20.P 2E21.P 2E22.P 2E23.P Low Pull-In Negative Capacitance A Novel Electrostatic High Power Electrostatic Curved for Control of Gap- Actuator for Micro Electrostatic Motor and Electrode Actuators Closing Electrostatic Deformable Mirrors: Generator Using Using Deep Reactive Actuators Fabrication and Test Electrets Ion Etching J.I. Seeger and B.E. Boser C. Divoux1,J.Charton2, T. Genda, S. Tanaka, J. Li1, M.P. Brenner2, University of California W. Schwartz1, and M. Esashi J.H. Lang1, Berkeley, USA E. Stadler2, J. Margail1, Tohoku University, A.H. Slocum1, L. Jocou2, T. Enot1, JAPAN and R. Struempler3 J.C. Barbe1, 1Massachusetts Institute and J. Chiaroni1 of Technology, USA, 1Commissariat l'Energie 2Harvard University, Atomique de Grenoble, USA, and 3ABB FRANCE and 2LAOG, Corporate Research, FRANCE SWITZERLAND

Force and Mass Sensors 2E24.P 2E25.P 2E26.P 2E27.P Nanocantilever Based Diamond AFM Probe A MEMS-Based High Sensitive, Mass Sensor Integrated With Piezoelectric Microsensor to Measure Miniaturized Plano- With CMOS Circuitry Sensor and Actuator All Six Componenents Convex Quartz Crystal Z.J. Davis1, G. Abadal2, T. Shibata1,K.Unno2, of Force and Moment Microbalance E. Forsén1,O.Hansen1, and E. Makino3 on a Near-Wall Particle Fabricated by Reactive F. Campabadal3, 1Ibaraki University, in Turbulent Flow Ion Etching and Melting E. Figueras3,J.Esteve3, JAPAN, 2Hokkaido D.V. Dao, A.T. Nguyen, Photoresist J. Verd3, F. Pérez- University, JAPAN, and T. Toriyama, J.C. Wells, L. Li1,T.Abe1,2, Murano3,X.Borrisé3, 3Hirosaki University, and S. Sugiyama and M. Esashi1 S.G. Nilsson4, JAPAN Ritsumeikan University, 1Tohoku University, JAPAN 2 I. Maximov4, JAPAN and PRESTO, L. Montelius4, JST, JAPAN N. Barniol2, and A. Boisen1 1Technical University of Denmark, DENMARK, 2Universitat Autònoma Barcelona, SPAIN, 3Institut de Microelectrònica Barcelona, SPAIN, and 4University of Lund, SWEDEN

2E28.P Development of the Smart Board Using Metal Core Piezoelectric Fiber H. Sato, Y. Shimojo, and T. Sekiya AIST, JAPAN

31 Transducers ’03 ADVANCE PROGRAM continued

Gas Sensors 2E29.P 2E30.P 2E31.P 2E32.P Limiting Current Type The Fabrication of Effect of Silicon-Carbide Oxygen Sensor With Novel Micro Hot-Wire Microstructure on Schottky Diodes With Graded-Composition Sensor Detection of Dilute Sputtered and Laser- 1 1 Layer Electrodes K.D. Song , B.S. Joo , NO2 Using WO3 Thin Ablated Thin-Pt Gate as T. Suzuki1,M.Iio1, N.J. Choi1, Y.S. Lee1, Film Sensors NO Gas Sensors in T. Okuno1,K.Ogino1, J.S. Huh1, B.G. Sohn2, J. Tamaki, A. Hayashi, High Temperature Y. Ishiguro1,M.Kondo1, and D.-D. Lee1 Y. Yamamoto, S.A. Khan1,G.Wei1, H.Takahashi1, T. Inaba2, 1Kyungpook National and M. Matsuoka E.A. de Vasconcelos2, H. Kondo2, and K. Saji2 University, SOUTH Ritsumeikan University, H. Uchida1, 1Yazaki Meter Co., Ltd., KOREA and 2Taegu Arts JAPAN and T. Katsube1 JAPAN and 2Toyota University, SOUTH 1Saitama University, Central Research & KOREA JAPAN and Development Labs., Inc., 2Universidade Federal de JAPAN Pernambuco, BRAZIL

2E33.P 2E34.P 2E35.P 2E36.P Thin Film Micro Development of a New Molecular Orbital Sensor-Based Air- Carbon Dioxide Sensor Preparation Method of Calculation of Surface Pollution Measurement Using MEMS Process Thermally Stable Reaction of SnO2 Gas System for Y.I. Bang1,K.D.Song1, Mesoporous Titania and Sensors for Aminic and Environmental Y.S. Lee1, N.J. Choi1, Its Application to Gas Carboxylic Smells Monitoring Network B.S. Joo1,J.C.Bae1, Sensors A. Fujimoto1, W. Tsujita, S. Kaneko, J.S. Huh1, S.D. Choi2, Y. Shimizu1,C.Yu2, T. Kanayama2, T. Ueda, H. Ishida, and D.D. Lee1 T. Hyodo1, and M. Okuyama2 and T. Moriizumi 1Kyungpook National and M. Egashira1 1Wakayama National Tokyo Institute of University, SOUTH 1Nagasaki University, College of Technology, Technology, JAPAN KOREA and 2Yeungnam JAPAN and 2Dalian JAPAN and 2Osaka University, SOUTH Institute of Chemical University, JAPAN KOREA Physics, CHINA

Micro Grippers 2E37.P 2E38.P 2E39.P Electrostatic Actuator Fabrication of an MEMS-Fabricated ICPF Integrated Optical Near- Electrothermally Grippers for Aqueous Field Probe With Bow- Actuated Electrostatic Applications Tie Antenna for High Microgripper W. Zhou and W.J. Li Transmission Efficiency S.H. Lee1, K.-C. Lee1, Chinese University of K. Iwami1,T.Ono1, S.S. Lee1, and H.-S. Oh2 Hong Kong, CHINA E. Oesterschulze2, 1Pohang University of and M. Esashi1 Science and Technology, 1Tohoku University, SOUTH KOREA and JAPAN and 2University 2LG Production of Kassel, GERMANY Engineering Research Center, SOUTH KOREA

Boston Harbor

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Micro-Optical Systems 2E40.P 2E41.P 2E42.P 2E43.P Dual-Axis Optical Anodic Bonding of A DRIE Comb-Drive Highly Space-Efficient Mirror Positioning Optical Fibers to Silicon Actuator With Large, Electrostatic Zigzag Using a Nonlinear for Integrating MEMS Stable Deflection Range Transmissive Micro- Closed-Loop Controller Based Optical Pressure for Use as an Optical Optic Switches for an T. Juneau, K. Unterkofler, and Temperature Shutter Integrated MEMS T. Seliverstov, S. Zhang, Sensors onto Optical J.D. Grade, Optical Display System and M. Judy Fibers K.Y. Yasumura, K. Wang1, Analog Devices, Inc., A. Saran1, and H. Jerman K.F. Böhringer1, USA D.C. Abeysinghe2, Iolon, Inc., USA M. Sinclair2, P. Deshmukh1, and G. Starkweather2 R. Flenniken1, 1University of and J.T. Boyd1 Washington, USA and 1University of 2Microsoft Research, Cincinnati, USA and USA 2TaiTech Inc., USA

2E44.P 2E45.P 2E46.P 2E47.P High-Resolution, High- Electrostatic Actuated PLC-Optical Circulator A Miniture Confocal Speed Microscanner in Interference Filters as and Isolator Based on Microscope With Single-Crystalline Optical Switches for Blazed Diffraction MEMS Gimbal Scanner Silicon Actuated by Self- Display Applications Grating K. Murakami, Aligned Dual-Mode M. Panitz T. Sonobe1 A. Murata, T. Suga, Vertical Electrostatic and W. Benecke and H. Fujita2 H. Kitagawa, Y. Kamiya, Combdrive With University of Bremen, 1Namiki Precision M. Kubo, Capability for Phased GERMANY Jewelry Co., Ltd., JAPAN K. Matsumoto, Array Operation and 2University of Tokyo, H. Miyajima, D. Lee, JAPAN and M. Katashiro U. Krishnamoorthy, Olympus Optical Co., K. Yu, and O. Solgaard Ltd., JAPAN Stanford University, USA

2E48.P 2E49.P 2E50.P 2E51.P Digital Deflection Optical Power Regulator A Novel Micro Optical Piezoelectric 2D Micro Micromirrors for Using Closed- System Employing Scanner for Minimally Adaptive Optics Controlled MEMS Inclined Polymer Invasive Therapy Applications Variable Optical Mirrors and Fresnel Fabricated Using G.Y. Zhou, L. Vj, Attenuator (VOA) Lens for Monolithic Femtosecond Laser F.E.H Tay, and F.S. Chau X. Zhang1, A.Q. Liu1, Integration of Optical Ablation National University of C.W. Chan1, C.S. Thian1, Disk Pickup Heads M. Maeda1, N. Kikuchi2, Singapore, SINGAPORE H. Cai2,J.Hao2, F.G. Tseng and H.T. Hu Y. Haga 1, and M. Esashi1 and C. Lu2 National Tsing Hua 1Tohoku University, 1Nanyang Technological University, TAIWAN, JAPAN and 2PENTAX University, SINGAPORE ROC Corporation, JAPAN and 2Institute of Infocomm Research, SINGAPORE

2E52.P Integrated Micro Optical Flying Head With Lens Positioning Actuator for Small Form Factor Data Storage S.-H. Kim, Y. Yee, J.-H. Choi, H. Kwon, M.H. Ha, C.H. Oh, and J.-U. Bu LG Electronics Institute of Technology, SOUTH KOREA

33 Transducers ’03 ADVANCE PROGRAM continued

Microfluidic Actuators 2E53.P 2E54.P 2E55.P 2E56.P Liquid Separation for Electrostatic Actuation Design and Test of an Novel Approaches to Chemical Extraction by Without Electrolysis in Interpolating Mixing Microfluidic Large Droplet Ejection Microfluidic MEMS Architecture for Components in High- and Millimeter High T.L. Sounart Electro-Wetting-Based End Medical Liquid Fountain and T.A. Michalske Droplet On-Chip Applications H. Yu and E.S. Kim Sandia National Chemical Dilution T. Goettsche1, J. Kohnle1, University of Southern Laboratories, USA H. Ren, V. Srinivasan, M. Willmann1, California, USA and R.B. Fair H.P. Ernst1, S. Messner1, Duke University, USA R. Steger2,M.Storz1, W. Lang1, R. Zengerle2, and H. Sandmaier1 1HSG-IMIT, GERMANY and 2University of Freiburg, GERMANY

2E57.P 2E58.P 2E59.P 2E60.P Novel On-Chip Micro- A Novel Electrokinetic Combustor-Integrated Heat Exchanger Fluidic Transport Micromixer Micro-Fuel Processor Fabrication With System With H.Y. Wu and C.H. Liu With Suspended Arrays of Sensors and Electrochemically National Tsing Hua Membrane Structure Heaters With Its Micro- Controlled Bubble University, TAIWAN K.S. Chang, S. Tanaka, Scale Impingement Formation C.L. Chang, Cooling Process H. Suzuki and M. Esashi Analysis and and R. Yoneyama Tohoku University, Measurements University of Tsukuba, JAPAN C.H. Shen and C. Gau JAPAN National Cheng Kung University, TAIWAN

2E61.P 2E62.P 2E63.P A Disposable, Dead Design and Experimental Volume-Free and Leak- Characterization of A Investigation of Free Monolithic PDMS Micro Single Bubble Electrokinetically Microvalve Actuator Generated In-Plane J.S. Go1, T. Yamazaki2, P.G. Deng, Y.K. Lee, Vorticity in a M. Kanai1,H.Sato1, and P. Cheng Microchannel S. Kawakami1, Hong Kong University of W.L.W. Hau, L.M. Lee, and S. Shoji1 Science and Technology, Y.-K. Lee, M. Wong, 1Waseda University, HONG KONG and Y. Zohar JAPAN and 2Cannon Hong Kong University of Inc., JAPAN Science and Technology, HONG KONG

Microfluidic Systems and Components 2E64.P 2E65.P 2E66.P 2E67.P Scalable Microfabricated Microfluidic Switch for Performance and Thermocapillary Multiphase Reactors for Embryo and Cell Scaling of an Electro Actuation of Liquids Direct Fluorination Sorting Osmotic Mixer Using Patterned Heater Reactions C.-C. Chen, S. Zappe, P. Huang Arrays N. de Mas, A. Günther, O. Sahin, X.J. Zhang, and K.S. Breuer J.P.Valentino, M.A. Schmidt, E.E.M. Furlong, M. Fish, Brown University, USA A.A. Darhuber, and K.F. Jensen M. Scott, S.M. Troian, Massachusetts Institute and O. Solgaard and S. Wagner, of Technology, USA Stanford University, USA Princeton University, USA

2E68.P 2E69.P 2E70.P 2E71.P Ultrasonic Particle A Single Cell Multi- A Cellular Motor Driven Field-Effect Flow Manipulation in Analysis System for Microfluidic System Control in a Polymer Microchannels Using Electrophysiological S. Tung, J.W. Kim, Microchannel Network Phased Co-Planar Studies A. Malshe, C.C. Lee, N.J. Sniadecki1, Transducers A. Han1,E.Moss1, and R. Pooran C.S. Lee1, 1G.M. Dougherty R.D. Rabbitt2, University of Arkansas, M. Beamesderfer2, and 2A.P. Pisano and A.B. Frazier1 USA and D.L. DeVoe1 1Lawrence Livermore 1Georgia Institute of 1University of Maryland, National Laboratory, Technology, USA and USA and 2NASA USA and 2University of 2University of Utah, USA Goddard Space Flight California Berkeley, USA Center, USA

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2E72.P 2E73.P 2E74.P 2E75.P A Parylene MEMS Flow Electric Field Pulse Integrated Polymer Comparative Study of Sensing Array Assisted Covalent Waveguides for GB and DMMP Vapor E. Meng and Y.C. Tai Immobilization and Absorbance Detection Detections Using California Institute of Hybridization of DNA in Chemical Analysis Guided Shear Technology, USA in the Nanosecond Systems Horizontal Acoustic Time Scale for Genetic K.B. Mogensen, Wave Platforms Information Analysis J. El-Ali, A. Wolff, C. Zimmermann1, F. Fixe1, and J.P. Kutter P. Mazein 1,D.Rebière1, D.M.F. Prazeres2, Technical University of C. Déjous1, J. Pistré1, V. Chu 1, and J.P. Conde2 Denmark, DENMARK and R. Planade2 1INESC, PORTUGAL 1Université Bordeaux, and 2Instituto Superior FRANCE and 2Centre Técnico, PORTUGAL d'Etudes du Bouchet, FRANCE

2E76.P 2E77.P 2E78.P Design, Fabrication and Valve-Less Micro Fluidic A Novel Micro Fabry- Characterization of an Transport via Deliberate Perot Sensor Utilizing Axial-Flow Turbine for Electrochemical Refractive Index Flow Sensing Manipulation of Surface Matched Medium for G. Hong, A.S. Holmes, Tension High Sensitive Shear M.E. Heaton, W. Satoh and H. Suzuki Stress Sensing and K.R. Pullen University of Tsukuba, C.J. Lin and F.G. Tseng Imperial College London, JAPAN National Tsing Hua UK University, TAIWAN

Micropower Generation 2E79.P A Thermophotovoltaic Micro-Generator for Portable Power Applications O.M. Nielsen, L.R. Arana, C.D. Baertsch, M.A. Schmidt, and K.F. Jensen Massachusetts Institute of Technology, USA New Materials 2E80.P 2E81.P 2E82.P 2E83.P Multi-Walled Carbon Quality Factor Issues in Controlled Modification Microsystems for the Nanotube Sensors Silicon Carbide of Micromachined Fabrication of Nano- J.Chung,K.-H.Lee, Nanoelectromechanical Silicon Surfaces Using Scale Structures and J. Lee Systems Colloidal Micro- and C.G. Courcimault, Northwestern University, X.M.H. Huang1, Nanoparticles D.S. Kercher, USA C.A. Zorman2, V.T. Srikar1, Y. Peles2, and M.G. Allen M. Mehregany2, L. Arana1, Georgia Institute of and M.L. Roukes1 and S.M. Spearing1 Technology, USA 1California Institute of 1Massachusetts Institute Technology, USA and of Technology, USA and 2Case Western Reserve 2Rensselaer Polytechnic University, USA Institute, USA

35 Transducers ’03 ADVANCE PROGRAM continued

2E84.P 2E85.P 2E86.P 2E87.P Dissolvable Hydrogels Lithographic Approach Fabrication and Testing A New Technique for as Transducers of Bio- to Pattern Multiple of Single Crystalline 3C- Accurately-Defined Chemical Signals: Nanoparticle Thin Film SiC Devices Using a Deposition of Catalyst Models and Simulations Prepared by Layer-by- Novel SiC-on-Insulator Thin Films in Deep A.N. Chatterjee1, Layer Self-Assembly for Substrate Flow Channels of High- J.S. Moore1,D.J.Beebe2, Microsystems H.-I. Kuo, C.A. Zorman, Temperature Gas and N.R. Aluru1 T. Cui, Y. Lvov, F. Hua, and M. Mehregany Microreactors 1University of Illinois and J. Shi Case Western Reserve R.M. Tiggelaar1, Urbana-Champaign, Louisiana Tech University, USA J.W. Berenschot1, USA and 2University of University, USA R.E. Oosterbroek1, Wisconsin, USA P. van Male2, M.H.J.M. de Croon2, J.C. Schouten2, A. van den Berg1, and M.C. Elwenspoek1 1University of Twente, THE NETHERLANDS and 2Eindhoven University of Technology, THE NETHERLANDS

2E88.P 2E89.P 2E90.P 2E91.P Local Growth of Sol-Gel A Novel Type of Metal- Piezoresistance Analysis Laser Microfabrication Films by Means of on-Polymer of n-Type 6H-SiC for Using Nano-Particles Micro Hot-Plates Micromachined High-Temperature Dispersed Polymer F. Calame, Thermopile Mechanical Sensors Resist J. Baborowski, S. Gentil, D. Bergman T. Toriyama H. Yagyu1, S. Hayashi1, N. Ledermann, and F. Nikolajeff and S. Sugiyama and O. Tabata2 and P. Muralt Uppsala University, Ritsumeikan University, 1Mitsuboshi Belting LTD, Swiss Federal Institute of SWEDEN JAPAN JAPAN and Technology - Lausanne, 2Ritsumeikan University, SWITZERLAND JAPAN

2E92.P 2E93.P 2E94.P 2E95.P Wafer-Compatible Carbon Nanotube Si-Based Micro Probe Diamond Fabrication of Integrated on Silicon Card With Sharp Knife- Micro-Thermionic Thermally Induced Tips for Electron Field Edged Tips Combined Field Emitter With an Ultrasound Emitters Emitter: Tip Apex Shadow Mask Integrated Heating Using Nanocrystalline Patterning and Emission Deposition Element Silicon Layer Characterization Y.H. Cho1,T.Kuki2, J. Bae, P.N. Minh, T. Kihara1,J.Hirota2, C.H. Tsai1, P.N. Minh2, Y. Fukuta1, H. Fujita1, T. Ono, and M. Esashi and N. Koshida2 T. Ono2, L.T.T. Tuyen2, and B.J. Kim1 Tohoku University, 1Yamatake Corporation, Y.W. Lee 1, C.Y. Wu1, 1University of Tokyo, JAPAN JAPAN and 2Tokyo and M. Esashi2 JAPAN and 2TSG, University of Agriculture 1Industrial Technology JAPAN and Technology, JAPAN Research Institute, TAIWAN and 2Tohoku University, JAPAN

Polymer Microfabrication Technologies 2E96.P 2E97.P 2E98.P 2E99.P Novel Piezoelectric Fabrication of Folding Scanning Probe With Wafer Bonding Using Polyimide MEMS Microstructures Elastomeric (PDMS) Parylene and G.M. Atkinson1, Actuated by Tip for Scanning Probe Wafer-Level Transfer of R.E. Pearson1, Polypyrrole/Au Bilayer Microcontact Printing Free-Standing Parylene Z. Ounaies1, Y. Liu, L. Oh, (SP-uCP) Membranes J.S. Harrison2,C.Park2, and E. Smela X.Wang,K.Ryu, H.S. Kim and K. Najafi S. Dogan1, University of Maryland, and C. Liu University of Michigan, and J.A. Midkiff1 USA University of Illinois USA 1Virginia Commonwealth Urbana-Champaign, University, USA and USA 2NASA Langley Research Center, USA

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2E100.P 2E101.P 2E102.P 2E103.P Large-Deflection Out- Rapid, Low-Cost A Thermally Fabrication of an Epoxy of-Plane Buckled- Fabrication of Parylene Responsive Polymer Based Multi-Layer Bio- Electrode Actuators Microchannels for Microvalve Without Fluidic Dermal Patch H.S. Kim, K. Najafi, Microfluidic Mechanical Parts A.P. Gadre1, J.A. Garra1, P.D. Washabaugh, Applications Photo-Patterned in a A.J. Nijdam1, and L.P. Bernal H.-S. Noh, Y.-S. Choi, Parylene Channel A.H. Monica1, University of Michigan, C.-F. Wu, P.J. Hesketh, S. Mutlu1,C.Yu2, M.C. Cheng1,C.Luo1, USA and M.G. Allen F. Svec 2, T.W. Schneider2, Georgia Institute of C.H. Mastrangelo3, T.J. Long2, R.W. White2, Technology, USA J.M.J. Frechet2, M. Paranjape1, and Y.B. Gianchandani1 and J.F. Currie1 1University of Michigan, 1Georgetown University, USA, 2University of USA and 2Science California Berkeley, Applications USA, and 3Corning International Corp., IntelliSense Corporation, USA USA

2E104.P 2E105.P 2E106.P 2E107.P Self-Assembled Real Polyimide Sacrificial Technique for Preparing A Novel Fabrication Monolayer Coating to Layer for an All-Dry Defect-Free Spray Technology for Smooth Improve Release of Post-Process Surface Coated Resist Film 3D Inclined Polymer MEMS Structures Micromachining V.K. Singh, M. Sasaki, Microstructures With B.M. Dutoit1, Module J.H. Song, and K. Hane Adjustable Angles L. Barbieri2, H.M.T. Pham1, Tohoku University, K.-Y. Hung, H.T. Hu, Y. von Kaenel 1, L. Pakula1, JAPAN and F.G. Tseng and P. Hoffmann2 C.R. de Boer1, National Tsing Hua 1Colibrys SA, A. Bagolini2, L. Pakula1, University, TAIWAN SWITZERLAND and P.J. French 1, 2Swiss Federal Institute and P.M. Sarro1 of Technology, Lausanne, 1Delft University of SWITZERLAND Technology, THE NETHERLANDS and 2IRST-Trento, ITALY

2E108.P Spray Coating Fabrication: Thin Film Formation on Non- Planar Surface M. Ichiki, L. Zhang, Z. Yang, T. Ikehara, and R. Maeda National Institute of Advanced Industrial Science and Technology, JAPAN

RF MEMS: Components and Packaging 2E109.P 2E110.P 2E111.P 2E112.P Post-Enable Flip-Chip An Isolated Tunable SOI-Based HF and VHF A High-Q, Low Assembly for Capacitor With Linear Single-Crystal Silicon Impedance, GHz-Range Manufacturable RF- Capacitance-Voltage Resonators With Sub- Piezoelectric MEMS MEMS Behavior 100nm Vertical Resonator F.F. Faheem, K.C. Gupta, C. Tsai, P.A. Stupar, Capacitive Gaps J. Gorman1, and Y.C. Lee R.L. Borwick, III, S. Pourkamali D.J.D. Carter2, University of Colorado, and J.F. DeNatale and F. Ayazi B. Antkowiak2, USA Rockwell Scientific Georgia Institute of and A.E. Duwel2 Company, USA Technology, USA 1Massachusetts Institute of Technology, USA and 2Charles Stark Draper Laboratory, USA

2E113.P 2E114.P 2E115.P 2E116.P Vertically Supported RF CMOS-MEMS Microfabricated Near- A Hybrid Approach to Microresonators Capacitor Having Large- Field Microwave Probes Low-Voltage MEMS K.B. Lee and L. Lin Tuning Range for Scanning Switches University of California A. Oz and G.K. Fedder Microscopy R.L. Borwick, III, Berkeley, USA Carnegie Mellon M. Tabib-Azar P.A. Stupar, University, USA and Y. Wang and J.F. DeNatale Case Western Reserve Rockwell Scientific University, USA Company, USA

37 Transducers ’03 ADVANCE PROGRAM continued

2E117.P 2E118.P 2E119.P 2E120.P Mechanical Domain A Novel Device for In Silicon MEMS Tunable The Radial Bulk Non-Degenerate Situ Experimental Capacitors Operating in Annular Resonator: Parametric Resonance Characterization and Dielectric Fluid Towards a 50Ω RF in Torsional Mode Reliability Analysis of D.T. McCormick1,2, MEMS Filter Micro Electro DC-Contact RF MEMS Z. Li1, and N.C. Tien1 B.L. Bircumshaw, Mechanical Oscillator Switches 1University of California R.T. Howe, R. Baskaran D. Peroulis1 Davis, USA and 2Cornell O.M. O'Reilly, and K.L. Turner and L. Katehi2 University, USA and A.P. Pisano University of California 1University of Michigan, University of California Santa Barbara, USA USA and 2Purdue Berkeley, USA University, USA

2E121.P 2E122.P 2E123.P 2E124.P Tapping-Mode HF 90 MHz 30 GHz Litz Wires RF-MEMS Filters in Nanometric Lateral Gap Nanomechanical Defined by Ion Track Mobile Phone Resonators: Structures Fabricated by Lithography Applications Experimental and Local Deposition and M. Lindeberg, R. Aigner, Theory Dry Etching E. Öjefors, A. Rydberg, S. Marksteiner, E. Quévy1,B.Legrand1, G.M. Kim1, and K. Hjort L. Elbrecht, D. Collard2, M.A.F. van den Boogaart1, Uppsala University, and W. Nessler and L. Buchaillot1 S. Kawai2, SWEDEN Infineon Technologies, 1IEMN, FRANCE and H. Kawakatsu2, GERMANY 2University of Tokyo, and J. Brugger1 JAPAN 1Swiss Federal Institute of Technology, Lausanne, SWITZERLAND and 2University of Tokyo, JAPAN

2E125.P 2E126.P 2E127.P 2E128.P MEMS Switches and A Fast Switching Surface Innovation Ultra Thin A 5-17 GHz Wideband Other RF Components Micromachined Packaging for RF- Reflection-Type Phase Fabricated Using CMOS Electrostatic Relay MEMS Devices Shifter Using Digitally Postprocess Compatible E. Thielicke Y.-K. Park1, Y.-K .Kim1, Operated Capacitive Surface Micromachining and E. Obermeier C.-J. Kim2, H.-W. Park1, MEMS Switches P. Ericsson1, Berlin University of J.-O. Park3, and B.-K. Ju1 J.-M. Kim, S. Lee, M. Hedström2, Technology, GERMANY 1Korea Institute of J.-H. Park, C.-W. Baek, A. Olsson1, A. Scholes1, Science and Technology, Y. Kwon, and Y.-K. Kim J. Svennebrink1, SOUTH KOREA, Seoul National C. Vieider1, 2University of Seoul, University, R.O. KOREA and B. Wenk2 SOUTH KOREA, and 1Acreo AB, SWEDEN 3Intelligent Microsystem and 2MEMSCAP S.A., Center, SOUTH KOREA FRANCE

2E129.P Micromachined FBAR RF Filters for Advanced Mobile Handset Applications J.Y. Park, H.C. Lee, H.M. Lee, K.H. Lee, and J.U. Bu LG Electronics Institute of Technology, KOREA

Ultrasound, Accoustic and Pressure Sensors 2E130.P 2E131.P 2E132.P 2E133.P Interdigital, Capacitive An Ultrasound Based High Quality PZT Thick Hardness Detection Micromachined Method for Measuring Films Using Silicon Using Micromachined Ultrasonic Transducers Multiple Velocity Mold Technique for Active Tactile Sensor for Sensing and Components Velocities MEMS Applications Y. Hasegawa1, Pumping in in Opaque Micro and H.J. Zhao, T.L. Ren, T. Shimizu1,T.Miyaji1, Microfluidic Macro Flows J.S. Liu, L.T. Liu, M. Shikida1,H.Sasaki1, Applications R. Shandas, H.B. Kim, and Z.J. Li K. Sato1, J. McLean J.R. Hertzberg, Tsinghua University, and K. Itoigawa2 and F.L. Degertekin and O. Mukdadi CHINA 1Nagoya University, Georgia Institute of University of Colorado, JAPAN and 1Tokai Rika Technology, USA USA Co., Ltd., JAPAN

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2E134.P 2E135.P 2E136.P Vacuum Sealed Ultra Design and Ultrasonic Array Sensor Miniature Fiber-Optic Experiments of Bio- Using Piezoelectric Pressure Sensor Using Mimicry Sound Source Film on Silicon White Light Localization Sensor Diaphragm and Its Interferometry With Gimbal- Resonant-Frequency K. Totsu, Y. Haga, Supported Circular Tuning and M. Esashi Diaphragm K. Yamashita, Tohoku University, N. Ono, A. Saito, H. Murakami, JAPAN and S. Ando L. Chansomphou, University of Tokyo, and M. Okuyama JAPAN Osaka University, JAPAN

8:00 p.m. - 10:00 p.m. Optional: Boston Pops

WEDNESDAY June 11, 2003

7:00 a.m. - 5:30 p.m. Registration

Salon E Salon F Salon G Salon H-K

RF MEMS I Biomedical Integrated Polymer Prosthesis Biosystems Microsystems

8:10 AM - 8:40 AM 3A1.1 - Invited Speaker 3B1.1 - Invited Speaker 3C1.1 - Invited Speaker 3D1.1 - Invited Speaker RF MEMS Reliability Microfabricated Imprinted Polymers Polymer J. DeNatale Electrode Arrays for and Biosensors Micromachining Rockwell Scientific Restoring Lost Sensory M.C. Moreno-Bondi P. Renaud Company, USA and Motor Functions Universidad Swiss Federal Institute of R.A. Normann Complutense, SPAIN Technology, Lausanne, University of Utah, USA SWITZERLAND

8:40 AM - 9:00 AM 3A1.2 3B1.2 3C1.2 3D1.2 Self-Aligned 1.14-GHz CMOS Monolithic Selective Attachment of Parylene Neuro-Cages Vibrating Contour- Microelectrode Array Multiple Cell Types on for Live Neural Mode Disk Resonators for Stimulation and Thermally Responsive Networks Study J. Wang, Z.Y. Ren, Recording of Natural Polymer Q.He,E.Meng, and C.T.-C. Nguyen Neural Networks Y. Wang, X. Cheng, Y.-C. Tai, University of Michigan, W. Franks, F. Heer, Y. Hanein, A. Shastry, C.M. Rutherglen, USA I. McKay, S. Taschini, D.D. Denton, and J. Pine R. Sunier, C. Hagleitner, B.D Ratner, California Institute of A. Hierlemann, and K.F. Böhringer Technology, USA and H. Baltes University of Washington, ETH Zurich, USA SWITZERLAND

9:00 AM - 9:20 AM 3A1.3 3B1.3 3C1.3 3D1.3 Square-Extensional Planar Microcoil-Based Design of a Multi- Design and Fabrication Mode Single-Crystal Magnetic Resonance Parameter Feedback- of Multi-Metal Silicon Micromechanical Imaging of Cells Based Electrical Electrodes Implanted RF-Resonator C. Massin1,S.Eroglu2, Stimulation System for PDMS Structures for V. Kaajakari1,2, F. Vincent1, B.S. Gimi2, Cardiomyocyte Cultures Micro Flow Devices T. Mattila1,A.Oja1, P.-A. Besse1, R.H. Whittington, Using 3-D Assembly J. Kiihamäki1, R.L. Magin2, K.H. Gilchrist, M. Ishizuka, M. Abe, H. Kattelus1, and R.S. Popovic1 L. Giovangrandi, H. Houjou, J. Mizuno, M. Koskenvuori2, 1Swiss Federal Institute and G.T.A. Kovacs K. Tsutsui, Y. Wada, P. Rantakari2, of Technology Lausanne, Stanford University, USA and S. Shoji I. Tittonen2, SWITZERLAND and Waseda University, JAPAN and H. Seppä1 2University of Illinois 1VTT Information Chicago, USA Technology, FINLAND and 2Helsinki University of Technology, FINLAND

39 Transducers ’03 ADVANCE PROGRAM continued

Salon E Salon F Salon G Salon H-K

RF MEMS I Biomedical Integrated Polymer Prosthesis Biosystems Microsystems

9:20 AM - 9:40 AM 3A1.4 3B1.4 3C1.4 3D1.4 Mechanically Corner- Evaluation of the Air Characterization of Fabrication of Flexible Coupled Square Pollution Purification Drosophila Embryos Polymer Nanotubules Microresonator Array Ability of Plant by a Immobilized by Fluidic for Micro and for Reduced Series Bioelectrical Potential Microassembly Nanofluidic Motional Resistance Measurement R.W. Bernstein1, Applications M.U. Demirci, Y Hasegawa1,S Asada1, X.J. Zhang2,S.Zappe2, B. Ilic, D. Czaplewski, M.A. Abdelmoneum, T Katsube1, M. Fish2,M.Scott2, M. Zalalutdinov, and C.T-C. Nguyen and T. Oyabu2 and O. Solgaard2 B. Schmidt, University of Michigan, 1Saitama University, 1SINTEF Electronics and and H. Craighead USA JAPAN and 2Kanazawa Cybernetics, NORWAY Cornell University, USA Seiryo University, JAPAN and 2Stanford University, USA

9:40 a.m. - 10:20 a.m. Break and Exhibit Inspection

Micromanipulation Biophysical Cell Sensing Integrated and Sensing Sensors and Fabrication Manipulation Technologies 10:20 AM - 10:40 AM 3A2.1 3B2.1 3C2.1 3D2.1 Piezoelectric Development of a Nanoparticle-Mediated Air-Isolated Through- Microactuators in Multi-Modal, Flexible In-Vitro Gene Wafer Interconnects for Polymer-Composite Tactile Sensing Skin Transfection on the Microsystem Technology Using Polymer Micro Electroporation Applications C. Friese, Micromachining Chip D.F. Lemmerhirt F. Goldschmidtböing, J.M. Engel, J. Chen, C.P. Jen, C.S. Fan, and K.D. Wise and P. Woias and C. Liu Y.C. Lin, Y.H. Chen, University of Michigan, University of Freiburg, University of Illinois and C.S. Yeh USA GERMANY Urbana-Champaign, National Cheng Kung USA University, TAIWAN

10:40 AM - 11:00 AM 3A2.2 3B2.2 3C2.2 3D2.2 A Novel Actuation A Sweeping Mode Integrated Optical High-Energy Ion Mechanism Based on Integrated Tactile Diffractive Implantation: An Ferromagnetic SMA Fingerprint Sensor Micrograting-Based Alternative Technology Thin Films B. Charlot1,F.Parrain2, Injection Force Sensor for Micromachining M. Kohl1,D.Brugger1, N. Galy1, X.J. Zhang1,S.Zappe1, Three Dimensional M. Ohtsuka2, and B. Courtois1 R.W. Bernstein2, GaAs Structures and T. Takagi2 1TIMA Laboratory, O. Sahin1, C.-C. Chen1, J. Miao1 1Forschungszentrum FRANCE and 2Institute M. Fish1,M.Scott1, and H.L. Hartnagel2 Karlsruhe, GERMANY d'Electronique and O. Solgaard1 1Nanyang Technological and 2Tohoku University, Fondamentale, FRANCE 1Stanford University, University, SINGAPORE JAPAN USA and 2SINTEF and 2Darmstadt Electronics and University of Technology, Cybernetics, NORWAY GERMANY

11:00 AM - 11:20 AM 3A2.3 3B2.3 3C2.3 3D2.3 Microfabricated Development of A Micro Analysis An SOI Process for Torsional Actuator by Polymer-Based System Using Fabrication of Self-Aligned Plastic Artificial Haircell Dielectrophoresis and Integrated Solar Cells, Deformation Using Surface Micro Electrical Transistors and J. Kim, H. Choo, L. Lin, Micromachining Impedance Electrostatic Actuators and R.S. Muller and 3D Assembly Spectroscopy for Cell C.L. Bellew, S. Hollar, University of California J. Chen, J.M. Engel, Manipulation and and K.S.J. Pister Berkeley, USA and C. Liu Analysis University of California University of Illinois S.K. Mohanty1, Berkeley, USA Urbana-Champaign, S.K. Ravula1, USA K. Engisch2, and A.B. Frazier1 1Georgia Institute of Technology, USA and 2Emory University, USA

Transducers ’03 40 ADVANCE PROGRAM continued

Salon E Salon F Salon G Salon H-K

Micromanipulation Biophysical Cell Sensing Integrated and Sensing Sensors and Fabrication Manipulation Technologies 11:20 AM - 11:40 AM 3A2.4 3B2.4 3C2.4 3D2.4 Pneumatic Two- Small Insect An Electrophysiological Package Embedded Dimensional Measurements Using a Lab on a Chip Heat Exchanger for Conveyance System for Custom MEMS Force S. Pedersen, Stacked Multi-Chip Autonomous Sensor J. Kutchinsky, S. Friis, Module Distributed MEMS M.S. Bartsch1, K. Krzywkowski, H. Lee1,Y.Jeong1, Y. Fukuta, Y. Mita, W. Federle2, R.J. Full3, C.L. Tracy, J. Shin1,S.Kim1, M. Arai, and H. Fujita and T.W. Kenny1 R. Vestergaard, M. Kim2,M.Kang1, University of Tokyo, 1Stanford University, C.B. Sørensen, and K. Chun1 JAPAN USA, 2University of H. Vennerberg, 1Seoul National Würzburg, GERMANY, and R. Taboryski University, SOUTH and 3University of Sophion Bioscience A/S, KOREA and 2Samsung California Berkeley, USA DENMARK Electronic Co., Ltd., SOUTH KOREA 11:40 AM - 12:00 PM 3A2.5 3B2.5 3C2.5 3D2.5 Novel Fused Sensor for A Soft Contact Lens Ion-Selective A Poly-Si Photo and Ion Sensing With a MEMS Strain Microelectrode Array Thermoelectric Cooling K. Sawada, T. Ohshina, Gage Embedded for for Intracellular Device Fabricated by T. Hizawa, H. Takao, Intraocolar Pressure Detection on Chip Surface and M. Ishida Monitoring O.T. Guenat1, X. Wang1, Micromachining Toyohashi University of M. Leonardi1, J.F. Dufour2, Technology Technology, JAPAN P. Renaud1,D.Bertrand2, P. van der Wal1, H.J.H. Chen, J.C. Lin, and P. Leuenberger3 W.E. Morf1, I.Y. Huang, 1Swiss Federal Institute N.F. de Rooij1, and R.S. Huang of Technology, Lausanne, and M. Koudelka-Hep1 National Tsing Hua SWITZERLAND, 1University of Neuchâtel, University, TAIWAN 2Centre Médical SWITZERLAND and Universitaire Genève, 2University of Bern, SWITZERLAND, and SWITZERLAND 3Hôpital Universitaire Genève, SWITZERLAND

12:00 p.m. - 1:30 p.m. Lunch Break and Exhibit Inspection

Dynamics of Energy and Biotechnology Non-Silicon Microscale Force Sensors Materials Systems Fabrication 1:30 PM - 1:50 PM 3A3.1 3B3.1 3C3.1 3D3.1 Dynamics of Prototype of the Ti/Au On/Off Control of Micromachined Mechanically and X-Ray Microcalorimeter Biomolecular Motors in Negative Thermal Electrostatically Array Using Mushroom- a Microfluidic Device Expansion Thin Films Coupled Shaped Sn R. Yokokawa, M.S. Sutton Microcantilevers Microabsorbers S. Takeuchi, T. Kon, and J. Talghader M. Napoli, W. Zhang, H. Kudo1, T. Arakawa1, M. Nishiura, University of Minnesota, K. Turner, T. Nakamura1, M. Edamatsu, K. Sutoh, USA and B. Bamieh S. Ohtsuka1,T.Izumi1, and H. Fujita 1 1 University of California S. Shoji ,H.Sato , University of Tokyo, 1 1 Santa Barbara, USA H. Kobayashi ,K.Mori , JAPAN T. Homma1,T.Osaka1, K. Mitsuda2,N.Y. Yamasaki2, R.Fujimoto2, N. Iyomoto2, T. Oshima2, K. Futamoto2,Y.Takei2, T. Ichitsubo2, T. Fujimori2, Y. Ishisaki3,U.Morita3, T. Koga3,K.Sato3, T. Ohashi3,Y.Kuroda4, K. Onishi4, and K. Otake4 1Waseda University, JAPAN, 2Institute of Space and Astronautic Science, JAPAN, 3Tokyo Metropolitan University, JAPAN, and 4Mitsubishi Heavy Industry, LTD., JAPAN

41 Transducers ’03 ADVANCE PROGRAM continued

Salon E Salon F Salon G Salon H-K

Dynamics of Energy and Biotechnology Non-Silicon Microscale Force Sensors Materials Systems Fabrication 1:50 PM - 2:10 PM 3A3.2 3B3.2 3C3.2 3D3.2 Simulating Nonlinear Thin Film Nano 3D Comb Electrodes A Hysteresis-Free Dynamics and Chaos in Thermocouple Sensors for Amperometric Platinum Flexure a MEMS Cantilever for Applications in Immuno Sensors Material for Improved Using Poincare Mapping Laser and Electron N. Honda1,2,K.Emi2, Performance and S. Liu, A. Davidson, Beam Irradiation T. Katagiri2,T.Irita2, Reliability of MEMS and Q. Lin D. Chu, D.T. Bilir, S. Shoji2,H.Sato2, Devices Carnegie Mellon R.F.W. Pease, T. Homma2,T.Osaka2, J.D. Brazzle1, 1 University, USA and K.E. Goodson M. Saito2, J. Mizuno2 W.P. Taylor , B. Ganesh1,J.J.Price2, Stanford University, USA and Y. Wada2 and J.J. Bernstein1 1Fujirebio Inc., JAPAN 1Corning IntelliSense 2 and Waseda University, Corporation, USA and JAPAN 2Corning Incorporated, USA

2:10 PM - 2:30 PM 3A3.3 3B3.3 3C3.3 3D3.3 Design Consideration Polymeric Micro- Fluorescent Development of and Realization of a Cantilever Acoustic Amplification by Self- Gallium Nitride-Based Novel Micromechanical Sensor Array Aligned Integrated MEMS Structures Bi-Stable Switch T. Xu, M. Bachman, Microfluidic Optical A.R. Stonas, M. Mescheder, F.G. Zeng, and G.P. Li Systems K.L. Turner, M. Freudenreich, University of California J. Seo and L.P. Lee S.P. DenBaars, and G. Somogyi Irvine, USA University of California and E.L. Hu University of Applied Berkeley, USA University of California Sciences Furtwangen, Santa Barbara, USA GERMANY

2:30 PM - 2:50 PM 3A3.4 3B3.4 3C3.4 3D3.4 a-Line Method for Mass-Loaded Cantilevers Study of Odor Recorder High Modulus Poly-SiC Measuring the Stability With Suppressed for Recording Recipe of Technology for Domain and Pull-In Higher-Order Modes for Orange Flavor RF MEMS Hyper-Surface of Magnetic Resonance T. Yamanaka, D. Gao, Electrostatic Actuators Force Microscopy B. Wyszynski, M.B.J. Wijesundara, With Multiple Voltage B.W. Chui1, and T. Nakamoto C. Carraro, W.Z. Low, Sources Y. Hishinuma2, Tokyo Institute of R.T. Howe, O. Bochobza-Degani, R. Budakian1, Technology, JAPAN and R. Maboudian D. Elata, H.J. Mamin1, University of California and Y. Nemirovsky T.W. Kenny2, Berkeley, USA Technion - Israel and D. Rugar1 Institute of Technology, 1IBM Almaden Research ISRAEL Center, USA and 2Stanford University, USA

2:50 PM - 3:10 PM 3A3.5 3B3.5 3C3.5-Late News 3D3.5 Coupled-Domain Harmonic Cantilevers A Novel Fabrication Fabrication and Testing Nonlinear Macromodels for Nanomechanical Process for Ultra-Sharp, of Vertically Actuated High-Aspect Ratio Nano and Pull-in Sensing of Elastic Polycrystalline SiC Properties Tips Using (111) Single Characteristics With Micromechanical O. Sahin1, Crystalline Silicon Electro-Thermal Effect G. Yaralioglu1, J.Park,K.Park,B.Choi, Resonators for MHz S.-Y. Cheng, C.-C. Yu, 1 1 K. Koo, S. Paik, S. Park, Frequency Applications R. Grow ,S.F.Zappe, J. Kim, and D. Cho and Y.-J. Yang 2 1 R.F. Wiser, A. Atalar , C.F. Quate , Seoul National National Taiwan and O. Solgaard1 University, S. KOREA M. Mehregany, University, TAIWAN 1Stanford University, and C.A. Zorman USA and 2Bilkent 3C3.6-Late News Case Western Reserve University, USA A Switchable Cantilever University, USA for a Novel Time-of- Flight Scanning Force Microscope D.W. Lee1,2,M.Despont1, U. Drechsler1, C. Gerber1,2,P.Vettiger1, A. Wetzel2, R. Bennewitz2, and E. Meyer2 1IBM Zurich Research Laboratory, SWITZERLAND and 2University of Basel, SWITZERLAND

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3:10 p.m. - 5:30 p.m. Wednesday Poster Session and Refreshments

Bio Sensing Devices 3E1.P 3E2.P 3E3.P 3E4.P Microscale Microsecond A Disposable Polymer Microthermopiles Nanogap-Based Calorimetric Sensing Field Effect Transistor Integrated With Fluidic Dielectric R.E. Cavicchi, (FET) for pH Channels as Immunosensing O.C. Thomas, D.J. Ross, Measurement Calorimetric MEMS D. Di Carlo, J.S. Lee, and M.J. Tarlov C. Gao, X. Zhu, Biosensors and L.P. Lee National Institute of J.W. Choi, and C.H. Ahn Y. Zhang University of California Standards and University of Cincinnati, and S.A. Tadigadapa Berkeley, USA Technology, USA USA Pennsylvania State University, USA

3E5.P 3E6.P 3E7.P 3E8.P Networked Wireless Tailoring Enzymatic Realization and Biosensor Based on the Microsystem for Remote Membranes for ENFETs Characterization of a Photoluminescent Gastrointestinal for Dialysis Monitoring Four-Channel Bacteria and Its Use for Monitoring N. Jaffrezic-Renault1, Integrated Optical Express Control of L. Wang1, A.P. Soldatkin2, Young Interferometer Water Contamination E.A. Johannessen1, C. Martelet1, A. Ymeti1, J.S. Kanger1, by Some Surface Active 1 1 L. Cui ,C.Ramsay, P. Temple-Boyer4, J. Greve1, P.V. Lambeck1, Substances 2 T.B. Tang , W. Sant3, M.L. Pourciel4, R. Wijn2, N. Staradub1, M. Ahmadian2, P. Montoriol3, and R.G. Heideman2 A. Levkovetz1, A. Astaras3, 3 1University of Twente, and A.M. Katzev2 P.W. Dickman1, and F. Montiel-Costes 1 THE NETHERLANDS 1A.V. Palladin Institute J.M. Cooper1, IfoS-ECL, FRANCE, 2 2 of Biochemistry, A.F. Murray2, National Academy of and LioniX b.v., THE UKRAINE and B.W. Flynn2, Sciences, UKRAINE, NETHERLANDS 2 S.P. Beumont3, 3HEMODIA, FRANCE, Simpheropol Medical and D.R.S. Cumming1 and 4LAAS, FRANCE Academy, UKRAINE 1University of Glasgow, UK, 2University of Edinburgh, UK, and 3Institute for System Level Integration, UK

3E9.P 3E10.P 3E11.P 3E12.P Flexible Glucose Sensor Integrated Bio-Switches: The Study of Micro A Self-Testing With a Film-Type Novel Biosensing Blood Sugar Control Multiplexed CMOS Oxygen Electrode by Devices Highly Suitable Device Without Energy Stimulating Probe for a Microfabrication to Actuators Supply for Diabetes 1024-Site Neural Techniques M. Suzuki, S. Ito, Therapy Prosthesis K. Mitsubayashi, K. Yamamoto, T. Nagakura1, Y. Yao, M.N. Gulari, S. Iguchi, T. Endo, and Y. Iribe S. Maruo2, J.F. Hetke, S. Tanimoto, Toyama University, and K. Ikuta2 and K.D. Wise and D. Murotomi JAPAN 1Osaka Electro- University of Michigan, TOKAI University, Communication USA JAPAN University, JAPAN and 2Nagoya University, JAPAN

3E13.P Improved Electromagnetic Displacement Transducer With Large Force for Implantable Middle Ear Hearing Aid K.C. Lee1, S.K. Park2, and E.S. Kim1 1University of Southern California, USA and 2Kyungpook National University, USA

43 Transducers ’03 ADVANCE PROGRAM continued

Biochips 3E14.P 3E15.P 3E16.P 3E17.P Fabrication of A Dielectrophoretic Continuous Spore Biomarker Implantable Polyimide Particle and Cell Paramagnetophoretic Detection Using a Based Neural Implants Concentrator Microseparator for MEMS Differential With Flexible Regions D.J. Bennett1,2, Blood Cells Mobility Spectrometer to Accommodate B. Khusid2, K.-H. Han1, C.E. Davis1, J.M. Kang2, Micromovement P.C. Galambos1, J.P. Landers2, C.E. Dube1, K.K. Lee, A. Singh, C.D. James1, and A.B. Frazier1 T.J. Borenstein1, H.Xu,G.Coryell, and M. Okandan1 1Georgia Institute of E.G. Nazarov3, B. Olson, B.C. Kim, 1Sandia National Technology, USA and R.A. Miller3, G. Raupp, and J. Zhu Laboratories, USA and 2University of Virginia, and A.M. Zapata1 Arizona State University, 2New Jersey Institute of USA 1Charles Stark Draper USA Technology, USA Laboratory, USA, 2Massachusetts Institute of Technology, USA, and 3Sionex Corporation, USA

3E18.P 3E19.P 3E20.P 3E21.P Shape Encoded Particle Culture-Based On-Demand Neural Biosystem With 16 for DNA Analysis Microfluidic Device for Probes Highly-Selective Optical- J.G.F. Tsai, Z. Chen, Environmental M.G. Kindlundh1, Channels for Biological B. Merriman, S. Nelson, Monitoring P.H. Norlin1 Fluids Analysis in the and C.J. Kim G. Jing, A. Polaczyk, and U.G. Hofmann2 Visible Spectrum University of California D.B. Oerther, 1Acreo AB, SWEDEN and G. Minas1,J.C.Ribeiro1, Los Angeles, USA and I. Papautsky 2Medical University of S. Lanceros-Mendez1, University of Cincinnati, Lubeck, GERMANY F. Vaz 1, R.F. Wolffenbuttel2, USA and J.H. Correia1 1University of Minho, PORTUGAL and 2Delft University of Technology, THE NETHERLANDS

3E22.P 3E23.P 3E24.P 3E25.P Thermally Actuated Fabrication of a A Bioreactor for Study on Bead-Based Probe Arrays for Microfluidic Device for Continuous Perfusion Micro Biochip and Manipulation and Axonal Growth Control Cell Culture Fabricated Analytical System for Characterization of T. Yasuda, T. Higashi, With UV Sensitive Protein Detection Individual Bio-Cell and Y. Nakashima Biodegradable Polymer M.S. Kim, W.J. Chung, B.J. Kim1, D. Collard1, Kyushu Institute of E. Leclerc, Y. Sakai, S.-H. Cho, B.G. Kim, M. Lagouge2, Technology, JAPAN and T. Fujii Y.-S. Lee, and Y.-K. Kim B. Legrand2, University of Tokyo, Seoul National and L. Buchaillot2 JAPAN University, SOUTH 1University of Tokyo, KOREA JAPAN and 2IEMN, FRANCE

Device Design and Simulation 3E26.P 3E27.P 3E28.P 3E29.P Fluid-Structure Electro-Hydrodynamic On a Micromachined Switching-Mode Coupling Analysis and Modeling of Fluidic Inclinometer Fluxgate Simulation of a Electrospray Ionization: R.A. Yotter1, P. Ripka1 and Micromachined Piezo CAD for a µFluidic R.R. Baxter1,S.Ohno2, W.G. Hurley2 Microjet Device-Mass S.D. Hawley1, 1Czech Technical C. Liu1,T.Cui2, Spectrometer Interface and D.M. Wilson1 University, CZECH Z. Zhou3, K. Lian1, J. Zeng1,D.Sobek2, 1University of REPUBLIC and and J. Goettert1 and F.T. Korsmeyer1 Washington, USA and 2National University of 1Louisiana State 1Coventor, Inc., USA and 2University of California Ireland, IRELAND University, USA, 2Agilent Technologies, Berkeley, USA 2Louisiana Technical Inc., USA University, USA, and 3Tsinghua University, CHINA

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3E30.P 3E31.P 3E32.P 3E33.P Modeling and An Electret-Based Micro Electron Field Electromagnetic Experimental Validation Electrostatic Emitter Array With Analysis and of Silicon Nanotip µ-Generator Focus Lenses for Multi- Fabrication of MEMS Oxidation: Towards a T. Sterken1, P. Fiorini1, Electron Beam Membrane Switches on Nanoelectromechanical K. Baert1,R.Puers2, Lithography GaAs Substrate for X- Filter Application and G. Borghs1 P.N. Minh, T. Ono, Band Application V. Agache 1,P.Bigotte1, 1IMEC, BELGIUM and N.Sato,H.Mimura, W.B. Zheng1, B. Legrand1, V. Senez2, 2Katholieke Universiteit and M. Esashi Q.A. Huang1, L. Buchaillot1, Leuven, BELGIUM Tohoku University, and F.X. Li2 and D. Collard1 JAPAN 1Southeast University, 1IEMN, FRANCE and CHINA and 2Nanjing 2Laboratory for Electronic Devices Integrated Micro Institute, CHINA Mechatronics Systems, JAPAN

3E34.P Design and Fabrication of a Resonant Micro Reciprocating Engine for Power Generation T. Toriyama, K. Hashimoto, and S. Sugiyama Ritsumeikan University, JAPAN

Fabrication and Packaging of Microfluidic Devices 3E35.P 3E36.P 3E37.P 3E38.P Selective Deposition of Bonding Energy of A Multi-Layer Model for Micropart Parylene C for Direct-Bonded Plastic/Glass Planarization in Underwater Shear-Stress Hydrophilic Silicon Technology for Capillary-Based Sensors Wafers With Nano Microfludic Systems Microassembly Y. Xu 1 and Y.-C. Tai2 Surface Roughness at With Integrated K.L. Scott, R.T. Howe, 1Wayne State University, Room Temperature Functionality and C.J. Radke USA and 2California N. Miki A. Han, O. Wang, University of California Institute of Technology, and S.M. Spearing S.K. Mohanty, M. Graff, Berkeley, USA USA Massachusetts Institute K.H. Han, of Technology, USA and A.B. Frazier Georgia Institute of Technology, USA

3E39.P 3E40.P 3E41.P 3E42.P Anodic Bonding for Fabrication of A Novel Low Microwave Bonding of Monolithically Nanochannels Using Temperature Bonding Polymer-Based Integrated MEMS Glass to Glass Anodic Technique for Plastic Substrates for G.U. Jensen1, Bonding Substrates Using X-ray Micro/Nano Fluidic K. Schjølberg-Henriksen1, V.G. Kutchoukov, Irradiation Applications A. Hanneborg2, F. Laugere, H.S. Lee, D.S. Kim, K.F. Lei1,W.J.Li1, and H. Jakobsen3 W. van der Vlist, and T.H. Kwon N. Budraa2, 1SINTEF, NORWAY, L. Pakula, Y. Garini, POSTECH, SOUTH and J.D. Mai2 2University of Oslo, P.F.A. Alkemade, KOREA 1Chinese University of NORWAY, and and A. Bossche Hong Kong, HONG 3SensoNor, NORWAY Delft University of KONG and 2Microwave Technology, THE Bonding Instruments, NETHERLANDS Inc., USA Gas Sensing Systems 3E43.P 3E44.P 3E45.P 3E46.P Thermal Behavior of Chemiresistor Array A Multisensor System Optimization of the High-Performance With Nanocluster for Monitoring the Signal to Noise Ratio of Temperature- Interfaces as a Micro- Quality of Carbon Resonant Programmed GC Detector Dioxide in the Beverage Microcantilever Type Microfabricated Gas W.H. Steinecker, Industry Chemical Sensors Chromatography M.P. Rowe, A.J. Matzger, X. Vilanova1,E.Llobet1, L. Fadel1,I.Dufour1, Columns and E.T. Zellers J. Brezmes1,R.Calavia1, F. Lochon 1, M. Agah, J.A. Potkay, University of Michigan, X. Correig1, and O. Français2 J.A. Driscoll, R.D. Sacks, USA and X. Sanchez2 1Laboratory IXL, M. Kaviany, 1University Rovira i FRANCE and 2ESIEE, and K.D. Wise Virgili, SPAIN and FRANCE University of Michigan, 2Carburos Metálicos S.A., USA SPAIN

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3E47.P 3E48.P 3E49.P 3E50.P Magnetically Actuated Multi-Transducer A Novel Micro Gas Odor Approximation of CMOS Resonant Recordings from a Sensor Using Laterally Fruit Flavors Using a Cantilever Gas Sensor Single-Chip Gas Sensor Grown Carbon QCM Odor Sensing for Volatile Organic System Coated With Nanotubes System Compounds Different Polymers Y.T. Jang1, C.H. Choi1, S. Munoz-Aguirre, C. Vancura1,M.Rüegg1, P. Kurzawski, I. Lazic, S.I. Moon1, J.H. Ahn2, A. Yoshino, Y. Li 1, D. Lange2, C. Hagleitner, Y.H. Lee3, and B.K. Ju1 T. Nakamoto, C. Hagleitner1, A. Hierlemann, 1Korea Institute of and T. Moriizumi O. Brand3, and H. Baltes Science and Technology, Tokyo Institute of A. Hierlemann1, ETH Zurich, SOUTH KOREA, Technology, JAPAN and H. Baltes1 SWITZERLAND 2HanYang University, 1ETH Zurich, SOUTH KOREA, and SWITZERLAND, 3Korea University, 2Stanford University, SOUTH KOREA USA, and 3Georgia Institute of Technology, USA

Inertial Sensors 3E51.P 3E52.P 3E53.P 3E54.P Capacitive Angular Sensor Assembly for Implantable Bimorph Development of Surface Accelerometer With Postural Control Piezoelectric Micromachinable Dual Radial Anchor Balance Prosthesis Accelerometer for Capacitive Support M.S. Weinberg1 Feedback Control of Accelerometer Using G.J. O'Brien1, and C. Wall, III2 Functional Fringe Electrical Field D.J. Monk2, 1Draper Laboratory, USA Neuromuscular S. Aoyagi and Y.C. Tai and K. Najafi1 and 2MEEI-Harvard Stimulation California Institute of 1University of Michigan, Medical School, USA Q. Zou, E.S. Kim, Technology, USA USA and 2Motorola, Inc., W. Tan, and G.E. Loeb USA University of Southern California, USA

3E55.P 3E56.P 3E57.P 3E58.P A Micro Pitch and Roll Development and Characterization of a A Single-Crystal Silicon Motion Sensor Characterization of a Novel Micromachined Symmetrical and J. Kim and L. Lin High Aspect Ratio Accelerometer With Decoupled Gyroscope University of California Vertical FET Sensor for Enhanced-MIDOS on Insulating Substrate Berkeley, USA Motion Detection O. Bochobza-Degani1, S.E. Alper and T. Akin S. Buschnakowski, R. Yechieli2,E.Socher1, Middle East Technical A. Bertz, W. Bräuer, U. Ben-Yehuda2, University, TURKEY S. Heinz, R. Schuberth, and Y. Nemirovsky1 G. Ebest, and T. Gessner 1Technion - Israel TU Chemnitz, ZfM, Institute of Technology, GERMANY ISRAEL and 2RAFAEL LTD., ISRAEL

3E59.P 3E60.P Optimisation, Design Electro-Mechanical and Fabrication of Feedback for Realization Novel Accelerometer of a Mechanical R. Houlihan, Spectrum Analyser E. Koukharenka, L.A. Rocha, E. Cretu, H. Sehr, and R.F. Wolffenbuttel and M. Kraft Delft University of University of Technology, THE Southampton, UK NETHERLANDS

Micro Actuators 3E61.P 3E62.P 3E63.P 3E64.P Thermally Actuated, Bi- Linear Variable Thermal Actuators Used Downscaling of Stable, Snapping Silicon Reluctance (VR) Micro for a Micro-Optical Propellant Membranes Motor With Horizontal Bench: Application for a Pyrotechnical R. Arya, M.M. Rashid, Flux Guidance: Concept, Tunable Fabry-Perot Microsystems D. Howard, S.D. Collins, Simulation, Fabrication Filter P.Q. Pham1, D. Briand1, and R.L. Smith and Test E. Pichonat-Gallois and C. Rossi2, University of California V. Seidemann1,J.Edler2, M. de Labachelerie and N.F. de Rooij1 Davis, USA S. Büttgenbach1, Laboratorie de Physique 1University of and H.-D. Stölting2 et Métrologie des Neuchâtel, 1Technical University of Oscillateurs/CNRS, SWITZERLAND and Braunschweig, FRANCE 2LAAS-CNRS, FRANCE GERMANY and 2University of Hannover, GERMANY

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3E65.P 3E66.P Fabrication and Instability in Characterization of a Micromachined Liquid Metal Micro- Electrostatic Torsion Droplet Thermal Switch Actuators With Full A.O. Christensen, Travel Range J.P. Jacob, C.D. Richards, Z. Xiao and K.R. Farmer D.F. Bahr, New Jersey Institute of and R.F. Richards Technology, USA Washington State University, USA

Micro Needles 3E67.P 3E68.P 3E69.P 3E70.P Fabrication and Microneedle Array With An Autonomous Novel Microneedle Characterization of Integrated Microneedle-Based Bio- Array Integrated With a Laser Micromachined Microchannels for Analysis System PDMS Biochip for Hollow Microneedles Transdermal Sample S. Chandrasekaran, Microfluid Systems S.P. Davis, Extraction and In Situ S.K. Mohanty, S.-J. Paik1,D.Cho1, M.R. Prausnitz, Analysis and A.B. Frazier J.-M. Lim1,I.Jung1, and M.G. Allen E.M. Mukerjee, Georgia Institute of Y. Park 1,S.Byun1, Georgia Institute of R.R. Isseroff, Technology, USA S. Chung2,K.Chun1, Technology, USA S.D. Collins, and J. Chang1 and R.L. Smith 1Seoul National University of California University, SOUTH Davis, USA KOREA and 2Digital Bio Technology Co., Ltd., KOREA

Micro Optical Components 3E71.P 3E72.P 3E73.P 3E74.P Robust Sliding-Mode Optimized Interface Elastomer Spatial Light A Novel Fabrication Control of Electrostatic Electronics and Modulators for EUV Method for a Vertical Torsional Micromirrors Transduction Lithography Comb Drive Using a Beyond the Pull-In Mechanisms for High J.-S. Wang, I.W. Jung, Single SOI Wafer for Limit Sensitivity Photodiode and O. Solgaard Optical MEMS N. Yazdi, H. Sane, Structures Stanford University, USA Applications T.D. Kudrle, J. Greegor, R.A. Yotter, K.H. Jeong and L.P. Lee and C.H. Mastrangelo and D.M. Wilson University of California Corning Intellisense University of Berkeley, USA Corporation, USA Washington, USA

3E75.P 3E76.P 3E77.P 3E78.P Measuring the Optical Thermal Based Angle Self-Powered Photon A Micromirror Device and Electromechanical Fixing for Micromirrors Source With Post-Fabrication Properties of MEMS J.L. Zhang1 H. Guo and A. Lal Re-Adjustable Pull-In Mirrors and Y.C. Lee2 Cornell University, USA Parameters Y. Reznichenko, 1Reflectivity Inc., USA D. Elata, M.W. Judy, and S. Zhang and 2University of O. Bochobza-Degani, Analog Devices, Inc., Colorado, Boulder, USA and Y. Nemirovsky USA Technion - Israel Institute of Technology, ISRAEL

3E79.P 3E80.P 3E81.P 3E82.P Diffractive Optical Sub-Micrometre A Novel Schottky Micro-Machined Elements in Titanium Precision Measurement Electro-Optic Tunable Optical Filters Oxide for MOEMS Method for Wafer Level Modulator for GHz With Optimized Band- Applications Assembly High-Speed Switching Pass Spectrum V.K. Parashar, A. Sayah, M. Olson, G. Arvidsson, M. Mazza, A.M. Ionescu, D. Hohlfeld and M.A.M. Gijs A.P. Scholes, D. Evekull, L. Thévenaz, P. Robert, and H. Zappe Swiss Federal Institute of S. Ahlberg, and M.J. Declercq University of Freiburg, Technology, Lausanne, and L. Bäcklin Swiss Federal Institute of GERMANY SWITZERLAND Acreo AB, SWEDEN Technology, Lausanne, SWITZERLAND

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3E83.P 3E84.P 3E85.P 3E86.P Characteristics of LIGA Tunable External- Electro-Statically Integrated PMMA Micromirror for Cavity Laser Using Actuated Light Multifunctional MOEM Optical Switch MEMS Technology Emitting Device Using Reprogrammable Application X. Zhang1, A.Q. Liu1, OLED “MEMS Deformable W.I. Jung1, M.Y. Jung1, D. Tang1,C.Lu2, M. Motoyama, Mirror” and “3D Phase C.H. Jun1,Y.T.Kim1, J. Hao2, K. Hoshino, Retrieval” Based and M. Esashi2 and A.K. Asundi1 K. Matsumoto, Adaptive Optic System 1Electronics and 1Nanyang Technological and I. Shimoyama Implementations Telecommunications University, SINGAPORE University of Tokyo, S. Rogers1 Research Institute , and 2Institute of JAPAN and F. Scarpino2 SOUTH KOREA and Infocomm Research, 1Air Force Research 2Tohoku University, SINGAPORE Laboratory, USA and JAPAN 2University of Dayton, USA

3E87.P An Electromagnetically Actuated Bi-Stable MEMS Optical Microswitch H.H. Gatzen1, E. Obermeier2, T. Kohlmeier1, T. Budde1, H.D. Ngo2, B. Mukhopadhyay2, and M. Farr3 1Hanover University, GERMANY, 2Berlin University, GERMANY, and 3Finisar Corporation, GERMANY

Micro Stage Actuators 3E88.P 3E89.P 3E90.P A Microstage With Six Design and Fabrication Development of Three- Degrees of Freedom of an Electrostatically Dimensional Made by a Piece of Actuated MEMS Probe Electrostatic Stages for Piezo-Material Card Scanning Probe D.Y. Zhang1,T.Ono2, S. Kawamura, Microscope and M. Esashi2 K. Kataoka, T. Itoh, Y. Ando 1Beihang University, and T. Suga National Institute of CHINA and 2Tohoku University of Tokyo, Advanced Industrial University, JAPAN JAPAN Science and Technology, JAPAN

Microfabrication with Metals 3E91.P 3E92.P 3E93.P 3E94.P Nanometer Gaps by Nickel Nano-Composite Effective Fabrication Electrochemical Etching Feedback-Controlled Film for MEMS Method of for Micromachining of Electromigration Applications Microelectrode Arrays Corrosion Resistant C.Y. Shih, S.Y. Zheng, K.S. Teh1, Y.T. Cheng2, With Modified Alloys A. Chan, and Y.C. Tai and L. Lin1 Platinum Electrode T. Mineta California Institute of 1University of California Surface for Yamagata Research Technology, USA Berkeley, USA and Electrochemical Institute of Technology, 2National Chiao Tung Biosensors JAPAN University, TAIWAN, H.K. Kim, S.K. Kang, R.O.C. D.-H. Shin, H. Yang, and Y.T. Kim Electronics and Telecommunications Research Institute , SOUTH KOREA

3E95.P Fabrication of Microneedle Array Using Inclined LIGA Process S.J. Moon and S.S. Lee Pohang University of Science and Technology, SOUTH KOREA

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Microvalves 3E96.P 3E97.P 3E98.P 3E99.P Improved Gas Flow A Pyroelectric - Expandable A Liquid-Triggered Model for Microvalves Piezoelectric Valve for Microspheres Liquid Microvalve A.K. Henning Integrated Incorporated in a J. Melin, N. Roxhed, Redwood Microsystems, Microfluidics PDMS Matrix: A Novel G. Gimenez, P. Griss, Inc., USA R. Duggirala and A. Lal Thermal Composite W. van der Wijngaart, Cornell University, USA Actuator for Liquid and G. Stemme Handling in Royal Institute of Microfluidic Technology, SWEDEN Applications B. Samel, P. Griss, and G. Stemme Royal Institute of Technology, SWEDEN

Modeling and Control 3E100.P 3E101.P 3E102.P 3E103.P Computational Fluid X3D: 3D X-Ray Non-Linearities in Modeling of Failure Dynamic Model and Lithography and Single-Crystal Silicon Mechanisms for Non-Dimensional Development Micromechanical Optimized MEMS Analysis of Diffusion, Simulation for MEMS Resonators CAD: Design, Convection and S. Hafizovic1,Y.Hirai2, V. Kaajakari1,2, Fabrication and Migration Processes in O. Tabata2, T. Mattila1, Characterization of in Electrochemical Sensor and J.G. Korvink1 J. Kiihamäki1, Situ Test Benches D. Barak-Shinar, 1University of Freiburg, H. Kattelus1,A.Oja1, O. Millet, V. Agache, M. Rosenfeld, GERMANY and and H. Seppä1 B. Legrand, D. Collard, and S. Abboud 2Ritsumeikan University, 1VTT Information and L. Buchaillot Tel-Aviv University, JAPAN Technology, FINLAND IEMN, FRANCE ISRAEL and 2Helsinki University of Technology, FINLAND

3E104.P 3E105.P 3E106.P 3E107.P Quasi-Analytical Study The Temperature Tunable Quality Factor Design Consideration of Offset Voltage Due to Compensation of a Using Novel of Micro Gyroscope Piezoresistive Effect in Thermal Flow Sensor Micromachined Stabilized for Vertical Hall Devices by With a Mathematical Structures Acceleration Mapping Techniques Method W. Fang and C.C. Cheng S. Ioku, K. Maenaka, R. Sunier1, S. Taschini1, T.J. Nam, S.H. Kim, National Tsing Hua T. Fujita, O. Brand2, T. Vancura1, and S.K. Park University, TAIWAN and Y. Takayama and H. Baltes1 Kyungpook National Himeji Institute of 1ETH Zurich, University, SOUTH Technology, JAPAN SWITZERLAND and KOREA 2Georgia Institute of Technology, USA

Physical Sensors 3E108.P 3E109.P 3E110.P 3E111.P MEMS High Resolution Optical Confinement Micromachined Two Spectral Performance of 4-20mA Current Sensor and Colour Separation Dimensional Resistor a Silicon IR for Industrial in a Double Laser Arrays for Microspectrometer Applications Colour Scanned Determination of Gas S.H. Kong, G. de Graaf, J.F. DeNatale1, Photodiode (D/CLSP) Parameters and R.F. Wolffenbuttel R.L. Borwick, III1, M. Vieira, M. Fernandes, J.J. van Baar, Delft University of P.A. Stupar1, P. Louro, A. Fantoni, W.A. Verweij, Technology, THE R. Anderson1, and D. Brida M. Dijkstra, NETHERLANDS K. Garrett1, Instituto Superior de R.J. Wiegerink, W. Morris1, Engenharia de Lisboa, T.S.J. Lammerink, and J. Yao2 PORTUGAL G.J.M. Krijnen, and M. Elwenspoek 1Rockwell Scientific University of Twente, Company, USA and THE NETHERLANDS 2Memcentric Technologies, USA

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3E112.P 3E113.P 3E114.P 3E115.P Thermal-Type Micro Electronic Compass Improvement of Sn-Doped InSb Thin Sensor Array on a PI Using Two-Axis Micro Infrared Lights Film Hall Elements by Film Substrate Which Fluxgate Sensing Sensitivity on PZT MBE and Their Wet-Etched Through Element Emitter Applications the Wafer for J.-S. Hwang1, D. Takamuro, H. Takao, I. Shibasaki, Interconnection W.-Y. Choi2, K. Sawada, A. Okamoto, M. Takada, J.S. Han, Z.Y. Tan, H.-S. Park1, and M. Ishida H. Goto, K. Sato, and M. Shikida D.-S. Shim1, K.-W. Na1, Toyohashi University of and R. Uchiyama Nagoya University, and S.-O. Choi1 Technology, JAPAN Asahikasei Corporation, JAPAN 1Samsung Advanced JAPAN Institute of Technology (SAIT), SOUTH KOREA and 2Kangnung National University, SOUTH KOREA

Silicon Microfabrication Technologies 3E116.P 3E117.P 3E118.P 3E119.P Critical Aspect Ratio Design, Fabrication, and Optical iMEMS™ - A MEMS Conformal Dependence in Deep Characterization of Fabrication Process for Electrode Array for Reactive Ion Etching of Thermally Isolating MEMS Optical Switches Retinal Implant Silicon Support Membrane for With Integrated On- M. Okandan, J. Yeom, Y. Wu, Low-Noise Si Amplifiers Chip Electronics K. Wessendorf, and M.A. Shannon S.Y. Bae, E. Jones, T.J. Brosnihan1, T. Christenson, T. Lemp, University of Illinois K.G. Sukhatme, S.A. Brown1,A.Brogan1, R.Shul,M.Baker, Urbana, Champaign, J.A. Podosek, C.S. Gormley1, D. Stein, C. James, USA A.Turner,J.Bock, D.J. Collins1, and R. Myers and M. Yun S.J. Sherman1, Sandia National Jet Propulsion M.A. Lemkin1, Laboratories, USA Laboratory, USA N.A. Polce2, and M.S. Davis2 1Analog Devices, Inc., USA and 2Clare Inc., USA

3E120.P 3E121.P 3E122.P 3E123.P Modular Integration of Fabrication of an Active SOI Silicon on Glass Fabrication of High CMOS and SOI-MEMS Nanostencil With Fabrication Technique Aspect Ratio Through- Using “Plug-Up” Integrated for Optical MEMS Wafer Vias in CMOS Concept Microshutters K.P. Larsen1, Wafers for 3-D Packaging J. Kiihamäki1, R.W. Tjerkstra1, J.T. Ravnkilde2, Applications H. Ronkainen1, P. Ekkels1,G.Krijnen1, and O. Hansen1 F.E. Rasmussen1, H. Kattelus1,P.Pekko1, S. Egger2,E.Berenschot1, 1Technical University of J. Frech2, M. Heschel3, and K. Theqvist2 K.C. Ma1, Denmark, DENMARK and O. Hansen1 1VTT Centre for and J. Brugger3 and 2Dicon A/S, 1Technical University of Microelectronics, 1University of Twente, DENMARK Denmark, DENMARK, FINLAND and 2Micro THE NETHERLANDS, 2HSG-IMIT, Analog Systems OY, 2University of GERMANY, and 3Hymite FINLAND Cambridge, ENGLAND, A/S, DENMARK and 3Ecole Polytechnique Federale de Lausanne, THE NETHERLANDS

3E124.P 3E125.P 3E126.P 3E127.P Improved Step Flow Examination of No Fabrication of Fast Wet Anisotropic Model for Simulation Al Etch Si Anisotropic Pen-Shaped Etching of Si{100} and of Orientation- Etching by TMAH Microneedle Structure {110} With a Smooth Dependent Dissolving Si and by Using Surface in Ultra-High Wet Etching of Silicon Oxidizing Agent Non-Photolithographic Temperature KOH A. Horn N. Fujitsuka1, Pattern Transfer Solutions and G. Wachutka K. Hamaguchi1, M. Shikida1,M.Ando2, H. Tanaka1,2, Munich University of H. Funabashi1, Y. Ishihara1, S. Yamashita2,Y.Abe2, Technology, GERMANY E. Kawasaki2, N. Yamaura1,T.Ando1, M. Shikida1, and T. Fukada2 and K. Sato1 and K. Sato1 1Toyota Central R&D 1Nagoya University, 1Nagoya University, Labs Inc., JAPAN and JAPAN and 2Sanwa JAPAN and 2DENSO 2DENSO Corporation, Kagaku Kenkyusho Co., Corporation, JAPAN JAPAN Ltd., JAPAN

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3E128.P 3E129.P 3E130.P 3E131.P Neuron Size Si Probe A Convex-Corner CMOS Signal Robust SOI Process Array Fabricated on Preservation Principle Processing Circuits on Without Footing for Integrated Circuits for in Bulk Si (111) for Neural High-Yield, Multichannel Electrode Micromachining and Its Activity Image- High-Performance T. Kawano, Y. Kato, Application to Nano- Recording With Microgyroscopes R. Tani, H. Ishino, Point Needles Epitaxially Grown J. Kim1,D.Cho1, H. Takao, K. Sawada, Y. Mita, D. Kobayashi, Micro-Si Probes S. Park1,D.Kwak1, and M. Ishida and T. Shibata Y. Kato, T. Kawano, H. Ko1,W.Carr2, Toyohashi University of University of Tokyo, Y. Ito, H. Takao, and J. Buss3 Technology, JAPAN JAPAN K. Sawada, 1Seoul National and M. Ishida University, SOUTH Toyohashi University of KOREA, 2New Jersey Technology, JAPAN Microsystems, Inc., USA, and 3Office of Naval Research, USA

Wireless Microsystems 3E132.P 3E133.P 3E134.P 3E135.P Selective Signal Two-Chip Pressure Optically-Powered Low Frequency Wireless Transmission to Inlaid Sensor and Signal Wireless Transmitter for Powering of Microcoils by Inductive Conditioning High-Temperature Microsystems Using Coupling J. Dancaster1,W.Kim1, MEMS Sensing and Piezoelectric- J. Wu D. Do1, S. Sampson1, Communications Magnetostrictive and G.H. Bernstein J.R. Logan1, M. Suster, W.H. Ko, Laminate Composites University of Notre and R. Merrill2 and D.J. Young A.K. Bayrashev1, 2 Dame, USA 1GE NovaSensor, Inc., Case Western Reserve A. Parker , 1 USA and 2RMC Data University, USA W.P. Robbins , and B. Ziaie1 Acquisition & Control 1University of Minnesota, Solutions, USA USA and 2University of North Carolina, USA

3E136.P A 100V-IC for the Remote Powering and Independant Control of Multiple Electrostatic Actuators P. Basset, A. Kaiser, D. Collard, and L. Buchaillot IEMN, FRANCE

7:00 p.m. - 10:00 p.m. Optional: Conference Banquet

Visit the website at: www.transducers03.org And don’t forget to sign up for Short Courses and Special Events!

51 Transducers ’03 ADVANCE PROGRAM continued

THURSDAY June 12, 2003

7:00 a.m. - 3:00 p.m. Registration

Salon E Salon F Salon G Salon H-K

RF Microsystems Integrated Bio Physical Optical MEMS Chemical Interfaces Technologies Microprocessing 8:10 AM - 8:40 AM 4A1.1 4B1.1 - Invited Speaker 4C1.1 - Invited Speaker 4D1.1 - Invited Speaker Integrated RF- MEMS Chemical Synthesis on Surface Modification Microoptical Systems Switch Based on a Wafers Technology for for Optical Data Combination of A. de Mello bioMEMS Storage Thermal and Imperial College of Y.-S. Lee J.-U. Bu Electrostatic Actuation Science, Technology and Seoul National LG Electronics Institute P. Rob er t 1, D. Saias2, Medicine, ENGLAND University, KOREA of Technology, KOREA C. Billard1,S.Boret2, N. Sillon1, C. Maeder-Pachurka1, G. Bouche2, P.L. Charvet1,P.Ancey2, and P. Berruyer1 1CEA-LETI, FRANCE and 2STMicroelectronics, FRANCE

8:40 AM - 9:00 AM 4A1.2 4B1.2 4C1.2 4D1.2 Silicon MEMS Combustion-Assisted A High-Density A 5-Volt Operated Micro-Switch With Hydrogen Production Electrode Array for MEMS Variable Optical Charge-Induced in a High-Temperature A Cochlear Prosthesis Attenuator Retention Chemical Reactor/Heat P.T. Bhatti1, H. Toshiyoshi1, K. Suzuki and Y.C. Neav Exchanger for Portable B.Y. Arcand2, J. Wang1, K. Isamoto2, NEC Corporation, Fuel Cell Applications N.V. Butala2, A. Morosawa2, JAPAN L.R. Arana, C.R. Friedrich2, M. Tei2, and H. Fujita1 C.D. Baertsch, and K.D. Wise1 1University of Tokyo, R.C. Schmidt, 1University of Michigan, JAPAN and 2Santec M.A. Schmidt, USA and 2Michigan Photonics Laboratories and K.F. Jensen Technological University, Corporation, JAPAN Massachusetts Institute USA of Technology, USA

9:00 AM - 9:20 AM 4A1.3 4B1.3 4C1.3 4D1.3 Development and A Silicon Living Three- A Bulk Micromachined Performance Analysis Microfabricated Direct Dimensional Tiltable Mirror Array of an Intra-Body Formic Acid Fuel Cell Microfabricated Digital Variable Optical Communication Device G.Z. Mozsgai, J. Yeom, Constructs for the Attenuator K. Hachisuka1, B.R. Flachsbart, Replacement of Vital W. Sun1,J.Mughal2, A. Nakata2,T.Takeda1, and M.A. Shannon Organ Function F. Perez 2,W.Noell1, Y. Terauchi1, K. Shiba3, University of Illinois, J.T. Borenstein1, N. Riza2, K. Sasaki1, H. Hosaka1, USA W. Cheung2, and N. De Rooij1 and K. Itao1 L. Hartman2, 1University of Neuchâtel, 1University of Tokyo, M.R. Kaazempur- SWITZERLAND JAPAN, 2Honda R&D Mofrad3, K.R. King3, and 2Nuonics, Inc., Co., Ltd., JAPAN, and A. Sevy3, M. Shin2, SWITZERLAND 3Tokyo University of E.J. Weinberg3, Science, JAPAN and J.P.Vacanti2 1Charles Stark Draper Laboratory, USA, 2Massachusetts General Hospital, USA, and 3Massachusetts Institute of Technology, USA

Transducers ’03 52 ADVANCE PROGRAM continued

Salon E Salon F Salon G Salon H-K

RF Microsystems Integrated Bio Physical Optical MEMS Chemical Interfaces Technologies Microprocessing 9:20 AM - 9:40 AM 4A1.4 - Invited Speaker 4B1.4 4C1.4 4D1.4 RF MEMS/Switches A Hydrogen Separation Fabric Sensors for the Analog Micromirror G.M. Rebeiz Module Based on Wafer Measurement of Arrays With University of Michigan, Scale Micromachined Physiological Orthogonal Scanning USA Palladium-Silver Alloy Parameters Directions for Membranes M. Catrysse1,R.Puers1, Wavelength-Selective H.D. Tong1, F.C. Gielens2, C. Hertleer2, 1xN2 Switches T.H. Hoang1, L. Van Langenhove2, J.C. Tsai1, S. Huang1, 1 J.G.E. Gardeniers , H. van Egmond2, D. Hah2, and M.C. Wu1 1 J.W. Berenschot , and D. Matthys2 1University of California M.J.D. Boer1, 1Katholieke Universiteit Los Angeles, USA and H.V. Jansen1, Leuven, BELGIUM and 2ETRI, SOUTH KOREA W. Nijdam1, 1 C.J.M. van Rijn3, Ghent University, and M.C. Elwenspoek1 BELGIUM 1University of Twente, THE NETHERLANDS, 2University of Eindhoven, THE NETHERLANDS, and 3Aquamarijn Micro Filtration B.V., THE NETHERLANDS

9:40 a.m. - 10:20 a.m. Break

RF MEMS II Nano Fluidic Packaging and Physical Manipulation I Encapsulation I Models

10:20 AM - 10:40 AM

4A2.1 4B2.1 4C2.1 4D2.1 Aluminum Nitride Electrowetting-Based Post-Packaging Tuning Reduced Order Modeling Based Thin Film Bulk Actuation for of Microresonators by of Fluid Structural Acoustic Resonator Microinjection Pulsed Laser Deposition Interactions in MEMS Using Germanium K. Hoshino, M. Chiao and L. Lin Based on Modal Sacrificial Layer Etching S. Triteyaprasert, University of California Projection Techniques M. Esashi, M. Hara, K. Matsumoto, Berkeley, USA J.E. Mehner1, W. Doetzel1, J. Kuypers, and T. Abe and I. Shimoyama B. Schauwecker1, Tohoku University, University of Tokyo, and D. Ostergaard3 JAPAN JAPAN 1Chemnitz University of Technology, GERMANY, 2DaimlerChrysler Research Center Ulm, GERMANY, and 3ANSYS Inc., USA

10:40 AM - 11:00 AM 4A2.2 4B2.2 4C2.2 4D2.2 Variable RF MEMS Soft-Printing of Metal to Glass Anodic An Analytical Model for Capacitors With Droplets Digitized by Bonding for the Thermoelastic Extended Tuning Range Electrowetting Microsystems Packaging Actuation of Composite J.R. De Coster1, U.C. Yi and C.J. Kim D. Briand, P. Weber, Diaphragms R. Puers1, University of California and N.F. de Rooij V. Chandrasekaran, H.A.C. Tilmans2, Los Angeles, USA University of Neuchâtel, B.V. Sankar, J.T.M. van Beek3, SWITZERLAND L.N. Cattafesta, T.G.S.M. Rijks3, T. Nishida, M.J.E. Ulenaers3, and M. Sheplak M.L. van Grootel3, University of Florida, USA and P.P.J. van Eerd3 1Katholieke Universiteit Leuven, BELGIUM, 2IMEC, BELGIUM, and 3Philips Research Laboratories, THE NETHERLANDS

53 Transducers ’03 ADVANCE PROGRAM continued

Salon E Salon F Salon G Salon H-K

RF MEMS II Nano Fluidic Packaging and Physical Manipulation I Encapsulation I Models

11:00 AM - 11:20 AM 4A2.3 4B2.3 4C2.3 4D2.3 Integrated 3-Bit A Novel In-Plane Room Temperature Macromodels of 3D RFMEMS Phase Shifters Digitalization of Vacuum Sealing Using Lateral Viscous With Constant Phase Multiphase Microfluid Surface Activated Damping Effects for Shift for Active Phased J.S. Go, M. Kanai, Bonding Method MEMS Devices Array Attennas in and S. Shoji T. Itoh1,H.Okada1, P.-C.Yen and Y.-J. Yang Satellite Broadcasting Waseda University, T. Suga1, H. Takagi2, National Taiwan Systems JAPAN and R. Maeda2 University, TAIWAN Y.J.Ko,J.Y.Park, 1University of Tokyo, and J.U. Bu JAPAN and 2National LG Electronics Institute Institute of Advanced of Technology, SOUTH Industrial Science and KOREA Technology, JAPAN

11:20 AM - 11:40 AM 4A2.4 4B2.4 4C2.4 4D2.4 A MEMS-Based Hybrid Geometry and Surface Incrementally Etched Extraction of Heat Circuit Having Assisted Flow Electrical Feedthroughs Transfer Macromodels Metallized Cavity for Discretization for Wafer-Level Transfer for MEMS Devices Ku-Band Wireless Y.-C. Su and L. Lin of Glass Lid Packages C.-C. Yu and Y.-J. Yang Communication University of California J. Oberhammer National Taiwan S-S. Lee, Y. Yoshida, Berkeley, USA and G. Stemme University, TAIWAN, T. Nishino, Y. Suehiro, Royal Institute of R.O.C. H. Oh-Hashi, T. Fukami, Technology, SWEDEN M. Kimata, and O. Ishida Mitsubishi Electric Co., JAPAN

11:40 AM - 12:00 PM 4A2.5 4B2.5 4C2.5 4D2.5 A 35-60 GHz Silicon-Based Liquid Packaging for A Comprehensive Single-Pole Microcantilevers for MEMS Sensors and RF Analytical and Double-Throw (SPDT) Multiple Biological Devices Numerical Analysis of Switching Circuit Using Sample Deposition P.A. Stupar, Transient and Static Direct Contact MEMS P. Belaubre1, R.L. Borwick, III, Micro Hotplate Switches and Double M. Guirardel1, and J.F. DeNatale Characteristics Resonance Technique V. Leber re 2, Rockwell Scientific F. Solzbacher1, J.-H. Park, S. Lee, A. Dagkessamanskaia2, Company, USA E. Obermeier2, J.-M. Kim, Y. Kwon, E. Trévisiol2, and T. Doll3 and Y.-K. Kim J.M. François2, 1First Sensor Technologie Seoul National J.B. Pourciel3, GmbH, GERMANY, University, R.O. KOREA G. Garcia1, 2Technical University and C. Bergaud1 Berlin, GERMANY, and 1LAAS-CNRS, FRANCE, 3Technical University 2Plateforme Transcriptome, Ilmenau, GERMANY FRANCE, and 3University of Tokyo, JAPAN

12:00 p.m. - 1:30 p.m. Lunch Break

Swan Boats Docked

Transducers ’03 54 ADVANCE PROGRAM continued

Salon E Salon F Salon G Salon H-K

Environmental Nano Fluidic Packaging and Gas Phase Sensors Manipulation II Encapsulation II Microsystems ans Systems 1:30 PM - 1:50 PM 4A3.1 4B3.1 4C3.1 4D3.1 An All-Capacitive Experimental and Thin Film A Micromachined Sensing Chip for Numerical Studies on Encapsulation of Knudsen Pump for On- Temperature, Absolute Micro-Droplet Acceleration Sensors Chip Vacuum Pressure, and Relative Movement Driven by Using Polysilicon S. McNamara Humidity Marangoni Effect Sacrificial Layers and Y.B. Gianchandani A.D. DeHennis Y.T. Tseng, F.G. Tseng, H. Stahl1, A. Hoechst1, University of Michigan, and K.D. Wise and C.-C. Chieng F. Fischer1,L.Metzger1, USA University of Michigan, National Tsing Hua R. Reichebach1, USA University, TAIWAN F. Laermer 1, S. Kronmueller1, K. Breitschwerdt1, R. Gunn2, S. Watcham2, C. Rusu3, and A. Witvrouw3 1Robert Bosch GmbH, GERMANY, 2Surface Technology Sytems plc, UK, and 3IMEC, BELGIUM 1:50 PM - 2:10 PM 4A3.2 4B3.2 4C3.2 4D3.2 Humidity Measurement Capillary Filling of Wafer-Scale Film The Resonant Micro by Dynamic Dew-Point Micro-Reservoirs With Encapsulation of Fan Gas Pump for Detection Various Cross-Sections Micromachined Active Breathing W. Lang1, H. Glosch2, F. Goldschmidtböing, Accelerometers Microchannels S. Billat2, T. Querrioux2, R. Schlosser, W.-T. Park1, R.J. Linderman1, M. Kunze2, M. Ashauer2, S. Schonhardt, R.N. Candler1, O. Nilsen2, and H. Sandmaier3 and P. Woias S. Kronmueller2, and V.M. Bright2 1University of Bremen, University of Freiburg, M. Lutz2, A. Partridge2, 1Swiss Federal Institute GERMANY, 2HSG-IMIT, GERMANY G. Yama2, of Technology - Zurich, GERMANY, and and T.W. Kenny1 SWITZERLAND and 3University of Stuttgart, 1Stanford University, 2University of Colorado, GERMANY USA and 2Robert Bosch USA Corporation, USA

2:10 PM - 2:30 PM 4A3.3 4B3.3 4C3.3 4D3.3 A Miniaturized Low- Numerical Simulations Wafer Scale Microdevice Design and Fabrication Power Wireless Remote of Electrokinetically Transfer/Interconnect: of a Flow Sensor Environmental Generated Micro From a New Integration Detecting Flow Monitoring System Vortices in Method to Its Direction and Velocity Using Microfabricated Microchannels Application in an Seunghyun Kim, Electrochemical A.S.W. Ng, W.L.W. Hau, AFM-Based Data Sunghyun Kim, Sensing Electrodes Y.-K. Lee, and Y. Zohar Storage System Yongduk Kim, K.-S. Yun1,J.Gil1, Hong Kong University of M. Despont1, and Sekwang Park J. Kim1, H.-J. Kim1, Science and Technology, U. Drechsler1,R.Yu2, Kyungpook National K.-H. Kim1,D.Park1, HONG KONG H.B. Pogge2, University, SOUTH J. Kwak2, H. Shin1, and P.Vettiger2 KOREA K. Lee1,J.Kwak1, 1IBM Zurich Research and E. Yoon1 Laboratory, 1Korea Advanced SWITZERLAND and Institute of Science and 2IBM Microelectronics, Technology (KAIST), USA KOREA and 2Cornell University, USA

55 Transducers ’03 ADVANCE PROGRAM continued

Salon E Salon F Salon G Salon H-K

Environmental Nano Fluidic Packaging and Gas Phase Sensors Manipulation II Encapsulation II Microsystems ans Systems 2:30 PM - 2:50 PM 4A3.4 4B3.4 4C3.4 4D3.4 Voltage-Programmable Electric Field Effects on An Integrated Process A Micromachined Knife Biofunctionality in Micro-Channel for Post-Packaging Gate Valve for MEMS Environments Electrophoresis Release and Vacuum High-Flow Pressure Using Electrodeposition C.W. Cheung, Sealing Utilizing Regulation Applications of a Reactive S.K. Kwok, W.H. Lee, Electroplated Nickel W. van der Wijngaart, Polysaccharide Y. Zohar, and M. Wong Packages A.S. Ridgeway, L.-Q. Wu, H. Yi, S. Li, Hong Kong University of B.H. Stark and K. Najafi and G. Stemme J.J.Park,G.W.Rubloff, Science and Technology, University of Michigan, Royal Institute of R. Ghodssi, W.E. Bentley, HONG KONG USA Technology, SWEDEN and G.F. Payne University of Maryland, USA

2:50 PM - 3:10 PM 4A3.5-Late News 4B3.5 4C3.5 4D3.5 Monolithic Fabrication MxN Micro Fluidic Optimization of 0-Level Thermally Driven of Wireless Switches Using Packaging for RF-MEMS Microactuator Miniaturized Quartz Electrokinetic Forces Devices Containing Thermal Crystal Microbalance G.B.Lee,L.M.Fu, A. Jourdain, Isolation Structure (QCM-R) Array for R.J. Yang, and Y.J. Pan X. Rottenberg, With Polyimide and Its Biochemical Sensing National Cheng Kung and H.A.C. Tilmans Application to J. Rabe, V. Seidemann, University, TAIWAN IMEC, BELGIUM Microvalve and S. Buettgenbach H. Kawada, H. Yoshida, Technical University of M. Kamakura, Braunschweig, K. Yoshida, M. Saitou, GERMANY K. Kawahito, and S. Tomonari 4A3.6-Late News Matsushita Electric Compact, Modular Works, Ltd., JAPAN Assembly and Packaging of Multi-Substrate Microsystems A.B. Ucok, J.M. Giachino, and K. Najafi University of Michigan, USA

3:10 p.m. Conference Adjourns

Newbury Cafe

Transducers ’03 56 TRANSDUCERS’03 HOTEL RESERVATION FORM Boston Marriott Copley Place, Boston, Massachusetts, USA

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57 Transducers ’03 TRANSDUCERS’03 REGISTRATION FORM 12th International Conference on Solid-State Sensors and Actuators Boston, Massachusetts, USA • June 8-12, 2003 Registration is an electronic process. To register online for the conference, please visit the website www.transducers03.org If you are unable to register online, complete this form and mail to the address on page two of this form. To ensure your registration, please complete all sections below. PLEASE TYPE OR PRINT CLEARLY Conference Presenter Region: Americas Asia/Oceania Europe/Africa Salutation: Dr. Prof. Mr. Mrs. Ms.

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Continued on other side Transducers ’03 58 TRANSDUCERS’03 REGISTRATION FORM 12th International Conference on Solid-State Sensors and Actuators Boston, Massachusetts, USA • June 8-12, 2003 Page Two

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Transducers ’03 59