Product Overview Heraeus Electronics - Assembly Materials Solder Powder High Quality Solder Powder

Precision in Production On Line Continuous Process A background of 20 years in production of fine metallic powders, allows Heraeus to custom design, build and improve powder, and also the production equipment. Smelter Heraeus is supported by a group of scientists from the most prestigious R&D institutions and universities. This constantly upgraded process is fully automatic Supervision to reduce all human intervention. Moreover, the whole production flow – from alloy melting to powder packing – is under a strict control of humidity and temperature, so that variations of outside conditions do not affect the final product. Heraeus solder powder products are performing an Granulation extraordinary function in the solder paste application. Heraeus is the only company that is ready to deliver not only the finished solder paste, but also the crucial solder powders to customers and even to competitors.

Automatic on line process ensuring High product consistency Higher productivity = lower production costs = competitive prices Safe & clean working environment High quality Sieving Pure & homogeneous alloy Low Oxide content Uniform microstructure High spherical shape

Online Quality Management System Recycling A pragmatic ISO 9001 / 14001 quality management system is based on: A strict statistical process control of each production step of the results Ongoing training of our staff to ensure high level Packing of qualification Periodic cross checking with external and customers’ labs to enhance the common expertise.

Process Control Powder Consistency

Pb Pb O Pb Pb C Pb Pb Pb 1 2 3 4 5 6 7 8 9 10 11 12 13

O Sn Sn C Si Sn Sn

1 2 3 4 5 6 7 8 9 10

Typical lot to lot consistency High spherical shape – Uniform and homogeneous microstructure

Alloys

Alloy Melting point Melting point Melting point Melting point Alloy Tin lead/lead based °C °F °C °F

Sn43Pb43Bi14 144/163 291/325 Sn42Bi58 138 280 Sn62Pb36Ag2 179 355 Sn96.5Ag3.0Cu0.5 217/221 423/430 Sn57Pb40Bi3 179/183 355/361 Sn96.5Ag3.5 221 430 Sn62.8Pb36.8Ag0.4 181/183 358/361 Sn95Ag5 221/245 430/473 Sn63Pb37 183 361 Sn99.3Cu0.7 227 441 Sn10Pb90 268/299 514/570 Sn97Cu3 227/300 441/572 Sn10Pb88Ag2 268/301 514/574 Sn100 232 450 Sn5Pb92.5Ag2.5 287/296 549/565 Sn95 Sb5 232/240 450/464 Sn5Pb92.5Ag1.5 296/301 565/574

Other alloys on request. Above table lists only the most usual alloys.

Size distributions Particle Size Spectrum Class 3

Type Size 30% 100% Type 2 45 – 75 µm Type 2.5 38 – 53 µm 10% 50% Type 3 25 – 45 µm Type 4 20 – 38 µm Type 5 15 – 25 µm 0% 0% 0 10 20 30 40 50 60 70 Type 6 5 – 15 µm Size [µm] Special distributions on request

Due to the Heraeus manufacturing method we are able With our R&D department we are constantly improving to produce every alloy with melting points from 100 to our production process to offer odd alloys e.g. SAC+NiGe. 320 °C, in classes 2 to 5. www.heraeus-electronics.com 63450 Hanau,Germany Heraeusstraße 12-14 Heraeus DeutschlandGmbH&Co.KG Heraeus Electronics any The The possession. patent descriptions

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