Product Brief
MAGIK-2 Family M2-SQ2-xx – Snapdragon SD210 SMARC Module
Product Brief ------
M2-SQ2-xx - Snapdragon based SMARC Module
Using the new SMARC standard 2.0 for embedded The modules come with a complete software suite modules, TESSOLVEEMBEDDED SYSTEMS introduces with unique differentiators (details below), ultra-low power ARM COMs (Computer-On-Module) including Device Drivers, BSP and support for Android based on the Qualcomm Snapdragon Family which is 7.1. powered by ARM Cortex-A7 quad-core application CPU. TESSOLVE leverages its vast experience of TESSOLVE delivers application specific carrier boards product development in the area of embedded along with reference software for related system multimedia systems for professional applications and solutions in the area of HMI units like tablets or systems combining audio/video, graphics and HMI. similar.
Target applications for MAGIK2 ARM COMs are HMI Product development made easy, with the industry units for machines and vehicles, Industrial Tablets, leading complete system solution packages from and Multimedia/ Infotainment applications in TESSOLVE, is a clear differentiator! avionics or transportation environment.
Figure 1: SD210 SOM
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Copyright TESSOLVE 2017 www.tessolve.com Product Brief
MAGIK-2 Family M2-SQ2-xx – Snapdragon SD210 SMARC Module
The M2-SQ2-xx modules are available in Quad Core CPU with wide variety of IO feature sets.
Technical Information
Module Name M2-SQ2-4Q QUALCOMM Snapdragon SD210
ARM Cortex-A7 Processor Quad core Upto 1.3 GHz
Adreno 304 GPU; 3D graphics Graphics accelerator (up to 409.6 MHz)
Memory LPDDR3,upto 2GB (x32 bits)
Flash 16GB eMMC 4.5
Display Interface 1x LVDS
1x MIPI CSI ( 2 lane) Camera 1x MIPI CSI ( 1 lane)
Audio 1x I2S
SD/MMC 1x SDIO/MMC(4 bits)
Wi-Fi 802.11 a/b/g/n Wi-Fi/BT/FM BT V4.0 LE FM receive GNSS GPS, GLONAS
USB 1x USB 2.0 OTG
3x I2C 1x SPI Other Interfaces 1x UART 12x GPIO
Operating Voltage Range 5V Temperature Range -30 Deg C to +85 Deg C Form Factor 82mmx50mm
RoHS
RoHS Compliant
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Copyright TESSOLVE 2017 www.tessolve.com Product Brief
MAGIK-2 Family M2-SQ2-xx – Snapdragon SD210 SMARC Module
Module Architecture Diagram
LPDDR3 SDRAM DDR3(32 bit) MIPI DSI DSI LVDS MMDC MIPI_DSI TO LVDS Size:2 GB MIPI CSI X 2LANE MIPI_CSI0
SDIO X8 bit SDC1 eMMC MIPI CSI X 1LANE MIPI_CSI1 Size:16 GB SDIO X 1 SDC2
SPI X 1 BLSP
UART X 2 BLSP
I2C X 3 BLSP
WiFi+BT WiFi WLAN DAC’s GPIO X 12 GPIO’s RF Wi-Fi/BT/FM FRON
Module BT FM T END Dsc,SSBI I2S X 1
MI2S E
G
R
D
)
E
O
T
FM N I
Dsc,SSBI B
C
P
C
USB HOST X 1 E P
USB HS 4
N
1
C
N
3
( R
FORCED_USB_BOOT O
A
C
M S RESET_OUT
GPS RF CARRIER_PWRP_ON FRON GPS GNSS Sub System T END BOOT_SEL
VCC 5V
RESET_IN PMIC POWER_BTN
Application Processor
Figure 2: SD210 SOM Block Diagram
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Copyright TESSOLVE 2017 www.tessolve.com Product Brief
MAGIK-2 Family M2-SQ2-xx – Snapdragon SD210 SMARC Module
Included Software Packages – TESSOLVE Differentiators !
TESSOLVE provides ready to use SDK for evaluation and application development. The section below lists high level details on the included software packages.
Board Support Packages (BSP) available for Android Linux Kernel Version: 3.10 Operating System :Android(Nougat 7.1)
Ordering Information
Article Part No**. Description
MAGIK 2 SMARC Module M2-SQ2A-4Q1G-2G-16G-C-S SD210 Quad, 1.3GHz, 2GB RAM, 16GBytes Flash, Commercial Grade, 80mmx52mm
**Contact TESSOLVE for other possible memory and temperature configurations
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Phone: +91-80-66995800 Phone: +33 (0)4 28 29 08 00 / +33 (0)6 37 30 37 32 Email: [email protected] Email: [email protected]
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Phone: +65 6297-9613 Phone: +1 408-865-0873 Fax: +65 6295-6355 Fax: +1 408-865-0896 Email: [email protected] Email: [email protected]
For inquiries from all other countries / regions, please contact our HQ in India
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