SFF-8482 Rev 2.5

This document was developed by the SFF Committee prior to it becoming the SFF TA (Technology Affiliate) TWG (Technical Working Group) of the SNIA (Storage Networking Industry Association) in 2016.

The information below should be used instead of the equivalent herein.

POINTS OF CONTACT: SFF TA TWG Chair Email: [email protected]. LOCATION OF SFF DOCUMENTS: http://www.snia.org/sff/specifications. Suggestions for improvement of this specification are welcome and should be submitted to http://www.snia.org/feedback. If you are interested in participating in the activities of the SFF TA TWG, additional information and the membership application can be found at: http://www.snia.org/sff.

PUBLISHED SFF-8482 Rev 2.5

SFF Committee documentation may be purchased in electronic form. SFF specifications are available at ftp://ftp.seagate.com/sff

SFF Committee

SFF-8482

Specification for

Serial Attachment 2X Unshielded Connector

Rev 2.5 August 31, 2018

Secretariat: SFF Committee

Abstract: This specification defines an Unshielded dual lane Input/Output connector for serial interface unshielded devices, backplanes and cables.

There are multiple using generations based on performance.

3 Gb/s SFF-8678 12 Gb/s SFF-8680 24 Gb/s SFF-8681

This specification provides a common reference for systems manufacturers, system integrators, and suppliers. This is an internal working specification of the SFF Committee, an industry ad hoc group.

This specification is made available for public review, and written comments are solicited from readers. Comments received by the members will be considered for inclusion in future revisions of this specification.

The description of a connector in this specification does not assure that the specific component is actually available from connector suppliers. If such a connector is supplied it must comply with this specification to achieve interoperability between suppliers.

Support: This specification is supported by the identified member companies of the SFF Committee.

POINTS OF CONTACT:

Jay Neer I. Dal Allan Industry Standards Manager Chairman SFF Committee Molex 14426 Black Walnut Court 2222 Wellington Court Saratoga, CA 95070 Lisle, Il 60532

561-447-2907 408-867-6630 [email protected] [email protected]

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EXPRESSION OF SUPPORT BY MANUFACTURERS

The following member companies of the SFF Committee voted in favor of this industry specification.

Adaptec IBM Amphenol Intel Comax LSI Dell MGE Dell Computer Molex EMC NetApp ENDL Sandisk FCI Seagate Foxconn Sun Microsystems Fujitsu CPA TE Connectivity Hewlett Packard Unisys HGST Volex Hitachi Cable Western Digital Hitachi GST

The following SFF member companies voted no on the technical content of this industry specification.

All Best Technique

The following member companies of the SFF Committee voted to abstain on this industry specification.

Amphenol Maxtor Avago Micrel Brocade Nexans Emulex Oclaro FCI Panduit Fiberxon Picolight Finisar Pioneer Foxconn Sumitomo Fujitsu Components Toshiba Infineon Toshiba America LSI TriQuint Luxshare-ICT Vitesse Semiconductor Madison Cable Xyratex

The user's attention is called to the possibility that implementation to this Specification may require use of an invention covered by patent rights. By distribution of this specification, no position is taken with respect to the validity of a claim or claims or of any patent rights in connection therewith. Members of the SFF Committee which advise that a patent exists are required to provide a statement of willingness to grant a license under these rights on reasonable and non-discriminatory terms and conditions to applicants desiring to obtain such a license.

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Change History

Revision 2.3 - Edited out symbols because of reports that a few were not being displayed on screen correctly by some PDF readers. - Clarified first and second stage content in 5.1 per request.

Revision 2.4 - p2 reflects support of SFF-8482 and SFF-8680 - Body replaced by SFF-8680 mechanical content which had enhanced host board solder pads and attachment specifications. Previous history of SFF-8680: - Footprints of SFF-8482 and SFF-8680 defined as Appendixes - SFF-8680 1.5 o Adopted common representation for SFF-8630/SFF-8639/SFF-8680 Table 6-x Performance Requirements Appendix A introductory paragraphs - SFF-8680 1.6 o Corrected Abstract EIA-966 reference to be formerly SFF-8482 - SFF-8680 1.7 o Editorial update to auto-generate Appendix in headings and TOC. - SFF-8680 1.8 o Added EIA reference for Temperature Rise in Electrical Requirements Table - SFF-8680 1.9 o Added additional footprints to Appendix A 1. Through-hole (Figure A-3) 2. Hybrid (Figure A-4)

Rev 2.5 (August 31, 2018) - Document to be withdrawn from EIA; other than the changes to the header and cover page, no content or formatting changes have been made since Rev 2.4 of this document.

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Foreword

The development work on this specification was done by the SFF Committee, an industry group. The membership of the committee since its formation in August 1990 has included a mix of companies which are leaders across the industry.

When 2 1/2" diameter disk drives were introduced, there was no commonality on external dimensions e.g. physical size, mounting locations, connector type, and connector location, between vendors.

The first use of these disk drives was in specific applications such as laptop portable computers and system integrators worked individually with vendors to develop the packaging. The result was wide diversity, and incompatibility.

The problems faced by integrators, device suppliers, and component suppliers led to the formation of the SFF Committee as an industry ad hoc group to address the marketing and engineering considerations of the emerging new technology.

During the development of the form factor definitions, other activities were suggested because participants in the SFF Committee faced more problems than the physical form factors of disk drives. In November 1992, the charter was expanded to address any issues of general interest and concern to the storage industry. The SFF Committee became a forum for resolving industry issues that are either not addressed by the standards process or need an immediate solution.

Those companies which have agreed to support a specification are identified in the first pages of each SFF Specification. Industry consensus is not an essential requirement to publish an SFF Specification because it is recognized that in an emerging product area, there is room for more than one approach. By making the documentation on competing proposals available, an integrator can examine the alternatives available and select the product that is felt to be most suitable.

SFF Committee meetings are held during T10 weeks (see www.t10.org), and Specific Subject Working Groups are held at the convenience of the participants. Material presented at SFF Committee meetings becomes public domain, and there are no restrictions on the open mailing of material presented at committee meetings.

Most of the specifications developed by the SFF Committee have either been incorporated into standards or adopted as standards by EIA (Electronic Industries Association), ANSI (American National Standards Institute) and IEC (International Electrotechnical Commission).

If you are interested in participating or wish to follow the activities of the SFF Committee, the signup for membership and/or documentation can be found at: www.sffcommittee.com/ie/join.html

The complete list of SFF Specifications which have been completed or are currently being worked on by the SFF Committee can be found at: ftp://ftp.seagate.com/sff/SFF-8000.TXT

If you wish to know more about the SFF Committee, the principles which guide the activities can be found at: ftp://ftp.seagate.com/sff/SFF-8032.TXT

Suggestions for improvement of this specification will be welcome. They should be sent to the SFF Committee, 14426 Black Walnut Ct, Saratoga, CA 95070.

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CONTENTS

1. Scope 6 1.1 Application Specific Criteria 6

2. References 6 2.1 Industry Documents 6 2.2 SFF Specifications 6 2.3 Sources 6 2.4 Conventions 6 2.5 Definitions 6

3. General Description 8

4. Dimensioning Requirements 9 4.1 Connector Interface 9 4.2 General Tolerances 9

5. Backplane Fixed (Receptacle) Interface Features 15 5.1 Blind Mating 15 5.2 Device to Backplane Location 16 5.3 Hot Plugging 17

6. Ratings 19 6.1 Current 19 6.2 Temperature 19

7. General Connector Performance Requirements 19

A. Appendix (Informative): Receptacle PCB Footprints (High Performance) 21

B. Appendix (Informative): Receptacle PCB Footprints 23

FIGURES Figure 2-1 Mating Side Gender 7 Figure 3-1 General Views 8 Figure 4-1 Device Free (Plug) Connector 10 Figure 4-2 Device Free (Plug) Connector Detail and Section View 11 Figure 4-3 Backplane Fixed (Receptacle) Connector 12 Figure 4-4 Backplane Fixed (Receptacle) Connector Section View 13 Figure 4-5 Cable Fixed (Receptacle) Connector 14 Figure 5-1 Blind Mate Tolerance Zones 16 Figure 5-2 Device to Backplane Location 16

Figure_ A-1 Printed Circuit Board Detail Surface Mount 21 Figure_ A-2 Printed Circuit Board Detail Alternate Surface Mount 21 Figure_ A-3 Printed Circuit Board Detail Through Hole 22 Figure_ A-4 Printed Circuit Board Detail Hybrid 22 Figure_ B-1 Through Hole Printed Circuit Board Detail (Press Fit & Solder Pin) 23 Figure_ B-2 Surface Mount Printed Circuit Board Detail 23 Figure_ B-3 Hybrid Printed Circuit Board Detail 24

TABLES Table 5-1 Hot Plug Contact Sequencing 18 Table 7-1 Electrical Requirements 19 Table 7-2 Mechanical Requirements 20 Table 7-3 Environmental Requirements 20

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SFF Committee --

Serial Attachment 2X Unshielded Connector

1. Scope This specification defines the mechanical and connector contact performance requirements for a composite connector system. This composite system is designed to support high speed serial signals and power on different contacts within the same housing. 1.1 Application Specific Criteria Intended applications for this connector system include Serial Attached SCSI (SAS) as specified by the T10 standards and for other applications requiring such a connector system.

2. References

2.1 Industry Documents The following interface standards are relevant to this SFF Specification.

- ASME Y14.5M Dimensioning and Tolerancing - EIA-364-D Electrical Connector/Socket Test Procedures Including Environmental Classifications (see Section 7 for relevant test procedures) - INCITS 478 Serial Attached SCSI 2.1 (SAS-2.1) - INCITS 519 Serial Attached SCSI - 3 (SAS-3) - INCITS 534 Serial Attached SCSI - 4 (SAS-4) - SFF-8223 2.5 inch Form Factor Drive w/Serial Attached Connector (EIA-720) - SFF-8323 3.5 inch Form Factor Drive w/Serial Attached Connector (EIA-740) - SFF-8678 Serial Attachment 2X 3 Gb/s Unshielded Connector - SFF-8680 Serial Attachment 2X 12 Gb/s Unshielded Connector - SFF-8681 Serial Attachment 2X 24 Gb/s Unshielded Connector 2.2 SFF Specifications There are several projects active within the SFF Committee. The complete list of specifications which have been completed or are still being worked on are listed in the specification at ftp://ftp.seagate.com/sff/SFF-8000.TXT 2.3 Sources Those who join the SFF Committee as an Observer or Member receive electronic copies of the minutes and SFF specifications (http://www.sffcommittee.com/ie/join.html).

Copies of ANSI standards may be purchased from the InterNational Committee for Information Technology Standards (http://www.techstreet.com/incitsgate.tmpl). 2.4 Conventions The ISO convention of numbering is used i.e., the thousands and higher multiples are separated by a space and a period is used as the decimal point. This is equivalent to the English/American convention of a comma and a period.

American French ISO 0.6 0,6 0.6 1,000 1 000 1 000 1,323,462.9 1 323 462,9 1 323 462.9

2.5 Definitions For the purpose of SFF Specifications, the following definitions apply:

Fixed: Used to describe the gender of the mating side of the connector that accepts

Serial Attachment 2X Unshielded Connector Page 6 PUBLISHED SFF-8482 Rev 2.5 its mate upon mating. This gender is frequently, but not always, associated with the common terminology "receptacle". Other terms commonly used are "female" and "socket connector". The term "fixed" is adopted from EIA standard terminology as the gender that most commonly exists on the fixed end of a connection, for example, on the board or bulkhead side.

In this specification "fixed" is specifically used to describe the mating side gender illustrated in Figure 3-1 as Backplane "Fixed" (receptacle)and Cable "Fixed" (receptacle).

Fixed Board: A connector that uses a fixed gender mating side and a termination side suitable for any of the printed circuit board termination technologies

Free: Used to describe the gender of the mating side of the connector that penetrates its mate upon mating. This gender is frequently, but not always, associated with the common terminology "plug". Other terms commonly used are "male" and "pin connector". The term "free" is adopted from EIA standard terminology as the gender that most commonly exists on the free end of a connection, for example, on the cable side.

In this specification "free" is specifically used to describe the mating side gender illustrated in Figure 3-1 as Device "Free" (plug).

Free Board: A connector that uses a free gender mating side and a termination side suitable for any of the printed circuit board termination technologies

Mating side: The side of the connector that joins and separates from the mating side of a connector of opposite gender. Other terms commonly used in the industry are mating interface, separable interface and mating face.

FIGURE 2-1 MATING SIDE GENDER

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3. General Description This connector system is designed to allow devices to connect to cable assemblies or to PCB's with the same device connector interface.

The device free (plug) interface incorporates three different contact sets (CS). Two of these sets (CS1 and CS2) contain 7 contacts each and typically are used for high speed serial signals. The high speed signals are grouped into differential pairs flanked with Grounds (G-S-S-G-S-S-G). The third set (CS3) contains 15 contacts and typically would be used for low frequency purposes such as power and control.

The backplane fixed (receptacle) interface supports device free (plug) interfaces which have CS1 and CS3 only or has all CS1, CS2 and CS3 contacts. Blind mating is supported by the guides built into the mating interface and a provision for hot plugging is supported by the contact sequencing that is possible by using the offset contact positions.

There is no provision for positive mating interface retention latching in the backplane fixed version.

FIGURE 3-1 GENERAL VIEWS

The cable fixed (receptacle) supports device free (plug) interfaces which have CS1 and CS3 only or has all CS1, CS2 and CS3 contacts. The cable fixed (receptacle) interface incorporates a passive latching retention system to prevent accidental disconnection of the interface.

For cabled backplane implementation, the cable connector shall provide all feature requirements of the backplane fixed (receptacle)in addition to the passive cable retention defined.

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4. Dimensioning Requirements

4.1 Connector Interface All dimensional requirements for the connector within this specification must be met in order to provide intermateability between plug and receptacle and to fit within the physical boundaries required by the media and backplane. 4.2 General Tolerances Unless otherwise shown, the following tolerances apply to the figures:

2 Place dimension = +/-0.20mm Angular dimension = +/-3 degrees

The range of characteristics supported is indicative of the environment of use.

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FIGURE 4-1 DEVICE FREE (PLUG) CONNECTOR

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FIGURE 4-2 DEVICE FREE (PLUG) CONNECTOR DETAIL AND SECTION VIEW

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FIGURE 4-3 BACKPLANE FIXED (RECEPTACLE) CONNECTOR

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FIGURE 4-4 BACKPLANE FIXED (RECEPTACLE) CONNECTOR SECTION VIEW

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FIGURE 4-5 CABLE FIXED (RECEPTACLE) CONNECTOR

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5. Backplane Fixed (Receptacle) Interface Features

5.1 Blind Mating The process of mating an unshielded serial attachment connector pair should be accomplished in a "free fit" manner where no excessive mechanical stresses are placed on the connectors during or after the mating process. The mating process should be considered in the context of the packaging surrounding the device with the connectors. Stresses considered include those transmitted to the mated connector through the device: for example, the weight of the drive, that resulting from resilient device guide members in the enclosure, the device retention mechanism, acceleration stresses (mechanical shock testing) and interference with enclosure parts. Mechanical interference between the device with the mated connectors and fixed or solid parts of the packaging will generally not be tolerated by the unshielded serial connector attachment system.

The mating interface specifications require a two stage process to arrive at the Final mated contact:

- The first stage must be delivered by the device enclosure system to achieve center to center alignment of less than 1.5 mm in the longitudinal axis and less than 1.0 mm in the horizontal axis prior to any part of the connector pair engaging. This is the blind mate tolerance zone depicted in Figure 5-1.

- The second stage (incorporated within connector blind mate pre-alignment features) positions the connectors from +/-1.5 mm / +/-1.0 mm at initial engagement through to a point where the main connector chamfers engage (normal connector engagement)

System/Application designers should recognize that certain lateral movement between free gender contacts and fixed gender contacts may occur between the time the pre- alignment features engage and the contacts reach the final mated position. The positional requirements in Figure 5-2 define the fully mated condition.

CAUTION: When mating unshielded serial attachment connectors without the aid of guide rails (or other pre-mating guiding systems not part of the connector) there is a risk of shorting signals to power. This event may damage the devices on either side of the connector.

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FIGURE 5-1 BLIND MATE TOLERANCE ZONES

5.2 Device to Backplane Location In order to guarantee minimum contact engagement is provided in a backplane system, the position of the device connector interface must be controlled relative to the Backplane surface as shown in Figure 5-2. Device clearances vary by Form Factor, see the appropriate Form Factor Specifications for connector location with respect to each Form Factor.

FIGURE 5-2 DEVICE TO BACKPLANE LOCATION

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5.3 Hot Plugging In order to facilitate hot plugging of a device into a powered backplane, the Backplane fixed (Receptacle) & Device free (plug) interface is designed to provide a 3 level contact engagement sequence. By specifying an offset between key contacts on each side of the mating interface, the mating sequence of these contacts is timed to occur in the proper order. There are 2 pins located in CS3 of the Backplane fixed (receptacle) interface that are advanced 0.50mm nominal from all other contact pins on this side of the interface. These pin locations represent the 1st level of mating upon insertion of the Device. The 2nd level of mating is established when the forward group of contacts located in the CSs of the Device free (plug) interface penetrate 0.50mm nominal into the Backplane fixed (receptacle) interface. The remaining contacts of the Device free (plug) interface are set back 0.50mm nominal and will be the last contacts to mate. In order to maintain this sequence, sufficient tolerance has been designed into the interface to allow for manufacturing and alignment of the device to the enclosure – see section 5.1. The pin locations for the long & short contacts on both sides of the interface are defined in Table 5-1.

Hot plugging of cables is not supported by this interface.

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TABLE 5-1 HOT PLUG CONTACT SEQUENCING

Device Free (Plug) Interface Backplane Fixed (Receptacle) Interface

S1 S1 S2 S2 S3 S3 S4 S4 S5 S5 S6 S6 S7 S7 S8 S8 S9 S9 S10 S10 S11 S11 S12 S12 S13 S13 S14 S14 P1 P1 P2 P2 P3 P3 P4 P4 P5 P5 P6 P6 P7 P7 P8 P8 P9 P9 P10 P10 P11 P11 P12 P12 P13 P13 P14 P14 P15 P15 <-0.50mm-> <-0.50mm->

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6. Ratings

6.1 Current Power section (per pin): - Continuous Current 1.5 A - Peak Current 2.5A 1.5 s - Peak Current Pre-charge 6A 1 ms

Signal section (per pin) - Continuous Current 500 mA 6.2 Temperature Operating 0° C to 55° C Non-operating -40° C to 85° C

7. General Connector Performance Requirements The General Electrical, Mechanical and Environmental requirements for mating connectors are listed in the tables.

See section 1.2 for the Electrical Performance requirements for this connector solution.

TABLE 7-1 ELECTRICAL REQUIREMENTS Description Requirement Procedure Low Level 30 milliohms EIA-364-23: Contact maximum for signal Mate connectors and apply a maximum voltage of Resistance contacts (initial) 20 mV and a current of 100 mA Insulation 1000 Megaohms EIA 364-21: Resistance minimum Apply a voltage of 500 VDC for 1 minute between adjacent terminals Dielectric No breakdown or EIA 364-20, method B: Withstanding flashover Apply a voltage of 500 VAC for 1 minute Voltage between adjacent terminals Temperature Temperature rise EIA-364-70B: Rise (via shall not exceed Wire contact pins P1, P2, P8 and P9 in current 30C degrees parallel for power cycling) Power Wire contact pins P4, P5, P6, P10 and P12 in section only parallel for return (P1 thru P15) Supply 6 Amp total DC current to the power pins in parallel, returning from the parallel ground pins Measure and record the temperature after 96 hours (45 minutes ON and 15 minutes OFF per hour) in ambient condition of 25C still air

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TABLE 7-2 MECHANICAL REQUIREMENTS Description Requirement Procedure Mechanical Discontinuity <1 EIA-364-27 Shock microsecond 15 Subject mated connectors to 50G’s half-sine milliohm maximum shock pulses of 11 milliseconds duration in change from initial each X,Y and Z axis (18 shocks total) Contact Resistance Random Discontinuity <1 EIA-364-28, Test Condition VII Vibration microsecond Subject mated connectors to 3.10G’s RMS 15 milliohm maximum between 20-500 Hz for 15 minutes in each of 3 change from initial mutually perpendicular planes Contact Resistance Durability No damage EIA 364-09: 15 milliohm maximum Mate and unmate connectors at a maximum rate change from initial of 200 cycles per hour Contact Resistance Backplane - 500 Cycles Cable - 25 Cycles Connector Mate Backplane EIA 364-13: and Unmate Mate - 25N max Mate and unmate connectors at a rate of 25mm Forces Unmate - 5N min per minute Cable Mate - 50N max Unmate - 20N min Initial and after durability

TABLE 7-3 ENVIRONMENTAL REQUIREMENTS Description Requirement Procedure Thermal Shock No damage EIA 364-32, Test Condition I: 15 milliohm maximum Subject mated connectors to 10 cycles between change from initial minus 55C and plus 85C degrees Contact Resistance Temperature No damage EIA 364-17, Test Condition III, Method A, Test Life 15 milliohm maximum Time Condition C: change from initial Subject mated connectors to 85C for 500 hours Contact Resistance Mixed Flowing No damage EIA 364-65, Class IIA: (4 Gas) Gas 15 milliohm maximum Expose half of samples unmated for 7 days and change from initial then mated for 7 days. The other half are Contact Resistance exposed mated for full 14 day test period. Humidity No damage EIA 364-31, Method II, Test Condition A: 15 milliohm maximum Subject mated connectors to 96 hours at 40C change from initial degrees with 90-95% relative humidity per Contact Resistance

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A. Appendix (Informative): Receptacle PCB Footprints (High Performance) The PCB footprint has an impact on the Signal Integrity (SI) performance of the connector system and the actual geometry may vary between different vendor implementations. Being an example, the footprint may not meet the necessary SI performance for all vendor implementations, and it is not a requirement of this specification.

Note: This specification does not address the electrical performance characteristics of the host Printed Circuit Board (PCB) material and construction used in these applications. The PCB thickness, number of layers, layer stack up, trace layer location(s), copper plane anti-pads, etc., as all are major contributors to the final electrical characteristics of each unique application of the connector.

FIGURE_ A-1 PRINTED CIRCUIT BOARD DETAIL SURFACE MOUNT

FIGURE_ A-2 PRINTED CIRCUIT BOARD DETAIL ALTERNATE SURFACE MOUNT

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FIGURE_ A-3 PRINTED CIRCUIT BOARD DETAIL THROUGH HOLE (Press Fit & Solder Pin)

FIGURE_ A-4 PRINTED CIRCUIT BOARD DETAIL HYBRID

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B. Appendix (Informative): Receptacle PCB Footprints These footprint examples suit the performance defined by SFF-8678.

FIGURE_ B-1 THROUGH HOLE PRINTED CIRCUIT BOARD DETAIL (PRESS FIT & SOLDER PIN)

FIGURE_ B-2 SURFACE MOUNT PRINTED CIRCUIT BOARD DETAIL

Pad widths listed as reference dimensions are left open to the manufacturer to determine based on their internal design standards. In order to determine the pad widths for Surface Mount leads the following dimensions and tolerances apply: Solder Leads on 1.27mm spacing = 0.40 +/- 0.08mm Solder Leads on 0.80mm spacing = 0.30 +/- 0.05mm

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FIGURE_ B-3 HYBRID PRINTED CIRCUIT BOARD DETAIL

Hole sizes listed as reference dimensions are left open to the manufacturer to determine based on their internal design standards. In order to determine the hole diameter for Solder Pins the following pin width dimensions and tolerances apply: Solder Pins on 1.27mm spacing = 0.40 +/- 0.08mm Solder Pins on 0.80mm spacing = 0.40 +/- 0.08mm

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