REVERSEREVERSE COSTING COSTING® –®STRUCTURE?– STRUCTURAL, PROCESS PROCESS AND & COST REPORT
Qualcomm Snapdragon 888 System on Chip withCLICK 5G TO Modem EDIT MASTER TITLE STYLE Deep dive analysis of Qualcomm’s SoC architecture using Samsung 5nm process technology. SP21612 - IC Report by Belinda Dube & Don Scansen Physical analysis by Veronique Le Troadec May 2021 - Sample 22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr ©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 1 Table of Contents
Overview / Introduction 4 Manufacturing Process 122 o Executive Summary o Snapdragon 888 DoC Die Front-End Process & Fabrication Unit o Reverse Costing Methodology o DRAM Memory Process & Fabrication Unit Company Profile 8 o Final Test & Packaging Fabrication Unit o Package Assembly Flow Physical Analysis 21 o Summary of the Physical Analysis 22 Cost Analysis 131 o o Smartphone Disassembly 26 Summary of the Cost Analysis 132 o Yields Explanation & Hypotheses 134 o Qualcomm Snapdragon and Memory Package 28 o ✓ Package Views Memory DRAM Component 136 ✓ ✓ Package CT –Scan 3D Xray Images Memory Die Front-End Cost ✓ ✓ Package Cross Section 1 Memory Component & Packaging Cost ✓ Package Cross Section 2 o Snapdragon SoC die 141 ✓ Package Cross Section 3 ✓ Wafer & Die Front-End Cost ✓ o DRAM Memory Analysis 59 Die Probe Test, Thinning & Dicing ✓ ✓ Memory Package Views Die Wafer Cost ✓ ✓ Memory Package Cross Section Die Cost ✓ ✓ Memory Die Analysis Packaging and Test Cost ✓ Memory Die Cross Section ✓ Memory Process Selling price 147 o Qualcomm Snapdragon 888 76 Feedback 151 ✓ Package Views Related Analyses 153 ✓ Package Cross Section System Plus Consulting Services 155 ✓ Snapdragon 888 Die ✓ Snapdragon 888 Die Cross Section ✓ Delayering ✓ FEOL (Front End of line) Floor Plan 105
©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 2 Executive Summary
Overview / Introduction o Executive Summary Qualcomm has introduced its latest and most advanced system-on-chip (SoC), the Snapdragon 888, a powerful o Reverse Costing Methodology processor chip targeting flagship mobile phones. The Xiaomi Mi11 is the first smartphone to use the Snapdragon 888 o Glossary 5G Mobile Platform, and many others will follow. The Snapdragon 888 is the first SoC to integrate 5G modem Company Profile & Supply functionality with processing cores rather than being a separate component. Chain Qualcomm switched its foundry supply back to Samsung for the Snapdragon 888 SoC. This device is the first Qualcomm Physical Analysis product produced on the latest 5 nm process technology. The foundry shift by Qualcomm will continue the FloorPlan competition between Samsung and TSMC. FEOL The 5 nm patterning process is advantageous for power efficiency, exceptional 5G multi gigabit speeds and improved battery life. The Snapdragon 888 architecture is complex, designed to cater to machine learning, image processing, Manufacturing Process Flow gaming and 5G modem applications. Qualcomm claims that devices powered by the chip can capture multiple high Cost Analysis resolution video streams simultaneously. Selling Price Analysis To reveal the details of Qualcomm’s SoC, this report includes a detailed physical analysis that reveals the SoC floorplan to understand the chip architecture and the IP block areas. Significant die area is devoted to the GPU, 5G Modem and Related Analyses machine learning core. The report includes a complete construction analysis using SEM cross-sections, material About System Plus analyses and delayering. Also, a front-end of line analysis uses high-resolution TEM images to provide detail of the channel structure and materials. For the 5nm technology generation, the channel material is critical and a switch to a high mobility channel for the PMOS finFETs is underway for all wafer foundries. The back-end analysis uses CT scan 3D X-Ray to reveal the layout structure of the package including an external LPDDR5 memory package that is attached over the Snapdragon 888 package. The cost estimation includes the SoC front end process, packaging, and the component cost.
SPR21612 ©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 3 Summary of the Physical Analysis
Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Package Disassembly o Xiaomi Mi11 Teardown o Package Assembly o Views & Dimensions o Package X-Ray o Package Cross-Section o DRAM Memory o Package Views & Dimensions o Package Cross Section & Opening o Die Analysis o Snapdragon 888 SoC o Package View o Package Cross Section o Die Views o Delayering&Process o Cross-section o FEOL FloorPlan Manufacturing Process Flow Cost Analysis Selling Price Analysis Related Analyses
©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 4 Xiaomi Mi11 Main Board
Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Package Disassembly o Xiaomi Mi11 Teardown o Package Assembly o Views & Dimensions o Package X-Ray o Package Cross-Section o DRAM Memory o Package Views & Dimensions o Package Cross Section & Opening o Die Analysis o Snapdragon 888 SoC o Package View o Package Cross Section o Die Views o Delayering&Process o Cross-section o FEOL FloorPlan Manufacturing Process Flow Cost Analysis Selling Price Analysis Related Analyses
©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 5 Snapdragon 888 SoC FLI Map
Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Package Disassembly o Xiaomi Mi11 Teardown o Package Assembly o Views & Dimensions o Package X-Ray o Package Cross-Section o DRAM Memory o Package Views & Dimensions o Package Cross Section & Opening o Die Analysis o Snapdragon 888 SoC o Package View o Package Cross Section o Die Views o Delayering&Process o Cross-section o FEOL FloorPlan Manufacturing Process Flow Cost Analysis Selling Price Analysis Related Analyses
©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 6 Package Cross Section 2
Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Package Disassembly o Xiaomi Mi11 Teardown o Package Assembly o Views & Dimensions o Package X-Ray o Package Cross-Section o DRAM Memory o Package Views & Dimensions o Package Cross Section & Opening o Die Analysis o Snapdragon 888 SoC o Package View o Package Cross Section o Die Views o Delayering&Process o Cross-section o FEOL FloorPlan Manufacturing Process Flow Cost Analysis Selling Price Analysis Related Analyses
©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 7 DRAM Memory Package Cross Section
Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Package Disassembly o Xiaomi Mi11 Teardown o Package Assembly o Views & Dimensions o Package X-Ray o Package Cross-Section o DRAM Memory o Package Views & Dimensions o Package Cross Section & Opening o Die Analysis o Snapdragon 888 SoC o Package View o Package Cross Section o Die Views o Delayering&Process o Cross-section o FEOL FloorPlan Manufacturing Process Flow Cost Analysis Selling Price Analysis Related Analyses
©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 8 Processor Top PCB DRAM Memory Die Cross-Section
Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Package Disassembly o Xiaomi Mi11 Teardown o Package Assembly o Views & Dimensions o Package X-Ray o Package Cross-Section o DRAM Memory o Package Views & Dimensions o Package Cross Section & Opening o Die Analysis o Snapdragon 888 SoC o Package View o Package Cross Section o Die Views o Delayering&Process o Cross-section o FEOL FloorPlan Manufacturing Process Flow Cost Analysis Selling Price Analysis Related Analyses
©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 9 Snapdragon 888 Package Cross Section
Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Package Disassembly o Xiaomi Mi11 Teardown o Package Assembly o Views & Dimensions o Package X-Ray o Package Cross-Section o DRAM Memory o Package Views & Dimensions o Package Cross Section & Opening o Die Analysis o Snapdragon 888 SoC o Package View o Package Cross Section o Die Views o Delayering&Process o Cross-section o FEOL FloorPlan Manufacturing Process Flow Cost Analysis Selling Price Analysis Related Analyses
©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 10 Snapdragon 888 Package Cross Section
Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Package Disassembly o Xiaomi Mi11 Teardown o Package Assembly o Views & Dimensions o Package X-Ray o Package Cross-Section o DRAM Memory o Package Views & Dimensions o Package Cross Section & Opening o Die Analysis o Snapdragon 888 SoC o Package View o Package Cross Section o Die Views o Delayering&Process o Cross-section o FEOL FloorPlan Manufacturing Process Flow Cost Analysis Selling Price Analysis Related Analyses
©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 11 Snapdragon 888 Package Cross Section - Capacitors
Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Package Disassembly o Xiaomi Mi11 Teardown o Package Assembly o Views & Dimensions o Package X-Ray o Package Cross-Section o DRAM Memory o Package Views & Dimensions o Package Cross Section & Opening o Die Analysis o Snapdragon 888 SoC o Package View o Package Cross Section o Die Views o Delayering&Process o Cross-section o FEOL FloorPlan Manufacturing Process Flow Cost Analysis Selling Price Analysis Related Analyses
©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 12 PHYSICAL ANALYSIS FEOL FEOL Analysis – TEM Across Fins
Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Package Disassembly o Xiaomi Mi11 Teardown o Package Assembly o Views & Dimensions o Package X-Ray o Package Cross-Section o DRAM Memory o Package Views & Dimensions o Package Cross Section & Opening o Die Analysis o Snapdragon 888 SoC o Package View o Package Cross Section o Die Views o Delayering&Process o Cross-section o FEOL FloorPlan Manufacturing Process Flow Cost Analysis Selling Price Analysis Related Analyses
©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 14 PHYSICAL ANALYSIS FLOORPLAN Die Floorplan – Detail of Constituent Circuit Blocks
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis FloorPlan o Die Dimensions o Floor Plan Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Analyses
About System Plus
©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 16 MANUFACTURING PROCESS FLOW MCeP – Process Flow (2/2)
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison FloorPlan
Manufacturing Process Flow o Summary o Snapdragon 888 SoC Front- End Process o Snapdragon 888 SoC Fabrication Unit o Snapdragon 888 SoC Process Flow o Memory Die Front-End Process o Memory Fabrication Unit
Cost Analysis
Selling Price Analysis
Related Analyses
About System Plus
©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 18 COST ANALYSIS DRAM Memory Die Cost
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis FloorPlan
Manufacturing Process Flow
Cost Analysis o Cost Analysis Summary o Yields Explanation & Hypotheses o DRAM Memory Die Cost o DRAM Memory Component Cost o Snapdragon 888 Front End Cost o Snapdragon 888 Die Cost o Snapdragon 888 Packaging Cost o Snapdragon 888 Component Cost
Selling Price Analysis
Related Analyses
About System Plus
©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 20 Snapdragon 888 SoC Front-End Cost
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis FloorPlan
Manufacturing Process Flow
Cost Analysis o Cost Analysis Summary o Yields Explanation & Hypotheses o DRAM Memory Die Cost o DRAM Memory Component Cost o Snapdragon 888 Front End Cost o Snapdragon 888 Die Cost o Snapdragon 888 Packaging Cost o Snapdragon 888 Component Cost
Selling Price Analysis
Related Analyses
About System Plus
©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 21 Snapdragon 888 SoC Front-End Cost – Die Cost
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis FloorPlan
Manufacturing Process Flow
Cost Analysis o Cost Analysis Summary o Yields Explanation & Hypotheses o DRAM Memory Die Cost o DRAM Memory Component Cost o Snapdragon 888 Front End Cost o Snapdragon 888 Die Cost o Snapdragon 888 Packaging Cost o Snapdragon 888 Component Cost
Selling Price Analysis
Related Analyses
About System Plus
©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 22 MCeP Packaging cost per process steps
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis FloorPlan
Manufacturing Process Flow
Cost Analysis o Cost Analysis Summary o Yields Explanation & Hypotheses o DRAM Memory Die Cost o DRAM Memory Component Cost o Snapdragon 888 Front End Cost o Snapdragon 888 Die Cost o Snapdragon 888 Packaging Cost o Snapdragon 888 Component Cost
Selling Price Analysis
Related Analyses
About System Plus
©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 23 RELATED ANALYSES Related Analyses
Overview / Introduction
Company Profile & Supply Chain RELATED REPORTS RELATED TEARDOWN TRACKS
Physical Analysis By System Plus Consulting: By System Plus Consulting: Physical Comparison • Apple M1 System-On-Chip • Samsung Galaxy S21 Ultra 5G FloorPlan • NVIDIA A100 Ampere GPU • Samsung Galaxy S21 5G Manufacturing Process Flow
Cost Analysis • Intel Foveros 3D Packaging Technology Selling Price Analysis By Yole Développement: Related Analyses • Cameras and Computing for About System Plus surveillance and security 2020 RELATED MONITORS
By System Plus Consulting: • Smartphone Design Win Quarterly Monitor
By Yole Développement: • Processor Quarterly Market Monitor
©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 25 COMPANY SERVICES Our Core Activity : Reverse Costing®
Overview / Introduction
Company Profile & Supply A Structure, Process and Cost Analysis Chain
Physical Analysis Reverse Costing® consists of disassembling a device or a system in order FloorPlan to identify its technology and discern its manufacturing processes and FEOL then using in-house models and tools to determine its cost. Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Analyses
About System Plus o Company services o Contact
©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 27 Fields Of Expertise
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis FloorPlan FEOL
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Analyses
About System Plus o Company services o Contact
©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 28 Business Model
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis FloorPlan FEOL Custom Cost Monitor Analysis Methods Manufacturing Process Flow 1 per year 150 custom Training Cost Analysis quarterly analyses per On demand Selling Price Analysis updated year
Related Analyses
About System Plus o Company services o Contact Report Teardown Costing 60+ per year Track Tools 205+ 5 process-based teardowns per and 3 parametric year costing tools
©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 29 Worldwide Presence Overview / Introduction 100+ collaborators in 8 different countries Company Profile & Supply Chain
Physical Analysis FloorPlan FEOL
Manufacturing Process Flow Frankfurt Cost Analysis
Selling Price Analysis Nantes Boise Related Analyses Seoul Phoenix Raleigh Lyon Austin Cornelius About System Plus o Company services Shenzhen Tokyo o Contact Hsinchu
Singapore
Headquarters › Nantes – System Plus Consulting › Lyon – Yole Développement ©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 30 Contact
Overview / Introduction REPORTS, MONITORS & TRACKS Company Profile & Supply Western US & Canada India and RoA Japan Chain Steve Laferriere - [email protected] Takashi Onozawa - [email protected] Miho Ohtake - [email protected] Physical Analysis + 1 310 600 8267 +81 80 4371 4887 +81 34 4059 204 FloorPlan Eastern US & Canada Greater China Japan and Singapore FEOL Chris Youman - [email protected] Mavis Wang - [email protected] Itsuyo Oshiba - [email protected] Manufacturing Process Flow +1 919 607 9839 +886 979 336 809 +86 136 6156 6824 +81 80 3577 3042
Cost Analysis Europe and RoW Korea Japan Lizzie Levenez - [email protected] Peter Ok - [email protected] Toru Hosaka – [email protected] Selling Price Analysis +49 15 123 544 182 +82 10 4089 0233 +81 90 1775 3866 Related Analyses Benelux, UK & Spain About System Plus Marine Wybranietz - o Company services o Contact [email protected] +49 69 96 21 76 78
HEADQUARTER REPORTS & MONITORS WEBSITE MARKETING, COMMUNICATION & PR & CUSTOM PROJECT SERVICES www.systemplus.fr Jean-Christophe Eloy, Marketing & 22 Bd Benoni Goullin Communication 44200 Nantes, France TRACKS WEBSITE [email protected] - +33 686 68 19 31 [email protected] - +33 2 40 18 09 16 www.reverse-costing.com Sandrine Leroy, Public Relations [email protected] - +33 4 72 83 01 89
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©2021 by System Plus Consulting | SPR21612 - Qualcomm Snapdragon 888 System on Chip with 5G Modem | Sample 31