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EDTM 2017 Highlights: EDS Device Conference in Asia UPCOMING TECHNICAL CONFERENCES

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EDTM 2017 Highlights: EDS Device Conference in Asia UPCOMING TECHNICAL CONFERENCES APRIL 2017 VOL. 24, NO. 2 ISSN: 1074 1879 EDITOR-IN-CHIEF: M.K. RADHAKRISHNAN TABLE OF CONTENTS TECHNICAL BRIEFS .......................... 1 T E ch NI C AL B RIEFS • EDTM 2017 Highlights: EDS Device Conference in Asia UPCOMING TECHNICAL CONFERENCES ........ 6 • 2017 IEEE International Reliability Physics Symposium (IRPS) IGHLIGHTS • 2017 IEEE Symposium on VLSI Technology EDTM 2017 H : EDS SOCIETY NEWS ............................. 11 DEVICE CONFERENCE IN ASIA • Announcement of Newly Elected EDS BoG Members • Message from EDS President Elect • Message from EDS Vice President of Regions & Chapters • Message from the Editor-in-Chief • New Staff Joins EDS Office • Report from the EDS VLSI Technical Committee AWARDS AND RECOGNITIONS ................ 17 • 2017 IEEE Robert Bosch Micro and Nano Electro Mechanical Systems Award Winner • 2017 IEEE Robert Bosch Award Call for Nominations The IEEE Electron Devices Society (EDS) had its first device con- • 2016 EDS J.J. Ebers Award Winner • 2017 EDS J.J. Ebers Award Call for Nominations ference in Asia—Electron Devices Technology and Manufacturing • 2016 EDS Education Award Winner Conference (EDTM), at Toyama International Conference Center, • 2017 EDS Education Award Call for Nominations • 2016 EDS Early Career Award Winner Toyama, Japan, from February 28th to March 2nd, 2017, (http://ewh. • 2017 EDS Early Career Award Call for Nominations ieee.org/conf/edtm/2017/). Various device technology areas, pack- • EDS Members Elected to IEEE Grade of Fellow • Congratulations to the EDS Members Recently aging, process/tool, material, modeling/reliability and emerging Elected to Senior Member Grade technologies were discussed. The technical program included ple- • Status Report from the 2016 EDS PhD Student nary sessions as well as 17 technical and poster sessions. The re- Fellowship Recipients • Status Report from the 2016 EDS Masters Student search findings were presented by researchers across the world Fellowship Recipients and was attended by about 290 attendees. (website: http://ewh. • Reminder of Deadline for 2017 EDS Masters Student Fellowship Nominations ieee.org/conf/edtm/2017/). This issue of the EDS Newsletter cap- • Reminder of Deadline for 2017 EDS PhD Student tures glimpses of some of the key presentations and latest technol- Fellowship Nominations YOUNG PROFESSIONALS ................... 31 ogy developments. • ‘Smart’ Drip-Irrigation System in Nicaragua As an emerging field, future computation and energy harvest- • Electronic Exploration Camps in Region 10 ing for cloud and edge systems was discussed, especially on CHAPTER NEWS ........................... 35 • Memory Day Event at Northern Virginia/ neuromorphic, memristor, CMOS and perovskite-solar-cell tech- Washington D.C. Chapter nologies. (Papers from 3M-2 to 3M-5). On the system integra- • Inaugural IEEE International Microwave, Electron Devices, Solid-State Circuits Symposium (IMESS) tion for cloud and edge, requirements for packaging technology 2016—Penang was presented to embed memory, RF and power-management • EDS Mini-Colloquium at Pontificia Universidad components. Javeriana, Bogota (Paper 4M-6, Packaging design considerations for • EDS Distinguished Lecture at ED Japan Chapter mobile and Internet of things (IoT), Piyush Gupta, Qualcomm). • EDS Mini-Colloquium at Santo Tomas University, Tunja Furthermore, Through Chip Interface (TCI) technology was dis- • IEEE Puebla Section Awarded the IEEE 2016 Best Achievement Award cussed for high-performance and low-cost interfaces between REGIONAL NEWS .......................... 42 SoC-DRAM, staked-NAND, staked DRAM and module sys- EDS MEETINGS CALENDAR .................. 56 tems. (Paper 4M-1, System Integration in a Package for Cloud REMEMBERING MILDRED Dresselhaus ...... 59 Summary OF CHANGES TO THE EDS FIELD (continued on page 3) OF Interest STATEMENT ................... 60 YOUR COMMENTS SOLICITED Your comments are most welcome. Please write directly to the Editor-in-Chief of the Newsletter at [email protected] ELECTRON DEVICES NEWSLETTER SOCIETY EDITORIAL STAFF President Vice President of Publications Editor-In-Chief Samar Saha and Products M.K. Radhakrishnan Prospicient Devices Hisayo Momose NanoRel E-mail: [email protected] Yokohama National University E-mail: [email protected] E-mail: [email protected] President-Elect Fernando Guarin Vice-President of Regions/ REGIONS 1-6, 7 & 9 UK, Middle East & Africa GlobalFoundries Chapters Eastern, Northeastern & South- Jonathan Terry E-mail: [email protected] M.K. Radhakrishnan eastern USA (Regions 1,2 & 3) The University of Edinburgh NanoRel Mukta Farooq E-mail: [email protected] Treasurer E-mail: [email protected] GlobalFoundries Subramanian S. Iyer E-mail: mukta.farooq@ Western Europe UCLA Vice President of Technical globalfoundries.com Jan Vobecky E-mail: [email protected] Committees & Meetings Abb Switzerland Ltd. Central USA & Canada Ravi Todi E-mail: [email protected] (Regions 4 & 7) Secretary GlobalFoundries E-mail: [email protected] Karim S. Karim Simon Deleonibus University of Waterloo REGION 10 CEA-LETI E-mail: [email protected] Australia, New Zealand & E-mail: simon.deleonibus.1992@ IEEE Newsletters South East Asia ieee.org Theresa Smith Southwestern & Western USA P Susthitha Menon IEEE Operations Center (Regions 5 & 6) Universiti Kebangsaan Jr. Past President E-mail: [email protected] Kyle H. Montgomery Malaysia Albert Z.H. Wang Air Force Research Laboratory E-mail: [email protected] University of California, Riverside Operations Director E-mail: [email protected] E-mail: [email protected] James Skowrenski Latin America (Region 9) Northeast Asia IEEE Operations Center Joao Antonio Martino Kuniyuki Kakushima E-mail: [email protected] Sr. Past President University of Sao Paulo Tokyo Institute of Technology Paul K.L. Yu E-mail: [email protected] E-mail: [email protected] University of California at San Diego Membership Administrator E-mail: [email protected] Joyce Lombardini REGION 8 East Asia IEEE Operations Center Eastern Europe Ming Liu E-mail: [email protected] Vice President of Membership Daniel Tomaszewski Institute of Microelectronics and Services Institute of Electron Technology E-mail: [email protected] Tian-Ling Ren E-mail: [email protected] Tsinghua University Scandinavia & Central Europe South Asia E-mail: [email protected] Mariusz Orlikowski Manoj Saxena Lodz University of Technology University of Delhi E-mail: [email protected] E-mail: [email protected] IEEE prohibits discrimination, harassment, and bullying. For more information, visit http://www.ieee.org/web/aboutus/whatis/policies/p9-26.html. CONTRIBUTIONS WELCOME EDS Board of Governors (B0G) Elected Members-at-Large Readers are encouraged to submit news items concerning the Society Elected for a three-year term (maximum two terms) with ‘full’ voting privileges and its members. Please send your ideas/articles directly to either Editor- in Chief or the Regional Editor for your region. The e-mail addresses of all 2017 TerM 2018 TerM 2019 TerM Regional Editors are listed on this page. E-mail is the preferred form of submission. Z. Celik-Butler (2) N. Bhat (1) J. Burghartz (1) NEWSLETTer DEADLines S. Chung (2) D. Camacho Montejo (2) R. Huang (2) M. Farooq (1) S. Deleonibus (1) S. Ikeda (1) IssUE DUE DATE P. Fay (1) M. Ieong (1) M. Meyyappan (1) C. Lilley (1) M. Polavarapu (1) A. Nathan (1) January October 1st D. Misra (1) R. Todi (1) J. Swart (2) April January 1st H. S. Momose (1) D. Verret (2) B. Zhao (1) July April 1st T. L. Ren (2) October July 1st The EDS Newsletter archive can be found on the Society web site at http://eds.ieee.org/eds-newsletters.html. The archive contains issues from July 1994 to the present. IEEE Electron Devices Society Newsletter (ISSN 1074 1879) is published quarterly by the Electron Devices Society of the Institute of Electrical and Electronics Engineers, Inc. Headquarters: 3 Park Avenue, 17th Floor, New York, NY 10016-5997. Printed in the U.S.A. One dollar ($1.00) per member per year is included in the Society fee for each member of the Electron Devices Society. Periodicals postage paid at New York, NY and at additional mailing offices. Postmaster: Send address changes to IEEE Electron Devices Society Newsletter, IEEE, 445 Hoes Lane, Piscataway, NJ 08854. Copyright © 2017 by IEEE: Information contained in this Newsletter may be copied without permission provided that copies are not used or distributed for direct commercial advantage, and the title of the publication and its date appear on each photocopy. 2 IEEE Electron Devices Society Newsletter ❍ April 2017 EDTM 2017 HIGHLIGhtS: EDS DEVICE CONFERENCE IN ASIA (continued from page 1) and Edge, Tadahiro Kuroda, Keio Furthermore, the advanced pack- performance, higher density, and University). aging technology was presented by multi-layer re-distribution layer (RDL) In the packaging field, Outsource TSMC, in which their strategy for remains. (Paper PL-3, Advanced Het- Assembly and Test (OSAT) approach heterogeneous integration was in- erogeneous Integration Technology for cloud and edge devices was pre- troduced, including InFO, CoWoS Trend for Cloud and Edge, Douglas sented along with newly-developed and panel technologies. It was dis- C.H. Yu, TSMC). panel level package (PLP) technol- cussed that fan-out panel level pack- In the process and tool fields, the ogy. (Paper 4M-3, Focused tech- aging aims for lower cost with larger significant progress of EUV scan- nologies in near future from OSAT panel substrate. It is more suitable
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