Electrical Properties of Multi P-N Junction Devices

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Electrical Properties of Multi P-N Junction Devices IEEE TRANSACTIONSIEEE ON ED-29,ELECTRONDEVICES,VOL. NO. 6, JUNE 1982 977 [ 151 J. G. Nash and J. W. Holm-Kennedy, “Effect of electron-electron [23] P. N. Swartztrauber and R. Sweet, “Efficient fortran subprograms scattering on hot-electron repopulation in n-Si at 77”K,” Phys. forthe solution of elliptic partial differential equations,” Na- Rev. B, vol. 16, p. 2834, 1977. tionalCenter for Atmospheric Res.,Tech. NoteTN/IA-109, [ 161 J V. Faricelli, “Physics of large-signal response of short-channel 1975. MESFET’s,” M.S. thesis, Cornell Univ., Ithaca, NY, 1980. [24] R. W. Hockney,“POT4-A fast direct Poisson solverfor the [ 171 K. Blotekjaer, “Transport equations for two-valleysemiconduc- rectangle allowing some mixed boundary conditions and internal tors,’’ IEEE Trans. Electron Devices, vol. ED-17, p. 38, 1970. electrodes,” IBM Res. Rep., RC-2870. [18] M. S. Shur,“Influence of non-uniformfield distribution on [25] D. L. Scharfetter and H.K. Gummel, “Large signal analysis of a frequency limits of GaAs field-effect transistors,” Electron Lett., siliconRead diodeoscillator,” IEEE Trans. ElectronDevices, vol. 12, p. 615, 1976. VO~.ED-16, p. 64, 1969. [ 191 C. Jacoboni et al., “A review of some charge transport properties [26] M. Reiser,“Large scale numerical simulation in semiconductor of silicon,” Solid-state Electron., vol. 20, p. 77, 1977. device modeling,” Computing Methods in Applied Mathematics [20] P. M. Smith, M. Inoue,and J. Frey,“Electron velocity in Si and Engineering, vol. 1, p. 17. and GaAs at very high electric fields,” J. Appl. Phys., vol. 37, p. [27] J. Ruch, “Electron dynamics in short channel field effect transis- 797, 1980. tors,” IEEE Trans. Electron Devices, vol. ED-19, p. 652, 1912. [21] T. J. Maloney, “Non-equilibrium electron transport in compound [28] R. C. Eden and B. M. Welch, “GaAs digital integrated circuits for semiconductors,” Ph.D, dissertation,Cornell Univ., Ithaca, NY, ultra-high speed LSI/VLSI,” in VLSI: Fundamentals and Applica- 1977. tions, D. F. Barbe, Ed. Berlin, Germany: Springer-Verlag, 1980. [22] S. Kratzer,“Computer simulations of electrontransport in [29] T. Wada and J. Frey, “Physicalbasis of short-channel MESFET GaAs,” M.S. thesis, Cornell Univ., Ithaca, NY, 1978. operation,”IEEE J. Solid-State Circuits, vol. SC-14, p. 398,1979. Electrical Properties of Multi p-n Junction Devices JOSEPH KATZ, SHLOMO MARGALIT, AND AMNON YARIV, FELLOW, IEEE Abstract-The electrical properties of multi p-n junction devices are devices as injection lasers has also been reported, but no analy- analyzed. It is found that this type of device possesses bistable charac- sisof the electrical properties of such structures has been teristicssimilar tothat of aShockley diode and thus provides an published. alternativerealization of devices forswitching applications. The in- herently greater current gains involved in the operations of such a de- This paper analyzes the electrical properties of semiconduc- viceyield in princ,iplehigher breakover voltages andhigher holding tor devices consisting of many layers of alternating p- and currents.Furthermore, the incorporation of heterostructuresin this n-type.Incorporation of heterostructures in these devices device introduces a new degree of freedom in tailoring their switching makes the design of their characteristics more flexible due to characteristics.Multi p-n heterojunction devices operatingas SCR the introduction of the additional degreeof freedom of the lasers were fabricated, and the experimental results are presented, energy band gap difference. It is foundthat such devices provide an alternative for realizing bistable switching charac- I. INTRODUCTION teristics. Compared to switching devices fabricated from sili- INCE THEIR introduction,the Shockleydiode [l] and con, GaAsdevices are lesssensitive to high temperatures Sother related deviceshave foundmany applications in because of their larger band gap and are inherently faster be- switching and regulating circuits [2] . Recently the operation cause of their shorter carrier lifetime. Since the common-base of Shockley diodes which function also as AlGaAs injection current gainof the transistors that model thesedevices (see lasers has been demonstrated [3]. Operation of both homo- next section) is distributed among all the regions of the struc- structure [4] and heterostructure [5] multi p-n GaAs-GaAlAs ture,different switching conditions are obtained. Mainly it is foundthat it takes more gain to perform the switching, Manuscriptreceived November 16,1981; revised February 3, 1982. which results in an increase in the breakover voltages and in Thiswork was supported in part by the Jet Propulsion Laboratory, the holding currents. California Institute of Technology, under NASA Contract NAS7-100, the Office of Naval Research and the National Science Foundation. The outline of this paper is as follows: In Section 11, a quali- J. Katz is with the Jet Propulsion Laboratory, California Institute of tative analysisof multi p-n devices,based on an extended Technology, Pasadena, CA 91109. transistormodel, is carried out. The results of this analysis S. Margalit and A. Yariv are with the Department of Electrical Engi- neeringand Applied Physics, California Institute of Technology, show that such structures have bistable characteristics similar Pasadena. CA 9 1125. to those of aShockley diode. Sections I11 and IV analyze 0018-9383/82/0600-0977$00.75 0 1982 IEEE 978 IEEE TRANSACTIONS ON ELECTRON DEVICES, VQL. ED-29, NO. 6, JUNE 1982 (a) (b) (c) Fig. 1. Transistor model of a (p-n), device. (a) Schematic structure of the device. (b) Decomposition of the device into individual transis- tors. (c) Equivalent circuit of the device. quantitatively the device in its two stable states: the forward ing matrix equation. A is given by blocking (“OFF ”) and the forward conducting (“ON”) states, r- - 1000 000 00-100 respectively, Finally, Section V describes the fabrication pro- cedure and the experimental results of several types of such 1-1-10 000 000 00 devices, and compares the experimental results with the theo- -CY,OlO 010 000 00 retical calculations. 0-100 010 00000 11. MODIFIED TRANSISTORMODEL FOR 0 001-1-10 000 00 MULTI p-n STRUCTURES 0 OO-a2010 000 00 Consider a structure consisting of 2m layers of alternating 0 0-10101 010 00 p- and n-type, which is denoted by (p-n),. In this structure the ith junction separates the ithand the (it 1)th layer. 0 000 001-1-10 00 By a directextension of thetwo-transistor model for the 0 000 00-cu3010 00 SCR, one can analyze the structure using a more complicated 0 00-1 000-100 01 transistor network. An example of a (p-n), structure is shown in Fig. 1. Generally, it takes a 2 X (m - 1) transistor network 0 000 000 001-1-1 to describe a (p-n), structure. The 3 X 2 X (m - 1) equations 0 000 000 OO-a,Ol- needed to describe thenetwork (three equations for each transistor) are (3) and Z and Idfive are given by IBj t ICj = IEi, i= 1,2,.,2(m - 1) (la) 7-l I-- -I Ici=aiI~i+Icoi, i=1,2;..,2(m- 1) (lb) IE 1 -CIGi ICi =IB,i-1 +IE,i-2 +IG,i-1 9 i=2,4,6;**,2(m- 1) (IC) IB1 0 IC1 IC0 1 IEi = -IB,i-lIC,i-2 2 IG,i-l > i=3,5,7;-.,2m- 3 (Id) IE2 IG 1 IB2 0 I = IC2 . Idrive = IC702 IE3 IG2 where the transistors are assumed to be initially in the cutoff 0 or active region(i.e., the deviceis in the forward blocking IB3 state), Icoi is the collector to base reverse saturation current IC3 IC03 of the ith transistor, ai is the common-basecurrent gain of IE4 IG 3 the ith transistor, and IG~is the current generated at the ith 0 gate of the device. The set of equations (1) can be cast in a I84 matrix form IC4- - IC04 4 Equation (2) can be solved for la = IE~with {ai} as a set of For example, the (p-n), structure is described by the follow- parameters. The particular case where IA approaches infinity KATZ et al.: MULTI p-n JUNCTION DEVICES 979 + P Anode + P Anode ”O 7 JI - x El a8 ff’ JZ a, / J3 P‘ 0.6 - b//’ / / /’ a 1’ I c ,p’ 0.4 - ,/ I‘ n‘ ’ / 6’ -bCothode -6 Cathode // (a) (b) Fig. 3. Comparisonbetween the generic characteristics of (p-n), and (p-n)zdevices. (a) (p-n), device. (b)Corresponding (p-n)~device I’ / (regular Shockley diode). IIIIII 23456789 electrical characteristics, Fig.3(a) depictsthe device in the rn Fig. 2. Common base current gain (a)for switching of a (p-n), device forward blocking (“OFF”) state. The crosshatched areas versus m. (a) All the transistors are identical (ai = 01). (b) All the odd represent the depletion regions of the reverse biased junctions (or all the even) numbered transistors in the model have 01 = 0.95. (J2 and J4). The junction J, is, in principle, forward biased. Shown is a neededfrom the other transistors for switching. (c) Same as in (b), but with agiven AI of 0.99. However, since the current that flows through the deviceis very small, there is also a very small voltage drop in the region (i.e., the determinant of A equals zero) indicates theswitching between Jz and J4. Since a region with virtually no current condition.Inspection of thematrix A in (2) shows the and voltage has a little effect on the device, to the external following: world the device appears basically as if‘it had thestructure 1) (p-n)m structures, with m 2 2, cannot possess more than depicted in Fig. 3(b), which is a device. Inthe forward twostable states. This is deducedfrom thefact that for a conducting (“ON”) state, all the internal regions in the (p-n), given structure, only one set of {acui},at most, yields 1, +.
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