Additive Manufacturing for RF Passive Hardware WM03 Petronilo Martin-Iglesias, Cesar Miquel-España, Jaione Galdeano, European Space Agency

[email protected] Challenges within End-To-End Additive Manufacturing of RF Components For Space Use

Dr. Johannes Gumpinger Advanced Manufacturing Processes Engineer

Dr. Tommaso Ghidini Head of the Materials Technology Section

London, 03-10-2016

Contact Details: [email protected] www.esa.int ESA UNCLASSIFIED – For Official Use

The Purpose of the European Space Agency

“To provide for and promote, for exclusively peaceful purposes, cooperation among European states in space researchch andand technologytechnolo and their space applicationapplications.s ”

AArticle 2 of ESA Convention

ESA UNCLASSIFIED – For Official Use Vision for AM in Space

To: o Totally change the way of designing parts o Revise mission logistics: • On demand production of spare parts on orbit / planet, remotely designed o Provide shelter for Astronauts for future missions o =>ESA 1.5 UNCLASSIFIED t demonstrator – For Official Use produced during R&D activity

Why Additive Manufacturing for Space hardware?

o Challenges for Space Materials and Processes: • Low Mass • Small Geometries • Small Production Series • Very High Performances • Very High Reliability • Challenging Material • Limited Manufacturing Procurement Processes o Why ALM? • ALM addresses majority of above challenges • Applied to many materials => metals, polymers, composites, ceramics • Dimensions: few micrometers to meters • Significant gains in performances • Environmentally friendly

ESA UNCLASSIFIED – For Official Use ESA Learning Curve

ł Started in 2006 with EADS IW De / Fr to understand the possibilities offered by powder bed and blown powder processes Î frustrating answers ł WOOV activity aimed at reproducing a part designed for machining without weld Î substitute stainless steel by titanium Î cost and mass benefits Î leads to change in thinking process, we need to design for AM!

ESA UNCLASSIFIED – For Official Use

AM for Space Propulsion

Injectors Chamber/Nozzles

Monolithic Thrusters ł Functionally graded materials with gradual transition in composition and structure for thruster performances improvement ł Reducing incompatibilities in material properties (e. g. CTE) ł Enhanced monopropellant catalyst design ł Lattice structure for thermal/weight management

ESAEESSSAA UNCLUNCUUNCLASSIFIEDNNCNCLCCLLAASSIFIED – For orr OOfOfficiall UseUsUssee A Major Achievement

World´s first 3D printed platinum combustion chamber for space applications !!!

Successfully Hot Firing Campaign 5th of May, 2015: ł 1,1 hrs firing time ł 618 ignitions ł 26 thermal cycles ł with a 32 min longest single burn 10N AM thruster maiden firing at nominal operation point ł highest throat temperature of 1253°C was reached

ESA UNCLASSIFIED – For Official Use

AM for Electrical Hardware – Telecom Satellites

Conventional design for manufacturability, machining

Redesign for performances using AM capabilities

Collaboration ESA – TESAT(D) – ILT (D) ł Mass & room saving (50% mass, 30% projected area) ł Suppress assembly (cost saving, no failure risk) ł Easier to control (no tightening torque, no electrical leakage) ł Easier to silver coat (no sharp corner, easy electrode access) ł Lead time reduced by weeks (9 made in a machine run)

ESA UNCLASSIFIED – For Official Use ESA UNCLASSIFIED – For Official Use

AM for Mechanical Hardware – Telecom Satellites

Reaction wheel bracket • Bracket made of AlSi10Mg • 56% mass savings • 4 brackets per satellite • Verification approach: NDI and destructive tests at coupons and part level • Ongoing Artes 5.1 project. (TRL 4 targeted)

ESA UNCLASSIFIED – For Official Use ESA UNCLASSIFIED – For Official Use

ESA Roadmap on Additive Manufacturing

Space products

o More than 700 experts /stake holders involved o 26 countries represented Terrestrial o 390 companies represented AM o 62 new members joined the roadmap space community

o Available for everyone in Europe ESA UNCLASSIFIED – For Official Use o => Eurospace Challenges to Achieve Space Quality

1. Design challenges: • Current design tools do not allow taking full benefit from AM capabilitiesp • AM specific features missing • Compatibility with AM machines • Design rules for AM not fully established 2. Manufacturing challenges: Source: University of Paderborn • Raw material procurement not under full control => high impact on part manufactured • Powder characteristics • Traceability / procurement of powders • Develop new materials specifically for AM processing • Manufacturing process stability • Two machines from same manufacturer produce slightly different output • Process monitoring • Changes of process parameters impact on final product

ESA UNCLASSIFIED – For Official Use

Challenges to Achieve Space Quality

3. (Space) Qualification / validation challenges: • Change of paradigm: classical qualification methods (at Product level) do not apply to AM made parts • Material evaluation samples not always representative of the part • Materials allowables to be defined D

• Process verification methodologies C F B (NDI) to be established and qualified E • PA requirements to be established • Companies capabilities approval (ESA)

4. Standardisation challenges: • AM dedicated standards not fully established yet • AM dedicated ECSS to be issued

ESA UNCLASSIFIED – For Official Use Status of the AM ECSS Proposal

1. Motivation: ł ECSS is required to establish processing and QM requirements for space hardware produced by AM ł Profiting of existing international standards (e.g. ISO, ASTM) for AM 2. Status: ł In agreement with the ECSS TA a WG is established with the following objectives: o Map the current state of the art w.r.t. AM standardization o Identify gaps w.r.t. space standardization for AM o Define the work plan for the AM ECSS o ToR of the WG in preparation Î Kicked off

ESA UNCLASSIFIED – For Official Use ASTM F42 ISO/TC 261

The Advanced Manufacturing concept

ł Objective of Advanced Manufacturing (AM) cross cutting initiative: => create new high performance Space products by actively reducing the limitations imposed by the traditional manufacturing processes/concepts

¾ Identify and implement new manufacturing technologies for space applications enabling: 9Design freedom 9Performance improvement 9Costs reduction 9Lead time reduction (from concept to manufacturing)

Space End-to-end Advanced Products Manufacturing Process

ESA UNCLASSIFIED – For Official Use GSTP-6 Element 1 Potential Activities Advanced Manufacturing

More information: www.emits.esa.int => news

ESA UNCLASSIFIED – For Official Use

Conclusions

o AM is seen as an enabling technology for future space missions

o However, challenges still exist

o Activities to mature technology and develop high end space hardware have been designed through harmonisation cycle

o Will increase competitiveness of European space industry

o AM is a building block of a larger activity – Advanced Manufacturing

ESA UNCLASSIFIED – For Official Use Thank you for your attention!

Prepared by: Johannes Gumpinger Tommaso Ghidini Laurent Pambaguian Benoit Bonvoisin

[email protected] ESA UNCLASSIFIED – For Official Use www.esa.int Impact of AM in Satellite Payloads

Petronilo Martin-Iglesias

European Space Agency (ESA/ESTEC)

[email protected]

Slide 1 WM03 Additive Manufacturing for RF Passive Hardware of 38

Outline

• Evolution Telecommunication Space Systems ¾ ONE WEB ¾ VIASAT-3 ¾ KA-SAT • Way Forward • AM – Advantage and disadvantages • System Impact of AM • Current solutions • Function Integration • AM within ESA • Challenges for AM • Conclusions

Slide 2 WM03 Additive Manufacturing for RF Passive Hardware of 38 Cost per Gbps - Evolution

Space Symposium 2015- HIGH CAPACITY SATELLITE COMMUNICATIONS - COST-EFFECTIVE BANDWIDTH TECHNOLOGY Mr. Richard VanderMeulen (VIASAT)

• The cost per Gbps has decreased with the frequency re-use of multibeam satellite systems. • Strong preassure from operators to reduce the cost in order to compete with terrestrial networks (DSL, fibre, cable). Slide 3 WM03 Additive Manufacturing for RF Passive Hardware of 38

Foreseen orders and launches

• Average annual GEO orders will decline by 5%, and non-GEO orders will increase by more than 600% in the coming decade. • Earlier replacement for non-GEO communication satellites Æ continuous evolution/innovation required.

Slide 4 WM03 Additive Manufacturing for RF Passive Hardware of 38 Satellite System Evolution

Slide 5 WM03 Additive Manufacturing for RF Passive Hardware of 38

OneWeb

Slide 6 WM03 Additive Manufacturing for RF Passive Hardware of 38 OneWeb

• The company is building about 900 satellites (150kg each). • The orbital constellation consists of 720 satellites (648 operational + spare) – 40 spacecraft in each of the 18 orbital plans, all at 1,100 kilometers in altitude. • Manufacturing of 15 satellites per week with a cost of less than US$500,000 • 32-36 spacecraft per launch (Soyuz).

Slide 7 WM03 Additive Manufacturing for RF Passive Hardware of 38

VIASAT-3

Slide 8 WM03 Additive Manufacturing for RF Passive Hardware of 38 VIASAT-3

Each satellite will carry with it a total network capacity of 1 Tbps

Slide 9 WM03 Additive Manufacturing for RF Passive Hardware of 38

KA-SAT

Space Symposium 2015- HIGH CAPACITY SATELLITE COMMUNICATIONS - COST-EFFECTIVE BANDWIDTH TECHNOLOGY Mr. Richard VanderMeulen (VIASAT)

Slide 10 WM03 Additive Manufacturing for RF Passive Hardware of 38 KA-SAT

• KA-SAT offers coverage to Europe and parts of North Africa and the Middle East. • The coverage is available in 82 spots, mostly of a 250km diameter (some spots in North Africa have a 500km diameter)

Slide 11 WM03 Additive Manufacturing for RF Passive Hardware of 38

KA-SAT

Slide 12 WM03 Additive Manufacturing for RF Passive Hardware of 38 KA-SAT

2580 Kg 25.1KW

Slide 13 WM03 Additive Manufacturing for RF Passive Hardware of 38

KA-SAT

Slide 14 WM03 Additive Manufacturing for RF Passive Hardware of 38 Players and trends

Pressure for operators to increase capabilities while decreasing price Æ direct impact on the manufacturers. Technology Operators demands flexible power allocation, coverage areas and frequencies.

Company culture - Risk aversion on the part of satellite operators and an aging workforce. Culture Now, operators receptivity to new and more cost effective capabilities is growing. Manufacturers must support high-risk innovative solutions.

Engagement in all the different market (GEO, non-GEO, EO, etc.) will diversify competitive positioning and increase market share for manufacturers.

Cross - The low price points and rapid development requirements of constellation contracts Innovation drive manufacturing creativity, particularly when a new production line is established.

Broader cross-industry innovation contributes further to new ideas and approaches. Innovations in a product line can be adapted to each market.

Slide 15 WM03 Additive Manufacturing for RF Passive Hardware of 38

Moving Forward

“It is not the strongest of the species that survives, not the most intelligent that survives. It is the one that is the most adaptable to change.” Charles Darwin “Long-term success will be reserved for those capable of adapting their mindset and processes to tomorrow’s demands and setting aside the traditionally nature of the satellite industry to welcome innovation from any source.”

“Darwin and Satellite Manufacturers” Apr 17th, 2016 by Carolyn Belle

Slide 16 WM03 Additive Manufacturing for RF Passive Hardware of 38 Out of the box

Slide 17 of 38

Out of the box

$GGLWLYH0DQXIDFWXULQJ"

Slide 18 of 38 AM Advantages

ͻ Lower energy intensity: These techniques save energy by eliminating production steps, using substantially less material, enabling reuse of by-products, and producing lighter products. ͻ Less waste: Building objects up layer by layer, instead of traditional machining processes that cut away material can reduce material needs and costs by up to 90%. ͻ Reduced time to market: Items can be fabricated as soon as the 3D digital description of the part has been created, eliminating the need for expensive and time-consuming part tooling and prototype fabrication. ͻ Innovation: Additive manufacturing eliminates traditional manufacturing-process design restrictions. It makes it possible to create items previously considered too intricate and greatly accelerates final product design. Multi-functionality can also be embedded in printed materials, including variable stiffness, thermal conductivity, and more. ͻ Mass: Additive techniques can help to reduce the mass in current designs since the material can be locally deposited The design can be optimized. ͻ Complexity: AM enable the manufacturing of new geometric shapes at are not possible with conventional methods. Slide 19 WM03 Additive Manufacturing for RF Passive Hardware of 38

AM challenges

• Tolerances: Some potential applications would require micron-scale accuracy in printing. • Finish: The surface finishes of products manufactured using additive technology require further refinement. With improved geometric accuracy, finishes may impart corrosion and wear resistance or unique sets of desired properties. • Reproducibility: Is today a risk factor in comparison to standard manufacturing process. • Validation and demonstration: Manufacturers, standards organizations, and others maintain high standards for critical structural materials, such as those used in aerospace applications. Providing a high level of confidence in the structural integrity of components built with additive technology may require extensive testing, demonstration, and data collection. • Process control: Feedback control systems and metrics are needed to improve the precision and reliability of the manufacturing process and to increase throughput while maintaining consistent quality.

Slide 20 WM03 Additive Manufacturing for RF Passive Hardware of 38 AM – Mechanical Tolerances, speed and cost

EUV extreme UV lithography DUV deep UV lithography EBL electron-beam lithography NIL nanoimprint lithography STM scanning tunneling microscopy AFM atomic force microscopy

Slide 21 WM03 Additive Manufacturing for RF Passive Hardware of 38

Something us already happening - Topology optimization

Topology Optimization

Slide 22 of 38 Something us already happening - – 3D optimization of RF devices

• Relative freedom – shape defined by certain formulas Current Predefined RF structures • Slow optimization - need for external strategies such as space mapping.

Slide 23 of 38

Impact of AM

• AM provides additional design freedom,withoptimized shapes and materials, mass savings, by limiting the need of bulk materials.

• What is the impact of the use of AM on spacecraft replacing standard manufacturing processes?

• extended opportunities to gather several pieces or functions within one single part. • Function integration • Development plan shortening • Performance optimization (mass, footprint, RF performance, etc.).

Slide 24 of 38 Programmatic

• Reduction of development cycle – parts can be adapted by only changing the CAD model. • Multi-disciplinary aspect will help to reduce the number of parts. Integration of support structures, thermal integration, cable routing integration, etc. • Lead time improvements and manufacturing time improvement are foreseen considering AM. • AIT aspects – Optimization of platform and satellite integration time considering the reduction of number of pieces. – Test can be performed at sub-system level instead of component level. – Auxiliary test fixtures which usually are specific for the program, can be manufactured with AM. • Strong impact in sciences and earth observation missions due to the specificity (low number of units required) of these type of system.

Slide 25 of 38

Performance

• Mass – Lighter elements leading to lighter spacecraft. Optimization of mass will impact on propellant consumption and can be also translated in reduction in the consumption and dissipation of Solar Array, batteries, etc. • Geometry – Additional accommodation capacity which could lead to smaller satellites (reducing the launch cost). • Interfaces – Reduction in the number of interfaces and simplification of the support structures. Possibility to embed the mechanical, thermal and electrical functions. Reduction of integration time. • Reliability – Through the reduction in the number of parts and interfaces.

Slide 26 of 38 Satellite ranking

Structure

Propulsion Life-cycle cost Impact

Performance Power

TTC

Environmental Impact Slide 27 of 38

Function Integration

Thermal aspects Aluminum Titanium

Slide 28 of 38 Function Integration

Thermal aspects

Slide 29 of 38

Function Integration

Mechanical aspects

Slide 30 of 38 Function Integration

Electrical aspects

3D printer that can fabricate multi-material aerospace components with multi- functional purposes Slide 31 of 38

Function Integration

Electrical aspects

Slide 32 of 38 AM within ESA

ESA AM Industry experts Which Technologies? Missing Which Materials? Preliminary GOAL information? Which Products? outcome Challenges?

ESA TD/SD representatives

Standardisation

AM Workshop

AM Roadmap

Slide 33 of 38

AM within ESA

ESA AM Roadmap timeline

October 2013 Meeting with delegates in ESTEC

Mapping meeting in February 2014 ESTEC October 2014 AM Workshop in ESTEC

Draft version sent to February 2015 Eurospace March 2015 European Space Industry Feedback Meeting with THAG April 2015 delegate

June 2015 Roadmap approved by IPC Access to roadmap documents for European industry representatives can be requested writing to Slide 34 [email protected] of 38 Additive Manufacturing Challenges

• Porosity due to entrapped gaz Raw Material

• Porosity due to lack of fusion

Material integrity

• Contamination by brittle material

Cleanliness

Slide 35 of 38

Additive Manufacturing Challenges

• Particles coming from the additive manufacturing process Raw Material

Material integrity

Cleanliness

Slide 36 of 38 Additive Manufacturing Challenges

• Particles coming from the sand blasting process Raw Material

Material integrity

Cleanliness

Slide 37 of 38

Conclusions

o AM is seen as an enabling technology for future space missions o Activities to mature technology and develop high end space hardware have been designed through harmonisation cycle o AM will increase competitiveness of European space industry o AM is a building block of a larger activity – Advanced Manufacturing o RF filters, all theory is based of standard designs which are heavily defined by the previous manufacturing methods. To explore new RF filter designs and shapes, the theory would have to be updated for this capability. o It is clear that some of the major benefits foreseen are when the complete system is changed and adapted for AM. o Specific team composition would be required including payload and system engineers along with the manufacturers

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Conclusions 3 Complex geometries Simple geometric improvements common to realisations • • • realisations Common Method ofstudy Typical components and realisations Motivation 9 Things discovered and on thewayother thoughts filter Flight Contents 3rd October October 3rd 2016 Manufacturing Additive Using Filters Waveguide for EnhancementPerformance th rd order extracted polefilter orderfilter prototype Ridge Ridge guide, evanescentand resonators coaxial The rectangular waveguide cavity Rectangular waveguide Rectangular coupling structures 3rd October 3rd October 2016 [email protected] Paul Booth, Elena Vallés Lluch Hardware Passive RF for Manufacturing Additive WM03 Conference Microwave46th European UsingAdditiveFilters Manufacturing WaveguidePerformance Enhancementfor 2 WM03 WM03 Additive Manufacturing RF Passivefor Hardware 46th European Microwave ConferenceMicrowave European46th 46th European Microwave Conference Performance Enhancement for Waveguide Filters Using Additive Manufacturing WM03 Additive Manufacturing for RF Passive Hardware Motivation nts to others without express authorization is authorization express without to others nts

Feed Payload Filters Filters , utility model or design.

Reduce Enhance out Enhance Feed Reduce Reduce Reduce Radiator of band Performances Filter Size mass cost Size performance

AO/1-6776/11/NL/GLC Reduce Improve out of Modelling and Design of Optimised band performance Waveguide Components Utilising 3D Insertion Losses All rights reserved.The reproduction, distribution and utilization of this document as well asthe communication of its conte – Manufacturing Techniques

Complex Additive Geometries Manufacturing © 2016 Airbus Defence and Space Space and Defence Airbus 2016 © prohibited. Offenders will be held liable for the payment of damages. All rights reservedin the event of the grant of a pate nt

3rd October 2016 3

46th European Microwave Conference Performance Enhancement for Waveguide Filters Using Additive Manufacturing WM03 Additive Manufacturing for RF Passive Hardware Typical RF Components.

Feed components: Horn, Polarizers, Multiplexers,… nts to others without express authorization is authorization express without to others nts , utility model or design.

Payload Filters All rights reserved.The reproduction, distribution and utilization of this document as well asthe communication of its conte – © 2016 Airbus Defence and Space Space and Defence Airbus 2016 © prohibited. Offenders will be held liable for the payment of damages. All rights reservedin the event of the grant of a pate nt

3rd October 2016 4 46th European Microwave Conference Performance Enhancement for Waveguide Filters Using Additive Manufacturing WM03 Additive Manufacturing for RF Passive Hardware Typical Filter Types

Technology: Waveguide, Coaxial, Planar. Depending on the frequency band and required performances Single mode / dual mode

nts to others without express authorization is authorization express without to others nts Type: LPF, BPF, Band Reject

Rectangular waveguide (TE101): due to the typical requirements for our applications it is the technology that we most commonly use. This technology is used as starting point to try to improve performance by the use of ALM. , utility model or design. All rights reserved.The reproduction, distribution and utilization of this document as well asthe communication of its conte – © 2016 Airbus Defence and Space Space and Defence Airbus 2016 © prohibited. Offenders will be held liable for the payment of damages. All rights reservedin the event of the grant of a pate nt

3rd October 2016 5

46th European Microwave Conference Performance Enhancement for Waveguide Filters Using Additive Manufacturing WM03 Additive Manufacturing for RF Passive Hardware Typical Filter Manufacturing Techniques

Typical Manufacturing techniques for RF components: nts to others without express authorization is authorization express without to others nts , utility model or design.

Spark Eroded WG Bandpass Filter Milled WG Bandpass Filter Milled OMT polarizer Turned Corrugated Horn

Assembly: normally manufactured in two pieces and bolted together. In order to minimize losses and leakage filter cut in two halves (E-plane) or body/lid (arranged in H-plane) All rights reserved.The reproduction, distribution and utilization of this document as well asthe communication of its conte –

Two halves (E-plane) and bolted together Body and Lid (H-plane) model © 2016 Airbus Defence and Space Space and Defence Airbus 2016 © prohibited. Offenders will be held liable for the payment of damages. All rights reservedin the event of the grant of a pate nt

3rd October 2016 6 46th European Microwave Conference Performance Enhancement for Waveguide Filters Using Additive Manufacturing WM03 Additive Manufacturing for RF Passive Hardware Method of Study

Simple third order filter at Ku-band nts to others without express authorization is authorization express without to others nts • Consistent centre frequency and bandwidth • Consistent conductivity applied

Overall Q of the filter calculated for all structures , utility model or design. • This is ultimately what is important • Q of standalone resonators also calculated to help apportion effects of coupling structures

Spurious performance for filter calculated • Any mode with less than 30dB rejection classed as spurious • Eigen mode analysis of standalone resonators calculated to assess mode suppression of coupling structure All rights reserved.The reproduction, distribution and utilization of this document as well asthe communication of its conte – Surface currents analysed • Areas with high current density targets for reduction through geometry modifications © 2016 Airbus Defence and Space Space and Defence Airbus 2016 © prohibited. Offenders will be held liable for the payment of damages. All rights reservedin the event of the grant of a pate nt

3rd October 2016 7

46th European Microwave Conference Performance Enhancement for Waveguide Filters Using Additive Manufacturing WM03 Additive Manufacturing for RF Passive Hardware Common Realisations The Rectangular Waveguide Cavity

Inductive iris coupled for consistency nts to others without express authorization is authorization express without to others nts

A and B dimension varied

, utility model or design. Resonant mode varied

Dual mode analysed • TE102/TE201, TE301/TE103, TE301/TE102, TE301/TE202

Basic Modification on the Q Out of band performance Resonator

▲Height ▲ ▼ All rights reserved.The reproduction, distribution and utilization of this document as well asthe communication of its conte – ▼▲ (There is an ▲Width ▲▼ (There is an optimum) optimum) ▲Resonant mode ▲ ▼ (i.e. TE102) © 2016 Airbus Defence and Space Space and Defence Airbus 2016 © prohibited. Offenders will be held liable for the payment of damages. All rights reservedin the event of the grant of a pate nt

3rd October 2016 8 46th European Microwave Conference Performance Enhancement for Waveguide Filters Using Additive Manufacturing WM03 Additive Manufacturing for RF Passive Hardware Common Realisations Rectangular Waveguide Coupling Structures

Inductive iris coupled nts to others without express authorization is authorization express without to others nts • For the analysed range: the thicker the iris the higher the Qeff. An optimum length exists

Capacitive iris coupled , utility model or design. • For the analysed range: the shorter the iris the higher the Qeff. An optimum length exists but it leads to extremely small iris height

Inductive posts (one, two and three posts) • No improvement in Q and worse out of band performance

Circular iris coupled • Higher Q than inductive or capacitive irises and better out of band performance All rights reserved.The reproduction, distribution and utilization of this document as well asthe communication of its conte –

3rd October 2016 9

Ridgeguide with iris coupling nts to others without express authorization is authorization express without to others nts • Single and double ridges studied

Ridgeguide with evanescent coupling

, utility model or design. Coaxial resonator

All show improved out of band performance compared to rectangular waveguide with increased insertion loss for better out of band response

3rd October 2016 10 46th European Microwave Conference Performance Enhancement for Waveguide Filters Using Additive Manufacturing WM03 Additive Manufacturing for RF Passive Hardware Simple Geometric Improvements to Common Realisations

Rectangular waveguide cavity nts to others without express authorization is authorization express without to others nts • Corner blending applied in E, H and Z planes • Z and E plane showed greatest increase in Q • Z plane showed higher second eigen mode frequency but in a filter the TE102 mode reduces in frequency , utility model or design.

Inductive iris in rectangular waveguide • Corner blending studied • Elliptic blending studied • Both showed improvements in filter Q with no appreciable change to out of band performance • There is an optimum elliptic blend for given iris dimensions All rights reserved.The reproduction, distribution and utilization of this document as well asthe communication of its conte – © 2016 Airbus Defence and Space Space and Defence Airbus 2016 © prohibited. Offenders will be held liable for the payment of damages. All rights reservedin the event of the grant of a pate nt

3rd October 2016 11

46th European Microwave Conference Performance Enhancement for Waveguide Filters Using Additive Manufacturing WM03 Additive Manufacturing for RF Passive Hardware Complex Geometries

Ellipsoidal Cavity nts to others without express authorization is authorization express without to others nts • Higher Q than standard rectangular waveguide resonator; 6400 vs 5400 • Higher second Eigen mode resonance; 18.3GHz vs 17.6GHz , utility model or design.

Super-ellipsoidal Cavity • Q increased compared to ellipsoidal cavity – greater volume/surface area • Second Eigen mode resonance decreased compared to ellipsoidal cavity

Depressed Super-ellipsoidal Cavity All rights reserved.The reproduction, distribution and utilization of this document as well asthe communication of its conte – • Higher Q than standard rectangular waveguide resonator; 6400 vs 5400 • Higher second Eigen mode resonance; 20GHz vs 17.6GHz • Easy to customise for better Q or better out of band performance © 2016 Airbus Defence and Space Space and Defence Airbus 2016 © prohibited. Offenders will be held liable for the payment of damages. All rights reservedin the event of the grant of a pate nt

3rd October 2016 12 46th European Microwave Conference Performance Enhancement for Waveguide Filters Using Additive Manufacturing WM03 Additive Manufacturing for RF Passive Hardware 3rd order filter prototype Design

3rd order Single mode based on depressed nts to others without express authorization is authorization express without to others nts super-ellipsoid cavity

Irises elliptic in Z-plane

, utility model or design. • Ideal would be circular but greater coupling required

Iris to cavity blend is parabolic

Pass band 12.75-13GHz

Optimised to reject all modes up to 20GHz whilst having better Q than rectangular waveguide All rights reserved.The reproduction, distribution and utilization of this document as well asthe communication of its conte – (5100 vs 4500) © 2016 Airbus Defence and Space Space and Defence Airbus 2016 © prohibited. Offenders will be held liable for the payment of damages. All rights reservedin the event of the grant of a pate nt

3rd October 2016 13

46th European Microwave Conference Performance Enhancement for Waveguide Filters Using Additive Manufacturing WM03 Additive Manufacturing for RF Passive Hardware 3rd order filter prototype Manufacture

RF internals sent to Airbus Group Innovations nts to others without express authorization is authorization express without to others nts where it was skinned and manufactured using laser melting of AlSi10Mg

, utility model or design. Two samples manufactured with same internals but differing externals and build orientations

The best one was sent for silver plating

RF tests after silver plating revealed areas of concern • Flanges had to be reworked – too rough for a good RF All rights reserved.The reproduction, distribution and utilization of this document as well asthe communication of its conte – contact • Irises were misshapen on the ‘downside’ of the build • Irises reworked to improve return loss at the expense of loss due to silver plating removal © 2016 Airbus Defence and Space Space and Defence Airbus 2016 © prohibited. Offenders will be held liable for the payment of damages. All rights reservedin the event of the grant of a pate nt

3rd October 2016 14 46th European Microwave Conference Performance Enhancement for Waveguide Filters Using Additive Manufacturing WM03 Additive Manufacturing for RF Passive Hardware 3rd order filter prototype RF Measurements

Passband narrower than as designed nts to others without express authorization is authorization express without to others nts

Centred in frequency

, utility model or design. Slight mismatch

No tuning of the manufactured unit

All rights reserved.The reproduction, distribution and utilization of this document as well asthe communication of its conte – © 2016 Airbus Defence and Space Space and Defence Airbus 2016 © prohibited. Offenderswill be held liable for the payment of damages. All rights reservedin the eventof the grant of a pate nt

3rd October 2016 15

The filter before iris modification had a Q calculated to be approximately 5000 nts to others without express authorization is authorization express without to others nts

With the iris modification this decreased to 3200

, utility model or design. Future builds will be tested and visually inspected before plating • Any rough edges may be removed before plating to ensure good final performance

Build had quite good accuracy as the centre frequency was correct

Out of band performance very close to predictions

3rd October 2016 16 Confidential 46th European Microwave Conference Performance Enhancement for Waveguide Filters Using Additive Manufacturing WM03 Additive Manufacturing for RF Passive Hardware 9th order extracted pole filter

9th order generalised chebyshev response with nts to others without express authorization is authorization express without to others nts three transmission zeroes

Single mode based on depressed super-

, utility model or design. ellipsoid cavity with extracted pole technique to realise transmission zeroes

Irises elliptic in Z-plane • Ideal would be circular but greater coupling required

Iris to cavity blend is parabolic

Optimised to reject all modes up to 20GHz whilst having better Q than rectangular waveguide © 2016 Airbus Defence and Space Space and Defence Airbus 2016 © prohibited. Offenderswill be held liable for the payment of damages. All rights reservedin the eventof the grant of a pate nt (5100 vs 4500)

3rd October 2016 17

46th European Microwave Conference Performance Enhancement for Waveguide Filters Using Additive Manufacturing WM03 Additive Manufacturing for RF Passive Hardware 5th order filter for flight Breadboard Design

5th order single mode based on depressed nts to others without express authorization is authorization express without to others nts super-ellipsoid cavity based on work performed under ESTEC contract

, utility model or design. Irises circular in Z-plane • Input iris must be elliptic for sufficient coupling Parameter Requirement Iris to cavity blend is parabolic Passband 14 – 14.25GHz Insertion Loss 0.35dB • Blend is different in X and Y directions Rejection 4.9-10.95GHz 50dB Low pass filter required 10.95-11.2GHz 120dB 11.2- 13.25GHz 50dB • Trade off showed rejection up to 30GHz could be met with 15.3-40GHz 30dB just a band pass filter Return Loss 21dB All rights reserved.The reproduction, distribution and utilization of this document as well asthe communication of its conte – • Above this BP-LP had less loss Mass 120g

3rd October 2016 18 46th European Microwave Conference Performance Enhancement for Waveguide Filters Using Additive Manufacturing WM03 Additive Manufacturing for RF Passive Hardware 5th order filter for flight Breadboard Manufacture and Test

RF and mechanical modelling performed by nts to others without express authorization is authorization express without to others nts Airbus.

Three samples manufactured to allow different

, utility model or design. processing paths

Best one silver plated (electrolytic) • All three met requirements

RF tests after silver plating showed good agreement with predictions

3rd October 2016 19

Update to requirements reduced rejection nts to others without express authorization is authorization express without to others nts requirements above band to 22GHz (c.f. 40GHz) • Lowpass no longer required • Cavity modified to reject up to 24GHz

, utility model or design. Externals kept simple • High load and stress margins • Longer than RF dictates as the part had to be a drop-in replacement for a standard filter • Mass of only 60g

Vibration and thermal vacuum tested

All rights reserved.The reproduction, distribution and utilization of this document as well asthe communication of its conte Units manufactured in same batch have been; – • Shock tested • Life tested (thermal cycling) • Thermal shock tested prohibited. Offenderswill be held liable for the payment of damages. All rights reservedin the eventof the grant of a pate nt © 2016 Airbus Defence and Space Space and Defence Airbus 2016 ©

3rd October 2016 20 46th European Microwave Conference Performance Enhancement for Waveguide Filters Using Additive Manufacturing WM03 Additive Manufacturing for RF Passive Hardware Flight Filter Performance nts to others without express authorization is authorization express without to others nts , utility model or design. ev the in reserved rights All . damages of payment the for All rights reserved.The reproduction, distribution and utilization of this document as well asthe communication of its conte – liable held be will Offenders . © 2016 Airbus Defence and Space Space and Defence Airbus 2016 © prohibited.prohibited Offenders will be held liable for the payment of damages. All rights reservedin the event of the grant of a pate nt

3rd October 2016 21

46th European Microwave Conference Performance Enhancement for Waveguide Filters Using Additive Manufacturing WM03 Additive Manufacturing for RF Passive Hardware Things discovered on the way and other thoughts

Loss is not as bad as surface roughness would suggest • The microscopic topology is different

nts to others without express authorization is authorization express without to others nts • Machined surfaces have sharp peaks and troughs • AM surface is spheroids melted together so less sharpness

Build direction is critical , utility model or design. • Ideally the roughest surfaces (downsides in a build) should be in areas of low surface current • Other factors such as external support requirements may prevent this • Bridging occurs where two surfaces meet and can cause cracks or defects to appear

Tolerances are better than they first appear • When measuring cuboids the extremes (peaks) tend to be measured • More organic shapes tend to have less in-built stress so distort less when cooled and released from the build plate

Total cost of manufacture reduced All rights reserved.The reproduction, distribution and utilization of this document as well asthe communication of its conte – • Monolithic part requires very little additional work compared to split half designs © 2016 Airbus Defence and Space Space and Defence Airbus 2016 © prohibited. Offenders will be held liable for the payment of damages. All rights reservedin the event of the grant of a pate nt

3rd October 2016 22 46th European Microwave Conference Performance Enhancement for Waveguide Filters Using Additive Manufacturing WM03 Additive Manufacturing for RF Passive Hardware Conclusions

Extensive analysis of basic resonator structures and other structures performed nts to others without express authorization is authorization express without to others nts A first sample filter designed and optimised to assess validity of ideas and manufacturing process with good results

, utility model or design. Flight filter built and fully tested leading to a qualified design • The RF performance was very encouraging

Standard electrolytic silver plating is suitable for selective laser melted parts

Shaping overcomes the increased loss from AM surface roughness

– Mass reduced and can be reduced further with more aggressive mechanical design and will be critical for very high throughput satellites

Cost reduced © 2016 Airbus Defence and Space Space and Defence Airbus 2016 © prohibited. Offenderswill be held liable for the payment of damages. All rights reservedin the eventof the grant of a pate nt

3rd October 2016 23

46th European Microwave Conference Performance Enhancement for Waveguide Filters Using Additive Manufacturing WM03 Additive Manufacturing for RF Passive Hardware Acknowledgements nts to others without express authorization is authorization express without to others nts AO/1-6776/11/NL/GLC Modelling and Design of Optimised Waveguide Components Utilising 3D Manufacturing Techniques , utility model or design.

– Christoph Ernst

3rd October 2016 24 46th European Microwave Conference Performance Enhancement for Waveguide Filters Using Additive Manufacturing WM03 Additive Manufacturing for RF Passive Hardware nts to others without express authorization is authorization express without to others nts

, utility model or design. Thank you for your attention!

[email protected] [email protected]

3rd October 2016 25 Additive Manufacturing of Waveguide Low-pass Filters by Selective Laser Melting: Lessons Learned Giuseppe Addamo

CNR - IEIIT

[email protected]

WM03 Additive Manufacturing for RF Passive Hardware Slide 1 of 30

Team & Expertise

O. A. Peverini, M. Lumia, F. Calignano, D. Manfredi, G. Addamo, G. Virone, R. Tascone M. Lorusso, E. P. Ambrosio, P. Fino

Expertise in microwave and millimeter- Expertise in Additive Manufacturing wave components/systems

WM03 Additive Manufacturing for RF Passive Hardware Slide 2 of 30 AM Technologies

ASTM definition of Additive Manufacturing (AM) A process of joining materials to make objects from 3-D model data, usually layer upon layer, as opposed to subtractive manufacturing methodologies ASTM classification of AM technologies Binder jetting: a liquid bonding agent is selectively deposited to join powder materials. Direct Energy deposition: focused thermal energy is used to fuse materials by melting as they are being deposited. Material extrusion: material is selectively dispensed through a nozzle or orifice (Fused Deposition Modelling) Material jetting: droplets of build materials are selectively deposited (3-D inkjet printing) Powder bed fusion: thermal energy selectively fuses regions of a powder bed (Electron Beam Melting, Selective Laser Melting) Sheet laminations: sheets of material are bonded to form an object Vat photo-polymerization: liquid photopolymer in a vat is selectively cured by light-activated polymerization (Stereolitography)

WM03 Additive Manufacturing for RF Passive Hardware Slide 3 of 30

AM Technologies

State of Art

Technology Material Coating RF components Band

Patch and conical antennas Fused Deposition Polymers Conductive Feed-horns Modeling 1 GHz – 18 GHz (ABS, PLA) paintings Microstrip and SIW filters (FDM) Dielectric lenses

Polymers Conductive 1 GHz – 18 GHz 3-D inkjet printing Planar components Conductive inks paintings

Conductive Waveguide filters Ceramics paintings Polarizers Stereolitography (SLA) (alumina, zirconia) 5 GHz – 110 GHz Electroless plating Feed-horns Polymers Dielectric lenses Selective Laser Waveguide filters Metals 10 GHz – 31 GHz Melting Ag/Ni plating Ortho-mode transducers (Al-alloy, Ni bronze) (SLM) Beam-forming networks

WM03 Additive Manufacturing for RF Passive Hardware Slide 4 of 30 Selective Laser Melting

Selective laser melting (SLM) process is a layer-by-layer additive manufacturing technique based on fusing metal powders by means of a high-power laser beam Main advantages

Manufacturing of parts with complex geometries integration of several RF functionalities in a single block, minimization of flanges and screws (e.g. SFB and MFB satellite communication systems)

Design flexibility novel layouts of waveguide components

Near-net shapes reduction of mass and waste

Reduction of lead time and cost more efficient component development

Main concerns (?)

Manufacturing accuracy and repeatability poor RF performance @ high frequencies (Ka, Q bands)

Maximum part size no applicability to low frequency applications (C, X bands)

Surface roughness high insertion losses

WM03 Additive Manufacturing for RF Passive Hardware Slide 5 of 30

SLM Process: 3D CAD model

A set of parameters must be defined in order to respect the specifications as well as the manufacturing constraints (thicknesses, filled radii, ...).

WM03 Additive Manufacturing for RF Passive Hardware Slide 6 of 30 SLM Process: Support Structure

The main functions of the supports are to fix the part to building platform and conduct excess heat away from the part.

WM03 Additive Manufacturing for RF Passive Hardware SlideSlide 7 of 30

SLM Process: Slicing

A key enabling principle of AM part manufacture is the use of layers as finite 2D cross-sections of the 3D model.

WM03 Additive Manufacturing for RF Passive Hardware Slide 8 of 30 SLM Process: Part Build

DMLS EOS M270 Xtdended

Technical Data Effective building volume 250 mmx 250 mm x 215 mm (including building platform) Building speed 2 – 20 mm3/s (material-dependent) Layer thickness 20 – 60 μm (material-dependent) Laser type Yb-fibre laser, 200 W Precision optics F-theta-lens, high-speed scanner DMLS is an EOS Gmbh Scan speed 100-3000 mm/s tradename for SLM Variable focus diameter 100 – 200 μm Materials Power supply 32 A Titanium Ti6Al4V Power consuption Maximum 5.5 kW Aluminum AlSi10Mg

WM03 Additive Manufacturing for RF Passive Hardware Slide 9 of 30

SLM Process: Stress Relieving

Stress relieving by thermal treatment is used to remove residual stresses that have accumulated from manufacturing processes. The part must be separated from a build platform on which the part was produced.

WM03 Additive Manufacturing for RF Passive Hardware Slide 10 of 30 SLM Process: Post-processing

As built After Post-processing: shot-peening, polishing and sandpapering, or application of coatings

Shot peening is a cold working process in which small spherical media called shot bombard the surface of a part With glass microspheres (200μm) at 8 bar

Ra ~ 5 Pm

WM03 Additive Manufacturing for RF Passive Hardware Slide 11 of 30

Metal Powders: AlSi10Mg

Si: 9 – 11 wt%, Mg: 0.2 – 0.45 wt%,Fe, Cu, Ni, Zn: ≤0.1 wt% , Al: Balance

Properties high specific strentgh and stiffness good corrosion resistance good thermal conductivity final density 99.2% DMLS process reliable and reproducible fracture’s surfaces with dimples of nanometric thickness Applications

used for parts with thin walls and complex geometry subjected to high loads, as in the aerospace and automotive industries

WM03 Additive Manufacturing for RF Passive Hardware Slide 12 of 30 Metal Powders: Ti6Al4V

Al: 5.5 – 6.5 wt %, V : 3.5 – 4.5 wt %, N < 500 ppm, C < 800 ppm, H < 120 ppm, Fe < 2500 ppm, Ti: Balance

Properties excellent mechanical properties corrosion resistance low specific weight biocompatibility better surface finishing higher manufacturing accuracy higher powders costs Applications ideal for many high-performance engineering applications, for example in aerospace and motor racing, and also for the production of biomedical implants

WM03 Additive Manufacturing for RF Passive Hardware Slide 13 of 30

Mechanical Benchmarks for SLM

Mechanical benchmarks help to know the limits of the technology to be confident in the design

Study for optimizing the realization of holes (0.5:0.5:6) and slots (0.25:0.5:3)

radii (positive and negative) angles dimensional control (Reverse Engineering) Different building degrees of slope

WM03 Additive Manufacturing for RF Passive Hardware Slide 14 of 30 RF Benchmarks for SLM

RF benchmarks help to know the suitability of the technology to the intended application

WR51 narrow-band cavity

z y

x Downward facing surface

Supports Key aspects Part orientation on the building platform Supports for overhanging structures

WM03 Additive Manufacturing for RF Passive Hardware Slide 15 of 30

RF Benchmark for SLM

AlSi10Mg sample without silver plating Equivalent electrical surface resistivity ρ = 20 P:cm Manufacturing uncertainty ~ 0.1 mm

Reflection coefficient Transmission coefficient

WM03 Additive Manufacturing for RF Passive Hardware Slide 16 of 30 RF Benchmark for SLM

AlSi10Mg sample with silver plating Equivalent electrical surface resistivity ρ = 8 P:cm Manufacturing uncertainty ~ 0.1 mm

Reflection coefficient Transmission coefficient

WM03 Additive Manufacturing for RF Passive Hardware Slide 17 of 30

RF Benchmark for SLM

Ti6Al4V sample without silver plating Equivalent electrical surface resistivity ρ = 2.5E2 P:cm Manufacturing uncertainty ~ 0.05 mm

Reflection coefficient Transmission coefficient

WM03 Additive Manufacturing for RF Passive Hardware Slide 18 of 30 RF Benchmark for SLM

Ti6Al4V sample with silver plating Equivalent electrical surface resistivity ρ = 8 P:cm Manufacturing uncertainty ~ 0.05 mm

Reflection coefficient Transmission coefficient

WM03 Additive Manufacturing for RF Passive Hardware Slide 19 of 30

Ku/K-band E-plane Filters Design

Pass-band design

WR51 rectangular waveguide seventh-order layout iris discontinuities Simulated scattering parameters minimum gap = 1 mm

Parameter Value Pass-band 12.5 - 15.0 GHz (20%) Stop-band 17.5 - 21.2 GHz (23%) Return loss ≥ 30 dB Insertion loss ≤ 0.1 dB Rejection ≥ 40 dB

WM03 Additive Manufacturing for RF Passive Hardware Slide 20 of 30 Ku/K-band E-plane Filters Design

Stop-band design

WR51 rectangular waveguide fifth-order layout composite step/stub resonators alternating arrangement of the Simulated scattering parameters resonators resonators directly coupled (no waveguide lengths) minimum gap = 5 mm

Parameter Value Pass-band 12.5 - 15.0 GHz (20%) Stop-band 17.5 - 21.2 GHz (23%) Return loss ≥ 30 dB Insertion loss ≤ 0.1 dB Rejection ≥ 40 dB

WM03 Additive Manufacturing for RF Passive Hardware Slide 21 of 30

Filters Sensitivity Analysis

Manufacturing uncertainty parameters

Uniform distribution Support: [-0.1, +0.1] mm (worst case analysis) Number of samples: 1e4

Reflection coefficient Reflection coefficient

WM03 Additive Manufacturing for RF Passive Hardware Slide 22 of 30 Filters Sensitivity Analysis

Manufacturing uncertainty parameters Uniform distribution Support: [-0.1, +0.1] mm (worst case analysis) Number of samples: 1e4

Transmission coefficient Transmission coefficient

WM03 Additive Manufacturing for RF Passive Hardware Slide 23 of 30

Filters Sensitivity Analysis

Manufacturing uncertainty parameters Uniform distribution Support: [-0.1, +0.1] mm (worst case analysis) Number of samples: 1e4

Statistical distribution Statistical distribution

WM03 Additive Manufacturing for RF Passive Hardware Slide 24 of 30 AlSi10Mg Stop-band Filter

Fifth-order WR51 stub filter in AlSi10Mg

Measured performance of six prototypes

Parameter Value Pass-band 12.5 - 15.0 GHz Stop-band 17.5 - 21.2 GHz Return loss ≥ 24 dB Insertion loss ≤ 0.15 dB Rejection ≥ 40 dB Port flange WR51 Dimension 20 mm x 20 mm x 48 mm (width x height x length) No tuning screws, part re-machining Weight < 25 g or silver-plating WM03 Additive Manufacturing for RF Passive Hardware Slide 25 of 30

AlSi10Mg Stop-band Filter

Fifth-order WR51 stub filter in AlSi10Mg

Measured insertion loss for silver-plated prototype Parameter Value silver plated Pass-band 12.5 - 15.0 GHz Stop-band 17.5 - 21.2 GHz Return loss ≥ 24 dB Insertion loss ≤ 0.15 dB not silver Rejection ≥ 40 dB plated Port flange WR51 Dimension 20 mm x 20 mm x 48 mm (width x height x length) Weight < 25 g

WM03 Additive Manufacturing for RF Passive Hardware Slide 26 of 30 AlSi10Mg Stop-band Filter

Sixth-order WR51 stub filter in AlSi10Mg

z y x

Supports

Key aspects Part orientation along building direction (laser beam z-axis) Tuning of SLM machine parameters through test lines Higher out-of-band rejection (> 50 dB)

WM03 Additive Manufacturing for RF Passive Hardware Slide 27 of 30

AlSi10Mg Stop-band Filter

Sixth-order WR51 stub filter in AlSi10Mg

Measured performance of two prototypes

Parameter Value Pass-band 12.5 - 15.0 GHz Stop-band 17.5 - 21.2 GHz Return loss ≥ 25 dB Insertion loss ≤ 0.12 dB Rejection ≥ 50 dB Port flange WR51 Dimension 30 mm x 30 mm x 52 mm (width x height x length) Weight < 30 g

WM03 Additive Manufacturing for RF Passive Hardware Slide 28 of 30 AlSi10Mg Stop-band Filter

Sixth-order WR51 stub filter in AlSi10Mg

Measured insertion loss for silver-plated prototype Parameter Value silver plated Pass-band 12.5 - 15.0 GHz Stop-band 17.5 - 21.2 GHz Return loss ≥ 25 dB not silver Insertion loss ≤ 0.12 dB plated Rejection ≥ 50 dB Port flange WR51 Dimension 30 mm x 30 mm x 52 mm (width x height x length) Weight < 30 g

WM03 Additive Manufacturing for RF Passive Hardware Slide 29 of 30

Conclusions

SLM manufacturing of RF components in AlSi10Mg

Mechanical accuracy: 0.1 mm (worst-case) Surface roughness: Ra 5-15 Pm Electrical resistivity: < 16 P: cm (no coating is necessary) Repeatability: good Ku/K-band low-pass filters are feasible Tuning of machine parameters to reduce systematic errors underway K/Ka-band OMTs are under investigation

SLM manufacturing of RF components in Ti6Al4V

Mechanical accuracy: 0.05 mm (worst-case) Surface roughness: Ra 4-10 Pm Electrical resistivity: > 200 P: cm (coating is necessary) Repeatability: under investigation Coating of complex parts is under investigation Ku/K-band low-pass filters are under investigation

WM03 Additive Manufacturing for RF Passive Hardware Slide 30 of 30

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AnEducationalPerspectiveofLowͲCostAdditive ManufacturingbyFusedFilamentFabricationof MicrowaveWaveguidePassiveDevices

JoséRamónMontejoͲGarai IreneO.SarachoͲPantoja JorgeA.RuizͲCruz* Jesús M.Rebollar

* E.T.S.ITelecomunicación UniversidadPolitécnica deMadrid(SPAIN) [email protected]

WM03AdditiveManufacturingforRFPassiveHardware 1/28

Outline

1. Introduction a)Educationalpointofviewoftheadditivemanufacturing. b)TheFusedFilamentFabrication(FFF)process:maincharacteristics. c)Rapidprototyping.

2.Rectangularwaveguidecharacterization a)Accuracyandconfigurations. b)Metallizationprocess:thebottleneck.

3.Passivedevicesdesign a)Filterdesign:lowͲpass,highͲpassandbandͲpass. b)Hornantennas.

4.Conclusions

WM03AdditiveManufacturingforRFPassiveHardware 2/28 1.Introduction:EducationalpointofviewofFFF

Planestructure:MicroͲstripline

• Smalllabs. • Lowcost. • Professionalresult. • Fastprototyping. • VerycommoninRFcurriculum.

WM03AdditiveManufacturingforRFPassiveHardware 3/28

1.Introduction:EducationalpointofviewofFFF

Waveguidetechnology

• Millingmachine. • Expertiseoperator. • Expensive. • Professionalresult. • Outofacademicenvironment.

WM03AdditiveManufacturingforRFPassiveHardware 4/28 1.Introduction:EducationalpointofviewofFFF

FusedFilamentFabrication (FFF)appliedtopassivewaveguidedevices

Filters

Hornantennas

WM03AdditiveManufacturingforRFPassiveHardware 5/28

1.Introduction:EducationalpointofviewofFFF

FFFinacademicenvironment:

• If1image>1000words,1object >1000images.

• Printingprototypesischeap.

• Printingcomplexgeometricsisfast.

• Thestudentisinvolvedinthewholeengineeringprocess:design, manufacturingandmeasurement.

WM03AdditiveManufacturingforRFPassiveHardware 6/28 1.Introduction:EducationalpointofviewofFFF

FusedFilamentFabricationinacademia

• LowͲcostadditivemanufacturingprocess. RepRapprojectKitBCN3D+750€. PlasticfilamentPLA25€/kg.

• Useofopenhardware&software(Arduino,Slic3r,etc.) • Largemakercommunityallovertheworld. Application inscienceandeducationareas. • Rapidprototypingallowingfastmodificationofthe geometry. • Experimentationwithshapesuntilnowunachievableby traditionalsubtractivetechniques.

PLA ABS

http://reprap.org/

WM03AdditiveManufacturingforRFPassiveHardware 7/28

1.Introduction:EducationalpointofviewofFFF

OpenSCAD The Programmers Solid 3D CAD Modeller STLfileformat

http://slic3r.org/

WM03AdditiveManufacturingforRFPassiveHardware 8/28 1.Introduction:EducationalpointofviewofFFF

Rapidprototyping,thedevicecanbe“touched”

TurnstilebasedOMT EͲplanediplexer

EͲplaneantennafeedchain

WM03AdditiveManufacturingforRFPassiveHardware 9/28

2.Rectangularwaveguidecharacterization

3Dprintingstrategy

• EͲplaneversusHͲplane. • Alignmentversuscontact. • Accuracy±0.1mm. • Filamentradio. • EveryPLA/ABStrademarkisdifferent.

WM03AdditiveManufacturingforRFPassiveHardware 10 /28 2.Rectangularwaveguidecharacterization

Metallizationprocess:thebottleneck.

• Noinformationaboutconductivityvalue

V 1.666.666 S / m 20Ͳ 60mё /square;10ʅmthickness(2Ͳ 6x10Ͳ5ͼɏcm) V 5.000.000 S / m

Silver20gBottlePaintConductiveAdhesive

Resistivity Conductivity U 0.001 : cm V 100.000 S / m WM03AdditiveManufacturingforRFPassiveHardware 11 /28

2.Rectangularwaveguidecharacterization

WR75KuͲband10Ͳ 15GHz

WR75 Length=40 mm 0 s11 LT Accuracy=0.1mm s11 RS -5 ʍef=50.000S/m

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WR75KuͲband10Ͳ 15GHz

WR75 Length=40 mm 0 Accuracy=0.1mm

ʍef=50.000S/m -0.5

-1 s21 Loctite s21 RS CST =50000 S/m -1.5 (dB)

-2

-2.5

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WM03AdditiveManufacturingforRFPassiveHardware 13 /28

3.Passivedevicesdesign:filters

Preliminaryissues:

• Filtersareessentialdevicesforcommunications. •Resonantstructureswithstrongelectromagneticfields. • Highsensitivitytodimensiontolerances. •Theoreticalsynthesisprocessandfullwavesimulation. •Threekindsofresponses:lowͲpass,highͲpass,bandͲpass.

Goals:

•LowͲcostdeviceswithoutpreviousinvestmentinlaboratory. •Rapidprototyping,flexibility,3Dprintingknowledge. •Newshapes;additiveversussubtractivemanufacturing. •DIY(DoItYourself)philosophy.

WM03AdditiveManufacturingforRFPassiveHardware 14 /28 3.Passivedevicesdesign:lowͲpassfilter

LowͲpassfilter 3DPrintingissues

• Bandwidth11.9Ͳ12.2GHz. •Printingaccuracy 0.1mm. •Returnloss>28dB •Mainbodymisalignment. • Rejection>50dB(13.75Ͳ14.0GHz). •Flangesmisalignment. •Widthofcorrugations. •EightͲorderfilter,fourcorrugations. •HeightcorrespondingtoWR75withoutI/Otransformers. •Widthofcorrugations2.5mm.

Low-pass filter lay-out PLA printed pieces WM03AdditiveManufacturingforRFPassiveHardware 15 /28

3.Passivedevicesdesign:lowͲpassfilter

• ʍef=50.000S/m • Highsensitivityduetocorrugations. • Smallwidthofcorrugationsforpainting. • MainͲbodymisalignment.

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HighͲpassfilter 3DPrintingissues

• Bandwidth13.75Ͳ14.0GHz. •Printingaccuracy 0.1mm. •Returnloss>28dB •Mainbodymisalignment. • Rejection>50dB(11.9Ͳ12.2GHz). •Flangesmisalignment. •Widthofsteps. • WaveguideundercutͲoff.

High-pass filter lay-out PLA printed pieces

WM03AdditiveManufacturingforRFPassiveHardware 17 /28

3.Passivedevicesdesign:highͲpassfilter

• ʍef=50.000S/m • WidthofthesectionundercutͲoff

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• BandͲpassfilterinductiveirises. • KubandWR75:10Ͳ15GHz. • ChebyshevN=3. fo=12GHz BW=600MHz RL=20dB (dB) • Manufacturetime:2hours. • PLAcost<1€.

ʍef=50.000S/m

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3.Passivedevicesdesign:hornantennas

PyramidalHorn Matchinglevel 0 Simulated -5 Measured

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WM03AdditiveManufacturingforRFPassiveHardware 20 /28 3.Passivedevicesdesign:hornantennas

PyramidalHorn dB dB

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3.Passivedevicesdesign:hornantennas

PyramidalHorn Gain 17 Flann Measured Simulated 16

15 dB

12 10 11 12 13 14 15 Frequency(GHz)

WM03AdditiveManufacturingforRFPassiveHardware 22 /28 3.Passivedevicesdesign:hornantennas

ConformedͲprofileHorn Matchinglevel 0 Simulated -5 Measured

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3.Passivedevicesdesign:hornantennas

ConformedͲprofileHorn dB dB

WM03AdditiveManufacturingforRFPassiveHardware 24 /28 3.Passivedevicesdesign:hornantennas

ConformedͲprofileHorn Gain 17 Flann Measured Simulated 16

15 dB

12 10 11 12 13 14 15 Frequency(GHz) WM03AdditiveManufacturingforRFPassiveHardware 25 /28

4.ConclusionsI

• Additive manufacturing by Fused Filament Fabrication opens the possibility to implement waveguide passive devices in academic environment.

• Advantages:

• Rapid prototyping: all in the same day. • Low cost: less than 20€ per device. •HomeͲmade process with DIY philosophy. • New geometries can be explored, imagination is the only limit.

• Limitations :

* Accuracy * Metallization process Ͳ 100μm. Ͳ High insertion losses. Ͳ Flanges misalignment. Ͳ Unknown conductivity value. Ͳ MainͲbody misalignment. Ͳ Roughness of the internal walls.

WM03AdditiveManufacturingforRFPassiveHardware 26 /28 4.ConclusionsII

• Microwave passive devices as filters, diplexers, couplers, dividers, orthomode transducers, etc. , can be implemented by FFF.

• Suggestions & Advices (common sense):

Ͳ 15 GHz is the upper limit for the frequency. Ͳ Very sensitive devices are not very suitable. Ͳ Narrow band responses are disguised by the insertion losses. Ͳ Maintain the same supplier for the PLA/ABS. Ͳ Adjustment, calibration and maintenance of the printer is basic.

WM03AdditiveManufacturingforRFPassiveHardware 27 /28

ThankYou

WM03AdditiveManufacturingforRFPassiveHardware 28 /28 Ceramic, plastic and metallic additive manufacturing: perspectives for RF passive components

A. Perigaud, O. Tantot, N. Delhote, S. Bila, S. Verdeyme

Xlim UMR 7252 CNRS/University of Limoges

[email protected]

Slide 1 WM03 Additive Manufacturing for RF Passive Hardware

Slide 2 • 2 Research labs (CNRS-University of Limoges) : XLIM and SPCTS Optoelectronic Ceramic materials and – RF components manufacturing process

• Lab. of Excellence 6_LIM 60 FTE/year – 7.5 M€ 2011 to 2019

• Competitiveness clusters and SME

Slide 3

Outline

` Motivation ` Ceramic AM ` Plastic AM ` Metal AM ` Conclusion

Slide 4 WM03 Additive Manufacturing for RF Passive Hardware Motivation

AM is now well implanted in different sectors … with different expectations

Source: Gartner (July 2015) Slide 5 WM03 Additive Manufacturing for RF Passive Hardware

Motivation

} Expected general advantages

9 The right quantity of material (less wastes) 9 Reduced manufacturing time 9 Less energy consumption 9 Complex 3D shapes 9 Less part to assemble 9 (Almost) no limits for customisation 9 Wide choice of materials 9 Many functions in a part 9 Great for education

Slide 6 WM03 Additive Manufacturing for RF Passive Hardware Motivation

} Expected advantages for RF passive hardware

9 Rapid prototyping of proof of concepts 9 Complex shapes and high end materials that lead to advanced performances 9 Monolithic objects (no or little assembly) 9 High level of geometrical customization 9 Wide choice of materials 9 Multifunctionnality

Slide 7 WM03 Additive Manufacturing for RF Passive Hardware

Motivation

New materials ` Digital chain for design and fabrication New technologies of passive RF hardware

Components Optimization Prototype Advanced CAD specifications (EM, other) Exp. validation part

Frequency Topological optim., … Passband EM simulators … thermal, …

Slide 8 WM03 Additive Manufacturing for RF Passive Hardware Outline

` Motivation ` Ceramic AM ` Plastic AM ` Metal AM ` Conclusion

Slide 9 WM03 Additive Manufacturing for RF Passive Hardware

Ceramic manufacturing

` Process overview Step 1 : preparation of the suspension UV curable Photopolymerisable monomer paste Photoiniator Dispersant (agglomeration and settling of ceram. particles) Thickening agent (to support the part) Ceramic particles Step 2 : fabrication similar to polymer SLA Layer-by-layer manufacturing Green part Paste polymerisation by a UV laser Step 3 : firing cycles Debinding : burning of organic materials Sintered part Sintering : densification and final dimensions Slide 10 WM03 Additive Manufacturing for RF Passive Hardware Stereolithography

` Process overview .STL file sliced in CAD 3D file .STL file cross-sectional layers

Layer-by-layer manufacturing

Sintered part Green part Cleaning Slide 11 WM03 Additive Manufacturing for RF Passive Hardware

Stereolithography

` Polymerization of cross-sectional patterns by a UV laser beam

Need for a specific spreading system

Slide 12 WM03 Additive Manufacturing for RF Passive Hardware

Stereolithography

Production in successive layers

Slide 13 WM03 Additive Manufacturing for RF Passive Hardware

Compact bandpass filter

` 3D bandpass filter (Ku band)

1mm Gold metallization by standard sputtering SLA manufacturing technique (recto/verso)

Ins. Loss ~2.5 dB at 17.5 GHz

100μm BW : 300 MHz Thickness : 2 mm 500μm

A. Khalil et al., IMS 2011, June 2011, Baltimore S11

S21 |S| (dB) Measurements Slide 14 WM03 Additive Manufacturing for RF Passive Hardware

Wide band C-band filter

` Wide band (10%) C band bandpass filter o ESA sponsored Ph. D: Ceramic Filters by 3D Stereolithography Y. Marchives et al., “Wide-band dielectric filter at C-band manufactured by stereolithography”, Eur. Mic. Conf., October 2014

(Zirconia)

Slide 15 WM03 Additive Manufacturing for RF Passive Hardware

60 GHz filter-antennas

` Monobloc passive antennas for wireless com. (WLAN) o Antenna - filter 60 GHz ceramic filter - horn antenna (Alumina) F. Kouki et al., “Miniature Ceramic Filter - Antenna For Wireless Communications Systems at 60GHz”, Eur. Microwave Conf., October 2014 60 GHz ceramic channel filter

Transition to WR Filter Mode converter waveguide

Slide 16 WM03 Additive Manufacturing for RF Passive Hardware

60 GHz antennas

` Monobloc passive antennas for wireless com. (WLAN)

o Lens antenna

3 cm 60 GHz Lens antenna (Alumina) N. T. Nguyen, et al, “Design and Characterization of 60-GHz Integrated Lens Antennas Fabricated Through Ceramic Stereolithography”, IEEE Trans. on Ant. and Propag., vol. 58, n. 8, 2010

Partner:

Slide 17 WM03 Additive Manufacturing for RF Passive Hardware

Development of low loss material

` Optimisation of custom ceramic for RF applications o Optimisation of impurities

~50 ppm

~30 ppm

D. Di Marco, K. Drissi, N. Delhote, O. Tantot, P.-M. Geffroy, S. Verdeyme, T. Chartier , ”Dielectric properties of pure alumina from 8 GHz to 73 GHz”, o Optimisation of density European Journal of Ceramic, vol. 36, no. 14, Nov. 2016,pp. 3355-3361

Density : 3.92 (98%) Density : 3.999 (99.9%)

Slide 18 WM03 Additive Manufacturing for RF Passive Hardware Outline

` Motivation ` Ceramic AM ` Plastic AM ` Metal AM ` Conclusion

Slide 19 WM03 Additive Manufacturing for RF Passive Hardware

3D printing with plastic

} Material extrusion Î FDM: Fused Deposition Modeling

Minimum layer thickness : 125 – 254 μm Manuf. Accurcay : 125 – 200 μm typically Surface roughness : rough Fabrication speed: slow Materials : thermoplastics (ABS, PLA), wax, …

MOT-d 3D printer Makerbot Stratasys

~200 € ~2 k€ ~20 k€ Slide 20 WM03 Additive Manufacturing for RF Passive Hardware

3D printing with plastic

} Material extrusion Î Material jetting Minimum layer thickness : 16 μm Manuf. Accurcay : 20 – 80 μm typically Surface roughness : smooth to very smooth. Fabrication speed : slow - medium Materials : resins, thermoplastics, wax

Stratasys

~100 k€ Slide 21 WM03 Additive Manufacturing for RF Passive Hardware

3D printing with plastic

` Fast validation of proof of concepts Î HF bandpass filters(FDM)

CAD Manufacturing by FDM (ABS)

Ku band 2nd order bandpass filter Nicolas Jolly et al., EUMC 2014 Tunable E plane filter Slide 22 WM03 Additive Manufacturing for RF Passive Hardware

3D printing with plastic

` Fast validation of proof of concepts Î 4 poles – 2 zeros elliptical filter (FDM)

Sence et al., “Plastic and Metal Additive Manufacturing Technologies for Hyperfrequency Passive Components up to Ka band, “ EumC 2016 Slide 23 WM03 Additive Manufacturing for RF Passive Hardware

3D printing with plastic

` Fast validation of proof of concepts Î 4 poles – 2 zeros elliptical filter (Polyjet ©)

Sence et al., “Plastic and Metal Additive Manufacturing Technologies for Hyperfrequency Passive Components up to Ka band, “ EumC 2016 Slide 24 WM03 Additive Manufacturing for RF Passive Hardware

3D printing with plastic

` 3D printing of waveguide filters for education purposes

• Quickly manufactured • Cheap • Easy to assemble without tools • Bandpass filter working whatever the order

Saucourt et al., “Design of 3D Printed Plastic Modular Filters,“ EumC 2016

Slide 25 WM03 Additive Manufacturing for RF Passive Hardware

Outline

` Motivation ` Ceramic AM ` Plastic AM ` Metal AM ` Conclusion

Slide 26 WM03 Additive Manufacturing for RF Passive Hardware

3D printing with metal

` Selective laser melting

Laser beam

Powder

Substrate

Slide 27 WM03 Additive Manufacturing for RF Passive Hardware

3D printing with metal

` Monobloc bandpass filter Î 4 poles – 2 zeros elliptical filter (SLM – stainless steel)

Sence et al., “Plastic and Metal Additive Manufacturing Technologies for Hyperfrequency Passive Components up to Ka band, “ EumC 2016 Slide 28 WM03 Additive Manufacturing for RF Passive Hardware 3D printing with metal

` Monobloc bandpass filter Î Comparison plastic / metal (no post-treatment)

Metal Plastic Simulation

(HFSS : Inox : V = 1,1 S/μm) Slide 29 WM03 Additive Manufacturing for RF Passive Hardware

3D printing with metal

` Mode converter Î Ka band rectangular TE10 to circular TE01 mode converter

Based on an initial design proposed in 1958 by G.R.P. Marie

No change when a rotation occurs Î confirmation of the wideband mode conversion

Sence et al., “Plastic and Metal Additive Manufacturing Technologies for Hyperfrequency Passive Components up to Ka band, “ EumC 2016 Slide 30 WM03 Additive Manufacturing for RF Passive Hardware

Outline

` Motivation ` Ceramic AM ` Plastic AM ` Metal AM ` Conclusion

Slide 31 WM03 Additive Manufacturing for RF Passive Hardware

Conclusion

} Expected advantages for RF passive hardware 9 Rapid prototyping of proof of concepts Î short test and validation cycles 9 Complex shapes and high end materials that lead to advanced performances Î high end performances 9 Monolithic objects (no or little assembly) Î less EM field leakage, less accuracy issues linked to assembly 9 High level of geometrical customization Î diversity, originality of the concepts 9 Wide choice of materials Î selection and even customization of HF selected materials 9 Multifunctionnality Î open the way to multiphysics optimization

Slide 32 WM03 Additive Manufacturing for RF Passive Hardware Conclusion

Thank you for your attention

Ceramic, plastic and metallic additive manufacturing: perspectives for RF passive components

[email protected]

Slide 33 WM03 Additive Manufacturing for RF Passive Hardware

High Performance Additive Manufactured RF Waveguide and Antenna Components for Aeronautical and Space Applications

Emile de Rijk, Alexandre Dimitriades, Tomislav Debogovic, Mathieu Billod, Mirko Favre, Luca Barloggio SWISSTo12 SA 1015 Lausanne, Switzerland

Outline of the Presentation

• Introduction ¾ About SWISSto12 ¾ Additive Manufacturing Technology • Examples of Passive RF Components ¾ Waveguide Components ¾ Filters and Diplexers ¾ Antennas and Antenna Arrays • Qualification Procedure and Summary

2 About SWISSto12 SA • Company specialized in Additive Manufactured RF components (antennas, waveguides & filters) • Founded 2011, based in Lausanne • Spin-off from Ecole Polytechnique Fédérale de Lausanne (EPFL) • Staff: Engineers, Physicists, Manufacturing • Reference customers:

Markets & Applications

• Satcom user terminal front-ends: Mobile aeronautic internet connectivity (Ku and Ka band) Mobile land and maritime internet connectivity (Ku and Ka band) Ground based (fixed or deployable) user terminals • RF payload for space-crafts X, Ku, Ka, Q, V, W bands • Test & Measurement: (67 GHz and above) • Point to point terrestrial telecom 60 – 80 GHz Backhaul • Radar: Defense and aviation Radar Automotive & Industrial radar

4 Additive-Manufacturing for RF Components 1. RF Design 3. Additive 2. Mechanical Design Manufacturing (Plastic) 4. Metallization 5. Integration

1: RF Design (either with or without the customer) 2: Mechanical design & Optimization 3: High accuracy Additive Manufacturing (proprietary SLA polymers and processes) 4: Chemical Copper plating (typical 2-3um thick) + Gold or Silver passivation. Unique technology developed and owned by SWISSto12. 5

Technical Advantages of the Technology • Enables complex RF designs • Mono-block RF components (no assemblies, better RF performance) • Weight reduction capabilities

Example: Ka band Orthogonal Mode Transducer (OMT) Traditional machining 3D printed polymer with metal plating 2.7 g/cm3 (aluminum) 1.5 g/cm3 (polymer) 489 cm3 23 cm3 4100 g 27 g 6 Outline of the Presentation

WR-28 SLA Cu-Plated Waveguides

8 WR-15 SLA Cu-Plated Waveguides

WR-10 SLA Cu- & Au-Plated Waveguides

10 Outline of the Presentation

Ku-Bandpass 3rd Order Filter by Airbus D&S

Courtesy of Airbus defence and Space

P. Booth and E. Vallés Lluch, ‘‘Performance Enhancement for Waveguide Filters Using Additive Manufacturing,’’ Int. Workshop on Microwave Filters (IWMF 2015), Toulouse, France, March 2015

12 Ku-band Diplexer

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Note: In collaboration with LEMA, EPFL GHz 13

W-Band Waveguide Filter

X. Shang, P. Penchev, C. Guo, M.J. Lancaster, S. Dimov, Y. Dong, M. Favre, M. Billod, and E. de Rijk, "W-Band Waveguide Filters Fabricated by Laser Micromachining and 3-D Printing,” IEEE Trans. Microw. Theory Techn., 2016 (in press), doi: 10.1109/TMTT.2016.2574839 14 Outline of the Presentation

Ku-Band Ring-Focus Dual-Reflector Antenna 1/2

Note: Image courtesy from the European Space Agency

• Feed antenna + sub-reflector + primary reflector in 1 single piece • Total system weight 145g (!) • Tested by the European Space Agency with success: http://www.esa.int/spaceinimages/Images/2016/03/3D-printed_antenna 16 Ku-Band Ring-Focus Dual-Reflector Antenna 2/2

Note: Image courtesy from the European Space Agency

M. van der Vorst and J. Gumpinger, ‘‘Applicability of 3D printing techniques for compact Ku-band medium/high-gain antennas,’’ 10th European Conference on Antennas and Propagation (EuCAP 2016), Davos, Switzerland, April 2016.

Ka-Band Array Demonstrator 1/4

• SWISSto12 demo unit illustrating the capabilities of AM • Low-loss beamforming network (BFN) based on broadband E-plane waveguide components (bends, splits etc.) • Challenging internal surfaces to metallize

18 Ka-Band Array Demonstrator 2/4

Ka-Band Array Demonstrator 3/4

Additive-Manufactured Array Metal-Plated Array • Measurements performed in the facilities of LEMA, EPFL 20 Ka-Band Array Demonstrator 4/4

• Radiation pattern identical to the simulated one • Measured gain lower that theoretical one by approximately 1.5dB

A.I. Dimitriadis, T. Debogovic, M. Favre, M. Billod, J.-P. Ansermet, and E. de Rijk, ‘‘Polymer-Based Additive Manufacturing of High Performance Passive RF Components,’’ Proc. IEEE, 2016 (under review) 21

Comparison of WR-28 SLA and SLS Waveguides

Conclusion: Raw SLS materials are too rough to serve as low loss RF passive components

22 WR-10 SLS Al Waveguides

Conclusion: Rework by plating and chemical etching of metallic SLS materials allows for reduction of RF losses. Unique technology recently developed and patented by SWISSto12 23

Outline of the Presentation

24 Space / aerospace qualification ongoing

• Outgassing tests passed for all materials to space standards (ASTM E 595)

• Thermal shock tests passed (room temp to 77K or to +85 DegC)

• Thermal cycling tests ongoing (First test passed for cycles between -60 Deg C and +85 DegC, 100 cycles, 10Deg/min)

• Flammability tests ongoing

• Vibrations and shocks to be done in frame of ESA project under preparation

• Radiation hardness to be done in frame of ESA project under preparation

Qualification testing depends strongly on customer requirement inputs and collaboration possibilities

Take-Home Message

• Disruptive lead times (4-6 weeks) • Price competitive • Weight reduction (50% to 90% reduction) • Enables complex and high performance RF designs • Suitable for production quantities SWISSto12 SA EPFL Innovation Park Building C CH-1015 Lausanne www.swissto12.ch +41 21 693 86 85 [email protected] 3-D Printed Metal-pipe Rectangular Waveguides

William J. Otter and Stepan Lucyszyn

Imperial College London

[email protected]

Slide 1 WM03 Additive Manufacturing for RF Passive Hardware of 50

Overview

• 3-D Printing Technologies • X-Band Waveguide (FDM) • X-Band Phase Shifter (FDM) • W-Band Waveguide (SLA) • W-Band Waveguide Filter (SLA) • Future Challenges • Commercialization • Acknowledgements

Slide 2 of 50 3-D Printing Technologies

• Additive Layer Manufacturing (ALM) (in contrast to Subtractive Manufacturing)

• Disruptive Technology: 9 Lightweight (with FDM, SLA and Polyjet) 9 Arbitrary shapes (limited by imagination) 9 Mixed materials (plastics and metals) 9 Fast turnaround 9 EM modelling S/W straight to printer 9 Perfect for rapid prototyping 9 Very low cost (for small volumes) 9 On-site parts replacement in remote locations

Slide 3 of 50

On-site Parts Replacement

Socket wrench 3-D printed on the International Space Station

http://www.theguardian.com/science/2014/dec/20/iss- astronaut-uses-3d-printer-to-make-socket-wrench-in-space Slide 4 of 50 3-D Printing Technologies

• Four Main Printing Technologies:

Fused Deposition Modeling (FDM)

Stereolithographic Apparatus (SLA)

Polymer-jetting (Polyjet)

Selective Laser Sintering (SLS) Selective Laser Melting (SLM)

Slide 5 of 50

Fused Deposition Modeling (FDM)

Simple thermoplastic manufacturing technology http://www.cs.cmu.edu/~rapidproto/students.03/rarevalo/project2/Process.html

http://www.valintech.com/index.php?m=5Slide 6 of 50 RF Device Example of FDM

Ku-band (12 to 18 GHz) Graded Index Flat Lens

• Building material: polylactic acid (PLA) polyester polymer (biodegradable and derived from renewable resources) • Metamaterial: refractive index (fill factor profile) decreases radially outwards • H-plane 3 dB beam width: 9° • Boresight gain: 8 dB Loughborough University (UK) and University of Central Florida (USA)

S. Zhang, et al., “3D-printed flat lens for microwave applications,” Loughborough Antennas & Propag. Conf. (LAPC), 2015. Slide 7 of 50

RF Device Example of FDM

Material THz Properties Polystyrene with a 100 μm Layer Height

S. F. Busch, et al., “Optical properties of 3D printable plastics in the THz regime and their application for 3D printed THz optics”, Journal of Infrared, Millimeter, and Terahertz Waves, Dec. 2014. Slide 8 of 50 RF Device Example of FDM

X-band (8 to 12 GHz) Absorbing Termination

• Build material: carbon-loaded acrylonitrile butadiene styrene (ABS) polymer • Return Loss: > -38 dB across X-band • Power levels: < 11.5 W at 10 GHz Lab-STICC (France) and XLIM-MINACOM (France) Y. Arbaoui, et al., “Full 3-D printed microwave termination: A simple and low-cost solution,” IEEE T-MTT, Jan. 2016. Slide 9 of 50

Stereolithographic Apparatus (SLA)

Liquid resin (photopolymer) is cured using UV light

https://en.wikipedia.org/wiki/Stereolithography Slide 10 of 50 Stereolithographic Apparatus (SLA)

https://3dprint.com/wp-content/uploads/2014/09/roland5.png

Slide 11 of 50

RF Device Example of SLA

35-39.5 GHz Dielectric-filled Horn Antenna Array

General Dynamics Research and Development Center (USA)

L. Schulwitz and A. Mortazawi, "A compact millimeter-wave horn antenna array fabricated through layer-by-layer stereolithography," IEEE Ant. and Propag. Soc. Int. Symp., Jul. 2008. Slide 12 of 50 RF Device Example of SLA

X-Band Split-block Spherical Cavity 5th-order Filter

• 25 Pm copper coating, with 14% of the weight when compared to copper equivalent • Polymer has a working temperature of <39-46% UESTC (China), University of Birmingham (UK) and 3-D-Parts (UK) C. Guo, et al., “A 3-D printed lightweight X-Band waveguide filter based on spherical resonators,” IEEE Microw. Compon. Lett., Jul. 2015. Slide 13 of 50

RF Device Example of SLA

W-Band Split-block Inductive Iris 5th-order Filter

• ~4% larger in x-y plane and ~1% larger along the z-axis, compared to design • 10 Pm copper coating + 0.1 Pm gold flash coating University of Birmingham (UK), UESTC (China) and Swissto12 (Switzerland)

X. Shang, et al., “W-band waveguide filters fabricated by laser machining and 3-D printing,” IEEE T-MTT, Jun. 2016. Slide 14 of 50 Polymer-jetting (Polyjet)

D. Dikovsky, "Multi-material 3D printing“, RadTech UV & EB Technology Expo & Conf. 2014 Slide 15 of 50

RF Device Example of Polyjet

146 GHz Electromagnetic Crystal (EMXT) Waveguide Horn

University of Arizona (USA) Z. Wu, et al., “Terahertz horn antenna based on hollow-core electromagnetic crystal (EMXT) structure,” IEEE T-AP, Dec. 2012. Slide 16 of 50 RF Device Example of Polyjet

X-Band Vertically-stacked 2-Cavity Filter

• Resonator Q-factor: 214 at 10.26 GHz • Insertion Loss: 2.1 dB • Fractional Bandwidth: 5.1% Georgia Institute of Technology (USA) F. Cai, et al., “A low loss X-band filter using 3-D Polyjet technology,” IEEE IMS, May 2015. Slide 17 of 50

Selective Laser Sintering (SLS) Selective Laser Melting (SLM)

https://en.wikipedia.org/wiki/Selective_laser_sintering Slide 18 of 50 RF Device Example of SLS/SLM

X-Band (8-12 GHz) to Ku-band (12-18 GHz) 4 x 4 Butler Matrix

• Aluminium AlSi 10 Mg with 50 Pm tolerances • Internal dimensions became enlarged, resulting in -180 MHz shift University of Birmingham (UK) and ESA/ESTEC (The Netherlands) V. T. di Crestvolant, et al., Advanced Butler matrices with integrated bandpass filter functions,” IEEE T-MTT, Oct. 2015. Slide 19 of 50

RF Device Example of SLS/SLM

E-Band (60-90 GHz) Iris Filters

• Operating at E-band (60 to 90 GHz), made from a CuSn15 alloy • Pass bands from 73.5 to 77.5 GHz and 84 to 90 GHz • Average insertion loss of 8 dB and 1.5 dB, respectively

Chalmers University of Technology (Sweden)

Bing Zhang and Herbert Zirath, “3D printed iris bandpass filters for millimeter-wave applications,” IET EL, Oct. 2015. Slide 20 of 50 RF Device Example of SLS/SLM

E- (60-90 GHz), D- (110-170 GHz), and H- (220-325) band Waveguides

Chalmers University of Technology (Sweden) and Ericsson Research (Sweden) Bing Zhang and Herbert Zirath, “3-D Printed Rectangular Waveguides for Millimeter-Wave Applications," IEEE T-CPMT, May 2016. Slide 21 of 50

RF Device Example of SLS/SLM

E- (60-90 GHz), D- (110-170 GHz), and H- (220-325) band Conical Horns

Chalmers University of Technology (Sweden) and Karlsruhe Institute of Technology (Germany) Bing Zhang, et al., “Metallic 3-D printed antennas for millimeter- and submillimeter wave applications," IEEE T-TST, Jul. 2016. Slide 22 of 50 Comparison of Methods 1

Technology Resolution Print Speed Cost FDM Poor Slow Low SLA Moderate Moderate Low/Medium Polyjet High Fast High SLS/SLM High Moderate High

• FDM, SLA and Polyjet require metalizing to create conducting- walled RF components: – Evaporation (good, likely to require cool cycles) – Sputtering (good, but requires cool cycles) – Electroless Plating (okay) – Silver dip coating (convenient, but limited conductivity)

• SLS/SLM can be made from directly from copper Slide 23 of 50

Comparison of Methods 2

Build Direction Build Direction FDM

SLA Build FDM Direction Scalloping Observed SLA

Slide 24 of 50 3-D Printers at Imperial College

Slide 25 of 50

FDM Process at Imperial College

ExtruderUltimaker 2 MakerBot Replicator X2 Slide 26 of 50 FDM Process at Imperial College

Desktop 3-D printer: MakerBot Replicator 2X

Building Material: ABS

Wall Thickness: 1 mm

Infills: 10% (walls) and 100% (dielectric flap)

Layer Height: 100 μm

Electroless Plating: 3 μm nickel seed layer

Electroplating: 27 μm copper layer

Slide 27 of 50

X-band WR-90 Waveguides (FDM)

CAD Model Waveguide Under Test

M. D’Auria, W. J. Otter, J. Hazell, B. T. W. Gillatt, C. Long-Collins, N. M. Ridler and S. Lucyszyn, “3-D Printed metal-pipe rectangular waveguides,” IEEE T-CPMT, Sep. 2015. Slide 28 of 50 X-band WR-90 Waveguides (FDM)

Slide 29 of 50

X-band WR-90 Waveguides (FDM)

Arbitrary Length W/G Resonant W/G Comparison Comparison

• Post-plated FDM waveguide: 250 mg/mm • Commercial machined copper-alloy walled waveguide: 730 mg/mm Slide 30 of 50 X-band Phase Shifter (FMD)

Tapered Dielectric Slab Curved Dielectric Flap

R. S. Rao and B. Bhat, “Phase shifters,” in Microwave Engineering, New Delhi, 2012

Slide 31 of 50

X-band WR-90 Phase Shifter (FMD)

Acrylonitrile butadiene styrene (ABS) building material: dielectric constant = 2.34 (not 2.54) and loss tangent = 0.0015 (not 0.0151) at 10 GHz

B. T. W. Gillatt, M. D’Auria, W. J. Otter, N. M. Ridler and S. Lucyszyn, “3-D printed variable phase shifter”, IEEE Microw. Compon. Lett., 2016 (in press) Slide 32 of 50 X-band WR-90 Phase Shifter (FMD)

Slide 33 of 50

X-band WR-90 Phase Shifter (FMD)

Relative Phase Shift Group Delay

Slide 34 of 50 X-band WR-90 Phase Shifter (FMD)

Tuning Performance PM-AM Conversion

Slide 35 of 50

3D Systems Viper si2®

Slide 36 of 50 3D Systems Accura® Xtreme Resin

Slide 37 of 50

W-band WR-10 Waveguides (SLA)

CAD Model Waveguide

M. D’Auria, W. J. Otter, J. Hazell, B. T. W. Gillatt, C. Long-Collins, N. M. Ridler and S. Lucyszyn, “3-D Printed metal-pipe rectangular waveguides,” IEEE T- CPMT, Sep. 2015. Slide 38 of 50 W-band WR-10 Waveguides (SLA)

Slide 39 of 50

W-band WR-10 Waveguides (SLA)

Arbitrary Length W/G Resonant W/G Comparison Comparison

Slide 40 of 50 W-band WR-10 Waveguide Filter (SLA)

Split-block Inductive Iris 6th-order Filter

M. D’Auria, W. J. Otter, J. Hazell, B. T. W. Gillatt, C. Long-Collins, N. M. Ridler and S. Lucyszyn, “3-D Printed metal-pipe rectangular waveguides,” IEEE T-CPMT, Sep. 2015. Slide 41 of 50

W-band WR-10 Waveguide Filter (SLA)

Slide 42 of 50 Waveguide Loss Comparison

Slide 43 of 50

Waveguide Loss Comparison

Slide 44 of 50 Waveguide Loss Comparison

Slide 45 of 50

Future Challenges

Materials characterization (before and after)

Printing process characterization Shrinkage (compensation rules) Minimum feature size Surface roughness

Life-cycle testing

Power handling

Vacuum testing (space applications)

Slide 46 of 50 Commercialization

Private company, spin-off of the Swiss Federal Institute of Technology in Lausanne, Switzerland, (EPFL).

Slide 47 of 50

Commercialization

3-D printed metal coated plastic (MCP) waveguides and diagonal pyramidal horn antennas.

WR-3.4 band (220 to 330 GHz) and, with copper metallization; minimum attenuation of 12 dB/m at ca. 280 GHz.

WR-5.1 band (140 to 220 GHz) MCP waveguides; straight and S-bend sections.

A. Macor, et al., “Note: Three-dimensional stereolithography for millimeter wave and terahertz applications,” Rev. Sci. Instrum., Apr. 2012.

A. von Bieren, et al., “Monolithic metal-coated plastic components for mm-wave applications,” Proc. 39th Int. Conf. Infr., Millim., Terahertz Waves (IRMMW-THz), Sep. 2014.

http://www.swissto12.com/Products/Metal Coated Plastics/index.html Slide 48 of 50 Commercialization

http://www.polariz3d.com

Dr Mario D'Auria after completing his PhD in 3D Printing. He now has his own 3D Printing Company…ny… …. watch his 3D space!!!!! Slide 49 of 50

Acknowledgements

N. M. Ridler National Physical Laboratory (NPL), UK

B. T. W. Gillatt, C. Long-Collins, M. D’Auria, J. Hazell Imperial College London, UK

Rapid 3D Ltd, UK (SLA printing)

3DDC Ltd, UK (electroless nickel and copper plating)

Prof. Maurizio Bozzi University of Pavia, Italy

Petronilo Martin Iglesias European Space Agency, The Netherlands Slide 50 of 50 Metallic 3D Printing Technologies for MmWave and THz Applications

Bing Zhang Microwave Electronics Laboratory MEL Department of Microtechnology and Nanoscience MC2 Chalmers University of Technology Gothenburg SE-41296, Sweden [email protected] Slide 1 WM03 Additive Manufacturing for RF Passive Hardware of 51

Outline

1. Introduction 1.1 The MmWave and THz Spectrum 1.2 About 3D Printing 2. 3D Printed MmWave and THz Devices 2.1 Dielectric 3D Printed MmWave and THz Devices 2.2 Metallic 3D Printed MmWave and THz Devices 2.2.1 Experiments on Metallic 3D Printed MmWave and THz Devices 2.2.2 Tolerance Analysis 3. Conclusions and Prospects Acknowledgement References

Slide 2 WM03 Additive Manufacturing for RF Passive Hardware of 51 1. Introduction

Slide 3 WM03 Additive Manufacturing for RF Passive Hardware of 51

1.1 The MmWave and THz Spectrum

Figures from internet: http://www.nipic.com/show/10659076.html; http://someinterestingfacts.net/top-10-happy-accidents-discoveries/; http://uc.cse.cau.ac.kr/60ghz.html; http://www.atzonline.com/Article/10508/Automotive-Radar-Technologies-for-All-Vehicle-Segments.html; http://www.hiwtc.com/products/smartbridges-backhaul-access-point-cpe-266530-53490.htm; http://www.nature.com/nclimate/journal/v3/n10/fig_tab/nclimate1908_F1.html; http://www.astro.cardiff.ac.uk/research/astro/instr/researchareas/detectors/ Slide 4 WM03 Additive Manufacturing for RF Passive Hardware of 51 1.2 About 3D Printing

Redrawn from “The free beginner’s guide to 3D printing”, online: http://3dprintingindustry.com/3d-printing-basics-free-beginners-guide/ Slide 5 WM03 Additive Manufacturing for RF Passive Hardware of 51

2. 3D Printed MmWave and THz Devices

Slide 6 WM03 Additive Manufacturing for RF Passive Hardware of 51 2.1 Dielectric 3D Printed MmWave and THz Devices

Designs from University of Michigan Ann Arbor

Luneberg Lens [2]; Technique: CSLA (Ceramic Stereolithography Apparatus); Functional band: Ka-band; Material: alumina; Performance: Maxi. 26 dBi gain @ 33 GHz, Gaussian beam; SLA horn and transducer Machined metal holder Year: 2007.

L-Shaped Horn+Transducer [1]; Technique: SLA (Stereolithography Apparatus); Material: Emmerson and Cumming HiK dielectric powder; Frequency: Ka-band (26.5 – 40 GHz); Performance: 12 dBi, <-20 dB X-pol; Year: 2005.

Slide 7 WM03 Additive Manufacturing for RF Passive Hardware of 51

2.1 Dielectric 3D Printed MmWave and THz Devices

Designs from University of Limoges

EBG Resonator [4]; Technique: μSLA (Micro Stereolithography Apparatus); Material: alumina; Frequency: D-band (110-170 GHz); Performance: unloaded Q-factor 2500; Year: 2008.

EBG (Electromagnetic Bandgap) BPF (Bandpass Filter) [3]; Technique: CSLA ; Material: zirconia; Frequency: Ka-band; Performance: central freq. 32. 94GHz, -3dB BW 1.03%, insertion loss 3dB, ripple 0.5 dB; Year: 2007. Slide 8 WM03 Additive Manufacturing for RF Passive Hardware of 51 2.1 Dielectric 3D Printed MmWave and THz Devices

Designs from Queen Mary University of London EBG Lens [6]; Technique: CSLA ; Material: alumina; Frequency: W-band; Performance: -15 dB side lobe on E- plane, -10 dB side lobe on H-plane; Year: 2008.

EBG Structure [5]; Technique: CSLA ; Material: alumina; Frequency: W-band (75-110 GHz); Performance: bandgap 84-118 GHz; Year: 2007.

Slide 9 WM03 Additive Manufacturing for RF Passive Hardware of 51

2.1 Dielectric 3D Printed MmWave and THz Devices

Designs from University of Arizona

Hollow-Core EXMT (Electromagnetic Crystal) Waveguide [8]; Technique: PJ ; Material: acrylic polymer; WPS (Wood Pile Johnson EBG [7]; Frequency: G-band (140-220 Structure) EBG [7]; Technique: PJ; GHz); Technique: PJ (Polymer Material: acrylic polymer; Performance: propagation Jetting) ; Frequency: 350 GHz; loss 0.03 dB/mm @ 105 GHz; Year: 2011. Material: acrylic Performance: fundamental polymer; EBG @ 223 GHz; Frequency: 600 GHz; Year: 2008. Performance: fundamental EBG 180 GHz, 2nd EBG 278 GHz, 3rd EBG 372 GHz; Year: 2008. Slide 10 WM03 Additive Manufacturing for RF Passive Hardware of 51 2.1 Dielectric 3D Printed MmWave and THz Devices

Designs from University of Arizona

Luneberg Lens [10]; Technique: PJ ; Material: acrylic polymer; Frequency: Q-band (33-50 GHz); Performance: N.A.; Year: 2014.

Hollow-Core EXMT Horn [9]; Technique: PJ ; Material: acrylic polymer; Frequency: D-band (110-170 GHz); Performance: Maxi. gain 23 dBi@200 GHz; Year: 2012. Slide 11 WM03 Additive Manufacturing for RF Passive Hardware of 51

2.1 Dielectric 3D Printed MmWave and THz Devices

Other designs Waveguide [12]; Corrugated Horn Technique: SLA ; [12]; Material: UV-curable Technique: SLA; polymer; Material: UV-curable Frequency: W-band; polymer; Performance: Frequency: W-band; averaged 0.3 dB Performance: N.A.; insertion loss; Year: 2011; Lens [11]; Year: 2011, Institute: Univ. Technique: CSLA ; Institute: Univ. Wisconsin-Madison. Material: alumina; Wisconsin-Madison. Frequency: V-band (50-75 GHz); Performance: Imp. BW. 55-65 GHz, maxi. Dir. 21 dBi @ 64 GHz; Year: 2010, Institute: University of Rennes. Slide 12 WM03 Additive Manufacturing for RF Passive Hardware of 51 2.1 Dielectric 3D Printed MmWave and THz Devices

Other designs

Reflectarrays [14]; Technique: PJ; Material: acrylic polymer; Frequency: W-band; Performance: maxi. gain 25 dBi @ 100 GHz; Year: 2014; Institute: Colorado School of Mines. Plasmonic Waveguide [13]; Technique: PJ; Material: acrylic polymer; Frequency: THz; Performance: N.A.; Year: 2013; Institute: University of Utah. Slide 13 WM03 Additive Manufacturing for RF Passive Hardware of 51

2.1 Dielectric 3D Printed MmWave and THz Devices

Other designs

The first successfully marketed 3D printed Lens [16]; mmWave devices!! Technique: SLA Material: N.A.; Frequency: H-band; Performance: maxi. gain 26.5 dBi @ 268 GHz; Year: 2014; Institute: UESTC.

Waveguide [15]; Diagonal Horn [15]; Technique: SLA; Technique: SLA; Material: photopolymer; Material: photopolymer; Frequency: H-band; Frequency: H-band; Performance: averaged Performance: maxi. gain 0.4 dB insertion loss ; 26 dBi @ 320 GHz; Year: 2014; Year: 2014; Institute: SwissTo12. Institute: SwissTo12. Slide 14 WM03 Additive Manufacturing for RF Passive Hardware of 51 2.1 Dielectric 3D Printed MmWave and THz Devices

Other designs BPF [18]; Technique: SLA ; Material: resin; Frequency: W-band; Performance: center Waveguide [18]; frequency of 107.2 GHz, Technique: SLA ; 6.8 GHz passband, and Material: resin; 0.95 dB insertion loss; Frequency: W-band; Year: 2015; Performance: 11 dB/m Institute: Imperial College attenuation; London. Year: 2015; Offset Stepped-Reflector Institute: Imperial College Antenna [17]; London. Technique: SLA; Material: nylon; Frequency: Ka-band; Performance: maxi. Gain 40.4 dBi @ 30 GHz; Year: 2015; Institute: Technical University of Denmark. Slide 15 WM03 Additive Manufacturing for RF Passive Hardware of 51

2.2 Metallic 3D Printed MmWave and THz Devices

The only metallic 3D printed mmWave device before 2012. The reason for the rarity of metallic 3D printed mmWave and THz deivce is not technical, but business priority. The microwave industry is craving for dielectric 3D printed devices to be more durable, while metallic ones are ignored.

Waveguide [19]; Technique: SLM (Selective Laser Melting); Material: Ti-6Al-4V; Frequency: W-band; Performance: averaged 2dB insertion loss; Year: 2012; Institute: Catholic University of Leuven. Slide 16 WM03 Additive Manufacturing for RF Passive Hardware of 51 2.2.1 Experiments on Metallic 3D Printed MmWave and THz Devices

In 2005, Zhang started a series of experiments on metallic 3D printed mmWave and THz devices, with the purpose to find the suitable “process+material” for device fabrication [20] [21].

Cost comparison*:comparison*: AntennaAntenna prinprint------t------ManualManual polish------polish------GoldGold electroplatingelectroplating ---- MMPMMP trtreatmenteatment ------*NeglectingNeglecting the technician training costcost. . Slide 17 WM03 Additive Manufacturing for RF Passive Hardware of 51

2.2.1 Experiments on Metallic 3D Printed MmWave and THz Devices (Phase I)

Measured inner surface roughness of 3D printed V-band horns 316L 316L gold 316L MMP treated Cu15Sn manually Cu15Sn gold Cu15Sn MMP electroplated polished electroplated treated Spv 129 142.84 68.737 30.104 20.495 39.349 Sq 16.096 6.7389 9.4598 3.5233 1.699 0.54156 Sa 12.893 4.6351 7.8153 2.7919 1.2936 0.25213 IsoFlatness 127.42 128.27 59.557 25.494 19.887 37.67

V-band horns

Inner surface photos

Inner surface profiles

Our choice for the following experiments, balancing the cost and performance. Slide 18 WM03 Additive Manufacturing for RF Passive Hardware of 51 2.2.1 Experiments on Metallic 3D Printed MmWave and THz Devices (Phase II)

Metallic 3D printed E-, D- and H-band horns

The horn design formula: d= 3ʄ݈

From top: E-, D- and H-band horns Slide 19 WM03 Additive Manufacturing for RF Passive Hardware of 51

2.2.1 Experiments on Metallic 3D Printed MmWave and THz Devices (Phase II)

Schematic of the far-field measurement setup at Karlsruhe Institute of Technology [22] Photograph of the far-field measurement setup Slide 20 WM03 Additive Manufacturing for RF Passive Hardware of 51 2.2.1 Experiments on Metallic 3D Printed MmWave and THz Devices (Phase II)

Performance of the 3D printed E-band horn 26 -20 -25 25 -30 -35 24 | (dB)

11 -40 0.5 dB difference Gain (dBi) |S 23 -45 Simulated Simulated Measured -50 Measured 22 -55 60 65 70 75 80 85 90 60 65 70 75 80 85 90 Frequency (GHz) Frequency (GHz)

10 0 0 -10 -20 -20 -40 -30 -60 -40 -80 -50 Co-pol simulated Co-pol simulated -60 -100 Co-pol measured Co-pol measured -70 -120 -180 -120 -60 0 60 120 180 -180 -120 -60 0 60 120 180 Normalized radiation patterns (dB) radiation patterns Normalized Normalized radiation patterns (dB) radiation patterns Normalized Theta (degree) Theta (degree) Radiation patterns at 75 GHz on E- and H-planes Slide 21 WM03 Additive Manufacturing for RF Passive Hardware of 51

2.2.1 Experiments on Metallic 3D Printed MmWave and THz Devices (Phase II)

Performance of the 3D printed D-band horn

-10 25.0 Simulated -20 Measured 24.5 24.0 -30 23.5 | (dB) -40 11 23.0 |S Gain (dBi) 0.7 dB difference -50 22.5 Simulated Measured -60 22.0 110 120 130 140 150 160 170 110 120 130 140 150 160 170 Frequency (GHz) Frequency (GHz)

10 0 0 -10 -20 -20 -40 -30 -60 -40 -50 -80 -60 Co-pol simulated -100 Co-pol simulated -70 Co-pol measured -120 X-pol measured -80 -180 -120 -60 0 60 120 180 -180 -120 -60 0 60 120 180 Normalized radiation patterns (dB) radiation patterns Normalized Normalized radiation patterns (dB) radiation patterns Normalized Theta (degree) Theta (degree) Radiation patterns at 245 GHz on E- and H-planes Slide 22 WM03 Additive Manufacturing for RF Passive Hardware of 51 2.2.1 Experiments on Metallic 3D Printed MmWave and THz Devices (Phase II)

Performance of the 3D printed H-band horn -10 25 -20 -30 24 -40 -50 23 | (dB) 1 dB difference

11 -60 Gain (dBi)

|S 22 -70 Simulated Simulated -80 Measured Measured 21 -90 220 240 260 280 300 320 220 240 260 280 300 320 Frequency (GHz) Frequency (GHz)

0 0 -20 -20 -40 -40 -60 -80 -60 Co-pol simulated -100 Co-pol simulated Co-pol measured Co-pol measured -80 -120 -180 -120 -60 0 60 120 180 -180 -120 -60 0 60 120 180 Normalized radiation pattern (dB) pattern radiation Normalized Normalized radiation patterns (dB) radiation patterns Normalized Theta (degree) Theta (degree) Radiation patterns at 145 GHz on E- and H-planes Slide 23 WM03 Additive Manufacturing for RF Passive Hardware of 51

2.2.1 Experiments on Metallic 3D Printed MmWave and THz Devices (Phase II)

Metallic 3D printed E-, D- and H-band waveguides [23]

From top: 50 mm -, 100 mm - and bend PNA measurement setup waveguides Slide 24 WM03 Additive Manufacturing for RF Passive Hardware of 51 2.2.1 Experiments on Metallic 3D Printed MmWave and THz Devices (Phase II)

Performance of 3D printed E-band waveguides 50 mm 100 mm Bend -10 -10 0 Simulated Simulated -10 -20 Measured -20 Measured -20 -30 -30 -30 -40 | (dB) | (dB) | (dB) -40 -40 11 11 11

-50 |S |S |S -50 -50 -60 -60 Simulated Measured -70 -60 -70 70 75 80 85 90 70 75 80 85 90 70 75 80 85 90 Frequency (GHz) Frequency (GHz) Frequency (GHz)

-0.1 0.00 Simulated Simulated Measured -1 -0.2 -0.25 Measured 1.5 dB -2 -0.3 0.15 dB -0.50

| (dB) 0.3 dB -3 -0.4 | (dB) | (dB) 21 -0.75 21 |S 21

|S -4 |S -0.5 -1.00 -5 Simulated Measured -0.6 -1.25 70 75 80 85 90 70 75 80 85 90 -6 Frequency (GHz) 70 75 80 85 90 Frequency (GHz) Frequency (GHz) Slide 25 WM03 Additive Manufacturing for RF Passive Hardware of 51

2.2.1 Experiments on Metallic 3D Printed MmWave and THz Devices (Phase II)

’ The total power loss of a waveguide for a given length l ŝƐɲT сɲR + lɲD ͘ɲR is the ’ ƌĞĨůĞĐƚŝŽŶůŽƐƐ͕ǁŚŝůĞɲD is the Ohmic loss [24]

11 ଶ ߙோ=-10ή݈݋݃ଵ଴ 1 െ ܵଵଵ [݀ܤ] 50 mm 3D Printed 10 100 mm 3D Printed

ଶ 9 10 ܵଶଵ െ ή݈݋݃ଵ଴ ଶ [݀ܤ/݉] ݈ 1 െ ܵଵଵ 8 ߙԢ஽ = ଶ 10Ȝ ௚ ܵଶଵ െ ή݈݋݃ଵ଴ ଶ [݀ܤ/Ȝ ௚] 7 ݈ 1 െ ܵଵଵ Ohmic loss (dB/m) 6 70 75 80 85 90 Frequency (GHz) Ohmic loss of 3D printed E-band waveguides

Slide 26 WM03 Additive Manufacturing for RF Passive Hardware of 51 2.2.1 Experiments on Metallic 3D Printed MmWave and THz Devices (Phase II) Comparison of D-band 3D printed with commercial waveguides 40 50 mm 3D printed 32 100 mm 3D printed 50 mm 3D printed 127 mm commercial 254 mm commercial 100 mm 3D printed 24 127 mm commercial 16

254 mm commercial Ohmic loss (dB/m) 8 12 dB difference 110 120 130 140 150 160 170 Frequency (GHz) 0 -20 -1 1 dB difference - -2 -40 -3 | (dB) | (dB) -60 -4

21 50 mm 3D Printed 11 50 mm 3D printed |S |S 100 mm 3D printed -5 100 mm 3D Printed -80 127 mm commercial -6 127 mm commercial 254 mm commercial 254 mm commercial -7 -100 110 120 130 140 150 160 170 110 120 130 140 150 160 170 Frequency (GHz) Freqneucy (GHz) Slide 27 WM03 Additive Manufacturing for RF Passive Hardware of 51

2.2.1 Experiments on Metallic 3D Printed MmWave and THz Devices (Phase II)

Performance of 3D printed D-band waveguides

50 mm 100 mm Bend -10 -20 -20 -20

-40 -30

-40 ) dB

( -40 | | (dB)

-60 | (dB) 11 11 11 -60 -50 |S |S |S -80 Simulated -60 Simulated -80 Simulated Measured Measured Measured -100 -70 110 120 130 140 150 160 170 110 120 130 140 150 160 170 110 120 130 140 150 160 170 Frequency (GHz) Frequency (GHz) Frequency (GHz)

-1.0 -0.6 -1 -1.5 0.4 dB -2 -0.8 2 dB -2.0 -3 | (dB) | (dB) | (dB) 21

21 0.75 dB 21 |S |S -1.0 |S -4 Simulated -2.5 Simulated Measured Measured Simulated -5 Measured -1.2 -3.0 110 120 130 140 150 160 170 110 120 130 140 150 160 170 110 120 130 140 150 160 170 Frequency (GHz) Frequency (GHz) Frequency (GHz) Slide 28 WM03 Additive Manufacturing for RF Passive Hardware of 51 2.2.1 Experiments on Metallic 3D Printed MmWave and THz Devices (Phase II) Comparison of D-band 3D printed with commercial bends -10

-20

-30

| (dB) -40 11 |S -50 3D Printed Commercial -60 110 120 130 140 150 160 170 Frequecy (GHz) 0 -1 It is calculated the It is calculated the -2 3.5 dB difference two 90-degree two 90-degree -3 bends contribute bends contribute | (dB) 21 -4 0.58 dB insertion 1.79 dB insertion |S -5 3D Printed loss totally. loss totally. Commercial -6 110 120 130 140 150 160 170 Frequency (GHz) Slide 29 WM03 Additive Manufacturing for RF Passive Hardware of 51

2.2.1 Experiments on Metallic 3D Printed MmWave and THz Devices (Phase II)

Performance of 3D printed H-band waveguides

50 mm 100 mm Bend 0 0 -20 -20 -20

-40 -40 -40 | (dB) | (dB) | (dB) 11 11 11

|S -60 |S -60 |S -60 Simulated Simulated Simulated Measured -80 Measured Measured -80 -80 220 240 260 280 300 320 220 240 260 280 300 320 220 240 260 280 300 320 Frequency (GHz) Frequency (GHz) Frequency (GHz)

0 -3 -2 Simulated Simulated -6 3 dB Measured Measured -20 40 dB / -9 -4 2 dB -12 | (dB) | (dB) | (dB) -40 21 21 21 |S |S |S -6 -15 -18 Simulated -60 Measured -8 -21 220 240 260 280 300 320 220 240 260 280 300 320 220 240 260 280 300 320 Frequency (GHz) Frequency (GHz) Frequency (GHz) Slide 30 WM03 Additive Manufacturing for RF Passive Hardware of 51 2.2.1 Experiments on Metallic 3D Printed MmWave and THz Devices (Phase II)

Comparison of H-band 3D printed with commercial waveguides

240 25.4 mm commercial 25.4 mm 50 mm 3D printed commercial 100 mm 3D printed 160

50 mm 3D printed 80 Ohmic loss (dB/m)

100 mm 3D 0 printed 220 240 260 280 300 320 Frequency (GHz) 10 20 25.4 mm commercial 25.4 mm commercial 50 mm 3D printed 5 50 mm 3D printed 100 mm 3D printed 0 100 mm 3D printed 0

-20 -5 4 dB difference | (dB) | (dB) 21 11 -10 |S |S -40 -15 -60 -20 220 240 260 280 300 320 220 240 260 280 300 320 Frequency (GHz) Frequency (GHz) Slide 31 WM03 Additive Manufacturing for RF Passive Hardware of 51

2.2.1 Experiments on Metallic 3D Printed MmWave and THz Devices (Phase II)

Comparison of metallic, dielectric 3D printed and commercial waveguides

- okay

Slide 32 WM03 Additive Manufacturing for RF Passive Hardware of 51 2.2.1 Experiments on Metallic 3D Printed MmWave and THz Devices (Phase III)

3D printed E-band BPFs [25] 15 order BPF!!

We do not minimize the filter orders to explore the BPF 71-76 limit and potential of 3D 11 order BPF!! printing for filter fabrication.

BPF 81-86 Slide 33 WM03 Additive Manufacturing for RF Passive Hardware of 51

2.2.1 Experiments on Metallic 3D Printed MmWave and THz Devices (Phase III)

Performance of 3D printed E-band BPFs 10 0 Designed: -10 S11 simulated 81 - 86 GHz -20 S11 measured -30 S21 simulated Average 1.5 dB passband insertion loss -40 S21 measured 90 dB stopband attenuation -50 -60 Measured: S-Parameter (dB) S-Parameter -70 84 – 90 GHz -80 -90 Average 3 dB passband insertion loss 70 75 80 85 90 Frequency (GHz) 50 dB stopband attenuation 10 Designed: 0 -10 S11 simulated 71 - 76 GHz -20 S11 measured Average 2dB passband insertion loss -30 S21 simulated -40 S21 measured 90 dB stopband attenuation -50 Measured: -60

S-Parameter (dB) S-Parameter -70 73.5 – 77.5 GHz -80 -90 Average 8 dB passband insertion loss -100 65 dB stopband attenuation 70 75 80 85 90 95 Frequency (GHz) Slide 34 WM03 Additive Manufacturing for RF Passive Hardware of 51 2.2.1 Experiments on Metallic 3D Printed MmWave and THz Devices (Phase IV)

The 3D printed E-band radio frontend [26]

+ =

BPF 81-86 BPF 71-76 E-band diplexer + =

E-band radio frontend E-band horn Slide 35 WM03 Additive Manufacturing for RF Passive Hardware of 51

2.2.1 Experiments on Metallic 3D Printed MmWave and THz Devices (Phase IV) The 3D printed E-band diplexer

10 0 0

-10 -10 | (dB) | (dB)

-20 22

11 -20 |S |S -30 Simulated Simulated Measured -30 Measured -40 65 70 75 80 85 75 80 85 90 95 Frequency (GHz) Frequency (GHz) 10 -20 Simulated -40 0 Measured -60 -10 -80 | (dB) -20 | (dB) -100 33 21 |S |S -120 -30 Simulated Measured -140 -40 -160 65 70 75 80 85 90 95 65 70 75 80 85 90 95 Frequency (GHz) Frequency (GHz) 0 0 Simulated Measured -20 -20

-40 -40 | (dB) | (dB) 32 31 -60 -60 |S |S -80 -80 Simulated Measured -100 -100 65 70 75 80 85 90 95 75 80 85 90 95 Frequency (GHz) Frequency (GHz) Slide 36 WM03 Additive Manufacturing for RF Passive Hardware of 51 2.2.1 Experiments on Metallic 3D Printed MmWave and THz Devices (Phase IV) 3D printed E-band radio frontend

5 3 0 0 -5 -3 -10 -6 -15 | (dB) | (dB) -9 11 -20 22 |S -25 |S -12 Simulated -30 Simulated Measured -15 Measured -35 60 65 70 75 80 85 70 75 80 85 90 95 Frequency (GHz) Frequency (GHz) -30 -40 Simulated Measured -50 -60

| (dB) -70 21

|S -80 -90 -100 65 70 75 80 85 90 95 Frequency (GHz) Slide 37 WM03 Additive Manufacturing for RF Passive Hardware of 51

2.2.2 Tolerance Analysis (dimensional tolerance)

Slide 38 WM03 Additive Manufacturing for RF Passive Hardware of 51 2.2.2 Tolerance Analysis (dimensional tolerance)

Slide 39 WM03 Additive Manufacturing for RF Passive Hardware of 51

2.2.2 Tolerance Analysis (dimensional tolerance)

Electron/Laser/UV Movement Control of the Beam Size; Nozzle Size Electron/Laser/UV Beam

Dimensional Tolerance in 3D Printing Thermalh Shrinkage Material Particle Size; (in Sintering/Post Filament Size Sintering/Melting) SlideSlSlidide 404 WM03 Additive Manufacturing for RF Passive Hardware of 51 2.2.2 Tolerance Analysis (surface roughness)

Comparison of 3D printed and commercial waveguide flanges D-band WR-06 H-band WR-03 Commercial Commercial

3D printed 3D printed Chamfered corner

Chamfered corner Bumpy surface Bumpy surface Slide 41 WM03 Additive Manufacturing for RF Passive Hardware of 51

2.2.2 Tolerance Analysis (surface roughness)

X-ray inspection of the 81-86 GHz 3D printed BPF

Slide 42 WM03 Additive Manufacturing for RF Passive Hardware of 51 2.2.2 Tolerance Analysis (surface roughness)

Electron/Laser/UV Movement Control of the Beam Size; Nozzle Size Electron/Laser/UV Beam

Surface Roughness in 3D Printing Gaussianity of the Material Particle Size; Electron/Laser/UV Filament Size Beam SlideSlide 434 WM03 Additive Manufacturing for RF Passive Hardware of 51

2.2.2 Tolerance Analysis

Slide 44 WM03 Additive Manufacturing for RF Passive Hardware of 51 3. Conclusions and Prospects

Slide 45 WM03 Additive Manufacturing for RF Passive Hardware of 51

Conclusions and Prospects

Conclusions: 1. Review the work on dielectric 3D printed mmWave and THz devices. 2. Introduce the experiments on metallic 3D printed mmWave and THz devices. 3. Analyze fabrication tolerance of mmWave and THz devices. 4. The 3D printing technology is applicable for mmWave and THz device fabrication, where the requirement on surface roughness and dimensional tolerance is not very strict.

Prospects: 1. Material powder refinement. 2. Development of surface treatment process. 3. Development of hybrid dielectric 3D printed mmWave and THz devices. 4. Development of hybrid “dielectric+metallic” 3D printing technology.

Slide 46 WM03 Additive Manufacturing for RF Passive Hardware of 51 Acknowledgement

We acknowledge the funding support from Swedish Foundation for Strategic Research (SSF) through the program of ‘RFIC solutions for very high data rate, energy and spectrum efficient wireless THz communication’; Swedish Research Council (VR) through the program of ‘Gigabits at THz frequencies’; and the Visiting Scientist Program from Télécom Bretagne, Institute Mines-Télécom. The authors thank Prof. P. Linnér, Prof. H. Zirath, Prof. V. Vassilev, Prof. P. Starski, Prof. J. Stake, Dr. Z. Zhan, Prof. Y. Cao, Dr. L. Hammar, Prof. J. Sun, Dr. P. Nilsson, Prof. S. Cherednichenko, Dr. A. Pavolotskiy, Prof. V. Desmaris, Dr. P. L. Tam and Prof. U. Södervall from Chalmers University of Technology; Dr. Y. Li, Dr. M. Bao, Dr. O. Tageman, Dr. J. Hansryd and Dr. T. Emanuelsson from Ericsson AB, Sweden; Dr. S. Thundal from Arcam; Dr. H. Kimblad from Höganäs AB, Swedn; Dr. F. Bajard from BINC, France; Prof. C. Kärnfelt and Mr. R. Jezequel from Télécom Bretagne-Institute Mines-Télécom; Dr. H. Gulan and Prof. T. Zwick from Karlsruhe Institute of Technology; Prof. S. Lucyszyn from Imperial College London; Dr. T. Deng from National University of Singapore; Dr. Z. Chen and Prof. Y. P. Zhang from Nanyang Technological University for their discussions, comments and assistance.

Slide 47 WM03 Additive Manufacturing for RF Passive Hardware of 51

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Thank you!

Slide 50 WM03 Additive Manufacturing for RF Passive Hardware of 51