Institute for Materials Research University of IMOMEC Associated Lab IMEC poor solderadhesion. such asvoids, cold solderjointsand hiddensolderproblemsdetect Only X-ray isableto inspection reliable manner. andcost-effective joints canbecheckedinasimple, ofhiddensolder the characteristics devices. ByusingX-ray inspection, no longersufficientto analyse these Traditional verification methodsare element inPCBdesign. devices have become astandard chips andotherhiddenconnection PackagesChip Scale (CSPs), flip wherefacturers BGAs, micro-BGAs, manu- contract PCB andelectronics tools usedby ing oneoftheprimary X-ray becom- isquickly inspection of testing non-destructive Application area: μFocus X-ray Equipment electronic assemblies high-end applications. high-end highest spatialandcontrast resolution for provide detector and thehigh-contrast solderjoints. package The nanofocus tube ofwettingdetection inarea defects array enablesthemostefficient Magnification) OVHM technique (Oblique View atHigher of printed circuit board assemblies. Its an opentube, dedicated to theinspection resolution X-ray system isequippedwith control andfailure analysis. This high of science andindustry, likeprocess system thatcanbeappliedinmany fields IMOMEC hasamicrofocus X-ray inspection System description and specifications

Large objects are placed on a x-y-z movable table, while smaller objects (up to 2kg) can be mounted on a tilt/rotate unit to analyse them from different angles. The system is equipped with image processing software with two modules for automatic analysis i.e. wire-bond sweep analysis and Ball Grid Array (BGA) analysis.

Parameter Specification Maximum scanning area 457mm x 304mm Dimension of table for PCBs 410mm x 410mm Maximum tube voltage 160kV Maximum tube current 0.5mA Maximum tube power 20W Spatial resolution 1μm or 500nm (with nanofocus tube) Geometric magnification 1900x Total magnification Nearly 10,000x

Crack in a thin film resistor, screenprinted on a Electrical relay contact partially destroyed by arcing ceramic substrate and incapsulated in epoxy mould

Wire bond analysis Visualisation of a crack in a cable assembly even (wire sweep, crack due to overcurrent,...) though concealed by the connector

Detection of solder bridges in the center of the BGA Automatic analysis of BGA solder joints (shape, voids,...)

IMEC Institute for Materials Research - Kapeldreef 75 Division IMOMEC, IMEC vzw B-3001 Leuven Wetenschapspark 1 B-3590 Belgium

Ph. +32 16 28 18 80 Ph. +32 11 26 88 72 Fax. +32 16 28 16 37 Fax. +32 11 26 88 99 [email protected] [email protected]