Early Registration Deadline: November 21, 2001 CONTENTS

Foreword 2 Scope and Format 3 International Symposium on Electronics and the Environment 6 Care Electronics within Eureka 7 Plenary speakers 8 Program Overview 12 December 9 13 December 10 14 December 11 15 December 12 Room Information 13 Tutorials 14 Program 12 December 17 13 December 25 14 December 33 15 December 49 Poster Session 61 General Information 63 Conference Committees 71 Conference Organization 77 Acknowledgments 80 Registration Form 81 Hotel Reservation Form 85 Access Map to the Intercommunion Session (NMESI, the Nippon Miraikan)87

1 FOREWORD

Sustainable Development is the most significant concept that all kinds of people must deeply consider its implication in modern society. The concept was originated by Mrs. Brundtland who chained the World Commission for Environment and Devel- opment in 1987. The concept has become subject of discussion very often and in various occasions since then, but without concluding any practical policy or activity to satisfy the concept. As a result, some people starts insisting that the concept is just an illusion which can not be realized and sometimes deceive the masses. This insistence is absolutely wrong. The concept, Sustainable Development, is not mentioning the ways along which people can actually achieve the goal. On the con- trary, it is proposing an equation that must be solved urgently in order to avoid the concurrent global disasters of natural environment and human society. The definition of the concept is clear but solution of the equation proposed within the concept is dif- ficult to solve. More definitely, it should be said that Mrs. Brundtland told us that there is no solution in our society if we proceed on the same way that we did in the past. Some funda- mental changes are requested. They are international relations, industrial policies, competition in the market, policies for material and energy resources, official aids for developing countries, and rather strange to say, life styles of people. How can we moderate them in a harmonic way? We do not have any feasible way to cope with them concurrently. Some comprehensive proposals to solve the equation of Sustainable Development are highly requested. They seem to be integrated ones that involve national science, engineering, social science, medical science and humanities. It is desirable that those separated researchers in different academic domains would come together to communicate each other and to construct a unique proposal to be opened to the general society. It should be pointed out here,that for the integration of different aca- demic domains, the domain-specific academic conclusions must be followed up by practical actions. For such follow-up, we may need new engineering, such as social engineering and humanity engineering, both of them will be doubtlessly based on social science and humanities, being similarly composed the relationship between natural science and engineering. EcoDesign 2001 will show a sound step to solve the different equation of Sustain- able Development from various aspects of disciplinary and interdisciplinary researches. We heartily hope that you will get unbounded information about Sustain- able Development from the Conference, and possibly contribute it for further step of progress by your thoughts in the particular scientific domains.

Hiroyuki Yoshikawa, Symposium Chair Chairman, The Science Council of Japan

2 SCOPE AND FORMAT

The EcoDesign 2001 organizing committee is pleased to announce EcoDesign 2001, the Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing, to be held on December 11-15, 2001 at Tokyo Big Sight, Tokyo, Japan. This symposium is organized by Union of EcoDesigners (Association of EcoDesign Societies, Japan), follow up on the first, successful “EcoDesign ’99” (Tokyo, February 1999). The Union comprises of 50 scientific societies, foundations and associations in Japan. The symposium is held in “Going Green” : Global collaboration with IEEE Technical Committee on the Electronics and the Environment, USA, and CARE Elec- tronics, Europe.

The technical program of EcoDesign 2001 comprises three plenary speeches, 10 keynotes addresses, and 10 invited speeches along with approximately 236 con- tributed papers (including 16 posters) from 23 countries around the world, which are based upon six pillars of categories and nine special themes as follows. We want to discuss how information and communication technology can contribute to a sustainable developmet. Which products and technologies are needed? You can expect to learn state-of-the-art of these domains by attending the sessions.

Category A: Environmentally Conscious Product Design Topics: EcoDesign Case Studies, Modular Design, Industrial Design, Life Cycle Design, EcoDesign Processes, EcoDesign Methods, Design for X, Integration of EcoDesign and CAD, Information Sharing for EcoDesign, Tools for X, LCA Case Studies, Design for Disassembly Sessions: 19 Oral presentations: 75 (included one keynote speech made by Prof. E. Manzini, Italy)

Category B: Process Technologies and Elemental Technologies Topics: Eco-Materials, Long Fatigue Life (Giga-cycle) of Materials, Maintenance, Cleaner Processes and Energy-Saving Processes Sessions: 6 Oral presentations: 23 (included one keynote speech made by Dr. C. Bathias, France)

Category C: Inverse Process Technologies Topics: Reuse and Recycling (Strategies and Technologies), Inverse Process System Design Sessions: 7 Oral presentations: 24 (included one Invited speech)

3 Category D: Business Strategies Topics: Environmental Conscious Market and Corporate Strategies, Servicifica- tion for Dematerialization Sessions: 2 Oral presentations: 9 (included one keynote speech made by Prof. H. Brezet, The Netherlands)

Category E: Sustainable Social Systems Topics: Environmental Education, Environmental Accounting, Social System Design, Labelling and Logistics Sessions: 5 Oral presentations: 19 (included one keynote speech made by Prof. M. Charter, UK)

Category F: Environmentally Conscious Management Topics: Supply Chain Management, Management System, LCA Sessions: 4 Oral presentation: 22

Following specific sessions created by leading experts from around the globe. Special Theme 1: Factor 10 (Resources Productivity) Oral presentations: 7

Special Theme 2: Promotion of DFE (Design for Environment) Sessions: 2 Oral presentations: 6 (included one keynote speech made by Prof. P. Eagan, USA)

Special Theme 4: Industrial Ecology (Invited Session) Sessions: 4 Oral presentations: 10 (including 9 invited lectures)

Special Theme 5: Recycling of Individual Products (Current and Future) Oral presentations: 5

Special Theme 6: Research Trends in Lead-free Soldering Oral Presentations: 6 (including two keynote speeches made by Prof. K. Nimmo, Italy and Dr. C. Handwerker, USA)

Special Theme 8: EcoDesign and Chemical Engineering Organized by The Society of Chemical Engineers, Japan Sessions: 3 Oral presentations: 13 (including two keynote speeches made by Mr. Y. Yasui, Japan and Prof. J. Petrie, Australia)

4 Special Theme 9: Advanced Technology for Electronic Packaging – JIEP Session Organized by Japan Institute of Electronics Packaging Sessions: 2 Oral presentations: 9 (including one keynote speech made by Mr. H. Hayashi, Japan)

Special Theme 10: Low-temperature Lead-free Solder This session reports the current status of the low-temperature lead-free soldering project organized by Japan Institute of Electronic Packaging Oral presentations: 6

Special Theme 11: IMS Project on Lead-free Soldering EFSOT Organized by IMS (Intelligent Manufacturing System) Project on Next Generation Environment-Friendly Soldering Technology (EFSOT) Sessions: 2 Oral presentations: 6

As another important feature, three tutorials are scheduled on the first day of the symposium, December 12 morning, inviting international lectures to provide partici- pants with their enlightening ideas. Additional interesting events are exhibition held by a variety of 350 companies displaying their unique products and latest environ- mentally conscious technologies from around the globe, and, specially arranged for overseas participants, technical tours (December 11) which introduce them to the recycling facilities of two Japanese firms and two interesting architectures.

Abundant in topics and nationalities of the speakers, EcoDesign 2001 will produce a stimulating and productive moment for all participants. We welcome you to the symposium and hope you find this opportunity useful.

Tadatomo Suga, Technical Committee Chair Prof. Dr., The Univ. of Tokyo RCAST (Research Center for Advanced Science & Technology)

5 International Symposium on Electronics and the Environment The ISEE will continue established traditions as the world’s leading forum on elec- tronics and the environment. More broadly, the ISEE has grown into a premier meet- ing of professionals in design for environment, polllution prevention and environmental policy fields. “Life-Cycle Environmental Stewardship for Electronic Products” will reaffirm the electronics industry’s leadership in environmental design and management, including life-cycle management, disassembly, recycling, take- back, energy use minimization, supply chain management and other activities. The symposium will also look forward to new domains such as electronic com- merce, new materials and components, advances in manufacturing, and environ- mentally preferable purchasing. The ISEE is organized by IEEE CS TCEE (The Institute of Electrical and Electron- ics Engineers, Inc. (IEEE), Computer Society, Technical Committee on Electronics and the Environment), USA. The next ISEE will be held May 6-8, 2002 in San Francisco, California, USA. It will be held in conjunction with the IAER’S (International Association of Electronics Recyclers) third annual Electronics Recycling Summit.

6 Care Electronics within Eureka

On the threshould of a new millennium the impact of electronics on the quality of life of mankind has never been greater. Advances in electronics have revolutionized the way in which we live and do business. However, every technological advance brings with it new demands on the Earth’s resources and subsequent changes to the global environment. Manufacturers of electronic equipment are increasingly being made aware of their environmental impacts by legislation, customers and competitors. Recognizing their responsibility to the Environment, electronics companies world-wide have been working to mini- mize their impact, develop new ‘clean’ technologies and to integrate environmental considerations into new designs to cope with end-of-life issues. CARE electronics within the EUREKA umbrella is the largest environmental research platform of the European electronics industry.

CARE Electronics means Comprehensive Approach for the Recycling and Eco- efficiency of Electronics.

CARE Electronics is a strategic initiative to understand the international & national implications of sustainability for the electr(on)ics industry in the future. CARE Elec- tronics is an independent, industrial R&D network with members from large as well as small companies & research organisations.

CARE Electronics • forecasts products, technologies, services & societal expectations, • identifies & researches strategic issues, • provides a platform for dialogue with government, business, academia & society and • initiates and supports a series of projects which deliver sustainable solutions.

CARE Innovation is the periodic international meeting of CARE Electronics.

7 PLENARY SPEAKERS

Opening Address (Dec.12, 13:30-13:45) Hiroyuki Yoshikawa, Symposium Chair/The Science Council of Japan/ National Inst.of Advanced Industrial Science and Technology, Japan

Plenary I (Dec.12, 13:45-14:25) The Development and Promotion of the Ecological Rucksacks and MIPS Concept F. Schmidt-Bleek, Factor 10 Inst., France

Plenary II (Dec.12, 14:25-15:05) Overview of Activities of the EC in the Field of Products and the Environment Marco Onida, DG Environment, European Commission

Plenary III (Dec.15, 15:40-16:30) Design ‘Sustainable’ Products/Service Systems John Ehrenfeld, Masachusetts Inst.of Technology, USA

Closing Lecture (Dec.15, 16:45-17:15) Comprehensive Product Modelling for Designing Life Cycle Scenarios Fumihiko Kimura, Org. Com. Co-Chair/The Univ. of Tokyo, Japan

Closing Words (Dec.15, 17:15-17:30) Diana Bendz, Org. Com. Co-Chair/IEEE CS TCEE/IBM, USA

The above speeches are all held at the International Conference Room on the 7th floor.

8 17:50 (1) Break andEcoDesign Industrial Ecology Industrial Ecology andEcoDesign (2) ST4-1-1(Invited Lectures) ST4-1-2(Invited Lectures) F1 Management SupplyChain (1) (2) C1-1 C1-2 Reuse and RecyclingReuse and RecyclingReuse and Break (Strategies and (Strategies Technologies) and (Strategies Technologies) (at Room 102, 1F, Tokyo Big Sight, Tower Building) Tower Big Sight, Tokyo 1F, Room102, (at Lunch/Sing-up & Registration Break (1) (2) B1-1 B1-2 (B. Bras) (B. Tu to r ia l 3 Eco-Materials Eco-Materials Wednesday, 12 December 2001 December 12 Wednesday, PROGRAM OVERVIEW PROGRAM Welcome Reception Welcome (1) (2) A1-2 Opening Address (Hiroyuki Yoshikawa, SymposiumChair/TheScienceJapan) of Council OpeningYoshikawa, Address (Hiroyuki J. Müler J. Tutorial 2 Tutorial H. Griese H. L. Stobbe L. EcoDesign EcoDesign O. Deubzer O. Case Studies Case Studies Plenarythe Activities ofin Products(Marco and of Field Overview Environment EC thethe II:of Onida, European Commission) Plenary I: The Development and Promotion of the Ecological Rucksacks and MIPS Concept (F. Schmidt-Bleek, Facto France) 10 Inst, Schmidt-Bleek, Facto and MIPSand PromotionConcept Rucksacks Ecologicalthe (F. Plenaryof I: Development The Room1 Room2 Room 3 Room 4 Room 5 Room 6 Poster Tu t o r i a l 1 Strategies EcoDesign (A. Stevels) (A. 15:40-16:00 16:00-16:20 16:20-16:40 16:40-17:00 17:20-17:40 12:00-13:30 13:45-14:25 9:00-12:00 17:40-18:00 18:00-18:20 18:30-20:30 14:25-15:05 15:05-15:20 15:20-15:40 A1-1 17:00-17:20 A1-3 13:30-13:45

9 tion Poster Prepara- (4) (3) Break andEcoDesign andEcoDesign Industrial Ecology Industrial Ecology ST4-2-2(Invited Lectures) ST4-2-1(Invited Lectures) ST1-2 Factor 10 Factor F2 System Management Break Lunch (2) (1) C2-2 SystemDesign SystemDesign Inverse Process Inverse Inverse Process Inverse Thursday, 13 December 2001 December 13 Thursday, Break PROGRAM OVERVIEW PROGRAM —Vision to an Affluent Eco-Society — (organized by EcoProducts Exhibition) —Visionby an Eco-Society to Affluent —(organized Environmental Efficiency as a Keyword / Ryoichi Yamamoto (The Univ. of Tokyo) of (TheUniv. Yamamoto Ryoichi / asEfficiencya Environmental Keyword (3) (4) A2-3 Welcome / Hiroshi Sakisaka (Japan Environmental Management Association for Industry) Hiroshi/Sakisaka Management Environmental Association for Welcome (Japan EcoDesign EcoDesign CaseStudies CaseStudies The Application of Eco-Design —Ten Years of Dynamic Development / A.L.N. Stevels (Delft Univ. Technology) (Delft Univ. Stevels A.L.N. / Dynamicof Development Years Application TheEco-Designof —Ten EcoProducts 2001 Exhibition Symposium: For Reforming Japanese Economy BasisAspectstheEcoProducts Japanese Reformingon Environmental of Exhibition Symposium:2001 For Hisatake Kato (Tottori Univ. of Env. Studies) Env. of Univ. (Tottori Kato Hisatake Xerox) (Fuji Kobayasi Yotaro (Architect) Kisho Kurokawa Kimoto(under negotiation) Noriko Environmental Technology Applicable to Reforming Economy —My Proposal / Hisatake Kato (Tottori Univ. of Env. Studies) Env. of Univ. —MyEconomyKato Reforming (Tottori Proposalto Hisatake Applicable / Technology Environmental Break Design Design Room 1 Room 2 Room3 Room 4 Room5 Room 6 Poster Modular Industrial Panel Discussions Panel Coordina- tor: Panellists: 9:20-9:40 A2-1 11:00-11:20 A2-4 14:45-15:00 10:00-10:20 10:20-10:40 14:00-14:45 10:40-11:00 A2-2 13:20-14:00 15:00-17:00 13:00-13:05 11:20-11:40 11:40-12:00 12:00-13:00 13:05-13:20 9:40-10:00 C2-1

10 Poster Poster Poster Session Exhibition Exhibition Break ST6-3 ST11-3 Soldering in Lead-freein Lead-free SolderLead-free Research Trends Low-temperature Soldering EFSOT IMSProjecton Lead-free (1) (2) LCA LCA F3-2 E3-2 Break Accounting Environmental (2) (1) and B3-2 B3-1 D3-1 D3-2 Break F3-1 Market Materials Materials Corporate Strategies Conscious Environmental Environmental (Giga-cycle) of (Giga-cycle) of Long Fatigue Life Fatigue Long Servicification for Long Fatigue Life Fatigue Long Dematerialization (5) (4) (3) E3-1 C3-3 C3-1 Break Break ST10-3 (at Restaurant 5K PLANETS, 7F, NMESI) Kagaku Nippon 7F, 5KPLANETS, (at Restaurant Education Environmental Reuseand Recycling Reuseand Recycling Reuseand Recycling (Strategies and Tech.) (Strategies (Strategies and Tech.) (Strategies Friday, 14 December 2001 14 December Friday, (Strategies and Tech.) (Strategies PROGRAM OVERVIEW PROGRAM Lunch & (1) (5) Poster Session Poster A3-5 A3-7 Break C3-2 Sharing Intercommunion Session Intercommunion EcoDesign Information Information Integration of Integration Case Studies Case for EcoDesign for for EcoDesign (2) for Information SharingInformation EcoDesignCAD and (1) Break Break A3-8 Design Room1 Room2 Room 3 Room4 Room5 Room6 Poster Methods Life Cycle Life Processes EcoDesign EcoDesign Design for X for Design 12:40-13:00 11:20-11:40 11:40-12:00 12:00-12:20 10:40-11:00 A3-2 13:20-13:40 9:20-9:40 A3-1 14:00-14:20 A3-3 12:20-12:40 13:00-13:20 13:40-14:00 16:20-16:40 16:40-17:00 17:00-17:20 18:00-20:00 11:00-11:20 A3-6 9:40-10:00 10:00-10:20 10:20-10:40 14:20-14:40 14:40-15:00 15:00-15:20 16:00-16:20 A3-4 15:20-15:40 15:40-16:00

11 Poster Exhibition (2) (1) DFE DFE Break ST5-4 ST2-4-2 ST2-4-1 Products Individual Individual Recycling of Promotion of Promotion of (Current and Future) (1) (3) (2) Break ST8-4-1 ST8-4-3 ST8-4-2 Chemical Chemical Chemical Engineering Engineering Engineering EcoDesign and EcoDesign and EcoDesign and E4-3 ST9-4-2 ST9-4-1 Logistics Advanced Advanced Advanced Advanced Packaging Packaging Electronic Electronic Labelling and Labelling Technology for Technology Technology for Technology – JIEP– Session(2) – JIEP– Session(1) Break Lunch Break Best Paper & Best Poster Awards & Best Poster Best Paper (2) (1) E4-1 SocialSystem Design SocialSystem Design Cleaner Processesand Energy-Saving Processes Energy-Saving Saturday, 15 December 2001 December 15 Saturday, (Fumihiko Kimura, Org. Com. Co-Chair/The Univ. of Tokyo, Japan) Tokyo, of Com.Org. Co-Chair/The Kimura, Univ. (Fumihiko PROGRAM OVERVIEW PROGRAM Closing Words (Diana Bendz, Org. Words Com. Closing Co-Chair/IEEECSTCEE/IBM, USA) Closing Lecture: Comprehensive Product Modelling for Designing Life Cycle Scenarios Cycle DesigningLife for Modelling Product Lecture: Closing Comprehensive Plenary III: Designing ‘Sustainable’ Product/Service Systems (John Ehrenfeld, MIT, USA) Plenary Product/ServiceDesigning ‘Sustainable’ III: MIT, Systems (JohnEhrenfeld, LCA B4-1 Break E4-2 Design for Disassembly Maintenance Case Studies (2) Room1 Room2 Room 3 Room4 Room5 Room6 Poster Design for X Designfor To o l s fo r D f X 11:20-11:40 A4-3 12:00-12:20 12:20-12:40 17:15-17:30 11:40-12:00 14:20-14:40 14:40-15:00 15:00-15:20 15:20-15:40 9:20-9:40 12:40-13:00 13:00-13:20 13:20-13:4013:40-14:0014:00-14:20 A4-2 15:40-16:30 A4-4 B4-2 16:45-17:15 9:40-10:00 10:00-10:20 16:30-16:45 11:00-11:20 A4-1 10:20-10:40 10:40-11:00

12 ROOM INFORMATION Tokyo Big Sight, Tower Building (Kaigi-to) 6th Fl.

605, 609, 610:Tutorials 605 ~ 610:Conf. Rm 604: Poster 603: Check Rm for Technical Equipment Lobby :Registration Desk 601: Secretariat 602: Committee/Recess Rm for Invited

7th Fl.

Int. Conf. Rm. Opening, Plenaly I ~ III Best Paper & Best Poster Awards Closing

13 TUTORIALS Wednesday, 12 December 2001, 9:00-12:00 Tutorial 1 Ecodesign Business and Green Marketing 1) Integration of EcoDesign into the Business 2) Green Marketing and Sales

Prof. Dr. Ir. A. L. N. A. Stevels Philips Consumer Electronics/Delft Univ. of Technology, The Netherlands

Three main drivers to do it (customers, legislation and competetive advantage). Several types of “green” to be considered (scientific green, government green, cus- tomer green). The Ecodesign matrix. Three types of environmental activities (defen- sive, cost oriented, proactive). Four levels of EcoDesign Vision, strategy policy, roadmap. How to organize. How to develop green options and how to do business evaluation of them. Integration of green into product creation. Example of green pro- grammes and of green product realizations. Lessons learned from ten years working implementation of Ecodesign. Five ways of making money while being “green”.

Seven archetypes of green consumer behaviour: – Characteristics of archetypes – How to circumvent the “green does not sell” trap – Environmental communication – Green image and its importance – How to put more green into your brand – Position of ecolabels – Integration of green idea generation, product development and marketing

14 Tutorial 2 Applied EcoDesign — Product Characterization by Sustainability Indices

Dr. H. Griese, O. Deubzer, J. Müller, L. Stobbe Fraunhofer Inst. for Reliability and Microintegration (IZM), Berlin, Germany

Presentation methods and practical applications of product characterization with ecological special sustainability indices. Key points are resource consumption, mate- rial content, hazardous materials and risk assessment, recycle/reuseability, and aspects of sustainability in the IT sector. The focus lies on the reduction of energy consumption and hazardous substances.

The tutorial includes the following topics: 1) Sustainability Roadmap and EcoDesign in the field of ICT – Status quo and trend analysis – Field of activity – Best practice examples environmental report (Sony; Philips; Flextronics)

2) EE Toolbox methodology for environmentally conscious design –Tool TPI –Tool ERM –Tool IPI –Tool ProTox – Tool RPI

3) Application examples of the EE-Toolbox – Example Switched power supply – Example PWB telephone – Example mobile phones – Example Semiconductor Fab

The tutorial will be held by specialists of the Fraunhofer IZM, Dept. of Environmental Engineering (organizer of “Electronics Goes Green 2000+”).

15 Tutorial 3 Identifying Economic and Environmental Win-Win Situations in EcoDesign

Prof. Bert Bras Georgia Institute of Technology, USA

In this tutorial, the focus is on how to identify technical, economical, and environmen- tal win-win situations. A key focus area will be on how to integrate economic and environmental assessments in order to easily identify opportunities for economic and reducing environmental improvements.

In the tutorial, attendees will learn about: – EcoDesign guidelines and strategies and how they affect other design and business requirements – Assessment tools like Life-Cycle Analysis, Life-Cycle Costing, Full Cost Account- ing, etc. and how they can (or cannot) be used to identify win-win situations in both product and process design – How to integrate financial and environmental assessments in a single framework using Activity-Based Cost and Environmental Management – Technologies and tools that support integrated performance assessments and monitoring – Industrial case studies and examples from Europe, Japan and the United States

The tutorial will be given by Dr. Bert Bras who is a faculty member in Mechanical Engineering and Director of Georgia Tech’s Institute for Sustainable Technology and Development. He has taught and published (including one book) extensively in the area of Environmentally Conscious Design and Manufacturing. He recently served on a panel of experts benchmarking the global state of Environmentally Benign Man- ufacturing for the US National Science Foundation and Department of Energy.

16 Tutorial/Opening/Plenary I, II PROGRAM Dec 12 Dec WEDNESDAY, 12 DECEMBER 2001

Room 1 9:00-12:00 Tutorial 1

Ecodesign Business and Green Marketing 1) Integration of EcoDesign into the Business 2) Green Marketing and Sales Ab Stevels, Philips/Delft Univ. of Technology, The Netherlands

Room 2 9:00-12:00 Tutorial 2

Applied EcoDesign-Product Characterization by Sustainability Indices Hansjörg Griese, Otmar Deubzer, Jutta Müller, Lutz Stobbe, Fraunhofer IZM, Belin, Germany

Room 3 9:00-12:00 Tutorial 3

Identifying Economic and Environmental Win-Win Situations in EcoDesign Bert Bras, Georgia Inst. of Technology, USA

International Conference Room, 7F

13:30-13:45 Opening Address

Hiroyuki Yoshikawa, Symposium Chair/The Science Council of Japan, Japan

13:45-14:25 Plenary I

The Development and Promotion of the Ecological Rucksacks and MIPS Concept F. Schmidt-Bleek, Factor 10 Inst., France

14:25-15:05 Plenary II

Overview of Activities of the EC in the Field of Products and the Environment Marco Onida, DG Environment, European Commission

17 Room 1 Dec 12 Dec

A1-1 15:20-17:20 A1-1: EcoDesign Strategies

1. System Boundaries and Functional Priorities in Different Life Phases in the Context of Eco-Design Ulrika Forsberg, Jessica Lagerstedt, Royal Inst. of Technology, Sweden

2. Combined Strategies for Recycling — Product and Process Oriented Benchmarking Juergen Hesselbach, Christoph Herrmann, Technical Univ. Braunschweig, Germany

3. Planning Product Take Back Period and Component Life under Uncertainty in Technological Evolution Hideo Fujimoto, Alauddin Ahmed, Nagoya Inst. of Technology, Japan

4. The Conflict of Contradictory Environmental Targets Conrad Luttropp, Reine Karlsson, KTH, Sweden

5. Environmentally Compatible Product Design: The Business Strategy of Siemens Ferdinand Quella, Siemens, Germany

6. Subjects in and Approaches for Life Cycle Design Toshijiro Ohashi1, Yoshio Matsumoto2, 1Hitachi, 2Tokai Univ., Japan

18 Room 2 A1-2/A1-3 Dec 12 Dec 15:20-16:40 A1-2: EcoDesign Case Studies (1)

1. Confronting Product Life Thinking with Product Life Cycle Analysis Tim C. McAloone, Technical Univ. of Denmark, Denmark

2. About the Environmental Load Relevant to Water, and Its Reduction Daisuke Yamanouchi, TOTO, Japan

3. Ecological Design for the Usage Phase: An Interdisciplinary Approach to DfE Christof Oberender, Olaf Weger, Juergen Sauer, Herbert Birkhofer, Darmstadt Univ. of Technology, Germany

4. On the Way to Green Mobile Products Jutta Mueller1, Hansjoerg Griese1, Herbert Reichl1, 2, 1Fraunhofer Inst. for Reli- ability and Microintegration, 2Technical Univ. of Berlin, Germany

17:00-18:00 A1-3: EcoDesign Case Studies (2)

1. The Aptitudes of the Ecodesign Competitions Held During 1987 to 1997 in Japan Edilson Ueda, Tadao Shimizu, Chiba Univ., Japan

2. Ecodesign Demonstration Project (LIFE) — Examples of Ecodesign in Belgian Industry An Vercalsteren, Bart Jansen, Vito (Flemish Inst. for Technological Res.), Belgium

3. Regarding the Actual Condition of Industrial Waste, and Possibility That Utilizes it Effectively as Materials for Other Industries Yoshiaki Kamo, Japan Inst. of Plant Maintenance, Japan

19 B1-1/B1-2 Room 3 Dec 12 Dec 15:20-16:40 B1-1: Eco-Materials (1)

1. Properties of a Novel Polyarylate Yoshinao Ishigure1, Kousuke Yamauchi2, Masashi Niikawa3, Yoshihiro Kubota4, Yoshihiro Sugi4, Minoru Miwa4, 1Research Inst. of Industrial Products, Gifu Pre- fectural Government, 2Nissei Kagaku Kogyosho, 3Tenryu Kogyo, 4Gifu Univ., Japan

2. Environmental Benchmark Analysis of Electr(on)ic Products with Components Consisting of Renewable Raw Materials Heiko Maas1, Michael Flake2, 1Technical Univ. of Braunschweig, 2LCE Consult- ing, Germany

3. Method for Interconnected Development and Selection of Basic Material, Exemplified on the Basis of Biodegradable Synthetic Materials Made-up of Renewable Primary Product Hermann Kuehnle, Otto-von-Guericke-Univ. Magdeburg, Germany

4. Newly Developed Chromium-free Organic-inorganic Composite Coated Steel Sheet with Excellent Corrosion Resistance Takahiro Kubota, Naoto Yoshimi, Akira Matsuzaki, Satoru Ando, Masaaki Yamashita, NKK, Japan

17:00-18:20 B1-2: Eco-Materials (2)

1. A High Reliability Halogen-free Flame-retardant Dielectric for Build-up PWBs Yasunori Yoneda, D. Mizutani, N. F. Cooray, K. Motoyoshi, Fujitsui Labs., Japan

2. Feasibility Study for Recycling of JVC Compact Disks for Use in the Manufacturing of Motorola Plastic Housings Markus Stutz1, Doreen Schnecke1, Teruo Takahashi2, Noboru Kawai2, Koji Tsujita2, 1Motorola, Germany, 2Victor Co. of Japan, Japan

3. Hydrothermal Solidification of Inorganic Waste Materials Mikihiro Oida1, Hideki Ishida2, Hiroki Maenami2, Hiroto Shin2, Hiroaki Kuno2, 1Aichi Science and Technology Foundation, 2INAX, Japan

20 Room 3 Dec 12 Dec B1-2 4. R&D of Environmentally Friendly Plate Material NPPS with Burrs for Electric Vehicle Storage Battery Use Kaihua Xu1, Min Wang1, Xueyi Guo2, Ryoichi Yamamoto2, 1Shenzhen Zhongjin Hi-Energy Battery Material Co., China, 2The Univ. of Tokyo, Japan

21 C1-1/C1-2 Room 4 Dec 12 Dec 15:20-16:40 C1-1: Reuse and Recycling (Strategies and Technologies) (1)

1. Recent Trends and Benefits of Remanufacturing: From Closed Loop Businesses to Synergetic Networks Rolf R. Steinhilper, Univ. of Bayreuth, Germany

2. An Analytic Approach for Designing Reverse Production System Infrastructure When Facing Uncertainty Jane C. Ammons, Tiravat Assavapokee, David Newton, Matthew J. Realff, Georgia Inst. of Technology, USA

3. Experiences with Take-back of White and Brown Goods in The Netherlands Ab Stevels, Delft Univ. of Technology, The Netherlands

4. Feasibility Study of the Recycling Options in Malaysia — The Kota Kinabalu Case Study Lee Chong Theng, Mohd Nasir Hassan, Md Mizanur Rahman, Muhamad Awang, Univ. Putra Malaysia, Malaysia

17:00-18:00 C1-2: Reuse and Recycling (Strategies and Technologies) (2)

1. Ricoh’s Global Deployment of Recycling Masakatsu Nakagawa, Ricoh, Japan

2. FXOS Recycled Pulp Promotion Program Hiromi Ishida, Katsumi Harada, Hiroshi Tokita, Kazuhide Suzuki, Masayuki Tsuchiya, Kazuya Suda, Mitsuo Ishida, Taiji Ohashi, Fuji Xerox Office Supply, Japan

3. Recycling-oriented Production and Assessment of FujiFilm One Time Use Camera “Quick Snap” Shu-ichi Ichino, Fuji Photo Film, Japan

22 Room 5 Dec 12 Dec

15:20-17:20 F1 F1: Supply Chain Management

1. Environmental-Economic Supply Chain Management of Suppliers, Contract Manufacturers and Recyclers: More than Requirements for Environmentally Hazardous Substances and Environmental Management Systems Menno H. Nagel, Delft Univ. of Technology, The Netherlands

2. Production Planning in Remanufacturing/Manufacturing Production System Andre Kasmara1, Masaaki Muraki2, Shinobu Matsuoka2, Sukoyo2, Kadarsah Suryadi1, 1Bandung Inst. of Technology, Indonesia, 2Tokyo Inst. of Technology, Japan

3. Environmental Supply Chain Management in the Electronics Industry Dana Hollien1, Graham L. Adams2, Michael Loch1, Steven M. Scheifers1, Markus Stutz3, 1Motorola, USA, 2Motorola, UK, 3Motorola, Germany

4. Consumer Incentive toward the Construction of Supply Chain for Inverse Manufacturing Keijiro Masui1, Jun Fujimoto2, Toshihiko Ito3, Sato4, Yuichi Hayakawa5, Masato Matsunaga6, Mutsumi Mikoda7, Takeshi Yuda8, 1National Inst. of Advanced Industrial Science and Technology, 2NEC, 3Nissan Motor, 4Hitachi, 5Meidensha, 6ECO KEIKAKU, 7Japanese Material Handling Society, 8Sony, Japan

5. Material-flow based Supply Chain Management in the Electronic Industry Juergen Hesselbach, Rene Graf, Martin Ohlendorf, Christoph Herrmann, Techni- cal Univ. Braunschweig, Germany

6. Design and Integration of “Intelligent Agents” to Implement Conscious and Sustainable Future Production Systems Pierre Massotte, Jihad Reaidy, Yuinggiu Liu, Daniel Diep, Ecole des mines d’ales, France

23 ST4-1-1/ST4-1-2 Room 6 Dec 12 Dec 15:20-16:40 Special Theme 4-1-1 (Invited Lectures): Industrial Ecology and EcoDesign (1)

1. Designing Sustainable Product/Service Systems John Ehrenfeld, Massachusetts Inst. of Technology, USA

2. Environmentally-Benign Manufacturing as a System Science Thomas Graedel, Yale Univ., USA

3. Material Flow Accounting as a Tool for Industrial Ecology Yuichi Moriguchi, National Inst. for Environmental Studies, Japan

17:00-17:50 Special Theme 4-1-2 (Invited Lectures): Industrial Ecology and EcoDesign (2)

1. Industrial Ecology in Off-site Building Component Industry: Case Study on Bathroom Units Sectors Shih-Hung Yang, Tomonari Yashiro, Nishimoto, The Univ. of Tokyo, Japan

2. Implementation of “Life Cycle Value Index” in Assembly Houses To m o m i M u ra t a 1, Tomonari Yashiro2, 1The Univ. of Kitakyushu, 2The Univ. of Tokyo, Japan

24 Thursday, 13 December 2001

Room 1 9:20-10:20 A2-1: Modular Design

1. A Study on Design for Upgradable Products Considering Future Uncertainty Yoshimasa Umemori1, Shinsuke Kondoh1, Yasushi Umeda1, Yoshiki 2 3 1 2 A2-1/A2-2 Shimomura , Masaharu Yoshioka , Tokyo Metolopolitan Univ., The Univ. of Dec 13 Tokyo, 3National Inst. of Informatics, Japan

2. Management of Joint Information to Support Design Module Kazuhiro Aoyama1, Shyoji Takechi1, Mitsuhiro Iwamura2, 1The Univ. of Tokyo, 2NTT Data, Japan

3. Design of Product Modularity for Life Cycle Management Tomoyuki Hata, Satoru Kato, Fumihiko Kimura, The Univ. of Tokyo, Japan

10:40-12:00 A2-2:Industrial Design

1. Sustainability and Scenario Building: Scenarios of Sustainable Well-being and Sustainable Solutions Development (Keynote) Ezio Manzini, Politecnico di Milano, Italy

2. Ecodesign Integration in Concept Development Tracy A. Bhamra, Chris Sherwin, Vicky A. Lofthouse, Stephen Evans, Cranfield Univ., UK

3. Producing Eco-value for a Recycling-based Society by Industrial Design Fumikazu Masuda, Tokyo Zokei Univ., Japan

25 Room 2 9:20-10:40 A2-3: EcoDesign Case Studies (3)

1. Recyclability of Flame Retardant Plastics Raymond B. Dawson, Susan D. Landry, Marcia L. Hardy, Hiroaki Yamada, Albemarle, USA

2. A Study on Marketability of Environmentally Conscious Products Made of A2-3/A2-4

Dec 13 Long Life Material Pi-Ju Tsai, Shin’ya Nagasawa, Ritsumeikan Univ., Japan

3. Vehicle Recycling from a Designers Perspective Anne-Mrie E. Akermark, Royal Inst. of Technology, KTH, Sweden

4. A Study on Marketability of the Next Generation Community Vehicle (NCV21) Pi-Ju Tsai, Satoshi Kawae, Shin’ya Nagasawa, Ritsumeikan Univ., Japan

11:00-12:00 A2-4: EcoDesign Case Studies (4)

1. The Influence of Copper Smelters Requirements on Design Rules for Electronics Goran Malhammar, Christina Berglund, Ericsson Radio Systems, Sweden

2. Construction of Two 25M Tall Vertical Arrays with 2nd Generation Amorphous Silicon Photovoltaic Technologies King Hang Lam1, Edward Lo2, Josie Close1, 1The Univ. of Hong Kong, 2The Hong Kong Polytechnic Univ., China

3. Application of Ecodesign in Nonferrous Metal Industry in China Xueyi Guo1, Chuanfu Zhang2, Ryoichi Yamamoto1, 1The Univ. of Tokyo, Japan, 2Central South Univ., China

26 Room 3 9:40-10:40 C2-1: Inverse Process System Design (1)

1. Car Recycling and Producer Responsibility in Sweden (Invited) Nils Hernborg, The Association of Swedish Automobile Manufacturers and Wholesalers, Sweden

2. Configuration of Recycling Networks for Enhanced WEEE Recycling C2-1/C2-2

Juergen Hesselbach, Martin Ohlendorf, Christoph Herrmann, Technical Univ. of Dec 13 Braunschweig, Germany

3. Maturing Markets for Recycled Plastics from WEEE: An Elaboration on the Consequences for the Evaluation of Future End-of-Life Scenarios Casper Boks, Ab Stevels, Delft Univ. of Technology, The Netherlands

11:00-12:00 C2-2: Inverse Process System Design (2)

1. Study of Inverse Supply Chain (1) — Survey of Actual Inverse Supply Chain in Japan Susumu Shibata1, Hiroshi Uesugi2, Yasushi Wada3, Hiroya Terui4, Genichi Mitsuishi4, Makuni Inoko5, Hitoshi Fujiwara6, Shigehisa Endoh7, Kazuhito Haruki8, Shuuji Hoshino9, Yoshio Itoi10, Toshiyoshi Okazaki11, 1Toyo E n g i n e e r - ing, 2Kawasaki Steel, 3Yokogawa Electric, 4Komastu, 5NKK, 6Juki, 7National Inst. of Advanced Industrial Science and Technology, 8Toshiba, 9Ishikawajima-Harima Heavy Industries, 10Ricoh, 11FANUC, Japan

2. Study of Inverse Supply Chain (2) — Classification of Inverse Supply Chain and Characterization of Products Susumu Shibata1, Hiroshi Uesugi2, Hiroya Wada3, Hiroya Terui4, Genichi Mitsuishi5, Makuni Inoko6, Hitoshi Fujiwara7, Shigehisa Endoh8, Kazuhito Haruki9, Shuuji Hoshino10, Yoshio Itoi11, Toshiyoshi Okazaki12, Katsushige Matsunuma13, 1Toyo Engineering, 2Kawasaki Steel, 3Yokogawa Electric, 4Komastu, 5Japanese Material Handling Society, 6NKK, 7Juki, 8National Inst. of Advanced Industrial Science and Technology, 9Toshiba, 10Ishikawajima-Harima Heavy Industries, 11Ricoh, 12FUNUC, 13Sharp, Japan

27 Room 3

3. Study of Inverse Supply Chain (3) — Study of Promotion Issues on Inverse Supply Chain Yoshio Itoi1, Susumu Shibata2, Hiroshi Uesugi3, Yasushi Wada4, Hiroya Terui5, Genichi Mitsuishi6, Hitoshi Fujiwara7, Shigehisa Endoh8, Kazuhito Haruki9, Shuuji Hoshino10, Toshiyoshi Okazaki11, Katsushige Maysunuma12, 1Ricoh, 2Toyo Engineering, 3Kawasaki Steel, 4Yokogawa Electric, 5Komatsu, 6Japanese Material Handling Society, 7Juki, 8National Inst. of Advanced Industrial Science Dec 13 9 10 11 C2-2 and Technology, Toshiba, Ishikawajima-Harima Heavy Industries, FANUC, 12Sharp, Japan

28 Room 4 10:00-12:00 F2: Management System

1. “Environmental Impact Information System” That Reflects the Eco-Balance at Ricoh Kyoko Ohno, Yuji Noritake, Ricoh, Japan

2. Eco Product Lifecycle Management

Andreas Moeller, Arno Rolf, Univ. of Hamburg, Germany Dec 13

3. Eco-efficiency and Eco-Target Costing in the Phase of F2 Developing New Products Hiroshi Okano1, Karl-Heinz Feuerherd2, Michiyasu Nakajima3, 1Osaka City Univ., 2Kobe Yamate Univ., 3Kansai Univ., Japan

4. Becoming A Zero Waste to Landfill Facility in The USA Frantz J. Pierre, Jeff Agur, Bobbi Shingleton, Leon W. Fife, Carl Hall, Ricoh Electronics, USA

5. Cost Benefit Analysis for Implementation of Environmental Management System for Semiconductor Company Gunalan Paramasevam1, Mohd Nasir Hassan2, Noor Mohamed2, 1Infineon Technologies (M) Sdn Bhd, Malaysia, 2Univ. Putra Malaysia, Malaysia

6. Eco-management in Singapore — From Pollution Control to Resource Management Wah Sing Loh1, Seng Eng Ong2, Walter Yam3, 1PSB, 2Ministry of the Environment, 3Philips Electronics Singapore, Singapore

29 Room 5 9:40-12:00 Special Theme 1-2: Factor 10

1. A theoretical Estimation of Dematerialization Factor for Sustainable Society Ryoichi Yamamoto, The Univ. of Tokyo, Japan

2. Zero Energy Home Hirofumi Ida, Isamu Ohta, Misawa Homes Inst. of R&D, Japan Dec 13

ST1-2 3. Eco-efficiency of Sanitary Ware and Tiles Akashi Funamoto, TOTO, Japan

4. Classigication of Eco-effidcient Services in Japan Kouji Tagusari, Tomonori Honda, Ryoichi Yamamoto, The Univ. of Tokyo, Japan

5. Recycled Organic Material “M-Wood 2” Masayuki Kamite, Masayuki Kato, Misawa Home Inst. of R&D, Japan

6. Reducion and Elimination of Using Batteries for Watchies Yasuhito Hirashima, SEIKO EPSON, Japan

7. Efforts to Improve the Eco-efficiency for Products of Mitsubishi Electric Corporation-Factor X by Using MET Indicators Etsuko Hirose, Tetsuya Takahashi, Kiyoshi Ueno, Mitsubishi Electric, Japan

30 Room 6 9:20-10:40 Special Theme 4-2-1 (Invited Lectures): Industrial Ecology and EcoDesign (3)

1. Journey to a Sustainable World Bob Pfahl, Motorola, USA

2. Global Responsibility of Electronics — Products and Sustainability ST4-2-1/ST4-2-2

Hansjoerg Griese, Jutta Mueller, Herbert Reichl, Fraunhofer IZM, Germany Dec 13

3. Ecodesign for Competetive Advantage, How to Make It Happen Ab Stevels, Philips Consumer Electronics, The Netherlands

11:00-12:00 Special Theme 4-2-2 (Invited Lectures): Industrial Ecology and EcoDesign (4)

1. The Greening of Industry — A Term from the Past or for the Future Jurgen Ertel, Brandenburg Technical Univ., Germany

2. The Benefits of Ecodesign and the Risk of Rebound Effects Thomas Schauer, FAW, Germany

31 International Conference Room, 7F 13:00-17:00 EcoProducts 2001 Exhibition Symposium

For Reforming Japanese Economy on the Basis of Environmental Aspects — Vision to an Affluent Eco-Society

EcoProductSymposium 13:00-13:05 Welcome Hiroshi Sakisaka, Japan Environmental Management Association for Industry, Japan Dec 13 13:05-13:20 Environmental Efficiency as a Keyword Ryoichi Yamamoto, The Univ. of Tokyo, Japan

13:20-14:00 Environmental Technology Applicable to Reforming Economy — My Proposal Hisatake Kato, Tottori Univ. of Environmental Studies, Japan

14:00-14:45 The Application of Eco-Design — Ten Years of Dynamic Development A.L.N. Stevels, Delft Univ. of Technology, The Netherlands

15:00-17:00 Panel Discussions Coordinator: Hisatake Kato, Tottori Univ. of Environmental Studies, Japan Panellists: Yotaro Kobayashi, Fuji Xerox, Japan Kisho Kurokawa, Architect, Japan Noriko Kimoto (under negotiation)

* This session is complimentary to all applicants for EcoProducts 2001.

32 Friday, 14 December 2001

Room 1 9:20-10:20 A3-1: Life Cycle Design

1. Proposal for Spiral Design Approach Kazuhiko Yamazaki, IBM Japan, Japan

2. Decision Factors of Product LifeCycle Strategies Satoru Kato, Tomoyuki Hata, Fumihiko Kimura, The Univ. of Tokyo, Japan

3. Toward Life Cycle Design Guideline for Inverse Manufacturing Yasushi Umeda, Tokyo Metropolitan Univ., Japan

10:40-12:00 A3-2: EcoDesign Processes

1. Pros and Cons of Adjusting and Extending Functionality of A3-1/A3-2 First Generation End-of-Life Evaluation Tools in Relation to Dec 14 User Requirements Mirjam Korse-Noordhoek1, Sytze Kalisvaart1, Casper Boks2, Ab Stevels2, 1TNO Industrial Technology, 2Delft Univ. of Technology, The Netherlands

2. Life Cycle Process Knowledge — Application during Product Design Ola Bernard Faneye, Anderl Reiner, Technical Univ. of Darmstadt, Germany

3. Generalized Eco-Design Process and Guidelines for Designers/Design Teams Parag A. Meshram, Vineet Thuvara, Fifth Quadrant Design, India

4. System-based Product Design and System Structure Changeover under Integrated Optimality: A Case Study on Leading Design of Vehicles Kikuo Fujita, Shinji Shiba, Osaka Univ., Japan

33 Room 1 14:00-15:40 A3-3: EcoDesign Methods

1. Development of Product Green Innovation Design Method Chih-Chen Liu, Jahau L. Chen, National Cheng Kung Univ., Taiwan

2. Selection and Implementation — Key Activities to Successful Use of EcoDesign Methods Sofia Ritzén1, Mattias Lindahl2, 1Royal Inst. of Technology, 2Univ. of Kalmar, Sweden

3. Applicable Methods for Sustainable Development for Small and Middle-size Companies Udo Lindemann, Philipp C. Hutterer, Thomas Hessling, Markus Moertl, TUM, Lehrstuhl fuer Produktentwicklung, Germany

4. Development of Ecodesign Methodology within Indian European Ecodesign Program A3-3/A3-4 Dec 14 Ana Mestre1, G. V. Soumitri2, Johan Carel Diehl2, 1INTI, CINDES, Portugal, 2Indian Inst. of Technol. Delhi, India, 2Delft Univ. of Technol., The Netherlands

5. Method for Developing Sustainable Product Service Innovations Helma Luiten1, Sacha Sivester2, Marjolijn Knot2, 1TNO Industrial Technology, 2Delft Univ. of Technology, The Netherlands

16:00-17:20 A3-4: Design for X (1)

1. Design Idea of Wind Power Generator by Product Dissection Haruo Sakamoto1, Junichi Matsuoka1, Takashi Uchino1, Sachiko Migiwa1, Toshifumi Asai2, 1Kochi Univ. of Technology, 2ELF.Co, Japan

2. EcoDesign of Packaging for Cold Rolled Sheet — An Innovative Approach Vineet Thuvara, Parag M. Anand, V. Vinodhan, Fifth Quadrant, India

3. Development of an Environment-Friendly, Energy-Efficient Copier Kazunori Karasawa, Hisao Murayama, Yasuhisa Katoh, Masayuki Ohtani, Koichi Kanaya, Takako Satoh, Ricoh, Japan

34 Room 1

4. Study of the Degrees of Freedom Equations in the Compliant Mechanism Design Bartolo R. Rodriguez, Center of Pharmaceutical Chemistry, Cuba Dec 14 A3-4

35 Room 2 9:20-10:40 A3-5: EcoDesign Case Studies (5)

1. Design of Air Power Meter Maolin Cai, Toshiharu Kagawa, Tokyo Inst. of Technology, Japan

2. Valuation for Two Experimental Studies of the “Perfect Recycle House” Yuki Kanemori, Hiroto Takaguchi, Yusuke Nakajima, Waseda Univ., Japan

3. Pb-free Plating for Peripheral/Leadframe Packages Nhat D. Vo1, Jason M. Conrad1, Ryan R. Kangas1, Balachandar Sundram2, Kee- Huat Lee2, Selvakumar M. Arunasalam2, Tatsuo Matsuura3, Masahiro Tsuriya3, Yoshikuni Nakadaira3, 1Motorola, USA, 2Motorola Malaysia, Malaysia, 3Motorola Japan, Japan

4. Solar Powered Telecommunication Erik C. Palm1, Flemming Hed1, Yumiko Yasuda2, 1Ericsson Radio Systems, A3-5/A3-6 Dec 14 Sweden, 2Nippon Ericsson, Japan

11:00-12:00 A3-6: Integration of EcoDesign and CAD

1. The Development of a CAD Integrated DFE Workbench Software Tool Thomas Roche1, Elena Man2, Jimmie Browne2, 1GMIT, 2NUIG, Ireland

2. CAD Integrated DFE Workbench, A Case Study Thomas Roche1, Camelia Chira1, Elena Man2, Jimmie Browne2, 1GMIT, 2NUIG, Ireland

3. 3D Environmental Conscious Design System Yuichi Arita, Kazuyuki Ujiie, Akira Sakai, Tadanobu Matsumura, Haruhiko Yamamoto, Fujitsu, Japan

36 Room 2 14:00-15:20 A3-7: Information Sharing for EcoDesign (1)

1. Eco-KIT: Webbased Ecodesign-Innovation Tool for SMEs Bart Jansen, An Vercalsteren, Vito, Belgium

2. ECODESIGN Online: The New Internet Tool for Environmentally Conscious Product Design Wolfgang Wimmer, Vienna Univ. of Technology, Austria

3. Efficient LCI Data Exchange for Approximate LCA in Industry Karl G. Mueller, Fumihiko Kimura, The Univ. of Tokyo, Japan

4. A Framework for Structured Data Retrieval in LCA Using Feature Technology Harald E. Otto, Karl G. Mueller, Fumihiko Kimura, The Univ. of Tokyo, Japan

15:40-16:40 A3-7/A3-8 A3-8: Information Sharing for EcoDesign (2) Dec 14

1. The Information System: An Advisory Tool or How to Select the Right Support for DFE Marc Ernzer, Olaf Weger, Herbert Birkhofer, Darmstadt Univ. of Technology, Germany

2. Integration of Waste-Specific Expert-Knowledge in a Design Environment for Sustainable Products Maike Hora, Burkhard Wolf, Johannes Jager, Darmstadt Univ. of Technology, Germany

3. Developing Java-Based Web Apprication to Support Effective Recycling and Material Circulation Sang-Jae Song, Hiroshima Inst. of Technology, Japan

37 Room 3 9:20-10:20 C3-1: Reuse and Recycling (Strategies and Technologies) (3)

1. An Economical and Technical Analysis of a Household Appliance Remanufacturing Process Erik Sundin, Linkoping Univ., Sweden

2. LCI Analysis for Treatment Processes of Disposed Office Appliances Misao Murakami1, Masao Yukumoto1, Yasushi Umeda2, 1Kawasaki Steel, 2Tokyo Metropolitan Univ., Japan

3. Development of Recyclable Eco-Packages Tomoaki Arai, Ricoh, Japan

10:40-12:00 C3-2: Reuse and Recycling (Strategies and Technologies) (4)

1. Recycle of Cut Waste of Glass Fabric Coated by Polyvinyl Chloride C3-1/C3-2 Dec 14 Tetsuya Takahashi1, Teruo Kimura2, 1Shimane Univ., 2Kyoto Inst. of Technology, Japan

2. Compression Molding of Biodegradable Board Using Waste of Bedding Cotton Te r u o K i mu ra 1, Yasushi Naito1, Seiji Hatta2, 1Kyoto Inst. of Technology, 2Kyoto Municipal Textile Research Inst., Japan

3. Intelligent Disassembly of Electr(on)ic Equipment Reinhard Knoth, Martina Hoffmann, Bernd Kopacek, Peter Kopacek, Austrian Society for Systems Engineering and Automation, Austria

4. Separation of A Joint Using Hydrogen Naoe Hosoda, Tadatomo Suga, The Univ. of Tokyo, Japan

38 Room 3 14:00-15:20 C3-3: Reuse and Recycling (Strategies and Technologies) (5)

1. Electrostatic Separation Technology for Waste Plastics — Development of the High Purity Separator in Plastics by Type Hiroyuki Daiku, Tetsuya Inoue, Masanori Tsukahara, Hidehiko Maehara, Kenji Kakeda, Hitachi Zosen, Japan

2. Challenges to Sustainable Aqueous Systems: A Case Study in Metalworking Fluids Steven J. Skerlos, Peter Adriaens, Katsuo Kurabayashi, Shuichi Takayama, Kim Hayes, Alexa Rihana, Fu Zhao, The Univ. of Michigan at Ann Arbor, USA

3. Environmentally-friendly Treatment and Recycling of Industrial Wastes in the Nippon Mining & Metals Group Yasuhito Kawasaki1, Takahiko Okura2, 1Nippon Mining & Metals, 2Nikko Techno Service, Japan C3-3/E3-1 Dec 14 4. Chemical Wastewater Recycling System in Semiconductor Manufacturing Factory Masashi Nishimura, Kohichi Sugiyama, Ricoh, Japan

15:40-17:20 E3-1: Environmental Education

1. The Instructional Models and Guidelines for Developing A Curriculum in Product Eco-design Chen-fu Chen, Ming Chuan Univ., Taiwan

2. Ricoh Programs for Contributing to Betterment of the Environment and Society Megumi Kawahara, Ricoh, Japan

3. Integrating Environmental Science into Modern Engineering Education Gunther Seliger, Matthias P. Meyer, Technical Univ. Berlin, Germany

4. Internet Based Ecodesign Education Johan Carel Diehl, Delft Univ. of Technology, The Netherlands

39 Room 3

5. The Development of Ecodesign Courses for Industrial Design Students and Professionals in India G.V. Soumitri1, Jan Carel Diehl2, Ana Mestre3, 1Indian Inst. of Technology Delhi, India, 2Delft Univ. of Technology, The Netherlands, 3INETI, CINDES, Portugal Dec 14 E3-1

40 Room 4 9:20-11:00 B3-1: Long Fatigue Life (Giga-cycle) of Materials (1)

1. Optimaization of Marerial Selection and Design for Car Industry in order to Increase Durability (Keynote) Clause Bathias, CNAM, France

2. Cyclic Damage of Some High Strength Alloys Showing Subsurface Crack Generation in High-cycle Fatigue Osamu Umezawa, National Inst. for Materials Science, Japan

3. Characteristic S-N Property of High Strength Steels in Ultra-Wide Life Regime under Rotating Bending Tatsuo Sakai1, Nobuaki Tanaka1, Mitsuhiro Takeda2, Manabu Kanemitsu3, Noriyasu Oguma4, 1Ritsumeikan Univ., 2Toray Industries, 3Kanazawa Technol. Coll., 4Koyo Seiko, Japan B3-1/B3-2 4. Expansion of the Database MSDRD and Analyses of S-N Fatigue Test Data Dec 14 in Ultra-Long Life Regime Tatsuo Sakai1, Tomofumi Shintani1, Kenji Okada2, Satoshi Fukui2, Takafumi Sogawa2, Noriyasu Oguma3, 1Ritsumeikan Univ., 2Takamatsu National Coll. of Te c h n o l o gy, 3Koyo Seiko, Japan

11:20-12:40 B3-2: Long Fatigue Life (Giga-cycle) of Materials (2)

1. Fracture Surface Analysis of Bearing Steels with Long Fatigue Life Naotake Ohtsuka1, Yasunori Shindo1, Wataru Kimura2, 1Ryukoku Univ., 2Takasono Industries, Japan

2. Giga-cycle Fatigue Properties of a High Strength Steel SNCM 439 Yuji Nakasone, Katsuhisa Ogawa, Jun’ichi Katoh, The Science Univ. of Tokyo, Japan

3. Effects of Shotpeening Treatment on Very Long Life Fatigue Property in Ductile Cast Irons Yasuo Ochi1, Takusaburo Hosoya1, Kiyotaka Masaki1, Takashi Matsumura1, Ta ke s h i S e k i n o 2, 1Univ. of Electro-Communications, 2Cannon, Japan

41 Room 4

4. On Evaluation Method of the Data for Long Life Fatigue Property Satoshi Hanaki1, Masaru Zako2, Tesei Kurasiki2, Hitoshi Uchida1, 1Himeji Inst. of Te c h n o l o gy, 2Osaka Univ., Japan

13:40-15:20 D3-1: Environmental Conscious Market and Corporate Strategies

1. Sufficiency Strategies for A Sustainable and Competitive Economy: Reversed and Inversed Incentives Warter R. Stahel, Product-Life Inst., Switzerland

2. Green Marketing of Consumer Electronics II Ab Stevels, Richard Agena, Eelco Hoedemaker, Delft Univ. of Technology, The Netherlands

3. An Application of the Market Microstructure Theory to Markets for Recyclable Products D3-1/D3-2 Dec 14 Kouhei Iyori1, Itsuo Hatono1, Sobei Oda2, Ueda1, 1Kobe Univ., 2Kyoto Sangyo Univ., Japan

4. Consideration of the Definition of Zero State on a Scale of Positive and Negative Evaluation Koji Masuda, Fuji Xerox, Japan

5. Corporate Environmental Strategies in Poland Michal Szymanski1, Saburo Ikeda2, 1The Univ. of Tsukuba, 2Inst. of Policy and Planning Sciences, Japan

15:40-17:20 D3-2: Servicification for Dematerialization

1. Dematerialization through Service and Business Innovation: Lessons from the Kathalys/DES Experiments (Keynote) Han Brezet, Sacha Silvester, Tom van der Horst, Delft Univ. of Technology, The Netherlands

2. Service Engineering to Intensify Serivice Contents in Product Life Cycles Tetsuo Tomiyama, The Univ. of Tokyo, Japan

3. Eco-efficient Services as a Business Strategy for Dematerialization Thierry Kazazian, Julia Haake, 02 France, France

42 Room 4

4. Functional Sales as a Further Approach to Environmental Product Development — Case Studies Gunilla Olundh, Sofia Ritzèn, Royal Inst. of Technology(Stockholm), Sweden Dec 14 D3-2

43 Room 5 9:20-10:40 E3-2: Environmental Accounting

1. Eco-Efficiency Accounting of Telecom Product Life Cycle Pontus Cerin1, Goan Muhammar2, 1Royal Inst. of Technology, 2Ericsson Radio Systems, Sweden

2. A Pilot Project of Flow Cost Accounting in Japan Yoshikuni Furukawa, Nitto Denko, Japan

3. Environmental Accounting at Ricoh Hiroshi Uramoto, Hiromitsu Hatano, Ricoh, Japan

4. Environmental Accounting of Product Design Hidemi Tomita, Sony, Japan

11:00-12:20 F3-1: LCA (1) E3-2/F3-1 Dec 14

1. A Simple Life Cycle Assessment Method for Green Product Conceptual Design Jahau L. Chen, Chih-Wei Liau, National Cheng kung Univ., Taiwan

2. Life Cycle Assessment of Business Hiroyuki Abe, Ricoh, Japan

3. Environmental Impact Assessment for Various Information Technology Systems and Classification by Their Environmental Aspects Shigeyuki Miyamoto, Hiroo Harada, Jun Fujimoto, NEC, Japan

4. A Study on Comparison of Life Cycle Energy Consumption and CO2 Emission in Grains Production; Transportation in Japan and Heilongjiang Province of China Jie Chen1, Hisashi Kobayashi2, 1Tokyo Univ. of Agriculture and Technology, 2Ibaraki Univ., Japan

44 Room 5 14:00-16:00 F3-2: LCA (2)

1. Development of Hybrid Micro Machine Tool Tsuneo Kurita1, Shinya Watanabe2, Mitsuro Hattori3, 1Japan Science and Tech- nology, 2Disco, 3National Inst. of Advanced Industrial Science and Technology, Japan

2. Industrial Ecology: Theory and Environmental Strategy in Viet Nam Le H. Ba1, Duong V. Viet2, Tran T. Hong, Loan3, Thai V. Nam4, 1National Univ., 2Univ. of Technology, 3Univ. of National Sciences, 4Ansted Univ., Viet Nam

3. Development of a Risk Assessment Method for Product Disposal in Landfills Eiji Hirao, Shigeyuki Miyamoto, NEC, Japan

4. Waste Input-Output Analysis of Disposal, Recycling, and Reuse of Electric Home Appliances Dec 14 Shinichiro Nakamura1, Yasushi Kondo2, 1Waseda Univ., 2Toyama Univ, Japan F3-2

5. The Development of the Environmental Efficiency Potential Assessment Katsuya Nagata1, Masahito Aizawa2, Ken Asaoka2, Chikako Usami2, 1Waseda Univ., 2Mikuniya Environmental Management Systems Inst. Inc., Japan

6. Development of Endpoint-Type Methodology of LCIA in Japan Norihiro Itsubo, Atsushi Inaba, National Inst. of Advanced Industrial Science and Technology, Japan

45 Room 6 9:20-12:00 Special Theme 6-3: Research Trends in Lead-free Soldering

1. Lead-free Industry Trends in the European Market and the Need for Global Co-operation (Keynote) Kay Nimmo, ITRI, UK

2. EUREKA Project LEADFREE Guenter F. Grossmann, Swiss Federal Inst. for Materials Testing and Research, Switzerland

3. Development of Environmentally Preferred Plastic Ball Grid Array, PBGA, Components Yushi Matsuda1, Alan Woosley2, Thomas Koschmieder2, G.K. Teh3, Ruzaini Ibrahim3, 1Motorola Japan, Japan, 2Motorola, USA, 3Motorola Malaysia, Malaysia

Dec 14 4. Estimation of CO2 Emission for Lead-free Soldering by ST6-3 Life Cycle Inventory Analysis Hiroshi Yamaguchi1, Atsushi Inaba2, 1Hitachi, 2National Inst. of Advanced Indus- trial Science and Technology, Japan

5. Lead-free Soldering — Future Aspects of Toxicity, Energy and Resource Consumption Otmar K. Deubzer1, Hansjoerg Griese1, Herbert Reichl1, 2, Tadatomo Suga3, Hideyuki Hamano3,1Fraunhofer IZM Berlin, 2Technical Univ. Berlin, Germany, 3The Univ. of Tokyo, Japan

6. Lead-free Soldering Trends in USA (Keynote) Carol Handwerker, NIST, USA

46 Room 6 13:00-15:00 Special Theme 11-3: IMS Project on Lead-free Soldering EFSOT

1. Outline of IMS Project “Next Generation Environmental Friendly Soldering Technology” Kouji Serizawa, Hitachi, Japan

2. Upgrading Pb-free Soldering Technology (1) — Reflow Soldering Koji Matsubara1, Katsuaki Suganuma2, Tomoya Kiga3, 1Sharp, 2Osaka Univ., 3Sony, Japan

3. Upgrading Pb-free Soldering Technology (2) — Flow Soldering Makoto Miyazaki1, Shigeo Nomura1, Toshiyasu Takei1, Naoaki Katsuyama2, Hiroyuki Tanaka2, Masanobu Akanuma2, 1Oki Electric, 2Hokkaido Industrial Research Inst., Japan

4. Upgrading Pb-free Soldering Technology (3) — Reliability Evaluation ST11-3/ST10-3 Masahide Okamoto1, Hanae Shimokawa1, Koji Serizawa1, Toshio Narita2, Dec 14 1Hitachi, 2Hokkaido Univ., Japan

5. Evaluation of Biological Effects of Metals in Pb-free Solders Hiroshi Satoh1, Kazuyuki Omae2, Momoko Chiba3, Masahide Okamoto4, 1Tohoku Univ., 2Keio Univ. 3Juntendo Univ., 4Hitachi, Japan

6. Environmental Impact Evaluation for the Full Life Cycle of Products Using Pb-free Solders Tadatomo Suga1, Hideyuki Hamano1, Masahide Okamoto2, 1The Univ. of Tokyo, 2Hitachi, Japan

15:20-17:20 Special Theme 10-3: Low-temperature Lead-free Solder

1. Lead Free Activities of JEITA Katsumi Yamamoto, Sony, Japan

2. JIEP Project fow Low-temperature Lead-free Solder and Its Report on Questionaire Survey Tadatomo Suga, The Univ. of Tokyo, Japan

47 Room 6

3. Sn-Zn Eutectic Alloy Soldering in a Low Oxygen Atmosphere Masahiro Tadauchi, Izuru Komatsu, Hiroshi Tateishi, Kouichi Teshima, To s h i b a , Japan

4. CSP Mounting Reliability with Sn-Zn-Bi in JIEP Project Makoto Takeuchi, Victor Co. of Japan, Japan

5. Newly Developed Real Time Monitoring System for lonic Migration of Lead Free Solder by Means of Crystal Microbalance Sachio Yoshihara, Utsunomiya Univ., Japan

6. Applications of Sn-Zn Lead-free Solder in Reflow Soldering Process Eiichi Kouno, NEC, Japan Dec 14 ST10-3

48 Saturday, 15 December 2001

Room 1 11:00-12:20 A4-1: Design for X (2)

1. Life Design for Remanufacturing Durable Products Susumu Okumura1, Toshimitsu Morikuni2, Norio Okino1, 1Univ. of Shiga Prefecture, Japan, 2NEC Machinery, Japan

2. On the Benefits of Use of Recently Developed Recovery Indicators during the Design Process of Electr(on)ic Products Fabrice Mathieux1, Daniel Froelich1, Pierre Moszkowicz2, 1ENSAM Chambery, France, 2INSA Lyon, France

3. Treatment of Reliability for Reuse and Remanufacture Takeshi Murayama1, Lily H. Shu 2, 1Hiroshima Univ., Japan, 2Univ. of Toronto, Canada

4. EcoDesign for Product Variety: A Multi-Objective Optimization Framework Suiran Yu, Satoru Kato, Fumihiko Kimura, The Univ. of Tokyo, Japan

13:20-15:20 A4-2: Tools for DfX

1. Development of Life Cycle Design System for Machine Tools Tojiro Aoyama, Shoji Nawata, Keio Univ., Japan A4-1/A4-2 Dec 15 Dec 2. Development of Recyclability Evaluation Tool Naohiko Oyasato, Hideki Kobayashi, Kazuhito Haruki, Toshiba, Japan

3. Recycling Oriented Design — A Case Study for Household Appliances Using the Software ATROiD Hong-Yoon Kang1, Christoph Herrmann2, Jang-Woo Jung1, 1LG Production Engineering Research Center, Korea, 2LCE Consulting, Germany

4. Design for Environment and the Recyclability Evaluation Method (REM) Yuzo Hiroshige, Takayuki Nishi, Toshijiro Ohashi, Hitachi, Japan

49 Room 1

5. Approximate Life Cycle Assessment for Classified Products Using Artificial Neural Network and Statistical Analysis in Conceptual Product Design Ji-Hyung Park1, Kwang-Kyu Seo1, David R. Wallace 2, 1Korea Inst. of Science and Technology, Korea, 2MIT, USA

6. DfE Tools — A Way for Application of LCA in Product Design Michael Betz, Hartmut Schoech, Harald Florin, PE Product Engineering, Germany Dec 15 Dec A4-2

50 Room 2 10:00-11:00 B4-1: Maintenance

1. A System Framework for Next-Generation E-Maintenance System Muammer Koc, Jay Lee, Univ. of Wisconsin-Milwaukee, USA

2. Life Cycle Management of Inductrial Robots Based on Deterioration Evaluation Atsushi Yamada, Shozo Takata, Waseda Univ., Japan

3. Decision-making Method of Optimum Inspection Interval for Plant Maintenance by Genetic Algorithms Masanori Yamamoto1, Peng Chen1, Toshio Toyota2, 1Kyusyu Inst. of Technology, 2Japan Condition Diagnosis Technology Lab., Japan

11:20-12:40 A4-3: LCA Case Studies

1. LCA of Third Generation (3G) Wireless Telecom Systems at Ericsson Jens Malmodin, Pernilla Bergmark, Royal Inst. of Technology, Sweden

2. Generic LCA Based DfE — A Case Study of Different PWB Systems Constantin Herrmann1, Michael Betz2, Niels Warburg1, 1Univ. of Stuttgart, 2PE Product Engineering, Germany

3. Ecological Improvement of the Vending Machine Using LCA Method

1 2 2 2 1 B4-1/A4-3 Yukio Ki mura , Seizo Kato , Naoki Maruyama , Yucho Sadamichi , Fuji Electric, 15 Dec 2Mie Univ., Japan

4. LCA of Machine Tools with Regard to Their Secondary Effects on Quality of Machined Parts Javad Akbari, Keigo Oyamada, Yoshio Saito, Tokyo Inst. of Technology, Japan

51 Room 2 13:40-15:20 A4-4: Design for Disassembly

1. Product’s Disassemblability Evaluation Using Information Entropy Hideo Fujimoto, Alauddin Ahmed, Kazuaki Sugi, Nagoya Inst. of Technology, Japan

2. Design of Heat-activated Reversible Integral Attachments for Product-embedded Disassembly Ying Li, Kazuhiro Saitou, Noboru Kikuchi, Steven J. Skerlos, Panos Y. Papalambros, The Univ. of Michigan, USA

3. A Design for Recycling Technique for Optimizing Resource Circulation Characteristics of Products Yasuo Kondo, Ko-suke Hirai, Fumio Obata, Tottori Univ., Japan

4. Development of Disassembly Support System for Mechanical Parts and Its Application to Design Considering Reuse/Recycle Hidefumi Wakamatsu, Akira Tsumaya, Keiichi Shirase, Eiji Arai, Osaka Univ., Japan

5. Design for Reuse and Disassembly Martina Hoffmann, Reinhard Knoth, Bernd Kopacek, Peter Kopacek, Austrian Society for Systems Engineering and Automation, Austria Dec 15 Dec A4-4

52 Room 3 9:40-10:40 E4-1: Social System Design (1)

1. Analyzing Sustainability of Circulatory System by Using the Rewriting System Kotaro Kakimoto, Takayuki Shiose, Toshiharu Taura, Kobe Univ., Japan

2. Indirect Control Methods for Navigating the Agent-based Recycle Society Takayuki Shiose, Kouji Yokoyama, Toshiharu Taura, Kobe Univ., Japan

3. From a Factory to a Person: One Approach for Sustainable and Service-oriented Manufacturing Scheme Masahiko Onosato1, Nydia Suppen1, Koji Teramoto1, Kazuaki Iwata2, 1Osaka Univ., 2International Inst. of Advanced Studies, Japan

11:00-12:40 E4-2: Social System Design (2)

1. Integrated Product Policy (IPP), Eco-Design and Supply Chains (Keynote) Martin Charter, The Centre for Sustainable Design, UK

2. Design and Evaluation of the Recycle of Home Appliances: An Application of Market Microstructure Theory Kanji Ueda1, Nariaki Nishino1, Atsushi Iwasaki1, Sobei H. Oda2, Itsuo Hatono1, 1Kobe Univ., 2Kyoto Sangyo Univ., Japan E4-1/E4-2 3. Demonstration of a Nature Symbiotic Office Designed for 100Years Use 15 Dec Masanobu Nagano, Soai Co., Japan

4. Greener Mobil Telecommunication Networks: The 3G Greenbook Initiative Klause Rick, T-Mobil Deutsche Telekom, Germany

53 Room 3 14:00-15:20 B4-2: Cleaner Processes and Energy-Saving Proccesses

1. Development of Drying Technology Utilizing Solar Energy to Dry Agricultural and Marine Products Hedetoshi Aoki, Hachinohe Inst. of Technology, Japan

2. On Process Planning with Multiple Agents: Environmentally Conscious Decisions among Feasible Process Plans Beth E. Allen, Univ. of Minnesota, USA

3. 100% Ozone-treatment System for Bath and Swimming Pool Water Reiji Terao1, Kazunori Mori1, Masaki Matsui2, 1TERAO, 2Gifu Univ., Japan

4. Energy Saving Cleaner Technology for Conversion of Waste Pickle Liquor and Millscale Parthasarathy M. Natteri1, Sudharsan M. Natteri2, 1SALN Coll. of Engineering & Management, 2ETK International Ferrites, India Dec 15 Dec B4-2

54 Room 4 9:40-10:40 E4-3: Labelling and Logistics

1. Trial of Product Environmental Information System — Canon Case (Type III Eco-Label, JEMAI Program Ver.2) Kiyofumi Matsumoto, Norihiro Mochizuki, Keizo Naganuma, Masaaki Oono, Canon, Japan

2. Re-Use of End-of-Life Electronic Equipment and Components — Logistic Aspects Reinhard Knoth, Martina Hoffmann, Bernd Kopacek, Peter Kopacek, Austrian Society for Systems Engineering and Automation, Austria

3. Formation of a Reverse Logistic System for a Circulated Type Construction Production System Hiroyuki Nakamura1, Jun Shiino2, Makoto Taneda3, 1Shimizu, 2Waseda Univ., 3Toda, Japan

11:00-12:40 Special Theme 9-4-1: Advanced Technology for Electronic Packaging — JIEP Session (1)

1. JIEP-EcoDesign for Tomorrow (Keynote) Hidetaka Hayashi, Fujikura, Japan

2. Conductive Adhesive for Plated Sn Electrode Michinori Komagata, Namics, Japan E4-3/ST9-4-1 Dec 15 Dec

3. Development of Environmentally Friendly Epoxy Resin Compounds without Toxic Flame Retardants and Their Application to Electronic Parts Yukihiro Kiuchi, Masatoshi Iji, NEC, Japan

4. Trend of Halogen Free Printed Wiring Board Materials Tetsuaki Suzuki, Toshiba Chemical, Japan

55 Room 4 13:40-15:20 Special Theme 9-4-2:Advanced Technology for Electronic Packaging — JIEP Session (2)

1. Development of Formaldehyde Free Electroless Copper Plating Technology Takeyuki Itabashi1, Hiroshi Kanemoto1, Haruo Akahoshi1, Tadashi Iida2, Eiji Takai1, Naoki Nishimura1, Jyunichi Kawasaki1, 1Hitachi, 2Hitachi Printed Wiring Board Solutions Co., Japan

2. Low Distortion Cold Rolled Clad Sheets for Mounting Material Shinji Ozawa, Kazuo Yosida, Hiroaki Okamoto, Kinji Saijo, Toyo Kohan, Japan

3. High Sensitive Dry Film Photoresist for Laser Direct Imaging System Teruhiro Uematsu, Tokyo Ohka Kogyo, Japan

4. Halogen-free High Elastic Moduls Build-up Material Nobuyuki Ogawa, Hitachi Chemical, Japan

5. Ball Semiconductor Process and Material Masataka Yoshida, Masataka Yoshida Ball Semiconductor, Japan Dec 15 Dec ST9-4-2

56 Room 5 9:20-11:00 Special Theme 8-4-1: EcoDesign and Chemical Engineering (1)

1. Eco-Design of Water Purification Equipment for Domestic Use Kensaku Mizoguchi1, Hideya Kamikawa2, 1Shizuoka Univ., 2Yamaha Motor, Japan

2. Filtration Behaviors in Microfiltration with Periodic Backwashing of Secondary Municipal Wastewater Than Ohn1, M. S. Jami 2, Y. Mukai2, E. Iritani2, 1Aichi Science and Technology Foundation, 2Nagoya Univ., Japan

3. Life Cycle Inventory Analysis of Waste Oil Chie Nakaniwa1, Yoshie Yagita2, Atsushi Inaba3, 1Yale Univ., USA, 2Ochanomizu Univ., 3National Inst. of Advanced Industrial Science and Technology, Japan

4. Development of a Life Cycle Inventory Database for Chemical Products Kiyotaka Tahara, Atsushi Inaba, National Inst. of Advanced Industrial Science and Technology, Japan

5. A Method to Evaluate Regional Material Flow for Designing Recycling Society Naohiro Goto1, Koichi Fujie1, Tomotaka Usui2, 1Toyohashi Univ. of Technology, 2Aichi Science and Technology Foundation, Japan ST8-4-1/ST8-4-2

11:20-12:40 15 Dec Special Theme 8-4-2: EcoDesign and Chemical Engineering (2)

1. Decomposition Mechanism of Epoxy Resin in Nitric Acid for Recycling Weirong Dang, Kosuke Yamaki, Hideki Sembokuya, Masatoshi Kubouchi, Ken Tsuda, Tokyo Inst. of Technology, Japan

2. Plastic Recycling with Supercritical Fluids Izumi Okajima, Takeshi Sako, Shizuoka Univ., Japan

3. For Building a Recycling-oriented Economic Society Originating in Chubu (Central Japan) (Keynote) Yoshihiro Yasui, Environmental Partnership Organizing Club, Japan

57 Room 5 13:20-15:20 Special Theme 8-4-3: EcoDesign and Chemical Engineering (3)

1. A New Program for Integrated Recycle System of Chemical Products Kensaku Mizoguchi1, Youji Akiya2, Toshiaki Ito3, Junjiro Kawasaki4, Minoru Nomura5, Yoshiyuki Hashiguchi6, Yasushi Hirata7, Kiyomi Imou6, Akira Kanai5, Masahito Sato2, Shigeru Matsumoto8, Ken Kataoka9, 1Shizuoka Univ., 2AIST, 3Mitsubishi Heavy Ind., 4Tokyo Inst. of Technology, 5JCII, 6KANEKA, 7Bridgestone, 8Tohoku Univ., 9Daceil Chem. Ind., Japan

2. Information Infrastractue for Supporting Recycling Systems Design and Operation Yuji Naka1, Atsushi Aoyama1, Katsuyoshi Kameda2, Takashi Kagiyama2, Kazu- hisa Hamda2, 1Tokyo Inst. of Technology, 2Japan Chemical Innovation Inst., Japan

3. Gasification of Organic Waste Materials (OWM) for Power Generation Using Fuel Cell Michihiko Hamai1, Motohiro Kondo1, Masataka Yamaguchi1, Shigekatsu Mori2, Yoshinori Itaya2, Guilin Piao3, 1Toyota Motor, 2Nagoya Univ., 3Aichi Science & Technology Foundation, Japan

4. Double-coated Tape for Recycle Application Koichi Ikeda, Kazuhiko Shibata, Nitto Denko, Japan Dec 15 Dec

ST8-4-3 5. Considerations of Process Flexibility in Design and Optimisation of Chemical Processes for Simultaneous Satisfaction of Economic and Environmental Objectives (Keynote) Jim Petrie, Univ. of Sydney, Australia

58 Room 6 10:00-11:20 Special Theme 2-4-1: Promotion of DFE (1)

1. Clarifying the Environmental Voice of the Customer Using the Kano Technique (Keynote) Patrick Eagan, Mark Finster, Dennis Hussey, Univ. of Wisconsin-Madison, USA

2. An Outline of Activities by the Committee of Desgin for Environment (DfE), Japan, 1994-2001 Shinzo Omi1, Mamoru Morimoto2, Shigeru Suda2, 1Tokyo Univ. of Agriculture and Technology, 2Japan Environmental Management Association for Industry, Japan

3. Quality Function Deployment for Environment: QFDE (1st Report) — A Methodology in Early Stage of DfE Keijiro Masui1, Tomohiko Sakao2, Atsushi Inaba1, 1National Inst. of Advanced Industrial Science and Technology, 2Mitsubishi Research Inst., Japan

11:40-12:40 Special Theme 2-4-2: Promotion of DFE (2)

1. Quality Function Deployment for Environment: QFDE (2nd Report) — Verifying the Applicability by Two Case Studies Tomohiko Sakao1, Keijiro Masui2, Mitsuru Kobayashi3, Seiichi Aizawa4, Atsushi 2 1 2 Inaba , Mitsubishi Research Inst., National Inst. of Advanced Industrial ST2-4-1/ST2-4-2 3 4

Science and Technology, Shinko Electric, Iiyama, Japan 15 Dec

2. Environmental Effect Analysis — How Does the Method Stand in Relation to Lessons Learned from the Use of Other Design for Environment Methods Mattias Lindahl, Univ. of Kalmar, Sweden

3. Developments in Product Oriented Environmental Management Systems (POEMS) and ISO 14062 Cristina Rocha1, Parag Anand2, Sacha Silvester3, 1INETI, CINDES, Portugal, 2Fifth Quadrant, India, 3Delft Univ. of Technology, The Netherlands

59 Room 6 13:40-15:20 Special Theme 5-4: Recycling of Individual Products (Current and Future)

1. Towards Inverse Production Life Cycle: A Simulation Tool Linking Mass Products to Environmental Legislation and Market Fabio Salsa1, Lorenzo Castelli2, Roberto Bosani1, Francesco Jovane1, 1National Research Council, 2Univ. of Trieste, Italy

2. The QWERTY Concept, a Powerful Method for Evaluating the Environmental Consequences of End-of-Life Processing of Consumer Electronic Products Jaco Huisman, Ab Stevels, Delft Univ. of Technology, The Netherlands

3. Some Obervations on Recycling of Electrical Home Appliances Activities in Taiwan Jahau L. Chen, National Cheng Kung Univ., Taiwan

4. The Regulation Plan of Disposal Goods and Articles in South Korea Kentoku Funaki, Funaki Enviromental Economics & Policy Research Inst., Japan

5. Waste Utilization by Melting and Crystallization Technology Takumi Kaneko, Tsukishima Kikai, Japan

ST5-4/Plenary III/Closing International Conference Room, 7F

Dec 15 Dec 15:40-16:30 Plenary III

Designing ‘Sustainable’ Product/Service Systems John Ehrenfeld, Massachusetts Inst. of Technology, USA

16:30-16:45 Best Paper & Best Poster Awards

16:45-17:15 Closing Lecture Comprehensive Product Modeling for Designing Life Cycle Scenario Fumihiko Kimura, Organizing Committee Co-Chair/The Univ. of Tokyo, Japan

17:15-17:30 Closing Words Diana Bendz, Organizing Committee Co-Chair/IEEE CS TCEE/IBM, USA

60 Poster Session Display: 9:20-17:00, 14 December 2001 9:20-13:20, 15 December 2001 Discussion: 12:00-14:00, 14 December 2001

P1. Green Marketing of Automobile Engine Air-Filter Element Using LCA Study Myung-Hwi Kang1, Han-Kyoung Lee1, Nam-Woong Lee2, 1Eco-Frontier, 2KOAIR, South Korea

P2. The Impact of Literature References in the Field of Applied Ecodesign Casper Boks, Ab Stevels, Jurgen Koster, Delft Univ. of Technology, The Netherlands

P3. Research Regarding the Environment-friendly Slope Protection Frame That Utilized the Felled Tree Kenji Nakamura, Shimizu, Japan

P4. Current Status of Phosphoric Acid Fuel Cell Power Plant Toshiyuki Ito, Tokyo Gas, Japan

P5. Incorporating Environmentally Conscious Materials Selection in CAD System Narito Shibaike, Matsushita Electric, Japan

P6. Design Process to Achieve Easy Assembly and Disassembly Yasuyuki Yamagiwa1, Shuichi Iwata2, Jun Numata3, Yuko Namiki3, 1Sony, 2The Univ. of Tokyo, 3Musashi Inst. of Technology, Japan

P7. Eco-Value as an Indicator for Sustainable Design Fumikazu Masuda, Satsuki Kashima, Naoki Iijima, Kengo Kato, Rei Sekine, Kenji Yamato, Satoko Watanabe, Risa Usami, Katsura Emukai, Tomohisa Kato, Tsuneya Kocho, Tomoya Sasaki, Takuya Sato, Mie Suzuki, Masashi Seo,Tokyo Zokei Univ., Japan Poster Session P8. Charcoal Board Adhered with Superfine Natural Fibers Kazunori Shibano1, Shuji Yoshizawa2, Yuu Ogawa1, 1Tokyu Construction, 2Meisei Univ., Japan

61 P9. Thermal Recycling of Used Vegetable Oil in an University Campus HaruHisa Uchida1, Tokiko Morikawa1, Hiroaki Iwasaki2, Shigeru Ohga2, 1Tokai Univ., 2Yamaichi New Technology, Japan

P10. Solubility of Glass-Epoxy laminate of Various Sizes in Solution Takeshi Horiuchi, Katsuji Shibata, Hiroshi Shimizu, Hitachi Chemical, Japan

P11. The Research into the Method of Developing Efficient Universal Design in Traffic Environment through the Application of Contingent Valuation Method Toshiki Nishiyama, Ken’ichi Gomyo, Makoto Arisawa, Keio Univ., Japan

P12. Environmental Impact of Energy Distribution Using Hydrogen HaruHisa Uchida, Shinya Kato, Asami Komatsu, Mikio Suga, Tokai Univ., Japan

P13. Frist Contract under Green Power Certifrication System Takeshi Shouda, Yamanaka Yasushi, Daisuke Makino, Junji Omura, Japan Nat- ural Energy, Japan

P14. Suppression of Dross Formation in Lead-free Wave Soldering Ta d a s h i Ta ke m o t o 1, Yeon Jun Joo1, Shohei Mawatari2, Rikiya Kato2, 1Osaka Univ., 2Senju Metal Industry, Japan

P15. Microscopic Observation of Pb-free Solder Joint Interface Yasushi Kadota1, Sunao Miyatake1, Tsutomu Sakatsu1, Hideo Watanabe1, Masaru Yamashita2, Ryuji Kanehara2, 1Ricoh, 2ITES, Japan

P16. Future Outlook of Eco-Design in China Tadatomo Suga, Toshihiko Itou, Naoe Hosoda, Zhaohui Qiang, The Univ. of Tokyo, Japan Poster Session

62 GENERAL INFORMATION

Registration Early Registration is recommended (Deadline: 21 November 2001). Please choose and fill in the attached Registration Form Type A (For All Sessions) or Type B (For All Technical Sessions), and mail or fax to the EcoDesign 2001 Secretar- iat with the payment. After the payment is confirmed, the registrant will receive a payment receipt and a ticket for conference kit by mail, which will be exchanged for a conference kit on site.

Payment Please choose one from the following methods. Unfortunately, no personal check is acceptable. Do not remit the fee before sending the registration form.

• Bank Check Payable to the EcoDesign 2001 in Japanese Yen • Bank Transfer to: Bank Name: Daiichi Kangyo Bank, Hongo Branch, Tokyo Account No.: 2396620 Account No.: ECODESIGN 2001 * Please attach a copy of the bank transfer receipt with the registration form. • Credit Cards: American Express, VISA, Master, or Diners * Master card issued in Japan is limited to UC only. Registration Fees Registration Fee: For All Sessions (Type A) Early Registration Late and On site (before 21 Nov. 2001) (after 21 Nov. 2001) Conference Member* ¥53,000 ¥58,000 * Co-Sponsors, IEEE, and CARE Electronics members Non-member ¥58,000 ¥63,000 Student (Intercommunion ¥5,000 ¥10,000 Session excluded) Intercommunion Session (For student or an accompany) ¥8,000 ¥10,000 Tutorial ¥10,000 ¥10,000 Technical Tour ¥6,000

Conference registration fees include conference attendance, a copy of Proceed- ings, Intercommunion Session, and Welcome Reception. Tutorial fee is optional.

63 Registration Fee: For All Technical Sessions (Type B) Early Registration Late and On site (before 21 Nov. 2001) (after 21 Nov. 2001) Conference Member* ¥45,000 ¥50,000 * Co-Sponsors, IEEE, and CARE Electronics members Non-member ¥50,000 ¥55,000 Student ¥ 5,000 ¥10,000 Intercommunion Session ¥ 8,000 ¥10,000 Tutorial ¥10,000 ¥10,000 Technical Tour ¥6,000

Conference registration fees include conference attendance, a copy of Proceed- ings, Welcome Reception. Intercommunion Session fee and Tutorial fee are optional.

Cancellation of Registration and Refund Cancellation with refund will be accepted before 30 November 2001. However, written notification is required and there will be a cancellation fee: ¥5,000. No refund for cancellation received after 30 November 2001 or no notice given. Refund will be made after deducting the cancellation fee and bank or credit card ser- vice charges. If the payment is made by credit card, refund will be made through the credit card company. If bank transfer, please inform your bank account to the Secretariat.

Registration Desk during the Conference Upon arrival at the conference site, Tokyo Big Sight, please sign-up with a confer- ence kit ticket at the Advanced Registration Desk to receive a conference kit and other necessary items. Onsite registration is also welcome.

Registration Desk is open at the 6th floor of The Tower Building (Kaigito) of Tokyo Big Sight as follows, Tuesday Dec.11: 17:00-19:00 Wednesday Dec.12: 8:30-17:00 Thursday Dec.13: 8:30-17:00 Friday Dec.14: 8:30-17:00 Saturday Dec.15: 8:30-15:00

64 Social Events Welcome Reception All participants are invited to the Welcome Reception on 12 December 2001 held at The Tower Building (Kaigito), Tokyo Big Sight (1F Room 102 from 18:30-20:30). The reception desk will be open at 18:00.

Intercommunion Session Participants who registered for all sessions (by using Form Type A) or applied the intercommunion session (by using Type B) are invited to participate in the Intercom- munion Session. On 14 December, it will be held at Restaurant 5K PLANETS in National Museum of Emerging Science and Innovation (7F, 18:00-20:00). The reception desk will be open at 17:30.

Overview of National Museum of Emerging Science and Innovation (the Nippon Kagaku Miraikan) In July 2001, the Nippon Kagaku Miraikan opened in the Tokyo Metropolitan Water- front Subcenter (Aomi, Koto-ku). The museum is a facility for sharing the most up-to-date information about science and technology, and an all-round facility for human interaction. At the museum, visitors come in direct contact with, and experience, the latest devel- opments in science and technology by hands-on exhibits, participating in various events, and meeting scientists and technicians. The objective of the museum is not limited to the acquisition of new knowledge. Its goals are to be the primary entity for the discovery of science, to consider the role of science and technology in contemporary society, and to be a dynamic entity that con- tinues to create.

Technical Tours As a special event for overseas participants, Technical Tours are planned on 11 December (Tue) 2001 as follows, Destinations 1) To see the advance technology for recycling Eg. Kawasaki Steel Plant and so on Destinations 2) To see the advance technology for zero-emission Eg. Zero-Energy Home by Misawa Homes A Tour fee is ¥6,000 including lunch and bus charge. For application, please check the box of “Technical tour” in the attached registration form and send it to EcoDesign 2001 Secretariat by 21 November, 2001. Domestic registrants are also welcomed to apply. (Minimum operating numbers of participants: 30 persons)

65 EcoProducts 2001 Exhibition Since 1999, the “Eco-Products Japan” exhibition has been held to provide a forum for exchanging and spreading ideas, information and opinions about eco-products among manufacturers and suppliers, governments and autonomous bodies, and consumers, citizen groups and NGOs. It features exhibitions of some 350 compa- nies’ environmentally conscious products in a wide range of fields, from “home use” products such as furniture, stationery, clothing, and home appliances to “information/ service” products such as software, and products in the finance, logistics, lease/ rental, and consulting fields. In 2001, it will be the largest scale international exhibi- tion in the field of eco-design and eco-products. All participants of EcoDesign 2001 are invited to attend the “ECO-PRODUCTS 2001” exhibition, 13-15 December 2001, at Tokyo Big Sight, East Exhibition Hall. For more information, please address e-mail inquiries to NIKKEI at [email protected].

Language The official language of all presentation is English. Except for tutorials those have simultaneous interpretation from English to Japanese.

Proceedings The proceedings of EcoDesign 2001 is published in English by IEEE CS Press and distributed at the conference site. Extra copies of the proceedings can be purchased at ¥8,000 per a copy at site.

Technical Equipment For oral presentation, an overhead projector is available. If a 35 mm slide projector, a video beamer or further equipment is needed, please contact with the EcoDesign 2001 Secretariat until 14 November. Upon receiving request, the Secretariat will inform the confirmation after the deadline.

At conference site, please check and confirm the operation of tools such as ‘Power Point’ with speaker’s PC 30-60 min. before speaker’s session starts at the check room (Rm 603, 6F) to avoid trouble in the session. In any case, please ensure to bring a set of OHP sheets for all presentation.

66 Conference Venue

Tokyo Big Sight, The Tower Building (Kaigito) Address: Ariake 3-21-1, Koto-ku, Tokyo, Zip-code 135-0063 Tel: +81-3-5530-1111, Internet: http://www.bigsight.or.jp/ Direct Telephone and Fax number of EcoDesign 2001 Secretariat at site will be announced in the Final Program.

Travel to Hotels and the Conference Venue Three routes can be offered upon arrival at Narita Airport to come to the conference venue, 1) Narita Airport→(JR Narita Express train)→Tokyo Station→(JR line bound for Shi- nagawa) →Shinbashi Sta.→(YURIKAMOME) →Kokusai Tenjijo Seimon Fee: ¥3,280 in total to go, Time: approximately 100 min., Frequency: once or twice an hour 2) Narita Airport→(KEISEI Skyliner)→Nippori Station→(JR line bound for Shina- gawa)→Shinbashi Sta.→(YURIKAMOME) →Kokusai Tenjijo Seimon Fee: ¥2,080 in total to go, Time: approximately 100 min., Frequency: once or twice an hour 3) Narita Airport→(a limousine bus bound for Ariake & Odaiba area in Tokyo) →Kokusai-Tenjijo Seimon or the Entrance of Tokyo Big Sight. Fee: ¥2,700 in total to go, Time: approximately 80 min., Frequency: three times a day

Access to the Intercommunion Session at National Museum of Emerging Sci- ence and Innovation (the Nippon Kagaku Miraikan) It takes about 15 min. on YURIKAMOME and foot from the conference venue (Tokyo Big Sight) to National Museum of Emerging Science and Innovation. From hotels near Shinbashi station, take YURIKAMOME line to the site. Taxi is usually available to the venue and National Museum of Emerging Science and Innovation. In Tokyo, however, traffic jams is going to be happened. So, public trans- portation is more reasonable and recommendatory than taxi in terms of the time and fee to go. Please refer Access Map on page 87.

A Climate in December of Tokyo In December, winter season starts in Japan. The weather in Tokyo is usually cold with the average temperature during the day ranging from 18 to 9°C.

Visa to Entry into Japan Those from countries requiring visas should apply to the nearest Japanese consu- late or Embassy. The EcoDesign 2001 Secretariat can also help you with Visa arrangement. For further information, please contact the EcoDesign 2001 Secretar- iat as early as possible.

67 Travel Arrangements

Travel Agency Kinki Nippon Tourist Co., Ltd. (KNT), the official travel agency for the symposium will handle travel arrangements such as hotel accommodation and sightseeing tour. Inquiries and applications in this regard should be addressed to:

EcoDesign 2001 DESK Events and Conventions, Tokyo Kinki Nippon Tourist Co., Ltd. Kyodo Bldg. 6F 2-2 Kanda-jimbocho, Chiyoda-ku, Tokyo 101-0051 JAPAN Tel: +81-3-3263-5581 Fax: +81-3-3263-5961 E-mail:[email protected]

A) Hotel Accommodation KNT has reserved rooms at hotels around Tokyo Big Sight. Hotel reservations are processed on a first-come-first-served basis. If your selected hotel is fully booked, you will be assigned to a hotel as close as possible to your choice. The name of your confirmed hotel, its exact room charge will be informed in a confirmation slip sent to you after the deadline of application.

Rank Name of Hotel Room Size Room Deposit Access to Tokyo Big Sight Ty p e (m3) Charge Access to Hotel

A Hotel Nikko Tokyo Single 33~ ¥21,945 ¥30,000 7min. by Yurikamome Monorail Line *No Breakfast Tw i n 33~ ¥27,720 ♦Hotel : Connected to Daiba Station

B Tokyo Bay Ariake Single 15~ ¥11,300 ¥20,000 3min. walk from Hotel Washington Hotel Tw i n 22~ ¥18,600 ♦Hotel : 3min. walk from Kokusai Ten- *Breakfast jijo Station or Kokusai Tenjijo Seimon included Station

C Hotel Amista Ohi Single 10~ ¥ 8,085 ¥20,000 35min. by JR Keihin Tohoku Line or *Breakfast Tw i n 10~ ¥11,970 Yurikamome Monorail Line included ♦Hotel : 5min. walk from JR Ohi-machi Station

1) Above rates are per room per night including 10% service charge and 5% con- sumption tax. 2) Breakfast is NOT included at Hotel Nikko Tokyo. 3) Above rates are valid only during the period of EcoDesign 2001. 4) The deposit will be deducted from your hotel bill. Please settle the balance when you check out the hotel. 5) Those who are staying for one night only should send one night room charge instead of deposit.

68 6) The above rates and the information are subject to change without notice. 7) Closest stations to Big Sight: By Rinkai Fukutochin Line: 5min walk form Kokusai Tenjijo Station By Yurikamome Monorail Line: in front of Kokusai Tenjijo Seimon Station

B) Sightseeing Tour Sightseeing tours with English speaking guide are available during your stay in Japan. For the details, please refer to the web site http://www.knt.co.jp/kokusai/pack- jht/jhtinde.htm . Those who wish to make a reservation should fill out tour name, date and the number of participants in the Application Form. Assemble time and place to join the tour will be informed in the confirmation slip sent to you after the dead line.

Reservation For reservations, you are kindly requested to forward the Application Form directly to KNT by 14 November 2001. Reservation should be accompanied by the payment of room deposit, sightseeing tour and communication fee of ¥1500. No reservation will be confirmed in the absence of the payment.

Confirmation Upon receiving your application form and payment, KNT will issue a confirmation slip and send it to after the deadline of application. Please ensure to bring this slip with you when you check-in at the hotel or join a sightseeing tour.

Payment Payment of hotel deposit, sightseeing tour and communication fee (¥1500) should be made only in Japanese yen by one of the following methods.

1) Credit Card (VISA, Master Card, American Express, Diners Club, or JCB only.) Please fill out the credit card section in the Application Form with your signature. 2) Bank Transfer to Bank: Sumitomo Mitsui Banking Corp. Chuo Branch Account No: 1855212 Account Name: Kinki Nippon Tourist Co., Ltd * Please attach a copy of your bank receipt to the application form. * Please note that the bank charge for remittance must be borne by the participant.

69 Reservation Change or Cancellation For reservation change or cancellation, a written notification should be sent directly to KNT to avoid troubles. Hotel cancellation charges Up to 14 days prior to check-in date ...... No charge 13-7 days prior to check-in date...... 10% of one day room charge 6-3 days prior to check-in date...... 40% of one day room charge Less than 3 days or no notice given...... 100% of one day room charge Sightseeing tour cancellation charges 7 or more days prior to the commencement of the tour ...... No charge 1-6 days prior to the commencement of the tour ...... 10% of Tour Fare On or after the Tour Date ...... 20% of Tour Fare

Refund When reservation is cancelled, refunds will be made after deducting the cancellation charges and bank or credit card service charges. If the payment is made by credit card, refund will be made through the credit card company. If by bank transfer, please inform us of your bank account.

70 CONFERENCE COMMITTEES

Symposium Chair H. Yoshikawa, Chairman, The Science Council of Japan

Organizing Committee

Co-Chairs: R. Yamamoto, The Univ. of Tokyo F. Kimura, The Univ. of Tokyo D. Bendz, IEEE CS TCEE, IBM J. Ehrenfeld, ISIE

International Members D. Allen, Univ. of Texas, USA T. Graedel, Yale Univ., USA B. Allenby, AT&T, USA H. Griese, Fraunhofer IZM, Germany L. Altings, Technical Univ. of Denmark, C. Handwerker, NIST, USA Denmark W. Harris, Columbia Univ., USA R. Aschenbrenner, Fraunhofer IZM, F.J.A.M. Hermann, Compaq Computer, Germany Germany C. Bathias, CNAM/ITMA, France N.P. Hernborg, The Association of S. Bleek, Factor 10 Inst., France Swedish Automobile Manufacturers G. Boothroyd, Boothroyd Dewhurst, and Wholesalers, Sweden USA K. Ishii, Stanford Univ., USA W. Both, Berlin Senate, Germany J. Jeswiet, Queen’s Univ., Canada D. Botkin, Center for the Study of the F.J.A.M. Jovane, CNR-Milano, Italy Environment, USA H.J.J. Kals, Univ. of Twente, The Nether- J. Brezet, Delft Univ. of Technology, The lands Netherlands T. Kjellberg, Royal Inst. of Technology, M. Charter, The Centre for Sustainable Sweden Design, UK W.A. Knight, Rhode Island Univ., USA P. Dubots, Alcatel CIT, France B. Kopacek, SAT-Care Electronics, P. Eagan, Univ. of Wisconsin-Madison, Austria USA F. - L . K r a u s e , Fraunhofer Inst. for Produc- J. Ertel, Brandenburg Technical Univ., tion Systems & Design Technology, Germany Germany W. Eversheim, Aachen Univ. of Technol- S.C.-Y. Lu, Univ. of Southerm California, ogy, Germany USA K. Feldmann, Univ. of A.Y.C. Nee, National Univ. of Singapore, Erlangen-Nuernberg, Germany Singapore W. Fried, BMW, Germany K. Nimmo, ITRI, UK

71 W. Oppermann, Nokia Mobile Phones, R. Steinhilper, Fraunhofer IPA, Germany Germany A. Stevels, Philips Consumer Electron- J.-G. Persson, The Royal Inst. of Tech- ics/Delft Univ. of Technology, The nology – KTH, Sweden Netherlands R. Pfahl, Motorola, USA N.P. Suh, Massachusetts Inst. of Tech- G. Pitts, Ecolibrium, USA nology, USA H. Reichl, Fraunhofer IZM / Technical M. Terho, Nokia Res. Center, Finland Univ. of Berlin, Germany H.K. Toenshoff, Univ. Hannover, H.-M. Rho, Korea Inst. of Science & Germany Technology, Korea D. Ufford, Raytheon, USA T. Schauer, FAW, Germany H. van Brussel, Catholic Univ. of L.-G. Scheidt, Sony International Louvain, Belgium (Europe), Germany F.J.A.M. van Houten, Univ. of Twente, G. Seliger, Technical Univ. of Belrin, The Netherlands Germany E.V. von Weizackerr, Wuppertal Inst., G. Sohlenius, The Royal Inst. of Tech- Germany nology, Sweden Y. Yasuda, Telefonab LM Ericsson, W.R. Stahel, Product-Life Inst., Sweden Switzerland

Domestic Members T. Arai, The Univ. of Tokyo A. Ichikawa , Japan Inst. of Plant Mainte- Y. Baba, NEC nance Y. Emura, Canon T. Iida, Osaka Univ. T. Enkawa, Tokyo Inst. of Technology K. Ikebuchi, Toyota Motor T. Fukuda, Nagoya Univ. H. Ikeda, Matsushita Erectric T. Fukushima, Japan Audit and Certifica- H. Ishida, INAX tion Organization for Environment and Y. Ishikawa, Japan Techno-Economics Quality Society Y. Furukawa, Tokyo Metropolitan Univ. H. Ishitani, The Univ. of Tokyo T. Gunjima, Doshisya Univ. A. Izumi, Misawa Homes Inst. of I. Hamano, Mitsubishi Erectric Research and Development M. Hanai, Denso K. Kageyama, The Univ. of Tokyo I. Hashimoto, Univ. T. Kamimura, National Inst. for Fusion K. Hashimoto, The Univ. of Tokyo Science N. Hashizume, Seiko Epson M. Kamon, Kyoto Univ. H. Hayashi, Manufacturing Science and H. Kato, Industrial Environment Technology Center Research Center Y. Hayashi, ITOKI M. Kato, Akita Prefectural Univ. K. Higashio, Kubota H. Katsura, Tokyo Ink Mfg. H. Hirai, Tokyo Gas T. Kimura, NTT Advanced Technology S. Hoshino, Musashi Inst. of Technology T. Kimura, Kyoto Inst. of Technology G. Kinoshita, Chuo Univ.

72 T. K i s h i , National Inst. of Advanced Inter- M. Sadakata, The Univ. of Tokyo disciplinary T. Sakai, Ritsumeikan Univ. S. Kishida, NEC K. Sanada, Yokohama National Univ. M. Kobayashi, IBM Japan S. Sano, Sony T. Kobayashi, The Univ. of Tokyo K. Seika, TOTO T. Koga, Fujitsu T. S e o, The Yasuda Fire & Marine Insur- T. Koitabashi, Konika ance H. Koshibu, Fuji Xerox Office Supply T. Shibasaka, Kobe Univ. M. Kouno, The Univ. of Tokyo Y. S h i m o i , Toshiba N. Kumagaya, Inst. of Nuclear Safety M. Shoji, Kajima System H. Suda, Toppan Printing M. Kuriyagawa, National Inst. of S. Suda, The Japan Federation of - Advanced Industrial Science and neering Societies Technology K. Sugimura, Sekisui House M. Maeda, The Univ. of Tokyo H. Tabata, Metocean Environment Inc. T. Matsuo, Toyo U n i v. S. Takata, Waseda Univ. A. Mitarai, Sharp N. Taketa, Kyoto Univ. K. Miyazaki, Chiba Univ. T. Takemoto, Osaka Univ. K. Mizoguchi, Shizuoka Univ. K. Takiguchi, Fuji Xerox S. Mori, Nagoya Univ. N. Tanaka, Hokkaido Univ. Y. Moriguchi, The National Inst. for Envi- Y. Tanaka, Toyo U n i v. ronmental Studies T. Ta n i , Ricoh K. Nagata, Waseda Univ. R. Terakado, Nippon Steel Y. Nakagami, The Sanno Inst. of Man- T. Tomiyama, The Univ. of Tokyo agement N. Tosaka, Nihon Univ. Y. Nakagawa, Hitachi H.Tsuchiya, Society of Japanese Value N. Nakajima, The Univ. of the Air Engineering K. Nakamura, Kirin Brewery H. Uchida, Tokai Univ. T. Nakamura, Meidensha K. Ueda, Kobe Univ. T. Nakayama, Japan Environmental K. Ueno, Mitsubishi Erectric Management Association for Industry T. Umeda, Chiba Inst. of Technology M. Naki, Clean Japan Center T. Watanabe, Ritsumeikan Univ. K. Nihei, Waseda Univ. K. Yagi, National Inst. for Materials Sci- S. Ohkouchi, Hosei Univ. ence R. Okada, Mitsui Engineering and Ship- T. Ya g i , The Univ. of Tokyo building A. Yamato, Japan Nuclear Cycle Devel- T. Okajima, Osaka Gas opment Inst. T. Okano, Tokyo Women’s Medical Univ. T. Yashiro, The Univ. of Tokyo N. Omi, Tokyo Univ. of Agriculture and I. Yasui, The Univ. of Tokyo Technology T. Yoshizawa, The Univ. of Tsukuba T. Osako, OMURON (As of 30 September 2001) S. Owada, Waseda Univ.

73 Technical Committee Chair/Tutorial Chair: T. Suga, The Univ. of Tokyo Vice-Chair: J. Fujimoto, NEC Secretariat: K. Ajiki*, +, Ricoh K. Ido++, I.D.O. Digital Publishing H. Hayashi*, +, Fujikura Technical Tour Chair: N. Kimata*, Tottori Univ. of Environmental Studies Seminar Chair: S. Kishida, NEC International Publicity Chair: M. Kobayashi, IBM Japan Publicity Chair: T. Koga, Fujitsu Finance Chair: H. Koshibu+++, Fuji Xerox Office Supply Home Page Chair: K. Masui, National Inst. of Advanced Indus- trial Science and Technology Special Themes & Arrangements: S. Owada*, Waseda Univ. K. Suganuma, Osaka Univ. Award Chair: T. Tomiyama*, The Univ. of Tokyo Event Chair: H. H. Uchida, Tokai Univ. Program Chair: Y. Umeda, TokyoMetropolitan Univ. Asian Countries Support Chair: H. Yokoyama*, Hitachi

Members Y. Adachi, The Univ. of Tokyo Y. Izumi*, Japan Inst. of Plant Mainte- K. Amagai*, Gunma Univ. nance K. Aoyama+, The Univ. of Tokyo K. Kageyama*, The Univ. of Tokyo S. Kanai*, Hokkaido Univ. S. Doi #, Toshiba J. Kasai*, Isuzu Motors T. Gamo*, Matushita Electric , + K. Halada*, National Inst. for Materials S. Kato* , The Univ. of Tokyo Science M. Katou, ITOKI K. Hashimoto*, The Univ. of Tokyo H. Katsura*, Toyo Ink Mfg. Y. Hirashima*, Seiko-Epson C. Kawamoto*, Osaka Industrial Design Inst. S. Honda++, Shoei Lab. , T. Kiriyama*, The Univ. of Tokyo N. Hosoda* **, The Univ. of Tokyo T. Kishimoto*, NTT H. Igarashi*, The Univ. of Tsukuba H. Kitahara, Daikin Environmental Lab. A. Inaba*, **, ##, National Inst. of H. Kobayashi*, Toshiba Advanced Industrial Science and S. Komatani*, Kirin Brewery Technology T. Kosuda*, Meidensha T. Itou*, Toyota Motor Y. Kurimoto*, Metocean Environment

74 K. Kuriyama*, Waseda Univ. S. Shimada*, OMRON S. Magaino*, Kanagawa Industrial Tech- M. Shimizu*, Advantest nology Reserch Inst. Y. S h i r a i , The Japan Research and F. Masuda*, Open House/Tokyo Zokei Development Center for Metals Univ. S. Suda, Japan Environmental Mamage- K. Masuda*, Fuji Xerox ment Associatiopn for Industry Y. M i n a g a w a , Fuji Photo Film H. Suzuki*, The Univ. of Tokyo S. Miyama*, Mertex S. Takada*, Waseda Univ. T. Miyauchi*, Tokyo Inst. of Technology T. Takemoto, Osaka Univ. S. Miyawaki*, INAX R. Terao, Kochi EcoDesign Council K. Mizoguchi*, Shizuoka Univ. O. Teshigawara*, Japan Radio K. Monzen*, Japan Mining Association S. Tounai*, Mori Landscape Architects S. Mori*, Nagoya Univ. M. Tsuchiya*, Matsushita Electric Com- T. Murakami*, The Univ. of Tokyo ponents K. Muramoto*, Misawa Homes Y. T s u c h i y a * , Society of Japanese Value M. Nakajima*, Sanyo Electric Engineering S. Nakamura*, Waseda Univ. T. Tsukui*, Tokai Univ. M. Naki*, Clean Japan Center M. Uno+, Hitachi Y. O g a w a * , Japan Excel-Management T. U raya m a * , Ritsumeikan Univ. Consulting T. Watanabe, Ritsumeikan Univ. K. Okaniwa*, Konica T. Yabe*, Tokyo Inst. of Technology N. Omi*, Tokyo Univ. of Agriculture and K. Yagi, National Inst. for Materials Sci- Technology ence N. Saegusa*, #, Nissan Motor Y. Yamagiwa*, Sony K. Sakai*, Sony H. Yamamoto+, Fujitsu H. Sakamura*, The Univ. of Tokyo H. Yamamoto*, Canon K. Sanada*, Yokohama National Univ. T. Ya s h i r o * , #, The Univ. of Tokyo T. S a n o, National Inst. of Advanced I. Yasui*, The Univ. of Tokyo Industrial Science and Technology A. Yasumoto*, Japan Techno-Economics ## K. Satoh , Japan Audit and Certifica- Society tion Organization for Environment and K. Yokoyama*, #, Joho Solution Quality Y. Yoneda*, Fujitsu Labs. T. Satoh*, Ricoh T. Yoshida*, Mitsubishi Electric M. Seki*, The Yasuda Fire & Marine T. Yoshizawa*, The Univ. of Tsukuba Insulance # H.A. Shapiro, Osaka Univ. of Arts M. Yukimoto , Kawasaki Steel T. Shibasaka*, Kobe Univ. (As of 30 September 2001) * Program Committee member ** Award Subcommittee member + Event Subcomittee member ++ Publicity Subcommittee member

75 +++ International Publicity Subcommittee member # Technical Tour Subcommittee member ## Asian Countries Support Subcommittee member

Managing Society K. Hirata, Japan Inst. of Electronics Pakaging

ECO-PRODUCTS 2001 Secretariat K. Hasegawa, Nihon Keizai Shimbun, Inc. A. Morita, Nihon Keizai Shimbun, Inc.

EcoDesign 2001 Secretariat H. Araki, Business Center for Academic Societies Japan N. Uehara, Business Center for Academic Societies Japan

76 CONFERENCE ORGANIZATION

Organized by Union of EcoDesigners; 2001 Managing society: Japan Institute of Electronics Packaging Secretariat: Business Center for Academic Societies Japan In Cooperation with (Going Green: Global Collaboration with) IEEE Computer Society Technical Committee on Electronics and the Environment (IEEE CS TCEE), USA CARE Electronics, Europe Co-Sponsors Union of EcoDesigners: Japan Inst. of Electronics Packaging Japan Vending Machine Manufactures (2001 Managing Society) Association Architectural Inst. of Japan Japan Welding Society Center for Environmental Information Japanese Society for the Science of Science Design Clean Japan Center Kochi EcoDesign Council Combustion Society of Japan Nippon Environment Club Design Engineering Special Comm., Osaka Industrial Design Inst., Osaka Liaison Comm. for Artifact Design and Prefectural Government Manufacturing, The Science Council Science Forum on Generation and For- of Japan mation Inst. of Systems, Control and Informa- Society of Environmental Science Japan tion Society of Japanese Value Engineering Japan Electronics and Information Tech- The Carbon Society of Japan nology Industries Association The Ceramic Society of Japan Japan Inst. of Plant Maintenance The Electrochemical Society of Japan Japan Machine Tool Builders’ Associa- The Illuminating Engineering Inst. of tion Japan Japan Society for Design Engineering The Inst. of Electrical Engineers of Japan Society of Civil Engineers Japan Japan Society of Color Material The Inst. of Electrical Installation Engi- Japan Society of Powder and Powder neers of Japan Metallurgy The Inst. of Electronics, Information and Japan Society on Water Environment Communication Engineers Japan Techno-Economics Society The Iron and Steel Inst. of Japan

77 The Japan Electrical Manufactures’ The Japan Society of Mechanical Engi- Association neers The Japan Federation of Engineering The Japan Society of Plasma Sci. and Society Nuclear Fusion Res. The Japan Hydraulics & Pneumatics The Japan Society of Polymer Process- Society ing The Japan Inst. of Energy The Japan of Society for Quality Control The Japan Inst. of Metals The Mining and Materials Processing The Japan Research and Development Inst. of Japan Center for Metals The Society of Chemical Engineers, The Japan Society for Composite Mate- Japan rials The Society of Inorganic Materials, The Japan Society for Precision Engi- Japan neering The Society of Powder Technology, The Japan Society for Technology of Japan Plasticity The United Nations Univ., Inst. of The Japan Society of Applied Physics Advanced Studies The Japan Society of Hydrology and The Visualization Society of Japan Water Resources Interrelated to Atomic Energy Society of Japan Japan Society for Natural Disaster Sci- Communications Industry Association of ence Japan Japan Society for Snow Engineering Cryogenic Association of Japan Japan Society of Engineering Geology Geothermal Research Society of Japan Japan Society of Fluid Mechanics High Temperature Society of Japan Japan Society of Refrigerating and Air Inverse Manufacturing Forum, Japan Conditioning Engineer Japan Association of Industries and Japan Thermal Spraying Society Environment Japanese Society for Engineering Edu- Japan Automobile Manufacturers Asso- cation ciation Japanese Society of Snow and Ice Japan Business Machine Maker’s Asso- Manufacturing Science and Technology ciation Center Japan Coating Technology Association Personal Computer Users’ Application Japan Concrete Inst. Technology Association Japan Electric Power Civil Engineering Quality Engineering Society Association The Chemical Society of Japan Japan Fluid Power Association The Development Engineering Society Japan Foundry Engineering Society of Japan Japan Oil Chemists’ Society The Energy Conservation Center, Japan Japan Prestressed Concrete Engineer- The Iron and Steel Inst. of Japan ing Association The Japan Institute of Energy

78 The Japan Institute of Light Metals The Resource Processing Society of The Japan Machinery Federation Japan The Japan Society for The Conservation The Robotics Society of Japan of Cultural Property The Society for Bioscience and Bioengi- The Japan Society of High Pressure Sci- neering ence and Technology The Society of Instrument and Control The Japan Society of Industrial Machin- Engineers ery Manufacturers The Society of Naval Architects of Japan The Japanese Geotechnical Society The Society of Resource Geology The Japanese Society for Biomaterial The Society of Rheology, Japan The Japanese Society for Non-Destruc- The Society of Rubber Industry Japan tive Inspection The Society of Synthetic Organic Chem- The Japanese Society for Strength and istry Fracture of Materials The Society of Waste Management The Japanese Society of Printing Sci- Experts ence and Technology The Spectroscopical Society of Japan The Laser Society of Japan The Surface Finishing Society of Japan The Marine Engineering Society in The Surface Science Society of Japan Japan (As of 1 October 2001)

Supported by Japan Environment Management Association for Industry

Nihon Keizai Shimbun, Inc.

79 ACKNOWLEDGMENTS

EcoDesign 2001 is financially supported by the following foundations:

Kansai Research Foundation for Technology Promotion

Nippon Sheet Glass Foundation for Materials Science and Engineering

The Commemorative Association for the Japan World Exposition (1970)

The Kajima Foundation

Tokyo Convention and Visitors Bureau

(As of 1 October 2001)

80 EcoDesign 2001 REGISTRATION FORM For office use: Reg.# Type A (For All Sessions) This form must be sent to: Early Registration EcoDesign 2001 SECRETARIAT Deadline: 21 Nov. 2001 c/o Business Center for Academic Societies Japan Honkomagome 5-16-9, Bunkyo-ku, Tokyo 113-8622, Japan Tel: +81 3 5814 1430 Fax: +81 3 5814 5845 E-mail [email protected]/[email protected] Please print or type: Title: Prof. Dr. Mr. Ms. Name:

(Family) (First) (Middle Initial)

Institution:

Department:

Division: Address: Office Home

Zip Code: Country:

Tel: Fax:

E-mail: Registration Fee Early Registration Late Registration Conference (before 21 Nov. 2001) (after 21 Nov. 2001)    cut here cut Member ¥53,000 ¥58,000 Sponsoring Society members and IEEE members Non-Members ¥58,000 ¥63,000 Student (Intercommunion Session Excluded) ¥ 5,000 ¥10,000 Intercommunion session (For Student, or an accompany) ¥ 8,000 ¥10,000 Tutorial  ¥10,000 ¥10,000 Technical Tour ¥ 6,000

Total¥ Total¥

Name of society(ies): Name of Accompanying Person (if any): Mr. Ms. , (Family) (First)

Remittance: Bank Check enclosed (payable to EcoDesign 2001) Bank Transfer:I will remit/have remitted the total fee on (date) through (your bank) to the account of EcoDesign 2001, A/C 075-2396620 (Ordinary Account), Daiichi Kangyo Bank, Hongo Branch, Tokyo Credit Card: Amex Visa Master Diners Master card issued in Japan is limited to UC only. Card Number: Holder’s Name: Expiry: (month)/ (year) Holder’s Signature: Signature: Date:

81 EcoDesign 2001 REGISTRATION FORM For office use: Reg.# Type B (For All Technical Sessions) This form must be sent to: Early Registration EcoDesign 2001 SECRETARIAT Deadline: 21 Nov. 2001 c/o Business Center for Academic Societies Japan Honkomagome 5-16-9, Bunkyo-ku, Tokyo 113-8622, Japan Tel: +81 3 5814 1430 Fax: +81 3 5814 5845 E-mail [email protected]/[email protected] Please print or type: Title: Prof. Dr. Mr. Ms. Name:

(Family) (First) (Middle Initial)

Institution:

Department:

Division: Address: Office Home

Zip Code: Country:

Tel: Fax:

E-mail: Registration Fee Early Registration Late Registration Conference (before 21 Nov. 2001) (after 21 Nov. 2001)    cut here cut Member ¥45,000 ¥50,000 Sponsoring Society members and IEEE members Non-Members ¥50,000 ¥55,000 Student (Intercommunion Session Excluded) ¥ 5,000 ¥10,000 Intercommunion Session (per a person) ¥ 8,000 ¥10,000 Tutorial ¥ 10,000 ¥10,000 Technical Tour ¥ 6,000

Total¥ Total¥

Name of society(ies): Name of Accompanying Person (if any): Mr. Ms. , (Family) (First) Remittance: Bank Check enclosed (payable to EcoDesign 2001) Bank Transfer:I will remit/have remitted the total fee on (date) through (your bank) to the account of EcoDesign 2001, A/C 075-2396620 (Ordinary Account), Daiichi Kangyo Bank, Hongo Branch, Tokyo Credit Card: Amex Visa Master Diners Master card issued in Japan is limited to UC only. Card Number: Holder’s Name: Expiry: (month)/ (year) Holder’s Signature: Signature: Date:

83   

December 12-15, 2001 Tokyo Big Sight

APPLICATION FORM (Deald Line: November 14) (official use) Reg. no. Please complete this form using a typewriter or block letters and return to: Date EcoDesign 2001 Desk Kinki Nippon Tourist, Co., Ltd., Events & Conventions, Tokyo Kyodo Bldg. 6F, 2-2, Kandajimbo-cho, Chiyoda-ku Tokyo, 101-0051, Japan FAX: +81-3-3263-5961 TEL: +81-3-3263-5581 e-mail: [email protected]

Title: Prof. Dr. Mr. Ms. Family Name: Given Name: , Middle Name Institution: Department: Division: Address Home Office Country: E-mail: TEL: FAX: Name of Accompanying Person (if any):Mr.Ms. Family Name Given Name (A)HOTEL ACCOMMODATION

 Hotel Nikko Tokyo  Tokyo Bay Washington Hotel  Hotel Amista Ohi Check in date: / Dec., 2001 Check out date: / Dec., 2001 for nights Room type: Single Twin (to share with Mr./Ms. ) cut here cut Hotel deposit: ¥ -(A) (B)SIGHTSEEING TOUR Tour Name Date Fee Person(s) Total Dec. ¥  Dec. ¥ 

Tour Fee: ¥ -(B)

Grand Total (A) + (B) +¥1,500 = ¥ *¥1500;communication fee PAYMENT (Payment should be made only in Japanese Yen and personal checks are NOT acceptable.)  BANK TRANSFER (Any handling charge must be settled by the participant.) I have remitted the above amount to the following bank on (date) through (bank).

Name of bank: Sumitomo Mitsui Banking Corp Branch Name: Chuo Branch Account Number: 1855212 Account Name: Kinki Nippon Tourist Co., Ltd.

 CREDIT CARD I authorize to charge the above Grand Total to the following credit card.  VISA  Master Card  American Express  Diners  JCB Card Holder’s Name (as appeared on the card):

Card Number: Good through: (month)/ (year)

Date: Signature: 85 National Museum of Emerging Science and Innovation

87