Smartphone Design Win Quarterly Monitor Sample – Q1 2021 2 INTRODUCTION

QUATERLY TECHNOLOGY MONITOR

SMARTPHONE DESIGN WIN MONITOR Q1 2021 Quaterly Technology Monitor SPM21001 – Monitor by Romain FRAUX and Audrey LAHRACH Q1 2021 – Sample

22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr 1 Table of Contents

Overview / Introduction 4 o Die Area per Category o Die Area per Category: Smartphones Details Executive Summary 12 o Die Area per Category: OEM Evolution (Apple, Samsung, Huawei) o Wafer Size Repartition Design Wins 32 o Wafer Material Repartition o Design Wins per Vendors o Technology Node Repartition o Design Wins per Vendors: Smartphones Details o Design Wins per Vendors: OEM Evolution (Apple, Samsung, Huawei) Focus on Application Processors 113 o Design Wins per Nationality o Focus on Application Processors o Design Wins per Nationality: Smartphones Details o Design Wins per Nationality: OEM Evolution (Apple, Samsung, Huawei) Focus on Memories 118 Packaging 54 o Focus on NAND o Package Footprint per Vendors o Focus on DRAM o Package Footprint per Vendors: Smartphones Details o Package Footprint per Vendors: OEM Evolution (Apple, Samsung, Huawei) Focus on Sensors 124 o Package Footprint per Category o Focus on Sensors: CMOS Image Sensors o Package Footprint per Family o Focus on Sensors: Others o Package Footprint: OEM Evolution (Apple, Samsung, Huawei)

Focus on RF 133 eBoM Cost 69 o Focus on RF o eBoM Cost per Category o eBoM Cost per Category: Smartphones Details o eBoM Cost per Category: OEM Evolution (Apple, Samsung, Huawei) Focus on Passives 138 o Focus on Capacitors Die, Wafer & Technology 81 o Focus on Capacitors o Die Area per Vendors o Focus on Capacitors o Die Area per Vendors: Smartphones Details o Die Area per Vendors: OEM Evolution (Apple, Samsung, Huawei) Feedbacks 143 o Die Area per Nationality o Die Area per Nationality: Smartphones Details Related Products 145 o Die Area per Nationality: OEM Evolution (Apple, Samsung, Huawei) SystemPlus Consulting services 147 ©2021 by System Plus Consulting | SPM21001 Smartphone Design Win Quarterly Monitor Sample – Q1 2021 2 INTRODUCTION

Overview / Introduction o Introduction The Smartphone Design Win Monitor allows to stay updated on the latest components, packaging and silicon chip choices of o Monitor Methodology the smartphone makers. o Smartphones References o Glossary

Executive Summary This monitor offers a clear view of the semiconductor compagnies leading the market and a direct comparison between OEM.

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Feedbacks It provides : ✓ Related Analyses Design wins for the top smartphones OEM (per vendors., nationality…) ✓ Packaging evolution in term of type, footprint, pitch… About System Plus Consulting ✓ Die area evolution per function, technology node, wafer size… ✓ Focus per category (Processor, Camera, Memory, Sensor…)

The following deliverables is included in the monitor: ▪ An online dynamic dashboard with historical data from past years and last quarter including at least 8 new smartphones analyzed during this quarter. ▪ A PDF slide deck with graphs and comments to explain the main technology evolutions on the smartphone market. ▪ Direct access to the analyst for more details and analysis of the data.

Overview / Introduction o Introduction ❑ Methodology: o Monitor Methodology o Smartphones References o Glossary ▪ We construct the smartphone monitor with data coming from representative phones:

Executive Summary ➢ 8 per quarter, 32 per year

Monitor ▪ It follows the shipment market share, which means that selected phones are a good representation of the market (i.e. if a vendor has 20% market share, we will take around 20% of phones from that Feedbacks vendor). Related Analyses ❑ One-year smartphones shipment market share (from Yole Développement): About System Plus Consulting Q1 2020 Units Q1 2020 Q2 2020 Units Q2 2020 Q3 2020 Units Q3 2020 Q4 2020 Units Q4 2020 Nb Phones to analyse Mfr. (Million) % (Million) % (Million) % (Million) % per year Samsung 61 21% 68 21% 70 21% 74 21% 6.7 Apple 41 14% 46 14% 47 14% 50 14% 4.5 Xiaomi 35 12% 39 12% 40 12% 42 12% 3.8 Huawei 32 11% 36 11% 37 11% 39 11% 3.5 Others 29 10% 32 10% 33 10% 35 10% 3.1 Vivo 25 9% 28 9% 29 9% 30 9% 2.7 OPPO 25 8% 27 8% 28 8% 30 8% 2.7 Honor 13 4% 13 4% 13 4% 14 4% 1.3 Realme 8 3% 9 3% 9 3% 10 3% 0.9 LG 5 2% 6 2% 6 2% 6 2% 0.6 ZTE 5 2% 6 2% 6 2% 6 2% 0.6 Lenovo 5 2% 5 2% 6 2% 6 2% 0.5 Google 2 1% 3 1% 3 1% 3 1% 0.3 OnePlus 2 1% 3 1% 3 1% 3 1% 0.3 TCL 2 1% 2 1% 2 1% 3 1% 0.2 Sony 1 0% 1 0% 1 0% 1 0% 0.1 Meizu 1 0% 1 0% 1 0% 1 0% 0.1 ASUS 0 0% 0 0% 0 0% 0 0% 0.0 HTC 0 0% 0 0% 0 0% 0 0% 0.0 Coolpad 0 0% 0 0% 0 0% 0 0% 0.0 Total 294 325 332 353 32.0 ©2021 by System Plus Consulting | SPM21001 - Smartphone Design Win Monitor Sample 2021 Q1 4 MONITOR METHODOLOGY

Overview / Introduction o Introduction ❑ Database Filters: o Monitor Methodology o Smartphones References o Glossary ▪ The Excel database provided with the slides deck allows to realize filters and to create pivot tables using at least 29 levels of filters: Executive Summary

Monitor Phone-Level Filters IC-Level Filters Package-Level Filters Die-Level Filters Feedbacks Teardown Date IC Manufacturer Package Length Die Manufacturer Related Analyses Phone Manufacturer IC Manufacturer Nationality Package Width Die Manufacturer Nationality About System Plus Consulting Phone Manufacturer Nationality IC Reference Package Height Die Category Phone Model IC Category Package Area Die SubCategory IC SubCategory Package Ball/Pin number Die Quantity IC Quantity Package Pitch Die Length IC ASP Package Type/Family Die Width Die Area Die Process Node Die Wafer Size Die Wafer Material

Overview / Introduction o Introduction ❑ IC/Die Categories: o Monitor Methodology o Smartphones References o Glossary ▪ Seven categories and several subcategories are used to differentiate the functional areas of the phones: Executive Summary

Monitor Application Audio & Power Baseband Connectivity Memory RF Sensor Processor Management Feedbacks APU/APE ADC/DAC Modem Bluetooth DRAM RF Transceiver Fingerprint Sensor Related Analyses (2G/3G/4G/5G)

About System Plus Consulting ASIC Audio Amp GPS FLASH NAND RF Front-End Environmental Sensor FPGA Audio Codec NFC/MST Serial Image Sensor FLASH/EEPROM ISP Audio Processor WiFi Inertial Sensor

MCU Charger/Interface/P FM/TV Light/Proximity rotection IC Sensor Controller/Driver Magnetic Sensor (Display, LED, Touch…) Power Microphone Management Unit (PMU) Switch/SMPS/Envel Radar ope Tracking IC

Overview / Introduction o Introduction o Monitor Methodology ❑ Smartphones references selected for Q1 2021 monitor: o Smartphones References o Glossary ▪ Q1 2021 (8 smartphones): Executive Summary ➢ Apple iPhone 12 US ➢Huawei nova 7 SE 5G Youth ➢Samsung Galaxy Z Fold 2

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About System Plus Consulting ➢Apple iPhone 12 Pro Max US ➢Microsoft Surface Duo ➢Vivo X50 Pro

➢Google Pixel 4a ➢Samsung Galaxy Note 20

Overview / Introduction o Introduction o Monitor Methodology ❑ Smartphones references selected for the monitor: o Smartphones References o Glossary Year Quarter Mfr. Ref. Chipset Display RAM NAND Network 2021 Q1 APPLE iPhone 12 Pro Max US Apple A14 6.7" 6GB 128GB 5G Nb Phones Executive Summary 2021 Q1 APPLE iPhone 12 5G US Apple A14 6.1" 4GB 64GB 5G Mfr. Selected 2021 Q1 GOOGLE Pixel 4a Qualcomm Snapdragon 730G 5.8" 6GB 128GB 4G over a year Monitor 2021 Q1 Huawei nova 7 SE 5G Youth HiSilicon Kirin 820 6.5" 8GB 128GB 5G 2021 Q1 MICROSOFT Surface Duo Qualcomm Snapdragon 855 8.1" 6GB 128GB 4G Samsung 6 Feedbacks 2021 Q1 SAMSUNG Galaxy Z Fold2 5G Qualcomm Snapdragon 865+ 7.6" 12GB 256GB 5G 2021 Q1 Samsung Galaxy Note 20 5G Qualcomm Snapdragon 865+ 6.7" 8GB 128GB 5G Huawei 4 Related Analyses 2021 Q1 Vivo X50 Pro Qualcomm Snapdragon 765G 6.5" 8GB 128GB 5G 2020 Q4 Apple iPhone SE (2020) Apple A13 4.7" 3GB 128GB 4G Apple 3 2020 Q4 Huawei P40 Pro 5G HiSilicon Kirin 990 6.6" 8GB 256GB 5G About System Plus Consulting 2020 Q4 Motorola Edge+ Qualcomm Snapdragon 865 6.7" 12GB 256GB 5G Xiaomi 2 2020 Q4 OnePlus 8 5G Qualcomm Snapdragon 865 6.5" 8GB 128GB 5G 2020 Q4 Realme X50 5G Qualcomm Snapdragon 765 6.6" 8GB 128GB 5G Oppo 2 2020 Q4 Samsung Galaxy M31 Samsung Exynos 9611 6.4" 6GB 64GB 4G 2020 Q4 Sharp AQUOS R5G Qualcomm Snapdragon 865 6.5" 12GB 256GB 5G Vivo 3 2020 Q4 ZTE Nubia Red Magic 5G Qualcomm Snapdragon 865 6.6" 12GB 256GB 5G 2020 Q3 Huawei Mate Xs HiSilicon Kirin 990 8.0"" 8GB 512GB 5G Other 12 2020 Q3 LG Electronics V60 ThinQ 5G Qualcomm Snapdragon 865 6.8" 8GB 128GB 5G 2020 Q3 Motorola Razr 2019 Qualcomm Snapdragon 710 6.2" 6GB 128GB 4G Total 32 2020 Q3 OPPO Find X2 5G Qualcomm Snapdragon 865 6.7" 12GB 256GB 5G 2020 Q3 Samsung Galaxy S20 Ultra 5G USA Qualcomm Snapdragon 865 6.9" 12GB 128GB 5G 2020 Q3 Samsung Galaxy Z Flip Qualcomm Snapdragon 855+ 6.7" 8GB 256GB 4G 2020 Q3 Vivo Nex 3s 5G Qualcomm Snapdragon 865 6.9" 12GB 256GB 5G 2020 Q3 Xiaomi Mi 10 Pro 5G Qualcomm Snapdragon 865 6.7" 8GB 256GB 5G 2020 Q2 HTC Desire 19s Mediatek Helio P22 6.2" 3GB 32GB 4G 2020 Q2 Huawei Mate 30 Pro 5G HiSilicon Kirin 990 6.5" 8GB 256GB 5G 2020 Q2 Motorola One Hyper Qualcomm Snapdragon 675 6.5" 4GB 64GB 4G 2020 Q2 OPPO Reno3 Pro 5G Qualcomm Snapdragon 765 6.5" 8GB 128GB 5G 2020 Q2 Samsung Galaxy A51 Samsung Exynos 9611 6.5" 4GB 128GB 4G 2020 Q2 Vivo X30 Pro 5G Samsung Exynos 980 6.4" 8GB 128GB 5G 2020 Q2 Xiaomi Mi Note 10 Global Qualcomm Snapdragon 730G 6.5" 6GB 128GB 4G 2020 Q2 ZTE Blade 10 Prime Mediatek Helio P60 6.3" 3GB 64GB 4G ©2021 by System Plus Consulting | SPM21001 - Smartphone Design Win Monitor Sample 2021 Q1 8 Q1 2021 DESIGN WINS PER VENDORS

Overview / Introduction

Related Analyses

About System Plus Consulting

❑ Q1 2021 shows Qualcomm leading with xxx design wins (xx%). ▪ Most of them are processors (Snapdragon), RF components (Transceivers, RFFEM) and PMIC

Overview / Introduction

Related Analyses

About System Plus Consulting

❑ Nationality represents the country of the headquarter of the component provider. ❑ USA represents xx% of the design wins in Q1 2021 ▪ Qualcomm, Qorvo, Skyworks, Broadcom Texas Instruments and Cirrus Logic account for the majority of these design wins. ©2021 by System Plus Consulting | SPM21001 - Smartphone Design Win Monitor Sample 2021 Q1 10 Q1 2021 PACKAGE FOOTPRINT PER VENDORS

Overview / Introduction

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About System Plus Consulting

❑ Q1 2021 shows Qualcomm leading with xxx (xx%) of packages among the 8 selected smartphones. ▪ Most of this area is for snapdragon processors and modems, followed by RF components (Transceivers, RFFEM). ©2021 by System Plus Consulting | SPM21001 - Smartphone Design Win Monitor Sample 2021 Q1 11 Q1 2021 PACKAGE FOOTPRINT DISTRIBUTION PER FAMILY

Overview / Introduction

Executive Summary

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Related Analyses Total Footprint xxx mm² About System Plus Consulting

Total Footprint xxx mm²

❑ BGA/LGA is the main packaging platform (xx% in Q1 2021) for smartphones. ▪ BGA/LGA packages are used in all categories of components, with around xx% of the footprint being used for memories.

Overview / Introduction

Feedbacks Q1 2021 Total eBOM Cost: $xxx Q4 2020 Total eBOM Cost: $xxx Related Analyses

About System Plus Consulting

❑ Memory represents xx% of BoM cost for the electronic components in Q1 2021 (Display, battery, PCB and mechanical components excluded). ▪ NAND & DRAM drive this cost, with only 4 players involved: Samsung, Kioxia, SK Hynix and Micron.

Overview / Introduction

About System Plus Consulting

❑ Samsung is leading the die area utilization in Q1 2021, with xxx (xx%). ▪ xxxx is the main driver.

Overview / Introduction

About System Plus Consulting

❑ USA accounts for xxx mm² of dies area in Q1 2021 (xx%) ▪ This dies area is most only realized by xx players: xx and xx.

Overview / Introduction

About System Plus Consulting

❑ Memory accounts for xxx mm² (xx%) of dies area in Q1 2021. ▪ xxxx.

Overview / Introduction

Related Analyses ❑ By using this calculated area, and to ensure xxM About System Plus Consulting smartphones units shipment in Q1 2021 as estimated by Yole Développement, it would require: ✓ xxK units of 150mm wafers ✓ xxM units of 200mm wafers xxx mm² ✓ xxM units of 300mm wafers

Overview / Introduction

Feedbacks ❑ By using this calculated area, and to Related Analyses ensure xxM smartphones units shipment in Q1 2021 as estimated by About System Plus Consulting Yole Développement, it would require: ✓ xxM units of silicon wafers (200mm equivalent) ✓ xxK units of SOI wafers (200mm equivalent) ✓ xxK units of LT/LN wafers (200mm equivalent) ✓ xxK units of III/V wafers (200mm equivalent)

Overview / Introduction

Feedbacks ❑ DRAM and application processors are driving this consumption. Related Analyses

About System Plus Consulting ❑ By using this calculated area, and to ensure xxM smartphones units shipment in Q1 2021 as estimated by Yole Développement, it would require: Total dies Area ✓ xxM units of wafers using 14-5nm technology nodes ✓ xxM units of wafers using 28-16nm technology nodes xxx mm² ✓ xxM units of wafers using 90-32nm technology nodes

Overview / Introduction

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About System Plus Consulting

❑Apple iPhone 12 Pro Max and Samsung Galaxy Z Fold 2 are the phones holding the most ICs area.

Overview / Introduction

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About System Plus Consulting

❑ The Samsung Galaxy Z Fold 2 and Samsung Galaxy Note 20 are the smartphones having the most dies area. ▪ xxxx. ©2021 by System Plus Consulting | SPM21001 - Smartphone Design Win Monitor Sample 2021 Q1 21 Q1 2021 FOCUS ON APPLICATION PROCESSORS

Overview / Introduction

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Feedbacks Apple A14 Apple A14 Kirin 820 Snapdragon Snapdragon Related Analyses 865+ 865+ Snapdragon 855 About System Plus Consulting Snapdragon 765G Snapdragon 730G

❑ Among the 8 smartphones used for Q1 2021, only three vendors are integrated: Qualcomm, Apple and HiSilicon. ▪ xxx.

Overview / Introduction

Executive Summary 256GB

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128GB 128GB 128GB 128GB 128GB 128GB

64GB

Overview / Introduction

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Related Analyses 8GB LPDDR5 About System Plus Consulting 8GB 6GB 8GB 6GB LPDDR4X 6GB LPDDR4X LPDDR4X LPDDR4X LPDDR4X

4GB LPDDR4X

❑ xxxx. ▪ xxxx.

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Feedbacks Front 3D: 1.5Mp Rear Main: Related Analyses 12Mp Rear Main: Rear Wide: 12Mp About System Plus Consulting Front: Rear 3D: 8Mp 10Mp Front: 12Mp Front 3D: 1.5Mp Front: 10Mp 16Mp Rear telephoto: Rear Main: Inside: 12Mp Rear Wide: 48Mp 10Mp 8Mp Rear Main: Rear Main: Rear Wide: 12Mp 12Mp Front: 12Mp Rear Main: 32Mp Rear Wide: Rear Wide: 64Mp Rear Wide: 12Mp 12Mp Rear Main: Rear Portrait: Rear telephoto: 12Mp 12.2Mp 13Mp 64Mp Front: Front: Rear telephoto: Rear Macro: 2Mp Front: 8Mp 12Mp 12Mp 12Mp Rear Bokeh: 2Mp Front: 11Mp Rear telephoto: 8Mp

❑ xxxx. ▪ xxxx.

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❑ xxxx. ▪xxxx.

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❑ xxxx. ▪xxxx.

28 RELATED PRODUCTS

Overview / Introduction

Executive Summary REVERSE COSTING REPORTS TEARDOWN TRACKS

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About System Plus Consulting

MONITORS

o CMOS Image Sensor Quarterly Market Monitor o Advanced Packaging Quarterly Market Monitor o Processor Quarterly Market Monitor o NAND Quarterly Market Monitor o DRAM Quarterly Market Monitor

Overview / Introduction

Executive Summary

Monitor

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