Global M&A and the Development of the IC Industry Ecosystem In
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Section 10 Flash Technology
10 FLASH TECHNOLOGY Overview Flash memory technology is a mix of EPROM and EEPROM technologies. The term “flash” was chosen because a large chunk of memory could be erased at one time. The name, therefore, distinguishes flash devices from EEPROMs, where each byte is erased individually. Flash memory technology is today a mature technology. Flash memory is a strong com- petitor to other memories such as EPROMs, EEPROMs, and to some DRAM applications. Figure 10-1 shows the density comparison of a flash versus other memories. 64M 16M 4M DRAM/EPROM 1M SRAM/EEPROM Density 256K Flash 64K 1980 1982 1984 1986 1988 1990 1992 1994 1996 Year Source: Intel/ICE, "Memory 1996" 18613A Figure 10-1. Flash Density Versus Other Memory How the Device Works The elementary flash cell consists of one transistor with a floating gate, similar to an EPROM cell. However, technology and geometry differences between flash devices and EPROMs exist. In particular, the gate oxide between the silicon and the floating gate is thinner for flash technology. It is similar to the tunnel oxide of an EEPROM. Source and INTEGRATED CIRCUIT ENGINEERING CORPORATION 10-1 Flash Technology drain diffusions are also different. Figure 10-2 shows a comparison between a flash cell and an EPROM cell with the same technology complexity. Due to thinner gate oxide, the flash device will be more difficult to process. CMOS Flash Cell CMOS EPROM Cell Mag. 10,000x Mag. 10,000x Flash Memory Cell – Larger transistor – Thinner floating gate – Thinner oxide (100-200Å) Photos by ICE 17561A Figure 10-2. -
Some Facts of High-Tech Patenting
Some Facts of High-Tech Patenting Michael Webb Nick Short Nicholas Bloom Josh Lerner Working Paper 19-014 Some Facts of High-Tech Patenting Michael Webb Nick Short Stanford University Harvard Kennedy School Nicholas Bloom Josh Lerner Stanford University Harvard Business School Working Paper 19-014 Copyright © 2018 by Michael Webb, Nick Short, Nicholas Bloom, and Josh Lerner Working papers are in draft form. This working paper is distributed for purposes of comment and discussion only. It may not be reproduced without permission of the copyright holder. Copies of working papers are available from the author. Some Facts of High-Tech Patenting Michael Webb, Nick Short, Nicholas Bloom, and Josh Lerner NBER Working Paper No. 24793 July 2018 JEL No. L86,O34 ABSTRACT Patenting in software, cloud computing, and artificial intelligence has grown rapidly in recent years. Such patents are acquired primarily by large US technology firms such as IBM, Microsoft, Google, and HP, as well as by Japanese multinationals such as Sony, Canon, and Fujitsu. Chinese patenting in the US is small but growing rapidly, and world-leading for drone technology. Patenting in machine learning has seen exponential growth since 2010, although patenting in neural networks saw a strong burst of activity in the 1990s that has only recently been surpassed. In all technological fields, the number of patents per inventor has declined near-monotonically, except for large increases in inventor productivity in software and semiconductors in the late 1990s. In most high-tech fields, Japan is the only country outside the US with significant US patenting activity; however, whereas Japan played an important role in the burst of neural network patenting in the 1990s, it has not been involved in the current acceleration. -
5G: Perspectives from a Chipmaker 5G Electronic Workshop, LETI Innovation Days – June 2019
5G: Perspectives from a Chipmaker 5G electronic workshop, LETI Innovation Days – June 2019 Guillaume Vivier Sequans communications 1 ©2019 Sequans Communications |5G: Perspective from a chip maker – June 2019 MKT-FM-002-R15 Outline • Context, background, market • 5G chipmaker: process technology thoughts and challenges • Conclusion 2 ©2019 Sequans Communications |5G: Perspective from a chip maker – June 2019 5G overall landscape • 3GPP standardization started in Sep 2015 – 5G is wider than RAN (includes new core) – Rel. 15 completed in Dec 2018. ASN1 freeze for 4G-5G migration options in June 19 – Rel. 16 on-going, to be completed in Dec 2019 (June 2020) • Trials and more into 201 operators, 80+ countries (source GSA) • Commercial deployments announced in – Korea, USA, China, Australia, UAE 3 ©2019 Sequans Communications |5G: Perspective from a chip maker – June 2019 Ericsson Mobility Report Nov 2018 • “In 2024, we project that 5G will reach 40 percent population coverage and 1.5 billion subscriptions“ • Interestingly, the report highlights the fact that IoT will continue to grow, beyond LWPA, leveraging higher capability of LTE and 5G 4 ©2019 Sequans Communications |5G: Perspective from a chip maker – June 2019 5G overall landscape • eMBB: smartphone and FWA market – Main focus so far from the ecosystem • URLLC: the next wave – Verticals: Industry 4.0, gaming, media Private LTE/5G deployment, … – V2X and connected car • mMTC: – LPWA type of communication is served by cat-M and NB-IoT – 5G opens the door to new IoT cases not served by LPWA, • Example surveillance camera with image processing on the device • Flexibility is key – From Network side, NVF, SDN, Slicing, etc. -
Annual Report 2018
08493 SMIC AR18 cover ENG (15.5mm).pdf 1 17/4/2019 下午5:36 Annual Report 2018 C M Y CM MY CY CMY K 2018 Annual Report Semiconductor Manufacturing International Corporation No.18 Zhangjiang Road, Pudong New Area, Shanghai 201203, The People’s Republic of China Tel : + 86 (21) 3861 0000 Fax : + 86 (21) 5080 2868 Website : www.smics.com (Incorporated in the Cayman Islands with limited liability) Stock Code: 0981 Shanghai . Beijing . Tianjin . Jiangyin . Shenzhen . Hong Kong . Taiwan . Japan . Americas . Europe SMIC GLOBAL NETWORK TIANJIN SAN JOSE, CA, USA BEIJING MILAN, TOKYO, ITALY JAPAN JIANGYIN, JIANGSU SHANGHAI AVEZZANO, (Headquarters) ITALY SHENZHEN, GUANGDONG HSINCHU, TAIWAN HONG KONG (Representative) SMIC FAB SMIC MARKETING OFFICE SMIC REPRESENTATIVE OFFICE SMIC BUMPING FAB THE LARGEST ADVANCED FOUNDRY IN MAINLAND CHINA EMPOWERED TECHNOLOGY ENRICHED SERVICES, ENHANCED COMPETITIVENESS CONTENTS 05 Additional Information 07 Corporate Information 09 Financial Highlights 11 Letter to Shareholders 12 Business Review 17 Management’s Discussion and Analysis of Financial Condition and Results of Operation 23 Directors and Senior Management 31 Report of the Directors 94 Corporate Governance Report 113 Social Responsibility 116 Independent Auditor’s Report 121 Consolidated Statement of Profit or Loss and Other Comprehensive Income 122 Consolidated Statement of Financial Position 124 Consolidated Statement of Changes in Equity 126 Consolidated Statement of Cash Flows 128 Notes to the Consolidated Financial Statements CAUTIONARY STATEMENT FOR PURPOSES OF THE “SAFE HARBOR” PROVISIONS OF THE PRIVATE SECURITIES LITIGATION REFORM ACT OF 1995 This annual report may contain, in addition to historical information, “forward-looking statements” within the meaning of the “safe harbor” provisions of the U.S. -
A Report on Semiconductor Foundry Access by US Academics (Discussion Held at a Meeting Virtually Held at the National Science Foundation on Dec 16, 2020)
A Report on Semiconductor Foundry Access by US Academics (Discussion held at a meeting virtually held at the National Science Foundation on Dec 16, 2020) Organizers: Sankar Basu1, Erik Brunvand2, Subhasish Mitra3, H.-S. Philip Wong4 Scribes: Sayeef Salahuddin5, Shimeng Yu6 1 NSF, [email protected] 2 NSF, [email protected] 3 Stanford University, [email protected] 4 Stanford University, [email protected] 5 University of California, Berkeley, [email protected] 6 Georgia Institute of Technology, [email protected] 2 Executive Summary Semiconductor technology and microelectronics7 is a foundational technology that without its continued advancement, the promises of artificial intelligence (AI), 5G/6G communication, and quantum computing will never be realized in practice. Our nation’s economic competitiveness, technology leadership, and national security, depend on our staying at the forefront of microelectronics. We must accelerate the pace of innovation and broaden the pool of researchers who possess research capability in circuit design and device technologies, and provide a pathway to translate these innovations to industry. This meeting has brought to the fore the urgent need for access to semiconductor foundry and design ecosystem to achieve these goals. Microelectronics is a field that requires sustained and rapid innovations, especially as the historical rate of progress following a predictable path, is no longer guaranteed as it had been in the past. Yet, there are many plausible paths to move forward, and the potential for further advances is immense. There is a future in system integration of heterogeneous technologies that requires end-to-end co-design and innovation. Isolated push along silos, such as miniaturization of components, will be inadequate. -
Memory Lane and a Look Down the Road: China Progressing in NAND but Hurdles Remain
21 July 2019 | 12:06PM EDT Made in the USA or China Memory lane and a look down the road: China progressing in NAND but hurdles remain Mark Delaney, CFA +1(212)357-0535 | [email protected] Goldman Sachs & Co. LLC Allen Chang +852-2978-2930 | [email protected] Goldman Sachs (Asia) L.L.C. We believe that China’s efforts to enter the global DRAM and NAND markets merit a Daiki Takayama +81(3)6437-9870 | deeper dive into how the memory industries have evolved over time, what impact [email protected] Goldman Sachs Japan Co., Ltd. China’s entry into other commodity tech industries (such as LEDs and solar) has had Toshiya Hari on fundamentals, where we believe the leading China-based memory companies +1(646)446-1759 | [email protected] Goldman Sachs & Co. LLC stand at present with their efforts to enter the market (and the challenges that still Satoru Ogawa +81(3)6437-4061 | exist for entering the market — with GlobalFoundries as an example that [email protected] leading-edge semi production is difficult even for well-funded efforts), and what we Goldman Sachs Japan Co., Ltd. Alexander Duval believe all this means for the stocks of the established memory, drive, and semi +44(20)7552-2995 | [email protected] equipment companies. Goldman Sachs International Timothy Sweetnam, CFA With over $150 bn of semiconductors shipped to China in 2018, per the +1(212)357-7956 | [email protected] Semiconductor Industry Association (SIA), and China domestic semi firms having Goldman Sachs & Co. -
The Impacts of Technological Invention on Economic Growth – a Review of the Literature Andrew Reamer1 February 28, 2014
THE GEORGE WASHINGTON INSTITUTE OF PUBLIC POLICY The Impacts of Technological Invention on Economic Growth – A Review of the Literature Andrew Reamer1 February 28, 2014 I. Introduction In their recently published book, The Second Machine Age, Erik Brynjolfsson and Andrew McAfee rely on economist Paul Krugman to explain the connection between invention and growth: Paul Krugman speaks for many, if not most, economists when he says, “Productivity isn’t everything, but in the long run it’s almost everything.” Why? Because, he explains, “A country’s ability to improve its standard of living over time depends almost entirely on its ability to raise its output per worker”—in other words, the number of hours of labor it takes to produce everything, from automobiles to zippers, that we produce. Most countries don’t have extensive mineral wealth or oil reserves, and thus can’t get rich by exporting them. So the only viable way for societies to become wealthier—to improve the standard of living available to its people—is for their companies and workers to keep getting more output from the same number of inputs, in other words more goods and services from the same number of people. Innovation is how this productivity growth happens.2 For decades, economists and economic historians have sought to improve their understanding of the role of technological invention in economic growth. As in many fields of inventive endeavor, their efforts required time to develop and mature. In the last five years, these efforts have reached a point where they are generating robust, substantive, and intellectually interesting findings, to the benefit of those interested in promoting growth-enhancing invention in the U.S. -
EDIT THIS 2021 ISRI 1201 Post-Hearing Letter 050621
Juelsgaard Intellectual Property and Innovation Clinic Mills Legal Clinic Stanford Law School Crown Quadrangle May 7, 2021 559 Nathan Abbott Way Stanford, CA 94305-8610 [email protected] Regan Smith 650.724.1900 Mark Gray United States Copyright Office [email protected] [email protected] Re: Docket No. 2020-11 Exemptions to Prohibition Against Circumvention of Technological Measures Protecting Copyrighted Works Dear Ms. Smith and Mr. Gray: I write to respond to your April 27 post-hearing letter requesting the materials that I referenced during the April 21 hearing related to Proposed Class 10 (Computer Programs – Unlocking) that were not included in our written comments. In particular, I cited to three reports from the Global mobile Suppliers Association (“GSA”) to illustrate the rapid increase in cellular-enabled devices with 5G capabilities in the last three years. In March 2019, GSA had identified 33 announced 5G devices from 23 vendors in 7 different form factors.1 By March 2020, GSA had identified 253 announced 5G devices from 81 vendors in 16 different form factors, including the first 5G-enabled laptops, TVs, and tablets.2 And by April 2021, GSA had identified 703 announced 5G devices from 122 vendors in 22 different form factors.3 It should be noted that some of the 22 form factors, such as 5G modules,4 can be deployed across a wide range of use cases that are not directly tracked by the GSA reports.5 For example, one distributor of Quectel’s 5G modules described the target applications as including: Telematics & transport – vehicle tracking, asset tracking, fleet management Energy – electricity meters, gas/water meter, smart grid Payment – wireless pos [point of service], cash register, ATM, vending machine Security – surveillance, detectors Smart city – street lighting, smart parking, sharing economy Gateway – consumer/industrial router 1 GSA, 5G Device Ecosystem (Mar. -
5G, Lte & Iot Components Vendors Profiled (28)
5G, LTE & IOT COMPONENTS VENDORS PROFILED (28) Altair Semiconductor Ltd., a subsidiary of Sony Corp. / www.altair-semi.com Analog Devices Inc. (NYSE: ADI) / www.analog.com ARM Ltd., a subsidiary of SoftBank Group Corp. / www.arm.com Blu Wireless Technology Ltd. / www.bluwirelesstechnology.com Broadcom Corp. (Nasdaq: BRCM) / www.broadcom.com Cadence Design Systems Inc. / www.cadence.com Ceva Inc. (Nasdaq: CEVA) / www.ceva-dsp.com eASIC Corp. / www.easic.com GCT Semiconductor Inc. / www.gctsemi.com HiSilicon Technologies Co. Ltd. / www.hisilicon.com Integrated Device Technology Inc. (Nasdaq: IDTI) / www.idt.com Intel Corp. (Nasdaq: INTC) / www.intel.com Lime Microsystems Ltd. / www.limemicro.com Marvell Technology Group Ltd. (Nasdaq: MRVL) / www.marvell.com MediaTek Inc. / www.mediatek.com Microsemi Corp., a subsidiary of Microchip Technology Inc. (Nasdaq: MCHP) / www.microsemi.com MIPS, an IP licensing business unit of Wave Computing Inc. / www.mips.com Nordic Semiconductor ASA (OSX: NOD) / www.nordicsemi.com NXP Semiconductors N.V. (Nasdaq: NXPI) / www.nxp.com Octasic Inc. / www.octasic.com Peraso Technologies Inc. / www.perasotech.com Qualcomm Inc. (Nasdaq: QCOM) / www.qualcomm.com Samsung Electronics Co. Ltd. (005930:KS) / www.samsung.com Sanechips Technology Co. Ltd., a subsidiary of ZTE Corp. (SHE: 000063) / www.sanechips.com.cn Sequans Communications S.A. (NYSE: SQNS) / www.sequans.com Texas Instruments Inc. (NYSE: TXN) / www.ti.com Unisoc Communications Inc., a subsidiary of Tsinghua Unigroup Ltd. / www.unisoc.com Xilinx Inc. (Nasdaq: XLNX) / www.xilinx.com © HEAVY READING | AUGUST 2018 | 5G/LTE BASE STATION, RRH, CPE & IOT COMPONENTS . -
Final Report of the NASA Technology Readiness Assessment (TRA) Study Team
NASA Technology Readiness Assessment (TRA) Study Team Final Report of the NASA Technology Readiness Assessment (TRA) Study Team March 2016 Authors: HQ Office of the Chief Engineer/Steven Hirshorn and HQ Office of the Chief Technologist/Sharon Jefferies Contributors: ARC/Kenny Vassigh, AFRC/David Voracek, GSFC/Michael Johnson, GSFC/Deborah Amato, JPL/Margaret (Peg) Frerking, JPL/Pat Beauchamp, JSC/Ronnie Clayton, KSC/Doug Willard, LaRC/Jim Dempsey, LaRC/Bill Luck, MSFC/Mike Tinker, SSC/Curtis (Duane) Armstrong NASA Technology Readiness Assessment (TRA) Study Team Acknowledgements The authors of this report wish to acknowledge and thank the members of the Technology Readiness Assessment (TRA) team for their participation, dedication, effort, hard work and brilliant insights throughout the course of this study. We deeply appreciate their willingness to contribute their knowledge, experience, and time, which was the fundamental attribute leading to the success of this study. You all have been brilliant!! Disclaimer The purpose of this report is to document the observations, findings, and recommendations of the NASA-wide Technology Readiness Assessment (TRA) team that conducted its work in 2014. While suggested guidance and recommendations are included, the contents of this report should not be construed as Agency-accepted practice. Establishment of an Agency-accepted practice on TRA may eventually stem from the report’s contents, but at this time the report simply constitutes an outbriefing of the team’s activities. 2 of 63 NASA Technology -
956830 Deliverable D2.1 Initial Vision and Requirement Report
European Core Technologies for future connectivity systems and components Call/Topic: H2020 ICT-42-2020 Grant Agreement Number: 956830 Deliverable D2.1 Initial vision and requirement report Deliverable type: Report WP number and title: WP2 (Strategy, vision, and requirements) Dissemination level: Public Due date: 31.12.2020 Lead beneficiary: EAB Lead author(s): Fredrik Tillman (EAB), Björn Ekelund (EAB) Contributing partners: Yaning Zou (TUD), Uta Schneider (TUD), Alexandros Kaloxylos (5G IA), Patrick Cogez (AENEAS), Mohand Achouche (IIIV/Nokia), Werner Mohr (IIIV/Nokia), Frank Hofmann (BOSCH), Didier Belot (CEA), Jochen Koszescha (IFAG), Jacques Magen (AUS), Piet Wambacq (IMEC), Björn Debaillie (IMEC), Patrick Pype (NXP), Frederic Gianesello (ST), Raphael Bingert (ST) Reviewers: Mohand Achouche (IIIV/Nokia), Jacques Magen (AUS), Yaning Zou (TUD), Alexandros Kaloxylos (5G IA), Frank Hofmann (BOSCH), Piet Wambacq (IMEC), Patrick Cogez (AENEAS) D 2.1 – Initial vision and requirement report Document History Version Date Author/Editor Description 0.1 05.11.2020 Fredrik Tillman (EAB) Outline and contributors 0.2 19.11.2020 All contributors First complete draft 0.3 18.12.2020 All contributors Second complete draft 0.4 21.12.2020 Björn Ekelund Third complete draft 1.0 21.12.2020 Fredrik Tillman (EAB) Final version List of Abbreviations Abbreviation Denotation 5G 5th Generation of wireless communication 5G PPP The 5G infrastructure Public Private Partnership 6G 6th Generation of wireless communication AI Artificial Intelligence ASIC Application -
TECHNOLOGY and INNOVATION REPORT 2021 Catching Technological Waves Innovation with Equity
UNITED NATIONS CONFERENCE ON TRADE AND DEVELOPMENT TECHNOLOGY AND INNOVATION REPORT 2021 Catching technological waves Innovation with equity Geneva, 2021 © 2021, United Nations All rights reserved worldwide Requests to reproduce excerpts or to photocopy should be addressed to the Copyright Clearance Center at copyright.com. All other queries on rights and licences, including subsidiary rights, should be addressed to: United Nations Publications 405 East 42nd Street New York, New York 10017 United States of America Email: [email protected] Website: https://shop.un.org/ The designations employed and the presentation of material on any map in this work do not imply the expression of any opinion whatsoever on the part of the United Nations concerning the legal status of any country, territory, city or area or of its authorities, or concerning the delimitation of its frontiers or boundaries. This publication has been edited externally. United Nations publication issued by the United Nations Conference on Trade and Development. UNCTAD/TIR/2020 ISBN: 978-92-1-113012-6 eISBN: 978-92-1-005658-8 ISSN: 2076-2917 eISSN: 2224-882X Sales No. E.21.II.D.8 ii TECHNOLOGY AND INNOVATION REPORT 2021 CATCHING TECHNOLOGICAL WAVES Innovation with equity NOTE Within the UNCTAD Division on Technology and Logistics, the STI Policy Section carries out policy- oriented analytical work on the impact of innovation and new and emerging technologies on sustainable development, with a particular focus on the opportunities and challenges for developing countries. It is responsible for the Technology and Innovation Report, which seeks to address issues in science, technology and innovation that are topical and important for developing countries, and to do so in a comprehensive way with an emphasis on policy-relevant analysis and conclusions.