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Henkel Electronic Solutions Worldwide Manufacturing Table of Contents

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Henkel Electronic Solutions Worldwide Manufacturing Table of Contents Henkel Electronic Solutions Worldwide Manufacturing Table of Contents The electronics group of Henkel is the world’s Lead-Free Solutions 1 true global supplier of materials solutions for electronic packaging and assembly. Packaging Materials Die Attach Adhesives 2-4 Emphasizing compatibility between Underfills 5-6 materials from wafer-level to Encapsulants 7-8 board-level and final assembly, Henkel delivers a wide range of Chip-On-Board Glob Tops 9 off-the-shelf and custom-developed Non-Conductive Pastes 10 solutions to respond to every Semiconductor Molding Compounds 11-12 requirement of your application. Optoelectronic Materials 13-14 The Henkel portfolio brings you Electronic Coating Powders 15 industry leading brands: Hysol® Electronic Molding Compounds 16 semiconductor and electronic and cost-effective turnaround. This is materials, Loctite® adhesives and just one facet of the Henkel experience Board Level Assembly Materials phase change thermal interface that will give you the edge over your Underfills & Encapsulants 5-8 materials and Multicore® solder competition. products. Each maintains the lead in Phase Change Thermal Interface Materials 17-18 its field through continuous, targeted Henkel is directly represented in more Thermal Management Adhesives 19-20 research and development, backed by than 80 countries. We deliver Solder & Flux Materials 21-25 Henkel’s continuing reinvestment. Our consistent products and superior Electrically Conductive Adhesives 26 network of research laboratories technical support, no matter where positions key resources close to our you are located. We provide the Surface Mount Adhesives 27-28 customers in all territories, with responsiveness and flexibility of a Circuit Board Protection 29-32 capabilities including accurate focused specialist, combined with the Low Pressure Molding 33-34 modeling and simulation for rapid strength of one of the world’s largest Solution Circuit Board 35-36 specialty chemicals corporations – our parent company, Henkel KGaA. Global Locations 37 Your business choices just became stronger. electronics.henkel.com ® MATERIALS Lead-Free Solutions Hysol Die Attach Adhesives PACKAGING The elimination of lead and other hazardous substances from Elevated lead-free processing temperatures demand electronic electronic packaging and assembly materials is making much packaging materials that can withstand polymer decomposition existing knowledge and characterization data obsolete. during reflow, increased interfacial stresses, and adhesive and cohesive strength. Henkel recognized this fact early, of no-clean flux residues that will Lead-free processing capability is Designed to deliver superior and is already leading the race to not crack after thermal shock or achieved by using Hysol® patented quality and reliability, Hysol® die acquire the necessary data and thermal cycling. BMI chemistry which allows for attach adhesives have won a re-qualify material sets. As a true • Hysol® liquid encapsulants are lower moisture absorption, lower number of supplier quality solutions provider, we believe it is designed to withstand up to 260°C stress, and higher adhesion to awards. Several products are essential for us to do this for our peak solder reflow temperatures gold and preplated leadframes formulated with PTFE, an without degradation, and meet compared to older epoxy extremely low dielectric constant customers. Henkel delivers turnkey JEDEC Level 2A standards. Henkel materials are compatible solutions, including the technical technology. Newer no/low bleed material that will not abrade with conventional oven cure as and engineering support crucial to •Hysol® molding compounds meet formulations are providing the polyimide and other die well as Snap Cure. You can also use flammability requirements without your process engineers. We will not performance that today’s smaller passivation. SkipCure™ and SkipPrebake™[*]. the use of antimony, bromine, or package designs and thinner die leave you to fill in the blanks. phosphorous flame retardant Our organic products can also be compounds. They provide excellent requirements demand. Our fast reaction kinetics and converted to their CCSP™ Henkel’s ‘Lead-Free That Works’ long term high temperature solvent-free formulation enable (Controlled Collapse Spacer Paste) initiative is ready for action, performance and lead-free processing Based on the ultra-hydrophobic inline SkipCure™ processing that versions without changing the for packaging a variety of power minimizes the risks of conversion, chemistry, Bismaleimide (BMI), increases throughput in Units Per base paste properties. The ability devices, sensors, ICs, and passive Hysol® die attach adhesives offer Hour (UPH) for adhesive cure, and gives you the confidence to components. to exercise these three options, introduce new lead-free products very high adhesive strength, eliminates the need for separate SkipCure™, SkipPrebake™, and elongation at break, and cohesive curing equipment, and decreases and processes quickly, in high CHALLENGE OF spacers at zero or minimal energy at high reflow package warpage. Our adhesives volumes, and at high quality from 260°C PROCESSING switching costs reduces both the temperatures. These properties for organic substrates eliminate the outset. The Henkel range By striving to continuously cost of use and the cost of help electronic packages retain substrate prebaking, while our includes lead-free solder, as well as improve the JEDEC performance ownership you will experience. adhesive strength and structural patented polymeric spacers deliver materials for board-level assembley of our packaging materials, we integrity during moisture soak consistent bondline thickness, such as surface mount adhesives, have acquired an in-depth and absorb stresses during the reduce tilt, and enable high UPHs conformal coating, underfill and understanding of the increased * For products designed for organic deformations associated with lead- for die placement. potting materials. In addition, interactions between all packaging laminates. free reflow processing. Henkel offers lead-free components at the higher semiconductor materials including processing temperatures required die attach, mold compounds, by lead-free applications. Our With spacer die underfill, and liquid encapsulants experienced research and for semiconductors and other technical service professionals, components. equipped with the most advanced analytical resources, are ready to • Multicore® solder materials offer a work with you to accurately map variety of solder paste, flux and these interactions and thereby combinations to greatly accelerate multiple cored wires for use in lead- free applications. maximize the reliability, stability, your development project. Our With spacer paste and performance of components advanced techniques include finite • Hysol® die attach adhesives offer and assemblies. element modeling and acoustic very high adhesion strength and elongation at lead-free solder reflow microscopy, for example. temperatures to ensure the entire Using our knowledge throughout package will not crack or popcorn. all phases of package • Hysol® fast-flow underfill materials development, you can quickly Eliminates the need for dummy die in the stack by offer excellent adhesion to a variety identify optimal material using spacers in the adhesive. 1 electronics.henkel.com 2 MATERIALS ® ® MATERIALS PACKAGING Hysol Die Adhesives for Non-Hermetic Packages Hysol Die Adhesives for Non-Hermetic Packages PACKAGING For organic substrates including laminates, array, BGA and CSP packages For substrates including Cu, Pd, Ag & Au plating, ceramic, and black oxide CONTINUED Product Description/Application Filler Thermal Tg CTE Modulus @ Viscosity Oven Cure/SkipCureTM Product Description/Application Filler Oven Cure/SkipCureTM Viscosity Thermal Tg CTE Modulus α α Conductivity (°C) 1/ 2 25°C 5 rpm @ 25°C 5 rpm @ 25°C Conductivity (°C) α1/α2 @ 25°C QMI536™ Industry standard for die-to-die PTFE 0.3 W/mK -31 93 0.3 GPa 8,500 cps 15 min @ 150°C Oven K00125™ General purpose silver-filled epoxy for Silver 15 min @ 150°C Oven 9,200 cps 2.1 W/mK 96 65 4.0 GPa bonding, dielectric, high adhesive 174 10 s @ 150°C SkipCureTM general bonding purposes that require (No SkipCureTM) 130 strength. electrical and thermal conductivity. QMI536HT™ High thermal version of QMI536 for Boron 0.9 W/mK 4 66 0.9 GPa 13,000 cps 15 min @ 150°C Oven mixed stacked die applications and Nitride 177 10 s @ 150°C SkipCureTM QMI534™ Non-Conductive, small die non-conductive, PTFE 15 min @ 175°C Oven 9,000 cps 0.4 W/mK -35 87 0.30 GPa single die BGA. very high adhesive strength on metal 10 s @ 200°C SkipCureTM 171 substates for die sizes less than 500x500 QMI550SI™ Low CTE version of QMI550 for low Silica 0.6 W/mK 42 36 1.5 GPa 17,000 cps 15 min @ 150°C Oven mil./13x13 mm. TM shrinkage and low warpage on laminate 90 10 s @ 150°C SkipCure QMI536UV™ UV Cure – CCD/CMOS glass lid sealing non- PTFE 10 s @ 2500mW 6,700 cps 0.3 W/mK 26 62 0.70 GPa and flex substrates. conductive, UV curing resin with excellent 136 QMI538NB™ Very low stress dielectric die attach for PTFE 0.3 W/mK -70 85 0.1 GPa 8,500 cps 15 min @ 175°C Oven adhesion to glass. Ideal for glass lid-sealing SCSP. 149 10 s @ 200°C SkipCureTM CCD or CMOS lenses. QMI538NB™ No Bleed, large die non-conductive, very low PTFE 15 min @ 175°C Oven 8,500 cps 0.3W/mK -70 85 0.10 GPa QMI600™ For stacked die applications where the Silica 0.6 W/mK 74 31 9.3 GPa 10,200 cps 15 min @ 175°C Oven TM stress QMI600 on metal substates for die 10 s @ 200°C SC 149 bonding wires go through the die attach 95 10 s @ 175°C SkipCure sizes greater than 500x500 mil./13x13 mm. paste and mold compound. ® For substrates including Cu, Pd, Ag & Au plating, ceramic, and black oxide Hysol Die Adhesives for Hermetic Packages Product Description/Application Resin Filler Recommended Cure Viscosity 5 Thermal Tg CTE Modulus Storage Product Description/Application Filler Thermal Tg CTE Modulus @ Viscosity Oven Cure/SkipCureTM rpm @ 25°C Conductivity (°C) α1/α2 @ 25°C Temp Conductivity (°C) α1/α2 25°C 5 rpm @ 25°C QMI2419™ No-dry Ag glass die attach for glass- Glass/ Silver See ramp profile 27,000 cps >60 W/mK 300 21 15.1 GPa RT on sealed packages.
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