Building Forward Together

上海市浦东新区张江高科技园区芳春路300号 (201203) High Performance for Mobile Applications 新北市中和區建一路 號 樓 and IoT Devices

北京市海淀区上地东路1号盈创动力大厦E座801室(100085)

深圳市南山区科技园南区高新南七道数字技术园 A1栋2楼C区 (518057) SMARC ®

Smallest Computer-on-Module Form Factor: Short Size and Full Size Modules

〒101-0045 東京都千代田区神田鍛冶町3-7-4 神田374ビル4F

137-881 서울시 서초구 서초대로 326, 802 (서초동, 모인터빌딩)

www.adlinktech.com 2016 SMARC Overview

ADLINK provides a wide range of embedded computing products and ser- Low power designs vices to the test & measurement, automation & process control, gaming, com- munications, medical, network security, and transportation industries. AD- • 2W to 6W typical module power draw during LINK products include those based on various computer-on-modules (COMs) • active operation standards like SMARC (Smart Mobility ARCHitecture). As an initial member of • Fanless • Passive cooling SGeT (Standardization Group for Embedded Technologies), ADLINK has pio- • Low standby power neered on the development of SMARC modules. SMARC is a versatile small • Designed for battery operation form factor computer module deinition targeting applications that require • 1.8V default I/O voltage ultra low power, low cost and high performance. SMARC modules are used as building blocks for portable and stationary embedded systems. SMARC modules can also be used in conjunction with carrier boards that implement application speciic features such as audio codecs, touch controllers, wireless devices, etc. This modular approach allows scalability, faster time to market and performance diversiication while maintaining lower costs, low power and small physical size.

The SMARC pin-out is optimized for features common to ARM and SOCs rath- er than those of the current x86 architecture. Some of these ARM/SOC fea- tures include parallel LCD display interfaces, provisions for serial and parallel camera input, multiple I²C, I²S and serial port options, USB client/host mode operation, and SD/eMMC card operation. The SMARC speciication, with its 314-pin board to board edge connector, is future proof by ofering addition- Model Name LEC-Starter Kit R1 al space for modern interfaces found on today’s devices such as LVDS, PCIe, SATA, HDMI and DisplayPort. Using SMARC, systems integrators can take full • SMARC compliant LEC-BASE R1 carrier board advantage of the user-interface options available to mobile device OEMs; op- • 7” lat panel 800 x 400 display with assembly and USB tions that are not usually found in x86-based embedded-computing systems. touch cable LEC is ADLINK’s brand name for SMARC products. It means “Low Energy Com- Features • SD card and USB stick puter-on-module” and is a new ADLINK product line. • Interface cables (one way open) for camera, GPIO, power management, I2S and SPI Because of its I/O lexibility and focus on ARM solutions, SMARC provides the • AC/DC adapter, power cord and universal socket support needed to build scalable solutions. Integrators can choose from a wide variety of processing options, from low-power single core devices. Optional Compatible Modules: LEC-iMX6, LEC-iMX6/GbE Items

SMARC pinout Ordering LEC-Starter Kit R1 with LEC-BASE carrier board, including SD Information card and power supply (LEC-iMX6 modules optional)

Model Name LEC-Starter Kit R2 • Up to 3 independent displays • Parallel LCD, LVDS, HDMI/DP • LCD support: panel & backlight enable, power management • SMARC compliant LEC-BASE R1 carrier board • SD card and USB stick • Up to 2 independent cameras Features • Interface cables (one way open) for camera, GPIO, power • Parallel and MIPI CSI serial cameras management, SPI, I²C and LVDS • 1x GbE • AC/DC adapter, power cord and universal socket • 3x PCIe x1 with support signals • 3x USB2.0, one is USB2.0 OTG/client • 1x SATA • Modules: LEC-BT, LEC-BTS or LEC-BW • 1x SDIO Optional • Heatsink: for LEC-BT, LEC-BTS or LEC-BW • 1x eMMC (may be boot device) Items • Software: BSP depending on operating system • 2x SPI, 3x I2S, 4x I2C, 1x S/PDIF • 4x serial (2x 2-wire, 2x 4-wire) • 2x CAN • 12x GPIO LEC-Starter Kit R2 with LEC-BASE carrier board, including SD Ordering • Boot select, force recovery, watchdog, power management card and power supply (LEC-BT, LEC-BTS or LEC-BW module Information • AFB: pin assignment is dependent on module use case and cooling solution optional) (e.g. USB3.0, GbE, SATA, ieldbus) Selection Guide Building Forward Together

Selection Guide

x86-based ARM-based

form factor computer module deinition targeting applications that require

application speciic features such as audio codecs, touch controllers, wireless and performance diversiication while maintaining lower costs, low power Model Name LEC-BW LEC-BT LEC-BTS LEC-iMX6 LEC-iMX6/2GbE

Form Factor & SMARC short size, SMARC full size, SMARC short size, SMARC short size, SMARC short size, Compatibillity 82 x 50 mm 82 x 80 mm 82 x 50 mm 82 x 50 mm 82 x 50 mm

Intel® Celeron™/ Intel® Atom™ Intel® Atom™ Freescale i.MX6 Freescale i.MX6 CPU Pentium™ N3000 Processor Processor Quad, Dual, DualLite Quad, Dual operation, and SD/eMMC card operation. The SMARC speciication, with its series Series SoC E3800 series SoC E3800 series SoC and Solo Processors Processors 314-pin board to board edge connector, is future proof by ofering addition

Up to 8GB DDR3L at Up to 4GB DDR3L at Up to 8GB DDR3L at Up to 4GB DDR3L at Up to 4GB DDR3L at Memory 1333/1066 MHz with 1333/1066 MHz • 7” lat panel 800 x 400 display with assembly and USB 1600 MT/s 1066 MHz 1066 MHz ECC without ECC

Cache L2: 2 MB L2: 512 kB to 2 MB L2: 512 kB to 2 MB L2: 512kB to 1 MB L2: 512kB to 1 MB

Because of its I/O lexibility and focus on ARM solutions, SMARC provides the Boot Loader AMI UEFI BIOS AMI UEFI BIOS AMI UEFI BIOS U-Boot U-Boot

Connectivity 10/100/1000 GbE 10/100/1000 GbE 10/100/1000 GbE 10/100/1000 GbE 2x 10/100/1000 GbE

1x USB 3.0 host 1x USB 3.0 host 1x USB 3.0 host 2x USB 2.0 host 2x USB 2.0 host USB 2x USB 2.0 host 2x USB 2.0 host 2x USB 2.0 host 1x USB 2.0 OTG 1x USB 2.0 OTG 1x USB 2.0 client 1x USB 2.0 client 1x USB 2.0 client

1x SATA 3Gbit/s 1x SATA 3Gbit/s 2x SATA 6Gbit/s 2x SATA 3Gbit/s 2x SATA 3Gbit/s (Quad and Dual only) (Quad and Dual only) Storage 1x SDIO/SD 1x SDIO/SD 1x SDIO/SD 1x SDIO/SD 1x SDIO/SD 1x eMMC 1x eMMC 1x eMMC 1x eMMC

Located on carrier Located on carrier Audio HDA HDA HDA S/PDIF S/PDIF

PCI Express 3x PCIe x1 3x PCIe x1 3x PCIe x1 1x PCIe x1 -

SEMA Support Yes Yes Yes Yes Yes

3.0 V-5.25 V 3.0 V-5.25 V 3.0 V-5.25 V 3.0 V-5.25 V 3.0 V-5.25 V Power Supply DC ±5% DC ±5% DC ±5% DC ±5% DC ±5%

Operating 0°C to +60°C 0°C to +60°C 0°C to +60°C 0°C to +60°C 0°C to +60°C Temperature -40°C to +85°C -40°C to +85°C -40°C to +85°C -40°C to +85°C

Linux, VxWorks, Linux, VxWorks, Windows 7, 8.1, 10, Linux, Android, Linux, Android, BSP Support Android, Android, Yocto Linux, Android WEC7, QNX WEC7, QNX Windows 7/8, WEC7 Windows 7/8, WEC7

Note: All specifications are subject to change without further notice.

(e.g. USB3.0, GbE, SATA, ieldbus)

2016/03/02-1 WORLDWIDE OFFICES

ADLINK Technology, Inc. ADLINK Technology (China) Co., Ltd. 9F, No.166 Jian Yi Road, Zhonghe District 上海市浦东新区张江高科技园区芳春路300号 (201203) New City 235, Taiwan 300 Fang Chun Rd., Zhangjiang Hi-Tech Park 新北市中和區建一路166號9樓 Pudong New Area, , 201203 China Tel: +886-2-8226-5877 Tel: +86-21-5132-8988 Fax: +886-2-8226-5717 Fax: +86-21-5192-3588 Email: [email protected] Email: [email protected]

Ampro ADLINK Technology, Inc. ADLINK Technology 5215 Hellyer Avenue, #110 San Jose, CA 95138, USA 北京市海淀区上地东路1号盈创动力大厦E座801室(100085) Tel: +1-408-360-0200 Rm. 801, Power Creative E, No. 1 Shang Di East Rd. Toll Free: +1-800-966-5200 (USA only) Beijing, 100085 China Fax: +1-408-360-0222 Tel: +86-10-5885-8666 Email: [email protected] Fax: +86-10-5885-8626 Email: [email protected] ADLINK Technology Pte. Ltd. ADLINK Technology 84 Genting Lane #07-02A, Cityneon Design Centre, 深圳市南山区科技园南区高新南七道数字技术园 Singapore 349584 A1栋2楼C区 (518057) Tel: +65-6844-2261 2F, C Block, Bldg. A1, Cyber-Tech Zone, Gao Xin Ave. Sec. 7 Fax: +65-6844-2263 High-Tech Industrial Park S., Shenzhen, 518054 China Email: [email protected] Tel: +86-755-2643-4858 Fax: +86-755-2664-6353 Email: [email protected]

ADLINK Technology Singapore Pte Ltd. LiPPERT ADLINK Technology GmbH (Indian Liaison Office) Hans-Thoma-Strasse 11, D-68163 Mannheim, Germany Tel: +49 621 43214-0 #50-56, First Floor, Spearhead Towers Fax: +49 621 43214-30 Margosa Main Road (between 16th/17th Cross) Email: [email protected] Malleswaram, Bangalore - 560 055, India Tel: +91-80-65605817, +91-80-42246107 Fax: +91-80-23464606 Email: [email protected] ADLINK Technology Japan Corporation ADLINK Technology, Inc. 〒101-0045 東京都千代田区神田鍛冶町3-7-4 (French Liaison Office) 神田374ビル4F 6 allée de Londres, Immeuble Ceylan 91940 Les Ulis, France KANDA374 Bldg. 4F, 3-7-4 Kanda Kajicho, Tel: +33 (0) 1 60 12 35 66 Chiyoda-ku, 101-0045, Japan Fax: +33 (0) 1 60 12 35 66 Tel: +81-3-4455-3722 Email: [email protected] Fax: +81-3-5209-6013 Email: [email protected]

ADLINK Technology, Inc. ADLINK Technology, Inc. (Korean Liaison Office) (Israel Liaison Office) 137-881 서울시 서초구 서초대로 326, 802 (서초동, 모인터빌딩) 27 Maskit St., Corex Building PO Box 12777 802, Mointer B/D, 326 Seocho-daero, Seocho-Gu, Herzliya 4673300, Israel 137-881, Korea Tel: +972-54-632-5251 Tel: +82-2-2057-0565 Fax: +972-77-208-0230 Toll Free +82-80-800-0585 Email: [email protected] Email: [email protected]

PENTA ADLINK Technology GmbH ADLINK Technology, Inc. Ulrichsbergerstrasse 17 (UK Liaison Office) 94469 Deggendorf, Germany Tel: +44 774 010 59 65 Tel: +49 (0) 991 290 94 – 10 Email: [email protected] Fax: +49 (0) 991 290 94 - 29 Email: [email protected]