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New Possibilities for Building High-Vacuum Chambers Using Glued Aluminum Plates and Application to Sputtered Nanocomposite Coatings

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New Possibilities for Building High-Vacuum Chambers Using Glued Aluminum Plates and Application to Sputtered Nanocomposite Coatings Khaleel N. Abu Shgair New Possibilities for Building High-Vacuum Chambers Using Glued Aluminum Plates and Application to Sputtered Nanocomposite Coatings New Possibilities for Building High-Vacuum Chambers Using Glued Aluminum Plates and Application to Sputtered Nanocomposite Coatings Vom Fachbereich Maschinenbau und Verfahrenstechnik der Universität Kaiserslautern zur Verleihung des akademischen Grades Doktor-Ingenieur (Dr.-Ing.) Genehmigte Dissertation Vorgelegt von M. Sc. Khaleel Abu Shgair aus Kufer Elma (Jordan) D386 Prüfungsvorsitz: Prof. Dr. rer. nat. C. W. Dankwort Referent: Prof. Dr.-Ing. R. Haberland Koreferent: Prof. Dr.-Ing. W. Brockmann Dekan Prof. Dr. tech. Hans-Jörg Bart Tag der mündlichen Prüfung: 25.11.2002 Preface This thesis has been written between 1999 and 2002 during my work period as research assistance at the Department of Precision Engineering (Lehrstuhl für Feinwerktechnik) at the University of Kaiserslautern, Germany. First of all, I would like to express my sincere gratitude to my supervisor Prof. Dr.- Ing. R. Haberland, without his assistance, insights, fruitful advice, generous support and persistence this work would not be complete. I also thank Prof. Dr.-Ing. W. Brockmann for his responsibility as reviewer. I also thank Prof. Dr. rer. nat. C. W. Dankwort for his chairmanship of the board of the examiners. Furthermore, I would like to thank all my colleagues at the University Kaiserslautern who contributed to this work. Especially A. Maier and R. Gausmann for their time and help. Finally, I would like to express my deep gratitude and great respect to my parents, family and friends who encouraged and supported me. Kaiserslautern, November 2002 Khaleel Abu Shgair Contents CONTENTS CONTENTS....................................................................................... I ZUSAMMENFASSUNG.................................................................. V SYMBOLS..................................................................................... VII 1. INTRODUCTION....................................................................1 1.1. Study Objects ..........................................................................................................1 1.2. Vacuum Technology................................................................................................2 1.2.1. Kinetic Picture of a Gas...................................................................................2 1.2.2. Mean Free Path ...............................................................................................3 1.2.3. Outgassing ......................................................................................................4 1.2.3.1. Adsorbed Gas ..........................................................................................4 1.2.3.2. Dissolved Gas..........................................................................................5 1.2.3.3. Vaporization of Materials ........................................................................5 1.2.3.4. Permeability of Gas Through Walls .........................................................6 1.2.4. Chamber Evacuation and Pumping Speed........................................................6 1.3. Thin Film Coating Technology................................................................................7 1.3.1. Basic Aspects of Sputtering.............................................................................7 1.3.2. Thin Film Formation .......................................................................................8 1.3.3. Coating Structure and Characterization..........................................................10 1.3.4. Coatings Analysis..........................................................................................12 1.3.4.1. Secondary neutral particle mass spectrometry (SNMS)..........................13 1.3.4.2. X-Ray-diffraction (XRD).......................................................................14 1.4. Bonding Technology..............................................................................................14 1.4.1. Fundamentals of Bonding Technology ..........................................................15 1.4.2. Types of Bonding Materials...........................................................................16 I Contents 1.4.2.1. Epoxy adhesives ....................................................................................16 1.4.2.2. Polyurethane Adhesives.........................................................................16 1.4.2.3. Acrylate Adhesives................................................................................17 1.4.2.4. Phenolic Resins .....................................................................................17 1.4.2.5. Modified Silane Polymers......................................................................17 2. OUTGASSING TEST ............................................................18 2.1. Introduction to Outgassing....................................................................................18 2.2. Vacuum Materials.................................................................................................18 2.3. Literature..............................................................................................................19 2.4. Outgassing Test Stand...........................................................................................21 2.5. Experimental Procedure........................................................................................22 2.6. Outgassing Results................................................................................................22 2.7. Discussion and Conclusion ...................................................................................33 3. VACUUM CHAMBER DESIGN..........................................37 3.1. Introduction to Vacuum Chamber Design..............................................................37 3.2. Design and Mechanical Load Of The Chamber .....................................................37 3.2.1. Design Constraints ........................................................................................37 3.2.2. Mechanical Properties of the Vacuum Chamber ............................................38 3.3. Glue Selection and Tests .......................................................................................39 3.4. Workpiece Transportation System .........................................................................47 3.5. Assembly of the Chamber......................................................................................48 3.6. Pumping System....................................................................................................51 3.7. DC-Sputtering Magnetron.....................................................................................51 4. DEPOSITION OF NANOCOMPOSITE (Ti, Si, Al)N COATINGS .....................................................................................53 4.1. Introduction to Sputtering Process ........................................................................53 II Contents 4.2. Sputtering Process ................................................................................................53 4.2.1. Sputtering Mechanisms .................................................................................53 4.2.2. Interactions of Ion Approached the Surface of a Target .................................54 4.2.3. Sputtering Advantages...................................................................................55 4.2.4. Sputtering Techniques ...................................................................................56 4.2.4.1. Non-Reactive Sputtering Processes........................................................56 4.2.4.2. Reactive Sputtering Processes................................................................57 4.2.4.3. Diode Sputtering....................................................................................57 4.2.4.4. RF Sputtering ........................................................................................57 4.2.4.5. Triode Sputtering...................................................................................58 4.2.4.6. Magnetron Sputtering ............................................................................58 4.2.4.7. Unbalanced Magnetron Sputtering.........................................................59 4.3. Deposition of Hard Coatings.................................................................................60 4.3.1. Types of Hard Coatings.................................................................................61 4.3.1.1. Multicomponent Coatings......................................................................61 4.3.1.2. Multilayer Coatings ...............................................................................61 4.3.1.3. Nanocomposite Hard Coatings...............................................................62 4.4. Characteristics and Properties of Hard Coatings..................................................64 4.4.1. Hardness .......................................................................................................64 4.4.2. High Temperature Oxidation .........................................................................65 4.4.3. Friction and Wear..........................................................................................66 4.4.4. Other Selected Properties of Coatings............................................................66
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