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Datasheet SHT21S Humidity and Temperature Sensor

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Datasheet SHT21S Humidity and Temperature Sensor Datasheet SHT21S Humidity and Temperature Sensor Fully calibrated SDM interface convertible to analog output Low power consumption Excellent long term stability DFN type package – reflow solderable Product Summary SHT21S, the new humidity and temperature sensor of SDM signal is a pulse sequence that with a low pass filter Sensirion is about to set new standards in terms of size may be converted into analog voltage output. The data and intelligence: Embedded in a reflow solderable Dual signal is provided on SDA line. Pulling SCL high or low Flat No leads (DFN) package of 3 x 3mm foot print and allows for switching between humidity and temperature, 1.1mm height it provides calibrated, linearized signals in respectively. The sensor measures the physical values analog Sigma Delta Modulated (SDM) format. twice per second. With a completely new designed CMOSens® chip, a Every sensor is individually calibrated and tested. Lot reworked capacitive type humidity sensor and an identification is printed on the sensor. improved band gap temperature sensor the performance With made improvements and the miniaturization of the level has been lifted even beyond the outstanding sensor the performance-to-price ratio has been improved. reliability level of the previous sensor generation (SHT1x SHT21 is also available with digital I2C or PWM interface. and SHT7x). For example, measures have been taken to stabilize the behavior at high humidity levels. Dimensions Sensor Chip 3.0 SHT21S feature a generation 4C CMOSens® chip. 0.3 typ Besides the capacitive relative humidity sensor and the band gap temperature sensor, the chip contains an 3.0 typ amplifier, A/D converter, OTP memory and a digital 1.4 1.4 2.0 typ processing unit. 0AC4 S 0.8SHT21 typ 2.2 1.1 Material Contents 0.2 While the sensor itself is made of Silicon the sensors’ Bottom View housing consists of a plated Cu lead-frame and green epoxy-based mold compound. The device is free of Pb, Cd 0.4 0.3 NC VDD SCL and Hg – hence it is fully RoHS and WEEE compliant. 0.75 0.4 2.4 1.5 Additional Information Additional information such as Application Notes is 1.0 1.0 NC VSS SDA available from the web page www.sensirion.com/sht21. For more information please contact Sensirion via Figure 1: Drawing of SHT21S sensor package, dimensions [email protected]. are given in mm (1mm = 0.039inch), tolerances are ±0.1mm. NC and die pad (center pad) are internally connected to VSS. They may be left floating. Numbering of E/O pads starts at lower right corner (indicated by notch in die pad) and goes clockwise (compare Table 2). www.sensirion.com Version 1.1 – May 2010 1/9 Sensor Performance Relative Humidity123 Temperature456 Parameter Condition min typ max Units Parameter Condition min typ max Units Resolution 12 bit 0.04 %RH Resolution 14 bit 0.01 °C Accuracy typ 2.0 %RH Accuracy typ 0.3 °C tolerance 1 max see Figure 2 %RH tolerance 1 max see Figure 3 °C Repeatability 0.1 %RH Repeatability 0.1 °C Hysteresis 1 %RH -40 125 °C Operating Range extended 3 Nonlinearity <0.1 %RH -40 257 °F Response time 2 63% 8 s Response Time 6 63% 5 30 s Operating Range extended 3 0 100 %RH Long Term Drift < 0.04 °C/yr Long Term Drift 4 normal < 0.5 %RH/yr RH (%RH) T (°C) ± 10 ± 3.0 maximal tolerance maximal tolerance ± 2.5 ± 8 typical tolerance typical tolerance ± 2.0 ± 6 ± 1.5 ± 4 ± 1.0 ± 2 ± 0.5 ± 0.0 ± 0 -40 -20 0 20 40 60 80 100 120 0 10 20 30 40 50 60 70 80 90 100 Relative Humidity (%RH) Temperature (°C) Figure 2 Typical and maximal tolerance at 25°C for relative Figure 3 Maximal temperature accuracy tolerance. For elec- humidity. For extensive information see Users Guide, Sect. 1.2. tronic impacts on accuracy please consult Sect. 5.3. For electronic impacts on accuracy please consult Sect. 5.3. Electrical Specification Packaging Information Sensor Type Packaging Quantity Order Number Parameter Condition min typ max Units Tape & Reel 400 1-100718-01 Supply Voltage, VDD 2.1 3.0 3.6 V SHT21S Tape & Reel 1500 1-100697-01 Supply Current, IDD 5 160 µA Tape & Reel 5000 1-100696-01 Power Dissipation 5 0.48 mW Measurement 2 Hz Frequency Switch RH/T on SDA SCL up RH; SCL down T Table 1 Electrical specification. For absolute maximum values see Chapter 3 of Users Guide. This datasheet is subject to change and may be amended without prior notice. 1 Accuracies are tested at Outgoing Quality Control at 25°C (77°F) and 3.0V. Values exclude hysteresis and long term drift and are applicable to non- 4 Value may be higher in environments with vaporized solvents, out-gassing condensing environments only. tapes, adhesives, packaging materials, etc. For more details please refer to 2 Time for achieving 63% of a step function, valid at 25°C and 1 m/s airflow. Handling Instructions. 5 3 Normal operating range: 0-80%RH, beyond this limit sensor may read a Values of Supply Current and Power Dissipation are based upon fixed VDD = reversible offset with slow kinetics (<3%RH after 200hours at 90%RH). For more 3.0V and T = 25°C applying a low pass filter as proposed in Sect. 5.3. 6 details please see Section 1.1 of the Users Guide. Response time depends on heat conductivity of sensor substrate. www.sensirion.com Version 1.1 – May 2010 2/9 Users Guide SHT21S 1 Extended Specifications ±2%RH where maximal tolerance is ±3%RH and about half the maximal tolerance at other values. For details on how Sensirion is specifying and testing accuracy performance please consult Application Note “Statement on Sensor Specification”. 2 Application Information 1.1 Operating Range 2.1 Soldering Instructions The sensor works stable within recommended Normal The DFN’s die pad (centre pad) and perimeter I/O pads Range – see Figure 4. Long term exposure to conditions are fabricated from a planar copper lead-frame by over- outside Normal Range, especially at humidity >80%RH, molding leaving the die pad and I/O pads exposed for may temporarily offset the RH signal (+3%RH after 60h). mechanical and electrical connection. Both the I/O pads After return into the Normal Range it will slowly return and die pad should be soldered to the PCB. In order to towards calibration state by itself. See Section 2.3 “Recon- prevent oxidation and optimize soldering, the bottom side ditioning Procedure” for eliminating the offset. Prolonged of the sensor pads is plated with Ni/Pd/Au. exposure to extreme conditions may accelerate ageing. On the PCB the I/O lands7 should be 0.2mm longer than 100 the package I/O pads. Inward corners may be rounded to match the I/O pad shape. The I/O land width should match 80 the DFN-package I/O-pads width 1:1 and the land for the 60 die pad should match 1:1 with the DFN package – see Normal Max. Figure 6. 40 Range Range Relative Humidity (%) The solder mask8 design for the land pattern preferably is 20 of type Non-Solder Mask Defined (NSMD) with solder 0 mask openings larger than metal pads. For NSMD pads, the solder mask opening should be about 120µm to -40 -20 0 20 40 60 80 100 120 Temperature (°C) 150µm larger than the pad size, providing a 60µm to 75µm design clearance between the copper pad and solder Figure 4 Operating Conditions mask. Rounded portions of package pads should have a matching rounded solder mask-opening shape to minimize 1.2 RH accuracy at various temperatures the risk of solder bridging. For the actual pad dimensions, Maximal tolerance for RH accuracy at 25°C is defined in each pad on the PCB should have its own solder mask Figure 2. For other temperatures maximal tolerance has opening with a web of solder mask between adjacent been evaluated to be within limits displayed in Figure 5. pads. 0.4 0.3 100 ±5 0.2 ±6 ±5 ±5 ±7 ±8 ±4 90 0.4 80 0.7 70 60 5 ±4 ±3 ±3 ±3 ±4 ±6 . 2.4 50 1 40 ive Humidity (%RH) Humidity ive 30 0.2 20 ±6 ±5 ±5 Relat 10 ±4 ±7 1.0 1.0 0 ±5 Figure 6 Recommended metal land pattern for SHT2x. Values 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 in mm. Die pad (centre pad) and NC pads may be left floating or be connected to ground. The outer dotted line represents the Temperature (°C) outer dimension of the DFN package. Figure 5 Maximal tolerance of relative humidity measurements given in %RH for temperatures 0 – 80°C. Please note that above values are maximal tolerances (not including hysteresis) against a high precision reference 7 The land pattern is understood to be the metal layer on the PCB, onto which such as a dew point mirror. Typical deviations are at the DFN pads are soldered to. 8 The solder mask is understood to be the insulating layer on top of the PCB covering the connecting lines. www.sensirion.com Version 1.1 – May 2010 3/9 Datasheet SHT21S For solder paste printing a laser-cut, stainless steel stencil with high relative humidity) the soldering pads shall be with electro-polished trapezoidal walls and with 0.125mm sealed (e.g. conformal coating) to prevent loose contacts stencil thickness is recommended.
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