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Yole Développement, System Plus Consulting, Knowmade and PISEO, We Are Pleased to Provide You a Glimpse of Our Knowledge From Technologies to Markets Silicon Photonics and Photonic Integrated Circuits 2019 Market and Technology Report - Sample © 2019 THE AUTHORS Dr. Eric Mounier, Fellow Analyst With more than 20 years experience in MEMS, sensors and photonics applications, markets, and technology analyses, Eric provides in-depth industry insight into MEMS and photonics current and future trends. He is a daily contributor to the development of MEMS and photonics activities at Yole, with a large collection of market and technology reports as well as multiple custom consulting projects: business strategy, identification of investments or acquisition targets, due diligence (buy/sell side), market and technology analyses, cost modelling, technology scouting, etc. Eric has contributed to more than 250 marketing/technological analyses and 80 reports, helping move the MEMS and Si photonics industry forward. Thanks to his extensive knowledge of the MEMS, sensors, and photonics-related industries, Eric is often invited to speak at industry conferences worldwide. Moreover, he has been interviewed and quoted by leading media throughout the world. Prior to working at Yole, Eric held R&D and Marketing positions at CEA Leti in France. Eric has a Semiconductor Engineering degree and a Ph.-D in Optoelectronics from the National Polytechnic Institute of Grenoble. Contact: [email protected] Jean-Louis Malinge Jean-Louis Malinge is an accomplished business management executive with extensive experience as a General Manager and CEO in France and the United States. He also serves on numerous Boards of Directors. He has formulated successful strategies to position or reposition numerous businesses, has led numerous acquisition projects, and also managed the creation of a successful joint-venture in Asia. Jean-Louis is currently a Venture Partner with Arch Venture Partners and is a Director on the boards of EGIDE Group, POET Technologies, and Cailabs. He is also Managing Director of YADAIS, a telecommunications and photonics consulting firm. Jean-Louis was President & CEO of Kotura from 2004 - 2013, when Kotura was acquired by Mellanox. A global leader in silicon photonics, Kotura designs, manufactures, and markets CMOS optical components that are deployed throughout the communications world. Formerly, Jean-Louis served as Vice President - Optical Networking Products for Corning, Inc. Prior to that his experience includes serving as Technology Director with Amphenol and Thompson CSF in France. Jean-Louis’ academic credentials include an Executive M.B.A. from MIT Sloan School in Boston, Massachusetts. He also holds an Engineering degree from the Institut National des Sciences Appliqués in Rennes, France. Silicon Photonics and Photonic Integrated Circuits 2019 Report | www.yole.fr | ©2019 2 LIST OF COMPANIES Acacia, Accelink, Almae, Amazon, AOI, apm, AT&T, Axalume, AXT, Ayar Labs, Broadcom, Broadex, CeliO, Ciena, Cisco, Effect Photonics, Elenio, Emcore, Ericsson, Facebook, Fiberhome, ficonTEC, Finisar, Fujitsu, GCS, Gigalight, GlobalFoundries, Google, HHI, Hisense, HPE, Huawei, III-V Labs, II-VI, Infinera, Innolight, InPact, Inphi, Intel, IQE, JDSU, Juniper, Kaiam, Landmark, Ligentec, Lightwave Logic, LioniX, Lumentum, Luxnet, Luxtera, MACOM, Masimo, Microsoft, Nokia, Northrop Grumman, Novati, NTT, NXP, Oclaro, Oepic, OMMIC, Orange Labs, POET, Ranovus, Rockley, Roshmere, Scintil Photonics, Sentea, ShinEtsu, Sicoya, SiLC, Silex, Silterra, Skorpios, Skywater, Smart Photonics, SOITEC, STMicroelectronics (STM), SunEdison, Synopys, TEEM Photonics, Thales, TrueLight, TSMC, Verizon, VLC Photonics, VPEC, VTT, ZTE and more.. Silicon Photonics and Photonic Integrated Circuits 2019 Report | www.yole.fr | ©2019 3 SCOPE OF THE REPORT ThisYole 2019 Silicon Photonics report also includes other integrated optics platforms: o Silicon photonics o InP o SiN o Glass o Polymer o LiNbO3 o Silica Photonic ICs (or PICs) are manufactured based on various materials and customized manufacturing platforms: Si, InP, Silica, LiNbO3, SiN, polymer, glass. Si photonics, a sub-category of PIC, leverages semiconductor manufacturing infrastructure to combine different photonic functionalities on the same chip. They integrate multiple (at least two) photonic functions, the optical equivalent of electronic ICs. PICs are used for optical functions such as: o Modulation, emission, guiding, filtering, coupling, detecting o Examples of PICs: Luxtera (SiPh) Infinera (InP) LioniX (SiN) TEEM (glass) Lightwave Logic AWG (Silica PLC) LiNbO3 (polymer) Silicon Photonics and Photonic Integrated Circuits 2019 Report | www.yole.fr | ©2019 4 SUMMARY: KEY DEFINITIONS Photonic ICs (or PICs) are manufactured based on various materials and customized manufacturing platforms: Si photonics, InP, Silica, LiNbO3, SiN, polymer, glass. o Si photonics, which is a category of PIC, leverages semiconductor manufacturing infrastructure to combine different photonic functionalities on the same chip. They integrate multiple (at least two) photonic functions, the optical equivalent of electronic ICs. o In the future, electronics (drivers, logic) could be also integrated on the same chip (Sicoya, Ayar Labs). o In the future, Si photonics will integrate other materials (InP, Ge, LiNbO3 …) as Si uses mature manufacturing platforms (e.g. LiNbO3 modulators will also be better than Si based) and performance of components will improve. Silicon Photonics and Photonic Integrated Circuits 2019 Report | www.yole.fr | ©2019 5 THE DIFFERENT PIC PLATFORMS Different materials can be used for PICs. They are Si, InP, SiN, polymer, glass, LiNbO3, Silica. Table below shows the applications and corresponding wavelengths/optical functionalities. DATA CENTER INTERCON- 5G WIRELESS Long haul Automotive Applications DCI (intra, metro, submarine, ACCESS Sensors Medical telecom interconnects long haul) NETWORK Coherent Optical transceivers (100G/400G) Optical Optical transceivers for Lidars OCT optical Embedded optics (200G) transceivers intra car interconnects Gas sensors Blood analysis Examples of products transceivers Switches (28G) (antennas to compute / AWG Splitters entertainment system) Modulators 1310 – 1550 1310 – 1550 nm 1310 – 1550 nm 700nm+ 900 – 7000+nm 400 – 1500 nm Typ. wavelength nm SiPh InP SiN Main PIC platforms Polymer Glass Silica LiNbO3 Silicon Photonics and Photonic Integrated Circuits 2019 Report | www.yole.fr | ©2019 6 WHAT’S INSIDE A TRANSCEIVER INCLUDING TYPE OF PIC MATERIALS Receiver: Transmitter: • Photo diode (InP or Ge) • Uncooled laser source (InP) • TIA (Si) • MZ driver (Si) • Couplers, isolator and lenses (glass, • Modulator (LiNbO3, Si, polymer, other materials) polymer possible) • Couplers, isolator and lenses (glass, polymer, other materials) Basic light routing such as WG, Mux/Demux, couplers (InP, Si, Silica) Source: Silicon Photonics and Photonic Integrated Circuits 2019 Report | www.yole.fr | ©2019 7 EXAMPLE: INTEL Si PHOTONICS EMITTER PART: 4X25 GB PARALLEL Two lasers split into 4 MZI and 8 detectors: 2 detectors per MZI. 1 for each output of the Prism MZI to check dynamically the balance between Isolator the 2 arms of the MZI. Grating Photo detector MZI arm 25G 25G Principal laser Toward Fiber Optic coupler (4 fiber optics) 4xMZI with IC above Photo detector Lens module Si Photonics die on SOI Mirror inclined for light extraction Silicon Photonics and Photonic Integrated Circuits 2019 Report | www.yole.fr | ©2019 8 PROS AND CONS OF THE DIFFERENT PLATFORMS Most versatile platforms InPBuilding based Block PICs for InPall building blocksSiPh have beenSiN demonstrated.Glass Polymer Silica LiNbO3 Passive ++ ++ +++ +++ +++ +++ Hybrid components Polarization ++ ++ ++ + + Hybrid Hybrid components Lasers +++ Hybrid Hybrid Hybrid Hybrid Hybrid Hybrid Modulators +++ ++ + Thermal +++ Hybrid ++++ Switches ++ ++ + + + + Hybrid InP based Optical amplifiers +++ Hybrid Hybrid Hybrid Hybrid Hybrid Hybrid PICs for all Detectors +++ ++ Hybrid Hybrid Hybrid Hybrid Hybrid • Best for building • Best for • Simple • Compatible • Very good electronic/opti • Low cost • Low losses blocks have PROs laser/active process, low with Si/InP modulation cal integration • Small size • Low cost integration cost platform function been • Smallest size demonstrated. • Wavelength limited to 1.3 • Reliability / • Material µm to 1.7 µm thermal • Difficult to get properties • Few functions • No active • Low damage CONs • Higher cost in management light in and out are process are possible functionalities threshold large volume issues dependent production • Complex Epi INDUSTRY LOW VOLUME R&D/ RAMPING UP HIGH VOLUME PRE-SERIES HIGH VOLUME HIGH VOLUME STATUS PRODUCTION QUALIFICATION Silicon Photonics and Photonic Integrated Circuits 2019 Report | www.yole.fr | ©2019 9 PIC FORECAST PIC revenues will total $18B+ in 2024 for 160M units using SiPh or InP. We exclude in the graph below silica, LinbO3, glass, polymer and SiN as these materials are either still only a minute part of the market (glass, polymer) or limited to one optical function (modulation for LiNbO3, guiding light for silica). Si Photonics will have the highest CAGR with 44% by value / 53% by volume Silicon Photonics and Photonic Integrated Circuits 2019 Report | www.yole.fr | ©2019 10 FORECASTS Silicon Photonics and Photonic Integrated Circuits 2019 Report | www.yole.fr | ©2019 11 EXAMPLES OF PIC PLAYERS (IDMS, FOUNDRIES, R&D) BY PIC TECHNOLOGY PIC technologies Si Photonics InP Glass Polymer SiN Silica LiNbO3 Silicon Photonics and Photonic Integrated Circuits 2019 Report | www.yole.fr | ©2019 12 SiPH INDUSTRIAL
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