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Silicon Photonics and Photonic Integrated Circuits 2019 Market and Technology Report - Sample

Dr. Eric Mounier, Fellow Analyst With more than 20 years experience in MEMS, sensors and photonics applications, markets, and technology analyses, Eric provides in-depth industry insight into MEMS and photonics current and future trends. He is a daily contributor to the development of MEMS and photonics activities at Yole, with a large collection of market and technology reports as well as multiple custom consulting projects: business strategy, identification of investments or acquisition targets, due diligence (buy/sell side), market and technology analyses, cost modelling, technology scouting, etc. Eric has contributed to more than 250 marketing/technological analyses and 80 reports, helping move the MEMS and Si photonics industry forward. Thanks to his extensive knowledge of the MEMS, sensors, and photonics-related industries, Eric is often invited to speak at industry conferences worldwide. Moreover, he has been interviewed and quoted by leading media throughout the world. Prior to working at Yole, Eric held R&D and Marketing positions at CEA Leti in France. Eric has a Semiconductor Engineering degree and a Ph.-D in Optoelectronics from the National Polytechnic Institute of Grenoble. Contact: [email protected]

Jean-Louis Malinge Jean-Louis Malinge is an accomplished business management executive with extensive experience as a General Manager and CEO in France and the United States. He also serves on numerous Boards of Directors. He has formulated successful strategies to position or reposition numerous businesses, has led numerous acquisition projects, and also managed the creation of a successful joint-venture in Asia. Jean-Louis is currently a Venture Partner with Arch Venture Partners and is a Director on the boards of EGIDE Group, POET Technologies, and Cailabs. He is also Managing Director of YADAIS, a telecommunications and photonics consulting firm. Jean-Louis was President & CEO of Kotura from 2004 - 2013, when Kotura was acquired by Mellanox. A global leader in silicon photonics, Kotura designs, manufactures, and markets CMOS optical components that are deployed throughout the communications world. Formerly, Jean-Louis served as Vice President - Optical Networking Products for Corning, Inc. Prior to that his experience includes serving as Technology Director with Amphenol and Thompson CSF in France. Jean-Louis’ academic credentials include an Executive M.B.A. from MIT Sloan School in Boston, Massachusetts. He also holds an Engineering degree from the Institut National des Sciences Appliqués in Rennes, France. Silicon Photonics and Photonic Integrated Circuits 2019 Report | www.yole.fr | ©2019 2 LIST OF COMPANIES

Acacia, Accelink, Almae, Amazon, AOI, apm, AT&T, Axalume, AXT, Ayar Labs, Broadcom, Broadex, CeliO, Ciena, Cisco, Effect Photonics, Elenio, Emcore, Ericsson, Facebook, Fiberhome, ficonTEC, Finisar, Fujitsu, GCS, Gigalight, GlobalFoundries, Google, HHI, Hisense, HPE, Huawei, III-V Labs, II-VI, Infinera, Innolight, InPact, Inphi, Intel, IQE, JDSU, Juniper, Kaiam, Landmark, Ligentec, Lightwave Logic, LioniX, Lumentum, Luxnet, Luxtera, MACOM, Masimo, Microsoft, Nokia, Northrop Grumman, Novati, NTT, NXP, Oclaro, Oepic, OMMIC, Orange Labs, POET, Ranovus, Rockley, Roshmere, Scintil Photonics, Sentea, ShinEtsu, Sicoya, SiLC, Silex, Silterra, Skorpios, Skywater, Smart Photonics, SOITEC, STMicroelectronics (STM), SunEdison, Synopys, TEEM Photonics, Thales, TrueLight, TSMC, Verizon, VLC Photonics, VPEC, VTT, ZTE and more..

ThisYole 2019 Silicon Photonics report also includes other integrated optics platforms: o Silicon photonics o InP o SiN o Glass o Polymer o LiNbO3 o Silica Photonic ICs (or PICs) are manufactured based on various materials and customized manufacturing platforms: Si, InP, Silica, LiNbO3, SiN, polymer, glass. Si photonics, a sub-category of PIC, leverages semiconductor manufacturing infrastructure to combine different photonic functionalities on the same chip. They integrate multiple (at least two) photonic functions, the optical equivalent of electronic ICs. PICs are used for optical functions such as: o Modulation, emission, guiding, filtering, coupling, detecting o Examples of PICs:

Luxtera (SiPh) Infinera (InP) LioniX (SiN) TEEM (glass) Lightwave Logic AWG (Silica PLC) LiNbO3 (polymer) Silicon Photonics and Photonic Integrated Circuits 2019 Report | www.yole.fr | ©2019 4 SUMMARY: KEY DEFINITIONS

Photonic ICs (or PICs) are manufactured based on various materials and customized manufacturing platforms: Si photonics, InP, Silica, LiNbO3, SiN, polymer, glass.

o Si photonics, which is a category of PIC, leverages semiconductor manufacturing infrastructure to combine different photonic functionalities on the same chip. They integrate multiple (at least two) photonic functions, the optical equivalent of electronic ICs.

o In the future, electronics (drivers, logic) could be also integrated on the same chip (Sicoya, Ayar Labs).

o In the future, Si photonics will integrate other materials (InP, Ge, LiNbO3 …) as Si uses mature manufacturing platforms (e.g. LiNbO3 modulators will also be better than Si based) and performance of components will improve.

Different materials can be used for PICs. They are Si, InP, SiN, polymer, glass, LiNbO3, Silica. Table below shows the applications and corresponding wavelengths/optical functionalities.

DATA CENTER INTERCON- 5G WIRELESS Long haul Automotive Applications DCI (intra, metro, submarine, ACCESS Sensors Medical telecom interconnects long haul) NETWORK Coherent Optical transceivers (100G/400G) Optical Optical transceivers for Lidars OCT optical Embedded optics (200G) transceivers intra car interconnects Gas sensors Blood analysis Examples of products transceivers Switches (28G) (antennas to compute / AWG Splitters entertainment system) Modulators 1310 – 1550 1310 – 1550 nm 1310 – 1550 nm 700nm+ 900 – 7000+nm 400 – 1500 nm Typ. wavelength nm

SiPh

InP

SiN

Main PIC platforms Polymer

Glass

Silica

LiNbO3

Receiver: Transmitter: • Photo diode (InP or Ge) • Uncooled laser source (InP) • TIA (Si) • MZ driver (Si) • Couplers, isolator and lenses (glass, • Modulator (LiNbO3, Si, polymer, other materials) polymer possible) • Couplers, isolator and lenses (glass, polymer, other materials)

Basic light routing such as WG, Mux/Demux, couplers (InP, Si, Silica)

Source:

Silicon Photonics and Photonic Integrated Circuits 2019 Report | www.yole.fr | ©2019 7 EXAMPLE: INTEL Si PHOTONICS EMITTER PART: 4X25 GB PARALLEL Two lasers split into 4 MZI and 8 detectors: 2 detectors per MZI. 1 for each output of the Prism MZI to check dynamically the balance between Isolator the 2 arms of the MZI.

Grating Photo detector

MZI arm 25G 25G Principal laser Toward Fiber Optic coupler (4 fiber optics)

4xMZI with IC above

Photo detector Lens module Si Photonics die on SOI Mirror inclined for light extraction

Silicon Photonics and Photonic Integrated Circuits 2019 Report | www.yole.fr | ©2019 8 PROS AND CONS OF THE DIFFERENT PLATFORMS Most versatile platforms InPBuilding based Block PICs for InPall building blocksSiPh have beenSiN demonstrated.Glass Polymer Silica LiNbO3 Passive ++ ++ +++ +++ +++ +++ Hybrid components Polarization ++ ++ ++ + + Hybrid Hybrid components Lasers +++ Hybrid Hybrid Hybrid Hybrid Hybrid Hybrid Modulators +++ ++ + Thermal +++ Hybrid ++++ Switches ++ ++ + + + + Hybrid InP based Optical amplifiers +++ Hybrid Hybrid Hybrid Hybrid Hybrid Hybrid PICs for all Detectors +++ ++ Hybrid Hybrid Hybrid Hybrid Hybrid • Best for building • Best for • Simple • Compatible • Very good electronic/opti • Low cost • Low losses blocks have PROs laser/active process, low with Si/InP modulation cal integration • Small size • Low cost integration cost platform function been • Smallest size demonstrated. • Wavelength limited to 1.3 • Reliability / • Material µm to 1.7 µm thermal • Difficult to get properties • Few functions • No active • Low damage CONs • Higher cost in management light in and out are process are possible functionalities threshold large volume issues dependent production • Complex Epi

INDUSTRY LOW VOLUME R&D/ RAMPING UP HIGH VOLUME PRE-SERIES HIGH VOLUME HIGH VOLUME STATUS PRODUCTION QUALIFICATION

PIC revenues will total $18B+ in 2024 for 160M units using SiPh or InP. We exclude in the graph below silica, LinbO3, glass, polymer and SiN as these materials are either still only a minute part of the market (glass, polymer) or limited to one optical function (modulation for LiNbO3, guiding light for silica). Si Photonics will have the highest CAGR with 44% by value / 53% by volume

PIC technologies

Si Photonics

InP

Glass

Polymer

SiN Silica LiNbO3

InP Wafer and Epiwafer Market – Intel Silicon Photonic 100G Photonic and RF Applications PSM4 QFSP28 Transceiver

Contact our Sales Team for more information Edge Emitting Lasers: Market LiDAR for Automotive and and Technology Trends 2019 Industrial Applications 2019

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Silicon Photonics and Photonic Integrated Circuits 2019 Report | www.yole.fr | ©2019 17 SILICON PHOTONICS AND PHOTONIC INTEGRATED CIRCUITS 2019 Market & Technology Report - April 2019 Silicon photonics: beyond the tipping point!

TODAY DRIVEN BY DATA CENTER INTERCONNECTS, MORE APPLICATIONS WHAT’S NEW • Photonic IC (PIC) forecasts for ARE LOOMING FOR PICS! different materials: Silicon, InP, Photonic Integrated Circuits (PICs) are built from players in investment, setting up their own long- Silica, LiNbO3, glass, polymer, SiN many different materials, on custom manufacturing haul and subsea networks for DCI. Until recently, • PIC forecast 2018-2024 platforms. These include silicon (Si), indium they were relying on traditional telecom players for • Updated silicon photonics forecast in units, value and wafers for phosphide (InP), silica (SiO2), lithium niobate long distance transmission. In 2018, Si photonics different applications for 2018-2024 (LiNbO3), silicon nitride (SiN), polymer or glass. has entered long-haul DCI with large hyperscale • Updated 2018 market shares for PICs aim to bring advantages of the semiconductor companies now being agnostic regarding Si or InP silicon photonics suppliers world, in particular wafer scale manufacturing, to technology. • Supply chains photonics. The motivations for PICs are numerous, Si photonics, which is a category of PIC, is leveraging • Technologies, processes and including smaller photonic dies, higher data rates, market trends for the different PIC lower power consumption, lower cost per bit of semiconductor manufacturing infrastructure to materials data and better reliability compared to legacy optics. combine different photonic functionalities on a • Application descriptions: Data PICs are progressively replacing vertical cavity same chip, although lasers still use InP. Si is today center interconnects, 5G, sensors surface emitting lasers (VCSELs) for increasing expected to have the highest growth for optical transceivers. In the future, Si photonics will REPORT KEY FEATURES bandwidth and distance in datacom networks. PICs integrate other PIC materials, as Si uses mature • Introduction to photonic are used for high data rate transceivers (100G and manufacturing platforms but will also use other ICs: Description, challenges, above) in coherent or non coherent mode. In the materials when performance is better. Options applications, functions future, PICs will be needed when close integration • Market forecast 2018-2024 of electronics and photonics will be needed. include InP for lasing, germanium (Ge) for photo • Description of the applications: data detection, LiNbO3 for modulation and glass for The largest volume demand for PICs is for data center interconnect, 5G, sensors interconnect. • Supply chains descriptions center interconnects (or DCIs) in data and telecom In recent years, strong R&D effort has been put into • Manufacturing trends and challenges networks, with new applications coming such as 5G wireless technology, automotive or medical the embedded optics approach to have photonic REPORT OBJECTIVES sensors. InP is the most used but Si photonics is dies as close as possible to the electronics on the • Get a clear understanding of the growing faster. Hyperscale networking companies board in the server. Today, development of co- applications and technologies related like Google, Apple, Facebook, Amazon and packaged Application-Specific Integrated Circuits to Photonic Integrated Circuits (ASICs) and optics for switches anticipates future (PICs), with a special focus on silicon Microsoft (GAFAMs) are today the driving force for (Si) photonics. the deployment of Si photonics technology. They data center architectures and reduces power • Identification and analysis of the are currently setting up interconnected networks consumption. Switch ASIC companies will capture applications: with local data centers at the nodes of the mesh. a lot of value and are likely to be involved in more > Determination of the application GAFAMs are ahead of the traditional telecom mergers and acquisitions in the future. ranges > Market segmentation Photonic IC (PIC) materials overview* > Technical and economic

requirements, by segment G IRELESS DATA CENTRES Applications LONG HAUL ACCESS AUTOMOTIE SENSORS MEDICAL INTERCO > Key players, at application and NETOR system levels Coherent optical Optical Optical Optical Lidars OCT > Market size and market forecast transceivers transceivers transceivers transceivers for Gas sensors Blood analysis AG (100G400G) (28G) intra cars 2018-2024, in $M, wafers and Munits Examples of products Modulators Embedded optics interconnects (200G) • Analysis and description if the Switches technologies involved: Splitters > Existing and future PICs Typ. wavelength 1310 – 1550 nm 1310 – 1550 nm 1310 – 1550 nm 700nm 900 – 7000nm 400 – 1500 nm technologies with a special focus Si on Si photonics InP

> Major actors and R&D firms, globally SiN

> Technology roadmap for the PIC materials Polymer different products and processes Glass

> Who is developing what? Silica

> Competing technologies and LiNbO3 organizations, per application *More complete analysis in the report • Main challenges, including packaging (Yole Développement, April 2019) SILICON PHOTONICS AND PHOTONIC INTEGRATED CIRCUITS 2019 THE MARKET WILL BOOM, WITH 400G GROWING FASTER THAN 100G FOR Si PHOTONICS

The total market for PIC-based transceivers using Si 2018-2024 Si photonics-based transceiver forecast photonics and InP will grow from around $4B in 2018 to around $19B in 2024, from around 30M units to

4,5 around 160M units. Si photonics will have the highest compound annual growth rate (CAGR) of 44.5%. It 4 will grow from around $0.45B in 2018, equating to 3,5 1.3M units, to around $4B in 2024, equating to 23.5M - : 44.5% units. DCI from metro to long haul/subsea is the 3 2018-2024 largest market, with coherent telecom and sensors 2,5 CAGR being a minute part. 5G is coming and could involve $B 2 4,14 large volumes in the future as well.

1,5 2,82 Beyond DCI, other applications are looming. For 1 1,97 example, the following companies plan to use their 0,5 1,15 PIC platform for LiDAR applications: Intel, Rockley 0,45 0,48 0,74 Photonics, SiLC, Blackmore, and probably many 2018 2019 2020 2021 2022 2023 2024 more. However, the prospects of market success are SiPh revenues still uncertain for LiDARs as they could be displaced by a combination of other approaches like radar and (Yole Développement, April 2019) imagers and the success of autonomous vehicles is still uncertain because of technical challenges, regulations and strategic changes from car makers. Si photonics player market share history in units The market volume for robotic cars is in the range of 100% thousands of units, not millions. So volumes are less 90% than for data centers. 80% The Si photonic market only involves a few players: 70% Luxtera/Cisco, Intel, Acacia and InPhi. Founded in 60% 2001, Luxtera, now part of Cisco, is the historical 50% pioneer, with almost 2M Quad Small Form-Factor 40% Pluggable (QSFP) transceivers shipped since starting volume production in 2009. Intel introduced a silicon 30% photonics QSFP transceiver that supports 100G 20% communications in 2016. The company now ships 10% a million units of the product per year into data 0% centers. Intel’s 400G products are expected to enter 2016 2017 2018 volume production in the second half of 2019. Acacia Cisco Luxtera Intel Acacia Others announced the shipment of more than 100,000 400ZR modules in total for coherent optics by 2022. (Yole Développement, April 2019)

BEYOND THE TIPPING POINT, BUT NOT YET FULLY MATURE!

Despite the current excitement about this Facebook working on this topic, and ‘Top of the technology, we believe that Si photonics is not yet Rack’ switches could disappear. This means that fully mature. We have reached the tipping point switches could be co-packaged with the optics at the thanks to a convergence of early adopters mastering server level. In this case, volumes will be boosted as this technology and requests from GAFAMs, but the number of switches is very high, in the range of there are still very few suppliers, as mentioned millions of units, providing a potential opportunity above. for foundries. For smaller MEMS foundries like Silex, However, a lot of new startups are being created and apm and VTT, having Si photonics processes is a way more foundries are involved from the IC and MEMS to fill their fab, as some processes are very similar, industries. One reason for large IC foundries such like Cisco/Luxtera’s MEMS capping. Last but not as TSMC to develop Si photonics approach could be least, there is always a big R&D effort worldwide linked to a future co-packaged switch approach. The with many industrial contracts in North America, data center architecture is evolving from pluggable Europe and Japan. So this market is on its way to to more co-packaged optics, with Microsoft and industrial maturity and very large volumes. MARKET & TECHNOLOGY REPORT

2019 Silicon photonics supply chain*

SOI substrate Epi wafer Fabless Foundry Transceiver Euipment Operator

AUTHORS With almost 20 years of experience in MEMS, Sensors and Photonics applications, markets, and technology analyses, Eric (out of business) Mounier, PhD provides deep industry insight into current and future trends. As a And more… And more… Fellow Analyst, Technology & Market, MEMS *on ehaustive list of companies & Photonics, in the Photonics, Sensing & (Yole Développement, April 2019) Display division, he is a daily contributor to the development of MEMS and Photonics activities at Yole Développement (Yole), COMPANIES CITED IN THE REPORT (non exhaustive list) with a large collection of market and Acacia, Accelink, Almae, Amazon, AOI, apm, at&t, Axalume, AXT, Ayar Labs, Broadcom, technology reports as well as multiple custom consulting projects: business Broadex, CeliO, Ciena, Cisco, Effect Photonics, Elenio, Emcore, Ericsson, Facebook, strategy, identification of investments or Fiberhome, ficontec, Finisar, Fujitsu, GCS, Gigalight, GlobalFoundries, Google, HHI, Hisense, acquisition targets, due diligences (buy/ HPE, Huawei, III-V Labs, II-VI, Infinera, Innolight, InPact, Inphi, Intel, IQE, JDSU, Juniper, sell side), market and technology analysis, Kaiam, Landmark, Ligentec, Lightwave Logic, LioniX, Lumentum, Luxnet, Luxtera, MACOM, cost modelling, technology scouting, etc. Masimo, Microsoft, Nokia, Northrop Grumann, Novati, NTT, NXP, Oclaro, Oepic, OMMIC, Previously, Eric Mounier held R&D and Marketing positions at CEA Leti (France). Orange Labs, POET, Ranovus, Rockley, Roshmere, Scintil Photonics, Sentea, ShinEtsu, He has spoken in numerous international Sicoya, SiLC, Silex, Silterra, Skorpios, Skywater, Smart Photonics, SOITEC, STM, SunEdison, conferences and has authored or co- Synopys, TEEM Photonics, Thales, TrueLight, TSMC, Verizon, VLC Photonics, VPEC, VTT, authored more than 100 papers. Eric has a ZTE and more... Semiconductor Engineering Degree and a Ph.-D in Optoelectronics from the National Polytechnic Institute of Grenoble (France). TABLE OF CONTENTS (complete content on i-Micronews.com) Glossary and definitions 2 > Long haul Table of contents 3 > 5G > LiDAR and sensors Report objectives 4 > Medical Report scope 5 Supply chain 141 Methodology 6 Technology trends 168 Jean-Louis Malinge collaborates with The authors 8 > Silicon photonics Yole Développement to investigate the List of companies 9 > InP silicon photonics technologies and market What we got right/what we wrong? 10 > SiN evolution. Jean-Louis is strongly involved > Polymer Executive Summary 17 in this industry for many years and as an > Glass expert, he is an accomplished business Context 53 > Silica management executive with extensive Market forecast 65 > LiNbO3 experience as a General Manager and CEO Market trends 80 > Photonic packaging challenges in France and the United States. He serves > Introduction to optical telecom Outlooks 225 on numerous Boards of Directors. Amongst > Data center interconnects Yole Développement 229 his experiences, he has formulated successful strategies to position or reposition lot of businesses, led numerous acquisition projects, and managed the creation of a RELATED REPORTS successful joint-venture in Asia. B enef it from our B undle & Annual Subscription offers and access our analyses at the best available Jean-Louis' academic credentials include an price and with great advantages Executive M.B.A. from MIT Sloan School • Intel Silicon Photonic 100G PSM4 QFSP28 in Boston, Massachusetts. He also holds Transceiver – Structure, Process and Cost an engineering degree from the Institut Report by System Plus Consulting National des Sciences Appliquées (INSA • Edge Emitting Lasers: Market and Technology Rennes, France). Trends 2019 • LiDAR for Automotive and Industrial Applications 2019

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Our publications (report, database, tool...) are delivered from its employees or any person to whom the Buyer has sent the additional PDF can also join it. Q&A with an Analyst is possible for only after reception of the payment. Products and shall personally take care of any related proceedings, and each monitor with a maximum limit of 100h/year. Frequency of the 3.4 In the event of termination of the contract, or of misconduct, the Buyer shall bear related financial consequences in their entirety. release varies according to the monitor or service. during the contract, the Seller will have the right to invoice at the 6.5 The Buyer shall define within its company a contact point for the Based in Villeurbanne (France, headquarters) Yole stage in progress, and to take legal action for damages. “Seller”: needs of the contract. This person will be the recipient of each Développement provides marketing, technology and strategy new report. This person shall also be responsible for respect c o n s u l t i n g , m e d i a a n d c o r p o r a t e fi n a n c e s e r v i c e s , r e v e r s e e n g i n e e r i n g / 4. LIABILITIES of the copyrights and will guaranty that the Products are not costing services as well as IP and patent analysis. With more than 70 4.1 The Buyer or any other individual or legal person acting on its disseminated out of the company. In the context of Bundle and market analysts, Yole Développement works worldwide with the behalf, being a business user buying the Products for its business Annual Subscriptions, the contact person shall decide who within key industrial companies, R&D institutes and investors to help them activities, shall be solely responsible for choosing the Products the Buyer, shall be entitled to receive the protected link that will understand the market and technology trends. and for the use and interpretations he makes of the documents allow the Buyer to access the Products. it purchases, of the results he obtains, and of the advice and acts 1. SCOPE 6.6 Please note that whether in Bundles or Annual Subscription, all it deduces thereof. 1.1 The Contracting Parties undertake to observe the following unselected reports will be cancelled and lost after the 12 month 4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable general conditions when agreed by the Buyer and the Seller. validity period of the contract. pecuniary loss, caused by the Products or arising from a material ANY ADDITIONAL, DIFFERENT, OR CONFLICTING TERMS 6.7 As a matter of fact the investor of a company, external breach of this agreement. AND CONDITIONS IN ANY OTHER DOCUMENTS ISSUED consultants, the joint venture done with a third party, and so 4.3 In no event shall the Seller be liable for: BY THE BUYER AT ANY TIME ARE HEREBY OBJECTED TO on cannot access the report and should pay a full license price. a) Damages of any kind, including without limitation, incidental BY THE SELLER, SHALL BE WHOLLY INAPPLICABLE TO ANY or consequential damages (including, but not limited to, damages SALE MADE HEREUNDER AND SHALL NOT BE BINDING IN for loss of profits, business interruption and loss of programs 7. TERMINATION ANY WAY ON THE SELLER. 7.1 If the Buyer cancels the order in whole or in part or postpones or information) arising out of the use of or inability to use the 1.2 This agreement becomes valid and enforceable between the the date of mailing, the Buyer shall indemnify the Seller for the Seller’s website or the Products, or any information provided on Contracting Parties after clear and non-equivocal consent by entire costs that have been incurred as at the date of notification the website, or in the Products; any duly authorized person representing the Buyer. For these by the Buyer of such delay or cancellation. This may also apply for b) Any claim attributable to errors, omissions or other purposes, the Buyer accepts these conditions of sales when any other direct or indirect consequential loss that may be borne inaccuracies in the Product or interpretations thereof. signing the purchase order which mentions “I hereby accept Yole by the Seller, following this decision. 4.4 All the information contained in the Products has been obtained Développement’s Terms and Conditions of Sale”. This results in 7.2 In the event of breach by one Party under these conditions or from sources believed to be reliable. The Seller does not warrant acceptance by the Buyer. the order, the non-breaching Party may send a notification to the the accuracy, completeness adequacy or reliability of such 1.3 Orders are deemed to be accepted only upon written acceptance other by recorded delivery letter upon which, after a period of information, which cannot be guaranteed to be free from errors. and confirmation by the Seller, within [7 days] from the date of thirty (30) days without solving the problem, the non-breaching 4.5 All the Products that the Seller sells may, upon prior notice order, to be sent either by email or to the Buyer’s address. In the Party shall be entitled to terminate all the pending orders, to the Buyer from time to time be modified by or substituted absence of any confirmation in writing, orders shall be deemed to without being liable for any compensation. with similar Products meeting the needs of the Buyer. This have been accepted. modification shall not lead to the liability of the Seller, provided 8. MISCELLANEOUS 2. MAILING OF THE PRODUCTS that the Seller ensures the substituted Product is similar to the All the provisions of these Terms and Conditions are for the benefit 2.1 Products are sent by email to the Buyer: Product initially ordered. of the Seller itself, but also for its licensors, employees and agents. • Within a few days from the order for Products already released 4.6 In the case where, after inspection, it is acknowledged that Each of them is entitled to assert and enforce those provisions and paid; or the Products contain defects, the Seller undertakes to replace against the Buyer. • Within a reasonable time for Products ordered prior to their the defective products as far as the supplies allow and without Any notices under these Terms and Conditions shall be given in writing. effective release. In this case, the Seller shall use its best indemnities or compensation of any kind for labour costs, delays, They shall be effective upon receipt by the other Party. endeavours to inform the Buyer of an indicative release date loss caused or any other reason. The replacement is guaranteed The Seller may, from time to time, update these Terms and Conditions and the evolution of the work in progress. for a maximum of two months starting from the delivery date. and the Buyer, is deemed to have accepted the latest version of these 2.2 The Seller shall by no means be responsible for any delay in Any replacement is excluded for any event as set out in article terms and conditions, provided they have been communicated to him respect of article 2.1 above, and including in cases where a new 5 below. in due time. event or access to new contradictory information would require 4.7 The deadlines that the Seller is asked to state for the mailing for the analyst extra time to compute or compare the data in of the Products are given for information only and are not 9. GOVERNING LAW AND JURISDICTION order to enable the Seller to deliver a high quality Products. guaranteed. If such deadlines are not met, it shall not lead to any 9.1 Any dispute arising out or linked to these Terms and Conditions or 2.3 The mailing of the Product will occur only upon payment by the damages or cancellation of the orders, except for non-acceptable to any contract/orders entered into in application of these Terms Buyer, in accordance with the conditions contained in article 3. delays exceeding [3] months from the stated deadline, without and Conditions shall be settled by the French Commercial Courts 2.4. The mailing is operated through electronic means either by information from the Seller. In such case only, the Buyer shall be of Lyon, which shall have exclusive jurisdiction upon such issues. email via the sales department or automatically online via an entitled to ask for a reimbursement of its first down payment to 9.2 French law shall govern the relation between the Buyer and the email/password. If the Product’s electronic delivery format is the exclusion of any further damages. Seller, in accordance with these Terms and Conditions. Source: Wikimedia Commons

Yole Développement From Technologies to Market

Life Sciences Semiconductor Semiconductor & Healthcare & Software & Software o Microfluidics o Package,Assembly & Substrates o BioMEMS & Medical Microsystems o Semiconductor Manufacturing o Inkjet and accurate dispensing o Memory o Solid-State Medical Imaging & BioPhotonics o Software & Computing o BioTechnologies Life Photonics, Sciences & Sensing Healthcare & Display

Power Photonics, & Wireless Sensing & Display o RF Devices & Technologies o Solid-State Lighting o Compound Semiconductors & Emerging Materials Power & Wireless o Display o Power Electronics o MEMS, Sensors & Actuators o Batteries & Energy Management o Imaging o Photonics & Optoelectronics

o Consulting and Analysis • Market data & research, marketing analysis • Technology analysis o Syndicated reports • Strategy consulting • Market & technology reports • Reverse engineering & costing • Patent investigation and patent • Patent analysis infringement risk analysis o Monitors • Design and characterization • Teardowns & reverse costing • Monthly and/or Quarterly of innovative optical systems analysis update • Financial services (due • Cost simulation tool • Excel database covering supply, diligence, M&A with our demand, and technology www.i-Micronews.com/reports o Media partner) • Price, market, demand and www.yole.fr production forecasts • i-Micronews.com website • Supplier market shares • @Micronews e-newsletter • Communication & webcast services www.i-Micronews.com/reports • Events: TechDays, forums,… www.i-Micronews.com

Yole Group of Companies

Market, technology and strategy Manufacturing costs analysis IP analysis consulting Teardown and reverse engineering Patent assessment Cost simulation tools www.yole.fr www.systemplus.fr www.knowmade.fr

Design and characterization of Due diligence innovative optical systems Innovation and business maker www.bmorpho.com www.yole.fr www.piseo.fr

Europe office Frankfurt

Paris

Nantes Yole Korea Yole Inc. HQ in Lyon Seoul Phoenix Vénissieux Yole Japan Tokyo Nice Greater Palo Alto China office 40% Hsinchu of our business 30% 30% of our business of our business

High

Technology and Market Report

Leadership

Meeting Breadth of the analysis the of Breadth

Q&A Meet the Custom Service Analyst Analysis

Integrators, end- users and software developers

Our analysts Device manufacturers provide market analysis, technology evaluation, Suppliers: material, equipment, and business plans along OSAT, foundries… the entire supply chain

Financial investors, R&D centers

Industrial Medical We work and defense systems across multiples industries to understand Energy the impact of management Automotive More-than- Moore technologies from device Mobile phone to system Transportation and makers consumer electronics From A to Z…

o Over the course of more than 20 years, Yole Développement has grown to become a group of companies. Together with System Plus Consulting and KnowMade, we now provide marketing, technology and strategy consulting, media and corporate finance services, reverse costing, structure, process and cost analysis services and well as intellectual property (IP) and patent analysis. Together, our group of companies is collaborating ever closer and therefore will offer, in 2019, a collection of over 125 reports and 10 new monitors. Combining respective expertise and methodologies from the three companies, they cover:

• MEMS & Sensors • Power electronics • RF devices & technologies • Compound semiconductors • Medical technologies • Solid state lighting • Semiconductor Manufacturing • Displays • Advanced packaging • Software • Memory • Imaging • Batteries and energy management • Photonics

o If you are looking for: • An analysis of your product market and technology • A review of how your competitors are evolving • An understanding of your manufacturing and production costs • An understanding of your industry’s technology roadmap and related IPs • A clear view supply chain evolution Our reports and monitors are for you! www.i-Micronews.com o Our team of over 70 analysts, including PhD and MBA qualified industry veterans from Yole Développement, System Plus Consulting and KnowMade, collect information, identify trends, challenges, emerging markets, and competitive environments. They turn that information into results and give you a complete picture of your industry’s landscape. In the past 20 years, we have worked on more than 2,000 projects, interacting with technology professionals and high-level opinion makers from the main players of their industries and realized more than 5,000 interviews per year. WHAT TO EXPECT IN 2019? In 2019 we will extend our offering with a new ‘monitor’ product which provides more updates on your industry during the year. The Yole Group of Companies is also building on and expanding its investigations of the memory industry. Moreover, in parallel, the Yole Group reaffirms its commitment to a new collection of reports mixing software and hardware and is increasing its involvement in displays, radio-frequency (RF) technology, advanced substrates, batteries and compound semiconductors. Discover our 2019 program right now, and ensure you get a true vision of the industry. Stay tuned!

18 fields of excellence combined with six markets to provide a complete picture of your industry landscape

Market –Technology – Strategy – by Yole Développement Yole Développement (Yole) offers market reports including quantitative market forecasts, technology trends, company strategy evaluation and indepth application analyses. Yole will The markets targeted are : publish more than 55 reports in 2019, with our partner PISEO contributing to some of the lighting reports. • Mobile & Consumer

Reverse Costing® – Structure, Process and Cost Analysis – by • Automotive & Transportation System Plus Consulting The Reverse Costing® report developed by System Plus Consulting provides full • Medical teardowns, including detailed photos, precise measurements, material analyses, manufacturing process flows, supply chain evaluations, manufacturing cost analyses and • Industrial selling price estimations. The reports listed below are comparisons of several analyzed components from System Plus Consulting. More reports are however available, and over • 60 reports will be released in 2019.The complete list is available at www.systemplus.fr. Telecom & Infrastructure

Patent Reports – by KnowMade • Defense & Aerospace More than describing the status of the IP situation, these analyses provide a missing link between patented technologies and market, technological and business trends. They offer • Linked reports are dealing with the same topic to provide an understanding of the competitive landscape and technology developments from a patent perspective. They include key insights into key IP players, key patents and future • a more detailed analysis. technology trends. For 2019 KnowMade will release over 15 reports.

MEMS & SENSORS RF DEVICES AND TECHNOLOGIES o MARKET AND TECHNOLOGY REPORT o MARKET AND TECHNOLOGY REPORT • Status of the MEMS Industry 2019 - Update • RF GaN Market: Applications, Players, Technology, • Status of the Audio Industry 2019 - New and Substrates 2019 - Update • Uncooled Infrared Imagers and Detectors 2019 – Update • 5G’s Impact on RF Front-End Module and Connectivity • Consumer Biometrics:Technologies and Market Trends 2018 for Cell Phones 2019 – Update • MEMS Pressure Sensor Market and Technologies 2018 • 5G Impact on Wireless Infrastructure 2019 • Gas & Particle Sensors 2018 • Radar and Wireless for Automotive: Market and Technology Trends 2019 - Update o STRUCTURE, PROCESS & COST REPORT • Advanced RF Antenna Market & Technology 2019 - New • MEMS & Sensors Comparison 2019 • RF Standards and Technologies for Connected Objects 2018 • MEMS Pressure Sensor Comparison 2018 o STRUCTURE, PROCESS & COST REPORT • Particle Sensors Comparison 2019 • • Miniaturized Gas Sensors Comparison 2018 RF Front-End Module Comparison 2019 - Update o PATENT REPORT • Automotive Radar RF Chipset Comparison 2018 o • MEMS Foundry Business Portfolio 2019 - New PATENT REPORT • • Miniaturized Gas Sensors 2019 - New Antenna for 5G Wireless Communications 2019 - New • RF Front End Modules for Cellphones 2018 PHOTONIC AND OPTOELECTRONICS • RF Filter for 5G Wireless Communications: Materials and Technologies 2019 o MARKET AND TECHNOLOGY REPORT • RF GaN : Materials, Devices and Modules 2018 • Photonic Integrated Circuit 2019 - New • LiDARs for Automotive and Industrial Applications 2019 - Update • Silicon Photonics 2018 o PATENT REPORT • Silicon Photonics for Data Centers: Optical Transceiver 2019 - New • LiDAR for Automotive 2018

Update : 2018 version still available ©2019 | www.yole.fr | About Yole Développement 11 OUR 2019 REPORTS COLLECTION (2/5) 18 fields of excellence combined with six markets to provide a complete picture of your industry landscape

IMAGING MICROFLUIDICS o MARKET AND TECHNOLOGY REPORT o MARKET AND TECHNOLOGY REPORT • Status of the CIS Industry 2019: Technology • Status of the Microfluidics Industry 2019 - Update and Foundry Business - Update • Next Generation Sequencing & DNA Synthesis - Technology, • Imaging for Automotive 2019 - Update Consumables Manufacturing and Market Trends 2019 - New • Neuromorphic Technologies for Sensing 2019 - Update • Organ-on-a-Chip Market & Technology Landscape 2019 - Update • Status of the CCM and WLO Industry 2019 – Update • Point-of-Need Testing Application of Microfluidic Technologies 2018 • 3D Imaging & Sensing 2018 • Liquid Biopsy: from Isolation to Downstream Applications 2018 • MachineVision for Industry and Automation 2018 • Chinese Microfluidics Industry 2018 • Sensors for Robotic Vehicles 2018 o PATENT REPORT o STRUCTURE, PROCESS & COST REPORT • Microfluidic Manufacturing Technologies 2019 – New • Compact Camera Modules Comparison 2019 • CMOS Image Sensors Comparison 2019 INKJET AND ACCURATE DISPENSING o PATENT REPORT o MARKET AND TECHNOLOGY REPORT • Facial & Gesture Recognition Technlogies in Mobile Devices 2019 - New • Inkjet Printheads - Dispensing Technologies • Apple iPhone X Proximity Sensor & Flood Illuminator 2018 & Market Landscape 2019 - Update • Emerging Printing Technologies MEDICAL IMAGING AND BIOPHOTONICS for Microsystem Manufacturing 2019 - New o MARKET AND TECHNOLOGY REPORT • Piezoelectric Materials from Bulk to Thin Film 2019 - New • X-Ray Detectors for Medical, Industrial • Inkjet Functional and Additive Manufacturing for Electronics 2018 and Security Applications 2019- New o STRUCTURE, PROCESS & COST REPORT • Microscopy Life Science Cameras: Market and Technology Analysis 2019 • Piezoelectric Materials from Bulk to Thin Film Comparison 2019 • Ultrasound technologies for Medical, Industrial and Consumer Applications 2018 o PATENT REPORT • Optical Coherence Tomography Medical Imaging 2018

Update : 2018 version still available ©2019 | www.yole.fr | About Yole Développement 12 OUR 2019 REPORTS COLLECTION (3/5) 18 fields of excellence combined with six markets to provide a complete picture of your industry landscape

BIOTECHNOLOGIES MEMORY o MARKET AND TECHNOLOGY REPORT o MARKET AND TECHNOLOGY REPORT • CRISPR-Cas9 Technology: From Lab to Industries 2018 • Status of the Memory Business 2019 - New o PATENT REPORT • MRAM Technology and Business 2019 - New • Personalized Medicine 2019 – New • Emerging Non Volatile Memory 2018 o STRUCTURE, PROCESS & COST REPORT BIOMEMS & MEDICAL MICROSYSTEMS • Memory Comparison 2019 o MARKET AND TECHNOLOGY REPORT o PATENT REPORT • Medical Wearables: Market & Technology Analysis 2019 - New • Magnetoresistive Random-Access Memory (MRAM) 2019 - New • Neurotechnologies and Brain Computer Interface 2018 • 3D Non-Volatile Memory 2018 • BioMEMS & Non-Invasive Sensors: Microsystems for Life Sciences & Healthcare 2018 ADVANCED PACKAGING o PATENT REPORT o MARKET AND TECHNOLOGY REPORT • 3D Cell Printing 2019 - New • Fan Out Packaging Technologies and Market Trends 2019 - Update • Circulating Tumor Cells Isolation 2019 - New • 3D TSV Integration and Monolithic Business Update 2019 - Update • Nanopore Sequencing 2019 - New • Advanced RF SiP for Cellphones 2019 - Update • Status of Advanced Packaging 2019 - Update SOFTWARE AND COMPUTING • Status of Advanced Substrates 2019 - Update o MARKET AND TECHNOLOGY REPORT • Panel Level Packaging Trends 2019 - Update • Artificial Intelligence Computing For Automotive 2019 - New • System in Package (SiP) Technology and Market Trends 2019 - New • Hardware and Software for Artificial Intelligence (AI) • Trends in Automotive Packaging 2018 in Consumer Applications 2019 - Update • Thin-Film Integrated Passive Devices 2018 • From Image Processing to Deep Learning 2019 - Update o STRUCTURE, PROCESS & COST REPORT • xPU (Processing Units) for Cryptocurrency, Blockchain, HPC and Gaming 2019 – New • Advanced RF SiP for Cellphones Comparison 2019

Update : 2018 version still available ©2019 | www.yole.fr | About Yole Développement 13 OUR 2019 REPORTS COLLECTION (4/5) 18 fields of excellence combined with six markets to provide a complete picture of your industry landscape

SEMICONDUCTOR MANUFACTURING SOLID STATE LIGHTING o MARKET AND TECHNOLOGY REPORT o MARKET AND TECHNOLOGY REPORT • Nano Imprint Lithography 2019 - New • Status of the Solid State Light Source Industry 2019 - New • Equipment and Materials for Fan Out Packaging 2019 - Update • Edge Emitting Lasers (EELS) 2019 - New • Equipment for More than Moore: Thin Film Deposition • Light Shaping Technologies 2019 - New & Etching 2019 - New • Automotive Advanced Front Lighting Systems 2019 - New • Wafer Starts for More Than Moore Applications 2018 • VCSELs - Technology, Industry and Market Trends 2019 - Update • Polymeric Materials at Wafer-Level • IR LEDs and Laser Diodes – Technology, Applications, for Advanced Packaging 2018 and Industry Trends 2018 • Bonding and Lithography Equipment Market • Automotive Lighting 2018: Technology, Industry and Market Trends for More than Moore Devices 2018 • UV LEDs - Technology, Manufacturing and Application Trends 2018 o STRUCTURE, PROCESS & COST REPORT • LiFi: Technology, Industry and Market Trends 2018 • Wafer Bonding Comparison 2018 o STRUCTURE, PROCESS & COST REPORT o PATENT REPORT • VCSEL Comparison 2019 • Hybrid Bonding for 3D Stack 2019 – New o PATENT REPORT • VCSELs 2018

DISPLAY o MARKET AND TECHNOLOGY REPORT • Next Generation 3D Display 2019 - New • Next Generation Human Machine Interaction (HMI)in Displays 2019 - New • Micro-and Mini-LED Displays 2019 - Update • Technologies And Markets for Next Generation Televisions • Displays & Optical Vision Systems for VR, AR & MR 2018 o PATENT REPORT • MicroLED Displays : Intellectual Property Landscape 2018

Update : 2018 version still available ©2019 | www.yole.fr | About Yole Développement 14 OUR 2019 REPORTS COLLECTION (5/5) 18 fields of excellence combined with six markets to provide a complete picture of your industry landscape

POWER ELECTRONICS BATTERY & ENERGY MANAGEMENT o MARKET AND TECHNOLOGY REPORT o MARKET AND TECHNOLOGY REPORT • Power SiC: Materials, Devices and Applications 2019 - Update • Status of the Rechargeable Li-ion Battery Industry 2019 - New • Power Electronics for EV/HEV and e-mobility: • Li-ion Battery Packs for Automotive and Stationary Storage Market, Innovations and Trends 2019 - Update Applications 2019 - Update • Status of the Power Electronics Industry 2019 - Update o PATENT REPORT • Discrete Power Packaging : Material Market • Battery Energy Density Increase: Materials and Technology Trends 2019 - New and Emerging Technologies 2019 - New • Status of the Power ICs Industry 2019 - Update • Solid-State Batteries 2019 - New • Status of the Passive Components for the Power Electronics • Status of the Battery Patents 2018 Industry 2019 - Update • Status of the Inverter Industry 2019 - Update COMPOUND SEMI. • Status of the Power Module Packaging Industry 2019 - Update o MARKET AND TECHNOLOGY REPORT • Wireless Charging Market Expectations • Emerging Compound Semiconductor and Technology Trends 2018 Market & Technology Trends 2019 - New • Power GaN 2018: Epitaxy, Devices, Applications • Status of the Compound Semiconductor Industry 2019 - New and Technology Trends • InP Materials, Devices and Applications 2019 - New o STRUCTURE, PROCESS & COST REPORT • GaAs Wafer and Epiwafer Market: RF, Photonics, • Automotive Power Module Packaging Comparison 2018 LED and PV Applications 2018 • GaN-on-Silicon Transistor Comparison 2019 o PATENT REPORT • SiC Transistor Comparison 2019 • GaN-on-Silicon Substrate: Materials, Devices o PATENT REPORT and Applications 2019 - Update • Power SiC : Materials, Devices and Modules 2019 - New • Power GaN : Materials, Devices and Modules 2019 – Update

Yole Développement, System Plus Consulting and KnowMade, all part of the Yole Group of Companies, are launching a collection of 10 monitors in 2019. The monitors aim to provide updated market, technology and patent data as well dedicated quarterly analyses of the evolution in your industry over the previous 12 months. Furthermore, you can benefit from direct access to the analyst for an on-demand Q&A and discussion session regarding trend analyses, forecasts and breaking news. Topics covered will be compact camera modules (CCMs), advanced packaging, compound semiconductors, microfluidics, batteries, RF and memory.

MARKET MONITOR byYole Développement o COMPOUND SEMI. – NEW This monitor will describe how the compound semiconductor industry is evolving. It A FULL PACKAGE: will offer a close look at GaAs, InP, SiC, GaN and other compounds of interest The monitors will provide the evolution of the market in units, wafer area and revenues. providing wafer volumes, revenues, application breakdowns and momentum. They will also offer insights into what is driving the business and a close look at what is Frequency: Quarterly, starting from Q3 2019 happening will also be covered in it. o CAMERA MODULE – NEW The following deliverables will be included in the monitors: This monitor will provide the evolution of the imaging industry, with a close look at • An Excel database with all historical and forecast data image sensor, camera module, lens and VCM. Volumes, revenues and momentum of companies like Sony, Samsung, Omnivision and OnSemi will thus be analysed. • A PDF slide deck with graphs and comments/analyses covering the expected Frequency: Quarterly, starting from Q3 2019 evolutions o MEMORY – UPDATE o ADVANCED PACKAGING – NEW For the memory industry you can have access to a quaterly monitor, as well as an This monitor will provide the evolution of the advanced packaging platforms. It will additional service, a monthly pricing. Both services can be bought seprately: cover Fan-Out Wafer Level Packaging (WLP), Fan-Out Panel Level Packaging (PLP), • DRAM Service: Including a quarterly monitor and monthly pricing. Wafer-Level Chip Scale Packaging (WLCSP), Flip Chip packaging platforms, and 2.5D and 3D Through Silicon Via (TSV) integration. Frequency: Quarterly, starting from Q3 • NAND Service: Including a quarterly monitor and monthly pricing. 2019

REVERSETECHNOLOGY MONITOR by System Plus Consulting o SMARTPHONES – NEW To stay updated on the latest components, packaging and silicon chip choices of the smartphone makers, System Plus Consulting has created its first Smartphone Reverse Technology monitor. This year, get access to the packaging and silicon content database of at least 20 different flagship smartphones – more than five per quarter. Starting at the beginning of 2019, the monitor will include an Excel database report for each phone and a quarterly comparison.

PATENT MONITOR by KnowMade o Li-ion Batteries Anodes made of lithium metal, silicon, and lithium titanate (LTO); cathodes made of A FULL PACKAGE: Lithium Iron Phosphate (LFP), Nickel-Manganese-Cobalt (NMC), Lithium Nickel Starting at the beginning of the year, the KnowMade monitors include the following Cobalt Aluminium Oxide (NCA), Lithium Nickel Metal Dioxide (LiNiMO2), Lithium deliverables: Metal Phosphate (LiMPO4), and Lithium Metal Tetroxide (LiMO4); electrolytes including liquid, polymer/gel, and solid inorganics; ceramic and other separators; • An Excel file including the monthly IP database of: battery cells including thin film/microbattery, flexible, cylindrical and prismatic; and • New patent applications battery packs and systems. • Newly granted patents o Post Li-ion Batteries • Expired or abandoned patents Battery technologies including redox-flow batteries, sodium-ion, lithiumsulfur, lithium- • Transfer of IP rights through re-assignment and licensing air, and magnesium-ion, and their supply chains, including electrodes, electrolytes, • Patent litigation and opposition battery cells and battery packs/systems. • Quarterly report including a PDF slide deck with the key facts & figures of the o Solid-State Batteries quarter: IP trends over the three last months, with a close look to key IP players and Supply chain including electrodes, battery cells, battery packs/systems and key patented technologies. electrolytes, including polymer, inorganic and inorganic/polymer, inorganic materials, including argyrodites, LIthium Super Ionic CONductor, (LISICONs), Thio-LISICONs, o GaN for Power & RF Electronics sulfide glasses, oxide glasses, perovskites, anti-perovskites and garnets. Wafers and epiwafers, GaN-on-SiC, silicon, sapphire or diamond, semiconductor devices such as transistors, and diodes, devices and applications including converters, o RF Acoustic Wave Filters rectifiers, switches, amplifiers, filters, and Monolothic Microwave Integrated Circuits Including Surface Acoustic Wave (SAW), Temperature Compensated (TC)- SAW, Bulk (MMICs), packaging, modules and systems. Acoustic Wave- Free-standing Bulk Acoustic Resonator (BAWFBAR), BAW-Solidly- Mounted Resonator (BAW-SMR), and Packaging. o GaN for Optoelectronics & Photonics Wafers and epiwafers, GaN-on-sapphire, SiC or silicon; semiconductor devices such o RF Power Amplifiers as LEDs and lasers; and applications including lighting, display, visible communication, Including Low Noise Amplifiers, Doherty Amplifiers, Packaging, and Millimeter-Wave photonics, packaging, modules and systems. technology. o RF Front-End Modules o Microfluidics From components to chips and systems, including all applications.

o About Micronews Media ONLINE ONSITE INPERSON To meet the growing demand for market, technological and business information, @Micronews e-newsletter i-Micronews.com Events Webcasts Micronews Media integrates several tools able i-Micronewsjp.com to reach each individual contact within its FreeFullPDF.com network.We will ensure you benefit from this. Brand visibility, networking Targeted audience opportunities involvement equals clear, Unique, cost-effective ways Today's technology makes it concise perception of your to reach global audiences. easy for us to communicate company’s message. Online display advertising regularly, quickly, and Webcasts are a smart, campaigns are great strategies inexpensively – but when innovative way of for improving your understanding each other is communicating to a wider product/brand visibility. They critical, there is no substitute targeted audience. Webcasts are also an efficient way to for meeting in-person. Events create very useful, dynamic adapt with the demands of the are the best way to exchange reference material for times and to evolve an effective ideas with your customers, attendees and also for marketing plan and strategy. partners, prospects while absentees, thanks to the increasing your brand/product recording technology. visibility. Benefit from the i-Micronews.com traffic generated by the 11,200+ Several key events planned for Gain new leads for your business monthly unique visitors, the 2018 on different topics to from an average of 340 10,500+ weekly readers of attract 120 attendees on average registrants per webcast @Micronews e-newsletter

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o CONSULTING AND SPECIFIC ANALYSIS, REPORT BUSINESS o FINANCIAL SERVICES (in partnership with Woodside Capital • North America: Partners) • Steve LaFerriere, Senior Sales Director for Western US & Canada • Jean-Christophe Eloy, CEO & President Email: [email protected] – + 1 310 600-8267 Email: [email protected] - +33 4 72 83 01 80 • Ivan Donaldson, VP of Financial Market Development • Chris Youman, Senior Sales Director for Eastern US & Canada Email: [email protected] - +1 208 850 3914 Email: [email protected] – +1 919 607 9839 • Japan & Rest of Asia: o CUSTOM PROJECT SERVICES • Takashi Onozawa, General Manager, Asia Business Development • Jérome Azémar, Technical Project Development Director (India & ROA) Email: [email protected] - +33 6 27 68 69 33 Email: [email protected] - +81 34405-9204 • Miho Othake, Account Manager (Japan) o GENERAL Email: [email protected] - +81 3 4405 9204 • Camille Veyrier, Director, Marketing & Communication • Itsuyo Oshiba, Account Manager (Japan & Singapore) Email: [email protected] - +33 472 83 01 01 Email: [email protected] - +81-80-3577-3042 • Sandrine Leroy, Director, Public Relations • Korea: Peter Ok, Business Development Director Email: [email protected] - +33 4 72 83 01 89 / +33 6 33 11 61 55 Email: [email protected] - +82 10 4089 0233 • Email: [email protected] - +33 4 72 83 01 80 • Greater China: Mavis Wang, Director of Greater China Business Development Email: [email protected] - +886 979 336 809 • Europe: Lizzie Levenez, EMEA Business Development Manager Email: [email protected] - +49 15 123 544 182 Follow us on • RoW: Jean-Christophe Eloy, CEO & President, Yole Développement Email [email protected] - +33 4 72 83 01 80