IPC CHECKLIST for Producing Rigid Printed Board Assemblies

Revision June 2019 IPC Offices

IPC (Headquarters) IPC Atlanta Office 333 North Point Center East 3000 Lakeside Drive, 105 N Suite 260 Bannockburn, IL 60015 Alpharetta, GA 30022 Tel: + 1 847-615-7100 Tel: + 1 847-615-7100

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IPC Europe IPC Brussels Boulevard du Souverain 280 1160 Brussels (Auderghem) Belgium Tel: +32 (0)2 740 22 35 Philippe Leonard Director of Operations [email protected]

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IPC India IPC Technology Consulting Pvt. Ltd. Old No. 269, (New No. 35), 2nd Floor, 5th Main 4th Block, Jayanagar, Bangalore, 560011 Tel: +91 80 26532211 [email protected]

IPC China IPC China — Chengdu Office Room 714, Electronics Industry Building, #159 IPC China HQ East First Ring Road, Chengdu, 610054, PRC 5F B3-1, Block B, International Innovation Park, 成都市一环路东一段159号电子信息产业大厦714 室 #1 First Keyuanwei Rd., Laoshan District, Qingdao, 266101, PRC 青岛市崂山区科苑纬一路1号国际创新园B座5层B3-1 IPC Greater China — Beijing Office 邮编： 266101 Room 4010, China Railway 19TH Bldg., Tel: +86 400 6218 610 #19 Ronghua south Rd., Beijing, 100176 PRC 北京市经济技术开发区荣华南路19号中铁十九局4010室 IPC China — Suzhou Office 邮编：100176 Room 1909, 200#, Xinghai Street, Xinghai International Business Square, IPC China — Shenzhen Office Suzhou Industrial Park. 215021,PRC 27F A-D, Xin Baohui Building, Nanhai Avenue, 苏州工业园区星海街号星海国际广场室 200 1909 Nanshan District, Shenzhen, 518054, PRC Tel: +86 21 2221 0030 深圳市南山区南海大道新保辉大厦27楼A-D 邮编： 2150215 邮编：518054 Tel: +86 21 2221 0070 IPC China — Shanghai Office Room 510, Modern Logistic Building,#448 IPC Greater China – Taipei Office Hongcao Rd., Xuhui District, Shanghai, 200233, PRC 14F., No.8, Sec. 5, Xinyi Rd., Xinyi Dist., 上海市徐汇区虹漕路448号现代物流大厦510室 Taipei City 110, Taiwan (R.O.C.) 11049 邮编：200233 Tel: +86 21 2221 0000

2 Contents

IPC Offices...... 2 Purpose of IPC Checklists...... 4 Chain of Production...... 5 IPC Reference Standards...... 6 IPC Performance Class 1, 2, or 3...... 8 IPC Producibility Levels...... 9 Checklist at the Project Start Level...... 10 Checklist at the CAD Level...... 11 Checklist at Printed Board Ordering Level...... 12 Checklist at Printed Board Assembly Ordering Level...... 13 Checklist for Cleaning and Conformal Coating...... 14 Terms and Definitions...... 15 IPC STANDARDS — Everything You Need from Start to Finish...... 16 Phenomena in Cross Section of Plated Through Holes...... 17

IPC China — Chengdu Office Attachments Room 714, Electronics Industry Building, #159 East First Ring Road, Chengdu, 610054, PRC CAD Rigid Text Standards — Design...... 18 成都市一环路东一段159号电子信息产业大厦714 室 PCB Rigid with IPC Standards...... 19 IPC Greater China — Beijing Office Room 4010, China Railway 19TH Bldg., #19 Ronghua south Rd., Beijing, 100176 PRC PCBA Rigid with IPC Standards — Soldering and Assembly...... 20 北京市经济技术开发区荣华南路19号中铁十九局4010室邮编：100176 Cleaning and Coating with IPC Standards...... 21

IPC China — Shenzhen Office LAB — Board/Assembly Quality Check...... 22 27F A-D, Xin Baohui Building, Nanhai Avenue, Nanshan District, Shenzhen, 518054, PRC Guide for CAD and PCB...... 23 深圳市南山区南海大道新保辉大厦27楼A-D 邮编：518054 Guide for PCBA...... 24 Tel: +86 21 2221 0070

IPC Greater China – Taipei Office Notes...... 26 14F., No.8, Sec. 5, Xinyi Rd., Xinyi Dist., Taipei City 110, Taiwan (R.O.C.) 11049

Association Connecting Electronics Industries

® 3 Purpose of IPC Checklists

In the entire production chain of a completed rigid printed board assembly number of parameters and varieties exist.

No Rigid Printed Board assembly Parameters Relevant IPC Standard(s) Variables 1 Choice of component package 50 2 Choice of surface finish on components: IPC J-STD-002 10 3 CAD acc to IPC-2221 & 2222 Class 1, 2 or 3 3 4 CAD acc to IPC-2221 & 2222 Level A, B or C 3 5 Footprint/land acc to IPC-7351 Density Level A, B or C 3 6 Demands for cooling in/on printed boards 2 7 Design/CAD of QFN: IPC-7093 3 8 Design/CAD of BGA/CSP: IPC-7095 3 9 Design/CAD of stencils: IPC-7525 5 10 Placement of components 10 11 Choice of printed board base material: IPC-4101 8 12 Choice of printed board base material Cu foil: IPC-4562 2 13 Choice of printed board solder mask: IPC-SM-840 3 14 Choice of printed board surface finish: IPC-4552, 4553, 4554 or 4556 5 15 Choice of printed board handling and storage: IPC-1601 2 16 Age/Wetting of printed board: IPC J-STD-003 3 17 Printed board process steps at supplier: IPC-6011 and 6012 20 18 Different stencil/printing options: IPC-7526 and 7527 5 19 Solder paste/stick/wire options: IPC J-STD-005 and 006 17 20 Flux with solder paste/stick/wire options: IPC J-STD-004 5 21 Reflow/vapor phase/wave/selective/hand options. 5

22 Choice of soldering environments (O2 free, N2 or Air) 3 23 Choice of lead or lead-free process. 2 24 Choice of process cycle: IPC J-STD-020 and 075 10 25 Choice of moisture sensitive level (MSL): IPC J-STD-033 5 26 Choice of cleaning method: IPC-CH-65, IPC-5702, IPC-5703 4 27 Conformal coating IPC-CC-830, J-STD-001 3 28 Printed board assembly requirements Class 1, 2 or 3: IPC J-STD-001 3 29 Printed board assembly acceptability Class 1, 2 or 3: IPC-A-610 3 30 Printed board assembly touch up and repair: IPC-7711/21 3 Printed board assembly requirements/acceptability for electronic enclosures: 31 6 IPC-A-630 Printed board assembly requirements/acceptability for cable: IPC/ 32 3 WHMA-A-620 Total variables 212

Theoretically, if each of these 32 parameters and their 212 variables depend on each other (worst case and not true), the number of potential combinations is as high as 4 200 000 000 000 000 000 0, (4,2E19) — too many to be handled by the human brain. The purpose of this IPC Checklist is to assist all involved in the entire production chain of Printed board’s (see facing page) in minimizing the risk of combinations that don´t give good solder joints according to 4 IPC-A-610 Class 1, 2 or 3. Chain of Production

MARKET DEMANDS: Quicker. Smaller. ELECTRONIC DESIGN Smarter. Analog technique and/or digital technique. Higher quality. Components Thru Hole Technology (THT), Surface mounted (SMD) and/or embedded (HDI). Around 5 million to choose between.

ELECTRONIC DESIGN Choice of components (BOM). Draw schematic diagram and create a Net list.

CAD Create footprints and make electrical connections without any shorts plus consider EMC regulations and cleaning and conformal coating.

CAD GERBER FILES are created. A printed board specification is established.

PRINTED BOARD MANUFACTURING

ASSEMBLING AND SOLDERING Purchase components according to BOM. Purchase printed boards. Purchase solder paste. Purchase solder paste stencil. Receive Pick & Place data. Assembly, soldering, testing and final assembly plus cleaning and conformal coating of printed board assemblies.

Association Connecting Electronics Industries

® 5 IPC Reference Standards

1. IPC-2221, Generic Standard on Printed Board 18. IPC-7527, Requirements for Solder Paste Design Printing

2. IPC-2222, Sectional Design Standard for Rigid 19. IPC-4562, Metal Foil for Printed Board Organic Printed Boards Applications

3. IPC-2141, Design Guide for High-Speed 20. IPC-4563, Resin Coated Copper Foil for Controlled Impedance Circuit Boards Printed Boards Guideline

4. IPC-2251, Design Guide for the Packaging of 21. IPC-4101, Specification for Base Material for High Speed Electronic Circuits Rigid and Multilayer Printed Boards

5. IPC-2152, Standard for Determining Current 22. IPC-4121, Guidelines for Selecting Core Carrying Capacity in printed board Design Construction for Multilayer Printed Wiring Board Applications 6. IPC-2615, Printed Board Dimensions and Tolerances 23. IPC-6011, Generic Performance Specification for Printed Boards 7. IPC-2581, Generic Requirements for Printed Board Assembly Products Manufacturing 24. IPC-6012, Qualification and Performance Description Data and Transfer Methodology Specification for Rigid Printed Boards

8. J-STD-002, Solderability Tests for 25. IPC-SM-840, Qualification and Performance Components Leads, Terminations, Lugs and Specification of Permanent Solder Mask and Wires Flexible Cover Materials

9. J-STD-033, Handling, Packing, Shipping and 26. IPC-4552, Specification for Electroless Nickel/ Use of Moisture/Reflow Sensitive Surface Immersion Gold (ENIG) Plating for Printed Mount Devises Boards

10. IPC-7092, Design and Assembly Process 27. IPC-4553, Specification for Immersion Silver Implementation for Embedded Components Plating for Printed Boards

11. IPC-7093, Design and Assembly Process 28. IPC-4554, Specification for Immersion Tin Implementation for Bottom Termination Plating for Printed Boards (Typical QFN and LCC) Components 29. IPC-4556, Specification for Electroless 12. IPC-7094, Design and Assembly Process Nickel/Electroless Palladium/Immersion Gold Implementation for Flip Chip and Die Size (ENEPIG) Plating for Printed Boards Components 30. IPC-A-600, Acceptability of Printed Boards 13. IPC-7095, Design and Assembly Process Implementation for BGAs 31. J-STD-003, Solderability Tests for Printed Boards 14. J-STD-030, Selection and Application of Board Level Underfill Materials 32. IPC-1601, Printed Board Handling and Storage Guidelines 15. IPC-7351, Land Pattern Calculator and Tools 33. IPC-TM-650, Test Methods Manual 16. IPC-7525, Stencil Design Guidelines 34. IPC-9691, User Guide for the IPC-TM-650, 17. IPC-7526, Stencil and Misprinted Board Method 2.6.25, Conductive Anodic Filament Cleaning Handbook (CAF) Resistance Test (Electrochemical Migration Testing)

Please NOTE: • Applicable documents are referenced in the standard but the requirements are not invoked unless specifically stated. • Related standards would have no call out, only useful references. 6 IPC Reference Standards

35. IPC-1752, Material Declaration Management 54. IPC-5703, Cleanliness Guidelines for Printed Board Fabricators 36. J-STD-609, IPC/JEDEC Marking and Labeling of Components, Printed Boards and Printed board’s 55. IPC-5704, Cleanliness Requirements for to Identify (Pb), Lead Free (Pb-Free) and Other Unpopulated Printed Boards Attributes 56. IPC-8497-1, Cleaning Methods and Contamination 37. J-STD-001, Requirements for Soldered Electrical Assessment for Optical Assembly and Electronic Assemblies 57. IPC-9201, Surface Insulation Resistance Handbook 38. IPC-HDBK-001, Handbook and Guide to Supplement J-STD-001 58. IPC-9202, Material and Process Characterization/ Qualification Test Protocol for Assessing 39. J-STD-004, Requirements for Soldering Fluxes Electrochemical Performance

40. J-STD-005, Requirements for Soldering Pastes 59. IPC-9203, User Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle 41. IPC-HDBK-005, Guide to Solder Paste Assessment 60. IPC-PE-740, Troubleshooting for Printed Board 42. J-STD-006, Requirements for Electronic Grade Manufacture and Assembly Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Solder Applications 61. IPC-CC-830, Qualification and Performance of Electrical Insulating Compounds for Printed Wiring 43. IPC-A-610, Acceptability of Electronic Assemblies Assemblies – Includes Amendment 1

44. IPC-7711/21, Rework, Modification and Repair of 62. IPC-HDBK-830, Guidelines for Design, Selection and Electronic Assemblies Application of Conformal Coatings

45. IPC/WHMA-A-620, Requirements and Acceptability 63. IPC-AJ-820, Assembly and Joining Handbook for Cable and Wire Harness Assemblies 64. IPC-A-630, Acceptability Standard for Manufacture, 46. J-STD-020, Moisture/Reflow Sensitivity Inspection and Testing of Electronic Enclosures Classification for Nonhermetic Solid State Surface Mount Devices 65. IPC-T-50, Terms and Definitions for Interconnecting and Packaging Electronic Circuits 47. J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes 66. IPC-9701, Performance Test Methods and Qualification Requirements for Surface Mount 48. IPC-2611, Generic Requirements for Electronic Solder Attachments Product Documentation 67. IPC-9704, Printed Circuit Assembly Strain Gage Test 49. IPC-2612, Sectional Requirements for Electronic Guideline Diagramming Documentation (Schematic and Logic Descriptions) 68. IPC-9706, Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT 50. IPC-2614, Sectional Requirements for Board Component Solder Crack and Pad Crater/Trace Crack Fabrication Documentation Detection

51. IPC-CH-65, Guidelines for Cleaning of Circuit Boards 69. IPC-9709, Test Guidelines for Acoustic Emission and Assemblies Measurement during Mechanical Testing

52. IPC-5701, User Guide for Cleanliness of 70. IPC-SM-817, General Requirements for Dielectric Unpopulated Printed Boards Surface Mount Adhesives

53. IPC-5702, Guidelines for OEMs in Determining 71. IPC-HDBK-850, Guidelines for Design, Selection and Acceptable Levels of Cleanliness of Unpopulated Application of Potting Materials and Encapsulation Printed Boards Processes Used for Electronics Printed Circuit Board Assembly

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® 7 IPC Performance Classes

Performance Classes Three general classes have been established to reflect progressive increases in sophistication, functional performance requirements and testing/inspection frequency. It should be recognized that there may be an overlap of equipment categories in different classes. The user has the responsibility to specify in the contract or purchase order, the performance class required for each product and shall indicate any exceptions to specific parameters, where appropriate.

IPC Class 1: General Electronic Products — Includes consumer products and some computer and computer peripherals suitable for applications where cosmetic imperfections are not important and the major requirement is function of the completed printed board.

IPC Class 2: Dedicated Service Electronic Products — Includes communications equipment, sophisticated business machines, instruments where high performance and extended life are required and for which uninterrupted service is desired but not critical. Certain cosmetic imperfections are allowed.

IPC Class 3: High Reliability or Harsh Operating Environment Electronic Products — Includes the equipment and products where continued performance or performance on demand is critical. Equipment downtime cannot be tolerated and must function when required such as in life support items or flight control systems. Printed boards in this class are suitable for applications where high levels of assurance are required and service is essential.

Please NOTE that the final performance class for printed board assemblies (assembled, soldered, cleaned and tested) cannot be any greater than the performance class called out for the bare printed board.

That is, in order to obtain a Class 3 with the assembly printed board assembly, an IPC Class 3 recognition of the bare printed board (anything with a Class 2 or 1 with the bare printed board prevents obtaining a Class 3 with the printed board assembly) must be first obtained.

8 IPC Producibility Levels

Producibility Levels When appropriate, IPC standards (IPC-2221, IPC-2222 and IPC-7351) provide three design producibility levels of features, tolerances, measurements, assembly and testing of completion or verification of the manufacturing process. These reflect progressive increases in the sophistication of tooling, materials and/or processing and therefore, progressive increases in fabrication cost.

These levels are: Level A: General Design Producibility — Preferred Level B: Moderate Design Producibility — Standard Level C: High Design Producibility — Reduced

The producibility levels are not to be interpreted as a design requirement, but a method of communicating the degree of difficulty of a feature between design and fabrication/assembly facilities. The use of one level for a specific feature does not mean that other features must be of the same level. Selection should always be based on the minimum need, while recognizing that the precision, performance, conductive pattern density, equipment, assembly and testing requirements determine the design producibility level. The numbers listed within the numerous tables are to be used as a guide in determining what the level of producibility will be for any feature. The specific requirement for any feature that must be controlled on the end item shall be specified on the master drawing of the printed board or the printed board assembly drawing.

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® 9 Checklist at the Project Start Level

E Responsible Demand on Assembly IPC Standard Information Check 1 Project Leader IPC Class 1, 2 or 3? IPC-2221 Any Additional/Exceptions 2 Project Leader IPC Level A, B or C? IPC-2221 Any Additional/Exceptions 3 Project Leader IPC Level A, B, C or D? IPC-1752 Material Declaration 4 Project Leader RoHS 1 or RoHS 2? Valid for both printed board and printed board 5 Project Leader Touch up and Repair allowed? IPC-7711/21 assembly? Different surfaces have different wetting. Can 6 Project Leader Surface finish on components? J-STD-002 be of importance for achieving IPC Class 3. IPC-020 and Max Temp, Thermal gradient and H O 7 Project Leader Process Sensitivity Level (PSL) 2 IPC-075 Sensitivity. IPC-4552, Different Surface Finishes have Different 8 Project Leader Surface finish on Printed Boards? IPC-4553 and wetting and durability. IPC-4554 Moisture Sensitive Level of more importance 9 Project Leader MSL on components J-STD-033 for a Pb-Free process. Marking and Labeling of Components, printed boards and Printed board’s 10 Project Leader J-STD-609 to Identify Pb, Pb-Free and Other Attributes. 11 Project Leader Voids? IPC-7095 In the balls of BGA and CSP components 12 Project Leader UL class? Underwriters Laboratories 13 Project Leader Cleaning and Conformal Coating IPC-CH-65 See Checklist I, page 19. EMC on the printed board and Needed for CE Different Standards/Demands in different 14 Electronic Designer components? marking countries? 15 Electronic Designer Impedance? IPC-2141 16 Electronic Designer High speed/frequency? IPC-2251 17 Electronic Designer High amperes? IPC-2152 Base material properties for All Base Material have different values for Tg, 18 Electronic Designer IPC-4101 mechanical, electrical and thermal? Td, Dk and CTE. 19 Project Leader Cooling in- & outside printed boards? IPC-2221 20 Electronic Designer Cu foil quality? IPC-4562 Different Cu Foils in the market 21 Electronic Designer CAF base material? IPC-9691 Conductive Anodic Filament 22 Electronic Designer Embedded in the Assembly? IPC-7092 23 Electronic Designer BGA/CSP on the Assembly IPC-7095 24 Electronic Designer QFN on the Assembly? IPC-7093 25 Electronic Designer Flip Chip on the Assembly? IPC-7094 Minimum isolation distances between IPC-2221 and 26 Electronic Designer holes and tracks? IPC-2222 27 Electronic Designer Final size (LxWxT)? 28 Electronic Designer Number of layers? IPC-4121 Buildup of an multilayer printed board 29 Electronic Designer Mechanical tolerances? IPC-2615 Mechanical Drawings Standard Assembly SMDx1, SMDx2 THT or in 30 Electronic Designer combination? Predestinated component placements 31 Electronic Designer IPC-7351 and forbidden areas? IPC-2611, If not all needed data are included, the IPC-2612 Project Leader & Documentation requests material interface between CAD and CAM at the 32 IPC-2612-1, Electronic Designer declaration printed board and printed board assembly IPC-2614 and supplier will be unclear. IPC-2615

10 Checklist at the CAD Level

Demand on printed F Responsible IPC Standard Information Check board assembly 1 CAD Department IPC Class 1, 2 or 3? IPC-2221 Any Additional/Exceptions 2 CAD Department IPC Level A, B or C? IPC-2221 and IPC-2222 Any Additional/Exceptions Footprints Level Density A, 3 CAD Department IPC-7351 Footprint = Land B or C? Marking and labeling of Components, Printed Boards Where the Marking and Labeling shall be done. 4 CAD Department and Printed Board Assemblies J-STD-609 Place, in the Cu or in the Solder Mask to Identify Pb, Pb-Free and Other Attributes. 5 CAD Department Voids? IPC-7095 In the balls of BGA and CSP components To solve the EMC on the printed board level is 6 CAD Department EMC on the printed board? preferable. 7 CAD Department Impedance? IPC-2141 Tolerances? 8 CAD Department High speed/frequency? IPC-2251 9 CAD Department High amperes? IPC-2152 Base material properties for All Base Material have different values for Tg, Td, Dk 10 CAD Department mechanical, electrical and IPC-4101 and CTE. thermal? Minimum isolation distances 11 CAD Department IPC-2221 and IPC-2222 between holes and tracks? Guideline for Selecting Core Construction for 12 CAD Department Number of layers? IPC-4121 Multilayer Applications 13 CAD Department CAF base material? IPC-9691 Conductive Anodic Filament 14 CAD Department Embedded in the assembly? IPC-7092 BGA/CSP on the printed board 15 CAD Department IPC-7095 assembly? QFN on the printed board 16 CAD Department IPC-7093 assembly? Flip Chip On The Printed Board 17 CAD Department IPC-7094 Assembly? 18 CAD Department Mechanical Tolerances? IPC-2615 Mechanical Drawings Standard Solder Paste Application By 19 CAD Department Screen Printing With A Stencil IPC-7525 and IPC-7527 Or Via Dispensing? Component Placement And Does the operators have valid IPC CID and/or 20 CAD Department Routing CID+ Certification 21 CAD Department Cleaning & Conformal Coating IPC-2221 See Checklist I page 18 22 CAD Department Format Of The Data Files IPC-2581 Gerber, ODB+++ or GenCam Are all needed data for printed board and printed board IPC-2611, IPC-2612 IPC- If not all needed data are included, the interface assembly included? Mechanical 23 CAD Department 2612-1, IPC-2614 and between CAD and CAM at the printed board and and electrical drawings IPC-2615 printed board assembly supplier will be unclear. understandable? Complete BOM list?

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® 11 Checklist at the Printed Board Ordering Level

Demand on Printed G Responsible IPC Standard Information Check Board Any Additional/Exceptions 3/A See Performance according to 1 Purchasing Department IPC-6011 and IPC-6012 Appendix A in 6012C See Appendix IPC Class 1, 2, 3 or 3/A? B in 6012C Base Material Properties Must be a number like 2 Purchasing Department for Mechanical, Electrical IPC-4101 IPC-4101C/xx and Thermal? 3 Purchasing Department Impedance? IPC-2141 Tolerances? Guideline for Selecting Core 4 Purchasing Department Number of Layers? IPC-4121 Construction for Multilayer Applications 5 Purchasing Department CAF Base Material? IPC-9691 Conductive Anodic Filament IPC-4552, IPC-4553, Different Surface Finishes have 6 Purchasing Department Surface Finish? IPC-4554 and IPC-4556 different wetting and durability. 7 Purchasing Department Mechanical Tolerances? IPC-2615 Mechanical Drawings Standard If not all needed data are included, Are all needed data Purchasing Department and IPC-2611, IPC-2612 the interface between CAD and 8 for printed board CAD IPC-2612-1 and IPC-2614 CAM at the printed board supplier manufacturing included? will be unclear. Purchasing Department Plus Acceptability of printed Does the operators have valid IPC-6011, IPC-6012 and 9 at the delivery department at board according to IPC IPC-A-600 CIS and/or CIT Training IPC-A-600 the printed board fabricator Class 1, 2 or 3? and Certification The wetting of the printed board is Solderability of printed 10 Purchasing Department J-STD-003 essential for achieving the perfect board solder joint. Are the Printed boards IPC-6012, IPC-A-600 and 11 Purchasing Department See Checklist I, page 19. clean and dry? IPC-5703 Printed Board Handling and 12 Purchasing Department IPC-1601 Storage? IPC-A-600 CIS and CIT Training and Incoming department at Acceptability of printed Certification. Routines for studying 13 the printed board assembly board according to IPC IPC-A-600 and saving printed board protocols operation Class 1, 2 or 3? and micro sections.

12 Checklist at Printed Board Assembly Ordering Level

Demand on Printed H Responsible IPC Standard Information Check board assembly Performance according Does responsible staff have valid J-STD-001 CIS 1 Purchasing Department J-STD-001 to IPC Class 1, 2 or 3? and/or CIT Training and Certification? Requirements for J-STD-001 Which requirements are valid/demanded for 2 Purchasing Department Soldered Electronic IPC-HDBK-001 article X? Handbook available! Assemblies IPC ESD Certification found Does the EMS/OEM have a ESD plan, control 3 Purchasing Department ESD Demands? in IPC EDGE routines and education to fulfill the necessary IEC-61340C/ANSI 20.20 ESD level? MSL on components in J-STD-033, J-STD-020 and Demands for Moisture Sensitive Level? Shall 4 Purchasing Department the factory? J-STD-075 printed board also be included? Solderability Tests on 5 Purchasing Department J-STD-002 Not all Surfaces Finishes have the same wetting. Component Terminations Solderability of printed J-STD-003 The wetting of the printed board is essential for 6 Purchasing Department board IPC-1601 achieving the perfect solder joint. J-STD-004 Choices of this parameters have influence for the 7 Purchasing Department Flux, Paste, Solder J-STD-005 solder joint and cleaning J-STD-006 8 Purchasing Department Type of Stencil? IPC-7525 Fluxofobic Coatings? Stencil Printing 9 Purchasing Department IPC-7527 SPI Parameters Tolerances? Stencil and Misprinted 10 Purchasing Department IPC-7526 Handbook! Board Cleaning? Moisture/Reflow J-STD-033, J-STD-020 and 11 Purchasing Department Sensitivity Classification More important in a Pb-Free process J-STD-075 of Components 12 Purchasing Department Assembly and Joining IPC-AJ-820 Handbook available! Acceptability of printed Does the operators have valid IPC-A-610 CIS 13 Purchasing Department board assembly acc. to IPC-A-610 and/or CIT Training and Certification IPC Class 1, 2 or 3? Rework, Modifications Is it allowed to do Touch up and Repair? Does and Repair of printed 14 Purchasing Department IPC-7711/21 the operators have valid IPC-7711/21 CIS and board and printed board CIT Training and Certification assembly? IPC-CH-65 Cleaning and Conformal IPC-CC-830 Many parameters to control to get the printed 15 Purchasing Department Coating? IPC-HDBK-830 board assembly clean. IPC-9505 Does the operators have valid IPC-A-620 CIS 16 Purchasing Department Cabling IPC/WHMA-A-620 and/or CIT Training and Certification 17 Purchasing Department Material Declaration IPC-1752 Level A, B, C or D? Different regulations in different countries.

Association Connecting Electronics Industries

® 13 Checklist for Cleaning and Conformal Coating

Demand on printed board I Responsible IPC Standard Information Check assembly Does responsible staff Is cleaning a demand? If yes, which IPC-6012, J-STD-001, have valid IPC-6012 and 1 Project Leader type alcohol, solvent, semi aqueous IPC-AJ-820 and J-STD-001 CIS and/or CIT or aqueous? IPC-TM-650 Training and Certification Which requirements are J-STD-001 2 Project Leader Which cleaning levels shall apply? valid/demanded for article IPC-HDBK-001 X? Handbook available!

3 Electronic Designer Are the compatible with cleaning? Define a test procedure.

Max Temp, Temperature 4 Project Leader Process Sensitivity Level (PSL) IPC-020 and IPC-075 gradient and H2O Sensitivity. 5 Electronic Designer Do components need stand off? IPC-2221 Electronic Designer and Component placement It must be possible for the 6 considerations due to cleaning and IPC-2221 cleaning agent to reach all CAD Department Conformal Coating surfaces. Printed board thickness to PTH Ø Aspect Ratio < 5 are 7 CAD Department IPC-2221 Tenting? preferred IPC-5701, IPC-5702, Printed boards need to be Cleanliness of unpopulated printed IPC-5703 and IPC-5704 8 Purchasing Department clean when they arrive from boards bare printed boards printed board fabricator. IPC-9201, IPC-9202 and Which methods will be 9 Purchasing Department Test methods of cleanliness IPC-9203 needed? IPC-CH-65 and Type of cleaning method? 10 Purchasing Department Assembling and cleaning IPC-AJ-820 Handbook! Does the printed board assembly 11 Purchasing Department IPC-8497 include optical Assembly? IPC-CC830 and More important in a Lead 12 Purchasing Department Conformal Coating IPC-HDBK-830 (Pb) free process Different regulations in 13 Purchasing Department Material Declaration IPC-1752 Level A, B, C or D? different countries. Does the operators have Acceptability of printed board valid IPC-A-610 CIS 14 Purchasing Department assembly acc. to IPC Class 1, 2 or IPC-A-610 and/or CIT Training and 3? Certification

14 Terms and Definitions

PCB Printed Circuit Board (Bare Board) PCBA Printed Circuit Board Assembly QFN Quad Flatpack - No Lead BGA Ball Grid Array BTC Bottom Termination Component CE Conformité Européenne (In accordance with EU Directives) CSP Chip Scale Package ESD Electrostatic Discharge EMC Electromagnetic Compatibility LCC Leadless Chip Carrier LCCC Leadless Ceramic Chip Carrier JEDEC Joint Electron Device Engineering Council CAF Conductive Anodic Filament UL Underwriters Laboratories Tg Glass Transition Temperature Td Laminate Temperature of Decomposition CTE Coefficient of Thermal Expansion Dk Dielectric Constant CID Certified Interconnect Designer (Basic) CID+ Certified Interconnect Designer (Advanced) CIS Certified IPC Application Specialist CIT Certified IPC Trainer Pb Lead RoHS Restriction of Hazardous Substances Directive BOM Bill of Materials CAD Computer Aided Design CAM Computer Aided Manufacturing

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® 15 IPC STANDARDS — Everything You NeedIPC SANDARDSfrom Start to Finish ® EVERHING NEED FR SAR FINISH

EndProduct Advanced Packaging IPC SD030 Acceptability Standard for IPC7091 Manufacture, Inspection, & Testing SMT Reliability IPC7092 of Electronic Enclosures IPC9701IPC9704 IPC7093 IPCA630 IPCHDB630 IPC9706IPC9709 IPC7094 IPC7095 Repair Requirements and Acceptance for Storage IPC771121 Cable and Wire Harness Assemblies IPCHAA620 IPCD620 IPCHDB620 & Handling IPC SD020 Solderability IPC SD033 IPC SD002 IPC SD075 IPC SD003 Acceptability of Electronic Assemblies IPC1601 IPCA610 Stencil Design Test Methods Guidelines IPC650 IPC7525 Requirements for Soldered IPC9241 IPC7526 Electronic Assemblies IPC9631 IPC7527 IPC SD001 IPCHDB001 IPCA820 IPC9691

Assembly Electrical Test Materials Acceptability of Printed Boards IPC9252 IPC SD004 IPCA600 IPC SD005 Surface IPCHDB005 Finishes IPC SD006 Qualifications for Printed Boards IPC6011 6012 6013 6017 6018 IPC4552 IPCS817 IPC4553 IPCCC830 IPC4554 HDB830 IPC4556 HDB850 Base Materials for Printed Boards IPC4101 4103 4104 4202 4203 4204 High Speed/ Solder Mask Frequency IPCS840 IPC2141 Design & Land Patterns IPC2251 Copper Foils IPC2221 2222 2223 2226 7351 IPC4562 Materials Declaration Data Transfer and Electronic IPC1751 Product Documentation IPC1752 IPC2581 Series IPC2610 Series IPC1755 IPC erms and Definitions IPC50 earn about IPC standards at ipcorgstandards 16 April 2019 Phenomena in Cross Section of Plated Through Holes Phenomena in Cross Section of Plated Through Holes

C 32 A 6 33 1 B 20 A Undercut 20 Burr Pushed Into Hole 34 B Outgrowth 21 21 Glass Fiber Protrusion C Overhang 7 10 22 Innerlayer (Post) Separation 11 23 Wicking Phenomena 1 (Resin) in Blistering Cross Section2 of Plated Through22 Holes 24 Over Plating Resist Void 2 Laminate Void 12 23 25 (Positive) Etchback 3 (Resin) Delamination 36 26 Barrel Crack 4 PadC Cratering 13 24 27 Shadowing 5 Lifted Land Crack 3 32 28 Nodule A 6 14 33 25 1 6 Burr 26 29 Resin Smear 7 BondB Enhancement 20 35 30 Copper & Over Plate Void removed — “Pink Ring” A Undercut 15 27 20 Burr Pushed Into Hole 31 Burned Plating 8 Negative Etchback B Outgrowth 34 21 Glass Fiber Protrusion37 32 Copper Foil Contamination 9 Foil Crack 21 C Overhang 10 16 2238 Innerlayer (Post) Separation 33 Lifted Land 10 Hole Plating Void7 28 8 23 Wicking 34 Resin Crack Delamination 11 Wedge Void 11 1 (Resin) Blistering 2 22 29 24 Over Plating Resist Void 35 Crazing 12 Glass Fiber Void 4 37 2 Laminate Void 12 30 25 (Positive) Etchback 36 Foreign Inclusion 3 (Resin) Delamination 13 Glass Bundle Void 23 26 Barrel Crack 37 Prepreg Void 14 Severe Etchback 9 36 4 Pad Cratering 13 24 17 4027 Shadowing 39 38 Copper Clad Laminate Void 5 Lifted Land Crack 3 15 Nail Heading 25 28 Nodule 39 Measling 6 Burr 16 Drill Wall Tear/Wicking 14 18 29 Resin Smear 40 Resin Recession 17 Hole Wall Pull Away 5 26 35 7 Bond Enhancement Phenomena in Cross31 Section30 Copper &of Over PlatePlated Void Through41 Glass-Weave Texture Holes Phenomena removed in — “PinkCross Ring” Section18 Corner Crack of Plated15 Through27 Holes 31 Burned Plating 41 42 42 Glass-Weave Exposure 8 Negative Etchback 19 (Copper) Blistering 37 32 Copper Foil Contamination 9 Foil Crack 19 33 Lifted Land 16 28 38C 10 Hole PlatingC Void 8 34 Resin Crack Delamination Originally Designed by 11 Wedge Void 32 35 Crazing 32 Viasystems Mommers BV. Netherlands A 33 29 A37 6 33 12 Glass Fiber Void 4 6 1 36 Foreign Inclusion 1 20 30 20 Reviewed by BTT-PTH 13 Glass BundleB Void B 37 Prepreg Void Atotech Deutschland GmbH. Berlin 14 Severe Etchback 9 A Undercut 38 Copper Clad Laminate Void 20 Burr Pushed Into Hole A Undercut 17 2040 Burr Pushed Into Hole Updated to Industry Standard Terminology 15 Nail Heading B Outgrowth 39 34 21 Glass Fiber Protrusion B Outgrowth 34 21 Glass Fiber Protrusion 39 Measling21 ©IPC 2010, 3000 Lakeside Drive, 16 Drill Wall Tear/Wicking 21 C Overhang 10 Suite 309 S, Bannockburn, IL 60015-124922 Innerlayer (Post) Separation C Overhang 7 10 18 22 Innerlayer (Post)7 Separation 40 Resin Recession 17 Hole Wall Pull Away 5 23 Wicking 11 41 Glass-Weave Texture Tel. 847 615-7100 • Fax 847 615-710523 Wicking 11 1 (Resin) Blistering www.ipc.org • e-mail: orderipc.org24 Over Plating Resist Void 1 (Resin) Blistering 18 Corner2 Crack 22 31 24 2 Over Plating Resist Void 42 Glass-Weave22 Exposure 2 Laminate Void 41 42 12 25 (Positive) Etchback 2 Laminate Void 19 (Copper) Blistering 12 23 25 (Positive) Etchback 23 3 (Resin) Delamination 3 (Resin) Delamination 26 Barrel Crack 36 26 Barrel Crack 19 4 Pad Cratering 36 24 All rights reserved under both international and27 Pan-Amerian Shadowing copyright conventions. 4 Pad Cratering 13 24 27 Shadowing 13 Any copying, scanning or there reproductions of these materials without the prior 5 Lifted Land Crack 5 Lifted Land Crack 3 28 Nodule Originally Designed by written consent of the copyright holder is strictly28 prohibited Nodule and constitutes 3 25 Viasystems 25Mommers BV. Netherlands infringement under the Copyright Law of the United States. 14 14 P-MICRO 6 Burr 6 Burr 29 Resin Smear 26 29 Resin Smear 7 Bond Enhancement 26 7 Bond Enhancement35 30 Copper & Over Plate Void Reviewed by BTT-PTH 35 30 Copper & Over Plate Void removed — “Pink Ring” 15 27 removed — “Pink Ring” 31 Burned Plating 15 Atotech Deutschland27 GmbH. Berlin 31 Burned Plating 8 Negative Etchback 8 Negative Etchback37 32 Copper Foil Contamination 37 32 Copper Foil Contamination 9 Foil Crack Updated to Industry Standard Terminology 9 Foil Crack 16 38 33 Lifted Land 16 ©IPC 2010, 300028 Lakeside Drive, 38 33 Lifted Land 10 Hole Plating Void 8 28 10 Hole Plating Void 34 Resin Crack Delamination8 Suite 309 S, Bannockburn, IL 60015-1249 34 Resin Crack Delamination 11 Wedge Void 11 Wedge Void 35 Crazing Tel. 847 615-710029 • Fax 847 615-7105 35 Crazing 4 29 12 Glass Fiber37 Void 4 www.ipc.org • e-mail: orderipc.org 37 12 Glass Fiber Void 36 Foreign Inclusion 30 36 Foreign Inclusion 13 Glass Bundle Void 30 13 Glass Bundle Void 37 Prepreg Void 37 Prepreg Void 9 14 Severe Etchback 9 14 Severe Etchback 38 Copper Clad Laminate Void 17 40 38 Copper Clad Laminate Void 17 40 15 Nail Heading39 All rights reserved under both international and Pan-Amerian copyright conventions. 39 15 Nail Heading 39 Measling Any copying, scanning or there reproductions of these materials without the prior 39 Measling 16 Drill Wall Tear/Wicking written consent of the copyright holder is strictly prohibited and constitutes 16 Drill Wall Tear/Wicking 40 Resin Recession infringement under the Copyright Law of the United States. 40 Resin Recession 18 18 P-MICRO 17 Hole Wall Pull Away 5 17 Hole Wall Pull Away 5 41 Glass-Weave Texture 31 41 Glass-Weave Texture 31 18 Corner Crack 18 Corner Crack 42 Glass-Weave Exposure 41 42 42 Glass-Weave Exposure 19 (Copper) Blistering 19 (Copper) Blistering41 42 19 19 Originally Designed by Originally Designed by Viasystems Mommers BV. Netherlands Viasystems Mommers BV. Netherlands Association Connecting Electronics Industries Reviewed by BTT-PTH Reviewed by BTT-PTH Atotech Deutschland GmbH. Berlin Atotech Deutschland GmbH. Berlin

Updated to Industry Standard Terminology Updated to Industry Standard Terminology ® ©IPC 2010, 3000 Lakeside Drive, 17 ©IPC 2010, 3000 Lakeside Drive, Suite 309 S, Bannockburn, IL 60015-1249 Suite 309 S, Bannockburn, IL 60015-1249 Tel. 847 615-7100 • Fax 847 615-7105 Tel. 847 615-7100 • Fax 847 615-7105 www.ipc.org • e-mail: orderipc.org www.ipc.org • e-mail: orderipc.org

All rights reserved under both international and Pan-Amerian copyright conventions. All rights reserved under both international and Pan-Amerian copyright conventions. Any copying, scanning or there reproductions of these materials without the prior Any copying, scanning or there reproductions of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States. infringement under the Copyright Law of the United States. P-MICRO P-MICRO CAD Rigid Text Standards — Design o Bare Board T Production CAM AOI Laser plotter Drilling Routing Electrical test Program for: • • • • • Purchasing assembly SMD CAD -2581 C P I standard Drill file & information Gerber files on legend print Gerber file for solder paste stencil Bare Board Specification Mechanical drawing Gerber files on solder mask Gerber files on all copper layer Coordinates for C P 1 I Routing Component placement -7527 C P I Electronic Design -7351 -2152 -2222 -2221 -7525 Footprints C C C C C P P P P P I I I I I standard C P 1 2 3 4 5 I -002 -609 D -7092 D -7093 -2152 -2251 -2141 -7094 -1752 -7095 -2610(15) T Component data T Product specification C C C C C C C C C S S P standard P P P I P P P Electronic scheme P P I I I J- I I I I I J- Net list BOM C 1 Project Leader P 1 2 3 4 5 6 7 8 9 1 10 I

C P

18 I Copyright ED/CAD/CAM rev 03/17 Design PCB Rigid with IPC Standards AOI -840 Stripping M Soldermask application S - C Etch Cu P I Exposure Stripping Sn resist PTH OUT Developing Developing Etch & Flux Optical registration Etch Cu Mylar removal Direct imaging Exposure Stripping El Plating Sn 4-5µm Cure -4556 Lamination C Exposure P I El Plating Cu 25µm Black- oxide Laser plotter Inspect -4121 -4554 L I C Laser Drilling C P P I I from A Pressing T Chemical Plating Cu 2-3µm Lay-up & registration with welding of Ag CAM DA -4563 G C I -4553 SnPb 1-40 µm SnCu 1-40 µm P P G G P C I E I I S N N S P E O E A I 1. HASL 2. HASL 3. 4. Immersion 5. Immersion Sn 6. 7. 8. 9. Nano O wash 2 PTFE H Inspect Drilling -4562

BT Epoxy C -4552 P C I Fr4 IL P I Routing 1 -840 ? -003 Legend printing M D S -601 -6012 -600 - standard T -9691 FR4 BFR Free C C C C S C C P P P P P P I I I J- I I I Tg -4101 C Scoring FR4 High P I Hole plugging FR4 est Probe T El Stacking Delivery -1601 C P I 1/17

C aste water & Chemicals treatment W P I

Association Connecting Electronics Industries Rigid rev 1 Rigid B PCB ® Copyright C 19 P 20 Soldering andAssembly PCBA RigidwithIPCStandards—

Soldering and Assembling IPC-600 IPC-2221/2222 J-STD-003 IPC-7351 IPC-840 Selective Soldering J-STD-075 IPC-4101 IPC-4552 IPC-7525 J-STD-020 IPC-4562 IPC-4553 Control of J-STD-033 Sn bath IPC-7526 IPC-6012 IPC-4554 Wave Soldering

IPC-7527 J-STD-002 IPC-1601 IPC-4556

E Components

G AOI

R O N

I C Manual Assy Unload IPC-A-620 J-STD-004 Dryer

123 456 789 00 PCB J-STD-005 Reflow J-STD-006 IPC-2581 Stencil Paste IPC-7711/21

@ Pick & Place Unload IPC-7526 Cleaning of stencil IPC-7527

Digital Data Screen print

O N I

C SPI

123 456 789 00 IPC-7095

Vapor Phase

X-Ray Pick & Place

J-STD-002 Repair Loading of BGA J-STD-003 Pick & Place Soldability tester IPC-A-610 J-STD-001 IPC-7093 J-STD-002 Jet printer IPC-7095 J-STD-003 IPC-AJ-820 IPC-7711/21 J-STD-004 Loading IPC-HDBK-001 IPC-A-620 J-STD-005 IPC-HDBK-005 J-STD-006 Copyright IPC IPC-HDBK-830 AST Rigid rev 11/17 Cleaning and Coating with IPC Standards -A-610 C isual Inspection P I V acc to Conformal Coating -830 K B -830 C D C H - - Conformal Coating -A-610 C C C P P isual Inspection P I I I V acc to esting T -9201 -9202 -9203 C C C P P P I I I ) T C I P Process Ionic Contamination ( -001 K Aqueous B -65 -650 -740 -820 -001 Conformal Coating H D Conformal Coating J E M D C H A T P - -8497-1 - - - - -A-610 T C C C C C C C S P P P P P P P I I I I I J- I I est T Ionic Contamination Semi aqueous Inline -5701 -5702 -5703 -5704 Solvent Batch cleaning C C C C P P P P I I I I -650 -8 20 Batch cleaning -001 J M T A D Batch cleaning -6012 - - T C C C S P P P I I I J- Alcohol Manual 1/17

Association Connecting Electronics Industries Copyright IPC Cleaning rev 1

Cleaning & Conformal Coating 21 Lab — Board/Assembly Quality Check Analysis & Documentation Micro Section Checking oltage? High V Isolation? Impedance? B C B P C P Micro Section Microscopy Micro Section Cu layer? Dielectric layer? Inspection? Plating integrity? est Electrical T ) Ion Micro Section C I Chromatography ( Part of test coupon ) R I S ( Surface Isolation Resistance ? T pads? Solderability test H M ransform T S T P Part of test coupon In On X E ) Fourier D S E R / I O T R M F E ( Infrared Spectroscopy S F R Part of test coupon X est Ag/Sn Inspection?

T M I , = Scanning Electronic Microscope = E nergy- d ispersive X -ray spectroscopy L X M A E D H , S E : Process Ionic T composition? G thickness I C F F I N A S S P Contamination E M T T I M est coupon T X-ray ? ? E T G C T Many Labs in Europe are Stress test wist Analysis T A B C Bow and P Delamination 288ºC in 10 sec Thermal Mechanical = = X-ray Fluorescense A F = Surface Finish R F M X S T X-ray Documentation 1/17 Annular ring? Cu defects? B rev 1 C P C P I Copyright Board/Assembly Quality Check

22 Board/Assembly Quality Check Guide for CAD and PCB Notes 4 1 2 3,5 2,5 0,95 Price factor 12 0,4 0,8 OSP No 4 0,025 2x140 Variable Variable 1 3 2 2 2 2,5 1,3 0,7 1,5 1,1 Price factor 1 10 0,2 2,2 130 0,05 No 3 Im Ag 2x105 1,5 Mil Max 15 Variable Variable 2 2 2 2 2 2 1,3 1,2 1,5 1,2 1,5 1,2 1,2 1,3 1,4 1,4 1,1 0,6 0,6 1,25 1,75 Price 10-50 factor 8 2 2 C C 0,1 2x5 180 3+3 0,15 0,05 0,05 2x70 No 2 2 Mil 0,075 0,075 IM Sn BV 2-6 Max 10 FR4/Rog Variable Variable μ via x 1-3 μ via x 8-6 1 3 1 3 3 1,5 0,9 1,1 1,4 1,3 1,1 1,2 0,9 1,1 1,3 1,3 1,1 1,5 1,5 1,5 1,2 1,2 1,2 0,8 1,2 1,5 1,5 5-50 Price factor 6 3 3 3 3 A A 0,1 1,8 0,2 0,1 0,1 0,1 170 1+1 0,05 0,15 2x12 2x18 No 1 ENIG Max 5 Larger BV 2-4 2,5 Mil Scoring Variable Variable Rog 4000 μ via x 1-2 μ via x 6-5 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Price 4 2 2 2 B B 1,6 0,3 5-8 4% 150 2+2 FR4 3 Mil None None None None Routing 2x18 μm 2x35 μm 0,78 mm 0,15 mm 0,15 mm 0,2 mm 0,125 mm Mainstream HASL SN100C ~ 210 x 300 mm PCB Parameters Bas material typ IL Thickness mm Number of Prepregs Basic Cu Outerlayer Number of Layers Cu T Innerlayer (IL) Min hole Ø Laser Total Thickness mm Total Min hole Ø Mechanical Aspect Ratio (AR) Tg ºC CTE in Z-axis Total Cu track width Cu space distance μ via x 1-2 with AR1 μ via x 4-3 with AR1 Buried via with AR 5-8 Min SM tolerance Min soldermask bridge Panel Outline IPC-2221, 22 & 26 Class IPC-2221, 22 & 26 Level Legend print Surface finish IPC-7351 Level IPC-6012 Class IPC-600 Class No 6 3 4 5 1 2 9 7 8 10 11 12 13 14 15 16 17 19 18 22 23 24 25 20 21 Guide for CAD & PCB parameters, its technical level and price Rev July 27 2016 by Lars Wallin 26 27 28 Association Connecting Electronics Industries

® 23 Guide for PCBA

Guide for PCBA parameters, its technical level and price Rev February 10 2016 by Lars Wallin No PCBA Parameters Mainstream Price Variable No 1 Price factor Variable No 2 Price factor Variable No 3 Price factor Variable No 4 Price factor Notes 1 J-STD-001/IPC-6012 Class 2 1 3 3 2 MSL Level 3 1 4 1,2 5 1,4 3 Repair/Touch up OK Yes 1 No 1,5 4 According to RoHS 2/REACH Yes 1 No 0,8 6 Conflict Minerals Yes 1 No 1,2 7 Design Rule Check (DRC) No 1 Yes 1,2 8 Reference points for Print/P&P Yes 1 No 1,2 9 Massive components One side 1 Both sides 1,5 10 Base material type FR4 1 Other 1 11 Tg ºC 150 1 170 1 180 1 130 1,1 12 Cu T Innerlayer (IL) 2x35 μm 1 2x18 1 2x70 2 2x105 3 2x140 4 13 Total Thickness mm 1,6 1 ≥ 1,2 1 ≥0,8 1,2 ≥ 0,4 1,6 ≥ 2,0 1,5 15 Footprint IPC-7351 Level 1 Other 1,3 B 16 Solder Mask to pad mm 0,075 1 0,1 1 0,05 1,25 17 Soldermask thickness IPC-SM-840 1 x2 1,2 18 Surface Finish PCB HASL SN100C 1 ENIG 1,2 IM Sn 1,1 Im Ag 1,1 OSP 0,95 19 Surface Finish Components Sn 1 ENIG 1,1 20 Age PCB in month < 3 1 > 3 1,1 > 12 1,2 > 24 1,5 21 Age components in month < 3 1 > 3 1,2 > 12 1,2 > 24 1,5 22 Stencil Etched 1 Laser 1 Step 1,2 Etched with Nano 1,2 23 PTH via in Pad filled Yes 1 No 1,3 24 Solder Paste SAC305 L0 Type 4 1 Typ 5 1,1 Type 3 1,4 25 SPI acc to IPC-7527 Yes 1 IPC Class 2 1,2 IPC Class 3 26 Chip ≥ 0402 1 ≥ 0201 1,1 ≥ 01005 1,3 27 Chip same value different size No 1 Yes 1,2 28 BTC Footprint size mm 0,5 x 0,5 1 0,4 x 0,4 1.1 0,3 x 0,3 1,3 29 BGA/CSP pitch mm 0,5 1 0,4 1,2 0,3 1,5 30 POP No 1 Yes 2 31 All assembled in P&P Yes 1 No 1,2 32 Number of Articles ≤ 400 1 ≤ 800 1,2 ≤ 1200 1,3

33 Reflow with Air 1 N2 1,2 VP 1,5 VP with vacuum 1,7 34 Can stand 2 x 240 °C in 90 sec Yes 1 No 1,2 35 2 x SMD assembly No 1 Yes 2 36 2 x SMD + PTH x 1 No 1 Yes 2,5 37 SMD with mechanical support pin No 1 Yes 1,4 38 Schields for ESD No 1 Yes 1,5 39 AOI IPC Class 2 1 IPC Class 3 1,5 40 X-Ray for detecting Voids IPC Class 2 1 IPC Class 3 3-5 41 Selective Soldering No 1 Yes 1,5 42 Repair BGA/CSP OK Yes 1 No 2 43 PCBA cleanliness before cleaning No 1 ROSE 1.1 SIR 20 IC 40 FTIR 100

44 Cleaning No 1 H2O 1,5 Semi H2O 1,5 Alcohol 1,5 Solvent 1,5 45 PCBA cleanliness after cleaning No 1 ROSE 1.1 SIR 20 IC 40 FTIR 100 46 Conformal Coating No 1 Yes 1,2 47 Testing with Contact 1 Pincushion 1,2 48 Final Manual Inspection IPC-610 Class 2 1 Class 3 1,3

24 Guide for PCBA

Association Connecting Electronics Industries

® 25 Notes

26 Notes

Association Connecting Electronics Industries

® 27 Association Connecting Electronics Industries

3000 Lakeside Drive, Suite 105 N Bannockburn, IL 60015 847-615-7100 tel 847-615-7105 fax www.ipc.org