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Advanced Packaging ADVANCED PACKAGING Take Advanced Packaging to a completely new level. As functionality and reliability of electronic devices progress, requiring changes in systems development and integration, materials, chemicals and auxiliaries are undergoing significant adaptions in performance, cost- efficiency and reliability. In order to respond to such market needs, Umicore´s business unit Electroplating has partnered with Shinhao Materials to provide innovative patented additives for copper electroplating in the advanced packaging industry together with Umicore´s Copper(II)oxide and Anode and Cathode solutions for ECD tools. www.ep.umicore.com www.shinhaomaterials.com IntraCu® additives 14 IntraCu® SC-1 IntraCu® SC-2 12 IntraCu® SC-1 System provides customers the IntraCu® SC-2 System provide customers the IntraCu® 10 opportunity to make products that require opportunity to reduce total cost of ownership by thermal and mechanical stability in future, so extending the process window. In addition, it is 8 that fine lines/structures will not break during a true 2in1 procedure that produces no or only a 6 subsequent packaging and assembly operations. small number of Kirkendall-voids (KV-less). The In addition, it offers a lower cost alternative system is a drop-in replacement for current POR 4 for copper to copper direct bonding due to its offerings. 2 signature flat topography. Furthermore, its 0 submicron surface roughness and etch-resistant US Korea Taiwan China PCT nature is a great advantage in PLP applications Patent Applications Issued Patents in addition to wafer level packaging. Cu Anode VMS; Cu-to-Cu Stable Tensile High Speed Comparable Application Appearance type Cu content Direct Bond Strength Plating WID vs. POR Our modular additives are designed to meet the highest requirements of the Matt Cu Insoluble / VMS 28 & SC-1 Fine Line RDL semiconductor industry in advanced packaging and offer the foundation for Ra <0.2 μm Soluble VMS 50 depositing customized material properties e.g. for Microbumps in IC packages, RDL in 2inl RDL + Bright Cu Insoluble / VMS 28 & SC-2 wafer level packaging and Pillar in flip-chip packaging Pillar Ra < 0.03 μm Soluble VMS 50 SYSTEM APPLICATIONS SYSTEM APPLICATIONS • Fine line RDL (< 2 µm) • 2-in-1 bright Cu (Cu pillar and RDL) • Cu-to-Cu direct bonding • 2-in-1 with KV-less requirement SYSTEM FEATURES SYSTEM FEATURES • Bamboo-like structure • Bright Cu, Ra < 0.03 µm IntraCu® Series • Matte Cu, Ra < 0.2 µm • ±50% process window for Cu pillar and RDL • Flat topography • Total in-film organics < 11 ppm • Stable tensile strength • Excellent KV-less performance • Resistant to grain growth • Resistant to etching A S L Concentration 1.0 10.0 WD 0.8 8.0 Standard 0.6 6.0 (%) (%) WID IntraCu® Series 0.4 4.0 0.2 2.0 Normalized Elongation Elongation Normalized Before Anneal After Anneal 2 3 4 7.5 10 12.5 10 15 20 mL/L 1.0 ® 0.8 Very low stress of IntraCu SC layers: IntraCu® Series 8 inch blanket wafer, plated on one side 0.6 with 20 µm, shows warpage < 10 µm. (MPa) Standard 0.4 0.2 Normalized Tensile Stress Stress Tensile Normalized Before Anneal After Anneal 1000 hrs @ 175 C Our high-performance and multiple patented additive IntraCu® for the copper process sets new standards in advanced packaging. PLATINODE® SC electrodes Insoluble anodes are proven to help increase process efficiency, reduce process costs, environmental ADVANCED PACKAGING impact and process control efforts in plating tools PRODUCTS FOR PERFECT ELECTROCHEMICAL DEPOSITION IN THE SEMICONDUCTOR INDUSTRY for advanced packaging. he key differentation of Umicore´s PLATINODE® is the unique layer performance due to the manufacturing method using a molten salt electrolyte allowing ultra-high purity, low porosity and best ductility even at high Pt layer thicknesses. Umicore copper oxide high purity metal oxide powder are developed, manufactured and • Function: providing best-in-class ductility quality tested in accordance with the demanding and chemical resistance due to unique HTE™ Cu(II)Oxide requirements of the semiconductor advanced coating of electrode packaging industry. In combination with ancosys • Customized designs, contact materials and DMR® concept (Direct Metal Replenishment) coatings high purity metal salt clean room usage is possible enabling lower cost • Fully integrated production and clean room of ownership for Cu replenishment along with a packaging: Built-to-Order or series boost in performance of the electrolyte through • Insoluble anodes and cathodes in qualification higher Cu concentrations. for several WLP/PLP ECD Tools Umicore Umicore Umicore CuO PG CuO HG CuO 4N SEM RDL and Fine line NO VMS NEEDED ® ® Panel PLATINODE SC PtTi PLATINODE SC MMO Surface morphology 5000x Application panel level RDL • H SO concentration remaining consistent. substrates 2 4 substrates and Pillar Stable electrolyte volume, feed and bleed Molten salt deposited Developed for low not needed. Pt on Ti substrate organic consumption Purity 99,9 % 99,9% 99,99% • Several grades (4N, Packaging) • Full traceability, only one source for Cu Developed for high auto-dosing compatibility End of lifetime - ASD, predictable DMR characterized by end lifetime and outmost COST EFFICIENCY of electrocatalytic Dissolution speed current distribution • Reduction tool down time, supporting function and wear rate maintenance-free plating chambers accuracy High Speed Plating • 50% lower cost per kg Cu Pt thickness can be Thickness cannot be compared with VMS measured / measured / Clean room packed / 2+ - • 15% higher speed through higher Cu compatibility correlated to lifetime correlated to lifetime Picture: Courtesy ancosys GmbH ancosys Courtesy Picture: (60g/l i/o 50g/l) Right Composition. Perfect Surface. www.ep.umicore.com www.shinhaomaterials.com CONTACT PERSON CONTACT PERSON Dr. Yun Zhang 张芸博士 Michael Herkommer CEO & CTO Director Technical Sales Phone/电话: +86 1589 5537 107 Phone: +49 (0) 7171 607 381 [email protected] [email protected] SHINHAO MATERIALS LLC UMICORE 苏州昕皓新材料科技有限公司 GALVANOTECHNIK GMBH Wujiang Economic and Technological Development Zone, Klarenbergstrasse 53-79 Suzhou, Jiangsu, China 73525 Schwaebisch Gmuend 中国江苏省苏州市吴江经济技术开发区 Germany Established in 2012 to provide innovative products and Umicore S.A. has 11.150 employees globally, processes to semiconductor advanced packaging €3,4 bn Revenues were generated 2019 via 50 Sites multiple patents in the field of Cu plating additives Its Business Unit Electroplating is a for advanced packaging segment leader in precious metals electroplating R&D, manufacturing and QA/QC located in Suzhou China, International Set-Up for manufacturing, quality control, sales, ISO 9001 and ISO 14001 certified marketing and logistics in the field of semiconductors.
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