Technical Reference Manual
Total Page:16
File Type:pdf, Size:1020Kb
PIP3x High-Tech • Made in Switzerland Technical Reference Manual PACKED INDUSTRIAL PC WITH INTEL CORE i PROCESSOR The PIP is a low power, highly integrated rugged industrial PC with a specially designed aluminum housing. This allows to operate the PIP in a moderate or also in a harsh environment without fan or ventilation holes. The design integrates standard connectors for easy connection. Therefore the PIP can be used for any PC application where a complete solution is needed. The PIP housing, available in different sizes, offers space for miscellaneous add-ons. With the integrated SATA ports, the PCI/104-Express interface and the two PCI-Express Full-Mini Card sockets there are flexible expansion interfaces available. Fully bootable flash disks are supported for shock and vibration critical projects. Particular precautions have been taken that the entire system EMC is within the CE and FCC limits. All these features make the PIP the ideal solution for the industry wherever a flexible, rugged, durable and complete Industrial PC is needed. Features: ● PIP31: Celeron 927UE 1.5 GHz single core with ● Two SATA 2.0 ports (3 Gb/s) 1.0 MiB Cache ● One eSATAp port (with USB 2.0 and SATA 2.0) ● PIP32: Celeron 1047UE 1.4 GHz dual core with ● One ePCIe x1 External Cabling port (500 MB/s) 2 MiB Cache ● Two serial ports with RS232 interface ● PIP37: 3rd Gen Core i7-3517UE 1.7 GHz dual ● Two serial ports with RS232 or RS485 interface core with 4 MiB Cache (optional) ● PIP38: 3rd Gen Core i7-3555LE 2.5 GHz dual ● One PCI/104-Express Type 1 connector core with 4 MiB Cache ● One mPCIe / mSATA Full-Mini Card combo socket ● Up to 12 GiB dual channel DDR3-1600 memory ● One mPCIe Full-Mini Card socket (including 4 GiB soldered down memory) ● Super-IO watchdog timer with hardware reset ● ECC support in soldered down memory capability ● Intel HD Graphis 2000 or 4000 with DP++, DVI-I ● Power input with load dump and reverse polarity and 24 Bit LVDS interface protection ● Four Intel Gb Ethernet ports ● Power input with galvanic isolation (optional) ● Four USB 3.0 ports (4800 Mb/s) ● DIN rail or flange installation ● Up to five USB 2.0 ports (480 Mb/s) ● RoHS compliant ● Two SATA 3.0 ports (6 Gb/s) ©2013 by MPL AG 1 MEH-10147-001 Rev. C PIP3x High-Tech • Made in Switzerland Technical Reference Manual TABLE OF CONTENTS 1 INTRODUCTION.............................................................................................................7 1.1 ABOUT THIS MANUAL.........................................................................................................7 1.2 SAFETY PRECAUTIONS AND HANDLING..........................................................................7 1.3 ELECTROSTATIC DISCHARGE (ESD) PROTECTION........................................................7 1.4 EQUIPMENT SAFETY...........................................................................................................7 1.5 MANUAL REVISIONS............................................................................................................8 1.5.1 RELATED PRODUCTS..................................................................................................8 1.5.2 REVISION HISTORY......................................................................................................8 1.6 RELATED DOCUMENTATION...............................................................................................9 1.7 STANDARDS COMPLIANCE..............................................................................................10 1.7.1 EMC............................................................................................................................. 10 1.7.2 ENVIRONMENTAL.......................................................................................................10 1.7.3 SAFETY........................................................................................................................ 10 1.7.4 TYPE APPROVAL........................................................................................................10 1.8 ORDERING INFORMATION................................................................................................11 2 SPECIFICATIONS.........................................................................................................12 2.1 FEATURES SUMMARY.......................................................................................................12 2.2 ELECTRICAL RATINGS......................................................................................................14 2.2.1 POWER INPUT............................................................................................................14 2.2.2 POWER DISSIPATION.................................................................................................14 2.3 MECHANICAL SPECIFICATIONS.......................................................................................14 2.4 ENVIRONMENTAL CONDITIONS.......................................................................................15 3 HARDWARE REFERENCE...........................................................................................16 3.1 HOUSING DIMENSIONS.....................................................................................................16 3.1.1 TOP VIEW....................................................................................................................16 3.1.2 BOTTOM VIEW............................................................................................................17 3.1.3 SIDE VIEW 1................................................................................................................18 3.1.4 SIDE VIEW 2................................................................................................................19 3.1.5 SIDE VIEW 3................................................................................................................20 3.1.6 SIDE VIEW 4................................................................................................................20 3.2 OPENING THE CASE..........................................................................................................21 3.3 DIMENSIONS AND PLACEMENT.......................................................................................22 3.3.1 PCB DIMENSIONS......................................................................................................22 3.3.2 PARTS LOCATION.......................................................................................................23 3.4 SWITCH SETTINGS.............................................................................................................24 3.4.1 DIP SWITCH 1 (S1) – IGNITION INPUT POLARITY SELECTION..............................24 3.4.2 DIP SWITCH 2 (S2) – PERIPHERAL SETTINGS........................................................24 3.4.3 DIP SWITCH 3 (S3) – PCI/104-EXPRESS IO-VOLTAGE SELECTION.......................24 3.4.4 DIP SWITCH 4 (S4) – ON BOARD LVDS PORT (LCD PANEL) SETTINGS................25 3.4.5 DIP SWITCH 5 (S5) – PCIe EXT. CABLING REDRIVER SETTING.............................25 3.4.6 DIP SWITCH 7 (S7) – RESERVED..............................................................................26 3.4.7 DIP SWITCH 8 (S8) – eSATAp SATA REDRIVER SETTING........................................26 3.4.8 DIP SWITCH 9 (S9) – ETHERNET WAKE ON LAN (WOL) SETTINGS.......................26 3.4.9 DIP SWITCH 2000 (S2000) – BACKLIGHT ENABLE LOGIC LEVEL..........................26 3.5 CONNECTORS....................................................................................................................27 3.5.1 EXTERNAL CONNECTORS........................................................................................27 3.5.1.1 Serial-1 (J65) and Serial-2 (J67) Connectors........................................................................27 3.5.1.2 Optional Serial-3 and Serial-4 Connectors............................................................................27 3.5.1.3 External Power Connector (J21)...........................................................................................28 ©2013 by MPL AG 2 MEH-10147-001 Rev. C PIP3x High-Tech • Made in Switzerland Technical Reference Manual 3.5.1.3.1 Pin Assignment.............................................................................................................28 3.5.1.3.2 Power Input Protection Circuits....................................................................................28 3.5.1.3.3 Power Up Behavior.......................................................................................................28 3.5.1.3.4 Power Input Circuit.......................................................................................................28 3.5.1.4 Ignition Input, Reset- and Power Button Connector (J53).....................................................29 3.5.1.4.1 Pin Assignment.............................................................................................................29 3.5.1.4.2 IGN, PWR- and RST-Button Circuit..............................................................................29 3.5.1.5 PS/2 Keyboard and Mouse Connector (J49)........................................................................30 3.5.1.6 Dual USB 3.0 Connectors (J8, J4)........................................................................................30 3.5.1.7 Dual USB 2.0 Connector (J9)................................................................................................30