Pickering 20-525 Manual

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Find the Pickering 20-525-902-LS1 at our website: Click HERE USER MANUAL pickering

Model No. 20-520/20-525

R.F. Matrix Module with Self-Test

Designed & Manufactured by:-

Pickering Interfaces Limited. Stephenson Road Clacton-on-Sea Essex CO15 4NL England

Tel: 01255-428141 +44 1255-428141 (International) Fax: 01255-475058 +44 1255-475058 (International)

Internet: www.pickering.co.uk E Mail: [email protected]

20-520/20-525 pickering R.F. SWITCHING MATRIX MODULE 1 HELP!!! If you need assistance with your Pickering Interfaces Switching System: Switching problems, Programming or Integration within your Test System. – Please ring Pickering Interfaces and ask for “Technical Support”.

Alternatively you may fax, email or connect to our Internet Web Site. A full set of operating manuals, application notes and software drivers is available on CD ROM.

20-520/20-525 pickering 2 SWITCHING MATRIX MODULE Contents

Section 1 High Density Matrix Modules ...... 5

Section 2 Constructing Large Matrix Systems ...... 11

Section 3 Self Test ...... 15

Section 4 Programming ...... 17

Section 5 Connector Pin-Out Diagrams...... 19

Section 6 Front Panel Layout ...... 21

Section 7 Reconfiguring Driver Card to Your Application...... 23

Section 8 Circuit Diagrams ...... 25

Section 9 Adapting Matrix for Analogue Bus Connection ...... 41

Section 10 Electrical, Environmental, Mechanical & Firmware Specifications ...... 43

20-520/20-525 pickering R.F. SWITCHING MATRIX MODULE 3 20-520/20-525 pickering 4 SWITCHING MATRIX MODULE Section 1 High Density Matrix Modules

1.1 Features

• High Isolation RF Switching Matrix, Available in 16 x 4 and 8 x 8 Configurations. • Single Pole Version Available in 50Ω or 75Ω Version with 100MHz Bandwidth • Double Pole Version Available with 50Ω Triaxial Connectors. • Full Matrix Self-Test for Total Switch Contact Confidence. • On-Board Isolation Switches Remove Unused Crosspoint Rows/Columns. • Large Low Frequency Matrices Easily Built Up Using Internal 24 Pole Analogue Bus. • Up to 31 Matrix Modules May Be Cascaded to Form Matrices with Sizes to Over 2000 Crosspoints. • Very Large Partially Filled Matrices May Be Constructed When Used In Conjunction with 20-700 Series RF Multiplexer Modules. • Front Panel Mounted BNC Co-Axial Connectors. • Two Reed Switch Types: Standard Dry or Ruthenium. • Switch up to 100Vd.c., 10W, 0.5A (1.2A carry).

1.1.1 Matrix Description This manual covers all models in the 20-520 range of Very High Isolation Matrix Modules switching frequencies to beyond 100MHz, available in both 50Ω & 75Ω versions. Also suitable for high accuracy, low frequency instrumentation requiring good isolation/noise performance. Built-In Self-Test gives complete switch confidence. System 20 High Isolation RF Matrix Modules are intended for easy construction of high performance matrix switching systems; modules may be simply cascaded to form matrices of almost any size. Connections are made via industry standard BNC connectors. Larger low frequency matrices are easily constructed using the internal 24 pole guarded analogue bus. Isolation Switches on each module remove all unselected columns and rows from the system, maximising both isolation and RF performance. Full Self-Test is performed both at power up and at any other time either manually or under program control. Self-Test is of particular importance in large systems where relay contact integrity is a very major consideration. In the unlikely event of relay failure (either high on-state or low off-state resistance) the front panel will indicate a fault. The diagnosis - including the position of the suspect relay - will be indicated using the DIAGNOSTIC? command. For a summary of switching capabilities please refer to tables 1.1 & 1.2. This is a double height module and must be mounted into a double height (6U) case: Available case types: 10-934, 10-936 20-930 and 20-935.

1.1.2 Applications Main applications will be for very high quality switching where standard matrix units have inadequate RF and isolation performance, these include: high quality data acquisition (usually 2 pole with frequencies < 1MHz), RF matrices (1 pole to beyond 100MHz), telecommunications and video applications (75Ω impedance) and high quality signal routing in functional ATE systems.

1.1.3 Front Panel The module front panels are illustrated in Section 6, they comprise of three elements: Status Display, 4 LED Indicators:- Power LED. Connected to power system supply. Active LED. On whenever one or more matrix switches are closed. For a list of all active switches use the VIEW? command. Self-Test LED. Active when self-test in progress. Error LED. Indicates that error found during self-test. Self-Test Button. Press to initiate a self-test, this will first disconnect the matrix, then perform a full functional self-test, finally reconnecting the matrix when complete. While in progress the “Self-Test” LED will be on, if a failure is detected then the “Error” LED will be set on permanently. Use the DIAGNOSTIC? command to find the exact cause of any failure, refer to section 3 for further details. NB: Self-Test button will only respond when matrix is inactive (i.e. no crosspoints set). Matrix Connectors. Provides connection to and from matrix, BNC Co-Axial and BNC Tri-Axial connectors, please refer to Section 6.

20-520/20-525 pickering R.F. SWITCHING MATRIX MODULE 5

Y 1Y 2 Y 3 Y 4 Y 5 Y 6 Y 7 Y 8

s I

X 1

X 2

X 3

X 4

X 5

ri p

X 6 ss

Mat

ro C X 7

X 8

Fig 1.1 Matrix Schematic (8 x 8, 2 Pole)

Characteristic Impedance 50 or 75Ω RF Specification For 1 Pole Version Only: Maximum Frequency 200MHz Rise Time < 1nS † Insertion Loss (< 100MHz) < 3dB † V.S.W.R. (< 70MHz) < 1:1.8 † Isolation (< 100MHz) > 75dB Crosstalk (< 100MHz) > 60dB Maximum Voltage 100V d.c. Maximum Power 10W Maximum Switch Current 0.5A Maximum Carry Current 1.2A On Path Resistance < 500 mΩ Off Path Resistance > 109 Ω Noise < -75dBm Differential Thermal Offset < 20µV Capacitance: Open Channel to Ground < 40pF Capacitance: Selected Channel to Ground < 70pF Capacitance: Open Input to Output < 4pF Expected Life (Low Power) > 1x108 ops Expected Life (Max Power) > 5x106 ops Switching Time < 10mS

Table 1.1 Switching Specification † RF Performance is entirely dependant upon the combination of crosspoints currently selected, these figures are for one selected crosspoint only, please refer to graphs in Sec 1.4.

20-520/20-525 pickering 6 SWITCHING MATRIX MODULE 1.2 Matrix Module Model Numbers

The following table lists the standard options available with the matrix module:-

Config- Connect Imdep- No. of Dry Reed Low Level uration Type ance Poles Switch Switch 16 x 4 BNC Coax 50Ω 1 20-520-501 20-520-521 16 x 4 BNC Triax 50Ω 2 20-520-502 20-520-522 16 x 4 BNC Coax 75Ω 1 20-520-701 20-520-721 8 x 4 BNC Coax 50Ω 1 20-522-501 20-522-521 8 x 4 BNC Triax 50Ω 2 20-522-502 20-522-522 8 x 4 BNC Coax 75Ω 1 20-522-701 20-522-721

8 x 8 BNC Coax 50Ω 1 20-525-501 20-525-521

8 x 8 BNC Triax 50Ω 2 20-525-502 20-525-522 8 x 8 BNC Coax 75Ω 1 20-525-701 20-525-721

Configuration Options † : - –Y Y Coordinates connected to analogue bus. –X X Coordinates connected to analogue bus † Default configuration is no connections to internal analogue bus.

Further options (see notes below): –R Limiting Resistor (e.g. 20-525-701-R). –L Loop Through Option: All of the above modules are available with a loop through option, see diagram, frequently used in the construction of large self terminating RF matrices. Please order option -L (e.g. 20-525-501-L)

Further options are available for interconnecting matrix modules to form very large matrices, please contact factory to discuss your application in more detail. All reed relay switching modules have the facility for a built in limiting resistor on each switch. This can be very useful in preventing high current in-rushes which may result in damage to the reed switch. These links are normally shorted, however when ordering you may specify limiting resistors if you wish, option -R.

20-520/20-525 pickering R.F. SWITCHING MATRIX MODULE 7 Y 1 Y 2 Y 4

To Self Test Circuit

X 1

X 2

X 16 To Self Test Circuit

Fig 1.2 Full Schematic of 16 x 4 Single Pole Matrix Module (104 Relays with 64 used in main Cross-Point Matrix)

20-520/20-525 pickering 8 SWITCHING MATRIX MODULE 1.3 Reed Switch & Connector Options

A summary of these modules capability is in tables 1.1 and 1.2. Additional data is included below:- 1.3.1 Dry Reed Switch Reed Relay Type 50Ω 1/2 Pole: 102M-1-A-12/1D 75Ω 1 Pole: 101-1-A-12/949D Expected Life > 108 operations at low current/voltage load. > 5x106 at 260mA, 28V. 1.3.2 Low Level Ruthenium Reed Switch - for low level signal use only Reed Relay Type 50Ω 1/2 Pole: 102M-1-A-12/2D 75Ω 1 Pole: 101-1-A-12/949D SW 2 Expected Life > 108 operations at low current/voltage load. NB This switch is not suitable for switching high current loads.

1.3.3 Front Panel and Connectors Two connector types are currently available, both are front panel mounted:- 1 Pole Version 16 x 4 Matrix: 20 x BNC Coaxial Connector Sockets, see Fig 6.1. 8 x 8 Matrix: 16 x BNC Coaxial Connector Sockets, see Fig 6.2.

2 Pole Version 16 x 4 Matrix: 20 x BNC Triax Connector Sockets, see Fig 6.1. 8 x 8 Matrix: 16 x BNC Triax Connector Sockets, see Fig 6.2.

Module width is 12 HP (2.4 inches, 60.8mm). Front Panel layouts are illustrated in Section 6.

1.4 Typical RF Performance Plots (Single Pole Versions) Typical RF Performance Plots for 20-525-501 (8 x 8, Single Pole) Curves are shown for matrix rows/columns with: 1 or 2 interconnected crosspoints set. For optimum insertion loss and VSWR (reflection) performance ensure only one crosspoint is set in any one row/column. Performance curves for all versions of the single pole matrix modules have similar characteristics, any differences are shown. For further information please contact factory.

20-525 MATRIX INSERTION LOSS 0 dB

-0.4 dB 1 Crosspoint Set -0.8 dB

-1.2 dB

-1.6 dB

-2.0 dB

-2.4 dB

-2.8 dB 2 Crosspoints Set

-3.2 dB

50MHz 100MHz 150MHz 200MHz

20-520/20-525 pickering R.F. SWITCHING MATRIX MODULE 9 20-525 MATRIX VSWR (RETURN LOSS) 1.8 11dB

1 Crosspoint Set

1.6 (75Ohm Version) s 13dB s o R 1 Crosspoint Set L

n (50Ohm Version) r

VSW 1.4 tu 16dB e

1.2 21dB

26dB

1.0 50MHz 100MHz

20-525 MATRIX ISOLATION

-50 dB

-60 dB

-70 dB

-80 dB

-90 dB

-100 dB

50MHz 100MHz 150MHz 200MHz

20-525 MATRIX CROSSTALK -40 dB

-50 dB

-60 dB

-70 dB

-80 dB

-90 dB

-100 dB

50MHz 100MHz 150MHz 200MHz

20-525 TYPICAL 90% STEP RESPONSE (1 Crosspoint Set)

50%

0.7nS 10%

0.4nS 0.8nS 1.2nS

20-520/20-525 pickering 10 SWITCHING MATRIX MODULE Section 2 Constructing Large Matrix Systems

2.1 Creating Large Matrices

Each System 20 interface can directly support cascaded matrices up to 128x16 or 32x64 using 16x4 matrix modules or up to 64x32 using 8x8 matrix modules, i.e. up to 31 modules per matrix, larger sizes can be supported using multiple System 20 interface modules mounted in separate cases. Forming larger matrices is usually only a question of plugging in additional matrix modules, a 24 pole guarded analogue bus is provided on the System 20 Analogue Backplane. So constructing large matrices is very straight forward, no time consuming daisy-chained wiring harnesses. Further expansion is simply a matter of adding additional matrix modules, please refer to notes in Section 2.4. All matrix modules in a cascaded matrix must have the same primary address, their position within the matrix is determined by their bank address (see sec 4.2, figs 2.1 & 2.2), this is set on an additional 5 way dip switch. The cascaded matrix is then programmed as a whole, the programmer does not need to address each matrix module individually, only a pair of coordinates for the required crosspoint need be sent.

2.2 Isolation Switches

Both the X and Y axes have on-board automatic isolation switches. In large matrix systems the parasitic capacitance associated with each cross-point switch can result in a large capacitance if several matrix modules are interconnected. The isolation switches only switch in those columns and rows on a module that contain an active switch. Thereby keeping matrix capacitance to a minimum., this may be important for applications requiring high isolation and crosstalk as well as good insulation resistance. NB. These isolation switches are also used to remove the matrix from the external circuit when performing self-test.

2.3 “Partially Filled” Matrices

For users requiring very large matrix systems the cost of a fully populated matrix may prove prohibitive, in many instances a combination of multiplexer input/output and small “core” matrix may prove quite acceptable. This approach may prove to be more effective in terms of both cost and performance, the main draw backs being additional programming complexity and restricted matrix versatility (particularly for future unforeseen requirements). Please contact Pickering if you wish to discuss your matrix application in greater detail. Pickering can build large Matrix systems constructed and tested to your exact requirements, (especially if your application involves switching RF or very high isolation signals), please contact sales office for further details.

2.4 Expanding an RF Matrix Using the Analogue Bus

If the signals being switches are not RF, typically < 1MHz bandwidth then using the analogue bus will be very straightforward. However, if RF frequencies (>1MHz) are being switches then particular attention must be paid to matrix interconnection. If the analogue backplane bus is used to interconnect two or more matrices switching RF signals then return loss (VSWR) will be very severely affected (e.g. around 10dB at around 10MHz), insertion loss will also be degraded This is due to the effect of the long bus lines (typically 45cm in length). Performance can be maximised by interconnecting the matrix modules using the front panel mounted Coaxial connectors or by ordering a system with a reduced length analogue backplane bus (e.g. quarter length). However if very low VSWR performance is required when switching RF signals, particularly in a large system, it may be worth looking at the Pickering Interface’s range of RF multiplexers, these can be used to construct very high performance matrix systems. Please contact factory for further information or advice.

20-520/20-525 pickering R.F. SWITCHING MATRIX MODULE 11 Y 1 Y 2 Y 3 Y 4 Y 8

X 1

X 2

X 3

X 4

X 8

Crosspoints Closed are at x = 2, y = 2 & x = 2, y = 4.

Fig 2.1 Typical Matrix (8 x 8 Single Pole) in Use with Automatic Isolation Switching

20-520/20-525 pickering 12 SWITCHING MATRIX MODULE 8 x 8 Matrix

8 8

5 5

4 4

3 3

2 2

1 1

8 5 4 3 2 6 plugged 1

simply

may

8 x 8 Matrix

8 8

modules

matrix

5 5

4 4

3 3

2 2

1 1

G 8 5 4 3 2 6 1

Additional

modules.

Switch

8 x 8 Matrix matrix

expansion.

Matrix

8 8

the

further

give

5 5

2.2

4 4

3 3

interconnect

2 2

Fig

1 1

8 5 4 3 2 6 I 1

used

are

Bus

8 x 8 Matrix

Analogue

8 8

guarded

5 5

4 4

3 3

2 2

internal

1 1

8 5 4 3 2 6 1

the

Poles

20-520/20-525 pickering R.F. SWITCHING MATRIX MODULE 13 20-520/20-525 pickering 14 SWITCHING MATRIX MODULE Section 3 Self Test

3.1 Self-Test Function

Self-Test is invoked at power on (taking up to 60 seconds) and may also be operated under software (*TST?) or via a recessed push button. Self-Test pass is indicated on a front panel LED with a full pass/fail description available using the DIAGNOSTIC? command. Self-Test comprises 3 levels, see Fig 3.1:- 1. Logic Test: Checks all logic including on-board microprocessor, relay drivers etc. 2. Relay Coil Test: All reed relay coils are checked for continuity. 3. Full Contact Test: Tests all the relay contacts in the matrix block. Two test are undertaken: (i) On-state resistance failure test. Fails if switch has on-state > 2Ω. (iii) Off-state resistance test. A switch fails if it’s isolation resistance is < 106Ω. The threshold for contact resistance is preset to approximately 2Ω at the factory. However this threshold may set to customers precise requirements (from 200mΩ to 10Ω). If a very low threshold is selected, the self test could be used to detect switches which are not failing to operate but which have reached an end of life condition, where the contact resistance is starting to rise, indicating that the relay is due for replacement. NB. The contact self test will only check the relay contacts in the core matrix block, isolation switches and self test switches are not tested, please refer to section 3.4 for further details. Note: Fault diagnosis on 2 pole matrix modules will identify down to a pair of relays. Both these relays must be replaced, only the position of the first relay in the pair is given by the REPORT? command, please refer to Section 8.3. 3.2 Self-Test Operation

Self Test is always run at power on, taking approximately 60 seconds. If self test is run under software control it will firstly clear the whole matrix (Manual Test will only function when the module is in a clear state). So it is very important to prepare your external instruments and U.U.T. for this! During self-test all isolation switches are opened so your external circuitry will see only very high resistance inputs. When the self-test has finished the matrix will be returned to an all clear state (i.e. the previous state will not be remembered!). Please note that because of the long self-test time that your computer may time out waiting for the test result (many PC's have default timeouts set to 10 seconds).

3.3 Detailed Self Test Reporting using DIAGNOSTIC? Query

The DIAGNOSTIC? query will give an ASCII string detailing any self test failures. These will include:- Logic: µP, RAM, EPROM, Relay Drivers, Invalid Link Settings etc. Relay Coils: Open Circuit Coil. Switch Contacts: High On Resistance, Low Off Resistance. This string is not intended to be processed by the user’s software, it is suitable for copying directly onto the screen of your control computer. This information will then indicate maintenance required (please contact Pickering for further help).

3.4 Self Test Limitations

Self Test covers all aspects of the Matrix Module which are liable to fail in normal use. The only exception to this are the following:- “Isolation Relays”: These switches are used to isolate the matrix from the users external circuitry, for this reason they cannot be included in the contact self test routine, refer to fig 2.1. These relays always “cold switch” (i.e. they are always operated without any load, as opposed to the matrix switches which always “hot switch”), therefore they should have an expected life in excess of 108 operations. These switches will only fail if a very heavy current is passed through the contacts (greater than around 3-4A for 10's of milliseconds, see section 5.1.1), this may result in switch weld to either an isolation or matrix switch. Please note that all relays including isolation and self test relays are included in the coil test, so an open circuit coil or faulty driver IC will be picked up and reported. “Self Test Relays”: There are self test relays on every x and y axis on the matrix board, if one of these contacts welds (very, unlikely) then all relays on that axis will appear to fail self test.

20-520/20-525 pickering R.F. SWITCHING MATRIX MODULE 15 SELF TEST INITIATED BY: ¥ POWER ON ¥ *TST? QUERY ¥ MANUAL BUTTON

LOGIC TEST: ¥ µP BOARD ¥ RELAY BOARD

LOGIC YES TEST FAIL

RELAY COIL TEST

COIL YES TEST FAIL

CONTACT TEST: ¥ SWITCH ON STATE RESISTANCE < 2Ω ¥ SWITCH OFF STATE RESISTANCE > 1MΩ

CONTACT YES TEST FAIL

SELF TEST PASS SELF TEST FAIL: ¥ ERROR LED ON ¥ USE DIAGNOSTIC? COMMAND TO GET ERROR MESSAGE

Fig 3.1 Self-Test: Basic Flow Diagram

20-520/20-525 pickering 16 SWITCHING MATRIX MODULE Section 4 Programming

4.1 Select Module Address

Choose module address (from 0 - 30) using the address select switch (SW1) on the top of the driver card (the top screen of the module may need to be removed to reveal the address switch). The module address selected in the illustration is 22 (i.e. 16 + 4 + 2 = 22).

4.2 Select Module Bank Address

When more than one module is used to make up a large matrix (see Fig 1.2), where four 20 x 12 modules are used to make up a 40x24 matrix), then all matrix units must have the same module address, the location of each module within the matrix is given by its bank address. The matrix bank address is composed of two x and y components, see Fig 1.3 , these determine the individual matrix modules position within the larger matrix. The bank address is constructed using 5 bits, see diagram, 3 bits for x and 2 bits for y. For example bit settings 0 0 1 0

0 represent bank address x = 1, y = 0. module address bank address SW1 16 8 4 2 1 16 8 4 2 1

ON 1 2 3 4 5 6 7 8 9 10

1 2 3 4 5 6 7 8 9 10 PCB

Side View Top View

There must always be a module present at the base address x = 0, y = 0, otherwise the matrix will not be recognised by the intelligent interface. If there is a problem with any of the modules used to make up a large matrix then an error will be detected (use the DIAGNOSTIC? query to discover the cause).

X 2 X 1 X 0 Y 1 Y 0 4.3 Using the Intelligent GPIB Interface

Switching matrices are controlled using the MCLOSE and MOPEN commands:- To close switch at position X = 17, Y = 9 on matrix with address 11. MCLOSE 11,17,9 Now to look at status of matrix 11. VIEW? 11 will return “17,9” To open last switch and close switches at positions X = 1, Y = 1 and X = 2, Y = 1 on matrix 11. MOPEN 11,17,9;MCLOSE 11,1,1;MCLOSE 11,2,1 Now to look at status of matrix 11. VIEW? 11 will return “1,1;2,1” To reset all switches on matrix 11. ARESET 11 Now to look at status of matrix 11. VIEW? 11 will return “0,0" - 0,0 indicates no coordinates set.

Note: The 10-920 Interface imposes a maximum limit allowing up to 100 crosspoints to be on at any one time (this is to prevent the power supply becoming overloaded).

20-520/20-525 pickering R.F. SWITCHING MATRIX MODULE 17 4.4 Instruction Set

The Matrix module is very easy to program using the Model 10-920 IEEE-488.2 Interface:- ARESET a Open all switches on device a MCLOSE a,x,y Close switch at coordinates x,y on matrix a MOPEN a,x,y Open switch at coordinates x,y on matrix a RESET Open all switches on all modules VIEW? a View status of device a. Self Test Functions:- DIAGNOSTIC? Return diagnostic string (self test fail details, if any). Refer to Sec 3.3 for further details *TST? Execute Full Self Test (IEEE-488.2 query)

4.5 Operating Speed

Maximum switching frequency is approximately 25mS to open or close any one crosspoint when using the 10-920 IEEE- 488.2 Interface Module, the higher speed 10-921 interface reduces this time to 10mS.

20-520/20-525 pickering 18 SWITCHING MATRIX MODULE Section 5 Connector Pin-Out Diagrams

ROW A C 1 Analogue 2.1 2 Analogue 2.2 3 Analogue 2.3 4 Ground 5 Analogue 2.4 6 Analogue 2.5 7 Analogue 2.6 8 Ground 9 Analogue 2.7 10 Analogue 2.8 11 Analogue 2.9 12 Ground 13 Analogue 2.10 A & C contacts are commoned. All 14 Analogue 2.11 analogue bus lines are surrounded 15 Analogue 2.12 by a grounded guard track to 16 Ground minimise inter–channel crosstalk. 17 Analogue 2.13 18 Analogue 2.14 Analogue Bus Approximate RF Ω 19 Analogue 2.15 Characteristic Impedance = 65 . 20 Ground 21 Analogue 2.16 22 Analogue 2.17 23 Analogue 2.18 24 Ground 25 Analogue 2.19 26 Analogue 2.20 27 Analogue 2.21 28 Ground 29 Analogue 2.22 30 Analogue 2.23 31 Analogue 2.24 32 Ground

Fig 5.1 24 Pole Internal Analogue Bus Connector (Type: 64 Pin DIN 41612)

20-520/20-525 pickering R.F. SWITCHING MATRIX MODULE 19 AAAAAAAAROW AAAAAAAAA C GND 1 GND 5V(relay) 2 12V(relay) POWER SUPPLIES 5V(logic)AAAAAAAA3 5V(logic) DIO1AAAAAAAA4 DIO2 DIO3 5 DIO4 EOI 6 DAV NRFD 7 NDAC IFC 8 SRQ SYSTEM DIGITAL BUS ATN 9 Reserved (Parallel and Serial Bus) DIO5 10 DIO6 DIO7 11 DIO8 REN 12 Reserved (-SS) Settled 13 Reserved (MOSI) Reserved (SCK)AAAAAAAA14 Reserved (MISO) Analogue 1.1AAAAAAAA15 Analogue 1.1 Analogue 1.2 16 Analogue 1.2 Analogue 1.3 17 Analogue 1.3 Analogue 1.4 18 Analogue 1.4 Analogue 1.5 19 Analogue 1.5 Analogue 1.6 20 Analogue 1.6 ANALOGUE BUS Analogue 1.7 21 Analogue 1.7 Analogue 1.8 22 Analogue 1.8 Analogue 1.9 23 Analogue 1.9 Analogue 1.10AAAAAAAA24 Analogue 1.10 Slot Address Bit 0AAAAAAAA25 Slot Address Bit 1 Slot Address Bit 2 26 Slot Address Bit 3 POSITION Slot Address Bit 4AAAAAAAA27 Backplane Address Bit 0 LOCATOR Backplane Address Bit 1 28 Backplane Address Bit 2 AAAAAAAA29 12V(relay)AAAAAAAA30 12V(relay) 5V(logic)AAAAAAAA31 5V(logic) POWER SUPPLIES GNDAAAAAAAA32 GND

10/92

Note: The Analogue bus on this connector is not used by any matrix module (only multiplexers). All analogue bus lines are surrounded by a grounded guard track to minimise inter–channel crosstalk. Analogue Bus Approximate RF Characteristic Impedance = 65Ω.

Fig 5.2 Power/Control/Analogue Bus Connector (Type: 64 Pin DIN 41612)

20-520/20-525 pickering 20 SWITCHING MATRIX MODULE Section 6 Front Panel Layout

LED (red) Module powered on

X 1 X 2 LED (green) Indicates if any switch is POW operated X 3 X 4 ACT

TEST LED (yellow) Self-Test Currently Running X 5 X 6 ERR

LED (red) error found X 7 X 8 MAN during self-test TEST

Self-Test Switch X 9 X 10 (recessed to prevent accidental operation)

X 11 X 12

X 13 X 14

X 15 X 16

Y 1 Y 2

Y 3 Y 4

Fig 6.1 20-520 Front Panel, 16 x 4 Matrix

20-520/20-525 pickering R.F. SWITCHING MATRIX MODULE 21 X 1 X 2

POW

ACT X 3 X 4 TEST

ERR

X 5 X 6

MAN TEST

X 7 X 8

Y 1 Y 2

Y 3 Y 4

Y 5 Y 6

Y 7 Y 8

Fig 6.2 20-525 Front Panel, 8 x 8 Matrix

20-520/20-525 pickering 22 SWITCHING MATRIX MODULE Section 7 Reconfiguring Driver Card to Your Application

Your multiplexer driver card will leave the factory preconfigured, so take great care if you wish to change any of the settings. If in doubt contact Pickering for further details. 7.1 Universal Driver Card: Configuration Links

Configuration switches are provided on the driver board at position SW2, on the top edge of the PCB, adjacent to the 10 way address selection lever switch. The five switches, see Fig 7.1, are used as follows:- Relay Settling Time There are four choices of relay settling time, this is to allow for different applications and relay types. 1 2 Relay Settling Time † 0 0 4.0ms 0 1 1.0ms - default setting 1 0 0.5ms 1 1 0.0ms

† The “Settled” line is triggered after this delay Matrix Intelligent Isolation Switching This will allow intelligent isolation switching, i.e. only those matrix rows and columns that have an active crosspoint switch will be connected in circuit. Note intelligent isolation switching may operate a little slower (up to around 5ms per operation because all isolation switches always cold switch). 3 4 5 Function 0 – – 1 Pole Switching (used for self test only) 1 – – 2 Pole Switching (used for self test only) – 0 – Enable Full Self Test (60 Seconds) - default setting – 1 – Enable Logic Only Self Test (5 Seconds) – – 0 Enable Automatic Isolation Switching - default setting – – 1 Disable Automatic Isolation Switching

7.2 Repeating Self Test with Burn In - Factory Use Only

A burn-in test facility is built into the module, this is initiated by pressing the selftest button until the Active LED goes on (around 5 seconds). Here the module will run the usual full selftest together with some additional isolation tests followed by 15 minutes of “switch rattling”, the test procedure will then be repeated. This process may only be stopped by powering off or holding the manual test button in for several seconds. This feature is for factory use where matrix modules are burned-in prior to undergoing final test.

5 4 3 2 1

N SW2

Fig 7.1 Driver Card Configuration Links on SW2

20-520/20-525 pickering R.F. SWITCHING MATRIX MODULE 23 20-520/20-525 pickering 24 SWITCHING MATRIX MODULE Section 8 Circuit Diagrams

Two sets of circuit diagrams and documentation are contained:-

• 8.1 Driver PCB Assembly

PCB Layout Circuit Diagram (6 pages) Inter PCB Connectors Parts List

• 8.2 8 x 8 Single Pole Relay PCB Assembly

PCB Layout Inter PCB Connectors Parts List

• 8.3 8 x 8 Double Pole Relay PCB Assembly

PCB Layout Parts List

20-520/20-525 pickering R.F. SWITCHING MATRIX MODULE 25 D.1 Driver PCB Assembly

C6 1 2 4 8 16 1 2 4 8 16 5 4 3 2 1 C7 C8

5 4 3 2 1 J1

BANK SW1 ADDR SW2

LD1

R4 k R8 LD2 U8 U7 k LD3

k LD4 Q3 C9 U6 k R9 U9 C13 Q4

R23 X1

R22 SW3 C2

J3 U1 C3 J4 + C4 U3 C1

Q1 R7 R3 R2 R5 R1 U4

C12 U5

R16 U2

R15 R17 R11 U10 C5 R18 R21 Q2

R14 R19 R10 RL1 RL2 RL3 RL4 R20

C10 C11

pickering

Fig 8.1 Driver PCB Layout

20-520/20-525 pickering 26 SWITCHING MATRIX MODULE STLD +5V LD4 Q1 GND +5V R3 LD3 R2 LD2 LD1 STAT GND R4 -LD3 -LD2 -LD4 C13 14.11.90 C12 Sheet 1 of 6 -RES C11 C10 R1 System 20 Driver Card - GPIB 80 Rev 0 C9 8 7 6 5 C8 Vcc RESET SENSE Miscellaneous: Reset control, LEDs, Power Supply decoupling, 'Settled' line driver -RESET U1 7705 C7 GND Vref CT -RESIN 2 3 4 1 C6 GND +5V GND +5V C1 C2

20-520/20-525 pickering R.F. SWITCHING MATRIX MODULE 27 D7 D6 D5 D4 D3 A8 A9 A14 A13 A11 A10 A15 +5V 25 28 27 21 20 24 22 19 18 15 26 17 16 23 GND +5V Vcc A8 A9 -OE -CS D7 D6 D5 D4 D3 A11 A14 A13 A10 9 16 15 14 13 12 11 10 2G 2B 2A Vcc 2Y2 2Y3 2Y0 2Y1 U4 27256 U3 74HCT139 Vpp A7 A6 A5 A4 A3 A2 A1 A0 D0 D1 D2 Vss A12 1B Vss 1G 1A 1Y0 1Y1 1Y3 1Y2 8 9 1 2 3 4 6 7 5 11 6 7 8 2 3 4 5 1 10 12 13 14 GND GND A12 A7 A6 A5 A4 A3 A2 A1 A0 E -WR D0 D1 D2 GND A13 A14 +5V A8 A0 A1 A2 A3 A4 A5 A6 A7 A9 A10 A11 A12 A13 A14 A15 -GPIACS -PIACS2 D0 D1 D2 D3 D4 D5 D6 D7 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 E BA D0 D1 D2 D3 D4 D5 D6 D7 A0 A1 A2 A3 A4 A5 A6 A7 Vss A8 A9 -WR -LIR -RD A10 A11 A12 A13 A14 A15 R/-W Vcc U2 6303X GND -RES Vss XTAL EXTAL MP0 MP1 -STBY -NMI P20 P21 P22 P23 P24 P25 P26 P27 P50 P51 P52 P53 P54 P55 P57 P60 P61 P62 P63 P64 P65 P66 P67 P56 6 7 8 9 1 2 3 4 5 25 31 32 15 18 19 22 24 26 29 30 11 20 21 27 28 10 12 13 14 16 17 23 +5V +5V GND +5V LCLK R7 LDATA STRB4 STRB1 STRB3 STRB2 STRB5 -STFAIL C4 STAT X1 14.11.90 Sheet 2 of 6 GND C3 -RES System 20 Driver Card - GPIB 80 Rev 0 CPU, address decoding, ROM and buffers R6 INH GND RDATA3 RDATA4 RDATA5 RDATA2 SW3 +5V +5V +5V R5 16 15 14 13 12 11 20 19 18 17 Vcc 1Y2 1Y1 1Y4 -2G 2A3 1Y3 2A2 2A1 2A4 R22 U5 74HCT244 2Y4 -1G 2Y3 2Y2 2Y1 1A1 1A2 1A3 1A4 GND GND 1 9 10 2 3 4 5 6 7 8 GND Q4 GND +5V R23 +5V GND J3 1 2 3 4 5 -LD3 -IRQ1 -LD2 -LD4 -LEAK1 -LEAK2 -DROP SERCLK IGIDATA Serial Debug -CTEST2 -CTEST1 MODDATA

20-520/20-525 pickering 28 SWITCHING MATRIX MODULE DIO4 SRQ DIO6 DIO8 REN DIO2 ATN DIO5 EOI IFC NRFD DIO1 NDAC DIO3 DIO7 DAV +5V +5V 21 20 21 20 24 22 19 18 15 24 22 19 18 15 17 17 16 14 13 16 14 13 23 23 Vcc Bus 0 Vcc Bus 0 Bus 1 Bus 2 Bus 3 Bus 4 Bus 5 Bus 6 Bus 7 Bus 1 Bus 2 Bus 3 Bus 4 Bus 5 Bus 6 Bus 7 S/-R (7) S/-R (7) Bus GND Bus GND GND S/-R (1-4) S/-R (1-4) GND U7 U8 3447 3447 S/-R (0) S/-R (5) S/-R (6) Logic GND S/-R (0) S/-R (5) S/-R (6) Logic GND Data 0 Data 1 Data 2 Data 3 Data 4 Data 5 Data 6 Data 7 Data 0 Data 1 Data 2 Data 3 Data 4 Data 5 Data 6 Data 7 8 9 8 9 1 2 3 4 6 1 2 3 4 6 7 7 5 5 11 11 10 12 10 12 -IRQ1 14.11.90 Sheet 3 of 6 GPIA, bus transceivers A2 A1 A0 32 31 25 28 21 27 30 29 24 22 26 23 40 39 38 37 36 35 34 33 -IRQ -EOI -SRQ RS2 RS1 RS0 -IB0 -IB1 -IB2 -IB3 -IB4 -IB5 -IB6 -IB7 TRIG -REN -IFC -ATN T/-R1 T/-R2 System 20 Driver Card - GPIB 80 Rev 0 U6 GND +5V DMA Req -DAV Vss DMA Gra -CS Vcc DB3 DB4 DB5 DB6 -ASE R/-W E DB0 DB1 DB2 DB7 -RES RFD DAC 8 9 1 2 3 4 6 7 5 11 20 15 19 18 17 10 12 13 14 16 D0 D1 D2 D3 D4 D5 D6 D7 E -WR -RES -GPIACS

20-520/20-525 pickering R.F. SWITCHING MATRIX MODULE 29 -WR E -PIACS2 -RES A0 A1 A12 GND D0 D1 D2 D3 D4 D5 D6 D7 32 25 31 29 26 22 28 21 30 24 27 23 40 39 38 37 36 35 34 33 D0 D1 D2 D3 D4 D5 D6 D7 EN RS0 RS1 -RES CS1 CS0 R/-W -CS2 CA1 CA2 -IRQA -IRQB U9 6321 -LEAK1 GND PB0 PB1 PB2 PB3 CB1 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PB4 PB5 PB6 PB7 CB2 Vss Vcc 6 7 8 9 1 2 3 4 5 18 20 12 14 15 16 19 11 17 10 13 +5V GND R9 14.11.90 Sheet 4 of 6 -CTEST1 PIA, selector switches R8 System 20 Driver Card - GPIB 80 Rev 0 +5V RDATA1 SW1 SW2 1 2 3 4 5 6 7 8 9 10 1 2 3 4 5 GND MSB LSB MSB LSB Primary Address Secondary Address

20-520/20-525 pickering 30 SWITCHING MATRIX MODULE +5V -STFAIL R21 GND 8 7 6 5 V+ OUT NULL STRB U10 R20 NULL IN- IN+ V- 4 2 3 1 R19 R18 C5 R17 R16 RL1 RL2 RL3 RL4 VREL 14.11.90 Sheet 5 of 6 R15 Self-test analog circuits -DROP -LEAK2 -CTEST2 R14 System 20 Driver Card - GPIB 80 Rev 0 R13 TST1 TST2 TSTGND Q3 Q2 GND R12 R11 R10 VSEL -CTEST1

20-520/20-525 pickering R.F. SWITCHING MATRIX MODULE 31 1 2 4 5 7 3 6 J2 8 11 14 12 13 9 10 1 2 3 4 5 6 and Self-Test J4 Secondary Serial Loops Serial Loop No 5 (for display) GND +5V TST1 TST2 TSTGND STRB2 STRB5 STRB3 STRB4 RDATA4 RDATA3 RDATA5 14.11.90 RDATA2 Sheet 6 of Inter-PCB Connectors System 20 Driver Card - GPIB 80 Rev 0 5 1 2 3 4 7 8 9 6 16 17 11 12 13 14 15 10 J1 21 24 25 26 18 22 23 19 20 27 28 31 32 33 34 29 30 Internal Bus and Primary Serial Loop VREL VSEL +5V GND INH EOI IFC ATN REN DIO1 DIO8 DIO7 SRQ DAV DIO4 DIO2 DIO3 DIO5 NRFD DIO6 STLD LCLK relative to their physical positions. NDAC SERCLK LDATA STRB1 RDATA1 IGIDATA MODDATA The pin rows of connectors J1, J2 are interchanged Note :-

20-520/20-525 pickering 32 SWITCHING MATRIX MODULE GPIB80 System 20 Driver Card inter-PCB connectors (from component side)

VREL 1 18 VSEL (+12v) LCLK 1 8 LDATA

GND 2 19 +5v RDATA2 2 9 STRB2

3 STRB3 DIO2 3 20 DIO1 RDATA3 10 4 DIO4 4 21 DIO3 RDATA4 11 STRB4

RDATA5 5 STRB5 DAV 5 22 EOI 12 INH NDAC 6 23 NRFD TSTGND 6 13

SRQ 7 24 IFC TST2 7 14 TST1

DIO5 8 25 ATN Secondary connector DIO7 9 26 DIO6

REN 10 27 DIO8

GND 11 28 STLD

LCLK 12 29 LDATA

RDATA1 13 30 STRB1

INH 14 31 GND

MODDATA 15 32 IGIDATA

SERCLK 16 33 NC

NC 17 34 NC

Note : Primary connector Pin numbering is PIL convention only (not industry standard)

20-520/20-525 pickering R.F. SWITCHING MATRIX MODULE 33 Parts List for GPIB80 Rev0 PCB Assembly

PCB PIL Part Part Location Number Description

R1 C/RS/012 Res 6k8Ω 5% 1/4W R2 C/RS/012 Res 6k8Ω 5% 1/4W R3 C/RS/012 Res 6k8Ω 5% 1/4W R4 C/RS/016 Res 8-pin SIP, 4 x 330R separate R5 C/RS/012 Res 6k8Ω 5% 1/4W R6 C/RS/013 Res 9-pin SIP, 8 x 10k commoned R7 C/RS/012 Res 6k8Ω 5% 1/4W R8 C/RS/013 Res 9-pin SIP, 8 x 10k commoned R9 C/RS/013 Res 9-pin SIP, 8 x 10k commoned R10 C/RS/025 Res 22kΩ 5% 1/4W R11 C/RS/012 Res 6k8Ω 5% 1/4W R12 C/RS/024 Res 180kΩ 5% 1/4W R13 C/RS/025 Res 22kΩ 5% 1/4W R14 C/RS/026 Res 470kΩ 5% 1/4W R15 C/RS/027 Res 470RΩ 5% 1/4W R16 C/RS/025 Res 22kΩ 5% 1/4W R17 C/RS/024 Res 180kΩ 5% 1/4W R18 C/RS/012 Res 6k8Ω 5% 1/4W R19 C/RS/005 Res 180RΩ 5% 1/4W R20 C/RS/024 Res 180kΩ 5% 1/4W R21 ———— Omit R22 C/RS/012 Res 6k8Ω 5% 1/4W R23 C/RS/012 Res 6k8Ω 5% 1/4W

Q1 C/SC/001 Transistor BC182L Q2 C/SC/001 Transistor BC182L Q3 C/SC/018 Transistor RFP 12P08 Q4 C/SC/001 Transistor BC182L

RL1 C/RL/000 Reed Relay 109-1-A-5/2D RL2 C/RL/000 Reed Relay 109-1-A-5/2D RL3 C/RL/000 Reed Relay 109-1-A-5/2D RL4 C/RL/000 Reed Relay 109-1-A-5/2D

U1 C/IC/019 IC DIG 7705 U2 C/IC/018 IC DIG 63B03X U3 C/IC/028 IC DIG 74HCT139 U4 C/IC/024 IC DIG 27256 EPROM U5 C/IC/033 IC DIG 74HCT244 U6 C/IC/020 IC DIG 68488P U7 C/IC/021 IC DIG 3447 U8 C/IC/021 IC DIG 3447 U9 C/IC/016 IC DIG 63B21 U10 C/IC/037 IC LIN CA3140E

C1 C/CP/009 Cap 10uF elect C2 C/CP/005 Cap 100nF C3 C/CP/010 Cap 22pF C4 C/CP/010 Cap 22pF C5 C/CP/005 Cap 100nF C6 C/CP/003 Cap 22uF tant C7 C/CP/001 Cap 10nF C8 C/CP/001 Cap 10nF C9 C/CP/001 Cap 10nF C10 C/CP/001 Cap 10nF C11 C/CP/001 Cap 10nF C12 C/CP/001 Cap 10nF C13 C/CP/001 Cap 10nF

SW1 C/SW/005 DIP Switch 10-pole dip piano key

20-520/20-525 pickering 34 SWITCHING MATRIX MODULE SW2 C/SW/001 DIP Switch 5-pole dip slide

SW3 C/SW/004 Switch 1pst p/button

LD1 C/SC/004 LED (red) LD2 C/SC/007 LED (green) LD3 C/SC/004 LED (red) LD4 C/SC/008 LED (yellow)

X1 C/MS/000 Xtal 4.00 MHz

J1 C/CN/097 34-way pin header (2 row, gold pl.) J2 C/CN/077 14-way pin header (2 row, gold pl.) J3 ———— J4 C/CN/110 6-way pin header (1 row)

C/PC/086 PCB 6U PTH

20-520/20-525 pickering R.F. SWITCHING MATRIX MODULE 35 8.2 8 x 8 Single Pole Relay PCB Assembly

J B 1 2 3 4 5 6 7 8 9 1 4 BB8 B8 8 0 BB2 BB24 BB23 U 2 K 3 BB2 BB21 BB10 B 9 BB7 B7 7 BB1 BB18 BB17 6 J BB1 BB15 BB14 B 3 BB6 B6 6 BB1 BB12 BB11 0 H BB 9 B S Out BB5 B5 5 C C 5 6

G U 2 B BB4 B4 4

J 3 F

B BB3 B3 3

B BB2 B2 2

J C C 1 D 3 4

B U BB1 B1 1 1

J RL 2 97 B

S In RL 5 12 98 V V A C C 1 2

F F F F F F F F 1 2 3 4 5 6 7 8

Fig 8.8 Relay PCB Layout

20-520/20-525 pickering 36 SWITCHING MATRIX MODULE System 20 Relay Card inter-PCB connectors (from component side)

NC 34 17 NC TST1 14 7 TST2

NC 33 16 SERCLK (14a) INH 13 6 TSTGND

IGIDATA (13c) 32 15 MODDATA (14c) STRB5 12 5 RDATA5

STRB4 11 RDATA4 GND (1a, c) 31 14 INH 4

STRB1 30 13 RDATA1 STRB3 10 3 RDATA3

LDATA 29 12 LCLK STRB2 9 2 RDATA2

STLD (13a) 28 11 GND (1a, c) LDATA 8 1 LCLK

DIO8 (11c) 27 10 REN (12a) Secondary connector DIO6 (10c) 26 9 DIO7 (11a)

ATN (9a) 25 8 DIO5 (10a)

IFC (8a) 24 7 SRQ (8c)

NRFD (7a) 23 6 NDAC (7c)

EOI (6a) 22 5 DAV (6c)

DIO3 (5a) 21 4 DIO4 (5c)

DIO1 (4a) 20 3 DIO2 (4c)

+5v (3a, c) 19 2 GND (1a, c)

VSEL (+12v) (4c) 18 1 VREL

Note : Primary connector Pin numbering is PIL convention backplane bus pin connects in only (not industry standard) brackets

Parts List for GPIB86 Rev0 Relay (1 Pole) PCB Assembly

PCB PIL Part Part Location Number Description J1, J4 C/CN/001 Connector DIN 41612 64 Way A/C J3 C/CN/077 Header 14 pin 2 row J2 C/CN/000 Header 34 pin 2 row B1..B8 C/CN/118 PC Mount Dielectric FeedThru 2, 6/50 F1..F8 C/CN/118 PC Mount Dielectric FeedThru 2, 6/50

C1..C6 C/CP/001 Cap 10nF

RL1..RL98 RF Reed Relay See Sec 1.3 for type U1..U3 C/IC/026 IC DIG UCN 5818A C/PC/086 PCB 6U 4 Layer

20-520/20-525 pickering R.F. SWITCHING MATRIX MODULE 37 8.3 8 x 8 Double Pole Relay PCB Assembly

24B8.2 B8.1 K d 23 c 22

L-T 21 1- 1- 1- 20 A A C 19 C9 C10 B7.2 B7.1 J 18 d 17 c 16

L-T 1 15 14 13 B6.2 B6.1 H 12 d 11 c 10 U4 L-T 9 8 7 C7 C8 B5.2 B5.1 G 6 d 5 c 4 L-T 1 3 2 1 J4 B4.2 B4.1 F d c

U3 L-T

C5 C6 B3.2 B3.1 E d c

J3 L-T 1

B2.2 B2.1 D d c

L-T U2

B1.2 B1.1 C C3 C4 d c

L-T 19 20 1

C1 C2

1 2 U1

RL193 RL194 A bb bbb b b b b bb b b b b b

aa a aa a a a aa a a a a a a

L-T L-T 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

L-T L-T F1. F2. F3. F4. F5. F6. F7. F8. 1 1 1 1 1 1 1 1

L-T L-T

J2 J1 L-T L-T F1. F2. F3. F4. F5. F6. F7. F8. 2 2 2 2 2 2 2 2

Note: Self Test Fails are diagnosed down to a pair of reed relays (so both relays must be removed), the pairs are shown above.

20-520/20-525 pickering 38 SWITCHING MATRIX MODULE Parts List for GPIB110 Rev0 Relay (2 Pole) PCB Assembly

PCB PIL Part Part Location Number Description

J1, J4 C/CN/001 Connector DIN 41612 64 Way A/C J2 C/CN/124 34 Way Mini-DIP Transition Connector J3 C/CN/128 14 Way Mini-DIP Transition Connector

B1..B8 C/CN/118 PC Mount Dielectric FeedThru 2, 6/50 F1..F8 C/CN/118 PC Mount Dielectric FeedThru 2, 6/50

C1, C2 C/CP/003 Cap Tant 22uF 16V C3..C10 C/CP/001 Cap Cer 10nF 50V

RL(A3-K20),195,196 RF Reed Relay, See Sec 1.3 for type RL193,194,197 C/RL/057 107-1-C-12/3D

U1..U4 C/IC/035 IC DIG UCN 5818EPF

C/PC/110 PCB 6U 4 Layer

20-520/20-525 pickering R.F. SWITCHING MATRIX MODULE 39 20-520/20-525 pickering 40 SWITCHING MATRIX MODULE Section 9 Adapting Matrix for Analogue Bus Connection

9.1 Configuring Matrix for Analogue Bus Connection

All RF matrix modules are shipped from the factory configured for front panel interconnection (please refer to Sec 2.5), therefore if the analogue bus is to be used then the module should be ordered in that configuration or the module must be modified by the user. To reconfigure the matrix module for analogue bus connection for a single pole 8 x 8 matrix:- • Remove all Coaxial Launchers, locations B1, B2,...... B8 on relay PCB. • Connect links BB8 to B8, BB7 to B7 ...... BB1 to B1. The operation is similar for 16 x 4 and all double pole versions. Please contact factory if you require further information or assistance, module can also be returned to Pickering for modification.

20-520/20-525 pickering R.F. SWITCHING MATRIX MODULE 41 20-520/20-525 pickering 42 SWITCHING MATRIX MODULE Section 10 Electrical, Environmental, Mechanical & Firmware Specifications

Environmental Operating Temperature 0°C to 50°C. Storage Temperature -20°C to 75°C. Humidity 95% non condensing.

Weight Dimensions and Power Requirements

Approx. Weight/g 1000

Dimensions/mm † Front Panel Width 60.5 Height 268 Overall Length 189

Power /Current Consumption

Maximum 5V 250 /mA 12V 1000

Minimum 5V 150 12V 0

† Approx. dimensions. Standard 160mm, 6U, Eurocard, as specified in DIN 41494.

Voltage Supplies Logic Supply 5Vdc ±5%. Relay Supply 12Vdc ±10%

Current Firmware Revision: 2.00

20-520/20-525 pickering R.F. SWITCHING MATRIX MODULE 43 20-520/20-525 pickering 44 SWITCHING MATRIX MODULE Artisan Technology Group is an independent supplier of quality pre-owned equipment

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