Implementing IBM Flashsystem 900 Model AE3
Total Page:16
File Type:pdf, Size:1020Kb
Front cover Implementing IBM FlashSystem 900 Model AE3 Detlef Helmbrecht Jim Cioffi Jon Herd Jeffrey Irving Christian Karpp Volker Kiemes Carsten Larsen Adrian Orben Redbooks International Technical Support Organization Implementing IBM FlashSystem 900 Model AE3 March 2018 SG24-8414-00 Note: Before using this information and the product it supports, read the information in “Notices” on page ix. First Edition (March 2018) This edition applies to the IBM FlashSystem 900 Model AE3. © Copyright International Business Machines Corporation 2018. All rights reserved. Note to U.S. Government Users Restricted Rights -- Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp. Contents Notices . ix Trademarks . .x Preface . xi Authors. xi Now you can become a published author, too! . xiv Comments welcome. xiv Stay connected to IBM Redbooks . xiv Chapter 1. Introduction to FlashSystem . 1 1.1 FlashSystem storage overview . 3 1.2 IBM FlashCore technology . 4 1.2.1 IBM Piece of Mind Initiative. 5 1.3 Why flash technology matters . 6 1.4 IBM FlashSystem family product differentiation . 7 1.5 Technology and architectural design overview . 8 1.5.1 Hardware-only data path. 9 1.5.2 3DTLC flash memory chips. 10 1.5.3 Flash module capacities . 10 1.5.4 Gateway interface FPGA . 11 1.5.5 Flash controller FPGA. 11 1.5.6 IBM Variable Stripe RAID and 2D Flash RAID overview . 12 1.5.7 Inline hardware data compression . 14 1.5.8 Encryption . 14 1.6 Usability plus reliability, availability, and serviceability enhancements . 16 1.6.1 Automatic battery reconditioning. 16 1.6.2 Remote Support Assistance . 16 1.6.3 Enhanced Thermal Management . 16 1.6.4 A/C Power Line Monitoring . 17 1.6.5 Enhanced Call Home Data . 17 1.6.6 GUI enhancements . 17 Chapter 2. IBM FlashSystem 900 Model AE3 architecture . 19 2.1 IBM FlashSystem 900 Model AE3 architecture overview . 20 2.1.1 Capacity . 20 2.1.2 Performance and capacity considerations . 22 2.1.3 In-line Hardware Data Compression. 23 2.1.4 Physical and effective capacity based on compression rates. 24 2.1.5 Out Of Physical Space . 27 2.1.6 Performance and latency . 29 2.1.7 Power requirements . 30 2.1.8 Physical specifications . 30 2.1.9 FlashCore technology . 30 2.1.10 Scalability . 32 2.1.11 Protocol support . 33 2.1.12 Encryption support . 33 2.1.13 IBM FlashSystem Model 900 AE2 and Model 900 AE3 differences . 35 2.1.14 Management . 35 2.2 Architecture of IBM FlashSystem 900 Model AE3 . 38 © Copyright IBM Corp. 2018. All rights reserved. iii 2.2.1 Overview . 38 2.2.2 Hardware components . 40 2.2.3 Canisters. 41 2.2.4 Interface cards . 42 2.2.5 MicroLatency modules . 44 2.2.6 Battery modules . 46 2.2.7 Power supply units . 47 2.2.8 Fan modules . 48 2.3 Administration and maintenance. 48 2.3.1 Serviceability and software enhancements. 48 2.3.2 System management . 49 2.4 Support matrix. 55 2.5 Product integration overview. 55 2.5.1 IBM Spectrum Virtualize - SAN Volume Controller . 55 2.5.2 IBM Storwize V7000 storage array . 56 2.5.3 IBM DB2 database environments . 57 2.5.4 IBM Spectrum Scale . 57 2.5.5 VMware with IBM Spectrum control Base. 58 Chapter 3. Planning . 59 3.1 Prerequisites to installation . 60 3.1.1 Contact information and checklist . 60 3.1.2 Completing the hardware location chart . 61 3.2 Planning cable connections . 63 3.2.1 Management port connections . 63 3.2.2 Interface card connections . 64 3.3 Planning for power . 67 3.4 Configuration planning . 67 3.5 Call Home configuration . ..