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Intel® Edison Board Support Package User Guide September 2014 2 Document Number: 331188-001

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Intel® Edison Board Support Package User Guide September 2014 2 Document Number: 331188-001 Intel® Edison Board Support Package User Guide September 2014 Revision 001 Document Number: 331188-001 Notice: This document contains information on products in the design phase of development. The information here is subject to change without notice. Do not finalize a design with this information. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A “Mission Critical Application” is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL’S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. Intel software products are copyrighted by and shall remain the property of Intel Corporation. Use, duplication, or disclosure is subject to restrictions stated in Intel’s Software License Agreement, or in the case of software delivered to the government, in accordance with the software license agreement as defined in FAR 52.227-7013. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. The code names presented in this document are only for use by Intel to identify products, technologies, or services in development that have not been made commercially available to the public, i.e., announced, launched, or shipped. They are not "commercial" names for products or services and are not intended to function as trademarks. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-548-4725 or by visiting Intel’s website at http://www.intel.com/design/literature.htm. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/products/processor_number for details. Intel and the Intel logo are trademarks of Intel Corporation in the US and other countries. * Other brands and names may be claimed as the property of others. Copyright © 2014 Intel Corporation. All rights reserved. Intel® Edison Board Support Package User Guide September 2014 2 Document Number: 331188-001 Contents 1 Introduction ....................................................................................................................................................................... 5 1.1 The Yocto Project.......................................................................................................................................................................... 5 1.2 References ........................................................................................................................................................................................ 6 1.3 Terminology .................................................................................................................................................................................... 6 2 Building a Standard Edison Image ................................................................................................................................ 7 2.1 Build the Edison native SDK ..................................................................................................................................................... 8 3 Creating Custom Edison Images .................................................................................................................................... 9 3.1 Adding standard Yocto packages in the image ............................................................................................................... 9 3.2 Excluding packages from the image .................................................................................................................................... 9 3.3 Add third-party packages to the image .............................................................................................................................. 9 3.4 Write a Yocto recipe from scratch ...................................................................................................................................... 10 3.5 Add a recipe for a systemd service .................................................................................................................................... 10 4 Customizing the Linux Kernel ...................................................................................................................................... 11 Figures Figure 1. Building an image ..................................................................................................................................................................... 5 Figure 2 Linux kernel configuration ................................................................................................................................................ 11 Intel® Edison Board Support Package September 2014 User Guide Document Number: 331188-001 3 Revision History Revision Description Date ww26 Initial release. July 7, 2014 ww32 Improved section about adding external recipes. August 4, 2014 ww36 Corrected code example in chapter 4. September 5, 2014 001 First public release. September 9, 2014 § Intel® Edison Board Support Package User Guide September 2014 4 Document Number: 331188-001 Introduction 1 Introduction This document is for software and system engineers who are building and customizing images, kernels, and native SDKs for the Intel® Edison Development Platform. Precompiled versions of the BSP are available on the Intel website. Users who don’t want to modify the default images don’t need to read this document. The Intel® Edison Board Support Package offers these features: • Kernel image based on Linux kernel 3.10.17 • U-boot second stage bootloader • Bluetooth and Wi-Fi connectivity • Intel cloud connectivity middleware • Many base Linux packages provided by the Yocto project 1.1 The Yocto Project The standard Linux OS shipped on the Edison device is based on Yocto. The Yocto Project is an open source collaboration project that provides templates, tools, and methods to help you create custom Linux-based systems for embedded products. Figure 1. Building an image The Edison BSP source package is the set of Yocto source files necessary to generate a Linux image ready to run on the Edison board. It contains: • The set of Yocto recipes describing the process for building a Linux kernel, a bootloader, and a rootfs, which together form the bootable images ready to flash on a device. • The set of Yocto recipes necessary for creating a Software Developer Kit (SDK) and a cross-compiling tool chain that developers can use to create native applications for Edison. Note: For details on the Yocto project, consult the documentation on the Yocto website. (See section 1.2.) Intel® Edison Board Support Package September 2014 User Guide Document Number: 331188-001 5 Introduction 1.2 References Reference Name Number/location 331188 Intel® Edison Board Support Package User Guide (This document) 331189 Intel® Edison Module Hardware Guide 331190 Intel® Edison Breakout Board Hardware Guide 331191 Intel® Edison Kit for Arduino* Hardware Guide 331192 Intel® Edison Native Application Guide 331193 Intel® Edison Quick Start Guide [RN] Intel® Edison Board Support Package Release Notes [GSG] Intel® Edison Getting Started Guide [YPQSG] Yocto Project Quick Start Guide http://www.yoctoproject.org/docs/current/yocto- project-qs/yocto-project-qs.html [YDM] Yocto Developer Manual http://www.yoctoproject.org/docs/current/dev- manual/dev-manual.html [YKDM] Yocto Kernel Developer Manual http://www.yoctoproject.org/docs/latest/kernel- dev/kernel-dev.html 1.3 Terminology Term Definition SSH Secure shell FTP File Transfer Protocol GDB GNU debugger § Intel® Edison Board Support
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