Webinar: Minimize Fire Risk in USB-C Co n n e c t o r s

John Hsieh Advanced Engineering Manager, DSM Engineering Materials

April 14, 2021 Introduction

• Taiwanese, lived in Shanghai for 15 years

• Master degree in Mechanical Engineering

• 20 years’ of experience in a broad range of electronics applications across the value chain (electronics devices PM, connector PM, industry marketing and then engineering material technical marketing)

• Joined DSM in 2013 at Shanghai, and then relocated to California in 2016, moved back to Shanghai again in 2018. John Hsieh Advanced Engineering Manager DSM Engineering Materials Quick facts and figures DSM Engineering Materials and DSM overall

DSM Workforce Net sales R&T Investment Production Technology Engineering Materials ~1,900 ~€ 1.4 b n ~4.5% 8 ~90% Figures for 2019 of revenue production of all new cars and electronics reinvested in R&T facilities devises use DSM technology

DSM Workforce Net sales Safety Planet overall 21,000 € 9.01 b n 0.28 #1 AAA excluding Figures for 2019 frequency index globally in rating in the affiliates of recordable sustainability MSCI in d e x injuries for 2019 by Sustainalytics

3 Quick facts and figures Global footprint to support our customers

Togliatti - Russia Emmen - Düsseldorf - Ge r m a n y Netherlands

Jiangyin - China Incheon – South Korea Evansville - USA Sittard - Netherlands Ge n k - Be lgiu m Shanghai-China Tokyo - Japan Geleen - Netherlands Shenzen-China Detroit - USA Pantnagar - India Silicon Valley - USA Gu r ga o n - India Taipei - Taiwan

Pune - India Kaohsiung - Taiwan Querétaro - Me xic o Chennai- India Ho Chi Minh City - Vi e t n a m

Bangkok - Thailand Singapore DSM Engineering Materials Production locations São Paulo - Bra zil R&D locations Offices

4 USB-C: The most popular data & powerful interface in the consumer electronics industry One connector for many devices

Tablet Earphone HDD Power TV Laptop

Smartphone Desktop

Smart speaker AR / VR

5 The mobile phone evolution Thinnovation & Integration

Evolution Evolution 2007 - 2017 1988 - 2020

Higher Power Advanced Features Higher Battery Capacities Fast Charging Consumption

6 Fast Charging standards

Samsung MediaTek Qualcomm Motorola USB 3.1 OnePlus Charging USB 2.0 USB 3.0 Adaptive PumpExpress Quick TurboPower (USB-C + Super WarpCharge SuperCharge Technology port port Fast 4.0 Charge 5* 30 USB PD) VOOC 30 2.0 Charger (USB-PD) (USB-PD) (USB-PD)

Max Power 2.5W 4.5W 100W 45W 65W 30W 40W 25/ 30W 100W+ 28.5W

3 V - 6V 5 V/ 9 V( US B Voltage 5V 5V 5 V - 20V 5/9/20V 5/ 10V 5V 5/9/10V PD) 5/9/12V (10-2 0 m V p e r 3 . 6 V~2 0 V step) 0 . 5 A/ 0 . 9 A/ 2/ 1.67/ 2.25 5.7/ 2.85/ 2.15 Current 0.5A 0.5/ 0.9A 10/ 6.5A 2/ 6A 2/ 2/ 4A 5 A+ 5 A+ 1. 5 A/ 3 A/ 5 A A A

• Qualcomm announced the 5 solution on July 27th, 2020. Xi a o Mi , ASUS, Lenovo and Samsung have announced to use this technology in their new flagship models.

• The USB PD and various fast charging standards increase the burning risk dramatically, and this brings a new challenge to smartphone and connector designers.

7 The different generations of USB connector

Available receptacles for each connector Connector type Zoom in USB 1.0 USB 2.0 USB 2.0 USB 3.0 USB 3.1 USB 3.2 USB4 Generations 1996 2001 Revised 2011 2014 2017 2019 1.5 Mb it / s 1.5 Mb it / s (Low Speed) (Low Speed) 12 Mb it / s 40 Gb it / s 5 Gb it / s 10 Gb it / s 20 Gb it / s Data rate (Full Speed) (SuperSpeed+ and (SuperSpeed) (SuperSpeed+) (SuperSpeed+) 12 Mb it / s 4 8 0 Mb it / s Thunderbolt 3) (Full Speed) (High Speed)

Typ e A Typ e A Deprecated Standard Typ e B Typ e B Deprecated

N/ A Typ e C (enlarged)

Mini A N/ A Mini Mini B Deprecated

N/ A Mini AB

N/ A

Mic r o B Mic r o B Deprecated Micro N/ A

Mi c r o AB Deprecated

USB 1.0 USB 2.0 USB 2.0 USB 3.0 USB 3.1 USB 3.2 USB4 Typ e C Typ e C Connectors 1996 2001 Revised 2011 2014 2017 2019 receptacles plugs

8USB type C connector is the only one interface to support USB 4 and onward version’s USB devices. Thunderbolt 3, 4 & USB 4

Thunderbolt is used in high end laptop/ ultrabook.

9 USB4 SI analysis Both ForTii Eco E11 and Stanyl HFX33S meet USB 4 standard

Item Plug (Dk, Df) Rec (Dk, Df) 1 LCP (3.4, 0.004) LCP (3.4, 0.004) 2 E11 (3.6, 0.01) E11 (3.6, 0.01) 3 HFX33 (3.48, 0.01) HFX33 (3.48, 0.01) 4 LCP (3.4, 0.004) E11 (3.6, 0.01) 5 LCP (3.4, 0.004) HFX33 (3.48, 0.01)

10 * Performed by Dr. James Lin (Lo t e s Co., Ltd.) USB type C connector challenges and solutions

11 Challenges with traditional materials Thinner walls require high -strength and more durable materials

• Liquid crystal polymers (LCP) are widely used for micro -USB connectors

• USB-C connectors require thinner walls than previous generations

• Fast charging increases the risk of connector defect

• Alternative materials are needed to produce reliable thin - walled connectors

12 Addressing safety concerns Recently Qualcomm released the latest Quick Charge 5 solution, and several New thinner devices pose fire risks smartphone companies are using the technology in new devices.

• Connectors with higher voltage rates and smaller pitch are more likely to result in electrical breakdown

• The tracking resistance of the insulator plastic is essential to reducing fire hazards Source capabilities organized as profiles

Hand-held devices, 10W Profile 1 5V @ 2A Default start -up today’s peripherals profile

Tablets, VR/AR devices, 5V @ 2A Profile 2 18W most peripherals 12V @ 1.5A Requires new Thinner notebooks, 5V @ 2A Profile 3 36W detectable larger peripherals 12V @ 3A cables for >1.5A or >5V 5V @ 2A Larger notebooks, hubs, 60W Profile 4 12V @ 3A Limit for docks 20V @ 3A micro A/B

5V @ 2A Workstations, hubs, 100W Profile 5 12V @ 5A Limit for standard docks 20V @ 5A A/B

13 Understanding tracking Insulating plastics may create fire risks

Potential real -life failure mode • The build-up of dust, sweat or moisture creates a conductive track on plastic materials – increasing the risk of fire

LCP after testing with 12 droplets — significant burn marks and electrical breakdown 14 Tracking resistance testing High CTI material decreases safety risks for connectors and devices • Materials need a high comparative tracking index (CTI) to ensure products are safe • Higher CTIplastic remains structurally intact even after testing of 60 droplets!

15 Insight s Charging electronics have been linked to device fires

• Some fires may result in property damage or injury Charging cell phone blamed for • If liable, manufacturers risk recalls, damage fire that destroyed Frayser home to their reputation and legal action

• Tracking posed fire risks with the previous generations of USB connectors. With USB-C, Cell phone charger not ruled out as the smaller pitch and increased power cause of Tuesday house fire in Redding density may further increase the risk of fire.

• “Home fires due to electrical failure or malfunction primarily involve some form of arcing. Arc faults can be produced by damaged connectors…”

Source: “Home Electrical Fires” report by NFPA

16 USB type C Receptacle structure and challenges

1st part (grey) Challenge 4 3rd part Over mold (purple)

Challenge 3

2nd part (black) Challenge 1 Challenge 1 Challenge 2

Challenge 1: the over mold parts need to be bounded with 1 st and 2nd parts well Challenge 2: Very thin wall in the both sides (0.1~0.2mm only), need very high flow material Challenge 3: front end plastics to protect metal contact, need high wear resistance material to ensure the reliability and durability during mating/ un-mating cycles.

Challenge 4: inappropriate tooling design may cause other issues such as void inside the housing or delamination

17 USB type C Plug structure and challenges

1st part (green) 2nd part (light green) Challenge 6 EMI springs

Challenge 7 Challenge 5 3rd part (grey)

Challenge 5: There is welding line in the front end and very easy to be broken. The broken parts may cause connector malfunction. Need high welding line strength material Challenge 6: The ribs are very thin (~0.15mm) and very easy to break during EMI spring assembly. Need high stiffness material Challenge 7: Deformation in the front end of plug housing, need higher strength material

18 Overcoming plug housing challenges Meeting all durability, flow and toughness needs

• Molding thin ribs requires high flow, highly durable materials

• Final components must retain a balance between toughness and stiffness

• High-strength weldlines are very durable

Stanyl shows the highest weldline strength among competitors Normal Weldline tensile bar tensile bar Base polymer [-] P A4 6 P A9 T PA6T/ 66 LCP

GF content [%] 20 35 45 35 35

Mechanical property [MP a ] 60 50 22 40 17 weldline strength Low weldline strength material Weldline strength measurement is based on UL tensile bar shows cracking in plug designs

19 Different polymer structure leads to different material characteristics

LCP has very rigid molecular structure in both solid and melt state, Stanyl/PA46 has flexural molecular chain, easier for therefore the very few entanglements and chemical interactions cause entanglement, and Fast crystallization to solidify the the very low weldline strength entanglement area

20 Wear resistance comparison of Halogen Free V0 grades Stanyl shows the highest wear resistance

Stanyl ForTii F11 GF30% PA9T GF45% PA6T GF35% LCP GF+MD35% HFX33S GF20%

Wear & Friction

Depth 8μm 22μm 47μm 36μm 23μm

21 * Test Condition: 20g, Stroke 40mm, Speed 70cycle/min, 100Kcycles. Probe Pin Front end R 0.4mm Full product portfolio for different design

Supplier DSM Competitor A Competitor B Competitor C Standard Gr a d e [-] HFX33S H FX6 1S H FX8 2 S GP2450 NH-2 FR52G35NHF E471i base polymer [-] P A4 6 P A9 T PA6T/ 66 LCP GF content [%] 20 35 45 45 35 35 Mechanical property TM [MP a ] 7400 11500 15000 15100 12800 13800 ISO 527-1/ -2 TS [MP a ] 110 145 180 146 135 130 ISO 527-1/ -2 EAB [%] 2.7 2.1 2.2 1.5 1.4 2.5 ISO 527-1/ -2

• Stanyl HFX33S has highest elongation at break ration and ductility among competitions

• DSM provides the product portfolio solution to meet different connector design needs

22 Blistering free solution JEDEC MSL-1 test

Sample: Connectors Material: Stanyl HFX 31S/33S/61S BK pre-dried: 105℃*16hrs Preconditioning: MSL-1(85℃×85%RH×168hrs) MSL-2(85℃×60%RH×168hrs) Reflow profile:Sony profile with peak temp. 260℃ Reflow time: one time pass

Material Sample type Pre-conditioning Water absorption(%) Blistering

HFX 61S with metal shell 0.4 0/9 85℃*85%RH*168hrs HFX 61S without metal shell 1.7 0/9 connectors HFX 61S with metal shell 0.2 0/9 85℃*60%RH*168hrs HFX 61S without metal shell 0.8 0/9 Note: The moisture absorption was measured by weight gain, which is only for reference due to metal pin included. Thermocoup le position Material Sample type Pre-conditioning Water absorption(%) Blistering HFX 31S/33S with metal 85℃*85%RH*168hrs 1.95 0/4 Connector HFX 31S/33S without metal 85℃*60%RH*168hrs 3.89 0/4

23 * No blistering at the both receptacle and plug connectors test Choosing the best material Robust plastics reduce fire risk COMPONENT MATERIALS Ca b le Conductor: copper with tin or silver plating SDP Shield: AL foil or AL/ mylar foil Coaxial shield: copper strand • Multiple considerations go into picking Braid: Tin-plated copper or aluminum materials for USB-C components: Jacket: PVC or halogen-free substitute material Ca b le Ove rmold Thermoset or thermoplastic – Receptacle tongues Connector Shells Stainless steel or phosphor bronze Plug Side Latches Stainless steel – Plug housings Receptacle Mid-Plate Stainless steel Plug internal EMC Spring Stainless steel or phosphor bronze • Choosing a halogen-free polyamide Receptable EMC Pad Stainless steel or phosphor bronze material reduces the risk of fire Receptable Shell Stainless steel or phosphor bronze Receptable Tongue Gla s s -filled nylon Thermoplastics capable of withstanding lead-free Housing soldering temperature Note: Halogen-free materials should be considered for all plastics

*Source: USB Type C specification release 1.0 Stanyl: Best polyamide for increased product safety and reliability Highest weldline strength and best wear resistance

• High CTI reduces the risk of electrical tracking by 50% PA46 PA9T PA6T LCP

CTI 400V or avove • Excellent flow properties ensure high yields to (Q) lower molding costs 5.0 Colorability (Q) in 4.0 Blister some OEM Performance (Q) • Up to 50% more wear resistance than competing 3.0 2.0 high temperature polyamides 1.0 • Unmatched reliability during use ensured by Processability (D) 0.0 Flow (D) extensive mating cycle testing

Wear Resistance Weld Line Strength • Proven track record of more than 300 million (D) (D) USB-C connectors with zero blistering or quality Overmold Bonding complains made by Stanyl for major OEMs Force(D)

25 DSM Engineering Materials Your best partner for connector development

26 Bright Science in advanced materials Co-developing throughout the value chain

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Measure Production De s ign Compliance Performance Support

• Review application • Temperature • Quality control • Documentation requirements • Mechanical • Ide ntify • Data sheets • Analyze datasets • Chemical resistance production • Regulatory affairs • CAE support • UL and other global efficiencies statements safety standards • Life cycle analysis

27 Bright Science in advanced materials Delivering advanced material solutions for the world’s leading manufacturers

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En d -Us e r OEM De s ig n Expectations: challenge Performance and Sustainability

28 Summary Why DSM Engineering Materials?

Materials trends in DSM Engineering Materials Delivering: A trusted partner with a sustainability and supports with: strong track record technology evolve rapidly

Engineers face challenges • Global footprint Security in selecting A preferred partner of in staying up to date with • Broad materials portfolio the right materials for leading multinationals, advanced materials • Application expertise applications with with a strong track record science, innovations and • Design support speed and agility. in automotive, electronics shifts in legislation - and in • Materials innovation & electricals and food choosing the right solution • Sustainable solutions packaging. for their design challenges • Security of supply

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30 Questions and Answers

John Hsieh [email protected] +86 13818977651 32