Background Statement for SEMI Draft Document 5117

Background Statement for SEMI Draft Document 5117 REVISION TO SEMI MS2-1109, TEST METHOD FOR STEP-HEIGHT MEASUREMENTS OF THIN FILMS

Note: This background statement is not part of the balloted item. It is provided solely to assist the recipient in reaching an informed decision based on the rationale of the activity that preceded the creation of this document.

Note: Recipients of this document are invited to submit, with their comments, notification of any relevant patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this context, “patented technology” is defined as technology for which a patent has issued or has been applied for. In the latter case, only publicly available information on the contents of the patent application is to be provided.

SEMI MS2-1109 enables the determination of step height measurements of thin films. Step height measurements can be used to determine thin film thickness values. Thickness measurements are an aid in the design and fabrication of MEMS devices and can be used to obtain thin film material parameters, such as Young’s modulus.

SEMI MS2 became publicly available in March of 2007 without precision and bias data. The MEMS Young’s Modulus and Step Height Round Robin Experiment was held from December 2008 through April 2009. The SEMI MS2 standard was revised to include the round robin precision and bias data and was published in November 2009 after a successful reballot.

Standard reference materials (SRM 2494 and SRM 2495) are being developed to aid customer’s in their use of 5 documentary standard test methods (including SEMI MS2). Changes to this standard were made in SEMI Document 5117 during the development of these standard reference materials. The changes include the incorporation of an additional uncertainty component in the combined standard uncertainty equation. This SEMI Document 5117 is now being balloted. A more complete list of modifications to this document can be found in the list of revisions following this ballot cover page.

SEMI Document 5117 was approved for yellow balloting in January 2011. The ballot results will be reviewed at the March 2011 meetings in San Jose, CA of the MEMS Materials Characterization TF and the N. A. MEMS Standards Committee.

If you need technical assistance, or have questions, please contact Janet Cassard by phone at 301-975-2049 or by email at [email protected]. For procedural issues, please contact Paul Trio at 408-943-7041 or email: [email protected]. Revisions to SEMI MS2-1109 Test Method for Step Height Measurements of Thin Films

Revisions to SEMI MS21109 (most clearly seen in the red-lined version of SEMI Document 5117) include the following: 1. Throughout the standard: a. For clarification purposes, used the terminology “physical step height standard” instead of “step height standard” or “physical step height.” b. For clarification purposes, added or deleted a word, phrase, or sentence here or there and made editorial changes, as appropriate. 2. In the Referenced Standards and Documents section:

a. Added E 2530 as a reference for the calibration of the physical step height standards at NIST. 3. In the Terminology section:

a. To simplify the process in the future of altering definitions within SEMI, slightly modified the definitions of those terms that were identical to those used in ASTM E 2444.

b. Specified in the pertinent definitions whether or not the parameter is calibrated.

i. zdrift, zrepeat(shs), and z6 are now uncalibrated to match the inputs to the data analysis sheets

c. Added the uncertainty component urepeat(samp). d. Deleted z since cert can be used in place of it. e. uc is now ucSH to better identify it from similar values obtained from other standards f. zrepeat is now zrepeat(shs) g. urepeat is now urepeat(shs) to distinguish it from urepeat(samp)

h. Deleted a note specifying that zperc may be 0 % for other instruments. 4. In the Test Specimen section:

a. Specified in 8.1.1.6 that it is typically not a good design practice to have coincident edges. 5. In the Calibration section:

a. Specified that the z-calibration is similar to that found in ASTM Test Method E 2244, E 2245, and E 2246. (These standards are currently being balloted.)

b. The equations of zdrift, zrepeat(shs), and z6 were modified to make them uncalibrated in order to simplify the entry of the data into the data analysis sheets. 6. In the Procedure section:

a. In 10.4.1.5, to account for systematic errors in the measurement, specified that the fringes should not be nulled during the measurement.

b. In 10.6.2 and 10.7.1, specified that representative data should be encompassed at least 10 m from each transitional edge. In 10.7.1, specified that at least 17 m of data should be encompassed on a 50 m long platform. 7. In the Calculations section:

a. Added a reference to EUROCHEM because it gives a clear exposition of ISO GUM. 8. In the Report section:

a. Improved the wording 9. In the Precision and Bias section:

a. Specified that the round robin test chips were fabricated in a bulk-micromachining process. b. The 95 % limits are found by multiplying by 2.0 (not 2.8) and assuming the other uncertainty components equal zero. The applicable tables and figures were modified, as appropriate. c. ucave is now ucSHave to better identify it from similar values obtained from other standards. d. Added a reference to the article entitled, “MEMS Young’s Modulus and Step Height Measurements with Round Robin Results” in the NIST J. Res. for a more complete description of the round robin. 10. In Tables 2 and 3:

a. Added repeat(samp)p to the tables. b. Included calculations for the new combined standard uncertainty equation. c. Deleted the 95% limits for ucSH because it is not needed. 11. In Appendix 1:

a. Added the component urepeat(samp) to the combined standard uncertainty equation b. Specified the type of analysis (Type A or Type B) used to obtain the uncertainty components. 12. Added Table 4 to aid in the understanding of the determination of the uncertainty components. Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and 4.1 post- This 4 calculations. the into enter not do such, as and, chip the across thickness is processing considered the of testoutside scope this method. uniform a have to assumed are layers additional These measurements. gold interferometric the accurate enabling for surface reflective layer smooth, adhesion a provides an coverage as gold serves the while chromium The surface. top the on deposited be can gold of nm 150 approximately by 1: NOTE 3.1 3 and practices, health and safety appropriate establish other ofprior thelimitations use. applicability regulatoryor to determine to documents the of users the of responsibility the is It use. obtaining of capability NOTICE the with instrument comparable or interferometer data 2-D traces.topographical optical an be can using which materials, imaged (MEMS) system microelectromechanical accurately in found those as such films, to only applies It 2.1 2 measurements Thickness values. thickness film thin as parameters, Young’s canusedthin obtain such MEMSto material modulus. and be film fabrication of devices determine to used be can 1.1 1 THIN MEASUREMENTSFILMS OF SEMIMS2-1109,HEIGHT TESTFOR STEP TO METHOD REVISION Draft Document SEMI 5117 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Fax: 610.832.9555; 610.832.9585; 3 Test MEMS Structures,” Processes using Beams,” 2 Polysilicon Processes,” MEMS in Micromechanical Thickness Systems Layer Measuring for of Technique Optomechanical “New Measurements C., J. Marshall, Property “Material D., in MEMS,” and Structure Nonidealities Test Properties S. Material Determine to Microcantilevers Actuated Senturia, of “Interferometry A., D. LaVan, and F., Bitsie, D., N. Masters, P., M. and Boer, de D., B. Jensen, M., P. Osterberg, in Micromachining II and Metrology Microlithography K., R. Gupta, J.NIST Res 1 E2444 ASTM an Using Films Reflecting Thin, of Measurements Gradient Strain InterferometerOptical for Method Test Standard — E2246 ASTM an Using Films Reflecting Thin, of Measurements Strain Residual InterferometerOptical for Method Test Standard — E2245 ASTM an Using Films Reflecting Thin, of Measurements Length InterferometerOptical In-Plane for Method Test Standard — E2244 ASTM 4.2 Resonance Beamsin of Frequency the on Based Films Reflecting Thin, of Measurements Modulus Young’s for Method Test — MS4 SEMI

American Society for Testing and Materials,Drive, 100 Barr forHarbor West Society Pennsylvania and Conshohocken, Testing USA. Telephone: American 19428-2959, Vernier, J. L., C., D. P. in D. Standard Herman, Marshall, Gaitan, DeVoe, T., M.,Measurements ICCMOS “Young’s and L. Modulus Referenced Standards Referenced Documents and Limitations Scope Purpose Marshall, J. C., and Vernier, P. T., “Electro-Physical Technique for Post-Fabrication Measurements of CMOS Process Layer Thicknesses,” Layer Process CMOS of Measurements Post-Fabrication for Technique “Electro-Physical T., P. Vernier, and C., J. Marshall, SEMI mustreflective. platformsstepmeasurements all height in involved be For opticalinterferometry, structures. test height step using films thin of heights step measuring for procedure a presents method test This of stepmeasurements height thinmeasurements the height determination Step enables of method test films. This ASTM , Vol 10(March pp.153–157. 2001):

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Standard their with associated issues safety all address to purport not do Guidelines Safety and Standards SEMI If in doubt as to whether or not the platforms are sufficiently reflective, approximately 8 nm of chromium followed chromium of nm 8 approximately reflective, sufficiently are platforms the not or whether to as doubt in If Standards — Standard Terminology Relating to Measurements Taken onThin, Films Taken to TerminologyRelating Reflecting Measurements —Standard 3 http://www.astm.org IEEE Electron Device Letters IEEE Electron , SPIE,14-15, Volpp.39–45. 2880(October 1996): Journal of Microelectromechanical Systems ofJournal Microelectromechanical Page , Vol. 28, No. 11 (2007): pp.960–963. , Vol.11(2007): 28,No. jn l jn 4 , Vol 10 (September 2001): pp.336–346. 2001): , Vol 10(September 1

are an aid in the design and design the in aid an are Journal of Microelectromechanical of Journal Document Document Number: Doc. Date:  SEMI 5/8/2018 DRAFT  2

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LETTER (YELLOW) BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and than 3 5.3.1.5 height for used calibrationheight step physical the th (at session data on the after taken measurements location calibration six the of same average the (at session data the before 5.3.1.4 5.3.1.3 5.3.1.2 5.3.1.1 5.3.1 5.3 6: NOTE not does it that such enough small is strain the assuming the material. deform irreversibly tension, uniaxial in loaded is material the when strain 5.2.19 data a asin 2-D trace. seen displacement 5.2.18 5.2.17 about layer) a of gradient E2444] strain the or strain residual the as, (such information 5.2.16 [ASTM E2444] 5.2.15 and of (orremovalor part) sacrificiallayers. bythestructural deposition in (insubstrate addition)and whole 5.2.14 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This for 5.3.2.2 5.3.2.1 5.3.2 session the data 5.3.1.10 z 5.3.1.9 height for locationonthe physicalthe step same used calibration. 5.3.1.8 data the after taken measurements calibration six the thsession (at of values maximum and minimum the between height difference step physical the on location same the data the taken minimummeasurements session (at maximumofbefore calibration the six between and values 5.3.1.7 instruments. 5.3.1.6 repeat Symbols  (shs) platNXt

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LETTER (YELLOW) BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and N 5.3.2.9 (or “ platform “ (or platform initial the with where structure, test height step 5.3.2.8 number structure number structure test where from and platform platform final the to platform initial the from is step and 5.3.2.7 examined. “ with starting (“ number 5.3.2.6 “ and etc.) 5.3.2.5 and of closestthe top to the chip), designed “ indicators compass the (using platform reference (“ number structure 5.3.2.4 “ indicators and platform, reference a from is it indicates where structure, test height step one on traces data multiple 5.3.2.3 “ “ traces data from obtained values deviation standard the all of smallest the as measured is it then compositions, reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This being measured to due is that 5.3.3.7 for measurement height platNX platform the of uncertainty the to due is that structures test height step two from obtained 5.3.3.6 is 5.3.3.5 a measurement of the uncertainty 5.3.3.4 5.3.3.3 of the uncertaintythephysical tovalue step height of due the 5.3.3.2 5.3.3.1 5.3.3 platform.the final platform), reference platform), reference the is it if used C b is the number associated with the test structure, structure, test the with associated number the is the uncertainty of a measurement measurement ofthe a uncertainty ,” and “ ,” and ,” etc.) asstartingwith etc.) lettered “ ,” M For Combined Standard Uncertainty Calculations Uncertainty For CombinedStandard ) on the same test chip, which is equal to the final platform height minus the initial platform height, where the where height, platform initial the minus height platform final the to equal is which chip, test same the on ) . u u u u u u u stepN stepN stepN platNXt platNX platNrDt platNrD repeat(samp) platNX linear drift cSH cert c X — the combined standard uncertainty standard —the combined c 1 is the capital letter (or “ (or letter capital the is ” along these platforms.” along these N — the component in the combined standard uncertainty calculation calculation uncertainty standard combined the in component the — — the combined standard uncertainty of a step measurement. height of —thea combined uncertainty standard ,” “ ,” — — — — ,” “ — the component in the combined standard uncertainty calculation for step height measurements height step for calculation uncertainty standard combined the in component the — the repeatability of measurements taken on on taken measurements of repeatability the XYt XY X r M A ” is used if it is the reference platform), and the step is from the initial platform to the platform), final thefromto stepplatform. is ” reference usedisthe initial is and ifplatform it the — the calibrated platform height measurement, where where measurement, height platform calibrated the — — the average of the calibrated step height measurements taken from multiple data traces on one on traces data multiple from taken measurements height step calibrated the of average the — 2 the component in the combined standard uncertainty calculation for step height measurements that is that measurements height step for calculation uncertainty standard combined the in component the . — a — — a calibrated step height measurement from one data trace on one step height test structure, where structure, test height step one on trace data one from measurement height step calibrated a — ” for the platform closest to to closest platform the for ” S Y the component in the combined standard uncertainty calculation for step height measurements that measurements height step for calculation uncertainty standard combined the in component the ,” “ ,” — a — h the — — the calibrated step height measurement taken from two different step height test structures ( structures test height step different two from taken measurement height step calibrated the — M ,” “ — the component in the combined standard uncertainty calculation for step height measurements height step for calculation uncertainty standard combined the in component the — . 1 t 3 n is the data trace (“ data is trace the ,” “ ,” E ”ec) etc.), ,” n

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LETTER (YELLOW) BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and The step height, height, step The value 6.2 platforms, pertinent the along traces platform(s),arerecorded. the reference including data 2-D the from deviations standard and averages Data 6. Figure in shown obtain to used A step. the in is involved structure(s) test the of top the along instrument traces data 2-D multiple comparable or 5) Figure in shown is which of schematic (a interferometer optical An values, uncertainty standard combined their and structures test height step two from or (recommended) structure test 6.1 to instruments.pertain all mayTherefore, modifications need be to made, as obtain requiredappropriate, to the data. 7: NOTE 6 measured is of the edge the to step. parallel width the where step, the of width the across height step the of uncertainty measurement the to due is 5.3.3.12 of the edge the to ste parallel of width the across uncertainty measurement the to due is that measurements 5.3.3.11 of the edge the to step. perpendicular measured is length the where step, the of length the across height step the of uncertainty measurement the to due is 5.3.3.10 step. of the edge the to of length the across uncertainty measurement the to due is that 5.3.3.9 standardheight to due is that 5.3.3.8 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This 6.4 measurement The chip.) test same the on are structures layers test design two same the the that of and comprised is structure test each in platform reference the that assumes (This structures. test that for height platform reference calculated height, step The structure. just the minus traces data the 2-D of the average the from is measurements measurement height platform platform a structure, test each For structure. test that on traces data 2-D the from taken measurements height platform reference the of average the as calculated is height platform reference 6.3 1 as determined givenAppendix is in measurement Summary ofMethod Summary Obtaining stepN Obtaining measurements height step the obtain to used be can method test This Obtaining stepN Obtaining s for u for u u

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LETTER (YELLOW) BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and found, (b) this value value this (b) found, are repeat of number is uncertainty standard combined the for and height 13.5 obtained. ¶ calculatedin were 11.2.1.Therefore,48stepmeasurements height as step the along spaced evenly somewhat positions different from taken measurements three of average the as defined reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This value height step the in variations discernable no are there neighboring quads. between implies This limits. the 95% at the given for are values quad comparable each for value this for limits grouped 95% the are and heightmeasurements step the for values comparable results reveal 3. 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LETTER (YELLOW) BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and calibration of the interferometer or comparable instrument is considered mandatory comparableis stepmeasurements. instrument height for of or the interferometer calibration each for different is bias resulting z 13.6 dealingtilt. widthwith may bewhen necessary and variations length the of determination comprehensive more a however, data; the smoothing of effect the have can instruments these non-contact within most in points incorporated capability averaging data An obtained. of deviations standard the number affects grossly the regions) (including regions analysis the of selection precise the Therefore, jagged. 13.5.1.3 value this in variations than 3) Table and 9 3). shown quads8and in (as Table Figure between Figure in shown (as structures test rotated between value height step less slightly are TS3 and TS1 averagefor the in variations more are also There comparable. beshould they when TS4 andTS2 for 95% limits the limits than 95% the however TS4; and TS2 do as limits 95% comparable have of TS4) bottom the at given are structure test each and TS2 to respect with ±90° rotated for are (which TS3 and TS1 that reveal results value These 3. Table in also and 9 Figure this for limits 95% the and value height step average the 8, Figure in As 3. quad from results the then 2, quad from results the by followed first, plotted 1 quad from results the with quad to according grouped are number structure test each for results The (TS4). 4 structure test then (TS3), 3 structure test from results the by followed (TS2), 2 structure test from results the by followed first, plotted (TS1) 13.5.1.2 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This -direction. If the calibration is not done, a bias to the measurements is expected. The direction and degree of the of degree and direction The expected. is measurements the to bias a done, not is calibration the If -direction. Accuracy The platform surfaces involved in the step were not ideal surfaces. Oftentimes they were tilted and the data the and tilted were they Oftentimes surfaces. ideal not were step the in involved surfaces platform The 1 structure test from results the with number structure test by results repeatability the groups 9 Figure 95% for limits u u  95% for limits | | n Data Table 2 stepN cSHave c repeat(samp)p SH ave — As specified in § 9, the interferometer or comparable instrument is calibrated in the out-of-plane the in calibrated is instrument comparable or interferometer the 9, § in specified As — ABave

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American Society for Testing and Materials,Drive, 100 Barr forHarbor West Society Pennsylvania and Conshohocken, Testing USA. Telephone: American 19428-2959, Vernier, J. L., C., D. P. in D. Standard Herman, Marshall, Gaitan, DeVoe, T., M.,Measurements ICCMOS “Young’s and L. Modulus Marshall, J. C., and Vernier, P. T., “Electro-Physical Technique for Post-Fabrication Measurements of CMOS Process Layer Thicknesses,” Layer Process CMOS of Measurements Post-Fabrication for Technique “Electro-Physical T., P. Vernier, and C., J. Marshall, Referenced and Standards Documents Limitations Scope Purpose For optical interferometry, all platforms involved in step height measurements mustreflective. platformsstepmeasurements all height in involved be For opticalinterferometry, structures. test height step using films thin of heights step measuring for procedure a presents method test This height Step films. thin of measurements height step of determination the enables method test This ASTM SEMI , Vol 10(March pp.153–157. 2001):

10 ., Vol.5(2007): 112,No. pp.223–256. : SEMI Standards and Safety Guidelines do not purport to address all safety issues associated with their with associated issues safety all address to purport not do Guidelines Safety and Standards SEMI If in doubt as to whether or not the platforms are sufficiently reflective, approximately 8 nm of chromium followed chromium of nm 8 approximately reflective, sufficiently are platforms the not or whether to as doubt in If

Standard Standards 11 http://www.astm.org IEEE Electron Device Letters IEEE Electron , SPIE,14-15, Volpp.39–45. 2880(October 1996): Journal of Microelectromechanical Systems ofJournal Microelectromechanical Page , Vol. 28, No. 11 (2007): pp.960–963. , Vol.11(2007): 28,No. jn l jn 27 , Vol 10 (September 2001): pp.336–346. 2001): , Vol 10(September Journal of Microelectromechanical of Journal 9

are an aid inare an the aid design Document Document Number: Doc. Date:  SEMI 5/8/2018 DRAFT 

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test structure test micromachining surface substrate layerstructural structure step test height height step thickness It recommendedis that two of bethe platforms interest designed adjacent each to other. For instruments,the datamany 2-D trace extracted is from 3-D set. a data the Some terms definitionsof following and are to found ASTM similar those in E2444. Unless otherwise indicated, all documents cited shall be theversions. latest published otherwise documents all cited be shall Unless indicated, The The —field of view — — microelectromechanical systems —microelectromechanical z -axis of the interferometer is used to measure the height of the sample. The interferometer’s interferometer’s The sample. the of height the measure to used is interferometer the of -axis — the height in the —thein height that glass) or silicon crystal single (often material starting thick, the process, fabrication a in — c omplementary omplementary — the distance in the the in distance the — he-iesoa ru fpit ihatpgahcltopographical a with points of group three-dimensional a — — a non-contact optical instrument used to obtain topographical data (such as 3-D data sets data 3-D as (such data topographical obtain to used instrument optical non-contact a — — a fabricated component (such as, a fixed-fixed beam or cantilever) that is used to extract to used is that cantilever) or beam fixed-fixed a as, (such component fabricated a — — a two-dimensional group is that the of —a to points parallel — the distance in the the in distance — the — to allow freestanding microstructures, a single thickness of material that is intentionally is that material of thickness single a microstructures, freestanding allow to — — a single thickness of material that is that thedevice. final thicknessin single of MEMS present material —a Acronyms — the flat, processed surface that is used to level and zero the measurements in the the in measurements the zero and level to used is that surface processed flat, the —

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LETTER (YELLOW) BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and measurements that is due to the repeatability of measurements taken on step height test structures processed structures test height step on taken measurements of repeatability the to due is that measurements 18.3.3.6 for measurement height platNX platform the of uncertainty the to due is that structures test height step two from obtained 18.3.3.5 scan. linearityof the duedata theis deviationfrom to 18.3.3.4 session. drift during the data due theof is amount to 18.3.3.3 18.3.3.2 the physical valueusedcalibration. stepstandard height for of of due theis uncertainty to 18.3.3.1 18.3.3 final to platform. platform the platform), reference the is “ where 18.3.2.9 (or “ platform “ (or platform initial the with where structure, test height step 18.3.2.8 number structure number structure test where from and platform platform final the to platform initial the from is step and 18.3.2.7 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this their distribute and/or reproduce and to granted respectively, is Permission standard. adopted or official an as construed be to is page chip, this on material No program. Standards International SEMI the of document draft a is same This the on structures test height step two from or (recommended) structure test 19.1 to instruments.pertain all mayTherefore, modifications need be to made, as obtain requiredappropriate, to the data. 7: NOTE is width the 19 where step, the of width the across height step the of step. parallel of the edge the to measured uncertainty measurement the to due is that 18.3.3.11 of the edge the to ste parallel of width the across uncertainty measurement the to due is that measurements 18.3.3.10 of the edge the to step. perpendicular measured is length the where step, the of length the across height step the of uncertainty measurement the to due is 18.3.3.9 of the edge the to step. perpendicular of length the across uncertainty measurement the to due is that measurements 18.3.3.8 onthe physical of step standard. taken height duemeasurements the is repeatability that to 18.3.3.7 one to being measured.similarly the r ” is used if it is the reference platform), platform), reference the is it if used is ” Summary of Method M This test method can be used to obtain the step height measurements measurements height step the obtain to used be can method test This ) on the same test chip, which is equal to the final platform height minus the initial platform height, where the where height, platform initial the minus height platform final the to equal is which chip, test same the on ) N . For Combined Standard Uncertainty Calculations Uncertainty For CombinedStandard

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By inserting the inputs into the the appropriate inserting web into on correctthe NIST locations via page (accessible inputs By The physical step height standards are calibrated at NIST as specified in Vorburger, T.V., Song, J.F., Renegar, T.B., and Zheng, A., “NIST A., Zheng, and T.B., Renegar, J.F., Song, T.V., Vorburger, in specified as NIST at calibrated are standards height step physical The Calibration Calibrate the interferometer or comparable instrument in the out-of-plane out-of-plane the in instrument comparable or interferometer the Calibrate Roughness and Step HeightRoughness and Step Obtain the additional parameters that will be used in Appendix 1 in the combined standard uncertainty standard combined the in 1 Appendix in used be will that parameters additional the Obtain the Determine step physical the of height the of sets) data 3-D six (using measurements six record session, data the After step physical the of height the of sets) data 3-D six (using measurements six record session, data the Before Determine Determine Determine the Determine Determine

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If the step height test structure is not surrounded by a reference platform on all four sides, the two extreme areas of areas extreme two the sides, four all on platform reference a by surrounded not is structure test height step the If The following steps are for measurements taken with an optical interferometer or comparable instrument and may and instrument comparable or interferometer optical an with taken measurements for are steps following The 2 ) obtain a 3-D data set, if applicable, ( applicable, if set, data 3-D a obtain ) 6 u ) repeat for at least two other 2-Dtraces. at least repeatfor twoother data )  cSH cert ) as detailed in ¶ 10.2 or from two step height test structures on the same chip by performing the performing by chip same the on structures test height step two from or 10.2 ¶ in detailed as ) y and -direction, if applicable. An the iforientation applicable. in -direction, if if z perc z z repeat repeat for use Appendix for in 1.

Applicable ( ( shs shs ) )     z z repeat repeat ( ( shs shs ) )   3 , then , then ) extract or obtain a leveled 2-D data trace, ( trace, data 2-D leveled a obtain or extract ) Page — For a step height test structure, obtain data from at least at from data obtain structure, test height step a For — jn l jn z z 36 5 repeat repeat ) obtain the raw, uncalibrated data from the pertinent the from data uncalibrated raw, the obtain ) x -direction (i.e., such that any 2-D data traces in the in such data anythe that (i.e., 2-D traces -direction ( ( shs shs y ) ) -direction is-direction also acceptable.   z z repeat repeat ( ( shs shs 1 ) )   ) select two transitional edges for edges transitional two select ) and and and z z     x Document Document Number: o (or - z z same same Doc. 4 ) obtain the raw, the obtain )   y Date: -) axis of the of axis -)  SEMI 1 ” and “ and ” 5/8/2018 DRAFT  (7) (6) 2 x x ” - -

LETTER (YELLOW) BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and and Note 21 for a 3-D data set and as specified in ¶ 10.5.1 for a 2-D data trace. Therefore, if a 3-D data set was obtained, the obtained, was set data 3-D a if Therefore, trace. data 2-D a for 10.5.1 ¶ in specified as and set data 3-D a for 21 Note and 26: NOTE deviation for nomenclature height recommended average uncalibrated resulting the Call cursors. 23.6.3 25: NOTE 10 least 23.6.2 moment. forthese the dataof just with thestructure,associated test one platform onthe atof the twoextremes concentrate awith reference 23.6.1 calculations.1 step a obtain to used is structure test for values small however, 10.7, § to skip measurement, height one If measurement. height step a obtain to used are structures test different two if only 24: NOTE 23.6 dataanother trace,if possible. 23: NOTE as shownFigure 6. in such trace data a obtain to platform) reference the of top the to respect (with it zero and level and 3) Figure in shown as “ as trace trace (such data a 2-D obtain taken, not was set data 3-D aIf 6). shown Figure in trace data obtainthe to 23.5.1 23.5 22: NOTE fit the of instrument,the not in FOV the reference adjacentplatform to step used the is to and the level zero 3-D set. data 21: NOTE reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This data2-D trace. 23.7.3 in 1. use Appendix height average uncalibrated for nomenclature resulting the Call cursors. 23.7.2 27: NOTE theat middlethisleast in 10 step) data of platform of of representative edge the 50 the of length the one-third approximately 23.7.1 23.7 available. and present 23.6.4 test different structures used obtain are to a height step measurement. 0.005 within ¶ in obtained height average uncalibrated the If procedure. the perform to platforms similar with structure test which level with to the data repeat3-D set, (d) from ¶ ¶ from repeat (c) trace, data ¶ from repeat (b) selected), be should data less (perhaps platform reference 0.005 0.000 is data leveled the of height average Obtain the Raw, Uncalibrated Data from the Reference Platform, if Platform, Needed Uncalibrated theDatafrom Raw, Reference Obtain orObtain Data 2-D Extract aLeveled Obtain the Raw, Uncalibrated the Datafromthe Raw, PertinentPlatforms Obtain  m of 0.000 0.000 of m Record the uncalibrated average height and the uncalibrated standard deviation of the data between the between data the of deviation standard uncalibrated the and height average uncalibrated the Record 17 least at encompass cursors, the using interest, of platform a on data 2-D the Examining if structure, test the of side other the on platform reference the on data 2-D the for 10.6.2–10.6.3 ¶¶ Repeat the between data the of deviation standard uncalibrated the and height average uncalibrated the Record 70 approximately encompass cursors, the Using “ trace Examining “ trace as (such trace data 2-D a extract 10.4.1.8, ¶ in set data 3-D leveled the From Repeat ¶¶ 10.7.1–10.7.2 for any other platforms of interest (not including the reference platform) along this along platform) reference the including (not interest of platforms other any for 10.7.1–10.7.2 ¶¶ Repeat 

m from each transitional edge. transitional fromm each  platNrDt Avoid anomaliesany in data. the Avoid anomaliesany in data. the The The data was leveled and zeroed with respect to the top of the reference platform as specified in ¶ in specified as platform reference the of top the to respect with zeroed and leveled was data The calculations in used are platform reference the on 10.6.3 ¶ in below obtained values height average uncalibrated The If a higher magnification lens is used for the measurements such that the reference platforms at the extreme ends do ends extreme the at platforms reference the that such measurements the for used is lens magnification higher a If In the 2-D data trace, if there are any anomalies along the platforms where measurements will be taken, obtain taken, be will measurements where platforms the along anomalies any are there if trace, data 2-D the In  m of 0.000 0.000 of m z values the of leveled points thedata along top the of reference are platform expected lie ±40to between nm. for use in Appendix forin 1. use  NXt m. If this is not the case, (a) repeat from ¶ from repeat (a) case, the not is this If m. in in  platNXt

b 10.4.1.8, if applicable, being more vigilant in the selection of the data within the reference platform reference the within data the of selection the in vigilant more being applicable, if 10.4.1.8, ,frwaee esn rce ihtekoldeta ihvlefrfor value high a that knowledge the with proceed reason, whatever for m, ,” locate the 2-D data associated with the reference platform(s). If there is data associated data is there If platform(s). reference the with associated data 2-D the locate ,” are given in ¶ 5.3.2.6. Call the resulting uncalibrated standard deviation deviation standard uncalibrated resulting the Call 5.3.2.6. ¶ in given are NrDt in in  m, such that, the uncalibrated average height obtained in ¶ in obtained height average uncalibrated the that, such m, platNrDt

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platNrDt m of representative data in the middle of this platform at platform this of middle the in data representative of m 10.6.2 being more vigilant in the selection of the data along the along data the of selection the in vigilant more being 10.6.2 platNrDt jn l jn 37 platNXt as obtained in ¶ 10.6.3 can still be recorded for Appendix for recorded be still can 10.6.3 ¶ in obtained as eg, (e.g.,

10.5.1 being more vigilant in the selection of the 2-D the of selection the in vigilant more being 10.5.1 hr eal ocrig te recommended the concerning details where , plat2rWb  m from each transitional edge. transitional fromm each ), where details concerning the concerning details where ), b ,” as shown in Figure 3, Figure in shown as ,”

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Taylor, B. N., and Kuyatt, C. E., “Guidelines for Evaluating and Expressing the Uncertainty of NIST Measurement Results,” ofResults,” Expressing B.Evaluating Uncertainty and Measurement N., C. and the NIST “Guidelinesfor Taylor, Kuyatt, E., Calculations plat2Bc AB AB Step Height MeasurementsStepStructure Height FromTest One Step Height (recommended structure test height step one from obtained data from calculated are measurements height Step recommended), (not measurement height step a for required are chip the on structures test height step two If at for 2-D Two DataTracesRepeat Least Other Step Height Measurements fromTwo Chip StepStructures Height Test ontheStep Same Height in the sample in equations follow: that a is negative if is step whennumber it a “down” going the platform the platform.from initial to final ) where details concerning the recommended nomenclature for recommended nomenclaturefor where detailsconcerning the ) Calculate the calibrated reference platform height from each step height test structure, test height step each from height platform reference calibrated the Calculate measurements platform reference the for inclusive, 10.6–10.9, §§ from data uncalibrated raw, the Given Calculate as, (such inclusive 10.7–10.8, §§ from measurements height platform uncalibrated raw, the Given from Repeat , , , National Institute of Standards and Technology (September 1994). StandardsTechnology (September of Institute and , National plat1Ac , plat1rWa plat2rWc The calculations that follow assume that the reference platforms from the two different step height testare height structures step different two the from theplatforms that reference assume follow that calculations The Step1 from platform “ platform from For the calculations in § 11.3 to apply, the reference platforms in the two step height test structures shall be shall structures test height step two the in platforms reference the apply, to 11.3 § in calculations the For 3 ) calculate the step height as given in 11.3.4. calculatethe stepas height ¶ given ) , , AB u 1 plat1Ba is from test structure “ structure test from is cSH calculations following the step, a in involved ”) , , ¶ 10.5 for at least trace 10.5for“ ¶ at least , plat1rWb using the method presented in Appendix presented method in using 1. the plat2rEa plat1Aa , , plat1Bb B , , stepN ” on test structure “ structure test on ” , step stepN plat1rWc step , step plat2rEb step plat1Ab u , and and , cSH    XY  ) as given in § 11.2 or from two step height test structures on the same chip as chip same the on structures test height step two from or 11.2 § in given as )    XYt   b c 1 plat1Bc , , , and , and a ihwith ”  n and ,   stepN  plat1rEa  step ( ( ( a ( plat plat ” and trace “ ” platNYt plat1Ac plat  plat1A ) for the pertinent platforms (such as platform “ platform as (such platforms pertinent the for ) ltrcplat2rEc XYa ABa   2 , ,  Bb  Bc ”) the following three steps are used to calculate a step height step a calculate to used are steps three following the ”) plat1rEb  Ba Page stepN as the initial platform and and platform initial the as from platform “ from platform step     3 from test structure “ structure test from c platNXt plat 3 plat  jn l jn .” 2 38 plat XYb ABb ) calculate any pertinent platform heights as given in ¶ in given as heights platform pertinent any calculate ) , and and ,     14  Ab Ac stepN step Aa 6 6 are used to obtain obtain to used are plat1rEc plat1rEc ) ( ) ) cal cal cal 1 )  N A ) calculate the reference platform height from height platform reference the calculate ) cal ABc XY XYc ” “ structure ontest z z z in in z stepN . from test structure “ structure test from plat1B 2 ”) and for the pertinent platform pertinent the for and ”) XY are given in 5.3.2.8: ¶ aregiven as the final platform. Therefore, platform. final the as (13) stepN 1 ” and ” XY (12)

(11) Document Document Number: (and for the example the for (and 6 A such as as such Doc. ” and platform “ platform and ” 1 plat2Ba ” and ” Date: NIST Technical NIST Technical (8) (10)  (9) SEMI plat2rWa plat1r , plat2Bb plat1Aa 5/8/2018 DRAFT  and B ” , , ,

LETTER (YELLOW) BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and which forwhich theequations: following using structures, 24.3.3 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This 25.1.2 interval the in lie 68%. of approximately confidence to believed is height step the uncertainty standard combined approximate with A1-1) § in specified (as distributed Gaussianly or uniformly 25.1.1.1 25.1.1 25.1 25 24.3.5 forwhich stepN as, 24.3.4 plat1A Report Report the results as follows: Report the X M If one step height test structure is used for the measurement: usedthe onemeasurement: is structure for If steptest height Calculate (such measurements height platform the obtain to used are chip same the on structures test height step two If ( heights platform calibrated pertinent the Calculate If two step height test structures areusedthe measurement: structures for twosteptest height If Y Since it can be assumed that the estimated values of the uncertainty components are approximately are components uncertainty the of values estimated the that assumed be can it Since , where details concerning the recommended nomenclaturefor , where detailsconcerning step1 plat1A n and A 2 plat2B u and B becomes cSH using the method presented in Appendix the presented method in using 1. plat platMY plat2B platNX plat in ¶ 11.3.3), the following calculation following the 11.3.3), ¶ in plat  plat  plat plat become:       rW   rE ( ( rW ( ( rE Error: Reference source not found Referencesourcenot Error: plat stepN platMYa plat platNXa plat step     ( ( plat   plat  ( plat  ( 6 X plat  plat r a a M         r   Y   rWa ( rEa  plat  plat rEa platMYb rWa platNXb  plat ( plat platMY stepN plat      Page  3 3  3 3 plat  plat rW plat b b  plat XY B rW   jn l jn ±   39  2     plat plat   platNXc platMYc rEb platNX rEb 3 rWb 2 plat 3  u 3 plat rWb platNX cSH 3 Error: notsource Error: Reference found 6  is used to obtain the step height measurement height step the obtain to used is plat  epninfco factor (expansion     

 c A n and c plat rE  plat ) plat ) cal . plat rE ) cal N ) cal ) cal X  M  . ) z platMY z   rEc z rEc Y z  in in  rWc rWc   plat plat stepN ) ) platNr platMr cal cal ) ) from the two step height test height step two the from ) ) cal cal   z z r X k r M z z =1) representing a level of level a representing =1)

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Marshall, J., Allen, R. A., McGray, C. D., and Geist, J., “MEMS Young’s Modulus and Step Height Measurements with R. RoundResults,” J.,McGray,D., Allen, A., J., ModulusMeasurements Geist, “MEMSStep Robin Young’s Height Marshall, C. and Precisionand Bias The Reproducibility Data Reproducibility The Data Repeatability The Round Robin The Precision ABave N right structure) test has 180 a OTE Test structure (theTest 2 upper test in right structure each has 270 quad) a Since it can be assumed that the estimated values of the uncertainty components are approximately are components uncertainty the of values estimated the that assumed be can it Since , Vol.5,pp.303-342, 115,No. 2010. | and multiplying by 100. For these approximate 95 % limits, it is assumed that the other uncertainty other the that assumed is it limits, % 95 approximate these For 100. by multiplying and | : upper hand: The left step test in height structure each is quad called structure and has test 1 it a 0 — The step height repeatability and reproducibility data are presented in Table 2. In this table, table, this In 2. Table in presented are data reproducibility and repeatability height step The — — SEMI conducted a MEMS Young’s Modulus and Step Height Round Robin ExperimentRobinRound Height StepandModulus Young’sMEMS a conducted SEMI —  repeat(samp)p — At one laboratory using an optical interferometer, four step height measurements height step four interferometer, optical an using laboratory one At — — Each round robin participant was supplied with a test chip and asked to obtain the obtain to askedand chiptest awith supplied was robin participant round — Each  test orientation. And structure (the left structure)4 bottom test has 90 a is calculated (for use in Appendix 1) as the repeatability standard deviation of the deviation of standard repeatability as the 1) Appendixin use (for calculated is Three Quads of StepHeightTestThree Structures stepN Figure 16 Figure stepN ABave Page X | is the absolute value of the average of the step height step the of average the of value absolute the is | M jn l jn Y 40 ± u cSH epninfco factor (expansion  structureorientation. Test 3 bottom (the stepN AB | that the repeatability limits are limits repeatability the that | k =1) representing a level of level a representing =1) Document Document Number: Doc.   orientation. orientation. Date:  stepN SEMI 5/8/2018 DRAFT AB  | are | u cSH 15 n ,

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Table in also and 9 Figure this for limits 95% the and value height step average the 8, Figure in As 3. quad from results the then 2, quad from results the by followed first, plotted 1 quad from results the with quad to according grouped are number structure test each for results The (TS4). 4 structure test then (TS3), 3 structure test from results the by followed (TS2), 2 structure test from results the by followed first, plotted (TS1) 26.4.1.2 value height step the in variations discernable no are there neighboring quads. between implies This limits. the 95% at the given for are values quad each comparable for value this for limits grouped 95% the are and heightmeasurements step the for values comparable results reveal 3. These Table also in and Figure 8 of and bottom quad value each height step within average results The etc. The 2, 3. structure quad from results the then 2, results towith from 1plottedfollowed structure number test structure test the byaccording the results first, from quad from results the by followed 26.4.1.1 3 orplus minus | between comfortably fall results reproducibility the of all observation, an As data. reproducibility and [assuming value this 3 average the with along 9 and 8 Figures of top the at specified is data repeatability the for step height the average plotted value is seven bytheTheof resultsdata first,fromabsolute followed participants. the standard combined average the 26.4.1 of calculations different two Next, percent). notes) detailedareprovided. the table in (as uncertainty a (as measurements height step reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This instrumentstepmeasurements. height for considered mandatory comparable is or interferometer the of calibration such, As measurements. the for used objective each for different is bias resulting z 26.5 dealingtilt. widthwith may be when necessary and variations -direction. If the calibration is not done, a bias to the measurements is expected. The direction and degree of the of degree and direction The expected. is measurements the to bias a done, not is calibration the If -direction. Accuracy The step height round robin results are plotted in Figures 8 and 9. In each of these figures, the repeatability the figures, these of each In 9. and 8 Figures in plotted are results robin round height step The The platform surfaces involved in the step were not ideal surfaces. Oftentimes they were tilted and the data the and tilted were they Oftentimes surfaces. ideal not were step the in involved surfaces platform The 1 structure test from results the with number structure test by results repeatability the groups 9 Figure first, plotted 1 quad from results the with number quad by results repeatability the groups 8 Figure — As specified in § 9, the interferometer or comparable instrument is calibrated in the out-of-plane the in calibrated is instrument comparable or interferometer the 9, § in specified As — u cSHave u as obtained from the repeatability results. the asrepeatability obtained from repeat(samp) equals zero]. These quantities are plotted in each figure with both the repeatability the both with figure each in plotted are quantities These zero]. equals Page jn l jn 41 u cSH Document Document Number: uncertainty bars for bars uncertainty Doc. Date:  SEMI stepN 5/8/2018 DRAFT  ABave |

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stepN |stepNAB (mm)| 0.3 0.4 0.5 0.6 AB ABaveQ1 | ABQ1 0 u u TS1 cSH cSH |=0.479 quad 1 (Q1) |=±8.4% determined using Equation using A1-1. determined determined using Equation with using A1-1 determined TS2 m m TS3 (with repeatability data grouped by quad) by grouped data repeatability (with For repeatability: | repeatability: For Figure 17 Figure Repeatability Results TS4 | Page 20 stepN a (5.0 (5.0 %) (3.0 %) ±7.9 % ±7.9 3.95% 0.024 0.014 0.477 with 3 with 48 jn l jn 42 repeatability | 95% limits for | stepN Q2 u stepN AB cSHave 6 analysis opposedfor as to deviation standard values. ABaveQ2 u stepN repeat(samp) | vs. Plot# vs. | ABQ2 = 0.043 0.043 = |=0.473 40 |=±7.2% Bave AB set equal set to zero. Reproducibility ResultsReproducibility m m | = 0.477 0.477 = | m Plot # m m Q3 (3.0 (3.0 %) ±6.2 ±6.2 % 0.014 0.481 14   m Document Document Number: m m 60 Doc. #1 Date: | 95% limits for | stepN #1 #2  stepN SEMI reproducibility participant #3 ABaveQ3 #2 5/8/2018 DRAFT ABQ3  chip #3 #4 |=0.478 |=±8.3% 80 #5 #4 #6 m m #5 #7 LETTER (YELLOW) BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Table 4 u u  limits | 95% for | n stepN cSHave cSHave repeat(samp)p ABave | 95% limits for | (TS) structuretest datafrom same step1 c b (in (in

Repeatability Data Repeatability |stepNAB ( m)|

step1 m | (in   0.3 0.4 0.5 0.6 (in ABave m) m) stepN   AB m) |=0.486 m) 0 |= ±6.4% c b a With the values for values the for With With the values for values the for With AB Taken on test chips fabricated in a bulk-micromachining CMOS process. bulk-micromachining CMOS in a fabricated onTaken testchips | m TS1 Step HeightRound Robin Results withthe Repeatability Results (with repeatability data grouped by test structure number) number) structure test by grouped data repeatability (with m a Grouped by Quad orTestStructure Groupedby Quad (5.2%) (3.1%) ±8.4 ±8.4 % 4.2% 0.479 0.025 0.015 | 95% limits for | step2 Grouped AccordingStructureNumber toGrouped Test Q1 For repeatability: | repeatability: For 16 Q1 u u 20 cSH cSH step2 determined using Equation using A1-1. determined determined using Equation with using A1-1 determined ABave TS2 | Q2 stepN AB repeatability |=0.469 with 3 with |= ±8.7% (4.8%) (3.2%) ±7.2 ±7.2 % Q3 3.6% 0.023 0.015 0.473 Q2 16 Figure 18 Figure m u m AB cSHave Page TS3 40 stepN | vs. Plot# vs. | (5.0 (5.0 %) (2.8 %) ±8.3 % ±8.3 4.2 4.2 % 0.024 0.013 0.478 jn l jn Q3 = 0.043 0.043 = 16 43 | 95% limits for | step3 ABave Plot # step3 ABave | = 0.477 0.477 |= m u (4.3%) (2.8%) ±6.4 ±6.4 % TS4 m 3.2% 0.021 0.014 0.486 repeat(samp) AB TS1 |=0.474 12 |= ±7.0% 60 set equal set to zero. m m m m #1 (5.4 (5.4 %) (3.1 %) ±8.7 % ±8.7 4.4 4.4 % 0.025 0.015 0.469 TS2 #1 12 #2 reproducibility | 95% limits for | step4 #3 participant #2 chip step4 #3 #4 ABave (4.2%) (2.4%) Document Document Number: ±7.0 ±7.0 % 3.5% 0.020 0.011 0.474 80 TS3 12 #5 AB Doc. |=0.478 #4 |= ±8.5% #6 Date:  #7 #5 SEMI m m (5.6%) (3.7%) ±8.5 % ±8.5 4.3% 0.027 0.018 0.478 TS4 5/8/2018 12 DRAFT 

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( z z 3  shs 3 2 ) jn l jn 6 are found below in ¶¶ A1-1.2–A1-1.8, respectively, as respectively, A1-1.2–A1-1.8, ¶¶ in below found are 2 44 stepN Error: Reference source not found not source Reference Error:  ) N  stepN  XY XY  are calculated using theequations: following arecalculatedusing  u  in in drift  platNYave  platNX . XY platNYc stepN platNXc 2 XY  . u , . XY      linear     platNY are given in 5.3.2.8. ¶ aregiven cal  cal roughNY 2 z z

 . n and , u cal repeat 6 6 6 6 z 6 platNr  ( 2 samp 6 ) Document Document Number: 2  l ae identical have all use the following the use

(A1-5) platNXt Doc. (A1-1) (A1-6)  Date: (A1-8) platNXt n and (A1-7)  SEMI , , 5/8/2018 step1   (A1-4) (A1-3) (A1-2) DRAFT platNYt platNYt  ABa , , ,

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( Wstep shs ( samp     ) stepN       stepN  stepN ) stepN 2 z   platNYave platNXave z cert  drift  stepN STDEV perc cert  3 3 Equation XYb z cal cert 2 repeat repeat XY XY XY , stepN stepN max max max stepN XY z Document Document Number:   3 2 ( max 2 (  samp z  stepN ( 6  shs  Doc.  2 6 stepN roughNY 3 roughNX 3 stepN stepN )  stepN ) XY XY XYc 3 p stepN stepN Date: stepN )  XY XYa cal cal SEMI XY XY (A1-9) XY , min min z min XY z XY 5/8/2018   XY 2 min DRAFT 2  

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