Draft Meeting Report

Draft Meeting Report of the 10th NEASCF WG7 meeting 23 June 2011, Paradise Hotel Busan, Korea

1. Opening Dr. Ming Su Lee (KPCA), WG 7 Convener, opened the WG at 13:30 on Wednesday 23 June 2011 and welcomed participants to Busan, Korea.

2. Approval of the Agenda The draft agenda was presented by the Convener and approved with no changes.

3. Review Meeting Summary from Previous meeting(s) (If applicable)

4. Meeting Results 4.1. Test Methods of Printed Circuit Board for High-brightness LEDs (C): 4.1.1. Standard content In main content, it sets thermal conductivity indicators and grades thermal conductivities in addition to generic requirements for conventional PCB so as to adapt to LED application of different heats. It also provides PCB light reflection and heat resistance and other special requirements, and the corresponding test methods for these performance indicators. 4.1.2. Cooperation among 3 countries Cooperate among 3 countries and exchange relevant information; prepare standard text respectively and the content should be consistent so as to complete the uniform standard. 4.1.3. Expected results Complete joint standard of China, Japan and South Korea Recommend it as IEC standard if possible Provide quality standard of PCB for new LED lighting products

4.2. The Safety Specification of Printed Circuit Board (C): 4.2.1. Standard content In main content, it provides safety indicators and identification test methods for PCB, such as combustion, electrical, mechanical strength, life, etc., which can be used for safety authentication. 4.2.2. Postpone to the next meeting 3 countries agreed to document before discussion. CPCA will document the spec. 4.2.3. Expected results Complete the documentation by the next meeting.

4.3. Measurement of adhesion between a dielectric and inkjet printed circuits (K): 4.3.1. Project background In Printed Electronics field, Circuits are produced by printing methods with minimum materials, minimize CO2 emission during production process. Flexible and R2R applicable are available. There are various printing technologies for circuit formation using conductive ink. Screen printing is most widely used. However, Inkjet printing is more suitable for fine circuits. There are many advantages of inkjet printed circuit technology for PCB fabrication. 4.3.2. Cooperation among 3 countries A strong adhesion between a dielectric layer and circuits is required for PCB application. Copper peel test (IEC 61198-2M06) is used for measuring the adhesion of etched circuits. Due to the very small thickness of pattern (<1um), the same procedure can not be applicable to inkjet printed circuits. Therefore, tape test has been used to test the adhesion of inkjet printed circuit. However, tape test is qualitative, which is not suitable for accurate measurement. New test method uses copper with adhesive to make thick circuit, which can be tested by peel tester. 4.3.3. Results KPCA to document for the reference of 3 countries by the next meeting.

4.4. General electrical test guide for device embedded substrate with active devices passive components (K): 4.4.1. Project basis and standard content This international standard specifies an electrical test method for device embedded substrate. This material describes net structure, testable net and electrical test method for device embedded substrate. This proposal is to provide the detailed descriptions of an electrical test method for device embedded substrate. 4.4.2. Cooperation among 3 countries Cooperate among 3 countries and exchange relevant information; prepare standard text respectively and the content should be consistent so as to complete the uniform standard. 4.4.3. Result Complete joint standard of China, Japan and South Korea Recommend it as IEC standard if possible Provide quality standard of General electrical test guide for device embedded substrate with active devices passive components.

4.5. Building a CJK’s cooperation system for PWB standards (J): 4.5.1. Project basis It’s the first time for 3 counties to meet only for PWB standard though Korea, Japan and China are getting PWB centered area. It’s the grand start for CJK to cooperate for Asia’s PWB Industry Development. Taking this Busan NEASCF, KPCA, JPCA and CPCA renew a concrete organization for PWB related standards establishment. 4.5.2. Contents The three trade associations of CPCA, JPCA and KPCA are to develop the global defacto standards under the framework of NEASCF, and to lead the development of international standardization. China takes over on-stop-spot investigation of the standard as the large volume production country. Japan can be in charge of cultivation role as like R&D and Korea investigate application with the vertical business condition. 4.5.3. Conclusion The three associations of CPCA, JPCA and KPCA(CJK) are setting the defacto standards and the international standards, and lead the world electronic circuits industries.

5. Next Meeting Schedule Next meeting is expected to be held on China and will be hosted by CSA.

Annex 1. Participant List No Country Name (First / Last) Organization

1 China Zhibin/MA China Circuit Technology Corporation

2 China Longji/WANG China Printed Circuit Association

3 China Yue/CHEN China Printed Circuit Association

4 China Cheng/YANG Zhuhai Founder PCB Development Limited

5 China Xinhong/SU Zhuhai Founder PCB Development Limited

6 China Jongung/KIM China Overseas Investment Office

7 China Angela/CHEN China Printed Circuit Association

8 China Miao/HAIYAN China Printed Circuit Association

9 Japan Noritaka/NAGASHIM Japan Electronic Packaging and Circuits Association A

10 Japan Masato/SHISHIDO Japan Electronic Packaging and Circuits Association

11 Japan Masamitsu/AOKI Japan Electronic Packaging and Circuits Association

12 Japan Kunio/TAKAHARA Japan Electronic Packaging and Circuits Association 13 Korea Minsu/LEE Doosan Electro-Materials

14 Korea Hyunho/KIM Samsung Electro-Mechanics

15 Korea Whanhuck/PARK Korea Printed Circuit Association(KPCA)

16 Korea Byeongnam/LIM Korea Printed Circuit Association(KPCA)

17 Korea Kyonghee/LEE Korea Printed Circuit Association(KPCA)

18 Korea Minhuck/KIM Korea Printed Circuit Association(KPCA)

Annex 2. Document List

No Document Name From

001 Agenda KPCA

002 Presentation Material 1 CPCA

Printed Circuit Board for High-brightness LEDs

003 Presentation Material 2 CPCA

The Safety Specification of Printed Circuit Boards

004 Presentation Material 3 KPCA

Regional Cooperation on Printed Wiring Board Standardization

005 Presentation Material 4 JPCA

CJK – Leading to Global Standardization in Electronic Circuits

Note: 1. Please submit each of documents in the list to the Secretariats after the meeting. 2. More annex can be added upon meeting contents.