Standards Update p.5 CompactPCI Serial ascends to Revision 2, AdvancedTCA primed for Ethernet and IPv6 enhancement Advancing Networks p.6 Proprietary implementations of open source in DSN

@PICMG_Tech Advertiser Index

PAGE ADVERTISER PICMG Systems & Technology Editorial/Production Staff 1 Annapolis Micro Systems, Inc. – Joe Pavlat, Editorial Director Steph Sweet, Creative Director WILDSTAR 6/AMC [email protected] [email protected] Brandon Lewis, Assistant Managing Editor Konrad Witte, Senior Web Developer 3 Excalibur Systems, Inc. – [email protected] [email protected] mil-1553.com Jessica Isquith, Industry Editor John McHale, Group Editorial Director [email protected] [email protected] 6 VEROTEC Electronics Packaging – System building Sales Group components Tom Varcie, Sales Manager Regional Sales Managers [email protected] Barbara Quinlan, Southwest 7 Computex – See you (586) 415-6500 [email protected] June 2-6, 2015 Rebecca Barker (480) 236-8818 Strategic Account Manager Denis Seger, Southern California 9 MEN Micro Elektronik GmbH – [email protected] [email protected] Breaking the chains! (281) 724-8021 (760) 518-5222 Eric Henry Sydele Starr, Northern California 12 Elma Electronic – Strategic Account Manager [email protected] Intelligent embedded [email protected] (775) 299-4148 computing – MicroTCA.4 (541) 760-5361 Europe Sales system platforms Kathleen Wackowski, Strategic Account Manager James Rhoades-Brown [email protected] [email protected] (978) 888-7367 13 Interface Concept – Asia-Pacific Sales Reprints and PDFs Build your own VPX system! Elvi Lee, Account Manager [email protected] [email protected] 15 N.A.T. GmbH – The smart way of composing – board level OpenSystems Media Editorial/Creative Staff products and system solutions by N.A.T. John McHale, Group Editorial Director Lisa Daigle, Assistant Managing Editor 16 ASIS – Beyond the Military Embedded Systems Military Embedded Systems standard – ATCA 3.0-3.7, PC/104 and Small Form Factors PC/104 and Small Form Factors mTCA, VPX, & custom PICMG Systems & Technology [email protected] platforms VITA Technologies Mariana Iriarte, Assistant Editor Rich Nass Military Embedded Systems 17 LCR Embedded Systems – Embedded Computing Brand Director [email protected] Rugged systems engineered for Embedded Computing Design Sally Cole, Senior Editor [email protected] Military Embedded Systems your application Jerry Gipper, Editorial Director [email protected] VITA Technologies 18 VadaTech Inc. – Rory Dear, Technical Contributor [email protected] Embedded Computing Design Introducing the UTC004 Curt Schwaderer, Editorial Director [email protected] 3rd generation MCH Embedded Computing Design Konrad Witte, Senior Web Developer [email protected] Steph Sweet, Creative Director 40 Vector Electronics & Monique DeVoe, Managing Editor Dave Diomede, Creative Services Director Embedded Computing Design Technology, Inc. – VectorPak Joann Toth, Senior Designer [email protected] systems packaging Chris Rassiccia, Graphic Designer Joy Gilmore, E-cast Manager [email protected] Corporate www.opensystemsmedia.com Patrick Hopper, Publisher Emily Verhoeks, Financial Assistant [email protected] Headquarters – ARIZONA: EVENTS Rosemary Kristoff, President 16626 E. Avenue of the Fountains, Ste. 201 [email protected] Fountain Hills, AZ 85268 ESC Boston John McHale, Executive Vice President Tel: (480) 967-5581 May 6-7, 2015 [email protected] MICHIGAN: Boston, MA Rich Nass, Executive Vice President 30233 Jefferson www.embeddedconf.com/boston/conference [email protected] St. Clair Shores, MI 48082 Wayne Kristoff, CTO Tel: (586) 415-6500 COMPUTEX TAIPEI Subscriptions www.opensystemsmedia.com/subscriptions June 2-6, 2015 Print ISSN 2333-5947, Online ISSN 1550-0381 PICMG Systems & Technology (USPS 019-288) is published three times a year (Spring, Fall and Winter) by OpenSystems Media, Taipei, Taiwan 16626 E. Ave of the Fountains, Ste 201, Fountain Hills, AZ 85258. PICMG Systems & Technology is free to qualified engineers or management dealing with or www.computextaipei.com.tw considering open system technologies. For others, paid subscription rates inside the US and Canada are $63/year. For first class delivery outside the US and Canada, subscriptions are $90/year (advance payment in US funds required). Periodicals postage paid at Scottsdale, AZ, and at additional mailing offices. Canada: Publication agreement #40048627. Return undeliverable Canadian addresses to: WDS, Station A, PO Box 54, Windsor, ON N9A 615. POSTMASTER: Send address changes to PICMG Systems & Technology 16626 E. Ave of the Fountains, Ste 201, Fountain Hills, AZ 85258.

2 | Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com

SPRING 2015 | VOLUME 19 NUMBER 1

picmg-systems.com @PICMG_Tech Standards-based technology platforms for open innovation On the cover

As the IEEE looks to advance Ethernet speeds from 40G to 400G for backplane-based systems such as AdvancedTCA, the PICMG Systems & Technology 2015 Resource Guide tracks the evolution of networking technologies in articles that range from 40 GbE MicroTCA and AMCs to 100G backplane design. The Resource Guide also includes myriad products for the designer of next-generation network infrastructure solutions, with products such as the Annapolis Micro Systems WILDSTAR 6/AMC featured beginning on page 19.

Identifying challenges in 100G backplane design Standards Update | Joe Pavlat By Sergej Dizel, Pentair Technical Products GmbH 5 CompactPCI Serial ascends to Revision 2, AdvancedTCA primed for Ethernet and IPv6 enhancement Technology Focus 8

Advancing Networks | Brandon Lewis 6 Proprietary implementations of open source in SDN

Technology Focus 8 Identifying challenges in 100G backplane design By Sergej Dizel, Pentair Technical Products GmbH

Application Feature Upgrading MicroTCA.0 and AMC.2 to 40 GbE speed levels 11 Upgrading MicroTCA.0 and AMC.2 to 40 GbE speed levels By Justin Moll,VadaTech, Inc. By Justin Moll,VadaTech, Inc. Application Feature 11 Industry Outlook 14 Ethernet – 40G to 400G Interview with John D’Ambrosia, Chairman, Ethernet Alliance; Chair, IEEE P802.3bs 400 GbE Task Force; and Chief Ethernet Evangelist, Dell

PICMG Resource Guide 19 Resource Guide Profiles AdvancedMC ...... 19 AdvancedTCA ...... 19 COM Express ...... 25 Ethernet – 40G to 400G Interview with John D’Ambrosia CompactPCI ...... 27 Industry Outlook 14 DSP-FPGA Boards ...... 32 Front Panel Hardware ...... 31 Mezzanines ...... 38 ® 2015 OpenSystems Media ® Comp actPCI, PICMG, PICMG, ATCA, AdvancedTCA, MicroTCA, AdvancedMC, MicroTCA ...... 39 GEN4, and their logos are registered trademarks of PICMG. TM xTCA is a trademark of PICMG. © 2015 PICMG Systems & Technology All registered brands and trademarks in AdvancedTCA & CompactPCI Systems are property of their respective owners. Member since 1998

4 | Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com Standards Update CompactPCI Serial ascends to Revision 2, AdvancedTCA primed for Ethernet and IPv6 enhancements

By Joe Pavlat [email protected]

Open standards for embedded com- to grow, and now includes MEN Mikro puting offer the customer a wide range Elektronik GmbH, Elma Electronic, of products, vendor independence, and Kontron, EKF Elektronik GmbH, ADLINK a fairly predictable upgrade path to Technology, Hartmann Electronic, Schroff incorporate new semiconductor, stor- GmbH, Teledyne Lecroy, ADDI-DATA, age, and software technologies. The and others. standards themselves are generally developed and maintained by open A new revision of the standard in now organizations or consortia that work to being released, Revision 2. It adds incre- be inclusive and not beholden to one or mental features and capabilities, which Figure 1 | CompactPCI Serial a few companies. There are many suc- is typical of revisions to well-established › supports both 3U and 6U configurations. cessful open standards organizations in standards. CompactPCI Serial Revision 2 Shown here is an example 9-slot, 3U CompactPCI Serial system (Figure operation, and the IEEE, PICMG, and now supports placement of the system courtesy MEN Mikro Elektronik GmbH). VITA are among the best known. slot on either the left or right side of the backplane. More importantly, Revision 2 One of PICMG’s early successful stan- supports additional rear I/O on the P6 dards is CompactPCI, which incorpo- connector and increased capability rates the wealth of PCI silicon developed on rear transition modules (RTMs). for the desktop PC world into a modular Graphics, USB, SATA, and other system and rugged standard for embedded slot connections can now be routed computing. First released in 1995, it out the rear, important for conduction continues to be the solution of choice cooling applications where the front for a very wide range of applications, module is fully encased. PCI Express Figure 2 | Depicted here is an example including the Mars rover, Curiosity (I just can also be routed out the rear, making › CompactPCI Serial backplane with the never get tired of saying that). it possible to easily interconnect mul- P6 connector configured for multiple rear Ethernet connections (Figure courtesy of tiple homogeneous or heterogeneous MEN Mikro Elektronik GmbH). Over the last ten years or so, the parallel PCI Express systems. PCI bus has given way to a serial ver- the beginning, and it was originally sion, PCI Express. Serial buses are faster AdvancedTCA 100G Ethernet specified to use 32-bit IP addresses and the chips cheaper, because they Driven by the need for higher bandwidth according to the IPv4 protocol. trade pin count (which is expensive) for in mobility, video, and security, this effort However, IPv4 supports 4 billion distinct a larger number of transistors (which are will provide capacity improvement to the IP addresses, and in the emerging world essentially free). Other buses, including AdvancedTCA (ATCA) specification by of Internet of Everything and billions USB and Serial ATA (SATA) have fol- incorporating 100 Gb backplane Ethernet of interconnected devices, this is not lowed suit. The granddaddy of all serial while maintaining backward compatibility. enough. IPv6 uses 128-bit addresses, communications interfaces, Ethernet, is Formally designated PICMG 3.1 R3.0, so more than 3.4 x 1038 devices can be still with us and just keeps getting faster. the 100G ATCA standard will update directly addressed. This new feature will AdvancedMC ...... 19 the PICMG 3.1 specification to incorpo- be released as an Engineering Change AdvancedTCA ...... 19 CompactPCI Serial – Revision 2 rate 100GBASE-KR4 (NRZ) Ethernet sig- Notice to the current revision of ATCA, A few years ago, PICMG released a naling. This effort began in early 2015, Revision 3.0, helping get this much COM Express ...... 25 new version of CompactPCI known as and work is expected to be completed by needed capability to the market quickly. CompactPCI ...... 27 CompactPCI Serial. It provides a tenfold the end of the year. It is being headed by The IPv6 feature is completely optional DSP-FPGA Boards ...... 32 or so increase in performance, more Doug Sandy, CTO of PICMG and Artesyn and does not affect backwards compat- Front Panel Hardware ...... 31 interconnectivity using fewer pins, and Embedded Technologies, who also lead ibility in any way, so all existing ATCA- Mezzanines ...... 38 cost-effective features such as the inclu- the successful 40G ATCA effort a couple compliant systems will remain so. sion of multi-channel Ethernet without years back. MicroTCA ...... 39 the need for a switch. It is already pop- 40G for MicroTCA and AMC ular in Europe where it was developed, IPv6 for AdvancedTCA The 40G MicroTCA and AMC effort and its popularity is now moving around Hardware platform management (HPM) is well underway. The next issue will the globe. The vendor base continues has been an integral part of ATCA since explore this in more detail.

www.picmg-systems.com PICMG Systems & Technology Resource Guide | Spring 2015 | 5 Advancing Networks Proprietary implementations of open source in SDN

[email protected] By Brandon Lewis

Earlier this year I had the opportunity to speak with Jeff Reed, by the Linux Foundation and had more than 250 contributors in VP of the Enterprise Infrastructure and Solutions Group at 2014, the vast majority of the now more than 1 million lines of Cisco on the company’s software-defined networking (SDN) code are courtesy networking giants such as Juniper, Brocade, strategy and trends in SDN in general[1]. I went in armed with Microsoft, Intel, and, of course, Cisco[2]. So while OpenDaylight some questions about OpenFlow, expected to hear about the flies under the flag of open source, is it really? company’s involvement in the OpenDaylight initiative, and was primarily interested in the company’s take on how SDN archi- Let me direct your attention back to OpFlex. OpFlex is a tectures are impacting vendors of hardware platforms such as Cisco-envisioned protocol that orchestrates policy between AdvancedTCA (ATCA). But when I asked about Cisco’s SDN the controller and network switch in ACI implementations (as strategy, Reed was quick to point me to their Application Centric mentioned, ACI is Cisco’s answer to SDN). Ironically, OpFlex is Infrastructure (ACI); when I said OpenFlow he responded with basically the equivalent of what the OpenFlow controller does OpFlex. Do you see where I’m going with this? for SDNs in OpenDaylight configurations, only faster and with more fine-grained control. Currently OpFlex is an open pro- Proprietary implementations of open source tocol, and Cisco has committed to licensing it under Apache In early 2013, Cisco teamed with IBM on the beginnings of 2.0 in addition to proposing it as a standard to the IETF[3]. OpenDaylight, an open-source project aimed at accelerating the development of SDN and network functions virtualization While an open-source variant of OpFlex would make the pro- (NFV). Of course, the term “open source” is used loosely at tocol widely accessible to the vendor community at large, it’s best these days, and although OpenDaylight is now managed also undoubtedly an endorsement of Cisco’s ACI. In addition to an application policy infrastructure controller (APIC), the ACI model relies on hardware such as Cisco’s Nexus 9000 and Nexus 9300 switches. Meanwhile, Reed also pointed out during VEROTEC INTEGRATED PACKAGING our conversation that Cisco has been working on a line of net- work ASICs over the past couple years that include a flexible System building components parser and flexible data pipeline so that the ICs “can support IEEE1101.1 and 1101.10 commercial and rugged systems protocols that didn’t even exist when we shipped it.” 19” standard, screened and Eurocard rack cases “That’s such a terrific toolset to have with SDN and ACI because if a customer deploys one of those boxes and a great new pro- tocol comes along a year from now, they can support it without having to go buy a new piece of hardware,” Reed said. “So there’s a lot of opportunity for ACI to continue to drive the rele- vance of capabilities on the network infrastructure itself. Almost Shielded and unshielded front panels and modules every new product or development activity we’re working on ties into ACI and how we enable it via the controllers. That’s part and parcel to how you’ll see Cisco build its products over the next few years.”

In all, these ASICs will provide a migration path from SDN/ Card cages 3U to 9U OpenFlow to Cisco’s ACI/OpFlex architecture, or other future SDN infrastructure combinations. If you’re interested in keeping abreast of the evolution of SDN, I’d suggest you pay attention to contributions in open-source projects such as OpenDaylight; if for no other reason than to make sure there are no surprises.

References: Continuing 50 years of excellence in functional and elegant enclosures for 1. “Software-defined networking – A view from the top.” cPCI, VME, VME64x, VPX, other major bus structures and general electronics http:// opsy.st/CiscoSDN 2. “A survey of open networking standards, part 1: OpenDaylight.” ELECTRONICS PACKAGING http://opsy.st/QualiSystemsOpenDaylight Ph: 603.821.9921 • [email protected] • www.verotec.us 3. “OpFlex: Another example of Cisco being Cisco.” http://opsy.st/CiscoBeingCisco.

6 | Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com See you JUNE 2 - 6, 2015

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Tel: +886-2-2725-5200 Ext. 2634 Organizers: E-mail: [email protected] Fax: +886-2-2725-3501 Technology Focus Identifying challenges in 100G backplane design

By Sergej Dizel, Pentair Technical Products GmbH

Since the introduction of AdvancedTCA (ATCA) in 2002, the race for more data transfer speed on the backplane has been on. The telecom and datacom markets have a hunger for processing power that is never satisfied. Today’s processor technologies such as multicore, GPGPUs, and powerful co-processors can satisfy the demands of full HD video on demand, increasing the number of data-hungry services available for smartphones and other applications. In addition to providing the processing power for these applications, infrastructure must be able to support the huge amount of data traffic they generate.

From packet switching backplanes with 1 Gbps of data transfer in the beginning of the millennium, today’s ATCA backplanes support 40 Gbps data transfer. This is achieved by four ports, each with two differential pairs transferring 10 Gbps each, which together are capable of transferring 40 Gbps. Even this is not sufficient to feed today’s most demanding processor blades.

Today, dual-dual star backplanes are often used where two switches work in parallel to increase the data traffic between transmitter and receiver to 80 Gbps, though this is certainly not the end point of demand for data speed. The IEEE specification for 100 Gigabit Ethernet (GbE) over copper was released at the end of 2014, and a PICMG working group is defining 100G Ethernet for ATCA based on the IEEE spec.

100 Gbps data rates create many new connectors, the bare board, and the transition between board and back- challenges for backplane design. Figure 1A copper trace structures have to be plane. One way of possibly achieving and 1B show the thresholds for insertion de­signed for those higher frequencies. this is to decrease the size of the through and return loss of the IEEE802.3ap spec- holes in the backplane. This method cre- ification (which defined 40G Ethernet), The current ZD+ connector as defined ates another advantage for backplane and the new standard IEEE802.3bj that in the ATCA specification is not rated for routing as the smaller hole sizes create defines 100G. At 100G, the IEEE defined those high frequencies. At the moment, a larger routing channel in between the two coding methods, 100GBASE-KR4 no such ATCA connector is defined or connector pins. This leads to a more and 100GBASE-KP4. As shown in the freely available on the market, although homogeneous impedance of the traces figures, the thresholds for both new connector vendors are working on a and a lower cross talk. The down side methods of 100G are defined for much solution. The main challenge for the of smaller hole sizes is that the press-fit higher frequencies. For the backplane new ATCA connector is to achieve a connector pins must be smaller and less this means that all components, such as much more homogeneous impedance robust and may have lower cohesion.

8 | Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com Figure 1A

Breaking the Figure 1B Chains!

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n Communication via Figures 1A and 1B | These graphs compare the thresholds for insertion loss (1A) and return real-time Ethernet loss (1B) at 40G and both methods of 100G. › n Connection to any railway fieldbus type like CANopen, Figure 2 shows the simulation of insertion loss (Sdd21) of a 30 mm-long differential MVB, PROFINET, etc. pair in an ATCA backplane without the connectors assembled. The difference between n Comes with complete the current configuration with a 0.6 mm through hole and a reduced through hole certification package including size of 0.36 mm is obvious. A reduction of the distance of the press-fit pins within hardware, safe operation system the differential pair from 1.5 mm to 1 mm is able to further reduce the losses of the and software transmission line. n Compliant with EN 50155

The near future will show what the new ATCA connector design for 100G will be, including the footprint for mounting to the backplane. At the same time the PICMG 100G ATCA working group is striving to define the new connector in a way that allows several connector manufacturers to create the 100G ATCA backplane and board connector.

Tackling cross talk The next important part of the backplane that must be addressed in 100G ATCA designs is the trace structures, especially their dimensioning with regards to losses and cross talk. Not every differential pair has similar properties. For example, when com- paring two differential stripline pairs each with a 100 Ohm impedance but different www.menmicro.com/markets/railways.html trace widths (and thus a different layer stackup), they will have different behavior with www.picmg-systems.com PICMG Systems & Technology Resource Guide | Spring 2015 | 9 Technology Focus

zHG 0 zHG 5 zHG 01 zHG 51 zHG 02 zHG 52 zHG 0 dB

-2 dB

-4 dB

-6 dB

-8 dB

-10 dB

-12 dB Insertion loss with 6mm vias, 30mm trace length Insertion loss with 3,6mm vias, 30mm trace length › Figure 2 | Comparison of insertion loss of a 30 mm differential pair with 6 mm and 3.6 mm vias. regards to transmission line losses and cross talk (emission and immission). At 40G backplane data transfer this issue is solved, but there are new challenges with 100G that became visible when conducting the first simulations for 100G data transfer, as the impedance discon- tinuities between the connector and the differential pair need to be evaluated very carefully. This part of the transmis- sion line already plays a significant role in a 40G backplane, but at 100G it will be much more critical. The impedance discontinuities between the connector › Figure 3 | An example of vias and traces in a backplane. and the backplane have a significant influence on the properties of the whole allow a 100G data transfer. This means it is essential to very carefully choose a PCB transmission channel (losses and cross manufacturing partner who understands these needs and has their processes carefully talk). If the discontinuities are too large, controlled. A close partnership is needed to qualify those suppliers and qualify the the signal fed into the transmission line production technology and processes. is more sensitive to cross talk from adja- cent differential signal traces. When the As the PICMG 100G ATCA specification is not yet complete, only prework on qualifying losses and/or influence from cross talk a 100G ATCA backplane design can be done at the moment. Verification of a 100G are to great, the receiver cannot cor- backplane is not possible until the PICMG specification is defined because the param- rectly read the signal; with that, the bit eter limits for the backplane have not been selected yet. error rate gets increased. The IEEE802.3bj 100G specification defines the parameter for the whole Ethernet To achieve the desired trace structure channel, which is located between both transceiver chips. The transmission line of in a bare board, new requirements for an ATCA backplane is just a part of the whole transmission channel; as ATCA boards the quality of the bare board are needed are located before and after the backplane within the transmission channel. For that (Figure 3). Bare board material, prepreg reason the IEEE802.3bj parameter can’t be used one-to-one for backplane validation. and core types, backdrilling, drilling The IEEE802.3bj parameter limits must be separated between these three parts of the offset, etching, and many other factors channel for both ATCA boards and the backplane. The PICMG 100G working group will play an enormous role in 100G back- is currently addressing these issues, and companies like Pentair are playing an active plane design. role defining this new important standard.

Spec’ing and certifying ATCA at 100G Sergej Dizel is an electrical and backplane design engineer at Pentair Technical In addition to correctly defining those Products GmbH. parameters, the quality and the toler- ances of the bare board manufacturing process is essential to guarantee repro- Pentair Technical Products GmbH ducible 100G data transfer results. Even www.pentairprotect.com the smallest process deviation during [email protected] manufacturing will influence the signal 1.800.525.468 properties, and, in the worst case, not

10 | Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com Application Focus

Upgrading MicroTCA.0 and AMC.2 to 40 GbE speed levels

By Justin Moll,VadaTech, Inc.

The Higher Speed Ethernet Fabrics for MicroTCA.0 and AMC.2 committee is working to bring 40 GbE to these specifications. The specification currently runs at up to 10 GbE levels per 10GBASE-KX and 10GBASE-KR. There are several pieces involved in this effort, and careful attention has been made to its effect on related specifications.

The largest aspect of the 40G over MicroTCA (mTCA) activity is ensuring the archi- ›› Simplicity – Keep the testing tecture will perform well at these speeds. In doing so, the committee will provide as simple as possible and limit an eye mask and design parameters for third-party users to adhere to when they the amount of expensive test develop their own boards. The goal is to provide enough guidelines and rules so that equipment required the mTCA vendor’s 40G products are fully interoperable at 40 GbE speeds, and third- party developments will also have enough guidance from the specification to work One of the key steps the committee took effectively at the increased rates. was to leverage core parts of the eco- system to create a model for the full inter- 40G over MicroTCA will be leveraging practices used in the sister specification for connect path. Using multiple vendors’ PICMG 3.1 (40GbE over AdvancedTCA). Listed below are a few of the guidelines: AMCs, MCHs, and backplanes/chassis, the Higher Speed Ethernet Fabrics ›› Ecosystem Interoperability – Components will be tested from active mTCA for MicroTCA.0 and AMC.2 working developers to ensure the various connectors, backplanes, AMCs, and MicroTCA group looked at several parameters for Carrier Hubs (MCHs) work together 10GBASE-KR compliance testing. This ›› Confidence Level – Establish that any party testing to the guidelines provided has included the differential insertion loss, a reasonably high level of confidence that their solution will perform to the metrics skew, differential return loss, crosstalk ›› Independent Development – Allow that backplanes, modules, and AMCs can ratio to insertion loss, and jitter tolerance. be developed separately Overall, the results were very good and ›› Minimize Cost Impact – Design options will be kept open to allow cost provided a solid baseline for 40G signal optimization innovation by vendors/suppliers integrity efforts. www.picmg-systems.com PICMG Systems & Technology Resource Guide | Spring 2015 | 11 Application Feature

As visible in Figure 1, all of the results for the insertion loss of a short channel path fell well above the fail line. As the S-parameters were based in FR4 PCB material, there is “THE 40G OVER mTCA confidence that plenty of margin exists for higher speeds; in the worst case, materials GROUP HAS PROVIDED with a low dielectric constant could be used. RECOMMENDED As shown in Figure 2, the differential return loss passes as well, but comes a bit close RESOLUTIONS FOR THE OPEN in the low frequencies. It is not expected for there to be a problem at 40G levels, but all of the areas will have to be watched closely. Again, as base FR4 materials CRS IN MICROTCA.0 ...” were the basis of analysis, there is room for recommending other materials in the specification if needed. during the simulation studies. The goal is The 40 GbE over mTCA efforts are continuing. Once simulation models are fully to have all simulations complete in Q1 of instituted, characterization of 40 GbE modules and backplanes with specially made 2015, with characterization commencing paddle/test cards will begin. This will provide confirmation of the parameters we set in Q2 or Q3.

Other activities Another part of the Higher Speed Ether­- net over MicroTCA.0 and AMC.2 speci- fication the committee is addressing are Correction Requests (CRs). These most often occur when a related specification addresses an issue and a request is made to have the adjustments incorporated in all corresponding specifications. When changes are made special care is given to not materially harm or affect the compatibility and function of related specs, but sometimes small adjustments and clarifications are required for consis- tency and accuracy.

MicroTCA and its related specifications have been very active in recent years, including the ratification of MicroTCA.2 and several notes/changes to MicroTCA.1. Intelligent Embedded Computing The task of aligning all of these specs can MicroTCA.4 System Platforms be time-consuming, but it is important to ensuring an effective family of speci- • Beam forming and test fications. Furthermore, there has been a wealth of activity in MicroTCA.4 led by • Scientific Data Acquisition & Diagnostics the high-energy physics (HEP) commu- • Energy Research Equipment nity, and the original authors’ allowance • Control Systems for Particle Accelerators & Colliders for the use of rear transition modules (RTMs) in the MicroTCA.0 has become a The mTCA architecture is well suited for use in applications key attribute of MicroTCA.4. Addressing CRs in this instance made life easier when such as particle accelerator labs, smart grid, trying to keep the specifications aligned wireless infrastructure and gateway systems. and up to date. Elma has the expertise and resources to help you design and build your system. The 40G over MTCA group has provided recommended resolutions for the open CRs in MicroTCA.0, and they will be sub- mitted to PICMG membership for a vote.

Join the committees MicroTCA is gaining traction in physics, mil/aero, and many other applications. Texas Instruments has based some of

12 | Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com OSM_PICMG_ad_mTCA_Fall.indd 1 2/27/2015 12:52:35 PM Build your own VPX system ! INTERFACE CONCEPT product range of Sin- gle Board Computers, FPGA boards, ADC/ DAC FMC and Graphic boards are ideal to devise a complete VPX system for compute intensive and image processing applica- tions (radar, electronic warfare, electro optical and IR, visualization systems)

Figure 1 | Insertion loss testing of 10GBASE-KR4 Ethernet for use in 40G MicroTCA.0 and › AMC.2 systems has yielded encouraging results. Intel® CoreTM i7 SBC

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Graphic Boards Figure 2 | Differential return loss testing of 10GBASE-KR4 Ethernet in 40G MicroTCA.0 and › AMC.2 systems was also successful, however the smaller margin for error may at some point necessitate a base material other than FR4. their new evaluation modules on the AMC form factor, and it is also common to find a new specialty AMC board vendor crop up in unexpected places. If you are an active • One AMD RadeonTM E8860 user or developer of AMC/MicroTCA systems and are interested in joining the group, • One KintexTM-7 325T FPGA • Support for DP, HDMI, VGA, Stanag3350, contact [email protected] or [email protected] for details. Arinc8181... • One PMC/XMC site Justin Moll is Director of Marketing for VadaTech, Inc. Justin is active in the embedded industry and is currently the Chair of the 40 GbE over MicroTCA committee within PICMG.

VadaTech, Inc. www.vadatech.com www.interfaceconcept.com [email protected] +33 (0)2 98 57 30 30 www.picmg-systems.com PICMG Systems & Technology Resource Guide | Spring 2015 | 13

IC-Jan15-exe.indd 1 16/01/2015 16:37 Industry Outlook

Ethernet – 40G to 400G

Interview with John D’Ambrosia, Chairman, Ethernet Alliance; Chair, IEEE P802.3bs 400 GbE Task Force; and Chief Ethernet Evangelist, Dell

With Ethernet speeds advancing past 40G to 100G and higher, designers of systems such as AdvancedTCA (ATCA) meticulously follow activities in the IEEE 802.3 Ethernet subcommittee for any indicators on the future of backplane-based systems. In this interview with John D’Ambrosia, IEEE P802.3bs Chair, Chairman of the Ethernet Alliance, and Dell’s Chief Ethernet Evangelist, he discusses the development and deployment of the recently released 100GBASE-KR4 and -KP4 specifications, as well as the beginnings of IEEE work on 400G Ethernet and beyond.

Give a little background on 10 GbE across the backplane. So as the group was winding down on 100G develop- the 100GBASE-KR4 spec, it’s ment, which was really an optics focus, we realized that we needed to start introducing development, and finalization. the next members of the 100G family. And following those discussions we had around developing the optics, we started looking at developing 4 x 25 Gbps Ethernet. That’s D’AMBROSIA: The 100GBASE-KR4 why it was called “Backplane and Copper Cable.” spec was developed as part of what was referred to as the IEEE 802.3 100 GbE As that project emerged, it became 100GBASE-KR4 (which is a backplane solution Backplane and Copper Cable project. based on NRZ signaling), there’s 100GBASE-KP4 (which is based on PAM4 sig- That project was being considered naling), and then there’s 100GBASE-CR4 (which is across a twinaxial cable for 5 m as the development of 40 GbE and based on four differential pairs of 25 Gbps Ethernet in each direction). The actual 100 GbE was coming to a close. In that project started with a call for interest (CFI) that happened in November of 2010, case, the 40 GbE and 100 GbE project and that spec was ratified in the middle of last year. That’s been finalized, so that hadn’t developed any new electrical sig- spec is out there now. naling on a per lane basis, meaning that all of the electrical interfaces developed What were some of the challenges with 100G spec development, and how do as part of that project were based on the KR4 and KP4 specs differ? 10 GbE signaling. D’AMBROSIA: In hindsight, some of the FEC encoding became more involved, and 100 GbE optics actually was developed the bigger point in terms of AdvancedTCA (ATCA) is you had new channel specs. This with a 4-lambda approach based on is where -KR4 and -KP4 came from. 25 GbE per lambda. When you look at the optical specs you see 100GBASE-LR4 As a kind of rule of thumb, you’re probably looking at a 25 dB to 35 dB solution and 100GBASE-ER4; that was really the at the Nyquist rate. So, if I’m running at 10 Gbps, Nyquist is roughly half of that – initial 100 GbE project. So right off the 5 Gbps – for NRZ signaling. That’s kind of constant, so when we jumped to 25 Gbps bat there was this understanding that we the channel was in the 25 dB to 35 dB range, but now at 12.5 Gbps. So as you were going to go to 25 GbE technology move to higher speeds, the channel itself becomes an issue. That’s always one of just because we had looked at it from an the challenges you’ll face, and you can see the same kind of thing with the 10 GbE optics perspective, which really became and 40 GbE specs. a systems perspective. NRZ signaling stands for non-return-to-zero, and it’s a form of pulse-amplitude modu- As I said, the electrical interfaces that lation (PAM). So it’s your classic zeros and ones. In the case of PAM4, the way that were developed for the 100 GbE project, I like to describe it is if you sit in a room and you ask people to raise their hands, those which did not include a backplane solu- are ones; if they don’t put their hands up, those are zeros. So it’s usually very easy tion by the way, were based on 10 lanes to tell the difference between zeros and ones. Normally it doesn’t really matter how of 10 GbE. As an old backplane designer quickly they put their hands up, but as you start moving faster and faster, you start to I can tell you that there’s no way in hell run into some issues. One of those is the challenges of the channel, and one of those I want to have to deal with 10 lanes of challenges is cost.

14 | Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com If you were to look at PAM4, going back that rule of thumb about 25 dB to 35 dB at Nyquist, but in the case of PAM4 it’s not on my analogy, there would be more really 25 dB to 35 dB at 12.5 Gbps, it’s really 25 dB to 35 dB 6.25 Gbps to 7 Gbps places for people to raise their hands. because of some overspeed. That becomes a way to deal with channels that may So zero would be their hands down, involve lower cost materials. That’s really the benefit here – being able to send more the next level might be at their waist, information over a lower cost channel is essentially the benefit of PAM4 over NRZ. the next level would be at their head, and the last level would be above their head. Pulse amplitude modulation at “YOU SEE MORE PRODUCTS BEING INTRODUCED four levels, or PAM4. Inherently, that reduces your signal-to-noise ratio right SUPPORTING 100GBASE-KR4 THAN 100GBASE-KP4 TODAY. off the bat. YOU HAVE TO REALIZE THAT THERE’S AN ECOSYSTEM

In the case of NRZ, you send a symbol OUT THERE THAT SUPPORTS NRZ SIGNALING. IT GOES that represents a 0 or a 1. In the case FROM THE TEST EQUIPMENT TO JUST THE BASIC of PAM4, you send a symbol (the baud rate), but in this case it is enabled by ENGINEERING UNDERSTANDING.” two bits. So when you’re at level 0 it represents something, when you’re at level 1 it represents two 2 bits, when What kind of adoption are you seeing for each specification, and what type you’re at level 2 it represents two bits, of interoperability challenges, if any, do the two types of signaling pose for when you’re at the highest level it rep- backplane designers? resents two bits – also, depending on the different transitions, you get into D’AMBROSIA: One of the things that we are seeing is a lot more work being devoted representing what those two bits are. to 100GBASE-KR4, the NRZ specification. You see more products being introduced So you’re sending more information in supporting 100GBASE-KR4 than 100GBASE-KP4 today. You have to realize that a single symbol than you do with NRZ, there’s an ecosystem out there that supports NRZ signaling. It goes from the test so your baud rate is half now. I gave you equipment to just the basic engineering understanding.

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But the debate between NRZ and PAM4 50 GbE PAM4. There are some people who are pointing to that saying it’s a good has been going on for a long time, and thing because we could support backwards compatibility, and as we look at having there are more and more people inter- to go backwards it would be to our benefit to consider doing 50 GbE PAM4 because ested in PAM4. Going back 13 years, of the popularity of 25 GbE NRZ, as opposed to having to go to newer processes to I helped form a group called the High support 50 GbE NRZ. Those arguments are already happening now as we look at sup- Speed Backplane Initiative, and we were porting 50 Gbps electrical signaling as part of the 400 GbE project. looking at using PAM4 for backplanes back then. At that time there were a few The IEEE hasn’t announced any intentions of taking copper backplanes parties interested in it, but ultimately the further than 100 GbE. From your perspective, what are the most viable options industry decided to not specify PAM4 moving forward? and specify NRZ for 10 GbE signaling. When it came time to do 4 x 25 GbE D’AMBROSIA: We’re developing 400G now. The 802.3bs Ethernet Task Force has signaling, more companies stepped decided that it will develop electrical interfaces for chip-to-chip (by chip-to-chip I up saying that they think we should mean on a card, not across cards) and chip-to-module. We will develop 25 GbE and do PAM4. Now as we look to going to 50 GbE electrical interfaces – 25 GbE will leverage NRZ signaling, 50 Gbps is still a 400 GbE and trying to go faster, more topic of debate over whether it will be NRZ or whether it will be PAM4. and more people are looking at using PAM4 signaling to support 50 Gbps The interesting thing here is that, when I said from a backplane designer’s perspec- electrical, especially over the longer tive that doing 10 x 10 GbE interfaces across a backplane didn’t sound appealing, for channels just because of the inherent 400G it would be 16 x 25 GbE and 8 x 50 GbE. Even at 50 GbE that sounds really ugly channel challenges. to me, but it is pretty much recognized that 50 Gbps signaling is going to be the next development point. It’s an interesting question as we go for- ward because a lot of the 25 GbE NRZ The introduction of 50 Gbps though, if you look at what’s going on inside the IEEE that has been developed and is now out right now, could raise some interesting questions. When you look at what’s happening in the market provides similar circuitry with how we’re developing 25 Gbps signaling technology as part of 4 x 25 GbE for to what would be needed to support 100G, and then you look at 40G, which is leveraging 4 x 10 GbE today, what you see

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16 | Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com Figure 1 | The 2015 Ethernet Roadmap outlines the ongoing development of Ethernet through 2020, and and includes projections for electrical/ › optical speeds possibly as high as 10 Tbps.

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www.picmg-systems.com PICMG Systems & Technology Resource Guide | Spring 2015 | 17 Industry Outlook is that you can’t get the same port density into an ASIC at 40G as you can at 25G because the basic building blocks don’t line up. In the case of 25 GbE, they do – 25 GbE I/O on the chip to 25 GbE I/O on the boxes. So you can get to the maximum “... WILL WE SEE 50 GBE density this way and the maximum throughput on the chips, which helps to optimize AND 200 GBE EMERGE? ... your switches, which helps to optimize and reduce cabling costs, power costs, and so on. So there is this inherent niceness to 1x or 4x architectures. I DON’T HAVE AN ANSWER

Now we’re getting to the question, and this is still a question, “Will we see 50 GbE FOR YOU TODAY, and 200 GbE emerge as speeds for backplanes?” BUT I GET THE LOGIC.” There’s been a lot of discussion and debate, and the logic of this is very relevant. But we’re still in the early stages of developing 50 GbE electrical signaling. I can tell you as Task Force Chair that this comes up and I have to keep people within the scope of there haven’t been any votes yet taken our project par. It’s not a foregone conclusion yet by any means in IEEE 802 because on any of these discussions. These are really industry debates around 50 GbE and 200 GbE.

So, will we see 50 GbE and 200 GbE “The Game-Changer” emerge? That is the question. I don’t have the answer for you today, but I get “A 40GbE MCH is here!” the logic. The role of the IEEE 802 specs is to produce high-quality, market-rele- vant standards. The IEEE 802 does not “ decree, “Thou shalt develop.” That’s not On-board GPS the way the process works. By market- receiver” relevant standards, what we’re saying is that the market decides what it wants to develop a standard for next. So the market market comes forward and says, “We want to do this.”

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18 | Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com PICMG Systems & Technology AdvancedMC

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20 | Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com PICMG Systems & Technology <>AdvancedTCA

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ĄĄ • Form factor – 5U; 7 slots; 19" Field-replaceable AC/DC – integrated AC support can be easily added in the field, providing outstanding flexibility and time-to-market. 7 payload blades (no switches); • Slot configurations – ĄĄ ™ Outstanding resiliency – unique external fan tray controllers 2 switches + 6 payload blades (Intera ); 2 switches + 5 payload eliminate fan tray failures. blades ĄĄ Power-efficient – 7 slots are cooled by only 6 fans while reaching up • Power & cooling – 450W/slot (standard); 550W/slot (high-power) to 550W per slot. • Field-replaceable AC/DC ĄĄ Intera™ integrated switch slot – frees up to two additional payload slots, for significantly greater processing power. </p><p> picmg.opensystemsmedia.com/p372662</p><p>Asis Ltd.  sales@asis-pro.com  www.asis-pro.com 408-215-1510</p><p>22 | Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com PICMG Systems & Technology AdvancedTCA</p><p>CO14-G4</p><p>The new flagship 14-slot chassis is Comtel’s “4th Generation” and R the latest in high performance platforms for ATCA! esource Guide Appropriately named, CO14-G4, this Chassis is a 14U height 14 slot AdvancedTCA® chassis supports full mesh, dual star and dual-dual star topologies backplanes it is DC powered and has front-to-back cooling!</p><p>About COMTEL Electronics Comtel has acquired a leadership position in the business of electrical interconnection components and systems. The activities of the com- pany include high-speed electrical simulation, design, prototypes and mass production for Backplanes and system solutions. Since 1993, Comtel Electronics GmbH has been offering Backplanes and integrated systems based on a wide range of VME, VME64x, VXI, FEATURES VXS, VPX, Gigabit VME64x, PXI, CompactPCI, AdvancedTCA, uTCA and ĄĄ 515W per slot engineered Cooling custom proprietary solutions. ĄĄ Options for 675W per slot Cooling Comtel has expertise in a wide range of engineering disciplines includ- ĄĄ Ultra high performance Air-/-Plane™ backplane supporting ing concept design, board assembly and testing, mechanical design 40 Gbps and now 100 Gbps! and production, wiring and functional test, system engineering and ĄĄ software design. Dual Star, Dual-Dual Star, Full Mesh topologies ĄĄ Comtel products are implemented in solutions for telecommunica- 19", 14U Rackmount chassis tions, test and measurement, instrumentation, medical, military and ĄĄ Accommodates 14, ATCA boards and RTMs other applications. ĄĄ Redundant Pigeon Point Based Shelf Manager Comtel is a privately owned company with its headquarters in Munich, ĄĄ 4 redundant Power Entry Modules (A1+ A2 and B1 + B2) to Germany. The Comtel Group incorporates production facilities in accommodate up to 800W per slot Germany, Israel and China. Furthermore the enterprise offers sales ĄĄ Pull cooling with 4 hot-swappable redundant fan trays with support worldwide. excellent airflow distribution Comtel is an active member of PICMG consortium, contribut- ĄĄ The new cooling system pumps 1250cfm of air through the ing in development of advanced telecommunication standards as chassis AdvancedTCA and MicroTCA. ĄĄ High Reliability Bussed or Radial IPMB ĄĄ EMI containment for front and rear card cage </p><p>ĄĄ Compliancy: • RoHS • Designed to meet NEBS • UL/cUL/CE pending </p><p> picmg.opensystemsmedia.com/p372546</p><p>COMTEL Electronics  nasales@comtel-online.com www.comtel-online.com  +1-619-573-9770</p><p> www.picmg-systems.com PICMG Systems & Technology Resource Guide | Spring 2015 | 23 AdvancedTCA esource Guide R</p><p>ATCA® Shelves and Backplanes FEATURES Pixus Technologies’ ATCA® shelves and backplanes support a wide range of applications in telecom, LTE, enterprise, military/aerospace, and HPC PXS1340 13U ATCA Shelf environments. All shelves are designed to meet NEBS. ĄĄ 40GBASE-KR4 Dual-Star or Full-Mesh 14-Slot Backplane ĄĄ Front-to-Rear airflow supporting over 270W/Slot cooling performance ® AdvancedTCA shelves from Pixus are equipped with the hot-swap high- (@ 55°C) performance RiCool III fans. These fans offer added output coupled with ĄĄ Full redundancy with dual ShMCs, quad CUs, dual Hubs and dual PEMs a reduced noise level. Pixus 40GBASE-40KR4 backplanes are monolithic ĄĄ 15,000+ installed base worldwide with a high level of signal integrity in dual star, full mesh, or replicated mesh. PICMG Systems & Technology PXS0640 SlotSaver 6U ATCA Shelf Pixus provides 3U, 5U, 6U, 8U, and 13U ATCA shelves with AC and DC power ĄĄ 40GBASE-KR4 Dual-Star, Full-Mesh or Replicated Mesh 6-Slot options. Full redundancy is provided with dual shelf managers, dual or quad Backplane cooling units, dual Hubs, and dual power modules. ĄĄ Integration of Hubs with ShMCs adds 2 node slots ĄĄ ATCA systems from Pixus leverage over 20 years of superior cooling, back- AC and DC power options plane, and packaging innovation with proven Pixus and Rittal technologies. PXS0309 3U ATCA Hybrid Chassis with 8 AMCs ATCA Shelves and backplanes can be modified to meet customer require- ĄĄ 19" rack mount 3U ATCA Hybrid AMC Chassis ments without NRE. ĄĄ 1 ATCA slot and 8 mid-size AMC slots</p><p>Enclosures Cases Subracks Backplanes Chassis Integrated Systems Components picmg.opensystemsmedia.com/p372668</p><p>Pixus Technologies  sales@pixustechnologies.com  www.pixustechnologies.com 519-885-5775</p><p>AdvancedTCA</p><p>Express Programs: When product is needed fast</p><p>Need systems, subracks, cases or front panels quickly for proto- typing or small projects? Express service provides rapid delivery turn- arounds for solutions engineered to meet your design requirements – in a matter of days. Systems Express • ATCA, MicroTCA, CompactPCI, and CompactPCI Serial models available • Shipped in as few as 15 days FEATURES Subrack & Cases Express • EuropacPRO subrack kits, parts and accessories ĄĄ Conform to PICMG specifications • RatiopacPRO case kits, parts and accessories ĄĄ • Delivered in as few as 15 days ATCA, uTCA, CompactPCI standards ĄĄ Standard and customized solutions available Front Panel Express ĄĄ • 5 to 50 front panels Local and global design and product support • Custom cut-outs, handles and silk screen ĄĄ Drawings and models available • Delivered in as few as 5 days ĄĄ Part and quantity restrictions may apply</p><p> picmg.opensystemsmedia.com/p367481</p><p> AskSchroff@pentair.com PentairProtect.com  1-800-525-4682</p><p>24 | Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com PICMG Systems & Technology AdvancedTCA</p><p>450/40 and 300/40 Series ATCA Systems</p><p>450/40 and 300/40 ATCA chassis are designed to support the </p><p> next generation of ATCA board requirements, minimizing the time to R market for critical, high-availability applications where high perfor- esource Guide mance is crucial. With superior physical construction, optimal cooling, reliable power supplies, efficient data distribution and secure system management, FEATURES Pentair’s Schroff ATCA solutions are your choice for a dependable solution. ĄĄ 2, 6 and 14 slot backplanes The 450/40 series ATCA systems offer generous head room for ĄĄ 40 Gbps (10GBASE-KR) transmission rate power and cooling capabilities. Both product families feature Pentair’s ĄĄ Up to 450 watts/slot cooling leading edge 40 Gbps backplane design, shelf management and proven ĄĄ AC & DC power entry modules hardware quality. ĄĄ Various cooling configurations available Deploying these chassis – ensure your integrated solutions will ĄĄ continue to perform at the highest level as network requirements grow Designed to meet NEBS, PICMG 3.0 and higher performing ATCA boards become available. ĄĄ Proven performance, test reports available</p><p> picmg.opensystemsmedia.com/p370348</p><p> AskSchroff@pentair.com PentairProtect.com  1-800-525-4682</p><p>COM Express</p><p>COM Express Vision PC</p><p>Active Silicon’s COM Express embedded vision solutions are driven by a customer request for a long product life embedded PC. Active Silicon can help specify, design and manufacture an embedded system that will remain fit, form and function identical for many years. We can integrate any type of video acquisition along with all the standard interfaces such as USB3, HDMI, GigE, eSATA etc. plus expansion options using PCI Express. FEATURES The COM Express architecture is ideally suited to rugged applications and is designed with reliability and long product life in mind. The mezzanine standard ĄĄ COM Express Mezzanine standard allows a wide variety of third party processor modules to be fitted to the custom ĄĄ Custom carrier card to suit the application carrier card and the processor module can be replaced, while keeping key function- ĄĄ Camera Link, CoaXPress and 3G-SDI ality identical. Supported operating systems include Windows Embedded, Linux, and also QNX. ĄĄ USB3, HDMI, GigE, eSATA Areas where COM Express products are widely used include markets with regu- ĄĄ PCIe expansion capability latory control and the requirement for high reliability as is the case for complex ĄĄ Stable product supply medical machines for X-ray, CT, and cancer treatment or machine vision in indus- tries like pharmaceutical packaging, quality control and food processing. Custom ĄĄ Rugged and highly reliable embedded systems are also commonly found in extremely rugged military appli- ĄĄ Extended temperature environment supported cations including UAV and in traffic markets such as speed cameras and vehicle identification. ĄĄ Ideal for long life products</p><p> picmg.opensystemsmedia.com/p372656</p><p>  Active Silicon  info@activesilicon.com  +44 (0) 1753 650 600 www.activesilicon.com https://uk.linkedin.com/company/active-silicon twitter.com/activesilicon www.picmg-systems.com PICMG Systems & Technology Resource Guide | Spring 2015 | 25 Com Express esource Guide</p><p> cExpress-BL COM Express® Type 6 Compact Module</p><p>The ADLINK cExpress-BL computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applica- tions. The cExpress-BL features a 5th Generation Intel® Core™ i7/i5/i3 processor and is suitable for fanless, edge device solutions that demand FEATURES intense graphics performance and multi-tasking capabilities in a space- ĄĄ ® ™ ™ constrained environment, such as digital signage for medical, transport 5th generation Intel Core i7/i5/i3 and Celeron processor System-on-Chip and retail, or machine vision applications in factory automation. R PICMG Systems & Technology ĄĄ Up to 16 GB dual channel DDR3L at 1600/1333 MHz ADLINK's cExpress-BL is also equipped with our Smart Embedded ĄĄ Two DDI channels, one LVDS supporting 3 independent displays Management Agent (SEMA) to allow access to detailed system activities ĄĄ Dual channel 18/24-bit LVDS (or optional eDP) at the device level, including temperature, voltage and power consump- ĄĄ Four PCIe x1 or 1 PCIe x4, Gigabit Ethernet tion. Information can be analyzed using our SEMA Cloud portal, which ĄĄ Four SATA 6 Gb/s, two USB 3.0, six USB 2.0 also provides users the ability to set alerts and connect and configure ĄĄ Supports Smart Embedded Management Agent (SEMA) functions one-to-many remote devices. ĄĄ Extreme Rugged™ operating temperature: -40 °C to +85 °C (optional)</p><p> picmg.opensystemsmedia.com/p372657</p><p>ADLINK  angela.torres@adlinktech.com  www.adlinktech.com/PD/web/PD_detail.php?cKind=&pid=1495 408-360-0200</p><p>COM Express</p><p>LSF-02</p><p>The LSF-02 is a rugged environmentally sealed tactical computing and communications platform, ideal for vehicle and man-pack applications. The LSF-02 was designed to be easily customizable. The COM-Express based architecture provides flexibility to meet different performance and power envelopes. Support for 2 Mini-PCIe slots provides options for FEATURES Mil-Std-1553, ARINC 429/575/717, CAN bus, WiFi or Cellular modems. ĄĄ Customizable Payload The platform also has room for 2 additional add in cards. Two optional 2 mini-PCIe expansion slots, Space for 2 additional add-in cards Mil-Std 2590 batteries allows the platform to be unmounted and be used 6.9" x 6.9" 7" x 6.83" in man-pack applications. ĄĄ Power • Computing: 9-36VDC Input, Optional dual Mil-2590 Batteries 4th Generation Intel Core i7-4700E 2.4GHz, QM87 Express Chipset, ĄĄ Physical 2 x 8GB DDR3L-1600 SO-DIMM dual channel 4.6"(H) x 9.5" (W) x 12.25" (L) • Storage: Removable 2.5" SSD, Optional mSATA Weight: <20 lbs Watertight to IP67 • I/O: 2 GbE, 4 USB 2.0, VGA Display port, RS-232 or RS-422/485 Operational: -40C to 70C (no handshaking signal) Shock: 30g/11ms per Mil-810F Method 516.5</p><p> picmg.opensystemsmedia.com/p372665</p><p>LCR Embedded Systems  Sales@lcrembedded.com  www.lcrembeddedsystems.com 1-800-747-5972</p><p>26 | Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com PICMG Systems & Technology CompactPCI</p><p>CompactPCI Solutions</p><p>Since its inception back in the mid 1990's CompactPCI has worked its way into some of the most mission critical applications on this planet. It can be R</p><p> found at the nerve-centre of the world's most hi-tech trains, at the core of the esource Guide telecommunication network, switching calls and providing critical signalling information in essential core network elements. In both its commercial and ruggedized form, CompactPCI controls industrial and chemical plants, while in the military arena it is employed for battle coor- dination managing vital communications and command functionality. Many top tier equipment providers have been deploying Advantech CompactPCI platforms within systems like these; systems upon which the world’s net- working infrastructure still relies, and upon which chemical plants and power stations depend for the safe and secure continuation of their processes. Advantech has been a key player in CompactPCI development for well over a Below are some of the latest products from Advantech’s decade now, assisting rugged and industrial OEMs as well as telecom equip- CompactPCI portfolio: ment manufacturers to design and integrate CompactPCI in their business and mission critical systems. We understand the impact which the discon- tinuation of a component can have on a customer’s product portfolio and we 3U CompactPCI and PlusIO Products have solid lifecycle management processes in place to handle it. We’ve also ĄĄ MIC-3022/3023 – learnt how to step in when a key supplier announces the end of a product line • 4U/3U CompactPCI® Enclosures for 3U Blades and a second source blade is urgently needed which meets the same form, fit and function. ĄĄ MIC-3328 – • 3U CompactPCI PlusIO Intel® Core™ i7 Processor Blade Customized COTS – ĄĄ Just What You Need When You Have a Unique Problem to Solve MIC-3325/3326 – • Intel® Atom™ N455/D525 Low Power Processor Blade Customization at Advantech doesn’t just stop at branding. We realise that no two suppliers’ seemingly identical CompactPCI blades are exactly the same ĄĄ MIC-3954 – and that features may differ in various ways like a missing I/O port or connec- • 3U CompactPCI PlusIO Serial Peripheral Carrier tor or often custom IPMI features which aren’t implemented. That’s where our ĄĄ MIC-3955 – Customized COTS (C2OTS) program comes into play. Because we design our • 4-port RS-232/422/485 Communication Card standard products with later customization in mind our processes are tailored to support the customized COTS business model. We offer significant flexibil- ĄĄ MIC-3756/3758 – ity over a “standard-product-only” roadmap by supporting changes ranging • 64-ch/128-ch Digital I/O Cards from branding, cost optimization, mechanical and schematic changes as well as the integration of a customer’s proprietary IP. We believe that this modus 6U CompactPCI Products operandi is critical to the long term success of CompactPCI and have adapted our development and manufacturing strategies to encourage customization ĄĄ MIC-3042/3043 – innovation, delivering complex CompactPCI products uniquely tailored to • 4U CompactPCI® Enclosures for 6U Blades meet customer’s needs without sacrificing the economy of scale offered by ĄĄ MIC-3398 – standard off the shelf products. • 6U SBC with Intel® Atom™ E3845/Celeron® J1900 Your OEM Blade ĄĄ MIC-3397 – There’s almost always a special feature that your customer needs you to • 6U SBC with Intel® Xeon® E3/Pentium® Processor integrate to meet a specific requirement. Its been that way since CompactPCI started and spans back even further to the early days of VMEbus. Mezzanine ĄĄ MIC-3396 – ® ™ card technology has evolved in various form factors and with different inter- • 6U SBC with 4th generation Intel Core processor connects help address the problems caused by over-customization. But when ĄĄ MIC-3395 MIL – the rubber meets the road and you can’t find that feature on COTS products, • Intel® Core™ i7 Rugged Processor Blade with ECC you need a partner who is ready to go the extra mile and is geared to help- ing you re-engineer a product to meet your needs. Advantech’s CompactPCI ĄĄ CPCI-8220 – customization team is here to identify and scope your special requests. • Freescale QorIQ P2040 Dual PMC Processor Board</p><p> picmg.opensystemsmedia.com/p372658</p><p>Advantech Co Ltd  ncg@advantech.com www.advantech.com/compactpci  twitter.com/AdvantechNCG</p><p> www.picmg-systems.com PICMG Systems & Technology Resource Guide | Spring 2015 | 27 CompactPCI esource Guide R</p><p>CompactPCI Serial Shelf Boards and Systems</p><p>Founded in 1972, EKF Elektronik has a long history in the embed- ded computing business. With a background of more than 30 years in modular eurocard system design, EKF is a leading vendor of CompactPCI technology, and offers continued lifecycle support for a wide range of ”classic“ CompactPCI products, in addition to the latest CPU boards, peripheral cards, and systems defined under the PICMG Systems & Technology PICMG CompactPCI Plus I/O and CompactPCI Serial standards. EKF EKF offers a wide range of the offers boards and systems for standard and extended temperature ranges, as well as sealing and coating on request. PMC and XMC latest CompactPI Serial shelf boards mezzanine modules expand the product portfolio. The EKF lifetime and systems, as well as policy guarantees long-term avail- ability for all EKF products, while a three-year standard warranty protects your investment. custom solution services.</p><p> picmg.opensystemsmedia.com/p372676</p><p>EKF Elektronik  sales@ekf.de  www.ekf.com 0049-2381-6890-0</p><p>CompactPCI</p><p>Intermas – InterRail</p><p>Intermas develops electronic enclosure systems: Cabinets, housings, subracks, and an extensive range of accessories for the 19" rack systems used in the fields of PCI, VME/VME64x, cPCI, IEEE, and communication applications with state-of-the-art EMI- and FEATURES RFI-shielded protection. ĄĄ InterRail® products meet tough physical demands and vibration Intermas has an extensive product range of more than 10,000 separate proofs used for railway engineering, traffic engineering, and power components and more than 30 years’ experience. station engineering. ĄĄ 19" subracks and housings with flexible internal layout. Go to ĄĄ EMI- and RFI-shielded protection using stable stainless steel www.Intermas-US.com contact springs ensuring permanent and reliable bonding. for our new catalog. ĄĄ Connectors and wiring accessories. ĄĄ Customization available.</p><p> picmg.opensystemsmedia.com/p372664</p><p>Intermas US LLC  intermas@intermas-us.com  www.Intermas-US.com 800-811-0236</p><p>28 | Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com PICMG Systems & Technology CompactPCI</p><p>G101, 3U flexible multiport Gigabit Ethernet switch</p><p>MEN Micro Inc. recently released the new G101, a managed 3U flex- ible multiport Gigabit Ethernet switch, with a 29 GBit/s switch matrix, implemented as a CompactPCI Serial board. Specifically designed for rugged mobile communication in harsh envi- ronments, the new Ethernet switch conforms to the EN 50155 railway R standard. The high bandwidth of the 29 GBit Switch matrix, robust design esource Guide and wide operating temperature of -40°C to +85°C make MEN Micro’s new G101 ideally suited for railway applications. FEATURES The G101 features a total of up to 25 Gigabit Ethernet ports. They can ĄĄ Managed 3U rugged Gigabit Ethernet switch all be connected to the rear or three can be used on the front, either as ĄĄ CompactPCI Serial design three robust M12 connectors or as two RJ45 connectors with a 2.5 Gb SFP interface. This interface can be used as a high speed uplink via fiber ĄĄ 29 Gbit/s carrier grade switch matrix technology. ĄĄ Up to 25 Gigabit Ethernet ports; all on rear I/O or 3 on front and The 29 GBit switch matrix incorporates different software protocols to 22 on rear ensure high speed and high efficiency and the large software pool enables ĄĄ Wide -40°C to +85°C operating temperature various protocols like security, synchronous Ethernet and stability as well ĄĄ EN 50155 compliant; rugged construction for reliable operation as for temperature needs. The G101 supports IEEE1588v2 on ports 1 to in harsh environments 12 and EEE (Energy Efficient Ethernet) as a standard on all ports. picmg.opensystemsmedia.com/p372666</p><p> MEN Micro Inc.  Stephen.Cunha@menmicro.com facebook.com/MENMicro www.menmicro.com www.linkedin.com/company/men-micro-inc- twitter.com/MENMicro </p><p>CompactPCI</p><p>NIU1A – Embedded I/O System – Nano Interface Unit</p><p>I/O Interface with optional ARM1 Processor Configure to Customize FEATURES The NIU1A is a small, rugged, low-power system. It consists of an integrated power supply, one function slot that can be configured with a field-proven ĄĄ Supports 1 Intelligent I/O function module NAI intelligent I/O and communications function module and an optional ĄĄ 2x 10/100/1000 Base-T Ethernet ARM Cortex-A9 processor. Ideally suited for rugged Mil-Aero applications, ĄĄ 1.5"H x 1.7"D x 6.8"L @ 16 oz. (454 g) with 3 mounting options the NIU1A delivers off-the-shelf solutions that accelerate deployment of ĄĄ 128 MB DDR3 SDRAM SWaP-optimized systems in air, land and sea applications. ĄĄ Optional ARM Cortex™-A9 Dual Core 800MHz Processor Architected for Versatility ĄĄ 4 GB SATA II NAND Flash (up to 32 GB option) ™ ™ NAI’s Custom-On-Standard Architecture (COSA ) offers a choice of over ĄĄ < 15 W power dissipation 40 intelligent I/O and communications options. Pre-existing, fully-tested ĄĄ Wind River® Linux, VxWorks®, Altera Linux OS Support functions can be selected to quickly and easily meet system requirements. Individually dedicated I/O and communications processors allow mission ĄĄ 1x RS232 computers to manage, monitor and control via single or dual Ethernet. ĄĄ Continuous Background BIT All products are designed to operate under extreme temperature, shock, ĄĄ Operating temp: -40°C to +71°C conduction cooled vibration and EMI environments. EMI filters and gaskets meet or exceed Made in the USA MIL-STD-461F and MIL-STD-810G requirements. ĄĄ 28 VDC input Certified Small Business picmg.opensystemsmedia.com/p372667</p><p>North Atlantic Industries, Inc.  www.naii.com  www.naii.com 631-567-1100 www.picmg-systems.com PICMG Systems & Technology Resource Guide | Spring 2015 | 29 CompactPCI esource Guide R</p><p> cPCI, PXI, VME, Custom Packaging Solutions</p><p>VME and VME64x, CompactPCI, or PXI chassis are available in many configurations from 1U to 12U, 2 to 21 slots, with many power options up to 1,200 watts. Dual hot-swap is available in AC or DC versions. We have in-house design, manufacturing capabilities, and in-process controls. All Vector chassis and backplanes are manufactured in the USA and are available with PICMG Systems & Technology custom modifications and the shortest lead times in the industry.</p><p>Series 2370 chassis offer the lowest profile per slot. Cards are inserted horizontally from the front, and 80mm rear I/O backplane slot configuration is also available. Chassis are available from 1U, 2 slots up to 7U, 12 slots for VME, CompactPCI, or PXI. All chassis are IEEE 1101.10/11 compliant with hot-swap, plug-in AC or DC power options. FEATURES</p><p>Our Series 400 enclosures feature side-filtered air intake and rear ĄĄ Made in the USA exhaust for up to 21 vertical cards. Options include hot-swap, plug-in AC or DC power, and system voltage/temperature monitor. ĄĄ Most rack accessories ship from stock Embedded power supplies are available up to 1,200 watts.</p><p>Series 790 is MIL-STD-461D/E compliant and certified, economi- ĄĄ Modified ‘standards’ and customization are our specialty cal, and lighter weight than most enclosures available today. It is available in 3U, 4U, and 5U models up to 7 horizontal slots. ĄĄ Card sizes from 3U x 160mm to 9U x 400mm</p><p>All Vector chassis are available for custom modification in the ĄĄ System monitoring option (CMM) shortest time frame. Many factory paint colors are available and can be specified with Federal Standard or RAL numbers. ĄĄ AC or DC power input</p><p>ĄĄ Power options up to 1,200 watts For more detailed product information, please visit www.vectorelect.com or call 1-800-423-5659 and discuss your application with a Vector representative.</p><p> picmg.opensystemsmedia.com/p371649</p><p>Vector Electronics & Technology, Inc.  inquire@vectorelect.com www.vectorelect.com  800-423-5659</p><p>30 | Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com PICMG Systems & Technology R CompactPCI</p><p> cPCI-VPX-VME Packaging Solutions</p><p>Pixus Technologies provides Eurocard packaging solutions for CompactPCI, FEATURES VPX, and VME architectures. Pixus supports a wide range of telecom, CompactPCI esource Guide industrial, military, aerospace, scientific, medical, and transportation ĄĄ 1U – 13U rackmount and desktop units supporting 2 to 21 slot cPCI applications. backplanes ĄĄ Conform to CompactPCI PICMG 2.0 specification Pixus CompactPCI, VPX, and VME packaging solutions include subracks, enclosures, backplanes, chassis, and integrated system platforms. In VPX & OpenVPX ĄĄ 1U – 9U rackmount and desktop units supporting 2 to 21 slot VPX and addition, Pixus provides components and accessories such as fans, power OpenVPX backplanes supplies, card guides, guide rails, front panels, filler panels, and handles. ĄĄ Complies with VITA 46, VITA 48, VITA 65 VITA 1, VITA 1.1, IEC 60 MicroTCA systems from Pixus leverage over 20 years of superior cooling, 297-3 and IEEE 1101.1/1101.10/1101.11 backplane, and packaging innovation with proven Pixus and Rittal tech- VME & VME64x nologies. MicroTCA chassis and systems can be modified to meet customer ĄĄ 1U – 9U rackmount and desktop units supporting 2 to 21 slot VME requirements without NRE. and VME64x backplanes ĄĄ Complies with VITA 1, VITA 1.1, IEC 60 297-3 and IEEE 1101.1/1101.10/1101.11</p><p>Enclosures Cases Subracks Backplanes Chassis Integrated Systems Components picmg.opensystemsmedia.com/p372669</p><p>Pixus Technologies  sales@pixustechnologies.com  www.pixustechnologies.com 519-885-5775</p><p>Front Panel Hardware</p><p>Faceplate Hardware</p><p>Southco AdvancedTCA access and alignment hardware provides the total solution of all faceplate hardware needed for complete PICMG 3.0 compliance. FEATURES These ergonomic Southco handles secure AdvancedTCA faceplates. The ĄĄ Push-to-close handles actuate microswitches, while spring-loaded handles also ensure proper interface with microswitches to signal a secondary catches lock boards in position graceful power-down sequence during hot-swap operation. All Southco ĄĄ Narrow handle design takes minimal space, yet provides ample AdvancedTCA compliant hardware can be tailored to user-specified ergonomic grip for easy board removal configurations. ĄĄ Handles fit faceplates from 0.8 mm to 2.5 mm thick and Optional custom-color powder-coated handles are available to enhance accommodate lever-, plunger-, or custom-microswitches ĄĄ aesthetics or color-code components. Captive screws are available in multiple styles for easy manual tightening, including color-coated knobs All of these Southco solutions provide finishes that are RoHS-compliant ĄĄ Alignment/grounding pins in multiple lengths feature smooth bullet and other attributes gained from years of Southco access hardware nose design for easy alignment/insertion experience – such as robust diecast construction, ergonomic molded ĄĄ Alignment and keying modules in multiple pin/receptacle handle grips, and precision machining to ensure precise fit. configurations are economical and extremely durable</p><p> picmg.opensystemsmedia.com/p372533</p><p>Southco  info@southco.com www.southco.com/ATCAresource  610-459-4000 www.picmg-systems.com PICMG Systems & Technology Resource Guide | Spring 2015 | 31 DSP-FPGA Boards esource Guide R</p><p>Wild40 Seven Slot OpenVPX 3U Chassis</p><p>The Wild40 Seven Slot OpenVPX 3U Chassis is an OpenVPX-compati- ble chassis capable of accepting up to six 3U tall by 160mm OpenVPX Payload Front Plug-in Modules (FPMs) and one 3U tall by 160mm OpenVPX Switch FPM and up to seven 3U tall by 80mm Rear ''''Tran- sition Modules (RTMs). Plug-in Module slot spacing is 1″.</p><p>PICMG Systems & Technology This chassis is equipped with a very high performance backplane which is capable of Serial I/O signaling at rates up to 10Gbps on the Data and Expansion Planes. The Data Plane of the backplane is con- FEATURES nected to adjacent slots with one Fat Pipe connection. The Expansion ĄĄ 6U High with Front Mounted OpenVPX Card Cage Plane is a 3 slot star with two Fat Pipes connecting slots. ĄĄ 7 Slot OpenVPX 40Gb+ Mesh Backplane with RTM Support The Wild40 Seven Slot OpenVPX 3U Chassis includes a Chassis Moni- toring system which displays DC voltages, slot temperatures and fan ĄĄ 1534 Watt Power Supply Revolutions Per Minute (RPMs) on the front panel of the chassis and ĄĄ Radial clocking for AUXCLK and REFCLK with chassis input can be used to set fan speed. The Chassis Monitor can be accessed SMAs and controlled remotely via the Serial or Ethernet interfaces. ĄĄ Payload Profile: SLT3-PAY-2F1F2U-14.2.1 and The card cage is recessed from the front of the chassis so that cabling SLT3-PAY-2F4F2U-14.2.11 can be used between Plug-in Modules and be contained within the ĄĄ Switch Profile: SLT3-SWH-2F24U-14.4.3 or frame of the chassis. SLT3-SWH-2F4T16U-14.4.11</p><p>Annapolis is famous for the high quality of our products and for our unparalleled dedication to ensuring that the customer’s applications succeed.</p><p>We offer training and exceptional special application development support, as well as more conventional support.</p><p> picmg.opensystemsmedia.com/p372672</p><p>Annapolis Micro Systems, Inc.  wfinfo@annapmicro.com www.annapmicro.com  410-841-2514</p><p>32 | Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com PICMG Systems & Technology DSP-FPGA Boards</p><p>Wild40 12-Slot OpenVPX 6U Chassis</p><p>11U Rack mountable, 12-slot OpenVPX chassis with OpenVPX R switched topology backplane capable of 10Gbps+ signalling com- esource Guide promising of 2 switch and 10 payload 1" slots. Option of additional secondary 4-slot OpenVPX power-only (Shown) or 5-slot VME/VXS backplane.</p><p>The Wild40 12-Slot OpenVPX 6U Chassis is an OpenVPX-compatible (VITA 65) chassis capable of accepting up to ten 6U tall by 160mm OpenVPX Payload Front Plug-in Modules (FPMs) and two 6U tall by 160mm OpenVPX Switch FPMs and up to twelve 6U tall by 80mm FEATURES Rear Transition Modules (RTMs) in its Primary Backplane. Plug-in Module slot spacing is 1″ VITA 48.1. ĄĄ 10U High with Front Mounted OpenVPX Card Cage</p><p>The Wild40 12-Slot OpenVPX 6U Chassis’ Primary Backplane is a very ĄĄ Primary 12 Slot OpenVPX High Speed Switched Backplane with high performance backplane which is capable of Serial I/O signaling at RTM Support rates up to 10Gbps on the Data Plane and up to 8Gbps on the Expan- ĄĄ Optional Secondary 5 Slot VME/VXS or 4 slot VPX Backplane sion Plane. The Data Plane of the backplane is arranged in a dual-star for Power Only Payload Cards configuration with two Fat Pipe connections from each Switch Slot to each Payload Slot. The Expansion Plane is a chain connecting adjacent ĄĄ Up to 3200 Watt Power Supply Payload Slots. ĄĄ Backplane Profile: BKP6-CEN12-11.2.X In addition to the Primary Backplane there is also an option for a Sec- ondary 4-Slot VPX Power-Only or 5-slot VME/VXS Backplane. The ĄĄ Payload Profile: SLT6-PAY-4F1Q2U2T-10.2.1 4-slot VPX backplane supports four OpenVPX VITA65 slots with a 1″ ĄĄ Switch Profile: SLT6-SWH-16U20F-10.4.2 VITA 48.1 slot spacing. These slots are not connected to each other on the Data or Expansion Planes, instead all of their connections go straight through the backplane to the RTM backplane connectors. These slots are ideally suited for Clock Distribution boards, Tuners or Annapolis is famous for the high quality other non-IO intensive FPMs. of our products and for our unparalleled The chassis includes a Chassis Monitoring system which displays DC voltages, slot temperatures and fan Revolutions Per Minute (RPMs) dedication to ensuring that the customer’s on the front panel of the chassis and can be used to set fan speed. applications succeed. The Chassis Monitor can be accessed and controlled remotely via the Serial or Ethernet interfaces. We offer training and exceptional special The card cage is recessed from the front of the chassis so that cabling application development support, as well as can be used between Plug-in Modules and be contained within the frame of the chassis. more conventional support.</p><p> picmg.opensystemsmedia.com/p372673</p><p>Annapolis Micro Systems, Inc.  wfinfo@annapmicro.com www.annapmicro.com  410-841-2514</p><p> www.picmg-systems.com PICMG Systems & Technology Resource Guide | Spring 2015 | 33 DSP-FPGA Boards esource Guide</p><p>WILD Data Storage Solution </p><p>When Storage capability is needed, Annapolis offers the highest density OpenVPX storage solutions on the market with up to 9.3 TB of capacity in a single 1" slot with up to 4.5 GB/s of write band- width. It also features a removable hot swappable canister with a connector rated for 10,000+ mating cycles. The WILD Data Storage R PICMG Systems & Technology Solution comes with standard images to support XAUI, 40GbE and AnnapMicro Protocol (Annapolis low FPGA utilization, full flow control protocol ideal for inter-FPGA communication).</p><p>The WILD Data Storage Solution is comprised of two pieces fitting in FEATURES a single 1" OpenVPX slot, the “storage canister” which holds up to 12 1.8" SATA disks, and the “Storage Carrier” that plugs into the VPX ĄĄ General Features • 9.3 TB of Storage Per Each 6U VITA 65 Compliant OpenVPX Slot backplane and holds the disk canister. • Up to 4.5 GB/s Write and Up to 5 GB/s Read Bandwidth (write The Storage Carrier/Canister is specifically designed to sup- bandwidth determined by system environmentals) • Scalable Depth and Bandwidth port 10,000+ insertion cycles of the disk canister for frequent • Hot Swappable Drive Canister with 10,000 Insertion Cycles & Hot drive removal. Both the canister and the entire assembly (Storage Swappable Carrier (exclusive to WILDSTAR OpenVPX EcoSystem) Canister + Storage Carrier) are also hot swappable for minimum ĄĄ system down time and highest reliability. This OpenVPX compliant Backplane I/O • Up to 40Gb Ethernet on each of Four Fat Pipes on P1, for a total of payload card supports 40Gb serial I/O on the VPX Data Plane on P1 to 20GB/s on P1 support four channels of 40GbE (proper backplane required for faster • 1 Additional Fat Pipe on P4 providing QSFP+ connection via RTM rates). • 1Gb Ethernet Connection on P4</p><p>To ensure safe and reliable processing, WILD Data Storage Solution ĄĄ System Management boards come equipped with a proactive thermal management system. • Client/Server Interface for WILDSTAR FPGA Boards and Linux and Windows-based CPU systems Sensors across the board monitor power and temperature, with auto- • Extensive System and Drive Diagnostic Monitoring and matic shutdown capability to prevent excessive heat buildup. WILD Configuration over 1 Gb Ethernet via P1 and P4 Ethernet Data Storage Solution boards are built with a rugged, durable design. • Standard Intelligent Platform Management Interface (IPMI) to Sensors can be accessed with a chassis manager (ChMC). Monitor Current, Voltage and Temperature • Front Panel Status LEDs for all 12 SSDs and all Backplane Control New heatsinks have been tested with great success on WILD Data and Data Plane Connections Storage Solution boards. These larger heatsinks also act as stiffeners ĄĄ Physical Features for the boards, making them sturdier. • 6U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX Payload Profile: MOD6-PAY-4F1Q2U2T-12.2.1-n • Integrated Heat Sink • Air Cooled with Product Path to Conduction Cooling</p><p> picmg.opensystemsmedia.com/p372456</p><p>Annapolis Micro Systems, Inc.  wfinfo@annapmicro.com www.annapmicro.com  410-841-2514</p><p>34 | Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com PICMG Systems & Technology R DSP-FPGA Boards</p><p>WILD OpenVPX 40 Gb Ethernet and FDR Infiniband Switch</p><p>The WILD OpenVPX 14Gbit Switch Card supports 1GbE, XAUI, 10GbE, esource Guide 40GbE, 56GbE, and SDR/DDR/QDR/FDR Infiniband. It has dual 1/10GbE SFP+ front panel control plane uplinks and eight front panel data plane QSFPs. It supports up to 20 1GbE backplane control plane connections and 20 XAUI/40GbE/Infiniband data plane connections.</p><p>The WILD OpenVPX 14Gbit Switch Card is extremely versatile since it is capable of switching both Infiniband (SDR, DDR, QDR, FDR) and Ethernet (1Gb, 10Gb, 40Gb, 56Gb) traffic with up to 4 Tb/s of non- blocking switching capacity. The WILD OpenVPX 40 Gb Ethernet and FDR Infiniband Switch also supports chassis management and can act as a Chassis Manager (ChMC). The 1Gb Ethernet control plane supports up to 20 backplane ports and two front panel SFP+ which FEATURES can run at 1GbE or 10GbE. The data and control planes are located on ĄĄ MultiProtocol Switch different virtual networks to ensure best performance on each. • 1/10/40/56 Gb Ethernet and SDR/DDR/QDR/FDR Infiniband • Up to Four Tb/s Non-Blocking Switching Capacity with up to Eight Basic configuration is streamlined where all required features are Switch Partitions selected by DIP switches. A front panel USB serial port allows con- figuration of management Ethernet interfaces if needed (DHCP is the ĄĄ Backplane & Front panel I/O default configuration). Software updates, if needed, are completed via • Backplane Ports: Twenty High Speed Four Lane Data Plane Connections, Sixteen 1Gb Ethernet Lanes a simple web interface which can also be disabled via USB serial con- • Front Panel Ports: Eight QSFP+, Two SFP+, RJ45 Management sole. Front panel status LEDs show the status of every switch port Port, USB UART, Status LEDs (link/activity) as well as overall status and health of the WILD Open- • Each Backplane and Front Panel Port can be Configured for either VPX 40 Gb Ethernet and FDR Infiniband Switch. Infiniband or Ethernet • Infiniband and IP Routing The front panel RJ45 10/100/1000 BASE-T Ethernet port is used for • Ethernet Gateways switch management and is connected directly to the on-board Pow- ĄĄ System Management erPC. There is also an optional “in band” Ethernet connection from the • System Management using Intelligent Platform Management PowerPC to the control plane. Note that not all switch configurations Interface (IPMI) support the “in-band” management connection. • Diagnostic monitoring and configuration • Current, Voltage and Temperature Monitoring Sensors • Hot Swappable (exclusive to WILDSTAR OpenVPX EcoSystem)</p><p>ĄĄ Mechanical and Environmental • 6U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX Slot Profile: SLT6-SWH-16U20F-10.4.2-n • Integrated Heat Sink and Board Stiffener</p><p> picmg.opensystemsmedia.com/p372674</p><p>Annapolis Micro Systems, Inc.  wfinfo@annapmicro.com www.annapmicro.com  410-841-2514</p><p> www.picmg-systems.com PICMG Systems & Technology Resource Guide | Spring 2015 | 35 DSP-FPGA Boards esource Guide R</p><p>WILDSTAR 7 for OpenVPX 3U</p><p>The WILDSTAR 7 for OpenVPX 3U contains one VX690T or VX980T Virtex 7 FPGA per board with up to 2 GB of DDR3 DRAM for 12.8 GB/s of DRAM bandwidth and up to 32 MB of QDRII+ SRAM for 8 GB/s of SRAM bandwidth. It has up to 1 million logic cells and 1.6 million multiplier bits per board. FEATURES These FPGA boards include a Xilinx Virtex 7 FPGA with 64 High Speed </p><p>PICMG Systems & Technology Serial connections performing up to 13.1 Gbps. There is two 36-bit ĄĄ General Features • One Xilinx Virtex 7 VX690T or VX980T FPGA QDRII+ SRAM interfaces clocked up to 500 MHz and two 32-bit • Up to 2 GB of DDR3 DRAM for 12.8 GB/s of DRAM bandwidth DDR3 DRAM ports clocked at up to 800 MHz. • Up to 32 MB of QDRII+ SRAM for 8 GB/s of SRAM bandwidth ĄĄ Backplane I/O With included High Speed Serial (HSS) FPGA cores (including • 24x High Speed Serial IO lanes to VPX Backplane (P1/P2) for 30 GB/s of Full 40GBASE-KR), there is up 10 GB/s of bandwidth on the VPX data Duplex Bandwidth • Two PCIe Gen3 8x Connections to VPX Backplane (P1) plane which can go directly to other VPX cards or to a switch, depend- • Eight LVDS lines to P2 ing on backplane topology. In addition, there is up to 20 GB/s of • Backplane Protocol Agnostic connections support 10/40Gb Ethernet, bandwidth on the VPX Expansion Place. When using 40GBASE-KR, SDR/DDR/QDR Infiniband, AnnapMicro protocol and user designed protocols • External clock and IRIG-B Support via Backplane there is the added reliability of Forward Error Correction (FEC) to • Radial Backplane Clock Support for OpenVPX backplane signals AUXCLK achieve a much lower Bit Error Rate (BER). and REFCLK ĄĄ Front Panel I/O If IO is required, Annapolis offers extraordinary density, bandwidth • Accepts Standard Annapolis WILDSTAR Mezzanine Cards, including a wide and analog conversion choices. Each 3U card has 1 mezzanine IO sites variety of WILDSTAR ADC and DAC Mezzanine Cards • Three optional built-in Front Panel QSFP+ Transceivers running at up to which can support up to 2 WILDSTAR Mezzanine cards as well as a 52.4 Gbps each for 39 GB/s of Full Duplex Bandwidth QSFP+ option (on WS7 and WS A5 board) that allows for 3 QSFP+ • Simultaneous QSFP and Mezzanine Card use • QSFP+ Protocol Agnostic connections support 10/40Gb Ethernet, transceivers per slot. These options can be mix and matched to meet SDR/DDR/QDR Infiniband, AnnapMicro protocol and userdesigned protocols customer needs. Some configurations utilize a second slot (for exam- ĄĄ Dual Core Processor APM86290 ple the QSFP+ option and WILDSTAR Mezzanine card used in a single • Host Software: Linux API and Device Drivers IO Site). • Each core runs up to 1.2 GHz • 2 GB of DDR3 DRAM WILDSTAR A5 and V7 FPGA boards are hot swappable allowing for • 4 GB SATA SSD and 16MB NOR Boot Flash • 4x PCIe Gen2 connection to Virtex 7 FPGA more system reliability. This feature is unique to Annapolis and was ĄĄ Application Development developed because our experience with OpenVPX systems has shown • Full CoreFire Next™ Board Support Package for Fast and Easy Application it invaluable so a whole chassis does not need to be shutdown to Development • 10/40Gb Ethernet and AnnapMicro Protocol Cores Included remove a single board. • Open VHDL Model including Source Code for Hardware Interfaces • Open VHDL IP Package for Communication Interfaces Annapolis OpenVPX FPGA cards include an on-board dual core • Chipscope Access through RTM 1.2 GHz PowerPC with direct FPGA 4x PCIe connection which can be ĄĄ System Management used by customers for application requirements. It is also used query • System Management using Intelligent Platform Management Interface (IPMI) board health like FPGA temperature and power. It is connected to the • Diagnostic monitoring and configuration • Current, Voltage and Temperature Monitoring Sensors OpenVPX control plane via 1GbE. • Hot Swappable (exclusive to WILDSTAR OpenVPX EcoSystem) There are also plenty of user backplane signals available on the ĄĄ Mechanical and Environmental • 3U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing Annapolis 6U Rear Transition Module (RTM) such as LVDS, FPGA • Supports OpenVPX payload profile: MOD3-PAY-2F4F2U-16.2.10-n HSS, IRIG, Ethernet and clocking. RTM HSS is also capable of 10Gbps • Integrated Heat Sink and Board Stiffener • Available in Extended Temperature Grades signalling and supports multiple channels of 40GbE. • Air Cooled with Conduction Cooled path • RTM available for additional I/O</p><p> picmg.opensystemsmedia.com/p372457</p><p>Annapolis Micro Systems, Inc.  wfinfo@annapmicro.com www.annapmicro.com  410-841-2514</p><p>36 | Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com PICMG Systems & Technology DSP-FPGA Boards</p><p>WILDSTAR G2 Dual 1.5 GSps 12-Bit ADC & DAC Mezzanine Card R</p><p>This ultra low latency Dual 1.5GSps ADC/DAC card is specifically esource Guide designed for DRFM applications with 24ns latency from SMA to SMA. </p><p>The WILDSTAR G2 Dual 1.5 GSps 12-Bit ADC & DAC Mezzanine Card was designed from the ground up for latency sensitive DRFM appli- FEATURES cations. The Board Support Interface, which is available in VHDL or ĄĄ General Features CoreFire Application Design Suite, was also designed from the begin- • Dual Channel ADCs and DACs running at up to 1500MSps each ning to be suited for DRFM applications. This interface provides a at 12-bits Digital Bypass Mode to achieve the lowest possible latency and • Ultra Low latency from ADC SMA input to DAC SMA output • Digital Bypass Mode (SMA-to-SMA): < 24ns a Fabric Space Mode to allow the user to do additional processing • Fabric Space Mode (SMA-to-SMA): < 39ns and manipulation of the ADC data before returning it out the DAC. • Digital Bypass Mode has built-in run-time adjustable delay providing additional delay from 0ns up to 62 Sclk periods The Fabric Space Mode adds only 14ns of latency. The Board • Capability to have four ADC channels and four DAC channels in Support Interface also includes a built-in Bypass Delay which can be one 6U OpenVPX slot when plugged into WILDSTAR OpenVPX FPGA cards controlled to be from 0 to 62 ADC sample clock periods. This allows • Support for WILDSTAR 7 (Xilinx Virtex™-7) and WILDSTAR A5 the user to “walk” the latency out from the minimum Digital Bypass (Altera Stratix® V) PCIe and OpenVPX mainboards Mode latency to slightly beyond the Fabric Space Latency, providing • Firmware and Software Board Support Interface provided in CoreFire Next and VHDL source for a smooth latency transition between the two modes. ĄĄ ADC and DAC and Performance The CoreFire Next Design Suite, Annapolis’ FPGA Design Tool, allows • Sample Rate: 300 – 1500MHz the user to design a 24ns latency DRFM-optimized application in • ADC and DAC Resolution: 12 bits minutes. ĄĄ SMA I/O • Two Analog Inputs The WILDSTAR G2 Dual 1.5 GSps 12-Bit ADC & DAC Mezzanine Card • Two Analog Outputs is shipped with a custom heatsink which enables proper cooling of the • One High Precision Trigger Input • One External Clock Input ADC. An on-board temperature monitor is also supplied which allows • Mechanical and Environmental for real-time monitoring of the ADC’s internal die temperature. ĄĄ Mechanical and Environmental The WILDSTAR G2 Dual 1.5 GSps 12-Bit ADC & DAC Mezzanine • Integrated Heatsink and EMI/Crosstalk Shields • Commercial and Industrial Temperatures Available Card provides high fidelity and high speed analog-to-digital conver- sion along with a rugged design. This card is compatible with with ĄĄ Clock Synchronization • Software-selectable external clock input or onboard clock WILDSTAR 7 and WILDSTAR A5 mainboards. • All ADCs on a mezzanine card are synchronized to the same sample • All ADCs across multiple mezzanine cards can be synchronized to the same sample using • WILDSTAR Clock Distribution Boards • Provides capability to configure 40+ ADC and DAC channels in one COTS Annapolis 19" OpenVPX Chassis</p><p> picmg.opensystemsmedia.com/p372675</p><p>Annapolis Micro Systems, Inc.  wfinfo@annapmicro.com www.annapmicro.com  410-841-2514</p><p> www.picmg-systems.com PICMG Systems & Technology Resource Guide | Spring 2015 | 37 Mezzanines esource Guide R PCIe-Mini-1553-2</p><p>The MIL-STD-1553 (1553) PCIe-Mini expansion module is a 2 Channel dual redundant 1553 controller module, where each controller can support BC or Multi-RT with Concurrent bus monitor. The controller can support the MIL-STD-1553 A/B and the MIL-STD-1760 traffic. This module can operate in a Mini PCI Express slot. Utilizing the DDC Total-AceXtreme® Engine, this 1553 card is able to perform: FEATURES 1553 Bus Monitor (MT) ĄĄ 1x Mini PCI Express Gen 1.0 • IRIG-106 Chapter 10 Compatibility • Filter Based on RT Address, T/R bit, Sub-Address ĄĄ Dual Independent Dual Redundant MIL-STD-1553 Channel • Advanced Bit Level Error Detection to Isolate Bus Failures ĄĄ Two independent DDC Total-AceXtreme® Engine PICMG Systems & Technology 1553 Remote Terminal (RT) ĄĄ BC or Multi-RT with Concurrent Bus Monitor • Emulate up to 32 RT Addresses Simultaneously ĄĄ Programmable Bus Controller, Remote Terminal or Bus Monitor • Multiple Buffering Techniques • Programmable Command Illegalization ĄĄ Supports MIL-STD-1553 A/B and MIL-STD-1760 • Programmable Busy by Sub-address ĄĄ IRIG-106 Chapter 10 MT Support 1553 Bus Controller (BC) ĄĄ Optional 8 I/O Lines • Streaming and Minor/Major Frame Scheduling of Messages ĄĄ Optional Digital Irig Input • High and Low Priority Asynchronous Message Insertion ® ® ® • Modify Messages or Data while BC is running ĄĄ Support for Linux , Windows , VxWorks drivers picmg.opensystemsmedia.com/p372660</p><p>ALPHI Technology Corporation  Support@Alphitech.com  www.Alphitech.com 480-838-2428</p><p>Mezzanines</p><p>XMC Removable CFast Module The XMC Removable CFast Module is a mezzanine storage module FEATURES with a dual-channel PCI Express to SATA 3 controller that is rated for a temperature range of -40C to +85C. ĄĄ Adds removable SSD to your ATCA, cPCI SBC ĄĄ Boot or Storage Provides boot drive and/or disk storage for VPX, VME, cPCI, and ATCA ĄĄ XMC PCIe Gen2 x1 interface per VITA 42.3 SBCs with XMC slot. ĄĄ Air or conduction cooled CFast is same form factor as Compact Flash but with SATA interface thus ĄĄ Uses COTS CFast drives providing faster throughput. The CFast connectors are rated for 10,000 ĄĄ CFast secured by rugged retainer clip mating cycles to support frequent insertions/removals. ĄĄ 10,000 mating cycles ĄĄ CFast capacities currently up to 120GB ĄĄ 1.8" SATA version available (up to 800GB) ĄĄ PMC versions also available ĄĄ Drivers for Windows, Linux and VxWorks</p><p> picmg.opensystemsmedia.com/p372671</p><p>Red Rock Technologies  www.redrocktech.com info@redrocktech.com </p><p>38 | Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com PICMG Systems & Technology MicroTCA</p><p>Low Cost mTCA</p><p>Asis has managed to break the mTCA chassis cost barriers without </p><p>FEATURES R compromising on the standard’s advanced features and performance. ASIS mTCA chassis’ unique architecture enables the use of “off-the-shelf“ ĄĄ Low cost – supports the use of “off-the-shelf” server PSUs and esource Guide simplified fan tray modules. server PSUs and simplified fan tray modules, while still maintaining distributed power and smart fans, as required by the mTCA standard. ĄĄ Fully redundant – redundant FAN Trays and power supplies. ĄĄ High-Power Cooling – cooling power of up to 80 watts per " • Form factor – 2U; 19 AMC/MCH. • 10G/40G Backplane ĄĄ AC Power Supply – Dual Redundant 1kW hot swappable PSU units. • 12 mid- or compact AMCs (80W each) ĄĄ High-speed Backplane – 10/40 GbE fat pipe; 1GbE for Management, IPMI for FRU’s. • 2 MCH ĄĄ AC/DC configurations – AC 110-230 VDC. • 300mm depth ĄĄ Compliance – EIA Compliant; RoHS Compliant; PICMG MicroTCA.0 • Fully redundant chassis (fan trays and power supplies) R1.0 ĄĄ Option for lower cost – Non-Redundant system.</p><p> picmg.opensystemsmedia.com/p372663</p><p>Asis Ltd.  sales@asis-pro.com  www.asis-pro.com 408-215-1510</p><p>MicroTCA</p><p>MicroTCA® Systems</p><p>Pixus Technologies’ MicroTCA® chassis and systems are based on the PICMG® MicroTCA.0 R1.0 specification. The 1U and 3U platforms support up to 8 AMC FEATURES modules to provide a superior level of flexibility and compute density. PXS1PXS0108 1U MicroTCA® Chassis With support for AC and DC input power, the 19" rackmount systems support ĄĄ Low cost MicroTCA platform a range of applications at the edge of the network in telecom, industrial, and ĄĄ Active backplane removes the need for expensive Power Entry Modules military environments. Applications include network appliances, deep packet (PEMs) inspection, surveillance, protocol conversion, and SIGINT. ĄĄ Side-to-side push-pull cooling removes the need for expensive Cooling Units (CMs) MicroTCA systems from Pixus leverage over 20 years of superior cooling, ĄĄ Supports up to 6 mid-height AMCs backplane, and packaging innovation with proven Pixus and Rittal tech- ĄĄ Supports 2 MCHs nologies. MicroTCA chassis and systems can be modified to meet customer ® requirements without NRE. PXS0309 3U ATCA Hybrid Chassis with 8 AMCs ĄĄ 19" rack mount 3U ATCA Hybrid AMC Chassis ĄĄ 1 ATCA slot and 8 mid-size AMC slots ĄĄ 40GbE or 10GbE fabric across the backplane </p><p>Enclosures Cases Subracks Backplanes Chassis Integrated Systems Components picmg.opensystemsmedia.com/p372670</p><p>Pixus Technologies  sales@pixustechnologies.com  www.pixustechnologies.com 519-885-5775 www.picmg-systems.com PICMG Systems & Technology Resource Guide | Spring 2015 | 39 </p> </div> </article> </div> </div> </div> <script type="text/javascript" async crossorigin="anonymous" src="https://pagead2.googlesyndication.com/pagead/js/adsbygoogle.js?client=ca-pub-8519364510543070"></script> <script src="https://cdnjs.cloudflare.com/ajax/libs/jquery/3.6.1/jquery.min.js" crossorigin="anonymous" referrerpolicy="no-referrer"></script> <script> var docId = 'ff0664a2189eb0a0481046e972a50146'; var endPage = 1; var totalPage = 40; var pfLoading = false; window.addEventListener('scroll', function () { if (pfLoading) return; var $now = $('.article-imgview .pf').eq(endPage - 1); if (document.documentElement.scrollTop + $(window).height() > $now.offset().top) { pfLoading = true; endPage++; if (endPage > totalPage) return; var imgEle = new Image(); var imgsrc = "//data.docslib.org/img/ff0664a2189eb0a0481046e972a50146-" + endPage + (endPage > 3 ? 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