Email: [email protected] Jiaxing Cheng Address: 360 Huntington Ave, Boston, MA 02115-5005 Tel: 1(857)210-9741 Education

09/2017 - Present: Ph. D. Candidate in Solid Mechanics, (SEU), , , . Advisor: Prof. Zhaoxia Li 09/2014 - 07/2017: Master of Forestry Engineering, Southwest Forestry University (SWFU), Kunming, , China. Advisor: Prof. Dongfa Sheng 09/2010 - 07/2014: Bachelor of , University College of Science and Technology (NCU&CST), Nanchang, , China. Professional Experience

09/2017 – Present: Ph.D. student in Prof. Zhaoxia Li’s Group at SEU l Project about Electromechanical fatigue damage theory and lifetime evaluation of flexible electronics (Funded by Graduate Innovation Project of Jiangsu Province at SEU) l Research on fatigue reliability of existing industrial building structures (Funded by the National Program on Key Research Project (2016YFC0701301-02)) l Participated in MEMS manufacturing process training organized by MEMS Consulting Company，July 2018 06/2015 – 06/2017: Master student in Prof. Dongfa Sheng’s Group at SWFU l C0-PI of the Fracture Mechanics Analysis of Quasicrystals (Funded by Discipline Infrastructure Research Project of Civil Engineering Institute at SWFU) Honors and Awards

10/2018: Recipient of the First-class Graduate Scholarship, Nanjing, China 07/2018: Best Poster Award at the 1st International Conference on Flexible Electronics (ICFE 2018), Hangzhou, China 06/2017: Best Graduate Paper Award of Southwest Forestry University 10/2016: Recipient of Yunnan Postgraduate Scholarships 06/2014: Outstanding Graduate in College of Science Technology Publications

Journal Papers Submitted:

1. J X cheng, B Sun, Z X Li, “An Electric Resistance Degradation Model of Thin Film on Flexible Substrate Due to Nano-Cracks in Grains and Fatigue Damage Evolution”, (U nder Review)

Published or accepted: 2. J X Cheng, B Sun, M Y Wang, Z X Li, “ Analysis of III crack in a finite plate of functionally graded piezoelectric/piezomagentic materials using boundary collocation method”, Archive of Applied Mechanics, 2019, 89(2): 231-243. 3. J X Cheng, P P Shi, D F Sheng, “ Fracture Analysis of One-Dimensional Hexagonal Quasicrystals: Researches of a Finite Dimensions Rectangle Plate by Boundary Collocation Method”, Journal of Mechanical Science and Technology, 31(5): 2373-2383, 2017. 4. J X Cheng, D F, Sheng, T Q Yang, CX Wang, “Analysis on thermal buckling of a piezoelectric functionally graded rectangular plate with micro-void damage”, (in Chinese) Chinese Journal of Applied Mechanics，35( 2) : 1-8, 2018. 5. J X Cheng, P P Shi, X Li, “The One-dimensional Constraints Thermal Stress Analyses of the Functionally Graded Beam-Spring System”, (in Chinese) Chinese Journal of Mathematics in Practice and Theory, 46(13): 155-158, 2016.

Conference Abstracts

1. J X Cheng, Z X Li, “Analytical Lifetime Prediction Model of Polymer-supported Metal Films Subjected to Cyclic Loading”, 2018 International Conference of Flexible Electronics (ICFE 2018), Hangzhou, China, July 15th-17th , 2018. (Best Poster) 2. J X Cheng, D F Sheng, “ Anti-plane Fracture analysis of One-dimensional Hexagonal Piezoelectric Quasicrystals Finite Plate with Void Damage”, 2017 The Chinese Congress of Theoretical and Applied Mechanics (CCTAM 2017), , China, August 15th-16th , 2018.

Professional Skills Programming Language: MATLAB, Python, C Software: ABAQUS, COMSOL, Matlab, Photoshop, OriginLab

Affilations

Institute of Chinese Society of Theoretical and Applied Mechanics (CSTAM), Student Member