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www.vmecritical.com Software: Safety-critical systems conquer performance, HA, security

14 Math libraries can make life easier By Peter Thompson, GE Intelligent Platforms

18 Integrating High Availability and Resource Guide 2011 Volume 29 Number 2 application management for the warfighter By Mike Houston, GoAhead Software @VME_VPX_mag

22 Making safe systems secure Columns By Greg Gicca and Ben Brosgol, AdaCore VITA news 7 A renaissance in computer packaging? Hardware: Virtex-7 on the SDR scene By Ray Alderman 24 New Virtex-7 FPGAs boost software VITA Standards Update 8 VITA 51.2 receives ANSI recognition radio performance By Rodger Hosking, Pentek By John Rynearson VITA Standards Activity Chart 10 Special: Industry execs talk VME: Its legacy, progeny, and rivals Defining Standards 11 XMC goes rugged with VITA 61 26 VME mingles with VPX/OpenVPX: mezzanine interconnect standard It’s all about the hybrid By Dan Mignogna, Tyco Electronics Q&A with Curtis Reichenfeld, CTO for Curtiss-Wright Controls Electronic Systems Open VPX Interconnects… 12 Overcoming backplane access 28 “… It’s our position that 3U VPX limitations in OpenVPX By Robert K. Evans is superior to 6U VPX.” Q&A with Rob Scidmore, President and CEO of Extreme Engineering Solutions Resource Guide 34 Avionics 35 30 Mil tech gets smart with Communication 35 OpenVPX, VXS designs Q&A with Dr. Günter Zahnenbenz, CEO at Hartmann Electronik DSP Boards and S/W 36 Industrial Applications 46 Technology: Mezzanines 49 Time to change the customization paradigm New VITA Standards 51 33 Board customization as easy as Semiconductor/ICs 63 1, 2, 3 – and at a fraction of the cost Rugged Computer Systems 64 By Staff Editor Single Board Computer 71 Storage (digital) 75 Surveillance Systems 78 ISSN: Print 1941-3807, ISSN Online 1550-0403 Test & Instrumentataion 81 VME and Critical Systems is published four times a year (Spring, Summer, Fall and Winter) by OpenSystems Media, 16626 E. Ave of the Fountains, Ste 201, Fountain Hills, AZ 85268. VME and Critical Systems is free to qualified engineers or management Special Advertising Feature 32 dealing with or considering open-system technologies. For others, paid subscription rates inside the US and Canada are $45/year. For first-class delivery outside the All registered brands and trademarks within VME and Critical Systems magazine US and Canada, subscriptions are $60/year (advance payment in US funds required). are the property of their respective owners. Periodicals postage paid at St. Clair Shores, MI, and at additional mailing offices. © 2011 OpenSystems Media © 2011 VME and Critical Systems Canada: Publication agreement number 40048627. Return address WDS, Station A, PO Box 54, Windsor, ON N9A 615 Published by: POSTMASTER: Send address changes to VME and Critical Systems 16626 E. Ave of the Fountains, Ste 201, Fountain Hills, AZ 85268

4 VME and Critical Systems / Resource Guide 2011 HYPERTAC ® contact technology

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Hypertronics Corporation Hudson, MA 1-800-225-9228 www.hypertronics.com/hypergrip ISO 13485 certified ADVERTISER INFORMATION VME Editorial/Production Staff

Jerry Gipper, Editorial Director Terri Thorson, Senior Editor (columns) Page Advertiser/Ad title [email protected] [email protected] 31 AdaCore Technologies – Safety, security, reliability Sharon Hess, Managing Editor David Diomede, Art Director [email protected] [email protected] 11 Alligator Designs – AV46D-1 and AV46D-2 3 Annapolis Micro Systems, Inc. – High performance signal and data processing Sales Group 84 CM Computer – VPX, VME, and cPCI true Patrick Hopper, Vice President Regional Sales Managers military ATR enclosures Marketing & Sales Barbara Quinlan, Midwest/Southwest 16 Concurrent Technologies, Inc. – 2nd [email protected] [email protected] generation Intel Core processor boards Dennis Doyle, Senior Account Manager Denis Seger, Southern California 20 Elma Electronic – XMC storage with high [email protected] [email protected] speed CFast storage 32 Elma Electronic Systems – Realizing the Tom Varcie, Senior Account Manager Sydele Starr, Northern California potential of OpenVPX [email protected] [email protected] 27 Elma Electronic Systems – Handles and Rebecca Barker, Strategic Account Manager Ron Taylor, East Coast/Mid Atlantic front panels from Elma [email protected] [email protected] 17 Excalibur Systems, Inc. – Dense? Eric Henry, Strategic Account Manager International Sales 13 Extreme Engineering Solutions – 2nd generation Intel Core i7 processor solutions [email protected] Elvi Lee,, Account Manager – Asia [email protected] 83 GE Intelligent Platforms, Inc. – More Christine Long, Online Manager processor. More data. More intelligence. [email protected] Reprints and PDFs 19 Hartmann Elektronik – OpenVPX Nan Holliday 5 Hypertronics – Hypertac contact technology 800-259-0470 2 Kontron – Who can solve my SWaP-C [email protected] challenges? OpenSystems Media Editorial/Production Staff 31 Kontron – VM6050 - 6U VME Intel Core i7 single board computer 9 Pentek, Inc. – Stroke of genius

34 Phoenix International – VC1-250-SSD Rosemary Kristoffff, Vice President Editorial Monique DeVoe, Assistant Managing Editor conduction cooled SATA solid state disk PC/104 and Small Form Factors Mike Demler, Editorial Director 21 Themis Computer – New Intel processors DSP-FPGA.com extend the life of VME infrastructure DSP-FPGA.com [email protected] [email protected] 82 Vector Electronics & Technology, Inc. – Curt Schwaderer, Technology Editor VectorPak systems packaging Joe Pavlat, Editorial Director 34 VEROTEC Electronics Packaging – Verotec CompactPCI, AdvancedTCA, Brandon Lewis, Technical Copy Editor integrated packaging & MicroTCA Systems [email protected] Christine Capuano, Web/Editorial Assistant

Warren Webb, Editorial Director Steph Sweet, Creative Director Embedded Computing Design Joann Toth, Senior Designer Industrial Embedded Systems [email protected] Konrad Witte, Senior Web Developer

Jennifer Hesse, Assistant Managing Editor Matt Jones, Web Developer Web resources Embedded Computing Design Industrial Embedded Systems Laura Arsenault, Media Assistant Subscribe [email protected] opensystemsmedia.com/subscriptions Editorial/Business Ofﬁ ce Submit videos, white papers, and new products 16626 E. Avenue of the Fountains, Ste. 201 Phyllis Thompson, Fountain Hills, AZ 85268 Circulation/Office Manager submit.opensystemsmedia.com Tel: 480-967-5581 ■ Fax: 480-837-6466 [email protected] Website: www.opensystemsmedia.com White papers Karen Layman Read: whitepapers.opensystemsmedia.com Publishers: John Black, Michael Hopper, Business Manager Wayne Kristoff

6 VME and Critical Systems / Resource Guide 2011 By Ray AldermanAlderman A renaissance in computer packaging?

Attending a standards meeting on computer packaging and back- data centers in Hong Kong and scattered across the U.S. and planes is like sitting through an insurance seminar: lots of numbers U.K. At some point in the distant past, Intel announced they get thrown around, and only a few people in the room understand would build a number of huge data centers around the world. their significance. The systems integrators and customers in atten- When you look at what is happening at the data-center level, dance just want a drawing they can use; they also want to feel com- it’s clear that each of these companies has more people working fortable that all the boards will go into the chassis without binding on packaging, cooling, and power specs than there are in our or scraping, or worse yet, flopping around loosely. The importance entire embedded industry. As the over-hyped “cloud computing” of getting things right in the standard is left to those mechanical model takes hold, there will be more data centers in the world warriors who get little credit for their complex and detailed efforts. than fast food restaurants. But the world is slouching toward “cloud computing,” requiring an all-new model for computer packaging, power consumption, and The speciﬁcations cooling techniques. This is specifically visible in the VITA com- It occurs to me, as another set of tolerance numbers flies over my mittees developing the new Small Form Factor (SFF) specifica- head in the meeting, that maybe we should explore what these tions for critical applications including VITA 73, VITA 74, and data center groups are doing and gain some knowledge from the VITA 75. thousands of educated and well- funded minds working on the Worldwide data centers data-center specifications. Yes, As the barrage of tolerances and most of the work they are doing dimensions flung across the room “Copper-based revolves around keeping cheap mercilessly numbs the mind, it commodity motherboards from might be instructive to consider croaking under excessive heat. what the data centers of the interconnects are rapidly They have no appreciable shock computer industry are doing in and vibration to accommodate in this area as you struggle to remain their environment. None of their conscious. A plethora of data becoming a faith-based gear will fly in military aircraft centers is being built across the or Unmanned Aerial Vehicles world that is working on similar (UAVs), and none will ever problems of mechanical design, endure the pounding dished out power consumption, and cooling proposition.” to computers in ground combat techniques for computer boards vehicles. None of these data and boxes. center applications are burdened with Mean Time Between Failures (MTBF) or the debilitating Facebook is building their new data center in Prineville, Oregon effects of Restriction of the use of certain Hazardous Substances (see http://personaldividends.com/money/jon-t-norwood/ (RoHS), the lead-free tin-based solders that create tin whiskers. facebook-goes-green-and-saves-money) and has released the Even the automobile industry has ignored the deleterious effects of specifications on their packaging, power supplies, and cooling RoHS on critical systems as shown in the recent reports released techniques. They have formed the Open Compute Project, a by NASA and National Highway Traffic Safety Administration hardware version of the open source computing environment, (NHTSA) concerning the Toyota unintended acceleration problems to maintain and expand these specifications. Google has (see www.nhtsa.gov/UA). massive data centers around the world, and they actually shift their search loads to the centers with the lowest power cost But we could learn some interesting things by looking at what during the day. Their power bills for operating the servers and the data center problems are and the technologies they have cooling are hurting them financially. But Google only releases developed. All these data centers are using 10 G and 40 G optical their packaging, power, and cooling specifications under Non- Network Interface Cards (NICs) to interconnect the servers, while Disclosure Agreement (NDA) to their partners and suppliers. we remain bogged down in the parasitic, capacitance-infested Apple has built a massive data center in Maiden, North swamp of copper connections that requires divine intervention to Carolina, and two more are under construction in Research make them work at 10 G. Copper-based interconnects are rapidly Triangle Park, North Carolina. [Editor’s note: as we went becoming a faith-based proposition. While the data centers to press, Apple announced iCloud, the replacement for .Mac/ show a blatant disregard for RoHS consequences, MTBF, shock MobileMe. Experts agree that iCloud requires massive Apple and vibration, and reliability in general, they have given up on data center build-out.] copper interconnects. That point alone suggests the existence of intelligent life in that market segment, and we might learn from Presently, there are 22 massive data centers in China (see http:// how they do power, packaging, and cooling. www.datacentermap.com/china/), but we do not know which chassis, cooling, and power specs they use. Rackspace has six For more information, contact Ray at [email protected].

VME and Critical Systems / Resource Guide 2011 7 By John Rynearson

VITA 51.2 receives ANSI recognition

VSO ANSI accreditation VITA 71, New Generation Mezzanine Accredited as a Standards Development Organization (SDO) in Objective: To define a new mezzanine standard for embedded June 1993 by the American National Standards Institute (ANSI), modules. the VITA Standards Organization (VSO) meets every two months to address vital embedded bus and board industry standards Status: Due to members’ workloads and other activities, the work- issues. Information on ANSI/VITA standards is available on the ing group voted to suspend meetings on VITA 71 until the fall. VITA website at www.vita.com. VITA 75, Rugged Small Form Factor (RSFF) Objective: Develop a standard for small form factor modules and VSO study and working group activities enclosures for rugged environments. Standards within the VSO may be initiated by a study group and developed by a working group. A study group requires the spon- Status: The working group has outlined a set of goals and is sorship of only one VSO member. A working group requires the discussing the pros and cons of various box form factors and sponsorship of at least three VITA members. module sizes.

VITA 51.2, Physics of Reliability Failure PDF – This column and the accompanying table are available at Objective: Establish uniform practices, take advantage www.vmecritical.com. of current developments, and clarify reliability prediction expectations using physics of failure methodologies. For more information, e-mail John at [email protected].

Status: VITA 51.2 has been recognized as an American National Standard. Copies may be purchased from the VITA office.

VITA 61, XMC 2.0 Objective: To specify an alternative connector for use on XMC mezzanine modules. Editor’s note: This update is based on the May 2011 VSO meeting. Additional VSO meetings are Status: The working group voted to move VITA 61.0 into the scheduled for July 2011 and September 2011. ANSI ballot process. After the ballot closes in early July, any Be sure to check out our online E-cast archives for the latest video comments received will be reviewed and appropriate changes and audio updates on VITA 41 (VXS), 46 (VPX), 48 (VPX-REDI), made to the draft if required. and 65 (OpenVPX). See www.opensystemsmedia.com/ecast.

Now showing at www.opensystemsmedia.com/ecast ANSI/VITA 65, OpenVPX (just click on “See Archived E-casts and Events in-progress”): Objective: To provide a standard for commonly used VPX profiles. OpenVPX: From Specs to Solutions Status: The working group is evaluating changes to certain Presented by: Pentek, Curtiss-Wright Controls Embedded sections of VITA 65 to better clarify PCI Express clocking. These Computing, GE Intelligent Platforms, Curtiss-Wright Controls changes have delayed the schedule, but the group plans to move Electronic Systems into the ANSI process this summer. OpenVPX Education and Training Virtual Conference Presented by: Emerson Network Power, CSPI, Mercury, Kontron, VITA 66, Fiber Optic Interconnect (Formerly 46.12) Themis, Extreme Engineering, GE, Pentek, Curtiss-Wright Objective: Define a family of blind mate fiber optic interconnects for use with VITA 46 backplanes and plug-in modules. Leveraging DO-178C and Reusable Software for Modern Avionics Development Status: The working group voted to move VITA 66.0 and 66.1 Presented by: DDC-I, HighRely into the ANSI process. ANSI ballots for both proposed standards will close in mid June. Comments will be reviewed and the drafts Make your move to multicore revised if appropriate. The working group continues to work on Presented by: Future Electronics, Freescale additional variants in the 66 family – VITA 66.2 and 66.3.

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3HQWHN,QF2QH3DUN:D\8SSHU6DGGOH5LYHU1-3KRQH)D[HPDLOLQIR#SHQWHNFRPZZZSHQWHNFRP :RUOGZLGH'LVWULEXWLRQ 6XSSRUW&RS\ULJKW3HQWHN,QF3HQWHN&REDOWDQG*DWH)ORZDUHWUDGHPDUNVRI3HQWHN,QF 2WKHUWUDGHPDUNVDUHSURSHUWLHVRIWKHLUUHVSHFWLYHRZQHUV VITA Standards Activity Chart MAY MEETING HIGHLIGHTS

Standard VME and Standard VME and Title Status Title Status *Reaffirmed CS edition *Reaffirmed CS edition ANSI/VITA 1.0 *2002 VME64 Standards Released ANSI/VITA 46.0 VPX: Base Specification Working Group Feb. 2009 ANSI/VITA 1.1 *2003 VME64 Extensions Released Aug. 2004 ANSI/VITA 46.1 VPX: VMEbus Signal Mapping Working Group Feb. 2008 ANSI/VITA 1.3 *2003 9U x 400 mm Format Released VITA 46.3 VPX: Serial RapidIO on VPX Fabric Connector Trial Use Standard Summer 2010 ANSI/VITA 1.5 2eSST Released Feb. 2004 VITA 46.4 PCI Express on the VPX Fabric Connector Working Group Fall 2010 ANSI/VITA 1.6 *2005 Keying for Conduction-cooled VME Released VITA 46.5 VPX: HyperTransport Inactive ANSI/VITA 1.7 Increased Connector Current Level Released VITA 46.6 VPX: GbE Working Group Spring 2010 ANSI/VITA 3 *2002 Board Level Live Insertion Released VITA 46.7 10 GbE on VPX Trial Use Standard Summer 2010 ANSI/VITA 4.0 *2002 IP Modules Released VITA 46.9 PMC/XMC/Ethernet Signal Mapping to 3U/6U on VPX User I/O Working Group Fall 2010 ANSI/VITA 4.1 *2003 IP/I/O Mapping to VME64x Released ANSI/VITA 46.10 Rear Transition Module for VPX Released Dec. 2009 ANSI/VITA 5.1 *2004 RACEway Interlink Released VITA 46.11 System Management on VPX Working Group Spring 2010 VITA 5.2 RACEway++ Withdrawn Aug. 2004 VITA 46.12 Fiber Optic Interconnect See VITA 66 Dec. 2009 ANSI/VITA 6.0 *2002 SCSA Released VITA 46.14 Mixed Signal VPX See VITA 67 Dec. 2009 ANSI/VITA 6.1 *2003 SCSA Extensions Released VITA 46.20 VPX Switch Slot Definition See VITA 65 Jun-09 ANSI/VITA 10 *2002 SKYchannel Packet Bus Released VITA 46.21 Distributed Switching on VPX See VITA 65 Jun-09 ANSI/VITA 12 *2002 M-Modules Released ANSI/VITA 47 Env., Design and Const., Safety, and Qual. for Plug-in Units Released Jun-06 ANSI/VITA 13 Pin Assignments for HIC on VME Withdrawn VITA 47r1 Revisions to ANSI/VITA 47 Released Feb. 2008 ANSI/VITA 17.0 *2004 Front Panel Data Port Released VITA 47r2 Revisions to ANSI/VITA 47 Working Group Dec. 2009 ANSI/VITA 17.1 Serial Front Panel Data Port Released Feb. 2004 VITA 48.0 REDI: Ruggedized Enhanced Design Implementation Working Group Fall 2010 VITA 17.2 Serial Front Panel Data Port (SFPDP) Channel Working Group Dec. 2009 VITA 48.1 Mechanical Specs for Microcomputers Using Air Cooling Working Group Fall 2010 VITA 19.0 BusNet Overview Withdrawn Mechanical Specs for Microcomputers Using Conduction VITA 48.2 Working Group Fall 2010 Cooling ANSI/VITA 19.1 BusNet MAC Withdrawn VITA 48.3 Mechanical Specs for Microcomputers Using Liquid Cooling Working Group ANSI/VITA 19.2 BusNet LLC Withdrawn Mechanical Standard for Electronic Plug-in Units Using ANSI/VITA 20 *2005 Conduction-cooled PMC Released Apr. 2005 VITA 48.5 Released Winter 2010 AFT Cooling ANSI/VITA 23 *2004 VME64x Extensions for Physics Released ANSI/VITA 25 VISION Withdrawn ANSI/VITA 49.0 VITA Radio Transport (VRT) Released May-09 ANSI/VITA 26 *2003 Myrinet-on-VME Released ANSI/VITA 49.1 VITA Radio Link Layer (VRL) Released May-09 VITA 50 Best Practices for Electronic Module Cooling Inactive Dec. 2007 ANSI/VITA 29 >1;7> Released ANSI/VITA 30.0 ANSI/VITA 51.0 *2008 Reliability Prediction Released Aug. 2008 2 mm Connector Practice on Euroboard Released *2005 ANSI/VITA 51.1 *2008 Reliability Prediction: MIL-HDBK-217 Daughter Released ANSI/VITA 30.1 2 mm Conduction-cooled Euroboard Released ANSI/VITA 51.2 *2011 Physics of Reliability Failure Released Summer 2011 VITA 30.2 Power Connector Equipment Practice Released Apr. 2007 ANSI/VITA 51.3 Qualification and Environmental Stress Screening Released Spring 2010 ANSI/VITA 31.1 GbE on VME64x Backplanes Released Feb. 2004 VITA 52 Lead-free Practices Working Group Oct. 2006 ANSI/VITA 32 Processor PMC Released Feb. 2004 ANSI/VITA 53 Commercial Technology Market Surveillance Released Summer 2010 VITA 34 A Scalable Electromechanical Architecture Working Group Apr. 2004 VITA 54 Embedded Platform Management Architecture (EPMA) Inactive Aug. 2005 ANSI/VITA 35 *2005 Pin Assignments for PMC to VME Released VITA 55 Virtual Streaming Protocol Inactive Feb. 2009 VITA 36 PMC I/O Modules Withdrawn Apr. 2004 VITA 56 Express Mezzanine Card (EMC) Inactive Oct. 2007 ANSI/VITA 38 System Management on VME Released ANSI/VITA 57 *2008 FMC: FPGA Mezzanine Card Released Feb. 2009 ANSI/VITA 39 PCI-X Aux. Std. for PMCs and PrPMCs Released Feb. 2004 VITA 57.1 FPGA I/O Mezzanine Pin Assignments Working Group Jun-09 ANSI/VITA 40 Status Indicator Released Dec. 2009 ANSI/VITA 58.0 Line Replaceable Integrated Electronics Chassis Released May-09 ANSI/VITA 41.0 VXS: VME Switched Serial Released Oct. 2006 VITA 59 RSE: Rugged System-on-Module Express Working Group Dec. 2008 ANSI/VITA 41.1 VXS: InfiniBand Protocol Layer Released Oct. 2006 VITA 60 Alternative Connector for VPX Working Group Winter 2010 ANSI/VITA 41.2 VXS: RapidIO Protocol Layer Released Oct. 2006 VITA 61 XMC 2.0 Working Group Summer 2011 VITA 41.3 VXS: GbE Working Group Apr. 2006 VITA 62 Power Supply Modules Working Group Dec. 2009 VITA 41.4 VXS: PCI Express Working Group Apr. 2006 VITA 63 KVPX Working Group Feb. 2009 ANSI/VITA 41.6 VXS: 1x GbE Control Channel Layer Released Sept. 2009 VITA 64 Optimized Footprint for VITA 60 Working Group Feb. 2009 VITA 41.7 VXS: Processor Mesh Topology Working Group ANSI/VITA 65 OpenVPX Released Summer 2011 VITA 41.8 VXS: 10 GbE Protocol Layer Working Group Jun-09 VITA 66 Fiber Optic Interconnect (Formerly 46.12) Working Group Summer 2011 VITA 41.10 VXS: Live Insertion Requirements for VITA 41 Boards Working Group Apr. 2006 VITA 67 Coaxial Interconnect on VPX Working Group Spring 2010 VITA 41.11 VXS: Rear Transition Modules Working Group Apr. 2006 Coaxial Interconnect on VPX, 3U, 4 Position SMPM VITA 67.1 Working Group Spring 2010 VITA 42.0 XMC Released Feb. 2009 Configuration ANSI/VITA 42.1 XMC: Parallel RapidIO Released Oct. 2006 VITA 68 VPX Compliance Channel Working Group Fall 2010 ANSI/VITA 42.2 XMC: Serial RapidIO Released Oct. 2006 VITA 69 Common Glossary Working Group ANSI/VITA 42.3 XMC: PCI Express Released Oct. 2006 VITA 70 Common Standard Template Working Group VITA 42.4 HyperTransport Working Group Apr. 2005 VITA 71 New Generation Mezzanine Working Group Summer 2011 ANSI/VITA 42.6 XMC: 10 GbE 4-Lane Protocol Layer Released Jun-09 VITA 72 Connector Comparision Testing Working Group VITA 42.10 XMC: General Purpose I/O Working Group VITA 73 Small Form Factor-v73 Working Group Summer 2010 VITA 42.20 XMC: Dual Fabric I/O Working Group VITA 74 Small Form Factor-v74 Working Group Summer 2010 VITA 43S Hot Swap NextGen Mezzanine Inactive Feb. 2004 VITA 75 Rugged Small Form Factor (RSFF) Working Group Summer 2011 VITA 45S Serial VME Canceled Apr. 2004 For corrections or suggestions, contact VME and Critical Systems magazine at [email protected].

10 VME and Critical Systems / Resource Guide 2011 SEPT Defining Standards MEETING

XMC goes rugged with VITA 61 mezzanine interconnect standard

By Dan Mignogna

As embedded computing applica- The VITA 61 connector is flexible and Going forward tions continue to evolve, multi-gigabit has been designed to support the existing [As of press time] the VITA 61 XMC 2.0 data rates have become commonplace. XMC stack heights of 10 and 12 mm. A draft specification is nearing maturity. This expectation extends to the rug- third height of 18 mm has been added as a Currently, the draft specification is going ged embedded computing marketplace, result of committee input. The additional through ANSI ballot. When the ballot is where unique packaging challenges stack height provides the ecosystem with closed, comments and suggested edits driven by adverse mechanical and ther- more packaging alternatives to mitigate will be incorporated as appropriate and mal environments must also be man- growing thermal challenges. the draft finalized. It is envisioned this aged. One of the newest technologies put will occur mid-2011 and that the VITA 61 forth by the VITA Standards Organiza- Finally, the VITA 61 connector provides XMC 2.0 specification will be completed tion (VSO) is targeted at mezzanine con- the XMC community a very elegant and released before year’s end. structions and detailed in the VITA 61 upgrade path. Although the VITA 61 and “Alternative Connector for XMC” aka VITA 42 connectors are not intermate- Dan Mignogna is a product manager “XMC 2.0” draft standard. VITA 61 is able (as indicated by different specifica- responsible for rugged printed circuit nearing completion and will advance the tion numbers), the VITA 61 connector board and fiber optic interconnects XMC architecture state-of-the-art both employs the exact same board attach at the Tyco Electronics Connectivity mechanically and electrically. footprint as the original VITA 42 connec- Global Aerospace, Defense & Marine tor. As a result, no changes to the printed business unit. He can be contacted at High performance meets the circuit board layouts are necessary. [email protected]. rugged connector During VSO bimonthly meetings, discussion of past, present, and future technology reviews occur, clarifying the fact that the XMC (VITA 42) ecosystem could benefit from a more rugged mezzanine connector. Ideally, the new connector would fit on the existing 114-position XMC footprint, yet enable higher data throughput.

VITA 61 connector: Putting it all together The VITA 61 connector is mechanically robust. The separable interface has MIL- C-55302 connector heritage, includes four points of contact on opposing axes, and is rated to a minimum of 500 mating cycles. The connector is rated at -55 ˚C to +125 ˚C. The connector also features protected socket contacts – eliminating contact stubbing as a failure mode – and a compliant solder tail for superior board attach performance (successfully completed 2,000 thermal cycles).

The VITA 61 connector enables some very high-speed signals and is baselined at 5 GHz at the current VITA 42 pin assignments. Significant headroom up to 7-12 GHz is available with alternate pin assignments. With very low insertion loss and crosstalk, it is envisioned to be capable well beyond what second- and potentially third-generation protocols will need.

VME and Critical Systems / Resource Guide 2011 11 By Robert K. Evans

Overcoming backplane access limitations in OpenVPX

While the connectors chosen for Open- fied ANSI VITA 46/65 data rates of 6.25 This cabling system offers ruggedized VPX (VITA 65) have many good features, Gbaud over 30 gauge coax cable. options to developers who face last- they are not offered in versions to allow minute changes to deployable systems or designers easy access to backplane signals. Reconﬁgurable cables where the volume of systems purchased This has necessitated the development of This wafer-based cabling system can be does not justify custom backplanes. Rear Transition Modules (RTMs), which reconfigured by the end user to address are often custom and certainly are not uni- changing requirements. As shown in Fig- VPX backplane diagnostics versal on all slot profiles. These RTMs are ure 1, a fat pipe cable (eight differential OpenVPX backplanes have channel often large and restrict the access to sig- pairs) carrying InfiniBand can be snapped requirements defined in ANSI/VITA 46 nal points on adjacent slots for concurrent apart and reapplied to form two thin pipes and ANSI/VITA 65 and the emerging development and test activity. (four differential pairs each) to carry Eth- VITA 68 (VPX Compliance Channel) ernet from slot to slot or from a slot on standard. This wafer cable system con- Because OpenVPX is a point-to-point the development backplane to a slot on a tains wafers that have SMAs attached to architecture, backplane design is con- separate VPX (VITA 46) system. facilitate rapid access to signal points for tingent on the number of cards; the I/O measurement of crosstalk; they can also architecture is also driven by the number InfiniBand, Serial RapidIO, Ethernet, and access signals from slot to slot to check and location of cards. During develop- PCIe are all high-speed fabrics that can uti- Tx quality and skew. It takes only a few ment, it is often not possible to finalize lize this cabling system from slot to slot or seconds to relocate the wafers to check the board selection until later in the evalu- from slot to I/O with the appropriate con- a second channel. The signal integrity of ation phase. This creates a dilemma for nector. Implementation using RJ45, CX4, these assemblies is adequate for detailed program managers who do not want to USB, SATA, and eSATA are some of the analysis of these tests: fund the development of multiple custom choices for the system developer. backplanes to support internal develop- Q Insertion loss: <2.5 dB up to 5 GHz ment. In addition, the evaluation process Using these cables does not inhibit access Q Return loss: <10 dB up to 5 GHz required to settle on a backplane design to adjacent slots and provides limitless Q Connector impedance: 100 +/- 10% adds precious time to the design cycle. access to every point on the VPX back- at 100 ps rise time (20 - 80%) plane. Not only do these cables support all Q Within pair skew: <3 ps ft A cabling system has been developed that 3U and 6U VPX backplanes, but they are Q Time domain crosstalk: <4% at 40 ps allows designers access to any point or ideally suited to support power/ground rise time (-20 to +80%) from multiple points on the OpenVPX backplane with- development backplanes. And various aggressors out an RTM. The cabling system is orga- wafer-to-I/O connector solutions provide nized in familiar OpenVPX “pipes” and designers with the flexibility needed to Easing OpenVPX design, facilitates the movement of these signals move fabrics to desired endpoints. hastening time to market from slot to slot or slot to I/O. Utilizing The push by many agencies and primes wafers similar to the ANSI VITA 46/65 Various wafer options include power for continued expansion of open systems approved TE Connectivity MultiGig RT2 wafers for P0, wafers with hookup wire has energized VPX as a leading-edge connector system, this cabling system is for user-defined options, and wafers for standard where high-density computa- capable of supporting maximum speci- single-ended slot profiles. tional power is required. The development and production of this VPX PLUS ! $ cabling system has eased the design, test,

% and development of OpenVPX cards and

$ $ # " # ( # " # ( systems and provided developers with

% $# " $# ( $# " $# ( a tool that, in some instances, has no

& & %# " %# ( %# " %# ( alternate in the OpenVPX ecosystem.

' &# " &# ( &# " &# ( The VPX PLUS cabling system conse- quently enables system designers to rapidly overcome development hurdles and % forgo using an RTM.

$ $ # " # ( # " # ( % $# " $# ( $# " $# ( Robert K. Evans is a consultant in the & & %# " %# ( %# " %# ( electronic component marketplace and ' &# " &# ( &# " &# ( has an extensive background in product ! % development in the interconnect, passive, and electromechanical device Figure 1 | Cable fat pipe hookup between two separate backplanes marketplace. Contact him at [email protected].

12 VME and Critical Systems / Resource Guide 2011 X-ES 2nd Generation Intel® Core™ i7 Processor Solutions: Delivering Innovation

In 2010, Extreme Engineering Solutions, Inc. (X-ES) developed more Intel® Core™ i7 processor products based on VPX, CompactPCI, VME, CompactPCI Express, and XMC form factors than anyone in the industry. This year, X-ES has added solutions based on the 2nd generation Intel Core i7 processor. Providing products customers want, when they want them – that truly is innovation that performs.

X-ES offers an extensive product portfolio that includes commercial and ruggedized single board computers, high-performance processor modules, multipurpose I/O modules, storage, backplanes, enclosures, and fully integrated systems.

2nd generation Intel Core i7 processor solutions available in a variety of form factors. Call or visit our website today. Software ĆċĊęĞǦĈėĎęĎĈĆđĘĞĘęĊĒĘĈĔēĖĚĊėĕĊėċĔėĒĆēĈĊǡ ǡĘĊĈĚėĎęĞ Math libraries can make life easier

By Peter Thompson

For a DSP system designer, the key to performance and portability is to use an optimized math library. For the library provider, there are many challenges to overcome to provide that performance across a variety of platforms.

The high-performance embedded com- transformed into vector form, performing be processed in parallel. In this example, puting landscape is a rapidly chang- dependency analysis to check if it can be the vector pipeline is 128 bits wide, or ing one. As recently as two years ago, verified that such a transformation is safe four 32-bit single precision floating-point the processor of choice for compute- in terms of guaranteed-correct results, values. As the vector width is 4, a loop is intensive signal- and image-processing and finally generating substitute code needed to iteratively process the complete applications was PowerPC with AltiVec. that calls vector library functions or sub- data set. (Code that would be required Today the choices are many and diverse: stitutes vector language macros into the for alignment and boundary conditions is PowerPC with or without AltiVec, Intel code. For instance, the loop depicted in excluded for clarity.) This looping to fit an Architecture with SSE or AVX, GPGPU Figure 1 can, in the right circumstances, arbitrarily sized vector to the fixed pipeline with CUDA or OpenCL, Tilera devices, be replaced by a library call. width is known as “strip-mining.” ARM devices with SIMD coupled with DSPs, and more. These processors These days, if such a library function has Additionally, one of the most flexible fea- invariably allow multithreading, offering been created with code optimized to use tures of the C language is the use of pointers the promise of superior performance. a SIMD architecture, this simple trans- to access memory. It is this very flexibility formation can yield order of magnitude that is one of the biggest impediments to For the application developer, the way increases in performance with no change automatic vectorization. Consider rewrit- forward is clear – use standards-based to the original code base. Other compilers ing the aforementioned loop in Figure 2 libraries such as VSIPL and VSIPL++ or convert the loop code directly to C primi- to a subroutine, as shown in Figure 3. higher-level abstractions such as model- tives that implement the SIMD instruc- based design that exploit such libraries tion set in use (Figure 2). As the compiler has no way to verify that under the hood by linking to optimized the arrays a, b, and c do not overlap at runtime libraries. Note that the SIMD code has been “strip- all, it is not possible to ascertain that this mined.” SIMD engines have a fixed width loop is safe to vectorize, as there might For COTS board developers, the chal- that allows a certain number of data to be hidden data dependencies. A compiler lenge is how to optimize libraries for all these disparate architectures without resorting to coding methods that would be economically unviable. The problem is that multiple library APIs must be optimized for multiple processor architectures, and must run under multiple revisions of multiple operating systems. The implication of this is that code generation becomes a huge task, and quality testing becomes even more challenging. Figure 1 | A loop can, in the right circumstances, be replaced by a library call. The impact on integrators is that the introduction of libraries might lag the introduction of a new processor by months to years, and the quality of the implementation might be suspect as hand coding many hundreds of functions can take several man-years. Here, we explore some of the techniques and technologies that can be exploited to expedite the generation of optimized libraries, yielding better performance. Compilers play a key role In the past, it was the preserve of dedicated and costly compilers to take standard C code and vectorize it. This is the Figure 2 | Some compilers convert the loop code directly to C primitives process of parsing a code module, iden- that implement the SIMD instruction set in use. tifying loops that are candidates to be

14 VME and Critical Systems / Resource Guide 2011 is likely to reject this as a candidate for an Application Programming Interface, Sophisticated tools help maximize transformation. compiler directives, and runtime libraries. performance Many compilers, such as gcc and Intel C, For more esoteric functions – as compared All is not lost, however. Firstly, if the have built-in support. As a simplistic exam- to the loop adds, subtracts, or multiplies programmer can categorically state that ple, the vadd routine depicted in Figure 3 generated by compilers – a more sophis- overlaps will never occur, the program- could be multithreaded as shown in Figure ticated approach might be required when mer can tell the compiler this extra detail. 4, with the simple addition of a compiler optimizing parallel library implementa- The usual mechanism is via a compiler pragma to allow the loop to be run across tions to improve performance. For exam- pragma, which is a directive to the com- multiple threads (as controlled by a func- ple, the SPIRAL project (http://spiral.net) piler. For example, for some compilers, tion call or environment variable). expresses linear transforms as Kronecker inserting #pragma ivdep in the Figure products, which are then converted by 3 subroutine will allow it to be vectorized. Some vendors choose to use Posix a program generation system to vector Secondly, some compilers will produce pthreads to write multithreaded math expressions that can be implemented in a code that does a runtime check of the vec- code. Sometimes this might result from a variety of architectures. Other commercial tors to see if they overlap, and will branch lack of OpenMP in some operating sys- vendors who specialize in math libraries accordingly. If the vectors overlap, it will tems, and sometimes it might be driven have created similar tools that allow algo- execute scalar code; if not, it will execute by a desire to have finer-grained control rithms to be expressed in an abstracted vector SIMD code. Executing scalar code of the algorithm decomposition. form that is then typically processed to nullifies the benefit of vectorization – so generate C or assembly code primitives no performance increase is achieved. Even when using OpenMP, programmers that map to the instruction set of a particu- must be aware of the traditional issues of lar SIMD platform. In recent years, automatic vectorization data locality and so on. It might be neces- technology is available in commonplace sary to exert control over core affinity, or Model-based design is being used compilers such as gcc and Intel C. While how threads are allocated and reallocated increasingly to generate deployed code. this will produce reasonably performing to physical or virtual cores. Whether Previously, the output of these tools was code, there are still some tricks of the trade shared resources like L2 cache are avail- sufficient to validate the algorithm but that an experienced engineer can apply to able between certain threads can have not enough for real-time application and increase the performance. Sometimes com- a large, although difficult to quantify, often required a phase of manual rewrit- pilers insert code to ensure correct execu- impact on performance. ing to be useable. As the code generation tion in all circumstances. An engineer can possess knowledge about the boundaries of operation that will be encountered, and can sometimes remove some of this redundant code for more efficient execution.

In addition, many processor architectures include hardware to pre-fetch data from memory to the caches, usually under the control of hint operations that can be inserted in the code. The use of these hints is somewhat of a black art, as inju- dicious use can hurt performance. But an experienced coder knows how best to employ them to schedule the pre-fetches far enough ahead that the data is in cache when needed but not too far ahead as to incur cast-out or cache thrashing. The for- Figure 3 | The loop described in Figure 2 can be rewritten to a subroutine, as shown in Figure 3. mer is where the data that is needed was placed in cache ahead of time, but inter- mediate execution demanded enough other data that it has been bounced back out to main memory by the cache management algorithms before it can be consumed. This can lead to the latter, cache thrashing, where more time is spent loading and reloading the data to the caches than consuming it.

Additionally, for many years, multithreading (the execution of multiple units of processing) has been available via time- slicing on a single processor. Most of the current-generation processors support multithreading on multiple cores, virtual cores, or a combination of both, giving true concurrent execution. One com- Figure 4 | The vadd routine depicted in Figure 3 could be multithreaded as shown in Figure 4, with the simple mon way to exploit this architecture is by addition of a compiler pragma to allow the loop to be run across multiple threads. using OpenMP, which is a combination of

VME and Critical Systems / Resource Guide 2011 15 Software ĆċĊęĞǦĈėĎęĎĈĆđĘĞĘęĊĒĘĈĔēĖĚĊėĕĊėċĔėĒĆēĈĊǡ ǡĘĊĈĚėĎęĞ

capability of these tools has evolved, more Libraries allow focus on the The good news for application develop- of the resultant code is good enough to use application ers is that they can concentrate on the as-is. MATLAB, for instance, can now There are many tools available today to application, with the knowledge that the target GPGPUs as well as x86 processors assist in writing high-performance math math libraries they are using will yield with MKL and IPP libraries. libraries. Vendors like GE Intelligent the best possible performance from the Platforms that supply math libraries hardware while maintaining code porta- Vendors to expand libraries with a consistent API across a multiplic- bility across multiple processor genera- Processor vendors are continually increas- ity of processors and operating systems tions and architectures. ing the availability of math libraries that are increasingly exploiting such tools have been optimized by their internal to assist in supporting all these diverse Peter Thompson experts with intimate knowledge of how to platforms. They still, however, apply is Director of coax the maximum possible performance deep-rooted knowledge of architectures Applications, from their architecture. Intel has its Math to coax the ultimate performance possi- Embedded Systems, Kernel Library, which includes BLAS, ble. By leveraging standard math librar- at GE Intelligent LAPACK, ScaLAPACK1, Sparse Solvers, ies, such as GE’s AXISLib-VSIPL and Platforms. With fast fourier transforms, vector math, and tools like AXISView, engineers can rap- an honors degree more. NVIDIA’s CUDA has support for idly write code that optimally exploits in Electrical and CUBLAS, CUFFT, CUSP (sparse linear the processor of choice and can view Electronic Engineering from the UK’s algebra), performance primitives, and and tune the performance. Parameters University of Birmingham, Peter has more. The performance is hard to beat, but such as cache hit/miss ratios and CPU worked for more than 30 years in one drawback might be limited operating loading can be viewed as time graphs embedded computing, joining Radstone system support. These libraries tend to that illustrate how well the algorithm – subsequently acquired by GE – stick with the mainstream of Windows and is tuned to the system. Simple recon- in 2005. He can be contacted at Linux. If a hard real-time operating system figuration of task and thread place- [email protected]. is required, the options are more limited: ment and affinities can be executed At present, technologies such as CUDA, within the tools to further fine-tune the GE Intelligent Platforms Intel MKL and IPP are not available for performance. www.ge-ip.com real-time operating systems.

2nd Generation VME/VXS

Intel® Core™ Processor Boards OpenVPX™ choice of dual or quad-core processors commercial, extended temperature or rugged conduction cooled variants support for leading operating systems CompactPCI® For more information please visit our website or contact us directly: email: [email protected] phone: (781) 933 5900 AMC

The Intel® Processor Board Specialists

All trademarks acknowledged www.gocct.com

16 VME and Critical Systems / Resource Guide 2011

Software ĆċĊęĞǦĈėĎęĎĈĆđĘĞĘęĊĒĘĈĔēĖĚĊėĕĊėċĔėĒĆēĈĊǡ ǡĘĊĈĚėĎęĞ Integrating High Availability and application management for the warfighter

By Mike Houston

Delivering High Availability (HA) – 99.999 percent uptime – for distributed applications is a major challenge for embedded system developers. Ensuring High Availability is usually enough of a challenge, but doing so for a distributed system that supports mission-critical defense applications magnifies the challenge greatly. The following discussion provides a framework for understanding this dual challenge and reviews some of the pertinent SA Forum standards for addressing these requirements.

For designers and developers of any Marrying High Availability software Application Management and HA embedded, distributed computing system, technology with these sophisticated – The core challenge building and maintaining a cost-effective application and management infra- Not all projects require High Availability and extensible application and manage- structure capabilities is at the heart of at the outset, but application and man- ment infrastructure is a major challenge. the solution to this multipronged chal- agement infrastructure is common to all This challenge is even more acute when lenge. The Service Availability Forum embedded, distributed systems. As High the system is mission-, life-, or safety- (SA Forum) specifications were created Availability is a potential future require- critical and carries a High Availability to satisfy the HA requirement, and SA ment because of changes in mission, host- (HA) requirement – meaning 99.999 Forum-based technologies have been ing of new applications, or broader integra- percent uptime. In the military environ- successfully applied and deployed in tion and dependencies within the Global ment, these kinds of systems are typically A&D and telecommunications systems. Information Grid, system designers need command and control systems, weapon Figure 1 provides a high-level overview to be well poised for the migration with all systems, and others that require near-real- of these SA Forum-defined categories the key architectural pieces in place. time or real-time performance. within the context of a simple distributed system common in a mission-critical Accordingly, Application Management Dealing with this twin challenge of an defense application or system. and High Availability refers to the gen- efficient application and management eral ability to model and manage a set of infrastructure while also addressing pos- An integrated High Availability and processes, their life cycles, dependencies, sible HA requirements is important when application management framework can and composite state that together make building new mission-critical defense address the aforementioned challenges. up a mission-critical system. This is best applications. It is also a major factor for designers focused on integrating different types of applications (new, legacy, and third party) into a common infrastructure. In either case, a unified and consistent infrastructure with a well-rounded set of services is crucial to meeting the High Availability challenge.

This consistent infrastructure can be bro- ken down into three categories:

Q Application Management and High Availability – The core capabilities for health monitoring and fault recovery. Q Management Infrastructure Services that include consistent configuration modeling, administrative support, alarms/notifications, and logging capability. To fully address the needs of a mission-critical system, these services should frame the solution for the middleware infrastructure and the applications. Q Application Infrastructure Services includes messaging, event distribution, Figure 1 | An overview of application and infrastructure management married with high availability and access control services.

18 VME and Critical Systems / Resource Guide 2011 accomplished as a configuration rather Key ingredients associated with Applica- than an implementation exercise. This tion Management and High Availability kind of modeling and process manage- include: ment is absolutely essential to meeting the 99.999 percent uptime requirement Q Health monitoring policies – that warfighters need in their systems. These serve as a means to monitor and understand component heath Today’s aerospace and defense systems with associated recovery policies are often a diverse collection of third (for example, application restart or party, legacy, and new applications, with failover). This does not require code engineers focused as much on integra- changes for legacy or third party tion as on traditional application devel- applications – crucial in today’s long opment. The power of SA Forum-based defense program life cycles. Many Application Management services is that defense systems are black boxes that they bring engineering discipline to this do not allow for open access to the otherwise potentially ad hoc integration code, but faults must be detected effort. It imposes modeling and architec- and isolated to these components to tural consistency that controls applica- maintain overall system availability. tion behavior – without requiring modi- Q Availability Management fications to code. Framework – Provides a framework to coordinate all the redundant As shown in Figure 2, Application Man- resources in a distributed environment agement and High Availability services with no single point of failure. This provides a consistent method of man- is the heart of addressing the HA aging a diverse set of mission-critical requirement that is at the foundation applications. Application startup and run- of many defense systems. time dependencies, state representation, Q Life-cycle policies – How, when, and administrative control, and health moni- where to instantiate and terminate toring are all key to the solution. components. This is required to honor dependencies and manage fault At the heart of the solution is an appli- conditions. cation modeling framework that allows a Q Runtime state – Manages the system designer to craft an XML descrip- presence, readiness, and operational tion of processes, called components, and state of a component. their relationships and dependencies that Q Administrative control – An make up a system. The application man- administrator can, on demand, agement model consists of a set of objects instantiate, engage, disengage, or assembled by the designer to reflect the terminate a collection of components planned deployment, and it is used by the that makes up a service or an entire middleware to instantiate such a system node in any combination to support at runtime. maintenance scenarios.

Figure 2 | Application Management and High Availability services

VME and Critical Systems / Resource Guide 2011 19 Software ĆċĊęĞǦĈėĎęĎĈĆđĘĞĘęĊĒĘĈĔēĖĚĊėĕĊėċĔėĒĆēĈĊǡ ǡĘĊĈĚėĎęĞ

Q Service location policies – A service as needed, to suit the startup, shutdown, Management Infrastructure is defined as a collection of one or and runtime circumstances. The system Services – Simplifying more components. Service location model also addresses basic fault condi- maintenance and operations policies explain which nodes a tions and recovery actions mandatory Management Infrastructure Services particular service can live on and in mission-critical defense applications. refers to a set of services that provides ranks them so that if a node fails, Furthermore, because all runtime actions a consistent approach to represent and alternate nodes are already identified. are driven by configuration policies, the implement configuration, runtime state, middleware performance is highly deter- alarm, notification, and log information In sum, application management and HA ministic. This determinism is critically that allows automated management by and its associated system modeling pro- important to the test and evaluation cycle middleware or by an operator to manage vide the system designer with a flexible of systems today and ensures that the sys- a deployed system. In a real-time sensi- framework to express all dependencies. tem can become approved for production tive scenario such as a weapons system, Since application management and HA as early as possible – and deployed for these specific capabilities are integral to own the life cycle of these components, use by our warfighters. the middleware itself to ensure operation it can instantiate and terminate processes, at the 99.999 percent availability required to maintain warfighter support. XMC Storage A key overall point about these services is that ideally the rest of the system with High Speed will use these same services to expose its own instrumentation, log, and event information. By adopting and leveraging CFast Storage these same services into the applications and system infrastructure, the value of Elma’s new 9289 XMCStor is a high speed the integration effort and the architec- storage mezzanine board which uses CFast tural consistency are both simplified and drive technology for blazing SATA transfer enhanced, and a more reliable design is achieved. rates. The XMCStor provides a mezzanine storage solution for applications requiring Storage & I/O Configuration, notification, and log services are fully integrated with the other rugged and fast storage operation. aspects of the middleware infrastructure. Adapters can be written to integrate the Management Infrastructure Service APIs to support external management entities such as a CLI or SNMP Manager. With distance support becoming a significant SBCs requirement in defense systems today, remote access via SNMP, Web, and so forth to the management infrastructure is important. Notification and log services are useful for online and offline diagnos- s Data transfer rates up to 130MB/sec write tics so that corrective action can be made and 140MB/sec read. to a system by an operator to return a Dual CFast™ drives, one front removable and one crucial defense system to health as rap- s ChassisChassis internal for maximum operational flexibility. idly as possible. Other configurations also available. s Up to 64GB of CFast solid state storage in an Key concepts and capabilities associ- XMC form factor board ated with SA Forum-based Management s Built to withstand harsh environments requiring high Infrastructure Services include: shock, vibration and extended temperature tolerances, s Compatible with PCIe high speed serial interconnects Q An XML-based means to define new on host cards with XMC mezzanine sites application objects and attributes and Networkiking an Object Management API for a client to invoke requests. It provides Call us or visit our exclusive object access support as 3CANFOR$ETAILS well as transaction semantics when website for more details. multiple objects must be changed in a www.elma.com single operation. 510.656.3400 Q Successful configuration changes are persisted by the infrastructure: Embedded Computing Solutions by Elma The infrastructure can use the www.elmasystems.com default configuration or last-known configuration at boot time.

20 VME and Critical Systems / Resource Guide 2011 Q A Notification API allows Framework delivers HA to mandated standard in the DoD IT Stan- applications to generate alarms as mission-critical apps dards Registry (DISR). well as state change, attribute change, All the SA Forum services described in and other notifications. Events are this framework concept share a common Mike Houston is automatically logged on a log stream. core of architectural features that will Director of Marketing Q A Log API allows applications to deliver benefits across an entire design. at GoAhead Software. define their own log streams or join a Most importantly, the risks of application He has more than 15 predefined log stream or one invented downtime and/or critical problems are years of experience by a designer. dramatically reduced for mission-critical in the software and defense applications. Furthermore, these telecommunications In sum, these Management Infrastructure must-have High Availability capabili- industries. He can be Services not only frame the solution for ties are cost prohibitive to build, test, and contacted at [email protected]. the middleware itself, but can also be maintain internally. However, using a used across the full range of applications standards-based COTS solution preserves in a distributed, mission-critical defense scarce resources. GoAhead Software system. 425-301-5131 The specific framework and services pre- www.goahead.com Application Infrastructure sented herein are included as a DoD-wide Services – Providing critical communication Application Infrastructure Services refers to a set of basic communications and coordination capabilities. They are ubiq- uitous and universally relevant services NEW INTEL PROCESSORS EXTEND THE LIFE used among cooperating, collaborating OF VME INFRASTRUCTURE embedded distributed applications: intra- cluster messaging services, a checkpoint XV2 Board Level Computer service to inform standby processes of the ™ active state, and a distributed lock service t High-performance Quad-Core Intel® Xeon® Processor LC5518 to manage access to critical resources. t High-speed Intel QuickPath® interface This particular set of capabilities is cru- t Up to 24 GB ECC DDRIII SDRAM memory t Up to two PMC/XMC expansion slots on board cial to addressing the 99.999 percent High Availability challenge in the highly t PCIe expansion to XMC/PMC carrier card t Up to four Gigabit Ethernet ports diverse and distributed systems that are t Two slot VME 64 solution becoming more common in today’s networked battlefield.

The core of Application Infrastructure

Services is a set of SA Forum-based LV1™ Board Level Computer services that works together to pro- tLow-power Intel Core 2 Processor vide foundational capabilities such as an interprocess messaging service that t Up to 16 GB ECC DDRII SDRAM memory t Up to two PMC/XMC expansion slots on board supports point-to-point, point-to-multi- t PCIe expansion to XMC/PMC carrier card point, and publish-subscribe many-to- t Up to three Gigabit Ethernet ports many messaging between distributed t Single slot VME 64 solution processes within the scope of a cluster. Additionally, a checkpoint service allows processes in an active state to push state information to its assigned standby process so that it is a hot standby allowing for stateful failovers. Not only that, a Illustrious Past, Bright Future critical resource access-control service is provided so that competing applications Protect your existing infrastructure with high- can methodically access (one-writer-at- performance server technology from the VME a-time) resources. industry leader. The Themis VME product family www.themis.com features the latest Intel processors including the (510) 252-0870 Mission assurance is improved by this Quad-Core Intel® Xeon® on VME. Themis supports robust application infrastructure. These Windows®, Linux®, and UNIX® applications. Themis communication and coordination func- products offer maximum configuration flexibility tions are increasingly important, not only and life cycle support to maximize your technology to critical applications, but to managing investment. workflow that could be jeopardized by ©2011 Themis Computer. All rights faults throughout the execution process. Themis VME and VPX technologies are ideal for reserved. Themis Computer, Themis The combination of these application compute-intensive embedded, storage, and and the Themis logo are trademarks or registered trademarks of Themis infrastructure services with the manage- communications applications, as well as a wide Computer. All other trademarks are the ment infrastructure services described range of commercial and military applications. property of their respective owners. creates a powerful suite for designers of mission-critical systems.

VME and Critical Systems / Resource Guide 2011 21 Software ĆċĊęĞǦĈėĎęĎĈĆđĘĞĘęĊĒĘĈĔēĖĚĊėĕĊėċĔėĒĆēĈĊǡ ǡĘĊĈĚėĎęĞ Making safe systems secure

By Greg Gicca and Ben Brosgol

How does one demonstrate that a system is “safe enough” for application domains such as avionics, where a software failure can lead to loss of human life? Additionally, the risk of system penetration from inadvertent or malevolent sources has raised the stakes and highlighted the need to pay serious attention to security. However, it is unrealistic to add security to a system as an afterthought.

The operative software safety certifica- and add some new content in the form of Evaluation Assurance Levels tion standard for commercial avionics (and special technology supplements: 1) model- In the security area, the principal cer- increasingly for military avionics also) is based development; 2) object-oriented and tification specification is the Common DO-178B[1]. This standard categorizes related technology; and 3) formal methods. Criteria standard[2], which catalogs and software failure conditions in terms of their defines two sets of requirements: potential effect on safety, ranging from the Neither DO-178B nor DO-178C call lowest (Level E – no effect) to the highest out specific objectives for security. Q Security Functional Requirements (Level A – catastrophic failure with loss of This does not imply that a DO-178B/C- (SFRs): Services that perform aircraft), with a corresponding set of objec- certified system is necessarily insecure. security-related tasks tives that must be met. Different systems However, as advanced networking and Q Security Assurance Requirements on the aircraft are at different levels. communications facilities become (SARs): Evaluation steps that available, such safety-critical systems check whether a product’s security In its nearly 20-year history, DO-178B has can be accessed by external systems objectives are met proven to be a successful safety standard: and equipment. In many cases, this is Although there have been some “close a benefit, but there are obvious secu- Similar to the safety objectives of DO- calls,” there has never been an aircraft rity (and therefore, safety) risks. Thus, 178B, the SARs are grouped into Evalu- fatality due to a failure of DO-178B cer- whether intentional or inadvertent, ation Assurance Levels (EALs), ranging tified code. Still, technology has changed such security breaches can lead to loss from 1 (lowest) to 7 (highest) (see Figure 1). since the early 1990s, and work is in prog- of life. So security cannot be added to Achieving higher EALs takes additional ress on a revision known as DO-178C. The the system as an afterthought. effort (for example, formal methods are new standard will correct a few errors and required at EAL 7), but is justified when ambiguities, clarify the requirements for Security objectives should be addressed by the value of protected assets is high. “qualifying” a tool that automates some adding security-related requirements to the process that would otherwise need to be software’s overall safety requirements – Different application domains have differ- done manually (for example, determin- and by using appropriate deployment plat- ent kinds of security requirements. To bring ing a program’s maximum stack usage), forms and development technologies. some consistency to evaluating prospective products, the Common Criteria defines the concept of a Protection Profile. A Protec- tion Profile identifies – in an implementa- $ ! " !!# tion independent manner – the assets that need to be protected, the SFRs that need #"&"!" % to be implemented, the SARs (that is, the EAL) that must be met, and the operational " #"# &"!" environment/attacker sophistication that is assumed. A product with a higher EAL is "&"!" not necessarily more secure than a product with a lower EAL; it depends on their "&!"!" $% # respective Protection Profiles.

&!"!" Unlike DO-178B, the track record of the Common Criteria has been mixed. One &$ !"!" issue is whether the effort required to take a product through a successful evaluation &$ !"!" !" (with respect to a given Protection Pro- file) produces the desired benefit in security assurance. Nevertheless, the Common Figure 1 | Similar to the safety objectives of DO-178B, the SARs are grouped into Evaluation Assurance Levels (EALs), ranging from 1 (lowest) to 7 (highest). Criteria’s catalog of SFRs and SARs can be extremely useful when considering the

22 VME and Critical Systems / Resource Guide 2011 security objectives of a safety-critical sys- interpartition communication in a secure One of the issues that has complicated tem. Based on a component’s functions policy-based manner, for example, to the job of maintaining and enhancing and safety level, the developer can deter- ensure that an unclassified partition cannot a safety- or security-critical system is mine which SFRs and SARs are relevant read classified data. the “big freeze”: Changing the source and add them as DO-178B requirements. code, or even upgrading the compiler, Through such an analysis and selection Development technologies for has required a large effort in regenerat- of SFRs and SARs, the developer can safety and security ing the certification artifacts to ensure achieve appropriate levels of assurance Achieving high levels of safety or security that the change has not introduced any for both safety and security. means finding bugs and potential vulner- regressions. A promising approach that abilities early in the software life cycle. addresses this issue is the Open-DO ini- Deployment platforms for safety That’s why the use of typical static analy- tiative[7], which is using methods from and security sis tools is too late; the error is already in the Agile and Lean communities, cou- As mentioned, modern systems with the code. A preferable approach is to use pled with qualifiable open-source tools. safety and security requirements share a programming languages and associated common attribute: the need to have dif- tools that prevent the errors from being Melding safety and security ferent components, at possibly different inserted in the first place. Languages such Designing a safe system requires account- safety levels and/or different security as Ada, with strong typing and extensive ing for security; this is difficult, especially levels, operate jointly (and possibly com- compile-time checking, can help. For since safety standards such as DO-178B municate with each other) without inter- example, in a language such as C, add- do not explicitly address security issues. ference. That is, assurance is needed that ing an integer to a pointer can easily result However, a combination of sound pro- no component can jeopardize the safety in a “buffer overrun” error, where data is cesses and appropriate technologies can or security of the overall system or other inserted into a location outside the bounds make it manageable. components. Architectures have been of the intended target data structure. This designed to meet these requirements error is prevented in Ada, since the com- References: through partitioning: ARINC-653[3] for piler will reject a program that attempts [1] RTCA SC-167/EUROCAE WG-12. RTCA/ safety and MILS[4] for security. such an operation. DO-178B – Software Considerations in Airborne Systems and Equipment Certification, December 1992. ARINC-653 is an operating system archi- For applications that need to achieve [2] Common Criteria Portal, www. tecture that supports multiple applications high levels of safety and/or security, commoncriteriaportal.org running at potentially different safety assurance backed by formal mathemati- [3] Avionics Application Software Standard levels. A small real-time kernel controls cal reasoning might be necessary. In Interface, ARINC Specification 653, all time and space usage for an arbitrary such situations it is appropriate and also January 1997. number of applications, each running in cost effective – as evidenced by practical [4] W. S. Harrison, N. Hanebutte, P. Oman, its own isolated partition and invoking experience in projects such as the NSA- and J. Alves-Foss, October 2005. The services from the APplication EXecu- sponsored Tokeneer[5] – to use a lan- MILS Architecture for a Secure Global tive (APEX), for example, to multithread guage that supports proofs of correctness Information Grid, CrossTalk 18 (10): within a partition. Each application is of developer-specified program proper- 20–24. www.crosstalkonline.org/storage/ allocated a certain amount of processor ties. The SPARK language[6] takes this issue-archives/2005/200510/200510- time per execution cycle and a certain approach. SPARK is a deterministic and Harrison.pdf [5] Praxis High Integrity Systems. Tokeneer amount (and location) of memory. This verifiable Ada subset augmented with ID Station EAL5 Demonstrator: Summary model guarantees that the operation of a notation for expressing a program’s Report, August 2008. www.adacore.com/ any one application cannot adversely “contracts” – for example, the precondi- multimedia/tokeneer/Tokeneer_Report.pdf affect another, and simplifies the testing. tions, postconditions, and invariants of [6] M. Croxford and R. Chapman, Correctness a subprogram, or a program unit’s data by Construction: A Manifesto for High- The Multiple Independent Levels of Secu- dependencies and information flows. Integrity Software, CrossTalk, Dec. 2005. rity (MILS) operating system architecture Tools that complement the compiler www.crosstalkonline.org/storage/issue- is similar to ARINC-653, but for appli- apply proof techniques to verify the archives/2005/200512/200512-Croxford.pdf cations running at potentially different specified contracts. The resulting analy- [7] Open-DO: Towards a cooperative and security levels (Figure 2). An additional sis can demonstrate, for example, that open framework for the development of consideration for MILS is the managing of the program is free of runtime errors. certifiable software. www.open-do.org

Greg Gicca is Director #"&"!" % ! ! # of Safety and Security ## '"! +$0 ## '"!9 &%&$"# )$"!'"!## '"!: ## '"!1 2#$*!&"!'!)%&! Product Marketing at " #"# &"!" $''"!- $*$%01 $''"!* $''"!+ $''"!, !!3 AdaCore. He can .$")%4%*$5 "&"!" "$ )$ 2%$")%"$#"&!' -& !)$% =5> =5> be contacted at 9"!'"! 95; <5> &"% !) $"1")#!&%3 [email protected]. "&!"!" $% # 6!"7 6!"7 )%& "$ )$"!'"! )%& )%&2%" "$&&"")#!&%0#"%% - Ben Brosgol is a &!"!"! )!!)$%3 member of the !"$ )$"!'"! 2%" !"!*!!&"")#!&%3 senior technical &$ !"!" staff at AdaCore. "&"!$$"#$'"! $! 6!"!7 # &-"$# "&+"$ " &$ !"!" !" Contact him at [email protected]. AdaCore Figure 2 | The Multiple Independent )& Levels ),- of Security " (MILS) !operating system architecture is 212-620-7300 similar * to ARINC-653, but for applications running at potentially different security levels. www.adacore.com

VME and Critical Systems / Resource Guide 2011 23 Hardware ĎėęĊĝǦ͟ĔēęčĊĘĈĊēĊ New Virtex-7 FPGAs boost software radio performance

By Rodger Hosking

Increasing demands in performance and capacity of radio services drive the need for better solutions. The recently introduced Virtex-7 FPGAs from Xilinx deliver unprecedented levels of performance for Software-Defined Radio. They target many critical resources including digital signal processing, high-speed peripheral interfaces, and system-level interconnects for advanced communications and radar systems. The following discussion examines some of the improvements in Virtex-6 versus Virtex-7, and how system engineers can exploit Virtex-7 to address the most difficult application challenges.

Wireless appliances in homes, offices, and offers the highest performance of the Challenge No. 1: DSP engine vehicles … fixed neighborhood broadband Xilinx families with twice the perfor- implementation wireless networks … the promise of seam- mance of the Virtex-6. Figure 1 shows Software-Defined Radio signal process- less connectivity to the Internet in portable a comparison of Virtex-6 and Virtex-7, ing algorithms for the new complex devices, regardless of location: These all illustrating the performance and other modulation waveforms require substantial drive the explosive demand for improved improvements. computational horsepower, which isn’t levels of service in this highly competitive always easy to come by. However, gen- Software-Defined Radio (SDR) market. Virtex-7 devices feature low-power 28 nm eral-purpose processors execute software This crowded radio spectrum means that process technology to implement up to instructions sequentially on one or more to be competitive, carriers must squeeze as 3.1 Tbits/sec of I/O and over 2 million arithmetic units, while FPGAs implement much traffic as possible into their licensed logic cells. They provide up to 6.7 TMACs algorithms with numerous DSP hardware bands so they can deliver the required lev- of DSP resources, especially important engines operating simultaneously in paral- els of voice and data service to the maxi- for Software-Defined Radio applications. lel. In this way, FPGAs not only improve mum number of subscribers. Because of new process technologies and algorithm processing speeds for a given other power management schemes, they channel, but given enough DSP engines, In the government and military realm, consume half the power of Virtex-6 for a they can handle multiple channels operat- organizations tasked with monitoring given function. ing in parallel. Because these engines are both domestic and overseas radio traffic configured and connected by the designer, for sensitive information must constantly Figure 2 shows the steady improvement in FPGAs can be tailored to meet a wide upgrade system-loading capacities and the past four generations of Xilinx FPGAs range of different applications to overcome develop new strategies to automate the starting with the Virtex-4 and continuing most any design challenge. information processing. Advanced radar to the Virtex-7. The graph displays the systems must detect and identify stealthy number of logic cells contained in a range Virtex-7 FPGAs use the DSP48E1 engines targets at greater distances and track of different density devices in a 35 mm x first introduced in the Virtex-6 family, each them with improved accuracy. Airborne 35 mm BGA package. This clearly shows containing a pre-adder, a 25 x 18 multiplier, countermeasure systems must constantly the dramatic increase in resource density, an adder, and an accumulator. The maxi- evolve in complexity to avoid detection. bounded by the constraints of the size and mum quantity of DSP48E1 engines in power dissipation. Virtex-6 devices was 2016, while the Vir- The only viable solution to all of these problems is Software-Defined Radio. Virtex-6: 2016 Maximum DSP48E1 Blocks These systems replace traditional ana- Virtex-7: 5280 Virtex-6: 11.1 GHz log radio components with FPGAs and Maximum Gigabit Serial Rate Virtex-7: 28.1 GHz other digital signal processing hardware Maximum Logic Cells Virtex-6: 759k to deliver precise, complex modulation Virtex-7: 1,955k

Virtex-6: 38 Mbits schemes to meet the constantly increasing Maximum Block RAM demands of each application. Meanwhile, Virtex-7: 85 Mbits Virtex-6 (Gen 2 x8): 4 GB/sec the new Xilinx Virtex-7 aims to address Maximum PCIe Data Rate Virtex-7 (Gen 3 x8) 6.4 GB/sec the most difficult application challenges in Virtex-6: 118,500 Max Configurable Logic Blocks Software-Defined Radio engineering. Virtex-7: 305,400 Virtex-6: 100% Relative I/O Power Virtex-7: 70%

Virtex-7 FPGAs: Power, other Virtex-6: 100% considerations Relative Dynamic Power Virtex-7: 75% The newest generation of FPGAs from Virtex-6: 100% Relative Maximum Static Power Virtex-7: 35% Xilinx is the Series 7, consisting of three families each targeting specific price/ Figure 1 | A comparison of Virtex-6 and Virtex-7 performance spaces. The Virtex-7 family

24 VME and Critical Systems / Resource Guide 2011 tex-7 boosts the maximum count nearly two- ing the maximum buffer time and risking Challenge No. 5: High-speed and-a-half times to an impressive 5,280. the loss of data. interconnections Since most Software-Defined Radio sys- Challenge No. 2: Data converter Internal FPGA block RAM can be used tems utilize real-time embedded system interfaces as swinging or “ping-pong” memory board-level products, high-speed intercon- All Software-Defined Radio systems need buffers. Here one buffer fills from the nections such as Gigabit serial links and A/D and D/A converters in the antenna path. source (like an A/D converter) while the PCI Express are essential to handle the To feed the insatiable demand for wireless other empties to the destination (like the increased digital traffic between compo- data service, new wideband standards like PCIe interface), with roles reversing each nents, boards, and chassis to support new UMTS and LTE can deliver wireless data cycle. Another very popular elastic buffer wideband signals. Needless to say, any rates up to 100 Mbps. But these services structure is the FIFO. bottlenecks for such wideband signal traf- require advanced modulation schemes fic will cripple real-time SDR operation. and channel bandwidths to 20 MHz and The largest Virtex-7 devices now offer beyond. Advanced radar systems with more than 85 Mb of internal block RAM, In their latest Virtex-7 devices, Xilinx sophisticated pulse structures call for sig- more than twice as much as Virtex-6. offers gigabit serial transceivers with nal bandwidths of 300 MHz and higher. Nevertheless, internal block RAM can four different maximum bit rates: fall short of meeting the required buffer 6.6 GHz (GTP), 12.5 GHz (GTX), 13.1 Because Software-Defined Radio deals sizes, and external memory must be used. GHz (GTH), and 28 GHz (GTZ). This so well with these complex waveforms, represents a dramatic increase over Vir- one major objective is to process signals Challenge No. 4: Those external tex-6 maximum serial transceiver rates of as close to the antenna as possible. For- memory interfaces 6.6 GHz (GTX) and 11.1 GHz (GTH). tunately, the latest Virtex-7 FPGAs pro- Software-Defined Radio applications use vide a direct connection to high-speed large blocks of memory not only for buff- These interfaces support popular protocols peripheral devices with LVDS DDR ering real-time data, but also to support such as Ethernet, Aurora, SerialRapidIO, I/O transfer rates reaching 1,600 MHz, complex signal processing algorithms. PCIe, and others. At the higher Virtex-7 rates up from 1,400 MHz in the Virtex-6. Thus, it’s a real problem when data buf- for GTH, each 8x Aurora link can deliver Applications such as a Virtex-7 XMC fers are too small or memory read/write bidirectional transfers up to 10 GBps. Software-Defined Radio module can cycles are simply not fast enough. use a 3.6 GHz A/D converter, taking full Unlike Virtex-6 devices, some Virtex-7 advantage of the high-speed I/O capa- Synchronous DRAMs offer the densest devices now support the PCI Express Base bilities of the Virtex-7 FPGA. and most economical solution for large Specification 3.0 with capabilities for both memory arrays. Developed to support endpoint and root port. Since each PCIe To ease onerous printed circuit board lay- high-end PCs, DDR3 SDRAMs deliver generation also accommodates lower gen- out constraints, Virtex-7 has per-bit skew extremely fast read/write rates by transfer- eration devices, the Gen3 interface operat- adjustments to help align bits in a data ring data on both edges of the clock. The ing at 8 Gbps is backward compatible with word. They also include digitally con- latest Virtex-7 devices can support DDR3 Gen1 at 2.5 Gbps and Gen2 at 5 Gbps. trolled termination networks for tuning devices running a bit transfer rate up to The x8 Gen3 PCIe interface provides a 6.4 optimum performance while eliminating 1.866 Gbps – far above the 1.066 Gbps GBps system interface. the need for external discrete resistors. for Virtex-6. Virtex-7 enhances SDR Challenge No. 3: Data buffering To achieve these speeds in the Virtex-7, When coupled with advanced power While Software-Defined Radio A/D and the maximum 1:2 ratio between the fab- reduction techniques, more DSP engines D/A converters operate at a constant clock ric logic clock and the memory transfer for signal processing, improved buffering, rate, networks and system buses transfer rate on the Virtex-6 was boosted to 1:4 and faster interfaces for data converter and data most efficiently in packets or blocks. on the Virtex-7. Also new on the Virtex-7 memories, it is easy to see how develop- This requires staging of data in buffers is the Phaser clock generator that main- ers can take advantage of the new Virtex-7 that are sized to handle the worst-case tains real-time clock-to-data timing to FPGAs to implement significant improve- delay until access is granted to use system within 7 psec. Designated interface pins ments in overall Software-Defined Radio memory. As data converter rates increase, allow a direct, glueless connection to system performance. CS buffer memory fills more quickly, shrink- these fast memories. Rodger H. Hosking is Vice President and cofounder of Pentek, Inc., where Logic Cells he is responsible for new product 700 690T definition, technology development, 585T 600 550T and strategic alliances. With more than 485T 500 415T 30 years in the electronics industry,

330T SX475T he has authored hundreds of articles 400 LX356T about digital signal processing. Prior SX315T 300 LX240T to his current position, he served as LX195T LX130T 200 engineering manager at Wavetek/ Rockland, and he holds patents in LX/SX50T 100 FX70T LX85T SX95T LX/FX110T LX155T Virtex-7 frequency synthesis and spectrum LX40 SX55 LX160 Virtex-6 0 LX/FX60 LX80 LXFX100 analysis techniques. Virtex-5 Smaller Devices Virtex-4 Larger Devices Pentek 201-818-5900 Figure 2 | The steady improvement in the last four generations of www.pentek.com Xilinx FPGAs, starting with the Virtex-4 and continuing to the Virtex-7.

VME and Critical Systems / Resource Guide 2011 25 Special ēĉĚĘęėĞĊĝĊĈĘęĆđĐǣ ęĘđĊČĆĈĞǡĕėĔČĊēĞǡĆēĉėĎěĆđĘ

VME mingles with VPX/OpenVPX: It’s all about the hybrid

Q&A with Curtis Reichenfeld, CTO for Curtiss-Wright Controls Electronic Systems

Editor’s note: VME lives on, and, as our interview with Curtiss-Wright CTO Curtis Reichenfeld reveals, is part of a larger trend to meld VME with VPX or OpenVPX in the system. While folding in such an array of form factors could rapidly turn into a mire of quicksand, a hybrid approach is proving a viable remedy … whether we’re talking about a mixed backplane or hybrid processor approach. Meanwhile, Reichenfeld also tells where the software comes into the equation – and makes a prediction or two about VME’s future.

VME: According to data from VITA, most of the new busi- but every pin is used for the bus, so it has limited uses for I/O and ness for VME-like systems is for VME64 itself, not for VPX or mezzanine cards. VPX backplanes are more complex and require OpenVPX. What is Curtiss-Wright seeing? tighter design rules, because of the higher-speed signals. Since there are many potential connections, routing of the backplane is REICHENFELD: Curtiss-Wright Controls Electronic Systems more difficult because of the restrictions on controlled impedance is developing more mixed backplane (hybrid) chassis to take traces. Therefore, signal integrity analysis and simulation become advantage of newer processor designs and higher-speed sig- essential for successful performance of VPX designs. naling capability without the need to respin legacy I/O cards. Some systems can incorporate VME64, CompactPCI, and VME: Which kinds of systems use a combination of VME and 3U/6U VPX/OpenVPX cards into a single chassis. Many I/O VPX/OpenVPX? Can you dive down a bit and describe the functions including purpose-built interfaces are only still avail- implementation differences? able in VME64. Some systems are still incorporating aging VME64 processors with these interface cards to take advantage REICHENFELD: Technology insertion applications will use of standard chassis and backplanes when cutting-edge proces- both VME and OpenVPX/VPX, for old and new technology use. sor designs are not required. Therefore, there is an ongoing Implementing hybrid processors used as a VPX bridge card will need for mixed backplanes technology. incorporate both VME and VPX interconnects. Part of the system can be legacy cards, usually to preserve software investment, and VME: Briefly describe the key systems-level differences between part can be VPX, to allow for higher data rates and greater net- VME and VPX. working capability. With a hybrid system, existing VME cards can run their existing software, but add additional performance REICHENFELD: VME is a parallel multi-drop bus with a single capabilities with VPX. A bridge card can interface between the path for data. VME connectors handle signal frequencies typi- VME and fabric connections and pass data over VME to fabric cally less than 1 GHz. VPX is based on high-speed point-to-point or GbE data paths. Existing VME cards with GbE ports can also serial interconnects, typically PCIe, Serial RapidIO, and GbE. pass data over that path, through a switch, to any other card in the It allows multiple paths for data, which can operate simultane- system. These are several potential ways to interface a combina- ously. Each channel has two endpoints with data channels in tion of VME and VPX/OpenVPX. each direction between the two points. The signaling rates are 2.5 to 6 GHz per signal pair. For higher data rates, interfaces VME: VPX adds substantially higher-rate and more I/O lines. are grouped together in parallel channels. 4X or four pairs in How would you match this with a VME system (using five-row each direction is the most common. This gives a raw rate of connectors and P0)? 10 Gbps. These interfaces can be switched, similar to the Ethernet switch concept, for multiple data path possibilities. VPX at a sys- REICHENFELD: VPX has more data transfer capability, both in tem level has advantages over VME with higher I/O pin counts data rates and number of separate connections, and more avail- available and higher-rate I/O signaling. able I/O lines on 3U/6U systems. Fiber connections and coax RF connections are also supported in VPX, which allows these VME: What makes VPX “better than” VME (64?)? In what signals to be incorporated into the backplanes. VME cards have ways is it inferior? been known to replace the P0 connector with higher-speed and fiber connectors to match some of the data rates currently found REICHENFELD: It really depends on the application. System in VPX, but are usually a custom build. Another way to transfer architectures and card selection are based on many factors includ- high-speed data in VME systems to an LRU front panel is to use ing: size, weight, power, cost, availability, performance risk, and front-panel connections on the cards, such as GbE, RF, and fiber, reliability. Data rates are higher on VPX serial fabrics, which are to allow signal routing over the top of the cards rather than incor- scalable in width to achieve desired bandwidths. Multiple data porated into the backplane. transfers can occur at the same time. VPX enables the use of 3U cards in systems with moderate I/O capability where previous VME: Suppose a designer has a VME64 system with dual 3U cards were very I/O pin limited. VME does have a 3U version, PMC mezzanine cards. What’s the best way to move to VPX?

26 VME and Critical Systems / Resource Guide 2011 REICHENFELD: The availability of 6U VPX cards that incorpo- tolerance for non-recurring engineering and compatibility with rate two PMC/XMC sites provides the ability to integrate legacy legacy software. Obsolescence management and technology PMC modules and provides a path to incorporate future XMC insertion will be part of VME’s future. CS modules. Other system architecture options would include a VPX processor with a VPX PMC/XMC carrier card to integrate the Curtis Reichenfeld, P.E., is Chief Technology Officer at legacy modules. Curtiss-Wright Controls Electronic Systems. He has more than 25 years of experience in safety-critical hardware and VME: Give us a quick answer: What’s the difference between software for military electronic systems. He can be contacted VPX (VITA 46) and OpenVPX (VITA 65)? at [email protected].

REICHENFELD: VITA 65 is a selected subset (called “profiles”) Curtiss-Wright Controls of the almost infinite universe of possible VITA 46 pinouts and Electronic Systems interconnects. VITA 65 has defined profiles of the parts of a sys- 661-257-4430 tem: Backplane, which defines interconnects between slots; Slot, www.cwcelectronicsystems.com which defines which type of signals appear on which card connectors (and where); and Module, which defines which protocols appear on each signal type, along with card size and cooling. OpenVPX allows higher levels of interoperability and standardiza- tion of backplanes that are compatible with OpenVPX cards from multiple vendors.

VME: What are the issues when it comes to software, for example, how about integrating a legacy VME64 and OpenVPX system?

REICHENFELD: The investment in software is always a key part of a system architecture trade study. Processor performance and operating system availability are key to this trade-off. Sometimes this comes down to which version of an operating system is available that is compatible with the legacy software and tools. The porting of legacy software is minimized if similar processor families are used with defined software application interfaces. The trade-off is always nonrecurring costs and risks associated with moving to a new processor versus nonrecurring costs and risks associated with designing hybrid backplanes with soon-to-be obsolete processors. The trade-off becomes even more difficult if the software has been safety certified (for example, to DO-178B).

VME: What does the future hold for VME?

REICHENFELD: The future should be interesting. Survival is all about innovation and adaptation.

Innovation involving smaller form factor standards with lower size, weight, power, and cost is driving the market. Even though a VME solution might have lower development costs, a system based on 6U VME card-sets simply cannot meet platform volume restrictions.

Adaptation is seen as development of newer VME64 designs is pin compatible with legacy systems to minimize system redesign efforts and eliminate obsolescence. VME still has a future in systems designs that have a lower

VME and Critical Systems / Resource Guide 2011 27 Special ēĉĚĘęėĞĊĝĊĈĘęĆđĐǣ ęĘđĊČĆĈĞǡĕėĔČĊēĞǡĆēĉėĎěĆđĘ “… It’s our position that 3U VPX is superior to 6U VPX.”

Q&A with Rob Scidmore, President and CEO of Extreme Engineering Solutions

Editor’s note: When you think of Extreme Engineering Solutions (X-ES), you probably think “chassis and cards provider.” But, as an utterly honest interview with Extreme Engineering Solutions’ President and CEO Rob Scidmore reveals, the company also sees itself as a systems integrator contending with GE Intelligent Platforms or Curtiss-Wright. Scidmore also tells where X-ES sits in the Intel versus Freescale paradox and why he feels VME is a dying art. Edited excerpts follow.

VME: Extreme Engineering popped onto our radar screen a VME: We don’t see PrPMCs very often. Explain why you’re a couple of years ago: a small company, middle America, build- leading supplier there. ing VME boards and other cool stuff. Let’s start with some company metrics. SCIDMORE: Every embedded-level form factor supports PMC and XMC. It’s always there, but in one regard, it’s fairly rare for SCIDMORE: This summer we should reach about 120 employees. someone to plug a processor on a processor board. So a lot of the We’ve been around since 2002, and last year we did about $32 times where we’re being pulled in is – I’ll use the analogy that’s million in revenue. the same as COM Express: Somebody wants to add a processer to their design, their special sauce, and they need a way to do that VME: So your company is known as focusing on customized on a custom or standard form factor. Well, that would be where COTS. How is such a custom solution faring in an increas- PrPMC would fit very well. It’s a standard product that can plug ingly COTS era? onto their custom or standard form factor card, much like COM Express plugs onto a custom or standard form factor card. SCIDMORE: Basically, really quite well. If you follow our growth path – we doubled our revenue last year. But more VME: Extreme Engineering was “into” the P.A. importantly, we do have standards-based products. We’ve found Semiconductor processors in the pre-Apple days, but looks that most customers don’t really need customized versions of like you’ve turned to Core i7 and Freescale offerings like the their products immediately. Usually we can lead with the stan- PowerQUICC and QorIQ. Which processor do your VME cus- dards-based products and provide the modified COTS in short tomers ask for most these days? order. SCIDMORE: If you look at Freescale and Intel, we have a road VME: How long does it take Extreme Engineering to design map that basically says we are going to take on all the high-per- something new from scratch? Tell me about that process. formance QorIQ solutions like the 4080 and the follow-on beyond that, or the Core i7 and the follow-on beyond that. We’re going to SCIDMORE: Well it really depends on what you mean by be there no matter what, and we already had those products before “design from scratch.” There are certain products out there like P.A. Semi. We’ve been with Freescale since 2003, and Intel prob- a brand-new Freescale or a brand-new Intel product, where it ably two years before P.A. Semi came along. In terms of the cus- literally takes probably six months to a year to bring something tomers who came to us as a result of P.A. Semi, I would say about to the market. The majority of the modifications we see are not, 80 percent of them have gone to Intel and about 20 percent of them “Oh by the way, I want this new processor.” If you look at our have moved on to Freescale. But people who used P.A. Semi and road map, we support every major Freescale high-performance VME – I see those people sticking PowerPCs. processor, and we’re supporting all the embedded Intel high- performance processors. And once you’ve gotten the bulk of VME: So new designs then overall – all your form factors – the hard work done (developing and supporting that from a soft- which processor are you finding is most popular? ware perspective and understanding how their product works), you’re turning that into a modified version where it’s wrapped SCIDMORE: I think it’s a split. We’re doing about 50/50 [Intel around CompactPCI, VME, or VPX, which is fairly trivial. and Freescale].

VME: You mentioned three form factors you build your boards VME: OK, moving on, tell me about VPX versus OpenVPX … in accordance with. Which other form factors? as you’re seeing it.

SCIDMORE: PrPMC and XMC and have really been the strong SCIDMORE: I don’t really see a distinction for us at this point. suit of our company for a lot of years. We have a strong presence All of our products are OpenVPX. There are basically two pro- in the 6U CompactPCI field, but I think we are the leading com- files that address the majority of our customers – and the pro- pany worldwide in terms of developing PrPMCs. files pretty much define the backplane topology, not really the processor topology.

28 VME and Critical Systems / Resource Guide 2011 VME: Are you doing 3U or 6U OpenVPX, and which is more VME: What do you think is the future of VME itself? popular? SCIDMORE: I think it’s a slowly dying part of the industry. The SCIDMORE: With OpenVPX, clearly 3U for us – that’s the most slowly dying applications and the people who are boxed in – no popular. Of course, it’s smaller, and then, more importantly, it’s pun intended – will continue to use it. our position that 3U VPX is superior to 6U VPX. VME: Switching gears, VITA/VSO is getting into small form VME: Oh really? Why is that? factor initiatives (VITA 73, 74, and 75). Do you use small form factors, or are you planning to? SCIDMORE: You put the same processor on the board, right, 3U or 6U? You’re taking the same amount of power and you’re put- SCIDMORE: The fact of the matter is this: They fall into a ting it to the rail, taking it to the wedge lock. If that power has camp. There’s a group of people out there who want to define to go a longer distance, you’re going to have a larger drop. So in it at the box level. They want to say, “You define it at the con- terms of thermal performance of a box, a 3U solution is better nectors,” and, “What do you care what’s inside the box?” Those than the 6U. And what makes it even more complicated is when people have a good point. When I look at the new VITA stan- they write the standards, they somehow think that 6U should be dards, I see people trying to drive a new board-level standard in able to handle more power. It’s just the opposite. If you’re talking addition to the box-level standard for small form factors. From about high-performance processors, it’s always a challenge to get our perspective, that’s basically a mistake. They’re biting off the thermal solution that pulls that heat off the boards, the rails, more than they can chew, and that means the standard is going and out of the box. to take years to get anywhere. The mistake is that people are using it to define something new, rather than figuring out how In terms of the 6U solution, you’ve to use what’s already out there. got to take that heat further and you’re talking about putting more power in VME: Does Extreme it. So I think what it comes down to “Ironically, with the Engineering play in any of the is – if your application has so much VSO working groups? I/O that you can provide a more dense majority of people solution with 6U, then you should use SCIDMORE: We definitely did 6U. If your application is thermally we’ve talked to, with OpenVPX. limited, then 3U makes more sense. For air-cooled solutions, 6U probably they want VME as VME: All right. What changes has the advantage in that you can get do you see coming in mil/ more I/O out. But, if you’re looking at a form factor; they defense in the next 5 to 10 a conduction-cooled solution, then 3U years? is clearly much better. don’t want the bus.” SCIDMORE: I say the biggest VME: Do you consider yourselves a challenge for the mil/aero guys system integrator or a provider of cards and chassis? is the disappearing of leaded solutions and what that’s going to bring. That’s probably the No. 1 thing on my list. Probably No. 2 SCIDMORE: We have 3U chassis. We do not have a 6U chassis. I would be that SERDES interfaces in excess of 5 GHz per sec- would say we’re doing system-level integration, as well, and there’s ond is another big problem coming down the pike. Routing them a desire for the market to see us as a systems integrator. I would say on boards and backplanes inside the box and supporting those if the industry doesn’t see us that way now, they will shortly. high-performance serial links in large systems – making that stuff work reliably across the full spectrum of temperature and envi- VME: Who do you consider your biggest two competitors? ronmentals could be a challenge.

SCIDMORE: I would think that the customer doing it themselves VME: Okay, what should we look for from Extreme is the largest competitor right out of the gate. I would say we Engineering going forward? probably are more of a match for GE and Curtiss-Wright in terms of which products we provide than Kontron or Mercury. SCIDMORE: More VPX, more system-level products, just sort of an overall expansion. We’re doing quite well. Just more of VME: OK. Getting back to OpenVPX, what are your predic- the same. CS tions? How much of a difference will it really make in the VME culture? Rob Scidmore is the President and CEO of Extreme Engineering Solutions (X-ES). In 1995, Rob founded SciTech, SCIDMORE: Since the OpenVPX announcement [at MILCOM] Inc., which merged with SBS Technologies in 1999. Rob stayed and that meeting, it’s almost like somebody flipped a switch that’s with SBS as the Madison operations manager until July of turning off CompactPCI and VME and gives system designers in 2002. Previous to SciTech, Rob was with Artesyn Technologies the company the excuse to go back to their management and say, Communications Group from 1984 through 1995. Contact him “No, VME and CompactPCI don’t make any sense.” Now they can at [email protected]. go after these new standardized serialized buses that are so popular today. Extreme Engineering Solutions (X-ES) Conversely, VME is a very, very old technology – a giant parallel 608-833-1155 bus. There’s no new money being put into it, so I can’t under- www.xes-inc.com stand why anybody would go there. Ironically, with the majority of people we’ve talked to, they want VME as a form factor; they don’t want the bus.

VME and Critical Systems / Resource Guide 2011 29 Special ēĉĚĘęėĞĊĝĊĈĘęĆđĐǣ ęĘđĊČĆĈĞǡĕėĔČĊēĞǡĆēĉėĎěĆđĘ

Mil tech gets smart with OpenVPX, VXS designs

Q&A with Dr. Günter Zahnenbenz, CEO at Hartmann Electronik

Editor’s note: Providing “intelligent solutions” (aka backplanes, chassis, and power supplies) for the military and industrial markets is all in a day’s work at Hartmann Elektronik. While it might appear the company has been standoffish when it comes to OpenVPX, the company’s CEO, Dr. Günter Zahnenbenz, says that’s a wrong impression. He also tells why the company still holds hope for the less-rising VXS star.

VME: Can you remind us briefly what Hartmann Electronik’s [Another challenge is that] military programs commonly last technology focal point is, and how many employees and loca- 15 to 20 years, while the lifespan of industrial applications is tions it has. commonly 3 to 5 years. Hartmann is able to meet both [lifespan] challenges. ZAHNENBENZ: Hartmann Electronik provides design and manufacturing with a focus of system chassis, backplanes, and VME: You’re a member of the VSO’s VXS Marketing Alliance, power supplies. Hartmann Electronik is part of the ELCOM divi- at the same time some in the industry say VXS is a proverbial sion of Phoenix Mecano. Along with sister company W-IE-NE-R falling star. Plein & Baus GmbH, we have 150 employees in 3 manufacturing locations. Phoenix Mecano, a global manufacturer of mechani- ZAHNENBENZ: Well, of course, VXS is a new VITA standard cal/electromechanical products, employs almost 6,000 people, (VITA 41) that combines the 320 MBps parallel VME bus with with 55 subsidiaries in 26 countries including the United States, high-speed serial fabrics of up to 2.5 GBps. We think of VXS, United Kingdom, Spain, France, Switzerland, Italy, Brazil, performance-wise, as an interim technology between VME64x Australia, Tunisia, Singapore, and China. In addition, we have and VPX. Drawing upon the large, well-established ecosystem of 19 production and assembly manufacturing locations worldwide. VME-based products, VXS provides a necessary bridge between the two technologies. VME: Hartmann specializes in backplanes, system platforms, and intelligent solutions. What do you mean by “intelligent VME: Has Hartmann had any VXS contract wins? solutions”? ZAHNENBENZ: W-IE-NE-R Plein & Baus GmbH/Hartmann ZAHNENBENZ: Essentially, to us, the phrase “intelligent solu- was selected in September 2010 as vendor for a major VXS chas- tions” means three things: sis program for the Hall-D project at Jefferson Lab in Virginia, USA. So the W-IE-NE-R 21-slot VXS crates will house the new 1. The experience/expertise gained over 35 years in designing JLAB data acquisition modules. The crates are outfitted with 5,000+ custom high-speed backplane layouts. Today’s Hartmann Electronik 21-slot VXS backplanes and are micro- designs demand ever-increasing speed and throughput, so processor controlled, low-noise 3 kW power supplies as well as our designs continue to evolve to allow customers to fully high-performance cooling fan trays. utilize the latest processors. OpenVPX, with its high- density RT2 connectors, is a perfect example of how market VME: Hartmann has produced some VPX products, but it demands require more sophisticated, intelligent designs. appears you’ve kept away from the OpenVPX side of things? 2. From a historical perspective, originally backplanes were only passive. Today’s technology incorporates active ZAHNENBENZ: That is a wrong impression. On the contrary, components such as bridges and switches. we think of OpenVPX as a future core business of Hartmann. 3. To support our customers’ needs for system management, And, in fact, we already have five different backplanes based on we offer local and remote monitoring and control, OpenVPX and are working daily on more products. In addition, temperature-controlled cooling, voltage monitoring, and we have introduced several new products to support VPX, such system reboot/on/off, including a WEB server and SNMPv2 as an open frame development chassis, preconfigured chassis, compliant protocol. load boards, test adapters, and we have a small developer chassis in development. VME: What are the biggest challenges your mil & aero customers face? What is the technical solution? VME: Will VPX/OpenVPX’s remain dominant in the industry in the next decade, or will the rugged SFF space be taken over ZAHNENBENZ: The challenges our customers face in the mil/ by the emerging VITA 73, 74, and 75 standards instead? aero space include Size, Weight, and Power (SWaP), for one thing. Also, increasing power density on board-level products places ZAHNENBENZ: Within the next 10 years the OpenVPX extreme demands in power and cooling performance. And the need standard will become even more established, while VITA 73, 74, for increasing speeds, currently up to 10 GHz, pushes manufactur- and 75 will be solutions for special applications. ers such as Hartmann to continue improving the design.

30 VME and Critical Systems / Resource Guide 2011 VME: Does Hartmann plan on utilizing the VITA 73, 74, and 75 small form factors when they are complete? “It is a fact that some backplanes are going to be replaced permanently in some applications ZAHNENBENZ: Because we are so customer driven at Hartmann Electronik, that will be decided by the marketplace by solutions without a backplane. But it is also a and customer [when the time comes]. If there is a need for those fact that new backplane-based applications are products, Hartman Electronik will certainly set up products based on these specifications. arising continuously. So we do not predict that backplanes will disappear in the near future.” VME: New optical interconnects are touted to perhaps make backplanes obsolete, at least in some applications. Do you think backplanes will ever be completely obsolete? Product Spotlight ZAHNENBENZ: We have been hearing these statements for more than 20 years now. It is a fact that some backplanes are ® ™ going to be replaced permanently in some applications by solu- VM6050 - 6U VME Intel Core i7 tions without a backplane. But it is also a fact that new back- Single Board Computer plane-based applications are arising continuously. So we do not Kontron VM6050 brings increased performance and reduced development predict that backplanes will disappear in the near future. CS time to new and existing VME system designs. With 100% I/O compatibility with VM6250, its PowerPC sibling, both featuring VITA 57 FMC interface, Dr. Günter Zahnenbenz is CEO of Hartmann Electronik, VM6050 is the ideal bridge where he has worked since 1984. By 1986, he was CEO and between all existing VME a major shareholder. In 2000, Phoenix Mecano AG, a Swiss designs and modern CPU and stock exchange holding, merged the shares of Hartmann. I/O performance and price, Today, he is CEO of Hartmann and W-IE-NE-R Plein & Baus regardless of the software GmbH, both companies under the roof of Phoenix Mecano AG, legacy. It combines extremely developing system platforms for military programs, nuclear high x86 computing and research, and industrial applications. He studied Economics in graphics performance with Stuttgart Hohenheim and earned his doctorate in 1984. flexible and modular expansion possibilities in four different ruggedization levels. For more information – www.kontron.com/vme Hartmann Electronik 937-324-4422 +1 888 294 4558 www.hartmann-electronic.com www.kontron.com

VME and Critical Systems / Resource Guide 2011 31 ĕĊĈĎĆđĉěĊėęĎĘĎēČ ĊĆęĚėĊ

Realizing the potential of OpenVPX

By Shan Morgan, Sr. Vice President, Elma Electronic Inc.

The rapid acceptance of OpenVPX (VITA 65) is clear evidence Q Application- and system-level know-how – A system of the architecture’s potential for demanding, harsh environ- is not a bag of parts. It is imperative to understand ment applications. By providing a path for designers to imple- how applications interact with each other to solve the ment current high-bandwidth technologies, VPX (VITA 46) customer’s needs and which limitations a system must allows companies to leverage their past investment in VITA- meet (thermal, vibration, power, and so on). based standards. The quick adoption of OpenVPX by the tra- Q Modified standard backplane implementation – The ditional VITA-based ecosystem reduces the potential risks heart of the system architecture is the backplane. The associated with interoperability, time to market, EOL, and cost use of multiple vendor boards with varying profiles in considerations. a tailored way demands a high-performance, reliable communication path be provided by the backplane. The mil/aero market segment is one of the primary target mar- Q Modified standard and custom chassis design – The kets for OpenVPX. Because of its high-bandwidth capabilities, deployed environment for VPX is wide ranging, and a it has attracted much attention in regard to graphical applica- company with broad experience with packaging will tions that require high bandwidth and high-speed processing eliminate a major potential point of program risk. capabilities. High-volume data movement from FPGA boards Q The right strategic partners – Often the optimal system to SBC boards for front- and back-end processing is also of requires the integration of SBCs, switch, storage, and I/O high interest. boards from multiple vendors. Working with a company that has relationships in place with “best in class” The key technology benefit of OpenVPX is the non-“bus” ori- companies insures the performance of the overall solution. ented, intraboard bandwidth using serial point-to-point fabric Q The right fit – Many companies understand technology, architectures. This allows for hybrid designs that can include but effectively implementing “concept to deliverable” VMEbus, thus extending older custom VME designs into the requires a business model tailored to the customer’s new generation architectures. Also 3U VPX supports the mar- demands. The relatively low-volume, high-complexity ket’s need for deployable, rugged products demanding more needs of a defense contractor require a different model CPU processing and higher I/O bandwidth in Small Form Fac- than that of a contract manufacturer of high-volume tors (SFFs) for applications like unmanned vehicles and aero- telecom equipment. space designs, which all are trying to meet Size, Weight, and Power (SWaP) requirements. Companies considering OpenVPX for their next application will be successful because they are able to implement a Successful implementation of OpenVPX is driven by several standards-based solution that is tailored to their application key decision factors: profile selection, compliance versus com- requirements. The overall solution can be supported by multiple patibility, and vendor/partner selection. Profile flexibility is at vendors that offer the “best” solution, rather than compromise the heart of OpenVPX and is used to define the architecture on what is available from a single vendor. Central to the solu- of a system, through backplane, module, and board selection tion is the backplane in moving from the lab to deployment, (backplane, slot, and module profiles). A solution is based on especially when migrating to ATR solutions, where eliminating selecting the right combination of these profiles to solve a spe- cables often requires custom changes to standard backplanes, or cific customer requirement. Understanding compliance versus a specialized breakout panel. compatibility is necessary when selecting the board payload. A board vendor may indicate which profiles they comply with, OpenVPX has a complexity of options at the system level. Tak- but that does not exclude them from being used in some subset ing full advantage of its application potential requires choosing of the full profile. Backplane profiles may not have full compli- the right partner that understands the application-level solu- ance, yet still provide a subset of capabilities. tions, the individual building blocks of chassis, backplane, and payload, and then has the resources in place to make the concept Choosing the right vendor/partner is tantamount to the suc- a deliverable reality. cess of any program. More so than past architectures, Open- VPX requires a systems-architecture-level understanding of With the industry’s full support of OpenVPX, a wide range of prod- the application and a spectrum of resources to implement the ucts is available from and is being deployed by nearly all of the solution in a low-volume, complex manufacturing environment. traditional VITA vendor base, insuring its growth moving forward. Important considerations are: Elma Electronic Inc. | www.elma.com

32 VME and Critical Systems / Resource Guide 2011 Technology ĎĒĊęĔĈčĆēČĊęčĊĈĚĘęĔĒĎğĆęĎĔēĕĆėĆĉĎČĒ Board customization as easy as 1, 2, 3 – and at a fraction of the cost

By Staff Editor

As the need for customized technologies in mil electronics marches on, Emerson’s Embedded Computing Division steps to the fore with its RapiDex board customization service – touted to cut customization costs by at least 25 percent, while slashing volume commitments by a whopping 99 percent and delivery time by at least 33 percent, the company estimates.

Imagine a military embedded electronics yields a return on investment. But cus- and specialty alternatives. Skeptics might realm where all boards were pure COTS tomization involves an entire develop- wonder how it’s possible to just pick and and no customization was needed. OK, ment cycle and gets very expensive,” says choose various functions from a library dreaming aside, pure customization and Anliker. and then have them all work together, modified COTS are just reality in defense. without design interface standards. And customization usually means three Emerson’s Embedded Computing RapiDex has reportedly solved such stitch- things: snail-like development times, Division – comprising Artesyn, Force ing-it-all-together issues. mandated high volumes, and skyrocketed Computer, Motorola, Blue Wave, and costs to ensure that customized board Prolog – implements RapiDex, which “Here’s a good analogy from a software meets all relevant specs. However, the often cuts typical customization costs by perspective,” Anliker explains. “You can Emerson Embedded Computing Divi- 25 percent, while volume commitment just write straight line code or you can sion’s new-this-year RapiDex board cus- and delivery time are typically slashed by use classes of objects, whether it’s Java or tomization service aims to shift the para- 99 and 33 percent, respectively. C++, and you can do it a lot faster.” digm, requiring a fragment of the typical price tag, volume, and development time A closer look at how it works Eye on the future for custom wares. First, the customer develops the specifi- While product road maps make develop- cation. Then within two days, Emerson ment easier in some ways, they can make Why do we need it? gives the customer a package including a life more difficult for the product designer Though it focuses on customizing both quote, user manual, 3D model, data sheet, when they have to create low-, medium-, ruggedized and benign small factor boards and pricing. and high-end versions. And there are also such as COM Express Compact, COM the requests to do something-or-other in Express Basic, Mini-ITX, and Micro- Then the customer pays a $75K manu- the next version (but not right now). ATX, the RapiDex process can also be facturing setup fee up-front and makes used for completely custom form factors a volume commitment of 100 pieces (as The RapiDex good news: Product design- – for example, a round circuit board with compared to the typical $100K+ costs and ers can spec the board so that the same holes in the middle for building torpedoes, 10K+ volume commitments). Then eight Ethernet controller on their low-end or a long, rectangular, irregularly shaped weeks later (as compared to the typi- board is also on their mid-range board, to thermostat. Or it might just be a customer cal 24+ weeks), the first article board is ensure that the same software works with wanting a custom carrier board to mix and produced. Production boards then follow both versions. And product designers can match with another vendor’s COTS board. another eight weeks later. use the same manufacturer for all versions of the boards. “We can do [those] like falling off a log. “When we certify boards for UL and FCC No problem at all,” says Rod Anliker, and so on, we do that in different countries, And if something changes with the Director of Services Marketing at Emer- and that takes time – not because it’s tech- board’s requirements a year or two son’s Embedded Computing Division. nically difficult, but just to turn the crank later – such as needing more memory or on all that bureaucracy,” details Anliker. wanting to implement a next-gen Intel But the RapiDex service didn’t just come “So the first article boards aren’t neces- processor – RapiDex quickly handles into being overnight. It was two years in sarily fully certified to where you can ship that. “The control factor is what’s really the making prior to its official green light them to an end customer. But they’re the got people’s eyes lighting up,” remarks earlier this year. The company noticed exact same board electrically and mechan- Anliker. “[Product designers] can then that small form factors vendors in par- ically that goes into volume production.” design a product line that makes it easy ticular often requested board customiza- So production ramps up fast thereafter. to do software, easy to control [the] tion, but it wasn’t as profitable as it should form, fit, and function in their product,” have been – for anyone. The secret sauce revealed? he concludes. Emerson (wisely) isn’t going to reveal “We try to spin boards to meet certain cus- all their secret sauce. But they did tell us Our question is: Will RapiDex will even- tomer needs ASAP, but reality is that it’s this: From a RapiDex library, custom- tually be suited to the nascent VITA/VSO an expensive proposition because when ers can choose “functions” such as form small form factor standards (VITA 73, 74, we develop a standard board, the volume factor, expansion slots, processing, I/O, and 75)? Time will tell. CS

VME and Critical Systems / Resource Guide 2011 33 2011 Resouce Guide PROFILE INDEX

Company Category Page Company Category Page Acromag New VITA Standards 51 Emerson Network Power Single Board Computer 75 Agilent Technologies Inc. New VITA Standards 51 Extreme Engineering Solutions, Inc. (X-ES) Avionics 35 Aitech Defense Systems Rugged Computer Systems 70 Extreme Engineering Solutions, Inc. (X-ES) New VITA Standards 61-62 ALPHI Technology Corporation Communication 35 Extreme Engineering Solutions, Inc. (X-ES) Rugged Computer Systems 66 Amphenol Backplane Systems New VITA Standards 52, 62 Extreme Engineering Solutions, Inc. (X-ES) Storage (digital) 77 Annapolis Micro Systems, Inc. DSP Boards and S/W 36, 38-41 GDCA, Inc. Single Board Computer 72 Annapolis Micro Systems, Inc. Industrial Applications 48 Hartmann Electronic Industrial Applications 46 Annapolis Micro Systems, Inc. New VITA Standards 53 Highland Technology, Inc. Test & Instrumentation 81 Annapolis Micro Systems, Inc. Semiconductor/ICs 63 Hypertronics New VITA Standards 52 Annapolis Micro Systems, Inc. Single Board Computer 73-74 Innovative Integration DSP Boards and S/W 37, 44, 46 Annapolis Micro Systems, Inc. Surveillance Systems 78-80 Innovative Integration Mezzanines 49 BittWare New VITA Standards 54 Innovative Integration New VITA Standards 59-60 CES Creative Electronic Systems Rugged Computer Systems 64 Innovative Integration Rugged Computer Systems 65 Concurrent Technologies Inc Single Board Computer 71 CSP Inc. MultiComputer Division New VITA Standards 54 Innovative Integration Storage (digital) 75 Curtiss-Wright Controls Electronic Systems New VITA Standards 55 Mercury Computer Systems, Inc. DSP Boards and S/W 37, 42-44 Curtiss-Wright Controls Electronic Systems Rugged Computer Systems 67, 69 Pentek, Inc. DSP Boards and S/W 45 Dawn VME Products New VITA Standards 55-57 Phoenix International Storage (digital) 76, 77 Dynatem, Inc. Single Board Computer 72 Pinnacle Data Systems, Incorporated Mezzanines 49, 50 Elma Bustronic New VITA Standards 57 SIE Computing Solutions, Inc. Rugged Computer Systems 64, 68 Elma Bustronic Rugged Computer Systems 67 TE Connectivity Rugged Computer Systems 68-69 Elma Electronic Inc. New VITA Standards 58 Themis Computer Storage (digital) 76 Elma Electronic Inc. Rugged Computer Systems 71 Vector Electronics & Technology, Inc. Industrial Applications 47 Emerson Network Power New VITA Standards 58

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34 VME and Critical Systems / Resource Guide 2011 Avionics: Power Supply Extreme Engineering Solutions, Inc. (X-ES) %FNJOH8BZ 4VJUFt.JEEMFUPO 8*64" www.xes-inc.com

XPm2020: VITA 62 3U VPX Power Supply The XPm2020 is a VITA 62-compliant 3U VPX power supply that takes in a MIL-STD-704 28V-DC input voltage and provides up to 8PO7 7 BOE7BUVQUPFGmDJFODZ5IF91N BMTPQSPWJEFTPODBSE.*-45%&&.*mMUFSJOHBOEPQUJPOBMPO card hold-up capacitance, which provides 75 ms of holdup time BU8PVUQVU

5IF91NmUTJOB7*5"DPNQMJBOU6719PSJODITMPU FEATURES Up to 8.3 A on 12V, 2 A on -12V, 22 A on 5V, 27 A on 3.3V, and 4 A on 3.3V i MIL-STD-704 28V-DC input voltage "VYJMJBSZDBOCFTVQQPSUFEPOFBDISBJM TFQBSBUFMZ5IF91N i .*-45%&&.*mMUFSJOH DBO QSPWJEF VQ UP B DPNCJOFE 8 PG UPUBM PVUQVU QPXFS BU i VITA 62.0-compliant power supply NBYJNVNPQFSBUJOHUFNQFSBUVSF5IF91NDBOBMTPCFQBJSFE i 6QUP8PVUQVUPO7 7 BOE7 with another XPm2020 for load sharing. i 0ODBSEIPMEVQDBQBDJUPSGPSVQUPNT BU8 PGIPMEVQ time (optional) i 6QUPFGmDJFOU The XPm2020 also features an Intelligent Platform Management i -40°C to 85°C conduction cooled operating temperature (at the Interface (IPMI) controller that monitors board voltages and temper- thermal interface) atures. In addition, the IPMI controller can turn off output power. i Two-level maintenance support i Load sharing support with another XPm2020

For more information, contact: TBMFT!YFTJODDPN www.vmecritical.com/p52394

Communication: 1553 ALPHI Technology Corporation &4PVUIFSO"WFt5FNQF ";64" www.Alphitech.com 5IF"-1)*7.&.$0. VME-MCOM Controller QSPWJEFTB6IJHIQFSGPS NBODFnFYJCMF*0TDIFNF ALPHI Technology Corp. releases on a single board 6U VME Multi GPSBQQMJDBUJPOTSFRVJSJOH communication combinations board. The VME-MCOM combines NVMUJGVODUJPOBMJUZCVUXJUI MJNJUFETZTUFNTQBDF5IF Single or Dual Channel 1553B bus, 8 Channels TX and 16 RX 7.&.$0.PDDVQJFT ARINC-429, 4 Channels programmable RS-232/RS-422/RS-485, POFTMPUPOUIF67.& 24 differential I/O lines and Dual Channel CANbus. This is a TZTUFN'PSIJHIEFOTJUZ *0PSVOJRVFDPNCJOB perfect solution for embedded/embarked applications, whether Mili- UJPOT UIF7.&.$0.JT tary or Commercial. UIFQFSGFDUTPMVUJPO Available Software Drivers: t$MJCSBSZEMMT FEATURES t-JOVYESJWFST i 1 or 2 Channels dual redundant (A/B channel) 1553 communications t8JOEPX91ESJWFST i Multiprotocol Support of MIL-STD1553A/B Notice 2 and t7Y8PSLTESJWFST STANAG 3838 i 8 Channels TX and 16 RX ARINC-429 Applications: i 4 Channels Serial Communications with programmable interface: This is a perfect solution for a wide array of Multiprotocol RS-232/RS-422/RS-485 modes Communication applications such as: i 24 Differential I/O lines RS-422/LVDS t5FTUFRVJQNFOUTVQQPSUJOHFWBMVBUJPO TJNVMBUJPO i Dual Channel CANbus t.POJUPSJOH BOEBOBMZTJT i Other options available: A/D, D/A, Synchro resolve t0QFSBUJPOBMFRVJQNFOUTVDIBTBWJPOJDT TQBDF4BUFMMJUFTZTUFNT aircraft onboard systems i A32/A24/A16: D16/D08 t*OEVTUSJBM .JMJUBSZ $PNNFSDJBMTZTUFNT BOENPSF i Interrupt: 1-7 software programmable

For more information, contact: [email protected] www.vmecritical.com/p52895

VME and Critical Systems / Resource Guide 2011 35 DSP Boards and S/W: Analog-related Annapolis Micro Systems, Inc. "ENJSBM$PDISBOF%SJWF 4VJUFt"OOBQPMJT .%64" www.annapmicro.com

WS4 Quad 250/400/500 MSps A/D The Annapolis Quad Channel 250/400/500 MSps A/D I/O Card provides four A/D inputs with converter speeds of up to 250, 400, or 500 MHz and resolutions of 13, 14, or 12 bits, respectively. The board has four A/D converters from TI (ADS5444, ADS5474, or ADS5463) fed by onboard analog input circuits that convert the single-ended, 50-ohm SMA input into differential signals for the ADC.

There is an onboard ultra-low jitter and skew clock distribution circuit to allow all four channels on a single A/D I/O board to be synchronized together. There is also an external clock input and a trigger input allowing multiple A/D I/O cards to be synchronized together. Synchronization of A/D I/O cards can be facilitated by the Annapolis 4 or 8 Channel Clock Distribution Boards.

In concert with the WILDSTAR 4 or WILDSTAR 5 FPGA processing main boards, this mezzanine board supplies user-conﬁ gurable real- time continuous sustained processing of the full data stream. Up to two A/D I/O cards can reside on each WILDSTAR 4 or WILDSTAR 5 VME/VXS or IBM Blade main board or reside on one A/D I/O card on FEATURES each PCI-X or PCI Express main board. i Four TI A/D converters of one of the speed and bit size types: ADS5444 250 MSps 13 bits, ADS5474 400 MSps 14 bits, ADS5463 Annapolis Micro Systems, Inc. is a world leader in high- 500 MSps 12 bits performance COTS FPGA-based processing for radar, sonar, SIGINT, i Analog input bandwidths of up to: 500 MHz for the 250 MSps A/D board, 1,400 MHz for the 400 MSps A/D board, 2,000 MHz for the ELINT, Digital Signal Processing, FFTs, communications, software 500 MSps A/D radio, encryption, image processing, prototyping, text processing, i Six SMA front panel connectors: four 50-ohm analog inputs, one and other processing intensive applications. single-ended 50-ohm clock input, one trigger input i Onboard ultra-low jitter and skew clock distribution circuit to allow Our boards run on many different operating systems. We support our synchronization of all four channels on a single I/O card board products with a standardized set of drivers, APIs, and VHDL i I/O card plugs onto WILDSTAR 4 or 5 VME/VXS/PCI-X/PCI Express/ simulation models. VHDL source is provided for the interfaces to A/Ds, IBM Blade main boards D/As, DRAM/SRAM, LAD bus, I/O bus, and PPC Flash. CoreFire™ i JTAG, ChipScope, and Serial Port access users will have the usual CoreFire Board Support Package. i Proactive thermal management system; available in both commercial and industrial temperature ranges The combination of our COTS hardware and our CoreFire FPGA i Full CoreFire Board Support Package for fast, easy application Application Development tool allows our customers to make development and technology refresh massive improvements in processing speed, while achieving i VHDL model, including source code for hardware interfaces significant savings in size, weight, power, person-hours, dollars, i Includes one-year hardware warranty, software updates, and and calendar time to deployment. customer support; reduce risk with COTS i We offer training and exceptional special application development support, as well as more conventional customer support i Annapolis is famous for the high quality of our products and for our unparalleled dedication to ensuring that customers’ applications succeed

For more information, contact: wﬁ [email protected] www.vmecritical.com/p35976

36 VME and Critical Systems / Resource Guide 2011 DSP Boards and S/W: Analog-related Mercury Computer Systems, Inc. 3JWFSOFDL3PBEt$IFMNTGPSE ."64" www.mc.com

Echotek Series SCFE-V6-OVPX The Echotek® Series SCFE-V6-OVPX Virtex-6 FPGA Processing Engine from Mercury Computer Systems provides high-performance processing for applications requiring extreme FPGA processing power, such as EW, ELINT, SIGINT, RADAR, Commercial Wireless, and Deep Packet Inspection. Utilizing top-end FPGAs available from market leader Xilinx®, the SCFE-V6-OVPX solves the toughest signal processing problems in a cost-effective form factor. VITA 57 FPGA Mezzanine Card (FMC) mezzanine sites and OpenVPX Rear Transition FEATURES Modules (RTMs) provide diverse sensor and I/O entry points, both i Next-generation architecture for high-end defense and analog and digital. When incorporated with the Mercury Ensemble™ commercial applications such as SIGINT, EW, Communications, RADAR, Commercial Wireless, and Deep Packet Inspection multi-computing OpenVPX modules, the SCFE-V6-OVPX represents i Ultimate processing power with three Xilinx® Virtex™-6 LX240Ts or an essential building block in powerful heterogeneous subsystems SX315Ts that can be tailored to speciﬁ c applications and platforms. i VITA 57 FMC sites for ﬂ exible I/O enhancements, including Echotek® Series multi-channel digitizer FMCs i High-speed OpenVPX interface fully compatible with Ensemble OpenVPX modules i EchoCore™ IP Advantage i Flexible Control-Plane Processor i Flexible I/O with FMC Sites

For more information, contact: [email protected] www.vmecritical.com/p52893

DSP Boards and S/W: FPGA-based, including mezzanines

Innovative Integration "8BSE"WFOVFt4JNJ7BMMFZ $"64" www.innovative-dsp.com

X6-1000M The X6-1000M integrates high-speed digitizing and signal generation with signal processing on a PMC/XMC I/O module for demanding DSP applications. The tight coupling of the digitizing to the Virtex-6 FPGA core realizes architectures for SDR, RADAR, and LIDAR front end sensor digitizing and processing. The PCI Express system interface sustains transfer rates over 2 GB/s for data recording and integration as part of a high performance real-time system. Available FPGAs: Xilinx Virtex-6 SX315T/SX475T or LX240T. FEATURES i Two 1 GSPS, 12-bit A/D channels The X6-1000M features two, 12-bit 1 GSPS A/Ds and two 1 GSPS 16-bit i Two 1 GSPS, 16-bit DAC channels i ±1V, AC or DC-Coupled, 50 ohm, SMA inputs and outputs DACs. Analog input bandwidth of over 2 GHz supports wideband i 4 Banks of 1 GB DRAM (4 GB total) applications and undersampling. The DACs have features for inter- i Ultra-low jitter programmable clock polation and coarse mixing for upconversion. The sample clock is i Arbitrary Waveform Generation Memory from either a low-jitter PLL or external input. Multiple cards can be i Gen2 x8 PCI Express providing 2 GB/s sustained transfer rates synchronized for sampling and down-conversion. i PCI 32-bit, 66 MHz with P4 to Host card i 20-25W typical Conduction Cooling per VITA 20 i Ruggedization Levels for Wide Temperature Operation i Adapters for VPX, CompactPCI, desktop PCI and cabled PCI Express systems

For more information, contact: [email protected] www.vmecritical.com/p52897

VME and Critical Systems / Resource Guide 2011 37 DSP Boards and S/W: Data Acquisition Annapolis Micro Systems, Inc. "ENJSBM$PDISBOF%SJWF 4VJUFt"OOBQPMJT .%64" www.annapmicro.com

WILDSTAR 5 for IBM Blade Perfect Blend of Processors and Xilinx Virtex-5 FPGAs. Eleventh Annapolis Generation.

Direct Seamless Connections – No data reduction between: external sensors and FPGAs, FPGAs and processors over IB or 10 Gb Ethernet backplane, FPGAs and standard output modules.

Ultimate Modularity – From zero to six Virtex-5 processing FPGA/ memory modules, and two Virtex-5 I/O FPGAs. Accepts one or two standard Annapolis WILDSTAR 4/5 I/O mezzanines: Quad 130 MSps through Quad 500 MSps A/D, 1.5 GSps through 2.2 GSps A/D, Quad 600 MSps DAC, Inﬁ niBand, 10 Gb Ethernet, SFPDP.

Fully Integrated into the IBM Blade Management System – Abundant power and cooling for maximum performance.

Annapolis Micro Systems, Inc. is a world leader in high-performance COTS FPGA-based processing for radar, sonar, SIGINT, ELINT, Digital Signal Processing, FFTs, communications, software radio, encryption, image processing, prototyping, text processing, and other processing FEATURES intensive applications. We support our board products with a stan- i From two to eight Virtex-5 FPGA processing elements – LX110T, dardized set of drivers, APIs, and VHDL simulation models. LX220T, LX330T, FX100T, FX130T, or FX200T; six are pluggable with power module and memory Develop your application very quickly with our CoreFire™ FPGA i Up to 10.7 GB DDR2 DRAM per WILDSTAR 5 for IBM Blade Board Application Builder, which transforms the FPGA development i 144 x 144 crossbar; 3.2 Gb per line; two external PPC 440s – 1 per process, making it possible for theoreticians to easily build and each I/O FPGA test their algorithms on the real hardware that will be used in the i Full CoreFire Board Support Package for fast, easy application fi eld. CoreFire, based on datafl ow, automatically generates distri- development buted control fabric between cores. Our extensive IP and board i VHDL model, including source code for hardware interfaces and support libraries contain more than 1,000 cores, including fl oating ChipScope access point and the world’s fastest FFT. A graphical user interface for design i Available in both commercial and industrial temperature grades entry supports hardware-in-the-loop debugging, and provides proven, i Proactive thermal management system – board-level current reusable, high-performance IP modules. measurement and FPGA temperature monitor, accessible through host API WILDSTAR 5 for IBM Blade, with its associated I/O cards, provides i Includes one-year hardware warranty, software updates, and extremely high overall throughput and processing performance. The customer support combination of our COTS hardware and CoreFire allows our customers i Blade management controller; USB, RS-485, Ethernet, KVM, 16 RIO, to make massive improvements in processing speed, while achieving Switch to 1 GbE over backplane signifi cant savings in size, weight, power, person-hours, dollars, and calendar time to deployment. i Save time and effort; reduce risk with COTS boards and software i We offer training and exceptional special application development Achieve world-class performance; WILDSTAR solutions outperform support, as well as more conventional support the competition. i Famous for the high quality of our products and our unparalleled dedication to ensuring that the customer’s applications succeed

For more information, contact: wﬁ [email protected] www.vmecritical.com/p35882

38 VME and Critical Systems / Resource Guide 2011 DSP Boards and S/W: FPGA-based, including mezzanines Annapolis Micro Systems, Inc. "ENJSBM$PDISBOF%SJWF 4VJUFt"OOBQPMJT .%64" www.annapmicro.com

CoreFire Develop your application very quickly and easily with our CoreFire™ FPGA Application Builder, which transforms the FPGA development process, making it possible for theoreticians to easily and quickly build and test their algorithms on the real hardware that will be used in the ﬁ eld.

Use CoreFire’s graphical interface to drag and drop library elements onto the design window. Modify your input and output types, numbers of bits, and other core variables by changing module parameters with pull-down menus. The modules automatically provide correct timing and clock control. Insert debug modules to report actual hardware values for hardware-in-the-loop debugging. Hit the Build button to check for errors and as-built core sizes and to build an encrypted EDIF fi le. Use the Xilinx ISE tool to place and route each FPGA design. Modify and use the jar fi le or the C program created by the CoreFire Build to load your new fi le into your WILDSTAR and I/O card hardware. Use the CoreFire Debugger to view and modify register and memory contents in the FPGA and to step through the datafl ow of your design running in the real physical hardware. FEATURES i Datafl ow-based – automatically generates intermodule Our extensive IP and board support libraries contain more than control fabric 1,000 proven, reusable, high-performance cores, including FIR and i Drag-and-drop graphical interface CIC fi lters, a channelizer, and the world’s fastest FFT. We support i Work at high conceptual level – concentrate on solving conversion between data types: bit, signed and unsigned integers, algorithmic problems single precision fl oating point, integer and fl oating point complex, i Hardware-in-the-loop debugging and arrays. A few of the newly added array cores include array com- i More than 1,000 modules incorporate years of application experience position and decomposition; slice, parallelize, serialize, repack, split, i Reduce risk with COTS boards and software merge, reorder, rotate, and concatenate transformations; matrix i Save time to market math, sliding windows, and convolutions. i Save development dollars i Easily port completed applications to new technology chips The combination of our COTS hardware and CoreFire enables our and boards customers to make massive improvements in processing speed i Training and custom application development available while achieving signifi cant savings in size, weight, power, person- i Achieve world-class performance; WILD solutions outperform the hours, dollars, and calendar time to deployment. competition i Annual node locked or networked license; includes customer support and updates

For more information, contact: wﬁ [email protected] www.vmecritical.com/p33544

VME and Critical Systems / Resource Guide 2011 39 DSP Boards and S/W: I/O Cards Annapolis Micro Systems, Inc. "ENJSBM$PDISBOF%SJWF 4VJUFt"OOBQPMJT .%64" www.annapmicro.com

2.0 GSps 10-bit A/D The Annapolis Single Channel 2.0 GSps A/D I/O Card provides one 2.0 GHz A/D input with a resolution of 10 bits. The board has one e2v AT84AS004 that is fed by an onboard analog input circuit, which converts the single-ended 50-ohm SMA input into differential signals for the ADC. There is a universal single-ended 50-ohm SMA clock input and a high-precision trigger input allowing multiple A/D I/O cards to be synchronized together. Synchronization of A/D I/O cards can be facilitated by the Annapolis 4 or 8 Channel Clock Distribution Boards.

Our boards run on many different operating systems. We support our FEATURES board products with a standardized set of drivers, APIs, and VHDL i One e2v AT84AS004 (2.0 GHz, 10-bit) A/D simulation models. VHDL source is provided for the interfaces to i Four SMA front panel connectors: one 50-ohm analog input, one A/Ds, D/As, DRAM/SRAM, LAD bus, I/O bus, and PPC Flash. CoreFire™ single-ended 50-ohm clock input, or differential 1.65 V LVPECL users will have the usual CoreFire Board Support Package. clock input i One high-precision trigger input with Fs precision; high-precision The combination of our COTS hardware and our CoreFire FPGA trigger input – 1.65 V LVPECL, 2.5 V LVPECL, 3.3 V LVPECL Application Development tool allows our customers to make i Analog input bandwidth is 100 KHz-3.0 GHz massive improvements in processing speed while achieving i I/O card plugs onto WILDSTAR 4 or 5 VME/VXS/PCI-X/PCI Express/ IBM Blade main boards signiﬁ cant savings in size, weight, power, person-hours, dollars, and calendar time to deployment. i JTAG, ChipScope, and Serial Port access i Full CoreFire Board Support Package for fast, easy application development Annapolis Micro Systems, Inc. is a world leader in high-performance COTS FPGA-based processing for radar, sonar, SIGINT, ELINT, i VHDL model, including source code for board-level interfaces Digital Signal Processing, FFTs, communications, software radio, i Proactive thermal management system encryption, image processing, prototyping, text processing, and i Includes one-year hardware warranty, software updates, and other processing intensive applications. customer support i We offer training and exceptional special application development support, as well as more conventional customer support Annapolis is famous for the high quality of our products and for our i Designed and manufactured in the USA unparalleled dedication to ensuring that the customer’s applications succeed.

For more information, contact: wﬁ [email protected] www.vmecritical.com/p36021

40 VME and Critical Systems / Resource Guide 2011 DSP Boards and S/W: I/O Cards Annapolis Micro Systems, Inc. "ENJSBM$PDISBOF%SJWF 4VJUFt"OOBQPMJT .%64" www.annapmicro.com

SFPDP UNI6 I/O Annapolis Micro Systems Inc.’s FPGA-based WILDSTAR family provides 24 SFPDP channels per VME slot.

The Annapolis SFPDP cards (UNI3 or UNI6) come with an easy-to- use Serial FPDP interface supporting up to 12 lanes of 2.5 Gb full duplex data. Three frame types are supported: Normal Data Fiber Frame, Sync without Data Fiber Frame, and Sync with Data Fiber Frame in Point-to-Point Mode.

The card has three individually conﬁ gurable, industry-standard 4X connectors, providing four lanes per connector, with dedicated signal conditioners to ensure clean communication. It supports up to 7.5 GB full duplex per I/O card and a wide variety of readily available copper and ﬁ ber cables.

Up to two serial I/O cards and two LVDS I/O cards can reside on each WILDSTAR 4 or WILDSTAR 5 VME/VXS main board, with half that number for the PCI-X or PCIe. The SFPDP card (UNI6) supports RocketIO protocol at up to 75 Gb full duplex per I/O card, three ports of 10G full duplex Infi niBand per I/O card, or 10G full duplex Ethernet per I/O card. FEATURES i Three individually confi gurable 4X connectors – four lanes per No other FPGA board vendor can match the volume of data we can connector send straight into the heart of the processing elements and then i Up to four 2.5 Gb full duplex Serial FPDP ports per connector straight back out again. i Up to 25 Gb full duplex RocketIO per connector i Up to 10 Gb full duplex Infi niBand per connector An FPGA-based high-performance processing engine thrives on data streaming in and out at high rates of speed. The FPGAs should i Up to 10 Gb full duplex Ethernet per connector be part of a balanced and unifi ed system architecture, providing i Optional on-board oscillators for other line rates like Fibre Channel maximum performance, with memory, processing power, and I/O i I/O card plugs onto WILDSTAR 4 or 5 VME/VXS/IBM Blade Chassis/ speeds designed and integrated for performance, scalability, and PCI-X/PCI Express main board growth. i JTAG, ChipScope, and Serial Port access Annapolis Micro Systems, Inc.’s WILDSTAR 4 (Xilinx Virtex-4 based) i Proactive thermal management system; available in both and WILDSTAR 5 (Xilinx Virtex-5 based) families of FPGA-based commercial and industrial temperature grades processing boards also support an extensive set of extremely i Includes one-year hardware warranty, software updates, and high-quality A/D and D/A boards. customer support i We offer training and exceptional special application development Annapolis Micro Systems, Inc. is a world leader in high-performance support, as well as more conventional customer support COTS FPGA-based processing for radar, sonar, SIGINT, ELINT, Digital i Full CoreFire Board Support Package for fast, easy application Signal Processing, FFTs, communications, software radio, encryp- development tion, image processing, prototyping, text processing, and other i VHDL model, including source code for hardware interfaces processing intensive applications.

Annapolis is famous for the high quality of our products and for our unparalleled dedication to ensuring that the customer’s applications succeed.

For more information, contact: wﬁ [email protected] www.vmecritical.com/p35968

VME and Critical Systems / Resource Guide 2011 41 DSP Boards and S/W: I/O Cards Mercury Computer Systems, Inc. 3JWFSOFDL3PBEt$IFMNTGPSE ."64" www.mc.com

Ensemble IOM-200 XMC The IOM-200 I/O Mezzanine XMC Module and IOR-280 RTM from Mercury Computer Systems provide the industry’s leading 10Gbps Ethernet I/O density. When two IOM-200s are conﬁ gured with the IOR-280 Rear Transition Module (RTM), up to eight channels of 10Gbps Ethernet can be supported per 6U OpenVPX slot.

The IOM-200 module includes a high-performance Altera Stratix IV GX ﬁ eld programmable gate array (FPGA) all in a single-wide XMC form factor. FEATURES i Up to eight 10GbE channels per 6U OpenVPX slot i Rear Transition Module available supports two IOM-200 XMCs i Includes high-performance user programmable FPGA i Mercury-provided Intel-based drivers supported under Linux industry-leading Quad 10Gbps Ethernet I/O density i Leverages open standards to ensure interoperability

For more information, contact: [email protected] www.vmecritical.com/p52885

DSP Boards and S/W: Multiprocessing Mercury Computer Systems, Inc. 3JWFSOFDL3PBEt$IFMNTGPSE ."64" www.mc.com

Ensemble GSC6200 The Ensemble™ 6000 series 6U OpenVPX™ GSC6200 GPU Processing Module from Mercury Computer Systems, Inc. harnesses the tre- mendous compute power of graphics processing units (GPUs) for rugged, high-performance, embedded signal and image processing in a broad range of defense and commercial applications, including radar signal processing, electro-optical and infrared image processing, electronic warfare and other applications requiring intense computational capabilities on large streams of data. Apply FEATURES GPUs to accelerate compute-intensive applications including i Dual MXM sites support 1 NVIDIA GeForce GTX 460M Fermi Fast Fourier Transforms (FFTs), Constant False Alarm Rate (CFAR), Architecture GPU, each with two single-link DVI interfaces QR Decomposition (QRD) Synthetic Aperture Radar (SAR). The i 48-lane, 12-port PCI Express Gen2 switch to backplane GSC6200 uses 2 NVIDIA GPUs based on their latest genera- i Software-controlled management features tion Fermi architecture, which provides signiﬁ cant enhancements i CUDA software environment for NVIDIA-based GPUs over the previous generation GPUs, including a larger number i Supports up to 2 high-end NVIDIA® compute nodes per 6U slot of parallel processing cores, larger memory capacity and higher i MXM form factor preserves rapid technical insertion of latest GPU memory bandwidth using GDDR5. architectures i Advanced power management capabilities i Conduction-cooled and air-cooled versions

For more information, contact: [email protected] www.vmecritical.com/p52886

42 VME and Critical Systems / Resource Guide 2011 DSP Boards and S/W: Multiprocessing Mercury Computer Systems, Inc. 3JWFSOFDL3PBEt$IFMNTGPSE ."64" www.mc.com

Ensemble HCD3210 The Ensemble™ 3000 Series HCD3210 3U OpenVPX™ Processing Module from Mercury Computer Systems is a single-slot solution for data acquisition and processing. By combining the performance logic of a highly capable Xilinx® Virtex™-6 FPGA with the real-time processing power of a Freescale™ MPC8640D dual-core processor, the HCD3210 supports multi-stage processing for many applications. The module’s XMC mezzanine site delivers I/O to these powerful processing elements, supporting high-performance processing for FEATURES size, weight, and power (SWaP)-constrained platforms. The multi- i General-purpose processing via dual-core MPC8640D processor plane OpenVPX architecture allows users to scale, knitting together running at 1.06 GHz, supported 1 GB of DDR2 SDRAM multiple HCD3210s into a powerful subsystem. i Xilinx® Virtex™-6 FPGA supported by two 9-MB banks of QDRII SRAM and 128 MB of DDR3-900M SDRAM i High-bandwidth communications, including native support for RapidIO and PCI Express® (PCIe) i XMC site supported by PCI Express (PCIe) per VITA 42.3 i IPMI controller for system management functions i MultiCore Plus® software environment with MC SAL

For more information, contact: [email protected] www.vmecritical.com/p52884

DSP Boards and S/W: Multiprocessing Mercury Computer Systems, Inc. 3JWFSOFDL3PBEt$IFMNTGPSE ."64" www.mc.com

Ensemble LDS6521 The Ensemble™ 6000 Series OpenVPX Intel® Core i7 Quad-Core Next Generation LDS6521 Module com-bines a powerful Sandy Bridge mobile-class quad-core Intel® 2nd Generation Core i7 processor, a high-performance FPGA for both fabric bridging and user- application functions, and high-bandwidth on-board and off-board communication fabrics in a single 6U OpenVPX slot. FEATURES The LDS6521 low-density server provides a next-generation archi- i One 10/100/1000BASE-T GigE connection: front panel on air-cooled, tecture that balances the disruptive computational capabilities of backplane on conduction-cooled the Intel 2nd Generation Core i7 processor with key high-bandwidth i One additional 10/100/1000BASE-T GigE connection to the I/O interfaces, providing a powerful and scalable computing archi- backplane tecture that is well aligned with high-end radar, electronic warfare, i Two 1000BASE-BX SERDES Ethernet connections to the backplane and image processing applications. i One front panel USB 2.0 interface on air-cooled i Two backplane USB 2.0 interfaces on both air-cooled and conduction-cooled i One front-panel eSATA interface provided on air-cooled i Two SATA interfaces to the backplane i Eight GPIO lines

For more information, contact: [email protected] www.vmecritical.com/p52892

VME and Critical Systems / Resource Guide 2011 43 DSP Boards and S/W: Other DSP-Fabric Switch Mercury Computer Systems, Inc. 3JWFSOFDL3PBEt$IFMNTGPSE ."64" www.mc.com

Ensemble SFM3010 The Ensemble™ 3000 Series SFM3010 3U OpenVPX™ Switch Fabric Module from Mercury Computer Systems combines Serial RapidIO® data-plane switching with a managed Gigabit Ethernet control-plane switch for maximum scalability. The SFM3010 also implements the OpenVPX Chassis Manager function for mission-critical system management. With the module’s XMC mezzanine site, users can stream I/O directly onto the data plane, delivering data to any processing element in the system without signiﬁ cant overhead. By combining these functions on a single 3U OpenVPX module, FEATURES the SFM3010 expands subsystem capabilities for size, weight, and i Control plane communications supported by a Broadcom Gigabit power (SWaP)-constrained environments. Ethernet switch with integrated MIPS processor core i Data plane communications supported by a Tundra Serial RapidIO switch with six 4x links to the backplane and two 4x links to the J15 XMC connector i XMC site supported by Serial RapidIO per VITA 42.2 i IPMI controller for system management functions i Air-cooled and conduction-cooled models available

For more information, contact: [email protected] www.vmecritical.com/p52883

DSP Boards and S/W: Radar/Sonar

Innovative Integration "8BSE"WFOVFt4JNJ7BMMFZ $"64" www.innovative-dsp.com

X6-GSPS The X6-GSPS integrates high-speed digitizing with signal processing on a PMC/XMC I/O module for demanding DSP applications. The tight coupling of the digitizing to the Virtex-6 FPGA core realizes architectures for SDR, RADAR, and LIDAR front end sensor digitizing and processing. The PCI Express system interface sustains transfer rates over 2 GB/s for data recording and integration as part of a high performance real-time system. Available with Xilinx Virtex-6 SX315T/SX475T or LX240T. FEATURES i Two 1.8 GSPS, 12-bit A/D channels The X6-GSPS features two, 12-bit 1.8 GSPS A/Ds that can be inter- i Single channel interleaved @ 3.6 GHz leaved to use as one 3.6 GSPS digitizer. Analog input bandwidth of i ±1V, AC-Coupled, 50 ohm, SMA inputs over 2.5 GHz supports wideband applications and undersampling. i 4 Banks of 1 GB DRAM (4 GB total) The sample clock is from either a low-jitter PLL or external input. i Ultra-low jitter programmable clock Multiple cards can be synchronized for sampling and down- i Gen2 x8 PCI Express providing 2 GB/s sustained transfer rates conversion. i PCI 32-bit, 66 MHz with P4 to Host card i 20-25W typical Conduction Cooling per VITA 20 i Ruggedization Levels for Wide Temperature Operation i Adapters for VPX, CompactPCI, desktop PCI and cabled PCI Express systems

For more information, contact: [email protected] www.vmecritical.com/p52898

44 VME and Critical Systems / Resource Guide 2011 DSP Boards and S/W: Software-Deﬁ ned Radio Pentek, Inc. 0OF1BSL8BZt6QQFS4BEEMF3JWFS /+64" pentek.com/go/vmergvpx

3U OpenVPX Cobalt Software Radio Boards Pentek is offering a new family of 3U OpenVPX Cobalt boards for data acquisition, software radio, and digital signal processing. These boards feature Xilinx Virtex-6 LXT or SXT FPGAs and offer ﬂ exible backplane fabric connections that support maximum data rates up to 4 GB/sec with Gen. 2 PCI Express and 2.5 GB/sec with other protocols.

All data and control paths are accessible by the FPGA, enabling factory-installed functions such as data multiplexing, channel selection, data packing, gating, triggering, and memory control. The Cobalt architecture organizes the FPGA as a container for data processing applications where each function exists as an IP (intellectual property) module.

Each member of the Cobalt family is delivered with factory-installed applications matched to the board’s analog interfaces. Depend- ing on model, these functions may include A/D acquisition and D/A waveform playback IP modules. IP modules for memory management, a controller for data clocking and synchronization FEATURES functions, a test signal generator, and a PCIe interface complete i Maximum data rates to 6 GB/sec with Gen. 2 PCIe protocol the factory-installed functions and enable the Cobalt board to i A/D sampling rates from 10 MHz to 1000 MHz with 12- to 16-bit operate as a complete turnkey solution without the need to develop resolution any FPGA IP. i D/A sampling rates up to 1.25 GHz i Support for Xilinx Virtex-6 LXT and SXT FPGAs The 3U OpenVPX form factor is compact and extremely well i Powerful linked-list DMA engines suited for avionics including UAVs, shipboard and airborne radar, i PCI Express as the primary control and data transfer interface beamforming, and signal-intelligence applications. All of these i Secondary serial gigabit interface boards are also available in XMC, PCI Express, and CompactPCI i On-board clocking and synchronization formats. i Available in XMC, PCI Express, OpenVPX and CompactPCI formats Model 53620: Transceiver with Three 200 MHz A/Ds, DUC (Digital i Available in commercial form and in several ruggedization levels up to and including conduction cooling Upconverter) and Two 800 MHz D/As Model 53621: Transceiver with Three 200 MHz A/Ds, DDCs (Digital Downconverters), DUC and Two 800 MHz D/As Model 53630: 1 GHz A/D and 1 GHz D/A Model 53650: Transceiver with Two 500 MHz A/Ds, DUC and Two 800 MHz D/As Model 53660: 4-Channel 200 MHz, 16-bit A/D Model 53661: 4-Channel 200 MHz, 16-bit A/D with 4-Channel DDC and Beamformer Model 53662: 4-Channel 200 MHz, 16-bit A/D with 32-Channel DDC Model 53690: L-Band RF Tuner from 925 to 2175 MHz, with 2-Channel 200 MHz A/D

For more information, contact: [email protected] www.vmecritical.com/p52490

VME and Critical Systems / Resource Guide 2011 45 DSP Boards and S/W: Software-Deﬁ ned Radio

Innovative Integration "8BSE"WFOVFt4JNJ7BMMFZ $"64" www.innovative-dsp.com

X6-RX The X6-RX is a ﬂ exible receiver that integrates IF digitizing with signal processing on a PMC I/O module. The module provides up to 24 conﬁ gurable receiver channels with a powerful Xilinx Virtex-6 FPGA signal processing core, and high performance PCI Express/ PCI host interface. With the X6-RX, IF recorders can log both the digitized raw data and channels at real-time sustaining rates over 2 GB/s. Available Xilinx Virtex-6 SX315T/SX475T or LX240T. FEATURES The X6-RX features four, 16-bit 160 MSPS A/Ds with dual digital i Four 160 MSPS, 16-bit A/D channels downconverters (DDC). IF frequencies of up to 300 MHz are sup- i Downconverter ASIC supporting up to 24 Narrowband or 8 Wideband Channels ported. The sample clock is from either a low-jitter PLL or external i ±1V, AC-Coupled, 50 ohm, SMA inputs input. Multiple cards can be synchronized for sampling and down- i 4 Banks of 128MB DRAM conversion. i Ultra-low jitter programmable clock i x8 PCI Express Gen2, providing 2 GB/s sustained transfer rates i PCI 32-bit, 66 MHz with P4 to Host card i < 15W typical Conduction Cooling per VITA 20 i Ruggedization Levels for Wide Temperature Operation i Adapters for VPX, CompactPCI, desktop PCI and cabled PCI Express system

For more information, contact: [email protected] www.vmecritical.com/p45059

Industrial Applications: Electronics Packaging Hartmann Electronic &BTU"VCVSO"WFt4QSJOHGJFME 0)64" www.Hartmann-electronic.com

Open Frame Development Chassis 3U and 6U models available, for backplanes up to 34 HP wide. Select from a broad range of Hartmann backplanes including VPX, VME64x, cPCI, and VXS. Designed for use with RTM boards, the chassis offers access to boards from both sides. Rear profi les are moveable up to 2.5 mm for use with different RTMs. The chassis features robust construction using .236" sidewalls. Additionally, three high-performance fans are mounted below the chassis, with front and rear air plenums to maximize airfl ow. An adjustable rotary FEATURES switch controls front board fans, and there are separate switches i 3U and 6U models available for front/rear fans. LED voltage/fan control is on the front side. i Accommodates backplanes up to 34 HP wide i Select from a wide range of Hartmann backplanes i For use with RTMs (profi les adjust up to 2.5 mm) i .236" sidewalls for rigidity i Three high-performance fans with front/rear air plenums i Adjustable rotary fan speed for front fans i Separate on/off switch for rear fan i LED for voltage/fan control i 300W ATX power supply, other supplies available

For more information, contact: [email protected] www.vmecritical.com/p45502

46 VME and Critical Systems / Resource Guide 2011 Industrial Applications: Electronics Packaging Vector Electronics & Technology, Inc. 7BOPXFO4USFFUt/PSUI)PMMZXPPE $"64" www.vectorelect.com

VME/VME64x Backplanes and Series 2270 ’Slimline‘ Chassis

VME/VME64x Backplanes Per ANSI/VITA 1.1-1997 Vector VME64x 6U monolithic backplanes are a ’true‘ 6U footprint, fully RoHS-compliant and available for immediate shipment from our factory.

Vector VME64x monolithic backplanes for 6U cards are available in 2, 3, 4, 5, 7, 8, 10, 12 and 21-slot conﬁ gurations. ’True‘ 6U (10.317" H) for easy replacement or addition to any 6U rack system.

Custom backplane design services available; please contact [email protected].

Series 2270 ’Slimline‘ Chassis for VME or cPCI Series 2270 can be conﬁ gured with full 6UX80MM rear transition slots, and either single plug-in or hot-swappable power options or cost-saving embedded ATX are available. We can customize any Vector chassis; please contact us at [email protected].

Go to www.vectorelect.com to order our New 2011 Catalog. FEATURES i VME/VME64x Backplanes tGreater than 64MHz high-speed design t10-layer FR-4 construction, UL 94-V0, RoHS-compliant tSignal lines shielded, controlled impedance tOR-logic electronic daisy-chaining (EBG) with on-board t termination tSMT capacitors, resistors, etc. replace through-hole for t increased reliability tScrew terminal power connections

i Series 2270 ’Slimline‘ Chassis t1U to 5U, 2 to 10 slots, space-saving 19" rackmount t’Push-Pull‘ fans for maximum airﬂ ow tDual-Redundant, hot-swap power supply option

For more information, contact: [email protected] www.vmecritical.com/p18881 | www.vmecritical.com/p21566

VME and Critical Systems / Resource Guide 2011 47 Industrial Applications: Industrial Ethernet Annapolis Micro Systems, Inc. "ENJSBM$PDISBOF%SJWF 4VJUFt"OOBQPMJT .%64" www.annapmicro.com

Tri XFP I/O Card Annapolis Micro Systems, Inc. is a world leader in high-performance COTS FPGA-based processing for radar, sonar, SIGINT, ELINT, Digital Signal Processing, FFTs, communications, software radio, encryption, image processing, prototyping, text processing, and other processing intensive applications.

The Annapolis Tri XFP I/O Card, which works with the WILDSTAR 4/5 Family Architecture, has three 10 Gb individually conﬁ gured XFP connectors, each with its own XAUI to XFI converter. Industry- standard pluggable ﬁ ber optic transceivers can be purchased from Annapolis or from other vendors. The Tri XFP provides up to 30 Gb full duplex I/O directly between the outside world and the RocketIO pins on the Xilinx Virtex-II Pro or Virtex-4 I/O FPGA on the WILDSTAR 4 main board. No other vendor provides that volume of data straight into the heart of the processing elements and then back out again.

The Tri XFP card will support 10 Gb Ethernet, 10 Gb Fibre Channel, and OC-192. Although the protocols will be provided as black box solutions with few modifi cations by users allowed, more adventurous FEATURES users who choose to develop their own communications protocols i Up to 10 Gb Full Duplex Ethernet per connector from the basics already have access to all the board resources i Up to 10 Gb Fibre Channel through VHDL source for the interfaces to SRAM, signal conditioners, i OC-192 LAD bus, I/O bus, and PPC Flash. CoreFire™ users will have the usual CoreFire Board Support Package. i Three 10 Gb XFP connectors i Accepts industry-standard pluggable transceivers The Tri XFP is the fi rst of many I/O cards Annapolis will be releas- i Available in both commercial and industrial temperature grades ing for its new WILDSTAR 4/5 Family Architecture, which uses Xilinx i Includes one-year hardware warranty, software updates, and Virtex-4 and Virtex-5 FPGAs for processing elements. WILDSTAR 4 customer support is the tenth generation of Xilinx FPGA processing-based COTS i One or two I/O cards fi t on a single WILDSTAR 4/5 processing board boards from Annapolis. i New I/O form factor for improved thermal performance i First of many WILDSTAR 4/5 Family I/O cards, including superior Annapolis is famous for the high quality of our products and for our performance A/D, D/A, and additional high-speed unparalleled dedication to ensuring that the customer’s applica- communication cards tions succeed. We offer training and exceptional special application i Save time and effort; reduce risk with COTS boards and software development support, as well as more conventional customer i Achieve world-class performance; WILD solutions outperform support. the competition

For more information, contact: wﬁ [email protected] www.vmecritical.com/p35857

48 VME and Critical Systems / Resource Guide 2011 Mezzanines: PMC Pinnacle Data Systems, Incorporated 1PSU3PBEt(SPWFQPSU 0)64" 5FM t'BY www.pinnacle.com

XMC-E24D/PMC-E24D Dual Display Graphics Module PDSi offers these high-performance dual-display graphics modules in both XMC and PMC form factors. Using the ATI RadeonTM E2400 graphics controller from AMD, these modules enable VME, cPCI, and AdvancedTCA systems to take full advantage of AMD’s embedded advanced graphics technology. They provide simultaneous independent support of either one digital DVI and one VGA analog display or two VGA displays at 32-bit color and up to 2048 x 1536 resolution. FEATURES i Based on the ATI Radeon E2400 graphics processor This module provides the high-performance, low-power, ﬂ ex- i Superior 2D and 3D graphics acceleration ibility, and long life-cycle availability required by many real-world i On-chip GDDR3 video memory embedded applications in industries such as military/aerospace, i Dual-independent high-performance display interfaces industrial control and instrumentation, telecom/datacom, and medi- i DVI-I and analog VGA (full size connectors) cal imaging. i Dual-integrated triple 10-bit DACs for dual RGB output i Supports analog displays up to QXGA (2048 x 1536) i 32-bit color depth i Low-power 65nm design i Customization and third-party integration welcomed; extended availability assured

For more information, contact: [email protected] www.vmecritical.com/p39360

Mezzanines: XMC

Innovative Integration "8BSE"WFOVFt4JNJ7BMMFZ $"64" www.innovative-dsp.com

For more information, contact: [email protected] www.vmecritical.com/p52897

VME and Critical Systems / Resource Guide 2011 49 Mezzanines: XMC Pinnacle Data Systems, Incorporated 1PSU3PBEt(SPWFQPSU 0)64" 5FM t'BY www.pinnacle.com

PMC-SD18 and XMC-SD18 SATA HDD/SSD Storage Modules These new SATA Storage Modules are offered in both PMC and XMC formats. Both provide high-capacity SATA storage using compact 1.8 inch hard disk drives (HDDs) or solid state drives (SSDs) – up to 160GB of storage is available with either drive type. Whether confi gured with an economical rotating HDD or with a highly shock-resistant SSD, these low-profi le modules fi t comfortably into VITA 42.3-compatible VME, CompactPCI®, AdvancedTCA®.

The onboard 4-port SATA controller provides 3 additional external drive interfaces. OS support includes Windows, Linux, Solaris x86, FEATURES and Solaris SPARC. Critical military and aerospace applications will i High-capacity 1.8 inch SATA storage PMC and XMC appreciate the high operating shock resistance (1000+ G) and high i Low-cost rotating HDDs for normal use MTBF (over 1 million hours) when conﬁ guring these modules with i Rugged SSDs available for high shock and vibration the latest SSD technology. i Up to 160GB SSD storage capacity i Featuring Intel advanced SSD technology (80GB and up) i 3 additional SATA channels i Windows, Linux, and Solaris support i Customizations welcome; extended availablility assured

For more information, contact: [email protected] www.vmecritical.com/p41871

Mezzanines: XMC Pinnacle Data Systems, Incorporated 1PSU3PBEt(SPWFQPSU 0)64" 5FM t'BY www.pinnacle.com

XMC-GBX Quad Gigabit Ethernet Adaptor This quad Gigabit Ethernet XMC is a high-performance, low-latency network adaptor providing four high-speed Ethernet interfaces for use with VITA 42.3-compatible VME, PCI Express, CompactPCI®, and AdvancedTCA® processor boards. It is available in three con- ﬁ gurations offering a mix of front and rear port access.

Wide internal data paths eliminate performance bottlenecks. The parallel and pipelined logic architecture is optimized for Gigabit FEATURES Ethernet and effi ciently handles packets with minimum latency. i Quad Gigabit Ethernet interfaces – Copper or SERDES Using widely accepted Intel 82571EB Ethernet controllers, this i Up to 4 10BASE-T/100BASE-TX/1000BASE-T ports with RJ-45 front adaptor offers up to four 10BASE-T/100BASE-TX/1000BASE-T copper connectors with status indicators ports with front-mounted RJ-45 connectors and full status indicators. i Up to 4 rear-accessible SERDES ports via Pn4 Alternatively, up to four SERDES ports are accessible through the i Low-latency data handling Pn4 connector for use via an appropriate copper or fi ber-based rear i Effi cient packet prioritization i Enables use of jumbo frames transition module. i Maximum system performance and throughput i Windows, Linux, and Solaris x86 support i VITA XMC-compliant interfaces for high bandwidth i Customization welcome; extended availability assured

For more information, contact: [email protected] www.vmecritical.com/p45800

50 VME and Critical Systems / Resource Guide 2011 New VITA Standards: VITA 41: VXS Agilent Technologies Inc. 4UFWFOT$SFFL#MWEt4BOUB$MBSB $"64" www.agilent.com/find/vme

Agilent U1083A – 10- to 14-bit High-Speed VME/VXS Modules Based on a scalable, modular architecture, the Agilent Acqiris VME/VXS board family platform U1083A features two Xilinx Virtex-4 FPGAs, one targeted at digital signal processing, and one for data fl ow control. An optional fi rmware development kit (FDK) is available to help development of application fi rmware on the FPGAs. The embedded FLASH memory allows the platform to be easily reconfi gured to perform user-defi ned applications. The board is fully VME64x compliant and supports the 2eSST protocol, providing a substantial aggregate data bandwidth of more than 3.5 Gbps.

U1083A-001: 14-bit dual-channel, 10 to 500 MHz bandwidth, 1.2 GS/s BASE PLATFORM FEATURES high-speed generator i 6U single slot VME/VXS (VITA 41) U1083A-002: 10-bit dual-channel, up to 3 GHz bandwidth, 2 GS/s, i 2 Xilinx Virtex-4 FPGAs, SX55 and FX100 high-speed digitizer i Firmware development kit containing FPGA interface cores, U1083A-003: 10-bit ADC, 14-bit DAC, 1.2 GS/s high-speed data converter software, and reference design U1083A-005: 12-bit quad-channel, 2 GHz, 500 MS/s high-speed digitizer i Two on-board DDR2 SDRAM banks (512 MB total) and local 128 MB U1083A-007: 14-bit eight-channel, 300 MHz, 125 MS/s high-resolution FLASH memory able to store multiple FPGA bitstreams digitizer i VXS VITA 41.0 compliant, 8 x 3.125 Gbps serial I/O links on This architecture makes the U1083A platform ideal for wideband, P0 connector high-dynamic-range demanding applications such as electronic warfare i Two front panel SFP slots for up to 3.125 Gbps ﬁ ber or copper (EW), ESM/ECM applications, radar digital receiver/transmitter, tele- transceivers communications, and semiconductor testing, where high sample rate, i Auxiliary I/O mezzanine with multipurpose 12-bit, 65 MS/s ADC, high data-processing capabilities, and high throughput are mandatory. 12-bit, 130 MS/s DAC, and 14 digital I/O ports on front panel

For more information, contact: [email protected] www.vmecritical.com/p42370

New VITA Standards: VITA 46: VPX Acromag 48JYPN3Et8JYPN .*64" www.acromag.com

VPX cards with confi gurable Spartan-6 or Virtex-5 FPGA Acromag’s new 3U VPX FPGA boards provide powerful and cost- effective solutions for high-speed processing of complex algorithms in embedded computing applications. The VPX-VLX model offers a choice of logic-optimized Xilinx Virtex-5 FPGAs while the VPX-SLX version employs a Spartan-6 FPGA with 150k logic cells. Virtex-5 FPGA cards deliver maximum computing performance. Spartan-6 FPGA cards are designed for cost-sensitive mid-level applications. Both cards feature a high-throughput PCI Express interface, FEATURES generous dual-ported memory for effi cient data handling, and 64 I/O i Virtex-5 or Spartan-6 confi gurable FPGA with up to 150k logic cells lines direct to the FPGA. Ideal for defense, aerospace, or scientifi c i PCI Express 4-lane bus interface research; typical applications involve signal intelligence, image i Supports both front and rear I/O (64 I/O or 32 LVDS via rear J4/P4) processing, and hardware simulation. i Plug-in I/O interface cards for front mezzanine (14-bit A/D; differential, TTL, LVDS digital I/O) A double fat pipe 4-lane PCIe interface ensures very fast data i Two banks 1M x 32-bit dual-port SRAM throughput. Dual-port SRAM enables high-speed DMA transfers i Two banks 32M x 16-bit DDR2 SDRAM to/from the CPU while simultaneously writing data to memory. i Dual DMA channel data transfers Large DDR2 SDRAM buffers give the FPGA fast access to I/O port i FPGA code loads from the PCIe bus or from on-board fl ash memory data. i Air-cooled (0 to 70°C) and conduction-cooled (-40 to 85°C) models

For more information, contact: [email protected] www.vmecritical.com/p51298

VME and Critical Systems / Resource Guide 2011 51 New VITA Standards: VITA 46: VPX Amphenol Backplane Systems $FMJOB"WFOVFt/BTIVB /)64" www.amphenol-abs.com

VIPER® Ruggedized High Speed Backplane Connector System Amphenol’s Viper connector is a shielded high-density, high-speed backplane interconnect system that is fully footprint compatible with VITA 46 and VITA 48 standards. From the extensive voice of customer interviews, Viper was designed to meet and exceed future avionic high-level vibration, mechanical shock and condensing moisture test requirements.

This ruggedized connector system offers the ability to scale from 80 Mbps to 10 Gbps while retaining the same VITA 46 backplane FEATURES slot pitch at 20.3 to 25.4mm. The fl exible modular design is ideal for i High-speed differential design offers proven 10 Gbps performance standard 3U and 6U applications as well as custom confi gurations i 4 points of contact backplane signal terminal design provides high reliability in high-vibration applications incorporating RF microwave and optical MT solutions. i Reworkable design allows replacement of modules after daughter card connector is installed on PCB Amphenol Backplane Systems is a leading producer of high-density, i User confi gurable keying options without PCB notch for simplifi ed high-reliability system-level packaging solutions for military and PCB design and manufacturing aerospace programs. i End position safety ground provides ESD protection i Press-fi t daughter card and backplane connectors are a proven design that is reliable and easy to assemble

For more information, contact: [email protected] www.vmecritical.com/p46076

New VITA Standards: VITA 46: VPX Hypertronics #SFOU%SJWFt)VETPO ."64" www.hypertronics.com

KVPX Featuring Hypertac Technology The KVPX connector is a high-density, high-speed modular interconnect system optimized for differential pair architectures on a 1.8mm x 1.35mm grid and is fully footprint-compatible with VITA 46 and VITA 48 Standards. Through the use of the proven Hypertac® hyperboloid contact, KVPX connectors provide immunity to shock and vibration fretting, numerous linear paths of contacts and a self-cleaning wipe action that results in consistently better signal integrity for unparalleled performance in all dynamic environmen- FEATURES tal conditions. KVPX connectors are manufactured with 30 percent i Fully footprint-compatible with VITA 46 and VITA 48 standards glass-fi lled liquid crystal polymer (LCP) insulators and potted i Designed for 6.25 Gbps data rate performance scalable to 10 Gbps contacts to allow withstanding the high temperatures associated i 100 ohm impedance for differential pair confi guration with soldering. The LCP insulators also exceed NASA space require- i Differential, single-ended and power-separable interface offering 63 ments for outgassing. differential signals/25.4mm and 70 single-ended signals/25.4mm i Reliable, Hypertac® Hyperboloid contact technology ® Other benefi ts the Hypertac contact technology offers include i ESD protection supports 2 level maintenance designs low insertion/extraction forces, low contact resistance, and high i 0.56mm (0.022") diameter via backplane connector cycle life. i Flexible, modular design for standard 3U and 6U

For more information, contact: [email protected] www.vmecritical.com/p52500

52 VME and Critical Systems / Resource Guide 2011 New VITA Standards: VITA 65: OpenVPX Annapolis Micro Systems, Inc. "ENJSBM$PDISBOF%SJWF 4VJUFt"OOBQPMJT .% www.annapmicro.com

WILDSTAR 6 for OpenVPX Annapolis Micro Systems is a world leader in high-performance, COTS FPGA-based processing for radar, sonar, SIGINT, ELINT, DSP, FFTs, communications, Software-Deﬁ ned Radio, encryption, image processing, prototyping, text processing, and other processing intensive applications. Our 14th-generation WILDSTAR 6 for OpenVPX uses Xilinx’s newest Virtex-6 FPGAs for state-of-the-art performance. It accepts one or two I/O mezzanine cards in one VPX slot or up to four in a double wide VPX slot, including Single 1.5 GHz 8 Bit ADC, Quad 250 MHz 12 Bit ADC, Single 2.5 GHz 8 Bit ADC, Quad 130 MHz 16 Bit ADC, Dual 2.3/1.5 GSps 12 Bit DAC, Quad 600 MSps 16 Bit DAC, Universal 3Gbit Serial I/O (Rocket I/O, 10 Gb Ethernet, Inﬁ niBand), and Tri XFP (OS 192, 10G Fibre Channel, 10 Gb Ether- net). Our boards work on a number of operating systems, including Windows, Linux, Solaris, IRIX, ALTIX, and VxWorks. We support our board products with a standardized set of drivers, APIs, and VHDL simulation models.

Develop your application very quickly with our CoreFire™ FPGA Application Builder, which transforms the FPGA development pro- FEATURES cess, making it possible for theoreticians to easily build and test i Up to three Virtex-6 FPGA processing elements – XC6LX240T, their algorithms on the real hardware that will be used in the ﬁ eld. XC6LX365T, XC6LX550T, XC6SX315, or XC6SX475 CoreFire, based on dataﬂ ow, automatically generates distributed i Up to 7 GB DDR2 DRAM in 14 banks or up to 448 MB DDRII or QDRII SRAM control fabric between cores. i OpenVPX backplane

i 80 x 80 crossbar connecting FPGAs and VPX backplane Our extensive IP and board support libraries contain more than i 1 GHz 460EX PowerPC onboard host 1,000 cores, including ﬂ oating point and the world’s fastest FFT. i 4X PCIe controller CoreFire uses a graphical user interface for design entry, supports i Programmable Flash to store FPGA images and for PCI controller hardware-in-the-loop debugging, and provides proven, reusable, high- i Full CoreFire Board Support Package for fast, easy application performance IP modules. WILDSTAR 6 for OpenVPX, with its associ- development ated I/O cards, provides extremely high overall throughput and pro- i VHDL model, including source code for hardware interfaces and ChipScope Access cessing performance. The combination of our COTS hardware and i Host software: Windows, Linux, VxWorks, etc. CoreFire allows our customers to make massive improvements in i Available in both commercial and industrial temperature grades processing speed, while achieving signiﬁ cant savings in size, weight, i Proactive Thermal Management System – Board level current power, person-hours, dollars, and calendar time to deployment. measurement and FPGA temperature monitor, accessible through host API Annapolis is famous for the high quality of our products and for our i Save time and effort and reduce risk with COTS boards and software; achieve world-class performance – WILD solutions unparalleled dedication to ensuring that the customer’s applica- outperform the competition tions succeed. We offer training and exceptional special application i Includes one-year hardware warranty, software updates, and development support, as well as more conventional support. customer support; training available

For more information, contact: wﬁ [email protected] www.vmecritical.com/p45439

VME and Critical Systems / Resource Guide 2011 53 New VITA Standards: VITA 65: OpenVPX BittWare )JMMT"WFOVFt$PODPSE /)64" www.bittware.com

Commercial & Rugged Altera Stratix® IV GX 3U VPX Board BittWare’s S4-3U-VPX (S43X) is a commercial or rugged 3U VPX card based on the high-density, low-power Altera Stratix IV GX FPGA. The Stratix IV GX is designed specifi cally for serial I/O-based applications, creating a completely fl exible, reconfi gurable VPX board. BittWare’s ATLANTiS FrameWork and the FINe Host/Control Bridge greatly simplify application development and integration of this powerful board. The board provides a confi gurable 25-port SerDes interface supporting a variety of protocols, including Serial RapidIO, PCI Express, and 10 GigE. The board also features FEATURES 10/100/1000 Ethernet, and up to 4 GB of DDR3 SDRAM. i VITA 57 FMC site for processing and I/O expansion i High-density Altera Stratix IV GX supported by BittWare The FMC (FPGA Mezzanine Card) site provides 8 high-performance ATLANTiS™ FrameWork for FPGAs SerDes, 2 additional SerDes, and 60 LVDS pairs, along with 6 clocks, i BittWare FINe Host/Control Bridge provides control plane I2C, JTAG and reset to the Stratix IV GX. The connector is compliant processing and interface with the VITA 57 mezzanine standard for FPGA I/O, enabling i Fully connected to VPX: GigE, 15 SerDes, 32 LVDS designers to customize the S43X to their individual needs with i Additional I/O: 10/100 Ethernet, RS-232, JTAG optional FMC I/O boards.

For more information, contact: [email protected] www.vmecritical.com/p52808

New VITA Standards: VITA 65: OpenVPX CSP Inc. MultiComputer Division .BOOJOH3PBEt#JMMFSJDB ."64" www.cspi.com/multicomputer/

3220Q The 3220Q 6U OpenVPX Blade Server, with a dual socket Intel® Xeon® processor and QuickPath Interconnect (QPI), delivers superior performance-per-watt and low latency, while operating in a standards based OpenVPX environment.

Offering an open software stack the 3000 SERIES OpenVPX blades support MPI over Inﬁ niBand, cluster management tools, a Linux 2.6 SMP based distribution or VxWorks. Continued support for the FEATURES same message passing protocol between processes allows existing i Dual Socket Intel® Xeon® Processors customers to migrate without any change at the Application Layer. – 4 Cores/8 Threads per socket This strategy provides customers with an upgrade path to the most – 8 MB On-chip Cache per socket advanced technologies while offering widespread interoperability – 2.13 GHz Core clock – 4.8 Gbps QuickPath Interconnect (QPI) between sockets and enabling software reuse. Likewise, the software development – 8/16 GB DDR3 ECC protected device-down Memory environment preserves support for Wind River’s Workbench open – 136 GFLOPS Peak Performance device software development suite, and CSPI’s optimized signal i 32 Lanes of PCIe Gen2 to the OpenVPX Data and Expansion Planes processing libraries. i Two 1000BASE-T Interfaces to the VITA-46.6 Ethernet Control Plane i Full IPMC Implementation for compliance with future VITA 46.11 Management Standard

For more information, contact: [email protected] or 1-800-325-3110 www.vmecritical.com/p52811

54 VME and Critical Systems / Resource Guide 2011 New VITA Standards: VITA 65: OpenVPX Curtiss-Wright Controls Electronic Systems 5BZMPS4USFFUt-JUUMFUPO ."64" www.cwces.com

OpenVPX Development Chassis Today’s applications are breaking traditional thermal barriers. Curtiss-Wright Controls Electronic Systems’ engineered packaging products have long been recognized for innovative thermal solutions, with an impressive track record in thermally challenging applications. Our standard and custom chassis platforms provide best-in-class thermal performance. Our wide range of VPX, OpenVPX and VPX-REDI (VITA 46/48/65/68) development and deployed enclosures are engineered to meet the most stringent design requirements and provide innovative solutions to customer requirements. FEATURES i Desktop, tower, open frame, rack mount, ATR and development platforms i Air, conduction or liquid-cooled i VPX, OpenVPX, VPX-REDI (VITA 46/48/65/68) i A wide variety of backplane options available i Standard products or custom designed solutions to your program requirements i Integration services also available i Development platforms are fully compliant with ANSI/VITA 65 OpenVPX cooling requirements

For more information, contact: [email protected] www.vmecritical.com/p45786

New VITA Standards: VITA 65: OpenVPX Dawn VME Products 8FTUJOHIPVTF%SJWFt'SFNPOU $"64" www.dawnvme.com

CCE-3VX4 Conduction Cooled Enclosure for 3U Modules Dawn’s 3U form factor conduction cooled chassis for cold plate deployment is designed for all rugged environments: airborne, land and sea.

Conduction cooled base coupled, via short and efﬁ cient thermal path, provides for optimum cooling. Maximum power dissipation depends on cold plate. FEATURES RuSH enhanced 3U conduction cooled power supply monitors i 4 slots of 3U VPX on 1" pitch (OpenVPX Ready) system-critical performance parameters including voltage, current, i Integrated power supply and temperature. The RuSH monitor is interfaced into the OpenVPX 2 i RuSH enhanced power supply actively monitors: IPMB (I C) management plane, providing communication link-up – Voltage on each power rail with system cards. – Current on each power rail – Temperature (humidity – optional) Key guards provide protection against incorrect card insertion for i FFM-overlay backplane interconnection for quick-turn each slot by customer selection of unique (0, 45, 90, 270, 315 degree) customization of data plane connection fabric key rotations. i Rigid front panel interface eliminates wiring challenges i Backplane overlays enable PMC/XMC to I/O customization

For more information, contact: [email protected] www.vmecritical.com/p45504

VME and Critical Systems / Resource Guide 2011 55 New VITA Standards: VITA 65: OpenVPX Dawn VME Products 8FTUJOHIPVTF%SJWFt'SFNPOU $"64" 510-657-4444 www.dawnvme.com

DEV-4200 VPX 3U DC-3 Development System Dawn’s DC-3 VPX Development System for 3U boards represents the latest in state-of-the-art technology. It provides a capability of confi guring up to an 8-slot system that supports any mix of 3U convection or conduction cooled boards and 3U transition modules on .8" or 1.0" centers along with an advanced capability to support high current demands and corresponding high cooling requirements. Backplane profi les and topologies are or will be available to test any board confi guration. FEATURES Power supply choices support 12H and 5VH-based systems. i 8 slots of VPX on 1" pitch with or without TM connectors Optional ”VEN“ power systems available for cost savings if desired. i Connectors may be partially populated for cost savings Cooling is delivered equally at each slot with up to 700 LFM across i Legacy wedgelock or VITA 48.2-style card guides available the boards with no dead spots. Chassis side panels are removable as an option for side board access and probing. Airfl ow through the board area i Dawn’s RuSH System Health Monitor and Controller with provides adequate cooling for even high power boards. LCD display i 8-slot, 3U x 160mm, 1101.10-compatible front card cage i 8-slot, 3U x 80mm, 1101.11-compatible Rear Transition Module card cage

For more information, contact: [email protected] www.vmecritical.com/p45503

New VITA Standards: VITA 65: OpenVPX Dawn VME Products 8FTUJOHIPVTF%SJWFt'SFNPOU $"64" 510-657-4444 www.dawnvme.com

ITM-6973 Intelligent Test Module Dawn’s ITM-6973 represents a quantum leap ahead in features and capability. It makes possible complex tests, measurements, data logging and reporting all in a 3U size module. The full featured version of the DITM contains a powerful PIC microprocessor, 6 separate voltage independent microprocessor-controlled active loads (one for each voltage rail), 6 separate current sensors (one for each voltage rail), 6 separate precision voltage sensors (one for each voltage rail), 7 ohm meters, 4 temperature sensors (located at FEATURES 4 corners of the module), 6 separate power supply noise detectors i PIC microprocessor for testing, data logging, and control (one for each voltage rail), 2 accelerometers for measuring low and i 6 microprocessor-controlled high current active loads high levels of 3-axis shock and vibration – all coupled to a simple, i 6-channel voltmeter measures to ±10mV accuracy easy-to-use, Windows-based Graphical User Interface (GUI). i 6-channel current meter with 200mA resolution i 4 precision temperature sensors measure ± 1°C The DITM may be used to test power supplies, power systems and i 6-channel noise meter measures P.S. pk-to-pk ripple chassis by providing an accurate, self-controlling and self-logging i 2 each 3-axis accelerometers measure shock/vibration dynamic current load, voltage monitor and heat source to the system i 7-channel ohm meter measures isolation resistance under test. i Real-time clock provides absolute time stamp of events i MS Windows-based GUI for viewing board, setting parameters and logging data

For more information, contact: [email protected] www.vmecritical.com/p45505

56 VME and Critical Systems / Resource Guide 2011 New VITA Standards: VITA 65: OpenVPX Dawn VME Products 8FTUJOHIPVTF%SJWFt'SFNPOU $"64" 510-657-4444 www.dawnvme.com

PSC-6629 3U 400W Plug-in Power Supply Designed speciﬁ cally for the OpenVPX market, Dawn’s PSC-6629 is designed to operate over a wide range of temperatures at high power levels. Models are available for air cooled, conduction to bulkhead cooled, and conduction to wedge lock cooled applications and conﬁ gurations.

Dawn’s embedded RuSH™ (Rugged System Health Monitor) technology provides the “smarts” that enables monitoring of critical system FEATURES performance parameters including voltage, current and tempera- i True 6-channel supply provides full OpenVPX support ture and control of power sequencing and shutdown of all voltage i Available in air cooled, bulkhead conduction cooled, and wedge lock rails. conduction cooled models i Up to 400 W power output with 1" pitch form factor i Onboard embedded RuSH™ technology actively monitors voltage, Custom fi rmware enables additional features such as monitoring current, temperature and provides protective control humidity, shock/vibration events or customer specifi ed monitoring i Factory programmable power sequencing of all voltage rails windows, power sequencing, alerts, alarms, status and control, etc. i Shutdown control for each power rail i Over voltage, over current, and over temp. protection The RuSH™ monitor is interfaced into the OpenVPX (I2C) management i Current-share compatible with additional PSC-6629 units plane, providing an I2C communication link with system cards. FAL# i I2C interface for status and control and DEG# status output for direct system alert. Optional LED/Status/ i Standard INH# and EN# power control signals Power Good output. Custom power capacity and voltage input range i VBAT for support of VPX memory backup power bus i Front panel I/O includes LED status indicator, USB port for fi rmware confi gurations available. Contact factory for additional information. upgrade and VBAT battery access

For more information, contact: [email protected] www.vmecritical.com/p46726

New VITA Standards: VITA 65: OpenVPX Elma Bustronic (SJNNFS#MWEt'SFNPOU $"64" www.elmabustronic.com

OpenVPX Backplanes Elma Bustronic is the industry leader in VPX and OpenVPX backplanes. We offer the widest range of OpenVPX profi les in 3U and 6U heights. We’ll work with you on your application and help you fi nd a profi le that fi ts your needs. Elma Bustronic’s team of signal integrity experts assures that your backplane offers the highest performance.

The company also offers the widest range of VPX and OpenVPX FEATURES accessories, as well as VPX power & ground, development, and i Compliant to the latest VITA 65 specifi cations test backplanes. i 3U, 6U and hybrid versions available VPX cabling solutions and SerDes test devices are also available. i 6U OpenVPX Development Backplane has fl exible confi gurations, making prototyping and development easy i 2-slot VPX Test Backplanes Contact Elma Bustronic for your OpenVPX solution today! i VPX Power and Ground Backplanes i VPX Load Boards, RTMs, Extender Boards, and SerDes Test Devices i VPX Cabling Solutions (wafer to SMA, wafer to wafer, wafer to RJ45, etc)

For more information, contact: [email protected] www.vmecritical.com/p45467

VME and Critical Systems / Resource Guide 2011 57 New VITA Standards: VITA 65: OpenVPX Elma Electronic Inc. (SJNNFS#MWEt'SFNPOU $"64" www.elma.com

VPX-300 3U VPX SystemPak The VPX-300 SystemPak is a reference development platform based on 3U VPX architecture. It provides a subsystem-level platform on which to begin next-generation applications requiring high bandwidth computing performance such as radar signals, image processing, and high speed data communications.

Designed around a Virtex-6 front end processor, the system supports multi-processor capability via two clusters for front end and back end processing. The NVIDIA graphics processor provides a FEATURES dramatic increase in computing performance by harnessing the i Designed around a Virtex-6 FPGA front end processor (FEP) card power of the GPU. The VPX-300 SystemPak provides the architecture i Combining data and control plane topology, the architecture necessary to perform very high end processing. supports multi-processor capability via two clusters for front-end and back-end processing The standard conﬁ guration is a 3U VPX platform that includes an i The OpenVPX™ standard backplane proﬁ le has two separate star Intel based SBC, FPGA Carrier with FMC site, NVIDIA Graphics Card, sections that are established through a data and control plane switch, handling both PCIe and GigE links Switch Card with GigE and PCIe, and optional storage. i All slots in the backplane include control plane interconnects i The front end FPGA cluster performs incoming digital signal processing in advance of higher level back end operations

For more information, contact: [email protected] or (510) 656-3400 www.vmecritical.com/p52829

New VITA Standards: VITA 65: OpenVPX Emerson Network Power 4%JBCMP8BZ 4VJUFt5FNQF ";64" PS www.Emerson.com/EmbeddedComputing

3U & 6U OpenVPX Processor Boards The 6U iVPX7220 and 3U iVPX7223 VITA 46 VPX & VITA 65 OpenVPX™ processor boards from Emerson Network Power features the dual-core or quad-core 2nd generation Intel® Core™ i7 processor @ 2.20 GHz, with integrated graphics and memory controller and the Mobile Intel® QM67 Express chipset with leading edge I/O functionality. This high compute density platform offers both high speed fabric connectivity with PCI Express and Gigabit Ethernet control plane connectivity with data transfer rates up to 5Gbps.

On-board memory includes up to 16GB DDR3-1333 memory, FEATURES embedded USB ﬂ ash and 256KB non-volatile F-RAM. Additional i 2nd generation Intel® Core™ i7 2.20 GHz dual-core or quad-core connectivity includes a variety of USB 2.0, serial and SATA ports, integrated processor and Intel QM67 PCH GPIO, DisplayPort, VGA and XMC sites for maximum ﬂ exibility. An i Up to 8GB (3U) or 16GB (6U) ECC-protected DDR3-1333 soldered " optional 2.5 SATA SSD is also available on the 6U iVPX7220. i VITA 48 REDI two-level maintenance (2LM) The boards are fully rugged for extreme environments with extended i Extended temperature -40°C to +85°C and rugged variants shock, vibration, temperatures and conduction cooling. They are i Air and conduction cooled designed for a range of industrial, communication and military/aerospace applications. Software support includes Solid and Stable BIOS with password protection and a wide range of operating systems.

For more information, contact: [email protected] www.vmecritical.com/p47463

58 VME and Critical Systems / Resource Guide 2011 New VITA Standards: VITA 65: OpenVPX

Innovative Integration "8BSE"WFOVFt4JNJ7BMMFZ $"64" www.innovative-dsp.com

VPX6-COP The VPX6-COP is a ﬂ exible FPGA coprocessor card that integrates a Virtex-6 FPGA computing core with an industry-standard FMC I/O module on a 3U OpenVPX card.

The FPGA computing core features the Xilinx Virtex 6 FPGA family, in densities up to LX550 and SX475. The SX475 provides over 2000 DSP MAC elements operating at up to 500 MHz. The FPGA core has two FEATURES 9MB QDRII+ SRAM banks, two 256MB LPDDR2 DRAM banks, and i 3U OpenVPX FPGA coprocessor card a 128MB DDR3 bank. Each memory is directly connected to the i FMC I/O site (VITA 57) with 8x 5 Gbps MGT lanes, 80 LVDS pairs FPGA and is fully independent. (LA, HA, HB full support) i 2 Banks of 256 MB DRAM (512 MB total) i 2 banks of 9MB QDRII+ SRAM (18MB total) For system communications, the VPX6-COP has a PCI Express and i 128MB DDR3 DRAM two SRIO/Aurora interfaces. The PCIe port is a x8, Gen2 interface i VPXI system-timing features supporting global and local timing and capable of up to 2 GB/s sustained operation with 4 GB/s burst rate. triggering features Two additional x4 system ports support either SRIO, Aurora or i Gen2 x8 PCI Express providing 4 GB/s burst and 2 GB/s sustained transfer rates custom protocols. i Two Serial RapidIO or Aurora ports supporting x4 Gen2 (2 GB/s) i < 15W typical excluding FMC i Ruggedization Levels up to L4 Forced air or conduction cooling i 40g shock, 9g sine vibration 0.1 g2/Hz random vibe

For more information, contact: [email protected] www.vmecritical.com/p52896

New VITA Standards: VITA 65: OpenVPX

Innovative Integration "8BSE"WFOVFt4JNJ7BMMFZ $"64" www.innovative-dsp.com

VPX-COMEX The VPX-COMEX is a 3U OpenVPX system controller CPU card that integrates an Intel CPU COM Express CPU module with SRIO switch, system timing and triggering features, and a Spartan-6 FPGA core. The VPX-COMEX supports VPX systems with up to 4 other PCIe/SRIO cards and timing/triggering support for embedded communications instrumentation, and data acquisition applications. FEATURES i COM Express Type 6 CPU module – Intel i7 @ 2.53 GHz/i5 @ 2.4GHz The CPU core is a COM Express module, a PICMG industry standard, – Up 8GB 1066MHz DDR3 ECC memory that is an Intel Architecture i7 or i5 CPU with QM57 chipset. The i PCI Express Root supports x4/x4/x1/x1 endpoints COM Express module runs Windows, Linux, or VxWorks, providing i GbE, USB 2.0, 3x SATA300, DisplayPort a familiar and easy-to-use software environment that is abundant i Integrated 1.8 in SATA SSD up to 256 GB i Serial RapidIO Data Plane Switch in tools and applications, resulting in dramatically lower time-to- – 8x SRIO Gen2 (5 Gbps) ports to VPX market than other CPU architectures. – Front panel QSFP x4 optical link i Precision timing/triggering support – PLL with 125KHz to 1GHz tuning range with -110 dB phase noise @ 10kHz The VPX-COMEX has support for 4 expansion cards using PCI Express – 10MHz, 0.28 PPM clock reference and SRIO. The PCI Express root complex has x4, x4, x1 and x1 Gen1 – Reference input support for GPS integration – Synchronized triggering outputs endpoint support, provided by the chipset. The SRIO data plane i Xilinx Spartan-6 LX45T to LX120T FPGA core complements the PCIe connectivity with a central switch providing i < 50W typical; conduction or forced-air cooling 8 SRIO Gen2 links (5 Gbps each). i Operating Environment: 0 to 60˚C, 0 to 100% RH, 30g shock, 0.04 g2/Hz random vibe

For more information, contact: [email protected] www.vmecritical.com/p52900

VME and Critical Systems / Resource Guide 2011 59 New VITA Standards: VITA 65: OpenVPX

Innovative Integration "8BSE"WFOVFt4JNJ7BMMFZ $"64" www.innovative-dsp.com

VPXI-ePC The VPXI-ePC is a 3U VPX embedded computer system that provides a performance architecture for instrumentation, signal processing and embedded computing applications. Four expansion slots, plus an IO/HDD drive are in a compact, half rack 4U enclosure. The VPX-COMEX CPU combines an Intel Architecture COM Express CPU module with timing and communications features. Real-time, data-intensive operation is built on multiple, high performance data planes employing both centralized and mesh topology interconnections between the cards.

VPXI integrates timing features into the VPX architecture providing synchronized high performance clock and trigger features to each FEATURES slot. Peripheral slots receive a dedicated clock and trigger input, as i VPX for Instrumentation well as several shared coordination signals. These signals are used – 3U OpenVPX embedded computer system – Integrated timing and triggering by VPX-COP, X6 and X3 IO card families and support simultaneous – Advanced multiple plane connectivity and coordinated sampling. An optional high-precision GPS can be – Rugged with wide-temperature options used with the VPX-COMEX as a timing reference. i Embedded PC – Runs Windows, Linux or VxWorks The backbone of the system in the VPXI-ePC are the PCIe and SRIO – COM Express module with Intel i5/i7 CPU with up to 8 GB memory planes in the VPXI system. Each plane can sustain data rates over – Gb Ethernet, 4x USB, DisplayPort video 500 MB/s concurrently on PCIe and SRIO planes. The SRIO data – 256 GB SSD + up to 3 removable drives plane also has a x4 optical link on the front panel supporting 12 Gbps i Half (1/2) rack, 4U system connection. – Six slots total: CPU slot + 4 OpenVPX Peripheral Slots + Storage/ – I/O Slot The VPXI may host one VPX-COMEX CPU card to create a Windows/ – Compatible with many OpenVPX cards Linux/VxWorks-compatible PC. The VPXI-ePC can run the same – Up to 3 HDD/SSD storage slots – Supports Innovative X3/X5/X6 and VPX-COP applications as a desktop system. Performance OSs such as Linux Xenomai and VxWorks are available for real-time applications. i Integrated timing and triggering features – Synchronized, multi-card sampling – Internal or external clock/references – Generate low phase noise sample clocks from 0.125 to 1 GHz – 10 MHz, 0.5 ppm stable clock reference – Optional GPS-disciplined reference

i Advanced architecture supports multiple data planes – PCI Express and SRIO planes – Mesh interconnects all I/O cards – Front panel x4 optical link for SRIO

i Rear Terminal Modules for I/O and CPU slots – Forced air cooling with upper and lower fans – Integrated 500W power supply – Expands to additional VPXI chassis using cable PCI Express – option

APPLICATIONS i Remote, Autonomous I/O i Mobile Instrumentation i Distributed Data Acquisition i Signal Processing Clusters

For more information, contact: [email protected] www.vmecritical.com/p52899

60 VME and Critical Systems / Resource Guide 2011 New VITA Standards: VITA 65: OpenVPX Extreme Engineering Solutions, Inc. (X-ES) %FNJOH8BZ 4VJUFt.JEEMFUPO 8*64" www.xes-inc.com

ADP: Avionics Development Platform The ADP is a prepackaged 3U OpenVPX development platform that provides functionality and I/O commonly required by avionics applications. The ADP enables the deployed system hardware to be developed in parallel with the software development effort to reduce overall development schedule and risk.

The ADP utilizes an OpenVPX development chassis that supports conduction-cooled payload modules, an OpenVPX backplane, and air-cooled RTMs. The same conduction-cooled 3U VPX modules FEATURES used in the lab development platform can be utilized in the deployed i OpenVPX development platform with a development power supply, system. As a result, software developed on the ADP will run on an RTM bay, and ten, one-inch pitch slots for 3U conduction-cooled the deployed system, reducing schedule risk and increasing the modules Test Readiness Level (TRL) of the deployed system. i 3U OpenVPX backplane with eight payload slots, two switch slots, and two power slots i Operating system BSP and drivers for all VPX and mezzanine modules

For more information, contact: [email protected] www.vmecritical.com/p46681

New VITA Standards: VITA 65: OpenVPX Extreme Engineering Solutions, Inc. (X-ES) %FNJOH8BZ 4VJUFt.JEEMFUPO 8*64" www.xes-inc.com

XPedite5470: P4080 3U VPX Conduction- or Air-Cooled SBC The XPedite5470 is a high-performance 3U VPX-REDI single-board computer based on the Freescale P4080 processor. With eight PowerPC e500 cores running at up to 1.5 GHz, the P4080 delivers enhanced performance and efﬁ ciency for today’s embedded computing applications.

The XPedite5470 supports two separate channels of up to 4 GB each of up to DDR3-1333 ECC SDRAM, up to 16 GB of user ﬂ ash, and up to FEATURES 256 MB of boot ﬂ ash. The XPedite5470 provides the option of utilizing i Freescale P4080 processor with eight PowerPC e500 cores delivers a PCI Express or Serial RapidIO and two Gigabit Ethernet VPX P1 maximum performance for demanding military applications backplane interconnects. The XPedite5470 also supports dual i 3U VPX (VITA 46) form factor provides small footprint Gigabit Ethernet, dual USB, GPIO, I²C, PMC I/O, XMC I/O, and up to i Conduction- and air-cooled versions support wide range of two RS-232/RS-422/RS-485 serial ports through the P2 connector. application requirements i PrPMC/XMC site supports additional processing, I/O, or storage requirements i Dual x4 PCI Express or Serial RapidIO VPX fabric interconnects support high-bandwidth data movement i Wind River VxWorks, Green Hills INTEGRITY, and Linux BSPs support software development

For more information, contact: [email protected] www.vmecritical.com/p45254

VME and Critical Systems / Resource Guide 2011 61 New VITA Standards: VITA 65: OpenVPX Extreme Engineering Solutions, Inc. (X-ES) %FNJOH8BZ 4VJUFt.JEEMFUPO 8*64" www.xes-inc.com

XPedite5570: P2020 3U VPX Conduction- or Air-Cooled SBC The XPedite5570 is a low-power, high-performance 3U VPX-REDI single-board computer based on the Freescale QorIQ P2020 processor. Consuming less than 20 watts, the XPedite5570 can host nearly any high-performance, FPGA-based, A/D or camera-interfaced XMC module for Size, Weight, and Power (SWaP) constrained UAV surveillance applications.

The XPedite5570 supports two separate channels of up to 4 GB each FEATURES of up to DDR3-1333 ECC SDRAM, up to 16 GB of user ﬂ ash, and up i Freescale QorIQ P2020 processor with dual e500 cores running at to 256 MB of boot ﬂ ash. The XPedite5570 provides the option of up to 1.2 GHz for SWaP constrained applications utilizing a PCI Express or Serial RapidIO and two Gigabit Ethernet i 3U VPX (VITA 46) form factor provides small footprint VPX P1 backplane interconnects. The XPedite5570 also supports i Conduction- and air-cooled versions support wide range of dual Gigabit Ethernet, USB, GPIO, I²C, PMC I/O, XMC I/O, and up to application requirements two RS-232/RS-422/RS-485 serial ports through the P2 connector. i PrPMC/XMC site supports additional processing, I/O, or storage requirements i Dual x4 PCI Express or Serial RapidIO VPX fabric interconnects support high-bandwidth data movement i Wind River, VxWorks, Green Hills INTEGRITY, and Linux BSPs support software development

For more information, contact: [email protected] www.vmecritical.com/p46340

New VITA Standards: VITA High Speed Solutions Amphenol Backplane Systems $FMJOB"WFOVF 4UFt/BTIVB /)64" www.amphenol-abs.com

High Speed Interconnect Solutions The need for faster data rates coupled with decreasing signal rise time requires better performing high-speed connectors. Amphenol provides its customers with cutting edge high-speed solutions.

With products offering speeds from 3.125 Gbps up to 25 Gbps, Amphenol is sure to have a connector to meet your ever-increasing need for speed. This broad range of high-speed interconnect solutions provides scalability for price and performance.

Amphenol Backplane Systems is a leading producer of high-density, FEATURES high-reliability system-level packaging solutions for military and i Capable of supporting data rates from 3.125 Gbps to 25 Gbps aerospace programs. Our ability to tackle problems such as signal i Modular designs enable fl exible confi gurations integrity, mechanical robustness and reliability concurrently rather i Industry-leading robustness with fi eld proven components than independently gives us the edge over competition in solving i VHDM® provides proven performance, design fl exibility and complex packaging challenges. reliability i GbX® was designed specifi cally for high-speed differential applications i XCede® meets IEEE 802.3ap v3.2 10GBASE-KR standard with at least 2X margin

For more information, contact: [email protected] www.vmecritical.com/p52894

62 VME and Critical Systems / Resource Guide 2011 Semiconductor/ICs: PCI/PCI Express Annapolis Micro Systems, Inc. "ENJSBM$PDISBOF%SJWF 4VJUFt"OOBQPMJT .%64" www.annapmicro.com

WILDSTAR 6 PCIe Annapolis Micro Systems, Inc. is a world leader in high-performance, COTS FPGA-based processing for radar, sonar, SIGINT, ELINT, DSP, FFTs, communications, Software-Defi ned Radio, encryption, image processing, prototyping, text processing, and other processing- intensive applications. Our fi fteenth-generation WILDSTAR 6 for PCI Express uses Xilinx’s newest Virtex-6 FPGAs for state-of-the-art performance. It accepts one or two I/O mezzanine cards, including Single 1.5 GHz 8 Bit ADC, Quad 250 MHz 12 Bit ADC, Single 2.5 GHz 8 Bit ADC, Quad 130 MHz 16 Bit ADC, Dual 2.3/1.5 GSps 12 Bit DAC, Quad 600 MSps 16 Bit DAC, Universal 3Gbit Serial I/O (Rocket I/O, 10 Gb Ethernet, Infi niBand), and Tri XFP (OS 192, 10G Fibre Channel, 10 Gb Ethernet). Our boards work on a number of operating systems, including Windows, Linux, Solaris, IRIX, ALTIX, and VxWorks. We support our board products with a standardized set of drivers, APIs, and VHDL simulation models.

Develop your application very quickly with our CoreFire™ FPGA Application Builder, which transforms the FPGA development process, making it possible for theoreticians to easily build and test their algorithms on the real hardware that will be used in the fi eld. FEATURES CoreFire, based on datafl ow, automatically generates distributed i Up to three Xilinx Virtex-6 FPGA I/O processing elements – LX240T, control fabric between cores. LX365T, LX550T, SX315T, or SX475T i Up to 8 GBytes DDR2 DRAM or DDR3 DRAM in 14 memory banks Our extensive IP and board support libraries contain more than per WILDSTAR 6 for PCI Express board or up to 480 MBytes DDRII+/ 1000 cores, including fl oating point and the world’s fastest FFT. QDRII DRAM in 15 memory banks CoreFire uses a graphical user interface for design entry, supports i Programmable FLASH for each FPGA to store FPGA images hardware-in-the-loop debugging, and also provides proven, reus- i 8X PCI Express Bus Gen 1 or Gen 2 able, high-performance IP modules. WILDSTAR 6 for PCI Express, with i Supports PCI Express standard external power connector its associated I/O cards, provides extremely high overall throughput i High-speed DMA Multi-Channel PCI controller and processing performance. The combination of our COTS hardware and CoreFire allows our customers to make massive improvements in i Full CoreFire Board Support Package for fast, easy application development processing speed, while achieving signifi cant savings in size, weight, i VHDL model, including source code for hardware interfaces and power, person-hours, dollars, and calendar time-to-deployment. ChipScope access i Available in both commercial and industrial temperature grades Annapolis is famous for the high quality of our products and for our unparalleled dedication to ensuring that the customers’ applica- i Proactive Thermal Management System – Board Level current measurement and FPGA temperature monitor, accessible through tions succeed. We offer training and exceptional special application Host API development support, as well as more conventional support. i Includes one year hardware warranty, software updates, and customer support. Training available. Save time and effort and reduce risk with COTS boards and software. Achieve world-class performance – WILD solutions outperform the competition.

For more information, contact: wﬁ [email protected] www.vmecritical.com/p46784

VME and Critical Systems / Resource Guide 2011 63 Rugged Computer Systems: Conduction Cooled CES Creative Electronic Systems "WFOVF&VHFOF-BODFt(SBOE-BODZ 4XJU[FSMBOE www.ces.ch

RIO6-8092 The RIO6-8092 is a CES 6U VME Single Board Computer for airborne applications requiring conduction-cooled equipment. It is spe- ciﬁ cally designed for the most demanding applications, combining very high computing and ﬂ ight-worthiness capabilities along with harsh environment criteria. The RIO6-8092 is the sixth generation of CES advanced high-performance computing platforms. It combines a fast single-core or dual-core processor with modern interconnect high-speed links and bridges (PCI Express, Gigabit Ethernet), FEATURES as well as an optional user-programmable FPGA for application i 6U VME64x form factor ™ development. A Board Management Controller is also integrated, i Freescale QorIQ P2010/P2020 processor i Xilinx Spartan-6 LX100T FPGA providing high-speed system status monitoring, logging and dynamic i One PCI Express Gen2 switch (12 ports) reload (processor and FPGA) functions in real-time for exceptional i Three PCIe x4 on XMCs mission backup strategies for the entire system. i Two GbE on VME-P2 i Two PMC/XMC sites i Static routing module (FlexIO) for extended compatibility with existing backplanes i Linux, VxWorks or VxWorks 653 software packages i FPGA user development toolkit (FPGA BSP) i Board Management Controller (BMC) and debugging environment

For more information, contact: [email protected] www.vmecritical.com/p46693

Rugged Computer Systems: Conduction cooled SIE Computing Solutions, Inc. .VQBD%SJWFt#SPDLUPO ."64" www.sie-cs.com

716 Series Conduction Cooled ATR Enclosures 716 Series offers a wide range of COTS solutions from a rugged, precision-machined design. Engineered for strength, light weight, and maximum cooling in a conduction cooled environment, the 716 Series incorporates a unique frame and conﬁ gurable conduct- ing walls that allow the ATR to be tailored to meet a wide range of thermal requirements.

FEATURES i Precision machined construction i Available in 3U or 6U card formats i Rugged deployment i Expansive range of ARINC sizes i Modular power supply i AC or DC ﬁ ltered inputs i System performance monitoring i Multiple bus architectures i Cold start heaters i Conﬁ gurable I/O panel

For more information, contact: [email protected] www.vmecritical.com/p34423

64 VME and Critical Systems / Resource Guide 2011 Rugged Computer Systems: Conduction Cooled

Innovative Integration "8BSE"WFOVFt4JNJ7BMMFZ $"64" www.innovative-dsp.com

VPXI integrates timing features into the VPX architecture providing synchronized high performance clock and trigger features to each FEATURES slot. Peripheral slots receive a dedicated clock and trigger input, as i VPX for Instrumentation well as several shared coordination signals. These signals are used – 3U OpenVPX embedded computer system – Integrated timing and triggering by VPX-COP, X6 and X3 I/O card families and support simultaneous – Advanced multiple plane connectivity and coordinated sampling. An optional high-precision GPS can be – Rugged with wide-temperature options used with the VPX-COMEX as a timing reference. i Embedded PC – Runs Windows, Linux or VxWorks The backbone of the system in the VPXI-ePC are the PCIe and SRIO – COM Express module with Intel i5/i7 CPU with up to 8 GB memory planes in the VPXI system. Each plane can sustain data rates over – Gb Ethernet, 4x USB, DisplayPort video 500 MB/s concurrently on PCIe and SRIO planes. The SRIO data – 256 GB SSD + up to 3 removable drives plane also has a x4 optical link on the front panel supporting 12 Gbps i Half (1/2) rack, 4U system connection. – Six slots total: CPU slot + 4 OpenVPX Peripheral Slots + Storage/ – I/O Slot The VPXI may host one VPX-COMEX CPU card to create a Windows/ – Compatible with many OpenVPX cards Linux/VxWorks-compatible PC. The VPXI-ePC can run the same – Up to 3 HDD/SSD storage slots – Supports Innovative X3/X5/X6 and VPX-COP applications as a desktop system. Performance OSs such as Linux Xenomai and VxWorks are available for real-time applications. i Integrated timing and triggering features – Synchronized, multi-card sampling – Internal or external clock/references – Generate low phase noise sample clocks from 0.125 to 1 GHz – 10 MHz, 0.5 ppm stable clock reference – Optional GPS-disciplined reference

i Advanced architecture supports multiple data planes – PCI Express and SRIO planes – Mesh interconnects all I/O cards – Front panel x4 optical link for SRIO

i Rear Terminal Modules for I/O and CPU slots – Forced Air cooling with upper and lower fans – Integrated 500W power supply – Expands to additional VPXI chassis using cable PCI Express – option

APPLICATIONS i Remote, Autonomous I/O i Mobile Instrumentation i Distributed Data Acquisition i Signal Processing Clusters

For more information, contact: [email protected] www.vmecritical.com/p52899

VME and Critical Systems / Resource Guide 2011 65 Rugged Computer Systems: Conduction Cooled Extreme Engineering Solutions, Inc. (X-ES) %FNJOH8BZ 4VJUFt.JEEMFUPO 8*64" www.xes-inc.com

XPand4200: Forced AC Sub-½ ATR for CC Boards The XPand4200 is an 8.8 pound, sub-½ ATR, forced air-cooled enclosure for conduction-cooled modules. A fully populated XPand4200 weighs less than 15 pounds and is ideal for C4ISR applications in vehicles such as UAVs, helicopters, planes, tanks and light armored vehicles, HMMWVs, and UGVs. The XPand4200 conducts heat from conduction-cooled modules to heat exchang- ers, where the heat is dissipated to the ambient environment by forced-air cooling. Compared to similar systems, the cooling capability of the XPand4200 is signifi cantly higher due to a heat FEATURES exchanger integrated into the top of the unit. Because the design i Physical dimensions of 4.88 in. (W), 6.0 in. (H), 13.5 in. (L), chassis footprint: 4.88 in. (W), 9.6 in. (L) supports conduction-cooled boards in an airtight enclosure, the i Six slots support conduction-cooled 3U VPX, 3U CompactPCI, or XPand4200 provides enhanced shock and vibration protection and power supply modules isolation of the boards from the outside environment. i 3U VPX and CompactPCI backplanes available i Confi gurable front panel I/O connectors i An optional memory module bay can be added to the top of the XPand4200 unit, which supports a removable SATA solid-state disk (SSD) fl ash memory module

For more information, contact: [email protected] www.vmecritical.com/p45366

Rugged Computer Systems: Conduction Cooled Extreme Engineering Solutions, Inc. (X-ES) %FNJOH8BZ 4VJUFt.JEEMFUPO 8*64" www.xes-inc.com

XPand5200: Convection-Cooled Sub-½ ATR System The XPand5200 is a convection-cooled sub-½ ATR box that provides both convection-cooling and conduction-cooling to conduction- cooled payload cards. Both 3U CompactPCI and 3U VPX backplanes are supported by the XPand5200. It supports an integrated MIL-STD-704 28 V DC power supply, internal EMI ﬁ ltering, and holdup for up to 100 ms at 70 W. Meeting the rigorous MIL-STD- 810 standards, the XPand5200 is a sub-½ ATR solution for deployed systems in the harshest environments.

The XPand5200 system is an excellent system for rugged Network FEATURES Attached Storage (NAS); since solid state storage generates very i Physical dimensions of 4.88 in. (W), 5.65 in. (H), 10.30 in. (L) little heat, it is well suited to natural convection-cooling. Along i Four conduction-cooled 0.8 in. slots, 3U VPX and CompactPCI with an Intel or Freescale SBC, the XPand5200 can support a total backplanes available of 3 TB of solid state Network Attached Storage. i Conﬁ gurable front panel I/O connectors i Foldable front panel handle i Environmentally sealed

For more information, contact: [email protected] www.vmecritical.com/p47845

66 VME and Critical Systems / Resource Guide 2011 Rugged Computer Systems: Electronics Packaging Curtiss-Wright Controls Electronic Systems 5BZMPS4USFFUt-JUUMFUPO ."64" www.cwces.com

Small Form Factor OpenVPX ATR Enclosures The Hybricon Small Form Factor (SFF) Baseplate Conduction Cooled Chassis are designed for rugged airborne and ground mobile applications. With extended temperature, shock and vibration tolerance, these open architecture solutions support 4 or 6 payload slot 1" pitch OpenVPX, VPX, VPX-REDI and CompactPCI backplanes. They utilize a 200-400W military power supply for MIL-STD-704 aircraft and MIL-STD-1275 vehicle use. Custom conﬁ gurations and integration services are available. FEATURES i ATR style, 3U Small Form Factor (SFF) solution i Cooling: Air Conduction Cooled Baseplate i CoolWall advanced metallic composite construction available i Supported Bus Structure: VPX, OpenVPX, VPX-REDI (VITA 46/48/65/68) i Power Supply: DC Input: 28VDC nominal (22VDC to 33VDC continuous). 200W 28VDC Power Supply compliant to MIL-STD-704F and MIL-STD-1275

For more information, contact: [email protected] www.vmecritical.com/p41860

Rugged Computer Systems: Electronics Packaging Elma Bustronic (SJNNFS#MWEt'SFNPOU $"64" www.elmabustronic.com

VXS, VME, and VME64x Backplanes Elma Bustronic has the largest selection of VITA-based backplanes, including VME, VME64x, VPX/OpenVPX, and VXS. The company has been a leader in the VME industry and continues to be a key driver of new VITA-based backplane architectures.

Elma Bustronic has several sizes/conﬁ gurations of its VXS backplanes in Single Star, Dual Star, Switchless Mesh, and VITA 41.6 (with Ethernet Control Plane). Sizes include 5, 8, 10, 12, 18, and 20 slots. FEATURES i VXS backplanes in Star, Dual Star, and Switchless Mesh (unique With both 6U and 7U (for more power taps) versions, Elma Bustronic high-speed versions are available) has a wide selection of standard and customized VME64x back- i VXS backplanes compliant to VITA 41.6 for Ethernet control plane planes. The company also offers the largest selection of OpenVPX i VME64x backplanes in 6U and 7U heights (also compliant versions to VITA 1.7 for increased power) backplane solutions in the industry. i VME backplanes in J1, J2, and J1/J2 (6U) Monolithic versions i A wide range of accessories is available including a load board, extender board, form factor extender, and RTMs i Customized backplane solutions, conformal coating, and board contract assembly services available

For more information, contact: [email protected] www.vmecritical.com/p52527

VME and Critical Systems / Resource Guide 2011 67 Rugged Computer Systems: Electronics Packaging SIE Computing Solutions, Inc. .VQBD%SJWFt#SPDLUPO ."64" www.sie-cs.com

VPX/OpenVPX Series VITA 46/48/65 Backplanes SIE Computing Solutions’ VPX backplanes are designed to the latest VITA 46, 48 and 65 standards. SIE Open VPX backplanes utilize the BKP3-CEN06-15.2.2-3 profi le ratifi ed by VITA 65, and are also available in custom confi gurations. The 5-slot full mesh 3U VPX and 6-slot 3U OpenVPX backplanes are designed for a wide array of VPX/OpenVPX applications. The highly confi gurable SIE backplane line offers maximum bandwidth in a compact size. The 3U VPX backplane provides greater I/O fl exibility through I/O PLUS™, an innovative use of confi gurable I/O daughtercards that accommodates an array of VPX applications. FEATURES i Designed for board-agnostic system design and integration i Range of full mesh VPX and OpenVPX confi gurations and profi les i 2 slots dedicated I/O daughtercards i VITA 46, 48 and 65 compliant i Over 200 Watts per slot i 28 layer board i RoHS compliant product features

For more information, contact: [email protected] www.vmecritical.com/p45468

Rugged Computer Systems: Electronics Packaging TE Connectivity 10#PY .4t)BSSJTCVSH 1" 64" 5PMM'SFF www.te.com/ADM

TE’s advanced FORTIS ZD high-speed backplane connector is designed for military and commercial aerospace applications. As demands on systems for real-time intelligence intensify, the importance of high-performance interconnection becomes critical. TE set out to design a new connector system that supports increasing bandwidth requirements in a ruggedized format to withstand the increased shock and vibration requirements of emerging military applications. FEATURES i Allows 10 Gb/s+ data rates i Extreme mechanical and electrical performance for the most demanding applications i Modular design allows for user conﬁ gurability and modular evolution i Three shell varieties for application versatility i Mini-Box contact system provides 4 points of contact for ultra reliability i www.TheFutureUnleashed.com for more information

For more information, contact: [email protected] www.vmecritical.com/p52822

68 VME and Critical Systems / Resource Guide 2011 Rugged Computer Systems: Electronics Packaging TE Connectivity 10#PY .4t)BSSJTCVSH 1"64" 5PMM'SFF www.te.com/ADM

TE Connectivity’s Mezalok connector is a high-reliability mezzanine connector that more than doubles the speed and durability of competing technology, making it the most viable option for today’s military and commercial aerospace applications.

The need for embedded electronic systems in rugged platforms has been continually increasing and driving more stringent requirements for board-to-board connectivity. TE engineers responded to these needs by developing a super-fast, super-durable and super- FEATURES redundant mezzanine connector ideal for extreme environments. i 60 and 114 positions i Mini-Box contact system provides 4 points of contact for ultra reliability i LCP plastic housings offer superior thermal stability and are low-outgassing i 114 position footprint compatible to XMC footprint i 500 mating cycles durability i www.ElementalAdvantage.com for more information

For more information, contact: [email protected] www.vmecritical.com/p46728

Rugged Computer Systems: Mass Storage Curtiss-Wright Controls Electronic Systems 1BSBNPVOU1MBDF 4VJUFt'BJSCPSO 0)64" www.cwces.com

Vortex Flash Storage Module The 3U VPX3-FSM (Flash Storage Module) is a new rugged, high- performance, high-capacity, solid-state SATA storage card that includes a NIST certifi ed 256-bit encryption capability. The VPX3-FSM utilizes high reliability SLC NAND fl ash to provide 1 TB of capacity in four banks of 256 GB, each in 3U VPX (VITA 46) and VITA 48.2 REDI with a 1" pitch. The four banks of fl ash can appear to the host as four separate SATA drives or as a single SATA drive with hardware RAID0 support. Industry standard wear leveling and bad block FEATURES management are provided. Declassifi cation is generally less than i 3U VPX SLC NAND fl ash storage 500 nSec as only the 256-bit AES key need be purged to secure i 1 TB physical storage capacity 1 TB of data, while typical solid state purge algorithms can take i 28% over-provisioning to enhance storage endurance many hours to complete. i VPX single RAID0 or quad JBOD SATA ports i 160 MB/s RAID0 performance, 100 MB/s per port JBOD performance i Industry standard wear leveling and bad block handling i Interoperable with standard host storage software under Windows®, Linux®, or VxWorks® i MLC & SLC Flash versions i RS-232 or I2C for host management functions i NIST certifi ed 256-bit AES data encryption hardware

For more information, contact: [email protected] www.vmecritical.com/p42615

VME and Critical Systems / Resource Guide 2011 69 Rugged Computer Systems: Mission Critical Aitech Defense Systems 1SBJSJF4USFFUt$IBUTXPSUI $"64" www.rugged.com/nighthawk.htm

NightHawk RCU™: Intel Atom-based, self-contained control unit Aitech Defense Systems’ NightHawk RCU™, an extremely rugged, compact Intel Atom-based, self-contained control unit, weighs only 4.5 lbs, almost half that of similar models currently available.

This weight reduction, combined with a slimmer proﬁ le and natural convection/radiation cooling that dissipates up to 22 W at +55°C in still air, or at up to +71°C with an optional low pressure fan or base plate, makes the rugged control unit ideal for a variety of military, aerospace and commercial environments.

These include data concentrator and remote interface applications such as manned and unmanned, ground or airborne vehicles as well as low SWaP (Size, Weight and Power) Data Concentrator Unit (DCU) and Remote Interface Unit (RIU) applications.

For military tracked and wheeled vehicle applications, the Night Hawk RCU can provide Condition Based Maintenance functionality to reduce the overhead costs of preventative vehicle maintenance. Based on the low-power Intel Atom processor operating at 1.6 GHz, FEATURES NightHawk provides up to 2 GB DDR2 SDRAM as well as between i Embedded PC-based Remote Interface Unit (RIU)/Data Concentrator 4 and 8 GB of SSD memory with an optional expansion up to 250 GB Unit (DCU) for extended and remote data collection and storage applications. i High Performance PC – Low Power Intel Processor in a Lightweight, Passive Air-cooled Rugged and Sealed Enclosure Optional I/O includes MIL-STD-1553B, ARINC-429 and ARINC-708, i Intel® Atom™ N270 Processor (Navy Pier Platform) at 1.6 GHz with 2GB DDR2 SDRAM CAN Bus, WiFi and WAN ports as well as video capture and processing, discrete and analog I/O and an eight-port Gigabit Ethernet i Data Storage – from 4 to 8 GB SSD Standard, with Optional Expansion to 250 GB SSD switch. All I/O is available via a fl exible, user-defi ned confi guration i Complete Set of Standard PC I/O Interfaces (Dual Gigabit Ethernet, of MIL-DTL-38999-style connectors mounted conveniently on the Video Graphics, Stereo Audio In/Out, USB, RS-232/RS-422/RS-485 unit’s front access panel. Serial Ports, Parallel Port, PS/2 Ports) i Extensive Internal Support for Added Peripherals and I/O Expansion The unit uses conductive silicon rubber O-rings and fl at EMI gaskets i 18-36 VDC Power Input with EMI/EMC-compliant Power Input Filter to keep sand, dust, humidity and contaminant splash out and i Three Rugged MIL-DTL-38999 Connectors (1 – Power, 2 – Standard its EMI/RFI fi lter protection meets MIL-STD-461 emission and PC I/O, 3 – Custom I/O) susceptibility limits. External surfaces are fi nished with black hard i Designed for Harsh Mechanical, Climatic, Chemical and Electrical anodized for excellent corrosion resistance, with other colors and Applications CARC (Chemical Agent Resistant Coating) paint available upon i Supported OS: Windows Embedded XP, Linux, VxWorks request. Internal surfaces are chemical conversion coated for corrosion resistance as well as to ensure high electrical conductivity.

Operating temperature is -55°C to +71°C in extreme environments up to 40 g peak single half-sine shock and 10 g RMS sine vibration at 5 Hz to 500 Hz. The NightHawk RCU is compliant with MIL-STD-1275, MIL-STD-704, MIL-STD-461 and MIL-STD-462 and features an input voltage range from 18 VDC to 36 VDC with reverse polarity protection. Total power supply output is 50 W to power optional, user-deﬁ ned I/O.

For more information, contact: [email protected] www.vmecritical.com/p44263

70 VME and Critical Systems / Resource Guide 2011 Rugged Computer Systems: Rugged Chassis Elma Electronic Inc. (SJNNFS#MWEt'SFNPOU $"64" www.elma.com

Elma’s Family of Rugged Chassis Elma’s families of rugged chassis and enclosures provide a huge selection of 19" Rackmount, SFF, Convection, Conduction, and Liquid Cooled chassis. Choose from our extensive selection of standard and built to order chassis types, or for fast delivery, select one of our chassis from our Express Program. Our rugged chassis meet the following standards:

– Superior quality, design, construction, and performance – Thermal and other environmental requirements of MIL STDs 167, FEATURES – 810E, and 901D i Convection, conduction, and liquid cooled ATR (Air Transport Rack); available in 1/2, 3/4, 1 and 1 1/2 ATR formats per ARINC 404A – ARINC 404A for Air Transport Racks (ATRs) i 19" rackmount and stand-alone designs to meet rugged environ- – Backplanes for COTS architectures VME, VXS, VPX, cPCI, xTCA; mental requirements such as MIL STDs 167, 810E, and 901D – custom designs available i Backplanes from 2 to 21 slots for COTS architectures VME, VPX, VXS, cPCI, xTCA; custom designs available – Airﬂ ow and power management i Express Program offers a selection of chassis available in stock for quick turnaround i Ask about our customized chassis and rugged boxes based on standard product designs

For more information, contact: [email protected] or (510) 656-3400 www.vmecritical.com/p33119

Single Board Computer: Intel-based (x86, Core i3/i5/i7) Concurrent Technologies Inc 5PXFS0GGJDF1BSLt8PCVSO ." 64" www.gocct.com

VX 81x/09x – 2nd Generation Intel Core Processor – VME/VXS The VX 81x/09x is a PC-compatible high performance VME or VXS processor board supporting a choice of 2nd Generation Intel Core processors and up to 16 GB of DDR3 ECC SDRAM. This single slot board features 2 PMC/XMC sites, a variety of I/O interfaces and optional on-board mass storage. The board supports VITA 41.4 dual x4 PCI Express backplane fabrics and VITA 41.6 Gigabit IEEE 802.3 (1000 Base-BX) ports. In addition to the commercial grade product, the board is also available in extended temperature and FEATURES rugged air and rugged conduction cooled variants. i Choice of 2 or 4 core 2nd Generation Intel Core Processor i Up to 16 GB of DDR3-1333 ECC SDRAM The high processing performance, the wealth of I/O interfaces, and i 2 x SATA interfaces plus optional on-board drive the choice of environmental speciﬁ cations, ensure that this board i On-board CompactFlash site is suitable for a wide range of applications, in particular within the i 2 x PMC/XMC sites i Dual independent displays defense, security and aerospace markets. i 2 x serial channels; 6 x USB interfaces i 2 x 1000Mbps Ethernet channels To ease integration, many of today’s leading Operating Systems, i VME64/320 interface including Windows, Linux, and VxWorks, are supported. i Optional VXS P0 connector (VITA 41.4; VITA 41.6) i Optional BIT support

For more information, contact: [email protected] www.vmecritical.com/p47634

VME and Critical Systems / Resource Guide 2011 71 Single Board Computer: Intel-based (x86, Core i3/i5/i7) Dynatem, Inc. .BEFSP 4VJUF$t.JTTJPO7JFKP $"64" www.dynatem.com

DPD Core™2 Duo based VMEbus Single Board Computer The DPD is a VMEbus (and VME64) compatible platform based on the Intel® Core™2 Duo Mobile Processor L7400. The DPD takes advantage of the Core™2 Duo’s low 15 W power consumption as a rugged Single Board Computer (SBC). It is optionally available as an IEEE 1101.2-compliant, conduction-cooled VMEbus module with wedge locks and a full-board heat sink for high shock/vibration environments and temperature extremes.

On-board CompactFlash permits single-slot booting. Two PMC-X FEATURES ® ™ sites are provided for additional I/O expansion. One site also i Intel Core 2 Duo Mobile Processor L7400 @ 1.5 GHz for 64-bit operation supports XMC expansion. i E7520 chipset for PCIe support and high memory bandwidth i On-board SVGA controller i Two Gb LAN front panel ports plus two more routed to the backplane in compliance with VITA 31.1 i Supports two PMC sites, one of which optionally supports XMC modules i Available in conduction-cooled versions for rugged applications i Support for Windows, VxWorks, Linux, QNX and Solaris

For more information, contact: [email protected] www.vmecritical.com/p34979

Single Board Computer: Obsolescence Mitigation GDCA, Inc. 1PSUPMB"WFOVFt-JWFSNPSF $"64" www.gdca.com

Support your applications indefi nitely! Don’t let component obsolescence issues dictate your priorities. Talk to us and fi nd out how GDCA has helped thousands of Solutions for your industry customers, across different industries, with solutions that have made obsolescence-forced redesign a thing of the past. i GDCA delivers tailored solutions to fi t the unique needs of your application’s product life cycle: GDCA teams with embedded OEMs such as Emerson Network Power, – Eliminate issues related to obsolescence and costly re-design Kontron, Curtiss-Wright, RadiSys, PT and more, to manufacture – Extend the life of equipment product-lines indefi nitely and repair end-of-life (so-called “obsolete”) embedded computing – Mitigate the cost of over/understocking that result from products that exactly meet their original specifi cations. – last-time-buy notices

i GDCA is ISO 9001:2008 Certiﬁ ed and ITAR compliant Since 1987, GDCA has built a solid reputation with customers who need consistent products for the long term. Many of our customers in the medical, industrial, military and telecom markets have critical applications or investments in certiﬁ cation. They rely on GDCA to deliver the same product year after year.

For more information, contact: [email protected] www.vmecritical.com/p52901

72 VME and Critical Systems / Resource Guide 2011 Single Board Computer: Clock Synch/Timing Annapolis Micro Systems, Inc. "ENJSBM$PDISBOF%SJWF 4VJUFt"OOBQPMJT .%64" www.annapmicro.com

Four Channel Clock Synchronization Board The Four Channel Clock Distribution Board distributes a common clock and synchronized control signal triggers to multiple cards in the system. This 6U VME64x/VXS board provides four high-speed, ultra-low jitter, ultra-low skew differential bulkhead mounted clock outputs, two ultra-low skew differential vertical SMA on-board clock outputs, and four ultra-low skew and clock synchronized single- ended bulkhead mounted control signal triggers.

A jumper set at board installation time or via optional P2 Serial Port determines which one of the two installed clock sources is active. Manufacturing options for Clock Source 0 are Single Ended or Differential External Clock, a PLL ranging from 700 MHz to 3 GHz with an On-Board Reference Oscillator, or a PLL ranging from 700 MHz to 3 GHz with a 10 MHz External Reference. Manufacturing options for Clock Source 1 are a PLL ranging from 700 MHz to 3 GHz with an On-board Reference Oscillator, a PLL ranging from 700 MHz to 3 GHz with a 10 MHz External Reference or an On-Board Low Frequency Oscillator ranging up to 800 MHz. FEATURES The four control trigger outputs can originate from a high- i Four Synchronized Differential Front Panel Clock Outputs up to precision external source via front panel SMA, from a manual 3 GHz with Typical Skew of 5 ps pushbutton on the front panel, or from software via an optional i Ultra-low Clock Jitter and Phase Noise – 275 Fs with 1,280 MHz PLL Backplane P2 Connector Serial Port. These trigger outputs are and external 10 MHz Reference synchronized to the distributed clock to provide precise output i On-board PLLs Manufacturing Options provide Fixed Frequencies of timing relationships. 700 MHz to 3 GHz, Locked to Internal or External Reference i On-board Low Frequency Oscillator provides Fixed Frequencies up Annapolis Micro Systems is a world leader in high- to approximately 800 MHz performance, COTS FPGA-based boards and processing for i Four Synchronized Trigger Outputs, always Synchronized with RADAR, SONAR, SIGINT, ELINT, DSP, FFTs, communications, the Output Clock, with Typical Skew of 5 ps Software-Deﬁ ned Radio, encryption, image processing, prototyping, i Jumper Selectable Trigger Output Levels of 3.3 V PECL, 2.5 V PECL, text processing, and other processing intensive applications. or 1.65 V PECL i Source Trigger from Front Panel SMA, Pushbutton, or Optional Annapolis is famous for the high quality of our products and for our P2 Serial Port unparalleled dedication to ensuring that the customer’s applica- i Cascade boards to provide up to 16 sets of outputs tions succeed. We offer training and exceptional special application i Compatible with standard VME64x and VXS 6U backplanes development support, as well as more conventional support. i Universal clock input supports wide range of signal options, including signal generator sine wave i Differential clock input permits multiple standards including: LVDS, 3.3 V PECL, 2.5 V PECL, and 1.65 V PECL i Clock and Trigger Outputs Compatible with all Annapolis Micro Systems, Inc. WILDSTAR™ 2 PRO I/O Cards and WILDSTAR™ 4/5 Mezzanine Cards

For more information, contact: wﬁ [email protected] www.vmecritical.com/p33661

VME and Critical Systems / Resource Guide 2011 73 Single Board Computer: FPGA-based Annapolis Micro Systems, Inc. "ENJSBM$PDISBOF%SJWF 4VJUFt"OOBQPMJT .%64" www.annapmicro.com

WILDSTAR 6 for AMCs Annapolis Micro Systems, Inc. is a world leader in high-performance, COTS FPGA-based processing for radar, sonar, SIGINT, ELINT, DSP, FFTs, communications, Software-Deﬁ ned Radio, encryption, image processing, prototyping, text processing, and other processing- intensive applications. Our fourteenth-generation WILDSTAR 6 for AMC uses Xilinx’s newest Virtex-6 FPGAs for state-of-the-art performance. It accepts one FMC I/O Card. Our boards work on a number of operating systems, including Windows, Linux, Solaris, IRIX, ALTIX, and VxWorks. We support our board products with a standardized set of drivers, APIs, and VHDL simulation models.

Our extensive IP and board support libraries contain more than 1000 cores, including ﬂ oating point and the world’s fastest FFT. FEATURES CoreFire uses a graphical user interface for design entry, supports i One Xilinx Virtex-6 FPGA I/O Processing Elements – LX240T, LX365T, hardware-in-the-loop debugging, and also provides proven, reus- LX550T, SX315T, or SX475T able, high-performance IP modules. WILDSTAR 6 for AMC, with its i Onboard Host Freescale P1020 or P2020 PowerPC associated I/O Cards, provides extremely high overall throughput and i Up to 2.5 GBytes DDR2 DRAM in 5 memory banks or up to 80 MB processing performance. The combination of our COTS hardware DDRII or QDRII DRAM in 5 memory banks and CoreFire allows our customers to make massive improvements in i Programmable FLASH to store FPGA image processing speed, while achieving signiﬁ cant savings in size, weight, i 4X PCI Express Bus Gen 2 between PPC and FPGA power, person-hours, dollars, and calendar time-to-deployment. i Supports VITA 57 FMC I/O Cards Annapolis is famous for the high quality of our products and for our i Full CoreFire Board Support Package for fast, easy application unparalleled dedication to ensuring that the customers’ applications development succeed. We offer training and exceptional special application i VHDL model, including source code for hardware interfaces and ChipScope access development support, as well as more conventional support. i Available in both commercial and industrial temperature grades Save time and effort and reduce risk with our COTS boards and i Proactive Thermal Management System – current, voltage, and software. Achieve world-class performance – WILD solutions temperature monitoring sensors via Host API outperform the competition. i Includes one year hardware warranty, software updates, and customer support. Training available.

For more information, contact: wﬁ [email protected] www.vmecritical.com//p46785

74 VME and Critical Systems / Resource Guide 2011 Single Board Computer: PowerPC/PowerQUICC/QorIQ Emerson Network Power 4%JBCMP8BZ 4VJUFt5FNQF ";64" PS www.Emerson.com/EmbeddedComputing

MVME2500 VMEbus Processor Board The MVME2500 SBC from Emerson Network Power features the latest Freescale QorIQ™ processors – the single-core P2010 and dual-core P2020. The e500 v2 core QorIQ processor uses 45 nano- meter technology, which delivers an industry-leading performance- to-power ratio with single-core or dual-core frequencies up to 1.2 GHz at less than 8 Watts. This is a perfect migration path for our PowerQUICC processor boards (MVME3100 and MVME4100), as well as our G4 processor boards (MVME5100 and MVME5110).

The extended temperature models feature an operating temperature FEATURES range of -40°C to +71°C – a signiﬁ cant increase over the standard i 800 MHz or 1.2 GHz Freescale QorIQ™ P2010 and P2020 models’ 0°C to +55°C range. Acceptable storage temperatures have processors also been increased, safely accommodating environments from i 1GB or 2GB DDR3-800 ECC memory, soldered down -50°C to +100°C. Both models are capable of operating under up to i Three on-board Gigabit Ethernet interfaces (one front, one rear, 5G of vibration (15 to 2000 Hz) and can withstand an 11 millisecond one conﬁ gurable by customer to front or rear) shock of up to 30G. Conformal coating is also available. i Five serial ports; one USB 2.0 port; up to two PMC/XMC sites The MVME2500 is ideal for automation, medical, and military appli- i Optional rear transition module cations such as railway control, semiconductor processing, test and i Extended temperature (-40°C to +71°C) and rugged variants measurement, image processing, and radar/sonar.

For more information, contact: [email protected] www.vmecritical.com/p46537

Storage (digital): Data Recorder (H/W)

Innovative Integration "8BSE"WFOVFt4JNJ7BMMFZ $"64" www.innovative-dsp.com

Andale Andale (pronounced on’ duh lay) is a powerful data logging system that directly controls an NTFS disk subsystem to support gap-free storage or playback of analog or digital signals acquired using the Innovative X-series XMC modules. The included logging software moves data in real-time between the analog or digital I/O peripherals on any Innovative XMC module to/from dedicated SATA drives with minimal intervention from application software or Windows.

Dedicated PCI Express SATA3 RAID controllers interface to conven- FEATURES tional hard/SSD drives supporting data fl ow rates up to 2600 MB/s, i Turnkey, High-Speed Data Acquisition + Storage sustained. File sizes are limited only by the amount of disk storage i Runs Windows 7/i7 CPU in ATX enclosure with integrated cooling available. Two terabytes of storage are available in the standard i Up to 48 TB Hard Disk Array confi guration; an optional 48 TB confi guration is available and even i Expandable storage via external JBOD larger storage is supported via external JBOD enclosures. i 2600 MB/s sustained performance from analog or digital I/O module to standard NTFS disk fi les A multitude of analog/digital I/O interfaces is available through i Supports all Innovative X3, X5 and X6 I/O module features including triggering and timing features optional XMC modules. Up to four X-series modules may be installed i Wideband (500 MHz) logging/playback and operated simultaneously in the chassis. i Autonomous or Network-controlled operation via named pipe

For more information, contact: [email protected] www.vmecritical.com/p46508

VME and Critical Systems / Resource Guide 2011 75 Storage (digital): Mass Storage Phoenix International 84PVUIFSO"WFt0SBOHF $"64" 714-283-4800 www.phenxint.com

RPC12 Ruggedized Data Storage Array The RPC12 is a high performance Fibre Channel/SAS/iSCSI host interface, 6Gb SAS/SATA-II RAID Subsystem utilizing Hard Disk and Solid State Disk devices that deliver a level of operational environmental capability not previously available in COTS Data Storage Systems.

The Storage Area Network (SAN) ready RPC12 features a 12 Drive Array housed in a rugged 3U (5.25") panel height enclosure providing FEATURES 8Gb FC, 6Gb SAS or 10GigE iSCSI host interfaces to high performance i Single Active or Dual Active, Failover/Failback Controller 6Gb SAS and/or SATA SSDs and HDDs. It is designed to be compliant i 8GB Fibre Channel, 6GB SAS or 10GigE iSCSI host ports with military and industrial speciﬁ cations such as MIL-STD-810F, i Sustained Data Rates in Excess of 700MB/sec per port MIL-STD-901D, MIL-STD-461F and NEBS level 3. i Battery Free Cache Backup i Enclosed and Electronically Isolated Hot-swap Drive Canisters The unique design of the RPC12’s rugged, cableless, passive midplane- i 40 to 440 Hz, 90/240 VAC Input Operation i Linux, Windows and Unix Support (VMware and Cluster Certiﬁ ed) based, high density 3U chassis provides an increased environmental i Redundant, Hot-swap Components/FRUs operational envelope (-20 to +70 degrees C, 45,000 ft. altitude with i Management GUI and Failover Software SSDs) redundant, hot-swap components and massive storage i Very Cool Operation – Less than 12 Degress F Max. Temp. Rise capacity, while assuring the highest level of data availability. i Made in the USA

For more information, contact: [email protected] www.vmecritical.com/p35575

Storage (digital): Mass Storage

Themis Computer #BZTJEF1BSLXBZt'SFNPOU $"64" www.themis.com

Themis RuggedStore 3100 Network Storage Appliance The Themis RuggedStore 3100 network storage appliance delivers an unequaled combination of features, simplicity, and effi ciency for ruggedized storage. It enables true storage consolidation with seamless management and a unique application-driven approach that eliminates the boundaries between applications and their storage. The RuggedStore 3100 is designed to withstand wide temperature ranges, intense shock and vibration, and high humidity. The base unit can hold up to 12 drives, with scalability of up to FEATURES 96 total drives with Disk Add-on Enclosures (DAEs). i Compact 2RU form factor i Multi-protocol IP connectivity for concurrent NAS and SANs with support for fi le-based (CIFS, NFS) and block-based (iSCSI) protocols The RuggedStore 3100 meets the needs of dynamic organizations i Scalable up to 96 drives and 57.6 TB, of raw capacity 15k RPM with that must scale and distribute work group access to data. It provides 2.5" 600-GB SAS drives an ideal platform for environments with physical server infra- i Two, 1 Gb/sec Ethernet for NAS and iSCSI, with 1 FLEX I/O slot that structures as well as those employing server virtualization to drive allows for four additional 1 Gb/sec ports consolidation and greater effi ciency. The RuggedStore 3100 pro- i Powerful application-based provisioning wizards for breakthrough vides a set of features that includes exceptional capacity utilization, simplicity, including seamless integration with VMWare, Microsoft Exchange, and Microsoft Hyper-V data protection and availability solutions, and advanced support i Themis RuggedStore software provides centralized management for capabilities. seamless access to all storage

For more information, contact: [email protected] www.vmecritical.com/p52891

76 VME and Critical Systems / Resource Guide 2011 Storage (digital): Solid State (SSD) Board Phoenix International 84PVUIFSO"WFt0SBOHF $"64" www.phenxint.com

VS/C1-250-SSD Phoenix International’s Conduction/Convection Cooled VME Data Storage Blade delivers high capacity, high performance data storage for military, aerospace and industrial applications requiring rugged, extreme environmental and secure mass data storage.

This 6U single-slot module houses one or two each 6Gb Serial Attached SCSI (SAS) or Serial ATA (SATA) Solid State Disks or Rotating Hard Drives. These high speed modules will sustain write FEATURES speeds in excess of 550MB/sec and 80,000 4KB random write IOPS. i Serial ATA (SATA) and Serial Attached SCSI (SAS) Device Interfaces The VS/C1-250-SSD is available in an operating temperature range i Operational Temperature Range From -40 to +85 Degrees C from -40 to +85 degrees C and functions at an altitude greater i Up to 80,000 Feet Operational Altitude than 80,000 feet. It also complies with current defense depart- i Sustained R/W Data Transfer Rates to 550Gb/sec ment security standards providing multiple levels of secure erase i 80,000 4KB Random Write IOPS techniques. i Integrated SLC, eMLC or MLC NAND Flash Solid State Disk Drives i Supports 7.2K, 10K or 15K RPM Hard Disk Drives The VS/C1-250-SSD’s outstanding performance and versatility are i Meets Military and IRIG 106-07 Declassiﬁ cation Standards i Advanced Flash Management for Enhanced Reliability and enabled by Phoenix International’s state of the art technology, which Durability provides high transfer and I/O rates, endurance and data integrity. i Low Power Consumption

For more information, contact: [email protected] www.vmecritical.com/p43730

Storage (digital): Solid State (SSD) Board Extreme Engineering Solutions, Inc. (X-ES) %FNJOH8BZ 4VJUFt.JEEMFUPO 8*64" www.xes-inc.com

XPort6172: 512 GB of 3U VPX Conduction- or Air-Cooled SSD The XPort6172 is a conduction- or air-cooled 3U VPX Solid State Disk (SSD) providing up to 512 GB, or a half terabyte (½ TB), of solid state storage with data encryption. The XPort6172 supports 256-bit AES encryption, utilizing the 123 NIST- and CSE-certifi ed Enova Technology X-Wall MX-256C encryption chip. Additionally, the XPort6172 supports “zeroization” (i.e., enhanced erase) and satisfi es DoD NISPOM 5220.22 and NSA/CSS 9-12 specifi cations. Using the XPort6172, a total of 1 TB in a single 3U VPX slot is achievable by mounting the XPort6103 512 GB XMC SSD onto the XMC site of the FEATURES XPort6172. The XPort6172 and XPort6103, individually or combined, i x4 PCIe interface on the VPX P1 backplane connector satisfy the rigors of MIL-STD-810F and -461E – they are ready for i XMC connector with a x4 PCIe interface (for XMC or XPort6103 use) the harshest deployments. i Up to 512 GB capacity (appears as two 256 GB drives) i 256-bit AES encryption (optional) i Declassifi cation via hardware or software control (optional) i ATA Secure Erase support i 100,000 program/erase cycles i -40°C to 85°C operating temperature range

For more information, contact: [email protected] www.vmecritical.com/p47715

VME and Critical Systems / Resource Guide 2011 77 Surveillance Systems: Data Acquisition Annapolis Micro Systems, Inc. "ENJSBM$PDISBOF%SJWF 4VJUFt"OOBQPMJT .%64" www.annapmicro.com

Dual 40/100G CFP IBM Blade 2nd-Slot Card Annapolis Micro Systems, Inc. is releasing the ﬁ rst COTS board in the world capable of capturing and processing multiple 100Gbit signals in real time! The Annapolis Dual 40/100G CFP IBM Blade 2nd-Slot Card enables the capture and real-time processing of massive amounts of data for network security and Signal Intelligence applications. Annapolis has integrated two CFP interfaces into their Dual CFP IBM Blade 2nd-Slot Card, allowing the capture, buffering and processing or transmission of two 100Gbit Ethernet streams per card or four 40Gbit Ethernet streams per card. The Dual CFP IBM Blade 2nd-Slot Card features one or two CFP transceiver cage interfaces, which can support either 100Gbit or 40Gbit Ethernet, 100Gbit OTU4 or 40Gbit SDH/OTU3.

Integral to any massively bandwidth intensive application is the ability to process that data. The Dual CFP IBM Blade 2nd-Slot Card is designed to interface to the 8 processors available on the WILDSTAR 5 IBM Blade main board. Using Altera Stratix IV FPGA processors, up to 37 GBytes of DDR3 DRAM and a 160x160 6.5Gbit crossbar, the Dual CFP card is able to buffer and distribute the data from the CFP interfaces to the processors on a WILDSTAR 5 IBM FEATURES Blade main board at full bandwidth. i One or two CFP interfaces, each supporting full duplex: –100Gbit and 40Gbit Ethernet (802.3ba) Annapolis will supply the Dual CFP IBM Blade 2nd-Slot Card with Ethernet MACs for 40Gbit and 100Gbit Ethernet, and full standardized –100Gbit (OTU4) and 40Gbit (SDH/OTU3) for telecommunications board support for VHDL models, drivers and APIs. –Three 40Gbit Ethernet streams i One or two Altera Stratix IV GT EP4S100G5 FPGAs i Up to 37 GBytes of DDR3 DRAM arranged in up to eight 72-bit ports i Integrated as 2nd slot of WILDSTAR 5 for IBM Blade main processor board i Up to 68 Full Duplex Serial I/O lanes from CFP 2nd slot board to WILDSTAR 5 IBM Blade main board i Supports enough memory bandwidth for buffering the incoming data i Includes 100Gbit and 40Gbit Ethernet MACs for Altera Stratix IV

For more information, contact: wﬁ [email protected] www.vmecritical.com/p46786

78 VME and Critical Systems / Resource Guide 2011 Surveillance Systems: Data Acquisition Annapolis Micro Systems, Inc. "ENJSBM$PDISBOF%SJWF 4VJUFt"OOBQPMJT .%64" www.annapmicro.com

Dual 4.0 GSps DAC The Annapolis Micro Systems Dual Channel 4.0 GSps D/A I/O Card provides one or two 12-bit digital output streams at up to 4.0 GSps. The board has one or two MAX 19693 for 4.0 GSps, MAX 19692 for 2.3 GSps, or MAX 5859 for 1.5 GSps.

The Dual Channel DAC board has fi ve SMA front connectors: two single-ended DAC outputs, a high-precision trigger input with Fs precision, and a universal single- or double-ended 50 ohm clock input. It has excellent gain fl atness in the fi rst 3 Nyquist Zones, ultra-low skew and jitter saw-based clock distributions, and main board PCLK sourcing capability.

In concert with the WILDSTAR 4 or WILDSTAR 5 FPGA processing main boards, this mezzanine board supplies user-conﬁ gurable real- time A to D conversion and digital output. Up to two A/D or D/A and up to two serial I/O cards can reside on each WILDSTAR 4 or WILDSTAR 5 VME/VXS or IBM Blade main board, or up to one A/D or D/A and up to one serial I/O card on each PCI-X or PCI Express main board. FEATURES Our boards run on many different operating systems. We support our i One or two 12-bit Analog to Digital Converters: MAX 19693 for board products with a standardized set of drivers, APIs, and VHDL 4.0 GSps, MAX 19692 for 2.3 GSps, or MAX 5859 for 1.5 GSps simulation models. VHDL source is provided for the interfaces to i Five SMA front panel connectors: two single-ended DAC outputs, A/Ds, D/As, DRAM/SRAM, LAD bus, I/O bus, and PPC Flash. CoreFire™ one high-precision trigger input with Fs precision users will have the usual CoreFire Board Support Package. i One universal single- or double-ended 50 ohm clock input i High-precision trigger input manufacturing options – 1.65 V LVPECL,

The combination of our COTS hardware and our CoreFire FPGA 2.5 V LVPECL, 3.3 V LVPECL Application Development tool allows our customers to make mas- i I/O card plugs onto WILDSTAR 4 or 5 VME/VXS/PCI-X/PCI Express/ sive improvements in processing speed, while achieving signiﬁ cant IBM Blade main boards savings in size, weight, power, person-hours, dollars, and calendar i JTAG, ChipScope, and Serial Port access time to deployment. i Full CoreFire Board Support Package for fast, easy application development Annapolis Micro Systems, Inc. is a world leader in high-performance i VHDL model, including source code for board-level interfaces COTS FPGA-based processing for radar, sonar, SIGINT, ELINT, Digital Signal Processing, FFTs, communications, software radio, encryption, i Proactive thermal management system image processing, prototyping, text processing, and other processing i Industrial temperature range intensive applications. i Includes one-year hardware warranty, software updates, and customer support Annapolis is famous for the high quality of our products and for our i Designed and manufactured in the USA unparalleled dedication to ensuring that the customer’s applications succeed. We offer training and exceptional special application development support, as well as more conventional customer support.

For more information, contact: wﬁ [email protected] www.vmecritical.com/p36023

VME and Critical Systems / Resource Guide 2011 79 Surveillance Systems: FPGA/Reconﬁ gurable Annapolis Micro Systems, Inc. "ENJSBM$PDISBOF%SJWF 4VJUFt"OOBQPMJT .% www.annapmicro.com

WILDSTAR 6 – Pluggable Virtex-6 Module for IBM Blade Annapolis Micro Systems is a world leader in high-performance, COTS FPGA-based processing for radar, sonar, SIGINT, ELINT, DSP, FFTs, communications, Software-Deﬁ ned Radio, encryption, image processing, prototyping, text processing, and other processing intensive applications. Our 14th-generation Pluggable Virtex-6 Module for WILDSTAR 5 for IBM BladeCenter uses Xilinx’s newest Virtex-6 FPGAs for state-of-the-art performance. This module plugs into the WILDSTAR 5 for IBM BladeCenter. Other potential modules available today feature Virtex-5 and Tilera. We support our board products with a standardized set of drivers, APIs and VHDL simulation models.

Develop your application very quickly with our CoreFire™ FPGA Application Builder, which transforms the FPGA development process, making it possible for theoreticians to easily build and test their algorithms on the real hardware that will be used in the fi eld. CoreFire, based on datafl ow, automatically generates distributed control fabric between cores. FEATURES Our extensive IP and board support libraries contain more than 1000 i One Virtex-6 FPGA processing element – XC6LX240T, XC6LX365T, cores, including fl oating point and the world’s fastest FFT. CoreFire XC6LX550T, XC6SX315, or XC6SX475 uses a graphical user interface for design entry, supports hard- i Up to 3.5 GB DDR2 DRAM in 7 banks or up to 224 MB DDRII or QDRII SRAM ware-in-the-loop debugging, and provides proven, reusable, high- i Plugs into any of 6 pluggable processing module slots on performance IP modules. Virtex-6 Pluggable Module provides WILDSTAR 5 for IBM BladeCenter extremely high overall throughput and processing performance. The i Up to 16 RocketIO lanes to crossbar combination of our COTS hardware and CoreFire allows our cus- i 4 lanes connect to PCIe switch on WILDSTAR 5 blade board tomers to make massive improvements in processing speed, while i LVDS systolic ring connecting all I/O FPGAs and computing FPGAs achieving signifi cant savings in size, weight, power, person-hours, i RocketIO systolic ring connecting pluggable positions 0 - 2 and 3 - 5 dollars, and calendar time to deployment. i Programmable Flash to store FPGA images on WILDSTAR 5 Blade Board, which acts as host

i Full CoreFire Board Support Package for fast, easy application Annapolis is famous for the high quality of our products and for our development unparalleled dedication to ensuring that the customer’s applica- i VHDL model, including source code for hardware interfaces and tions succeed. We offer training and exceptional special application ChipScope Access development support, as well as more conventional support. i Host software: Windows, Linux, VxWorks, etc. i Available in both commercial and industrial temperature grades i Proactive Thermal Management System – Board Level current measurement and FPGA temperature monitor, accessible through host API i Save time and effort and reduce risk with COTS boards and software; achieve world-class performance – WILD solutions outperform the competition i Includes one-year hardware warranty, software updates, and customer support; training available

For more information, contact: wﬁ [email protected] www.vmecritical.com/p45438

80 VME and Critical Systems / Resource Guide 2011 Test & Instrumentation: Data Acquisition Highland Technology, Inc. 0UJT4USFFUt4BO'SBODJTDP $"64" www.HighlandTechnology.com

V490 16-channel VME multi-range digitizer The V490 includes 16 independent acquisition channels, each with a programmable-gain differential ampliﬁ er, analog anti-aliasing ﬁ lter, 16-bit analog-to-digital converter, and digital post-processing. With a dedicated A/D converter per channel, the V490 provides true simultaneous sampling, which can be extended across multiple V490s or triggered from an external TTL signal.

Both real-time and FIFO-buffered data are simultaneously available, FEATURES with each path having its own programmable digital fi lter. FIFO load i Sixteen channels of independently programmable differential rates are internally programmable to up to 500 Ks/s, or may be exter- analog input acquisition nally triggered. Digital processing allows emulation/replacement i Input ranges from ±10.24 mV to ±40.96 V with 16-bit resolution of a classic Neff-type architecture, namely a preamp and analog i Sample rate up to 500 Ks/s per channel lowpass fi lter feeding a low-aperture-jitter triggerable ADC per i Programmable lowpass fi lter per channel from 1 Hz to 100 KHz channel, while adding the ability to watch the real-time data at any i Simultaneous sampling, extendable across modules i Real-time and FIFO-buffered data simultaneously available time without disturbing the FIFO acquisition. i Common-mode rejection 120 dB typical, ±10 V common-mode range

i Overload protected to ±250 volts on all ranges i In-crate calibration check via dedicated test connector i Optional built-in self-test

For more information, contact: [email protected] www.vmecritical.com/p45266

Test & Instrumentation: I/O Highland Technology, Inc. 0UJT4USFFUt4BO'SBODJTDP $"64" www.HighlandTechnology.com

V220 12-channel VME current loop/process control I/O module The V220 is ideal for driving and sensing transducers in computer or PLC-based control systems. It can also be used to simulate complex industrial processes to control systems under development and certiﬁ cation.

All units are equipped with channel test relays and a front-panel D9 test connector, allowing channel performance and calibration to be veriﬁ ed without disconnecting ﬁ eld wiring. FEATURES i 12 independently isolated, independently programmable channels An economical measurement-only version is also available. i Capable of driving and simulating both controllers and transducers, measuring loop voltages and currents, and simulating faults

i Continuous voltage and current measurement in all modes i Operates up to 18 volts with internal power, 32 volts with external loop power i Protected to ±50 volts in all modes i 0.1% basic accuracy i Separate test connector supports in-crate calibration check i Clearly labeled DIP switches set VME address; no jumpers, headers, or trimpots i Optional built-in self-test (BIST)

For more information, contact: [email protected] www.vmecritical.com/p45915

VME and Critical Systems / Resource Guide 2011 81

GE Intelligent Platforms

More processor. More data. More intelligence.

GE’s rugged computers provide greater data throughput with 2nd Generation Intel Core i7 processors.

GE Intelligent Platforms’ new line of rugged single board computers and DSP products takes advantage of Advanced Vector Extensions to process more data. This new family of processors is raising the bar on floating point processing performance that is so critical to military and aerospace applications. Unmanned aerial vehicles, intelligence surveillance and reconnaissance, signal processing and sonar can now collect data with greater resolution and distance than ever before.

Don’t let your processor be a bottleneck in the mission-critical data stream. Let GE Intelligent Platforms help you build a bigger data stream. defense.ge-ip.com/intel-i7 Scan this QR code with your smart phone to download GE’s white paper on 2nd generation Core i7 processors.

© 2011 GE Intelligent Platforms, Inc. All rights reserved. All other brands or names are property of their respective holders. 5GNHFKUUKRCVKQP/KNKVCT[%JCUUKU(KIWTGU VPX, VME & cPCI True Military ATR Enclosures 6QVCN2QYGTXU$QCTF%CTFTCKN6GORGTCVWTG

16HP - Embedded Heat Pipe transfer system 9 9

9 The perfect Sealed COTS solution

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PSU Models C-475W 20A 22A 16A 8A 700W C-575W 20A 22A 21A 12A 850W †All Inputs except 28VDC : 48VDC / 270VDC / Autorange 90-264VAC @ 47-880Hz / 200VAC-3Phase @ 47-880Hz

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All our chassis products are delivered Tested and Certified yb independent authorized Labs per MIL-STD-461E & MIL-STD-810F for immediate deployment in US Navy and US Air Force military UAVs, Fighters and Helicopters.

Visit www.cmcomputer.com or contact us at [email protected] to request our latest Chassis Catalog.