New Products Introduction

October 2018

TRENCHSTOP™ Feature IGBT - Protected Series for Induction Heating

600 V CoolMOS™ CFD7 - High voltage superjunction MOSFET – portfolio extension

CIPOS™ Maxi

Infineon® Eco Block – Solder Bond Technology

Infineon® Prime Block – Solder Bond Technology

LITIX™ Power - TLD5190QU - synchronous MOSFET H-Bridge DC/DC controller with built in protection features

LITIX™ Power Flex - TLD5541-1QU - Synchronous H-bridge DC-DC controller with SPI interface

XENSIV™ - TLE5501 E0002 magnetic angle sensor

AUIR3242S – High side gate driver for 12V power distribution applications

Lite System Basis Chips (SBC) Family

TLE9104SH - Smart 4-channels Low-Side Switch in Smart Power Technology

BGS16MA12, BGS18MA12 and BGS18MA14 - SP6T & SP8T RF Switches with MIPI 2.0

SPOC™+2 family - SPI Multi-channel-Highside-driver with diagnosis and embedded protection

TRENCHSTOP™ Feature IGBT - Protected Series for Induction Heating IEWS20R5135IPBXKLA1

The Protected IGBT is the first device in the new family of TRENCHSTOP™ feature IGBTs, which add new functionality to standard discrete IGBTs.

The innovative TRENCHSTOP™ Feature IGBT Protected Series combines a 20 A 1350 V IGBT in RC-H5 technology with a unique protecting gate driver IC together in a TO-247 6-pin package. The Protected IGBT features not only the industry’s best IGBT performance considering blocking voltage, static losses and conduction losses in soft switching application but also integrated protection functions.

Features Benefits  Reverse conducting IGBT with  Increased overall system reliability du to integrated protection  monolithic body diode designed for soft commutation functions  Reduced board level complexity with fewer component  Integrated driver with  Extended life time of passive components  Overvoltage and overcurrent protection  Reduced costs from replacement or rework  Active clamp control circuit  Overall simplified MCU design  Programmable overvoltage threshold  Higher output power levels  Programmable cycle-by-cycle overcurrent threshold  TO247 6-pin with the same package width and single screw hole as  Integrated gate drive with 2 level turn-on current standard To 247 3 & 4 pin packages for easier handling during  Temperature warning manufacturing  Over-temperature protection

 VCC UVLO  Integrated ESD protection and latch immunity on all pins Target applications Soft switching applications  TO-247 6-pin package Application examples:

Competitive advantage  Induction heating  Rice cooker  By using the P-IGBT a reduction of 30% in components count can  Microwave be achieved by keeping the same features and even improving  Induction cooking the reliability  Water heating  A PCB area reduction of 25% can also be achieved  Coffee machine

Competing products (application example induction cooking) System requirements:  Highly efficient power management (AC-DC Integrated Power Stage - CoolSET™ / DC-DC-Converter / Linear Voltage Regulator)  Good EMI performance  Low standby power  Accurate and robust sensing (Magnetic Current Sensor)  Innovative and secure communication / IoT (OPTIGA™ )

Block diagram

Product collaterals / Online support  Product page  Product brief  Induction cooking - application page

Product overview incl. data sheet link

OPN SP Number Package

IEWS20R5135IPBXKLA1 SP001778868 PG-TO-247-6

600 V CoolMOS™ CFD7 - High voltage superjunction MOSFET – portfolio extension IPL60R060CFD7AUMA1, IPL60R095CFD7AUMA1, IPL60R140CFD7AUMA1, IPW60R018CFD7XKSA1, IPW60R105CFD7XKSA1, IPW60R145CFD7XKSA1, IPL60R060CFD7AUMA1

Infineon’s answer for resonant high power topologies. The 600 V CoolMOS™ CFD7 is Infineon’s latest high voltage superjunction MOSFET technology with integrated fast body diode and completes the CoolMOS™ 7 series. It is the ideal choice for resonant topologies in high power SMPS applications such as server, telecom and EV charging stations.

Features Benefits  Ultra-fast body diode  Best-in-class hard commutation ruggedness

 Best-in-class reverse recovery charge (Qrr)  Highest reliability for resonant topologies  Improved reverse diode dv/dt and diF/dt ruggedness  Highest efficiency and improved thermal behavior  Lowest FOM RDS(on)*Qg and Eoss  Enabling increased power density solutions  Best-in-class RDS(on)/package combinations

Competitive advantage Target applications  Integrated fast body diode enables a combination of all the  Server advantages of a fast switching technology together with best-in-  Telecom class commutation ruggedness  EV charging  Up to 69 percent lower reverse recovery charge (Qrr) compared to  SMPS competition, makes CFD7 the most robust high voltage  PC power superjunction MOSFET on the market  CoolMOS™ CFD7 positions with up to 1.45 percent increased Completing products efficiency over main competition without sacrificing easy  2EDN EiceDRIVER™ implementation in the design-in process, and attractive cost

position on market price level

Block diagram Evaluation board

 EVAL_1K4W_ZVS_FB_CFD7  EVAL_2KW_ZVS_FB_CFD7  EVAL_800W_ZVS_FB_CFD7  EVAL_3kW_2LLC_CFD7

Products collaterals / Online support

 Product family page  CoolMOS product brief  600 V CoolMOS™ CFD7 SJ MOSFET video  Mosfet CoolMOS™ selection guide  Power and Sensing selection guide

Application notes / Design support  MOSFET CoolMOS™ CFD7 600V (CN)  Evaluation board EVAL_1K4W_ZVS_FB_CFD7  Evaluation Board EVAL_3kW_2LLC_CFD7  Evaluation board EVAL_600W_12V_LLC_CFD7 with 600V CoolMOS™ CFD7 SJ MOSFET  Evaluation board EVAL_800W_ZVS_CFD7  Mosfet CoolMOS™ CFD7 600V PSpiceEN simulation model

Product overview incl. data sheet link

OPN SP Number Package

IPL60R060CFD7AUMA1 SP001715620 PG-VSON-4

IPL60R095CFD7AUMA1 SP001715622 PG-VSON-4

IPL60R140CFD7AUMA1 SP001715636 PG-VSON-4

IPW60R018CFD7XKSA1 SP001715618 PG-TO247-3

IPW60R105CFD7XKSA1 SP001715628 PG-TO247-3

IPW60R145CFD7XKSA1 SP001715654 PG-TO247-3 CIPOS™ Maxi IM818SCCXKMA1, IM818MCCXKMA1

The high performance CIPOS™ Maxi Intelligent Power Modules (IPMs) integrate various power and control components to increase reliability, optimize PCB size and system costs. It is designed to control three-phase AC motors and permanent magnet motors in variable speed drives applications. The existing portfolio offers 5 A and 10 A in 1200 V class up to 1.8 kW power rating. The smallest package in 1200 V IPM class offers highest power density and best performance in its class.

IM818 is the first 1200 V IPM that integrated an optimized 6-channel SOI gate driver to provide built-in deadtime that prevents damage from transients. The product concept is especially adapted to power applications, which require excellent thermal performance and electrical isolation as well as meeting EMI requirements and overload protection.

Features Benefits  Optimized thermal design  Increased power density  Industrial standard package  Predictably high performance and lifetime due to 100% x-ray  Electrically insulated base plate monitoring  Solid base plate for fast and easy mounting  Optimized for less performant heat sinks Value proposition  Reduced system costs – compact and smallest package Target applications  Fast time to market – fast design in based on higher integration level to use/layout easily  Commercial air conditioners, Active filter (Active power factor  Product performance – high system efficiency, high power correction) for HVAC density  Low power motor drives  Flexibility – various selectivity for switching speed and topologies  Pumps  Fans

 Blowers

Block diagram

Products collaterals / Online support  IM818-MCC product page  IM818-SCC product page  Product brief  CIPOS™ selection guide  Application note  Motor Drive Simulation Tool for Intelligent Power Modules (a three- phase motor drive inverter system is implemented to simulate the power loss and junction temperature of each device inside IPM at the given static load conditions)

Product overview incl. data sheet link

OPN SP Number Package

IM818SCCXKMA1 SP001648550 PG-MDIP-24

IM818MCCXKMA1 SP001648554 PG-MDIP-24

Infineon® Eco Block – Solder Bond Technology TT240N16SOFHPSA1, TD240N16SOFHPSA1, TT240N18SOFHPSA1, TD240N18SOFHPSA1, DD220N16SHPSA1

Infineon Technologies Bipolar extends its product portfolio of thyristor / diode modules in solder bond technology with higher current ratings. The 34 mm Eco Block modules cover now current ratings from 140 A to 240 A. Solder bond modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must.

Features Benefits  Optimized thermal design  Increased power density  Industrial standard package  Predictably high performance and lifetime due to 100% x-ray  Electrically insulated base plate monitoring  Solid base plate for fast and easy mounting  Optimized for less performant heat sinks Technology comparison Target applications  Drives  Welding  UPS

Products collaterals / Online support  Product family page  Selection guide  Simulation tool (Simulate IGBT modules for your inverter/DC converter applications; calculate switching and conduction losses for all components, counting in conduction/switching losses and thermal ratings; results are shown in tabular and graphic presentation and can be saved for later revision or printed as .pdf file) Competitive advantage  Robust mechanical design  Highest power density in the market

Block diagrams Input rectifier for Drives Input rectifier and bypass for UPS

Low and medium voltage Soft Starter Static switch

Product overview incl. data sheet link

OPN SP Number Package

TT240N16SOFHPSA1 SP002256798 BG-PB34SB-1

TD240N16SOFHPSA1 SP002256810 BG-PB34SB-1

TT240N18SOFHPSA1 SP002256804 BG-PB34SB-1

TD240N18SOFHPSA1 SP002256816 BG-PB34SB-1

DD220N16SHPSA1 SP002256822 BG-PB34SB-1

DD220N22SHPSA1 SP002256828 BG-PB34SB-1

Infineon® Prime Block – Solder Bond Technology TT390N16SOFHPSA1, TD390N16SOFHPSA1, TT390N18SOFHPSA1, TD390N18SOFHPSA1, DD390N16SHPSA1, DD390N22SHPSA1

Infineon Technologies Bipolar extends its product portfolio of thyristor /diode modules in solder bond technology with higher current ratings. The 50 mm Prime Block modules cover now current ratings of 390 A and become best in class. Solder bond modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must.

Features Benefits  Optimized thermal design  Increased power density  Best in class current rating in 50 mm foot print  Predictably high performance and lifetime due to 100% x-ray  50 mm foot print available with TIM monitoring  Solid base plate for fast and easy mounting  Optimized for less performant heat sinks Technology comparison Competitive advantage  Robust mechanical design  Highest power density in the market

Target applications  Drives  Welding  UPS

Products collaterals / Online support  Product family page  Selection guide  Simulation tool (Simulate IGBT modules for your inverter/DC converter applications; calculate switching and conduction losses for Completing products all components, counting in conduction/switching losses and thermal ratings; results 62 mm IGBT Modules are shown in tabular and graphic presentation and can be saved for later revision or printed as .pdf file)

Block diagrams Input rectifier for Drives Input rectifier and bypass for UPS

Low and medium voltage Soft Starter Static switch

Product overview incl. data sheet link

OPN SP Number Package

TT390N16SOFHPSA1 SP002256840 BG-PB50SB-1

TD390N16SOFHPSA1 SP002256854 BG-PB50SB-1

TT390N18SOFHPSA1 SP002256848 BG-PB50SB-1

TD390N18SOFHPSA1 SP002256860 BG-PB50SB-1

DD390N16SHPSA1 SP002256866 BG-PB50SB-1

DD390N22SHPSA1 SP002256872 BG-PB50SB-1

LITIX™ Power - TLD5190QU - synchronous MOSFET H-Bridge DC/DC controller with built in protection features TLD5190QUXUMA1

The TLD5190QU is a synchronous MOSFET H-Bridge DC/DC controller with built in protection features. This concept of a synchronous and seamless buck-boost regulation provides a very efficient solution for circuits where the output (load) voltage is on the same level as the input voltage, e.g. in short chains with 2 to 3 high power LEDs or laser diodes connected to a 12 V electrical system.

Thanks to the flexibility to be used in current and in voltage mode it is also a perfect device for powering non LED applications like USB and mobile wireless charger or as multipurpose pre-regulation like for infotainment. As it comes without SPI it is also ideal for all application where a basic feature set is sufficient or where a Microcontroller is not used.

Features Benefits  MOSFET H-Bridge with Single Inductor DC/DC Controller for high  1ch DC/DC for seamless Buck-Boost & High power applications power BUCK-BOOST LED control  Good EMC performance  Constant Current and Constant Voltage Regulation  Built in monitoring and protection functions  Wide VIN Range (IC 4.5 V to 40 V, Power 4.5 V to 55 V)  Constant Current and Constant Voltage Regulation  Wide LED forward voltage Range (2V up to 55V)  PWM and Analog dimming  Switching Frequency Range from 200 kHz to 700 kHz  LED current accuracy +/- 3% at TJ = 25°C and 4% over the whole automotive temperature range Qualification  16-bit SPI for diagnostics and control, providing daisy chain Automotive AEC qualified capability  Maximum Efficiency in every condition (up to 96%)  Drives multiple loads with a single IC thanks to the Fast Output Discharge operation Target applications  Limp Home Function (Fail Safe Mode)  Especially designed for driving high power LEDs in automotive  EMC optimized device: Auto and programmable Spread Spectrum applications  LED and Input current sense with dedicated monitor Outputs  Ideal for driving (LED) loads on supply/battery voltage level  Adjustable soft start feature to limit the current peak and the voltage overshoot at start-up Application examples:  Smart power protection features for device and load (open load,  Automotive Exterior Lighting, where high efficiency is required or short of Load, Overtemperature) where board space is limited, like high current Low Beam, High  Enhanced Dimming features: Analog and PWM dimming Beam or combined Low- and High beams  Available in a small thermally enhanced PG-TQFP-48-9 package  Non LED applications like USB, mobile wireless charger and multipurpose pre-regulation like for infotainment Competitive Advantage  High Power DC/DC H-Bridge controller with SPI and full adjustability, built in monitoring and protection features, suitable Boards for loads operated on input voltage level and for currents >3A or  TLD5190 VOLT DEMO: H-Bridge mini where >90% efficiency is required. With Auto Spread Spectrum voltage regulator demoboard (w/o SPI) and SPI communication.

Block diagram  TLD5190QV DEMO V1: H-Bridge Demoboard (w/o SPI)

Products collaterals / Online support  Product page

Product overview incl. data sheet link

OPN SP Number Package

TLD5190QUXUMA1 SP001650664 PG-TQFP-48

TLD5190VOLTDEMOTOBO1 SP001697764 N/A

TLD5190QVDEMO1TOBO1 SP001628006 N/A

LITIX™ Power Flex - TLD5541-1QU - Synchronous H-bridge DC-DC controller with SPI interface TLD55411QUXUMA1

The TLD5541-1QU is a synchronous MOSFET H-bridge DC-DC controller with built in protection features and SPI interface. This concept is beneficial for driving high power LEDs with maximum system efficiency (well above 90%) and minimum number of external components. Furthermore, reduced EMC emissions are achieved thanks to the optimized spread spectrum switching frequency.

With its seamless buck-boost regulation and fast dynamic load jump behavior, it is also an innovative solution for realizing cost- optimized LED headlamps with complete protection and diagnosis features – e.g. by driving two, three or more separately switched LED loads in one string, with up-to 55 V string voltage, with just one TLD5541-1QU.

Features Benefits  16-bit SPI for diagnostics and control  Configuration and maximum features flexibility  Fast dynamic behavior(load jump behavior)  Increased LED Current Accuracy & Efficiency (>90%)  Programmable auto spread spectrum  Innovative feature set as solution for cost-optimized full LED  Switching frequency 200 to 700 kHz headlamps  LED current accuracy ±3%  Safety First with complete system monitoring and communication  Adjustable soft start interface  Limp home function  Small BOM (1 coil H-Bridge)  Current and voltage mode  Very good EMC performance

Competitive Advantage  The only full synchronous H-Bridge with SPI and Fast Dynamic Load Jump behavior to realize full LED headlamps with just one Qualification DC/DC Automotive AEC qualified  In general there are only very few synchronous automotive LED Driver DC/DC available  important to drive new 3 A and 6 A LEDs Target applications Topology Flexibility Especially designed for automotive exterior LED applications  High-power and high-current applications likeHigh-power (e.g. 3 A or 6 A) LED based front lighting  Laser headlamps  LED or laser based matrix and pixel headlamps  Cost optimized Full LED headlamps  High-efficient voltage supply for LED applications working on battery voltage level

Products collaterals / Online support  Product page  Product family page  PSPICE simulation model

Product overview incl. data sheet link

OPN SP Number Package

TLD55411QUXUMA1 SP001650654 PG-TQFP-48

XENSIV™ - TLE5501 E0002 magnetic angle sensor TLE5501E0002XUMA1

With the new XENSIV™ TLE5501 E0002 angle sensor, a new Functional Safety benchmark is launched to the sensor market: Infineon is the first supplier in the market to achieve the highest automotive functional safety grade for angle sensors with only one single sensor chip.

The new TLE5501 E0002 offers ISO26262-compliant development, achieving ASIL D level. It incorporates decoupled bridges for redundant external angle calculation and offers highest diagnostic coverage as demanded by functional safety regulations. The full Functional Safety Documentation is available for customers on request.

Infineon’s new TLE5501 products are fast analog 360° TMR-based angle sensors that detect the orientation of a magnetic field. This is achieved by measuring sine and cosine angle components with Tunneling Magneto Resistance (TMR) elements. These raw signals (sine and cosine) are provided as a differential output signal and can directly be further processed within a micro controller. The large output voltage of the bridge renders any further signal amplification unnecessary.

Their application fields range from steering angle applications with the highest functional safety requirements to motors for wipers, pumps and actuators and electric motors in general. TLE5501 is dedicated to any automotive but also industrial and consumer applications like robotics or gimbal..

Features Benefits  World record: reaching ASIL D with just one single sensor chip  ASIL D with one chip only: reducing component count, system  ISO26262-compliant development ASIL D complexity and thus system costs  Large output signals of up to 0.37 V/V for direct micro controller  Functional Safety Documentation acc. ISO26262 available connection  Cost benefit as no internal amplifier needed due to the TMR  Discrete bridge with differential sine and cosine output technology’s high sensing sensitivity  Very low supply current: ~2 mA  Cost benefit due to TMR technology’s very low temperature drift  Magnetic field range (20 mT to 100 mT) reducing external calibration and compensation efforts  Typ. angle error ~ 1.0 ° (over temperature and lifetime)  Very low current consumption, which is as low as 2 mA for TLE5501  DSO-8 package

Competitive advantage Target applications  TLE5501 E0002 is the only magnetic angle sensor in the market  Steering Angle Sensor (SAS) offering full ISO26262 compliance at ASIL D level with just one  Top column module & gear selector single sensor chip  BLDC motor commutation (e.g. wipers, pumps and actuators)  ISO26262-compliant development ASIL D including full  Angular Position Sensing documentation  Electric Motors  Realizing the highest Functional Safety Level ASIL D at  Industrial Applications like Automation, Robotics or Gimbal o lowest system complexity o lowest component count Application examples: o lower system cost  Actuators applications  Minimizing Customer Safety Documentation Efforts due to full  Wipers product safety documentation available  Top column module  Realizing cost-efficient solutions : o very low temperature drift reducing external calibration  gear selector and compensation  EPS Motor o large output signals of up to 0.37 V/V  direct  Brake booster connection to the microcontroller w/o further  Pumps amplification  Precise rotation sensing: typ. angle error ~ 1.0 ° (over Qualification Temperature & lifetime)  Automotive qualified Q100, Grade 0: TA = -40°C to 150°C ambient  Very low current consumption: supply current ~2mA temperature  Wide Magnetic field range (20mT to 100mT)  ISO26262-compliant development ASIL D  DSO8 package for the single sensor  Grade 0

Block diagram Products collaterals / Online support

 Product page  Product brief  PG-SSO assembly application note  TLE5501 calibration 360° application note  Sensor+Test 2018 video  Market news  XENSIV™ selection guide  XENSIV™ pocket guide

Product overview incl. data sheet link

OPN SP Number Package

TLE5501E0002XUMA1 SP001621828 PG-DSO-8

AUIR3242S – High side gate driver for 12V power distribution applications AUIR3242SXUMA1

AUIR3242S is perfect for applications that require very low on state operation current to support key-off loads. This feature is called idle mode. Idle mode results in gate driver operation current that is as less than 50 μA. Idle mode is unique on the market for gate drivers in this power class and plays a big role in increasing efficiency in hybrid electric vehicles. AUIR3242S has a high level active input which supports direct drive from battery.

Features Benefits  Idle mode (50µA quiescent current)  Small footprint (8-pin package)  Boost converter with integrated diode  Super low consumption during idle mode  Support of back to back architectures  Low leakage current  Wide operating voltage 3-36V  Fast design in with demo boards available  Ground loss protection  Gate current monitoring via frequency  Undervoltage lockout with diagnostics

Block diagram Target applications  Q-diode  back to back battery switch  safety switch  relay replacement  start stop applications  DC/DC safety switch  board net stabilization

Qualification  Automotive AEC qualified

Products collaterals / Online support  Product page  Product brief

Product overview incl. data sheet link

OPN SP Number Package

AUIR3242SXUMA1 SP001783486 PG-DSO-8

Lite System Basis Chips (SBC) Family TLE94613ESXUMA1, TLE94613ESV33XUMA1, TLE9461ESXUMA1, TLE9461ESV33XUMA1, TLE94713ESXUMA1, TLE94713ESV33XUMA1, TLE9471ESXUMA1, TLE9471ESV33XUMA1

Infineon’s Lite System Basis Chip (SBC) family offers high integration and high performance with optimized system cost for various automotive applications. The Lite SBCs family offers two variants: Lite LDO SBC with a low-dropout voltage regulator of 150mA and the Lite DCDC SBC with a DCDC buck converter up to 500mA. Both variants are available as 5V or 3.3V output voltage option for microcontrollers, network transceivers, sensors and other peripherals’ power supply.

The entire Lite SBC family is hardware compatible, and is also software compatible with the Mid-Range+, DCDC and Multi-CAN Power SBC families (TLE926x & TLE927x).

Features Benefits LDO Variant (TLE9461): 5V/3.3V Linear Voltage Regulator up to 150mA  Reduced system cost through low component count and small PCB footprint DCDC Variant (TLE9471): 5V/3.3V Buck converter up to 500mA  Effective external load switch control through its integrated charge  5V Linear Voltage Regulator up to 100mA (Vcc2) pump that can drive an external N-FET  CAN FD up to 5Mbps (acc. to ISO 11898-2:2016), CAN PN and  Extends battery life with very low quiescent current modes FD Tolerant (“-3” variants)  Enables design flexibility and reduces software design effort by  1x HV Wake input, Watchdog, Reset, Interrupt, Fail Output shared state machine and SPI access within the entire Lite SBC  Charge Pump Output for Load Switch / Reverse Current family Protection  Meets major car OEM requirements with excellent EMC and ESD  Alternative Functions for Fail Output: Wake, Low-Side or High- performance Side Switch (up to 45mA)  Safely supply off-board loads (e.g., sensors) with short circuit  Low-Power Modes with full wake capability protected low-drop voltage regulators

Value proposition Target applications Space saving:  In-Cabin Wireless Charger  Auto Transmission  Power, communication, safety and support features are integrated  Transfer Case into a System-on-Chip solution  Exhaust module and NOx sensor  PCB space saving enabled by a leadless TSDSO package with  Steering column and steering lock 8.65mm x 6mm footprint  Seat control module  Reduces electronic control unit (ECU) PCB size and weight  Seat belt pretension Energy saving:  Closure (power lift gate, sliding door, etc.)  Heating, ventilation and air conditioning (HVAC)  Offers intelligent power saving modes including stop and sleep  Gear shifter and selectors mode, and supports energy management  Light Control Unit (LCU) for front, and rear  Very low quiescent current mode  Smart Power Distribution modules High system reliability:  Fuel and water pump  Extensive diagnostics and protections are embedded within the System-on-Chip Boards  Integrated fail-safe functions: fail-safe output, watchdog, fail-safe All demo boards enables device evaluation of the Lite SBC product family and operating mode accelerates the design-in phase. The evaluation boards can be connected to  Voltage, current and temperature protection and monitoring the “UIO STICK” (Power Easy Kit Lite) and controlled via USB using a Reduced cost: Graphical User Interface (GUI) installed on your computer.  Minimum number of external components reduce TLE9471-3ES: LITE DCDC SBC BOARD o BOM cost TLE9471-3ES V33: LITE DCDC SBC V33 BOARD o Part placing and development o Purchasing TLE9461-3ES: LITE LDO SBC BOARD o Handling o PCB sizing TLE9461-3ES V33: LITE LDO SBC V33 BOARD  Compatible software reduces design costs

Multiple and flexible designs: XMC4200 - Interface device between PC and Infineon  The entire family is pin-to–pin and software compatible, also to boards/ kits: UIO STICK other Infineon SBC families  Due to platform approach reduced development time  Simplifies EMC design and improves the EMC performance with slope control

Qualification Products collaterals / Online support

Automotive AEC-Q100  Product family page  TLE9461 product brief  TLE9471 product brief Competitive advantage  Lite SBC FAQ Lite SBC fighting guide  TLE9461 PCB design data  TLE9471 PCB design data  Power dissipation tool  SBC CAN PN configurator

Block diagram

Product overview incl. data sheet link

OPN SP Number Package

TLE9461ESXUMA1 SP001480534 PG-TSDSO-24

TLE94613ESXUMA1 SP001480524 PG-TSDSO-24

TLE9461ESV33XUMA1 SP001480528 PG-TSDSO-24

TLE94613ESV33XUMA1 SP001480520 PG-TSDSO-24

TLE9471ESXUMA1 SP001480552 PG-TSDSO-24

TLE94713ESXUMA1 SP001480544 PG-TSDSO-24

TLE9471ESV33XUMA1 SP001480548 PG-TSDSO-24

TLE94713ESV33XUMA1 SP001480540 PG-TSDSO-24

LITEDCDCSBCBOARDTOBO1 SP001628344 N/A

LITEDCDCSBCV33BOARDTOBO1 SP001628350 N/A

LITELDOSBCBOARDTOBO1 SP001628336 N/A

LITELDOSBCV33BOARDTOBO1 SP001628340 N/A

UIOSTICKTOBO1 SP001215532 N/A

TLE9104SH - Smart 4-channels Low-Side Switch in Smart Power Technology TLE9104SHXUMA1

The TLE9104SH is designed for Automotive Powertrain applications and it's equipped with a 16-bit Serial Peripheral Interface (SPI) for control and diagnosis. All channels are protected against over-current/temperature and enhanced with an active clamping circuitry for driving inductive loads. Load status detection is possible over the SPI for: Short to ground (SCG), Open Load (OL), and Short to Battery (SCB). 4 input pins are available for direct control of the switches. The TLE9104SH comes along with important safety features which makes it a good fit to safety critical Automotive and Industrial applications. The TLE9104SH is particularly suitable for Engine Management, Transmission Control and Battery Management Systems where high-current/high-energy actuators have to be controlled.

Features Benefits  16-bit SPI at 8MHz  High current/Energy capability  4x Direct Input Pins  Flexible due to configurable features  VDS(CL): 50…60 V (Internal Clamping)  Inductive Load Clamping at VDS(CL) = 50 … 60 V  RDSON: 300 mΩ (@ 150˚C)  Cost and Size Optimized Package  3 A Nominal Load Current  Protection and Diagnosis functions (SCB, OT, OC, OL, SCG)  5 A peak current  Safety features (EN pin, communicating watchdog, output stage  VIO pin for 3.3V and 5.5V SPI compatibility status, …)  Independent on-state and off-state diagnostic functions  SPI communication  Configurable Overcurrent protection  Electrostatic Discharge (ESD) protection Qualification  Extra output EN pin for safety critical applications  SPI communication watchdog for safety critical applications  AEC Q100/101 and Q006 Qualified  Output stage status available via SPI for safety critical applications

Value proposition Target applications Highly configurable and flexible 4-channel High Current / Energy LowSide  Automotive Powertrain, Body and Safety Applications Switch for powertrain applications in smallest available package on the  Engine Management, Transmission Control and Battery market. Management  Driving Resistive/Inductive Loads (Solenoids, Injectors, Valves,

Relays) Competitive advantage  Industrial Applications  Small package saves board space Application examples:  high inductive load clamping performance MPI Injectors, High Current/Energy Relays, Starter Relays, Fuel Pump,  direct input pins for all switches with flexible use Valves, Lambda Heaters, Solenoid Switches  highest degree of configuration to fit for different application requirements  enhanced diagnostics Boards

Multichannel Connection PCB for connection of Infineon Completing products Multichannel IC shields with AURIX™ TC277 Evaluation  OPTIREG™ TLF35584 Board  AURIX™ TLE9104SH_DEV_BOARD shield in the Arduino™ form factor is an universal development/evaluation kit that is designed, but not limited to, Engine Management Block diagram Systems and other Powertrain Applications. The TLE9104SH shield can be easily used either in

combination with the XMC1100 Boot Kit or in combination with the AURIX™ TC277 Evaluation Board (TriBoard) with the help of an additional Multichannel Connection PCB Products collaterals / Online support  Product page  Product brief  Application note  Automotive Power selection guide

Product overview incl. data sheet link

OPN SP Number Package

TLE9104SHXUMA1 SP001661358 PG-DSO-20

MULTICHCONNECTPCBTOBO1 SP002428792 N/A

TLE9104SHDEVBOARDTOBO1 SP002428784 N/A

BGS16MA12, BGS18MA12 and BGS18MA14 - SP6T & SP8T RF Switches with MIPI 2.0 BGS16MA12E6327XTSA1, BGS18MA12E6327XTSA1, BGS18MA14E6327XTSA1

MIPI 2.0 SP6T/SP8T are band-selection switches for LTE applications. With LTE Tx power-handling capability it is suitable for both LTE diversity path and LTE uplink Tx applications.

Features Benefits  0.1 to 6 GHz coverage (BGS18MA14: up to 3.8 GHz)  High system sensitivity due to low insertion loss  LTE TX power handling capabilities  BGS16/18MA12 optimized for high-frequency applications  Very low insertion loss  Small footprint, easy for integrations  BGS16MA12: 0.65 dB at Band 42  PCB and cost savings  BGS18MA12: 0.78 dB at Band 42  BGS18MA14: Pin compatible to standard reference design  BGS18MA14: 0.5 dB for Band 41 and 0.7 dB for Band 43

 Small form factor 1.1mm x 1.9mm (BGS18MA14: 2.0mm x Target applications 2.0mm) Mobile devices  Fully compatible with MIPI 2.0 RFFE standard  No decoupling capacitors required if no DC applied on RF lines  Low harmonic generation  High port-to-port isolation Competitive advantage  On-chip control logic including ESD protection Compact size and ultra-low insertion loss  No power supply blocking required  High EMI robustness  RoHS and WEEE compliant package

Block diagram Completing products

Products collaterals / Online support  Product presentation  BGS16MA12E6327XTSA1 product page  BGS18MA12E6327XTSA1 product page  BGS18MA14E6327XTSA1 product page

Product overview incl. data sheet link

OPN SP Number Package

BGS16MA12E6327XTSA1 SP001646658 PG-ATSLP-12

BGS18MA12E6327XTSA1 SP001646662 PG-ATSLP-12

BGS18MA14E6327XTSA1 SP001641674 PG-ATSLP-14

SPOC™+2 family - SPI Multi-channel-Highside-driver with diagnosis and embedded protection BTS712204ESAXUMA1, BTS712204ESEXUMA1, BTS722204ESAXUMA1, BTS722204ESEXUMA1

The smallest & most flexible protected switch with multiple channels on the market! The SPOC™+2 is the optimized cost-feature-ratio for multi-channelhigh-side switches. It offers diagnosis and embedded protection function for Automotive applications suitable for resistive, inductive and capacitive loads to replace electromechanical relays, fuses and discrete circuits. Capable to drive high inrush current loads such as lamps, HIDs or LED modules. The product has up to 6-high-side channels in the smallest package solution from 1.5A-14A. The product family supports functional safety applications.

Features Benefits Protection features:  Less µC I/Os due to PWMoverSPI  Less routing efforts  Absolute & dynamic temperature limitation, over-current  Switching of high current loads on small PCB area protection, under-voltage shutdown, over-voltage protection  Pin and function compatibility over the whole family Diagnosis features:  All types using a common software concept  Adjustable protection behavior  Proport. Load current sense, open-load in ON and OFF state,  Channel parallelization short circuit to ground & battery, diagnosis feedback  Supports functional safety Functional Safety features:  Limp Home mode, monitoring input status, checksum verification, current sense verification mode

Value proposition  High design flexibility for cost optimized system  Highest efficiency and power density  Very compact and cost optimized system design  Reduced module and housing costs  Low power dissipation Qualification Automotive AEC Q100 grade 1

Competitive advantage Completing products  Scalability: High modularity due to pin, function and software Application Diagram for SPOC™+2 with BTS72220-4ESE compatibility for all 7 members of the SPOCTM+2 family ›

 PCB Area: SPOCTM+2 has the smallest package with excellent skills & thermal performance  Flexibility: SPOCTM+2 shows the highest flexibility due to chl. parallelization and configuration of the entire features-set  Feature to Cost: SPOCTM +2 shows optimized feature set to match market pressure on prices  Power Dissipation: lowest power dissipation on the market: 50% under operation condition and 10-times better in battery reverse condition Boards The following Daughterboards are a small PCB with soldered SPOC+2 device on it. They have to be used in combination with the SPOC+2 motherboard.

SPOC-2 DB BTS71040-4ESA SPOC-2 DB BTS71040-4ESE

SPOC-2 DB BTS71220-4ESA SPOC-2 DB BTS71220-4ESE BCM Power Switches SPOC-2 DB BTS72220-4ESA  Multi-Chl-High-SideSwitch: SPOC™+2 e.g. BTS72220-4ESx  High-Side-Switch: PROFET™+2 e.g. BTS7040-1EPA Bock diagram BCM Communication, Control & Security  Microcontroller: AURIX™ XC2267

Products collaterals / Online support  Product family page

Product overview incl. data sheet link

OPN SP Number Package

BTS712204ESAXUMA1 SP001225108 PG-TSDSO-24

BTS712204ESEXUMA1 SP001471298 PG-TSDSO-24

BTS722204ESAXUMA1 SP001225106 PG-TSDSO-24

BTS722204ESEXUMA1 SP001471316 PG-TSDSO-24

SPOC2MOTHERBOARDTOBO1 SP001833488 N/A

SPOC2DBBTS710404ESATOBO1 SP001833468 N/A

SP001833464 N/A SPOC2DBBTS710404ESETOBO1 SPOC2DBBTS712204ESATOBO1 SP001833476 N/A

SPOC2DBBTS712204ESETOBO1 SP001833472 N/A

SPOC2DBBTS722204ESATOBO1 SP001833484 N/A