2009 Computer-On-Modules

Computer-On-Modules 2009 © 2009 congatec AG. All rights reserved. conga, congatec and XTX™ are registered trademarks of congatec AG. Intel, Pentium and Intel Atom are trademarks of Intel Corporation in the U.S. and other countries. COM Express is a registered trademark of PICMG. Express Card is a registered trademark of the Personnel Computer Memory Card international Association (PCMCIA). PCI express is a registered trademark of the Peripheral Component Interconnect Special Interest Group (PCISIG). CompactFlash is a registered trademark of the Compact Flash Association. Winbond is a registered trademark of the Winbond Electronics corps. AVR is a registered trademark of the Atmel corporation. ETX is a registered trademark of Kontron Embedded Modules GmbH. AMICORE8 is a registered trademark of American Megatrends inc. Microsoft®, Windows®, Windows NT®, Windows CE and Windows XP® are registered trademarks of Microsoft corporation. VxWorks is a registered trademark of WindRiver. All product names and logos are property of the respective manufacturers.

All data is for information purposes only. Although all the information contained within this document is carefully checked no guarantee of correctness is implied or expressed.

2 congatec

4 congatec AG 15 COM Express™

4 About congatec 15 Concept 5 congatec International 16 Product Overview 18 conga-BM45 19 conga-B945 20 conga-BA945 6 Technology Technology 21 conga-CA945 6 Computer-On-Modules 22 conga-B915 7 ACPI Battery Management 23 conga-CA 8 Embedded BIOS 24 conga-CAx 9 Embedded Panel Interface - EPI 25 conga-CLX 10 Cooling Solutions 26 Engineering Tools

11 Qseven™ 30 XTX™

11 Concept 30 Concept Qseven 12 conga-QA 31 Product Overview 13 Engineering Tools 32 conga-X965 33 conga-X945 34 conga-XA945 35 conga-X915 36 conga-X855 37 conga-XLX 38 Engineering Tools

42 ETX®

42 Concept COM Express 43 Product Overview 44 conga-E855 45 conga-ELX 46 conga-ELXeco 47 Engineering Tools XTX / ETX

3 www.congatec.com About congatec

About congatec AG Module Know How Design-In Support congatec AG is an experienced company The congatec engineering team is committed congatec realizes how important it is in an serving the quickly growing embedded com- to the embedded module technology from the embedded module system that both the cus- puter technology market. Our product portfolio very beginning of this industry. This vast amount tomer’s carrier board and the embedded PC is comprised of embedded computer boards of knowledge and experience translates directly work together perfectly. The congatec team is & modules with BIOS features for industrial use, into superior hardware, software and support for committed to giving the best design-in support professional board support packages and exten- our customers. to our customers. sive design-in support. Embedded computers are our passion. It’s our goal to establish long-term Software and Driver Support System Integration partnerships with our customers so that we can congatec offers advanced Board-Support- When designing a system special attention must meet your ever-demanding needs. Packages, which include both the latest tested be paid to issues such as heat dissipation and drivers from silicon vendors and the congatec electrostatic/electromagnetic compatibility. By Economical Principal specific drivers for accessing all of our additional using our products you gain access to congatec Our products and technologies offer innovative embedded module features. experience, which will help you deal with these solutions for industrial uses of embedded com- issues. puter technology. We strive to make high-tech Display Technology world standards economically viable. Although Due to the fact that flat panel manufacturers Lifecycle Support we offer full functionality, the customer has the don’t follow a uniform specification, special Today it is obvious that product attention not only ability to utilize only those functions that are nec- adaptation know how is necessary. Automatic starts with the first prototypes but also must be essary for their application. Panel Detection via EPI (Embedded Panel maintained throughout series production. In Interface based on VESA EDID™ 1.3) can detect addition to this congatec is offering life cycle Quality and configure most flat panels available on the support during our product’s lifetime. This means congatec AG is certified in compliance with market today. we will offer replacement modules, when appli- ISO9001. All congatec products are made to cable, and quick and efficient handling of repairs meet the highest quality standards. All our BIOS Expertise during the life cycle of our products. congatec manufacturers are also ISO9001 certified. When it comes to Embedded computing often will also pay close attention to component life the difference between one company’s product cycles in order to provide our customers with and another’s is the BIOS. congatec has many advanced end-of-life warnings for our products. years of experience in BIOS development. The congatec Embedded BIOS expands the Focussing on core competencies functionality of a standard BIOS allowing for our Embedded computers are congatec’s passion. products to be implemented into many industrial We exclusively develop embedded computer uses. modules. With this focus, and thanks to the many years experience of our employees, we have achieved a very high degree of specialization. This knowledge is there for you to make use of and to strengthen your application know-how in your industry.

EN ISO 9001:2000

4 congatec AG International congatec

 congatec  Sales Partner  Technology Partner Technology

                       

  Qseven 



 COM Express   

Find more details at: www.congatec.com/partner.html XTX / ETX

5 www.congatec.com Computer-On-Modules - the concept

Embedded computer modules are highly integrated single board computers particularly suited for implementing customized solutions. Embedded computer modules are used when standard single board computers are not suitable for mechanical reasons or due to a lack of expandability.

The difference between boards and Thus, e.g. the excess heat can be modules passed directly to the system Embedded computer modules are very small housing. The heatspreader is computer boards that can be integrated in defined in the COM specification almost every application without a cable and is uniformly implemented connection. Every signal is transmitted via small, for all modules. densely packed board-to-board industrial connectors to a customer- or application-specific Flexible and robust carrier board. This carrier board contains all the mechanical solutions hardware expansions and also allows the cable In comparison to most computer less distribution of the required interfaces. boards, modules are very small Computer boards are equipped with numerous and allow for very compact solutions. and various connectors in order to allow the Because the modules are firmly screwed connection of a variety of peripherals and down, solutions are possible even for the expansions. Complex solutions based on com- most difficult environmental conditions. puter boards require many cable connections, Minimized development risk which is frequently a cause of problems during Economical The complexity of carrier board development is tough industrial use. By avoiding expensive and sensitive cable significantly reduced when embedded computer connections, solutions based on embedded modules are used. With lower complexity, the Customer specific solution computer modules are already economical in probability of error is naturally lower as well. This The carrier board contains all the special mid-sized quantities. means the cost and time frame of the project functionalities required by the corresponding can be met with a significantly lower risk. embedded application. This could be special Scalability interfaces, a unique power supply, as well as the congatec currently offers modules from 500 MHz Time-to-market mechanical design and the slot placement. The to 2.53 GHz. However, not only is the computer With a module-based solution, a complex CPU- embedded computer module itself is plugged in performance scalable, but also the interface board design with accompanying BIOS develop- like a component. This ”component” represents a configuration. You get precisely the performance ment is not necessary. Modular solutions are complete computer that is the intelligence of the your application needs. therefore ready for market significantly faster. application. To accelerate the time-to-market even further, Long-term availability congatec offers starter kits. With this, hardware Cooling The excellent long-term availability of all and software development can get under way The heatspreader serves as a thermal interface congatec modules is further extended as a result immediately. Appropriate board-support pack- between the embedded computer module and of the clearly defined module interface enabling ages for all standard operating systems provide the cooling solution of the system. broad market offers. an additional head start.

6 ACPI Battery Management congatec

ACPI Battery Management By following our CMB interface specification, The congatec ACPI BIOS and board controller customers can implement their own battery are designed to support a CMB (Control Method solutions or obtain a fully tested battery system Technology Battery) sub-system. from congatec AG. The board controller interacts with the battery In combination with an ACPI operating system, solution by providing the congatec ACPI BIOS the battery functionality associated with mobile with all the required battery information. platforms is supported by congatec embedded Since all congatec designs are equipped with computers. the board controller, the entire Qseven™, XTX Now it‘s much easier to build mobile embed- and COM Express™ product family range sup- ded applications that have notebook battery ports ACPI Battery Management. functionality. Qseven

Application System conga-SBM² 5V, 12 V DC SBM² 19V DC AC OS Smart Power ready to use Smart Battery Manager Module ACPI CGOS Control Supply CMB Battery congatec I²C Manager Board Module Controller System Host Carrier board SMART SMART Battery Battery #1 #2 COM Express .. .. XTX / ETX

7 www.congatec.com congatec Embedded BIOS

Embedded computer users usually require more than the standard functionality of an office computer. We at congatec have taken these requirements into account when designing our BIOS functionality. By drawing on the wealth of information that has been gathered as a result of many man-power years of combined experience in BIOS development, we have implemented the special requirements of an embedded BIOS into the congatec BIOS.

ACPI Support BIOS Setup Data Backup Hardware Monitoring Power Management and System Configuration The BIOS CMOS settings are held in flash memory The congatec BIOS already has the routines to is supported by the congatec BIOS according to to allow battery-less applications. monitor critical components implemented. Fans, the ACPI specification. operating voltages and several temperature Customer specific CMOS Defaults sensors can be monitored without incurring ad- Multi Stage Watchdog Timer The congatec embedded BIOS allows the cus- ditional development costs. All congatec modules tomer to store their own defaults in flash memory. are equipped with a Watchdog Events This helps reduce the need for customized BIOS Flexible BIOS Expansion Power ACPI NMI Reset multi stage watchdog Button Event versions. Customer specific code can be executed while timer supporting differ- booting the system. During power on self test ent events such as NMI, Manufacturing Data Storage (POST) the congatec BIOS can give control to NMI Hardware Switch Shutdown hardware reset or power Routine Reset ON/Off or Reset The congatec board controller provides a customer specific code. This gives customers button. It can either as- No Trigger rich data set of manufacturing and board in- more flexibility to initialize special hardware sert a single event and/ formation: Serial Number, Article Number, EAN extensions. ACPI or any combination of Event Code, Manufacturing and Repair Date, System Multi Stage these events. Triggering No Trigger Statistics and more. The BIOS also keeps track 32 Bit Uniform OS API

Hardware can happen by software Reset of dynamically changing running time and The congatec embedded BIOS Features are ac- and/or external OEM boot count data. All this data is accessible by cessible through a uniform 32 Bit API. hardware. a uniform API. congatec System Utility congatec Board Controller User Data Storage Area All Embedded BIOS features are accessible An onboard µc fully isolates some of the embed- congatec modules provide 32 Bytes of non vola- through the use of a congatec Windows tool. ded features such as system monitoring or the tile storage in the EEPROM and a 64 kByte block This includes all manufacturing and statistical I²C bus from the x86 core architecture, which in the BIOS flash memory. information; e.g. serial number, running hours, results in higher embedded feature performance boot counter etc. BIOS default settings, bootlogo and more reliability. Customer Logo and flat panel configurations can easily be pro- The BIOS can display a custom logo instead of grammed using this flexible and powerful tool. Fast Mode I²C Bus the traditional diagnostic output during POST. With The I²C Bus is a low speed bus interface often the congatec embedded BIOS customers can Board Support Packages used for sensors, converters or data storage in now integrate an OEM logo into the standard congatec offers advanced BSPs, which include embedded applications. All congatec modules BIOS by themselves. both the latest tested drivers from silicon vendors offer a 400 kHz multi-master I²C Bus that provides and the congatec specific drivers for access- maximum I²C bandwidth. ing all of our additional embedded BIOS and module features.

8 Embedded Panel Interface EPI congatec Technology

The congatec system utility enables users to easily generate an EPI dataset.

Qseven EPI Flat Panel Support With EDID 1.3 only monitors with local intelligence Embedded Computer Display Subsystem

The Embedded Panel Interface EPI, an open can be operated. In order for an Embedded Carrier board standard, allows for easy and direct control of all Computer Module to have direct control of a flat with customized functionality flat panel displays with maximum interchange- panel display some more information is required. Display Properties Brightness I²C Device ability. Therefore, EPI adds the missing parameters to the Computer On Module

complete set of EDID 1.3 data. XTX, ETX, COM Express, Qseven

One of the biggest advantages of COM‘s Flip Rotate (Computer On Modules) is the interchangeability An EPI data set, used to describe the control of of modules between different suppliers. The only a flat panel display, can be easily created using weak point was the direct control of flat panel the information found in the display‘s datasheet. EPI Display Data displays. Due to the lack of a uniform standard all It‘s even easier when using congatec‘s system Display

manufacturers had to define their own interface utility. Power Sequencing Backlight strategy. COM Express With this tool the EPI data set can be created This problem is now solved with the use of Em- and written to a reserved area in the congatec bedded Panel Interface EPI. EPI is based on embedded BIOS. The EPI data set description Power the VESA standard EDID 1.3 and defines the is independent from the video controller and is Power Supply software format for display properties and the interpreted by the video BIOS of the COM in order scalable hardware interface. to set the correct video attributes. The result is a manufacturer independent “plug-and-display” solution that enables free interchangeability of displays and COM‘s. Further Details: www.epi-standard.org XTX / ETX

9 www.congatec.com Cooling Solution

Heatspreader The specifications for Qseven™, COM Express™, XTX™ and ETX® embedded computer modules include a heatspreader, which is a mechanical definition of the thermal interface. All the heat generated by components such as chipsets and processors is transferred to the system’s cooling via the heatspreader. This can be achieved by either a thermal connection to the casing, a heat pipe or a heat sink.

Active and passive standard cooling solutions Compared with sandwich-type constructions for heatspreaders and cooling systems, active and passive cooling solutions remove one layer from the process. The heatspreader and cooler are manufactured as one unit, which enables them to provide faster thermal conduction. For an active cooling solution, a high performance quiet fan has been integrated within the cooling fins.

active cooling solution passive cooling solution

Thermal simulation of an active cooling solution

Thermal Stacks The “thermal stacks” can also be used separately without a heatspreader. It is distinguished from a heatspreader by its lack of a thermal conductive surface. This also reduces differences in temperature. The disadvantage here is its slightly more complex construction. When using heatspreaders, the customer receives a premounted heatspreader (thermal stack + aluminum plate). The heatspreader only has to be attached to the COM via screws. The customer has the entire heatspreader surface available as a connector to a cooling solution. With thermal stacks the customer needs to plan the mounting of the thermal stacks and the connection to the COM and cooling solution.

10 ™ Qseven - the mobile COM definition congatec

Targeting next generation ultra mobile embedded processors built using 45 nm technology, the Qseven™ format complements the low power and small size of these processors. By exploiting the small form factor of the industry`s latest processors, the Qseven™ format offers high performance computing power, delivered in a module measuring only 70 x70 mm2.

Mobile Applications This slot is already being used for graphics cards Qseven™ is unlike previous Computer-On-Mo- in laptop computers, so it is capable of the high Technology dules (COM) standards due to its primary focus speed PEG (PCI Express Graphics) data transfers. being directed towards mobile and ultra mobile This MXM slot connector is produced by three applications. It defines fast serial differential manufacturers in two different heights and there interfaces such as PCI Express and Serial ATA but is also an inverted model available. omits support for legacy interfaces like EIDE and PCI in order to provide ideal support for today as Graphics Interfaces well as future CPU's and chipsets. The video interfaces have been designed with increased flexibility. A total of four different output Legacy free possibilities are defined. Direct control of a flat Qseven™ is a legacy free standard and only panel display via 2x24 Bit LVDS (Low Voltage

focused on high speed serial interfaces. Differential Signal) with DisplayID and EPI panel Qseven detection. The physical signals the SDVO port Compact Size are shared with DisplayPort and TDMS. A hot The module's dimensions are 70x70mm² only. plug mechanism detects what type of interface This means it can be easily integrated into size is used and configures the graphics controller constricted systems. accordingly. Software API SDIO PCI Express Qseven™ embedded computer modules are When utilizing the SDIO interfaces, rugged and Qseven™ offers up to 4 PCI Express™ x1 lanes. equipped with additional functions for industrial cheap SD-Cards can be used as bulk memory. This allows the customer to equip their embed- applications such as Watchdog Timer, I²C Bus, Qseven™ defines an 8 Bit SDIO interface that is ded PC application with the next generation of LCD brightness control, BIOS user storage area capable of a maximum data transfer rate of 52 PC performance. PCI Express™ is a serial inter- and the reading of system temperatures. Due to

™ MByte/s. The Secure Digital standard also enables face with maximum bandwidth of 2.5 GBit/s per the fact that no standardized software interface ExpressCard™ other applications such as WLAN, Bluetooth, RFID lane and direction. for these functions has been defined to date, the COM Express etc. while using the same card format. exchangeability of COMs can be more difficult Low Power than expected. In order to generally avoid the Connector Qseven™ is defined for a maximum power con- software modifications that such situations would Unlike most previous module standards, Qseven™ sumption of 12 Watt operated by a single 5 Volt require, the Qseven™ specification includes a does not require an expensive board-to-board DC power and provides all additional signals for consistent software API (Application Program connector. Instead, it utilizes a very affordable battery management. This simple power require- Interface). Qseven™ modules from different MXM card slot with 230 pins in a 0.5 mm con- ments allow for small mobile solutions powered manufacturers can thus be easily exchanged figuration. by compact two cell batteries. without modifications to hardware or software. Qseven feature set XTX / ETX

11 www.congatec.com conga-QA Ultra Mobile

Ultra compact Qseven™ module based on Intel® Atom™ Processor Z5xx Module for ultra mobile applications Formfactor Qseven Form Factor, 70x70 mm2

Lowest power consumption CPU Intel® Atom™ processor Z530 1.6 GHz, 533 MHz FSB and memory bus speed, 512k L2 cache, 45 nm, with Hyper-Threading Technology ® Fast serial differential interfaces Intel Atom™ processor Z510 1.1 GHz, 400 MHz FSB and memory bus speed, 512k L2 cache, 45 nm for high data bandwidth DRAM Up to 1 GByte on-board DDR2 memory with 400/533 MT/s Chipset Intel® SCH US15W

Ethernet Gigabit Ethernet Realtek RTL8111

I/O Interfaces 8x USB 2.0, 1x SATA, 1x SDIO, 1x PCIe, I²C Bus, 1x USB client

Mass Storage On-board ATA Solid State Drive up to 4 GByte (optional)

Sound Intel® High Definition Audio (Intel® HD Audio)

Graphics Intel® Graphics Media Accelerator 500 (Intel® GMA 500), up to 256 MByte frame buffer supporting Direct X 9.0E and Open GL 2.0

Video Decode Acceleration Full hardware acceleration for MPEG2, MPEG4, H.264, WMV9 and VC1

Motion Video Support Single channel 112MHz LVDS transmitter, support for flat panels with 1x18 and 1x24 bit data mapping up to resolutions of 1366x768 pixel Single channel SDVO interface, supports resolutions up to 1280x1024 pixel Dual independent display support

congatec Board Controller Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board information, Board Statistics, BIOS Setup, Data Backup, I²C bus (fast mode, 400 kHz, multi-master), Power Loss Control

Embedded BIOS Features OEM Logo, OEM CMOS Defaults, LCD Control, Display Auto Detection, Backlight Control, Flash Update, based on AMIBIOS8®

Power Management ACPI 3.0 compliant, Smart Battery Management

Operating Systems Windows® XP, Windows® XP embedded, Windows® CE 6.0, LINUX, QNX

Power Consumption Typ. application ~5 Watt @ 5V

Temperature Operating: 0 to +60°C Storage: -20 to +80°C, extended temperature versions in preparation

Humidity Operating: 10 to 90% r. H. non cond. Storage: 5 to 95% r. H. non cond.

Size 70 x 70 mm2 (2¾" x 2¾")

Original size (70 x70 mm2, 2¾"x2¾") 12 ™ Qseven - Engineering Tools congatec Technology

conga-QKIT conga-QEVAL Qseven

This complete kit provides the ability to start evaluating Evaluation Board for Qseven™ modules. Qseven™ modules immediately. To achieve a quick start with Qseven congatec offers an Contents: evaluation carrier board, which routes all the Qseven™ signals to standard interface connectors. conga-QEVAL evaluation carrier board 4x PCI Express x1, 1x ExpressCard, 1x Mini PCI Express Card, I²C EEPROM, Aux. signals for battery management conga-LDVI LVDS to DVI converter 1x SDIO Card Socket, 4x 32 Bit PCI 1x Dual Channel LVDS, 1x SDVO, HDMI or Display Port, conga-FPA1 evaluation flat panel adapter Gigabit Ethernet Backlight control SATA-to-CF card adapter 6x USB 2.0 + 1x USB Client 12 V single power input SATA-to-IDE converter MIC, Line In, Line Out, SPDIF COM Express ATX power input connector, CMOS battery ATX power supply 2x SATA Complete cable set LPC POST code display, System speaker congatec USB memory stick Power button, Reset button, LID button, Sleep button Product documentation and BSPs are available at: PCI Express switch, External BIOS flash www.congatec.com XTX / ETX

13 www.congatec.com Qseven™ - Engineering Tools

Qseven™ Mobility Kit

The congatec Qseven™ mobility kit provides the ability to start evaluating Qseven™ modules for all kind of mobile applications immediately. conga-LDVI Contents:

DVI Converter Module for LVDS Qseven™ mini carrier board 95x140mm²

19V DC power supply Compact module to convert LVDS to DVI-D. It can be used with either XTX™ or COM Express™ modules. It`s now Flat panel LVDS adapter with USB touch controller possible to realize a dual port DVI-D system independent and LED backlight control of the typical Video Output Ports (SDVO or DVO). 5,7" TFT LVDS display with installed touch panel and LED backlight

HDMI-to-DVI adapter conga-SBM2Q battery manager

Smart battery Qseven™ mini carrier board conga-SBM2Q Full Feature Set. The conga-Qcarrier is a full featured, miniaturized carrier board for Qseven™. conga-SBM2Q is a complete battery manager sub-system 2 in the form of a plug-in module. Small size: 95x140 mm Qseven™ module socket Support 2S1P up to 4S2P, parallel or SDIO socket sequential battery operation Mini PCI Express socket S3 support (Suspend to RAM) LVDS LEDs provide a direct view of charging and battery capacity status DVI output through HDMI connector

Input voltage of 19V DC 6x USB

Output 5V, 7A and 5V Standby Ethernet

Battery charging max. 17V, max. 3A 2 SATA & SATA power

Size 70 mm x 60 mm 19V DC power input with battery management signals

14 ™ COM Express - the concept congatec

COM Express™ is a PICMG standard that defines a Computer-On-Module, or COM, packaged as a super component. The defined interfaces provide a smooth transition path from legacy interfaces to LVDS (Low Voltage Differential Signaling) serial interfaces. This includes SDVO, PCI Express and Serial ATA. COM Express™ defines 5 different pinout types in order to be scalable for future applications.

New interfaces Thermal Design ExpressCard™ About PICMG COM Express™ defines 440 interconnect pins As with XTX™ and ETX®, the COM Express™ COM Express™ supports ExpressCard™ slots. PICMG is a consortium of over 450 companies Technology between the COM Express™ module and the definition includes a heatspreader that acts as ExpressCard™ is the successor to PCMCIA. This who collaboratively develop open specifications carrier board. Legacy buses such as PCI, parallel a thermal interface between the COM Express™ interface allows the use of USB 2.0 and PCI for high performance telecommunications and ATA and LPC are supported along with new serial module and the system‘s cooling solution. All Express™ applications as well. industrial computing applications. The members high speed interfaces such as PCI Express, Serial heat generating components are thermally of the consortium have a long history of develop- ATA and Gigabit Ethernet. conducted to the heatspreader in order to avoid ing leading edge products for these industries. hot spots. Legacy free COM Express™ is a legacy free standard. Out- PCI Express dated interfaces such as floppy, PS/2 keyboard/ In addition to the 32 bit parallel PCI bus, COM mouse, RS232, LPT are no longer supported. If re- Express™ offers up to 22 PCI Express™ lanes. This

quired, these legacy interfaces can be optionally allows the customer to equip their embedded Qseven generated on the customized carrier board. PC application with the next generation of PC performance. PCI Express™ is a low pin count Row C&D: Row A&B: Size interface with maximum bandwidth per pin. The PCI Express Graphics 6x PCI Express (PEG x16) COM Express™ modules are available in three scalable bandwidth is 2.5 GBit/s per lane and 4x SATA 2x SDVO 8x USB different sizes: Compact, Basic and Extended. direction. (shared with PEG) The primary difference between the modules is IDE 2x ExpressCard the overall physical size and the performance GPIO PCI 32 Bit 1x Ethernet 100/1000 AC’97/HDA envelope supported by each. The Extended COM Express™ defines freely usable general VCC module is the biggest and can support more purpose inputs and outputs. (+12V primary, +5V standby, Flatpanel (2x24Bit LVDS) 3,3V RTC) VGA power consuming processors and chips with TVout larger footprints. PCI Express Graphic (PEG) I²C The PEG interface utilizes up to 16 PCI Express LPC lanes in order to drive an external ultra high SMB COM Express performance graphic controller located on the 8x GPIO carrier board. D C

extended 155x110mm² basic 125x95mm² compact 95x95mm² A XTX / ETX

15 www.congatec.com COM Express™ - Product Overview

COM Express™ conga-BM45 conga-B945 conga-BA945

Formfactor COM Express™ Basic COM Express™ Basic COM Express™ Basic Type II connector layout Type II connector layout Type II connector layout Processor Intel® Core® 2 Duo T9400, 2.53 GHz Intel® Celeron® M423 Intel® Atom™ N270, 1.6 GHz, up to 1.06 GHz up to 512 MByte cache, 533 MHz FSB, Intel® Celeron® M575 2.0 GHZ Intel® Core™ 2 Duo 2.16 GHz 45nm, 2.5W TDP

Chipset Intel® GM45 / ICH9M-E Intel® 945GME / ICH7-M Intel® 945GME / ICH7-M Intel® GL40 / ICH9M-E DRAM max. 8 GByte DDR3 1067 MHz max. 4 GByte DDR2 667 MHz max. 4 GByte DDR2 667 MHz

Mass storage 4x SATA 2x SATA 2x SATA 1x EIDE (option) 1x EIDE 1x EIDE Bus PCI Express 5x1. 1x16 Lanes (PEG), PCI Express 5x1 or 1x4 & 1x1 Links, PCI Express 5x1 or 1x4 & 1x1 Links, PCI Bus, LPC Bus, I²C 1x16 Lanes (PEG), PCI, LPC, I²C 1x16 Lanes (PEG), PCI, LPC, I²C Ethernet 10/100/1000 LAN MAC + Intel 10/100/1000BaseT 10/100/1000BaseT 82567LM Phy. AMT 4.0 support I/O 2x Express Card 2x ExpressCard support 2x ExpressCard support 8x USB 8x USB 2.0 8x USB 2.0

Graphics Intel® GMA 4500 MHD Intel® GMA 950 Intel® GMA 950 max. Memory 224 MByte 224 MByte Panel Interface CRT/LVDS 2x24/TV-Out/2xSDVO, CRT/LVDS 2x24/TV-Out/2xSDVO CRT/LVDS 2x24/TV-Out/2xSDVO HDMI, DisplayPort max. FP Resolution 1920x1200 1920x1200 1920x1200 Audio AC'97 Rev. 2.2 AC'97 Rev. 2.2 HDA digital audio HDA digital audio HDA digital audio Power Management ACPI 3.0 with Battery Support ACPI 2.0 with Battery Support ACPI 2.0 with Battery Support S3 Support (Supend to RAM) S3 Support (Supend to RAM) S3 Support (Supend to RAM) Others Board Controller Board Controller Board Controller TPM option, Fan Control TPM option, Fan Control TPM option, Fan Control

16 congatec

conga-CA945 conga-B915 conga-CA conga-CAx conga-CLX Technology COM Express™ Compact COM Express™ Basic COM Express™ Compact COM Express™ Compact COM Express™ Compact Type II connector layout Type II connector layout Type II connector layout Type II connector layout Type II connector layout Intel® Atom™ N270, 1.6 GHz, Intel® Celeron® M 600 MHz Intel® Atom™ processor Intel® Atom™ processor AMD Geode™ LX800 512 MByte cache, 533 MHz FSB, up to Z530 1.6 GHz Z520 1.3 GHz 500 MHz 45nm, 2.5W TDP Intel® Celeron® M 1.5 GHz Z510 1.1 GHz Z510 1.1 GHz 128 kByte L2 cache

Intel® 945GSE / ICH7-M Intel® 910GMLE / ICH6-M Intel® System Controller Hub US15W Intel® System Controller Hub US15WPT AMD Geode™ CS5536

max. 2 GByte DDR2 533 MHz max. 2 GByte DDR2 400 MHz max. 1 GByte on-board DDR2 max. 1 GByte on-board DDR2 max. 1 GByte DDR333 533 MHz 533 MHz

2x SATA 2x SATA 2x SATA 1x SSD 2x SATA Qseven 1x EIDE 1x EIDE 1x EIDE 1x EIDE 1x EIDE PCI Express 3x1, PCI, LPC, I²C PCI Express 3x1, PCI, LPC, I²C PCI, LPC, I²C PCI, LPC, I²C PCI, LPC, I²C

10/100/1000BaseT 10/100/1000BaseT 10/100/1000BaseT 10/100/1000BaseT 10/100/1000BaseT

2x ExpressCard support 2x ExpressCard support 8x USB 2.0 8x USB 2.0 8x USB 2.0 8x USB 2.0 4x USB 2.0 2x SDIO

Intel® GMA 950 Intel® GMA 900 Intel® GMA 500 Intel® GMA 500 integrated, EPI support max. 224 MByte 128 MByte 256 MByte 256 MByte 254 MByte LVDS 2x18/1xSDVO CRT/LVDS 2x24/2xSDVO LVDS 1X24/SDVO LVDS 1X24/SDVO CRT/LVDS 1X18/TV-Out COM Express

1920x1200 1920x1200 1366x768 1366x768 1024x768 AC'97 Rev. 2.2 AC'97 Rev. 2.2 AC'97 digital HDA digital audio HDA digital audio HDA digital audio HDA digital audio ACPI 2.0 with Battery Support ACPI 2.0 with Battery Support ACPI 3.0 with Battery Support ACPI 3.0 with Battery Support ACPI 2.0 with Battery Support S3 Support (Supend to RAM) S3 Support (Supend to RAM) S3 Support (Supend to RAM) S3 Support (Supend to RAM) S3 Support (Supend to RAM) Board Controller Board Controller Board Controller Board Controller Board Controller TPM option, Fan Control TPM option, Fan Control Fan Control, integrated EPI support Fan Control, integrated EPI support Fan Control, integrated EPI support XTX / ETX

17 www.congatec.com conga-BM45 High End

® 45nm Intel Core™2 Duo Formfactor COM Express™ Basic, (95 x 125 mm), Type II Connector Layout Processors up to 2.53 GHz CPU Intel® Core™ 2 Duo T9400, 2.53 GHz (6M cache, 1066 MHz FSB, 45nm), Socket mPGA479M Intel® Core™ 2 Duo P8400, 2.26 GHz (3M cache, 1066 MHz FSB, 45nm), Socket mPGA479M Provides up to 8 GByte dual Intel® Celeron™ processor T3100, 1.90 GHz (1m cache, 800 MHz FSB, 45nm), Socket mPGA478M (with Intel® GL40 Chipset) channel DDR3 DRAM Intel® Celeron™ processor 575, 2.0 GHz, Socket mPGA479M, no PEG Support (with Intel® GL40 Chipset) DRAM 2 Sockets, SO-DIMM DDR3 1067 MHz, up to 8 GByte

Intel AMT 4.0 Chipset Graphics & Memory Controller Hub: Intel® GM45/GL40 I/O Controller Hub: Intel® ICH9M-E

Ethernet Integrated within the ICH9M-E, 10/100/1000 LAN MAC + Intel® 82567 Phy, AMT 4.0 support New Display Interfaces DisplayPort and HDMI/HDCP I/O Interfaces 5x PCI Express™ lanes, PCI Express Graphics (PEG x16), 3x Serial ATA® (AHCI) supporting RAID 0/1/5/10, 1x EIDE (UDMA-66/100) optional, 2x ExpressCard® (uses 2x USB & 2x PCI Express), 8x USB 2.0 (EHCI), PCI bus 33 MHz Rev. 2.3, LPC bus, I²C bus (fast mode, 400 kHz, multi-master), Power Loss Control, temperature controlled Power-Up

ACPI Battery Support, Sound Digital High Definition Audio Interface with support for multiple audio codecs Flat Panel detection Graphics Mobile Intel® Graphics Media Accelerator 4500MHD, graphics core speeds up to 533 MHz, improved graphics and 3D rendering performance, Intel® Dynamic Video Memory Technology (Intel® DVMT 5.0), OpenGL 2.0 and DirectX10 support, Two independent pipelines for full dual view support

Motion Video Support High performance hardware MPEG-2 decoding, WMV9 (VC-1) and H.264 (AVC) support Blu-ray support @ 40 Mb/s, hardware motion compensation

Flat panel Interface Dual channel 112 MHz LVDS transmitter, Supports flat panels with 1x18, 2x18, 1x24, 2x24 bit interface, VESA- and openLDI mappings, resolutions from 640x480 up to 1920x1200, Automatic Panel Detection via EDID/EPI/DisplayID

DisplayPort (DP) Supports two DisplayPorts multiplexed with the PCI Express Graphics interface 1.62 Gb/s and 2.7 Gb/s, 1/2/4 data lanes, 8B10B-coding, Hot-Plug detect support, HDCP support

HDMI Single TMDS Link, only support for RGB Video support for CEA modes 480i/p, 576i/p, 720p, 1080i/p and PC modes via dot clock, HDCP and HDMI repeater support

CRT Interface 300 MHz RAMDAC, resolutions up to QXGA

AUX Output Supports two SDVO Ports multiplexed with the PCI Express Graphics interface

TV Out Onboard TV encoder, supports HDTV (420p, 720p and 1080i), supports component and S-video

congatec Board Controller Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board Information, Board Statistics, BIOS Setup Data Backup, I²C bus (fast mode, 400 kHz, multi-master), Power Loss Control, temperature controlled Power-Up

Embedded BIOS Features OEM Logo, OEM CMOS Defaults, LCD Control, Display Auto Detection, Backlight Control, Flash Update, Based on AMIBIOS8®

Security Integrated TPM 1.2/TCPA security functions, tor Hash, RSA, keys and random numbers

Power Management ACPI 3.0 with battery support

Operating Systems Microsoft®, Windows Vista, Windows XP, Windows XP embedded, Windows® CE 6.0, LINUX, QNX

Power Consumption Typ. application: TBD W @ 12V, see manual for full details, CMOS Battery Backup

Temperature Operating: 0 .. +60°C Storage: -20 .. +80°C

Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond.

Size 95 x 125 mm² (3.74" x 4.92")

18 Performance conga-B945 congatec

Formfactor COM Express™ Basic, (95 x 125 mm), Type II Connector Layout Featuring the latest Intel® Core™2 Duo Processors CPU Intel® Core™ 2 Duo T7400, 2.16 GHz, (4M cache, 667 MHz FSB, 65nm), Socket mPGA479M Intel® Core™ 2 Duo L7400 LV, 1.5 GHz, (4M cache, 667 MHz FSB, 65nm) up to 2.16 GHz Intel® Core™ 2 Duo U7500 ULV, 1.06 GHz, (2M cache, 533 MHz FSB, 65nm) Intel® Core™ Duo T2500, 2.0 GHz, (2M cache, 667 MHz FSB, 65nm), Socket mPGA479M Intel® Core™ Duo L2400 LV, 1.66 GHz, (2M cache, 667 MHz FSB, 65nm) Provides up to 4 GByte top Intel® Celeron® M440, 1.86 GHz, (1M cache, 533 MHz FSB, 65nm), Socket mPGA479M of the line DRAM performance Intel® Celeron® M423 ULV, 1.06 GHz, (1M cache, 533 MHz FSB, 65nm)

DRAM 2 Sockets, SO-DIMM DDR2 667/PC5300 up to 4 GByte physical memory

ACPI Battery Support, Technology Chipset Graphics & Memory Controller Hub: Intel® 945GME I/O Controller Hub: Intel® 82801GHM (ICH7M-DH) Flat Panel detection ... Ethernet Gigabit Ethernet, Realtek RTL8111

I/O Interfaces 5x PCI Express™ Lanes, PCI Express Graphic (PEG x16), 2x Serial ATA® (AHCI) supporting RAID 0 and RAID 1, 1x EIDE (UDMA-66/100), 2x Express Card® (uses 2x USB & 2x PCI Express), 8x USB 2.0 (EHCI), PCI Bus 33 MHz Rev. 2.3, LPC Bus, I²C (Fast Mode, 400 kHz, Multi Master), Power Loss Control, Temperature Controlled Power-Up

Sound AC‘97 Rev.2.2 Compatible, Digital High Definition Audio Interface with support for multiple audio codecs

Graphics Enhanced 256 Bit 3D Video Controller, Intel® Graphics Media Accelerator 950, up to 10.6 GB/sec memory bandwidth, 256-bit graphics core, max. 224 MByte 64 Bit Video RAM (DVMT 3.0), Dynamic Display Modes for flat-panel, wide-screen and Digital TV support

Two independent pipelines for full dual view support Qseven

Motion Video Support High Definition Hardware Motion Compensation to support high definition hi-bitrate MPEG2 media playback, Up and Down Scaling of Video Content, High Definition Content Decode, HDTV (1080i/p) Support

Flat panel Interface Dual 112 MHz LVDS Transmitter, Supports all 1x18, 2x18, 1x24, 2x24 Bit, VESA- and openLDI-Mappings, Resolutions 640x480 up to 1920x1200, Automatic Panel Detection via EPI, (Embedded Panel Interface, based on VESA EDID™ 1.3)

CRT Interface 400 MHz RAMDAC, Resolutions up to 2048x1536 @ 75 Hz, including 1920x1080 @ >85 Hz (HDTV)

AUX Output 2x SDVO (shared with PEG x16 pins)

TV Out Onboard TV encoder, supports HDTV (420p, 720p and 1080i), supports component and s-video congatec Board Controller Multi Stage Watchdog, Non-volatile User Data Storage, Manufacturing and Board information, Board Statistics, BIOS Setup Data Backup, I²C (Fast Mode, 400 kHz, Multi Master), Power Loss Control, Temperature Controlled Power-Up

Embedded BIOS Features OEM Logo, OEM CMOS Defaults, LCD Control, (Auto Detection, Backlight Control), Flash Update, Based on AMIBIOS8® COM Express Security TPM 1.2/TCPA Security Functions, tor Hash, RSA, Keys and Random Numbers (optional)

Power Management ACPI 2.0 with Battery support

Operating Systems Microsoft®, Windows XP, Windows 2000, Windows XP embedded, Windows® CE 5.0/6.0, LINUX, QNX

Power Consumption Typ. application: 10.5 W @ 12V, (1.66 GHz Core Duo), see manual for full details, CMOS Battery Backup

Temperature Operating: 0 .. +60°C Storage: -20 .. +80°C

Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond.

Size 95 x 125 mm² (3.74" x 4.92") XTX / ETX

19 www.congatec.com conga-BA945 Performance

Featuring the Intel® Atom™ Formfactor COM Express™ Basic, (95 x 125 mm), Type II Connector Layout processor N270, 1.6 GHz CPU Intel® Atom™ processor N270, 1.6 GHz, 512 kB cache, 533 MHz FSB, 45nm, 2.5W TDP

Provides up to 4 GByte Dual DRAM 2 Sockets, SO-DIMM DDR2 667/PC5300 up to 4 GByte physical memory Channel DRAM Chipset Graphics & Memory Controller Hub: Intel® 945GME I/O Controller Hub: Intel® 82801 GHM (ICH7M-DH) Ethernet Gigabit Ethernet, Realtek RTL8111 ACPI Battery Support, I/O Interfaces 5x PCI Express™ Lanes, PCI Express Graphic (PEG x16), 2x Serial ATA® (AHCI) supporting RAID 0 and RAID 1, Flat Panel detection ... 1x EIDE (UDMA-66/100), 2x Express Card® (uses 2x USB & 2x PCI Express), 8x USB 2.0 (EHCI), PCI Bus 33 MHz Rev. 2.3, LPC Bus, I²C (Fast Mode, 400 kHz, Multi Master), Power Loss Control, Temperature Controlled Power-Up

Sound AC‘97 Rev.2.2 Compatible, Digital High Definition Audio Interface with support for multiple audio codecs

CRT Interface 400 MHz RAMDAC, Resolutions up to 2048x1536 @ 75 Hz, including 1920x1080 @ >85 Hz (HDTV)

AUX Output 2x SDVO (shared with PEG x16 pins)

TV Out Onboard TV encoder, supports HDTV (420p, 720p and 1080i), supports component and s-video

congatec Board Controller Multi Stage Watchdog, Non-volatile User Data Storage, Manufacturing and Board information, Board Statistics, BIOS Setup Data Backup, I²C (Fast Mode, 400 kHz, Multi Master), Power Loss Control, Temperature Controlled Power-Up

Embedded BIOS Features OEM Logo, OEM CMOS Defaults, LCD Control, (Auto Detection, Backlight Control), Flash Update, Based on AMIBIOS8®

Security TPM 1.2/TCPA Security Functions, tor Hash, RSA, Keys and Random Numbers (optional)

Power Management ACPI 2.0 with Battery support

Operating Systems Microsoft®, Windows XP, Windows 2000, Windows XP embedded, Windows® CE 5.0/6.0, LINUX, QNX

Power Consumption Typ. application: <10 W @ 12V, see manual for full details, CMOS Battery Backup

Temperature Operating: 0 .. +60°C Storage: -20 .. +80°C

Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond.

Size 95 x 125 mm² (3.74" x 4.92")

20 Ultra Low Power conga-CA945 congatec

Formfactor COM Express™ Compact, (95 x 95 mm), Type II Connector Layout Allows cost effective and power efficient COM Express™ CPU Intel® Atom™ N270, 1.6 GHz, 512 kB cache, 533 MHz FSB, 45nm, 2.5W TDP solutions DRAM 1 Socket, SO-DIMM DDR2 533, up to 2 GByte Chipset Graphics & Memory Controller Hub: Intel® 945GSE I/O Controller Hub: Intel® 82801GBM (ICH7M) Combines Intel® Atom™ processor Ethernet Gigabit Ethernet, Realtek RTL8111C technology with the feature rich embedded chipset Intel® 945 GSE I/O Interfaces 3x PCI Express™ Lanes, 2x Serial ATA® (AHCI), 1x EIDE (UDMA-66/100), 2x Express Card® (uses 2x USB & 2x PCI Express),

8x USB 2.0 (EHCI), Technology PCI Bus 33 MHz Rev. 2.3, LPC Bus, I²C (Fast Mode, 400 kHz, Multi Master), Power Loss Control, Temperature Controlled Power-Up

Sound AC‘97 Rev.2.2 Compatible, Digital High Definition Audio Interface with support for multiple audio codecs

Graphic Interface Enhanced 256 Bit 3D Video Controller, Intel® Graphics Media Accelerator 950, up to 10.6 GB/sec memory bandwidth, 256-bit graphics core, max. 224 MByte 64 Bit Video RAM (DVMT 3.0), Dynamic Display Modes for flat-panel, wide-screen and Digital TV support Two independent pipelines for full dual view support

Flat panel Interface Dual 112 MHz LVDS Transmitter, Supports all 1x18, 2x18, Resolutions 640x480 up to 1920x1200, Automatic Panel Detection via EPI, (Embedded Panel Interface, based on VESA EDID™ 1.3) and Display ID Qseven

CRT Interface 400 MHz RAMDAC, Resolutions up to 2048x1536 @ 75 Hz, including 1920x1080 @ >85 Hz (HDTV)

AUX Output 1x SDVO congatec Board Controller Multi Stage Watchdog, Non-volatile User Data Storage, Manufacturing and Board information, Board Statistics, BIOS Setup Data Backup, I²C (Fast Mode, 400 kHz, Multi Master), Power Loss Control, Temperature Controlled Power-Up

Embedded BIOS Features OEM Logo, OEM CMOS Defaults, LCD Control, (Auto Detection, Backlight Control), Flash Update, Based on AMIBIOS8®

Security TPM 1.2/TCPA Security Functions, tor Hash, RSA, Keys and Random Numbers (optional)

Power Management ACPI 2.0 with Battery support

Operating Systems Microsoft® Vista™, Windows XP, Windows XP embedded, Windows® CE 5.0/6.0, LINUX, QNX

Power Consumption Typ. application: <10 W @ 12V, see manual for full details, CMOS Battery Backup

Temperature Operating: 0 .. +60°C Storage: -20 .. +80°C COM Express

Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond.

Size 95 x 95 mm² (3.74" x 3.74") XTX / ETX

21 www.congatec.com conga- B915 Economy Class

Economy priced COM Express™ modules Formfactor COM Express™ Basic, (95 x 125 mm), Type II Connector Layout

Performance up to 1.5 GHz CPU Intel® Celeron® M 370 1.5 GHz, 1 MByte cache, FSB 400 MHz Intel® Celeron® M Intel® Celeron® M 373 1.0 GHz, ULV, 512 k cache, FSB 400 MHz Intel® Celeron® M 600 MHz, ULV, 512 kByte cache, FSB 400 MHz, eco version utilizing Intel® 910GMLE Chipset (no PEG port) ACPI Battery Support, DRAM SO-DIMM DDR2 DDR533/PC4200 up to 2 GByte Flat Panel detection ... Chipset Graphics & Memory Controller Hub: Intel® 915GME I/O Controller Hub: Intel® 82801FBM (ICH6-M)

Ethernet Gigabit Ethernet, Realtek RTL8111

I/O Interfaces 3x PCI Express™ Lanes, PCI Express Graphic (PEG x16), 2x Serial ATA® (AHCI), 1x EIDE (UDMA-66/100), 2x Express Card® (uses 2x USB & 2x PCI Express), 8x USB 2.0 (EHCI), PCI Bus 33 MHz Rev. 2.3, LPC Bus, I²C (Fast Mode, 400 kHz, Multi Master)

Sound AC‘97 Rev.2.2 Compatible, Digital High Definition Audio Interface with support for multiple audio codecs

Graphics Enhanced 256 Bit 3D Video Controller, Intel® Graphics Media Accelerator 900, 533 MHz Memory Clock, max. 128 MByte 64 Bit Video RAM (DVMT 3.0) Two independent pipelines for full dual view support

Motion Video Support Motion Compensation, Subpicture Support, Dynamic Bob & Weave, HDTV (1920x1080) Support

CRT Interface 400 MHz RAMDAC, Resolutions up to 2048x1536 @ 75 Hz, (QXGA), including 1920x1080 @ >85 Hz (HDTV)

AUX Output 2x SDVO (shared with PEG port)

congatec Board Controller Multi Stage Watchdog, Non-volatile User Data Storage, Manufacturing and Board information, Board Statistics, BIOS Setup Data Backup, I²C (Fast Mode, 400 kHz, Multi Master)

Embedded BIOS Features OEM Logo, OEM CMOS Defaults, LCD Control, (Auto Detection, Backlight Control), Flash Update, Based on AMIBIOS8®

Security TPM 1.2/TCPA Security Functions, tor Hash, RSA, Keys and Random Numbers (optional)

Power Management ACPI 2.0 with Battery support

Operating Systems Microsoft® Windows XP, Windows 2000, Windows XP embedded, Microsoft® Windows® CE 5.0/6.0, LINUX, QNX

Power Consumption Typ. application: 6.5 W @ 12V, (Intel® Celeron® M 1 GHz), see manual for full details, CMOS Battery Backup

Temperature Operating: 0 .. +60°C Storage: -20 .. +80°C

Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond.

Size 95 x 125 mm² (3.74" x 4.92")

22 Low Power Consumption conga-CA congatec

Compact COM Express Module based on Intel® Atom™ Processor Z5xx Series Best Performance / Watt COM Express™ Module Formfactor COM Express™ Compact, (95 x 95 mm), Type II Connector Layout CPU Intel® Atom™ processor Z530 1.6 GHz, 533 MHz FSB and memory bus speed, 512k L2 cache, 45 nm, Compact size for easy with Hyper-Threading Technology Intel® Atom™ processor Z510 1.1 GHz, 400 MHz FSB and memory bus speed, 512k L2 cache, 45 nm integration

DRAM Up to 1 GByte on-board DDR2 400/533 MHz Extremely low power consumption, Chipset Intel® System Controller Hub US15W

Flat Panel detection ... Technology Ethernet Gigabit Ethernet Realtek RTL8111

I/O Interfaces 2x SATA, 1x EIDE (UDMA-66/100), PCI bus Rev. 2.3, LPC bus, 8x USB 2.0, I²C bus

Sound Intel® High Definition Audio (Intel® HD Audio)

Graphics Intel® Graphics Media Accelerator 500 (Intel® GMA 500), up to 256 MByte frame buffer supporting Direct X 9.0E and Open GL 2.0

Video Decode Full hardware acceleration for MPEG2, MPEG4, H.264, WMV9 and VC1 Acceleration

Motion Video Support Single channel 112 MHz LVDS transmitter, support for flat panels (1920x1080) with 1x18 and 1x24 bit data mapping up to resolutions of 1366x768 pixel Single channel SDVO interface, supports resolutions up to 1920x1080 pixel Qseven Dual independent display support congatec Board Controller Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board information, Board Statistics, BIOS Setup, Data Backup, I²C bus (fast mode, 400 kHz, multi-master), Power Loss Control

Embedded BIOS Features OEM Logo, OEM CMOS Defaults, LCD Control, Display Auto Detection, Backlight Control, Flash Update, based on AMIBIOS8®

Power Management ACPI 3.0 with battery support

Operating Systems Microsoft® Windows® Vista, Windows® XP, Windows® XP embedded, Windows® CE 6.0, LINUX, QNX

Power Consumption Typ. application 5 Watt

Temperature Operating: 0 to +60°C Storage: -20 to +80°C, extended temperature versions in preparation

Humidity Operating: 10 to 90% r. H. non cond. Storage: 5 to 95% r. H. non cond. COM Express

Size 95 x 95 mm² (3¾" x 3¾") XTX / ETX

23 www.congatec.com conga-CAx Industrial Temperature

Extended Temperature Range Formfactor COM Express™ Compact, (95 x 95 mm), Type II Connector Layout -40° .. +85°C CPU Intel® Atom™ processor Z520PT 1.3 GHz, 533 MHz FSB and memory bus speed, 512k L2 cache, 45 nm, with Hyper-Threading Technology, industrial temperature Compact COM Express™ Module Intel® Atom™ processor Z510PT 1.1 GHz, 400 MHz FSB and memory bus speed, 512k L2 cache, 45 nm with Hyper-Threading Technology, industrial temperature with best Performance per Watt Ratio DRAM Up to 1 GByte on-board DDR2 400/533 MHz congatec Embedded BIOS, Chipset Intel® System Controller Hub US15WPT, industrial temperature Flat Panel Detection, ... Ethernet Intel® Gigabit Ethernet 82574L Controller

I/O Interfaces 1x EIDE (UDMA-66/100), PCI bus Rev. 2.3, LPC bus, 8x USB 2.0, I²C bus

Mass Storage Onboard IDE Solid State Disk up to 8GB

Sound Intel® High Definition Audio (Intel® HD Audio)

Graphics Intel® Graphics Media Accelerator 500 (Intel® GMA 500), up to 256 MByte frame buffer supporting Direct X 9.0E and Open GL 2.0

Video Decode Acceleration Full hardware acceleration for MPEG2, MPEG4, H.264, WMV9 and VC1

Motion Video Support Single channel 112MHz LVDS transmitter, support for flat panels with 1x18 and x24 bit data mapping up to resolutions of 1366x768 pixel Single channel SDVO interface, supports resolutions up to 1920x1080 pixel Dual independent display support

Embedded BIOS Features OEM Logo, OEM CMOS Defaults, LCD Control, Display Auto Detection, Backlight Control, Flash Update, based on AMIBIOS8®

Power Management ACPI 3.0 with battery support

Operating Systems Microsoft® Windows® Vista, Windows® XP, Windows® XP embedded, Windows® CE 6.0, LINUX, QNX

Power Consumption Typ. application 5 Watt

Temperature Operating: -40 to +85°C Storage: -40 to +85°C, extended temperature

Humidity Operating: 10 to 90% r. H. non cond. Storage: 5 to 95% r. H. non cond.

Size 95 x 95 mm² (3¾" x 3¾")

24 Entry Level conga-CLX congatec

Formfactor COM Express™ Compact, (95 x 95 mm), Type II Connector Layout Entry level COM Express™ Module

CPU AMD Geode™ LX 800 Processor, 500 MHz, 400 MT/s memory bus speed, 128 kByte L2 Cache Compact size for easy integration DRAM SO-DIMM DDR333/PC2700 up to 1 GByte Chipset Companion Device: AMD Geode™ CS5536 Ethernet: RTL8110SC(L) (Gigabit) Low power consumption, Ethernet Gigabit Ethernet or, IEEE 802.3u 100Base-Tx Flat Panel detection ...

I/O Interfaces 2x Serial ATA®, 1x EIDE (UDMA-66/100), 4x USB 2.0 (EHCI), PCI Bus Rev. 2.1, no ISA Bus, LPC Bus,

I²C (Fast Mode, 400 kHz, Multi Master) Technology

Sound AC‘97 Digital Audio Interface Rev. 2.2

Graphics Integrated in chipset, Unified Memory Architecture (UMA) up to 254 MByte graphic memory space

Motion Video Support H/W Up- and Downscaling, High Definition digital video support, alpha blending and color keying

Flat panel Interface 68 MHz LVDS Transmitter Automatic Panel Detection via EPI (Embedded Panel Interface based on, VESA EDID™ 1.3), 1x18 Bit TFT, resolutions 320x240 up to 1024x768

CRT Interface 350 MHz RAMDAC, Resolutions up to, 1920x1440x32bpp @ 85 Hz, 1600x1200x32bpp @ 100 Hz

TV Out (optional) onboard TV encoder, supports HDTV (420p, 720p and 1080i), supports component and s-video

congatec Board Controller Multi Stage Watchdog, Non-volatile User Data Storage, Manufacturing and Board information, Board Statistics, Qseven BIOS Setup Data Backup, I²C (Fast Mode, 400 kHz, Multi Master, Power Loss Control)

Embedded BIOS Features OEM Logo, OEM CMOS Defaults, LCD Control, (Auto Detection, Backlight Control), Flash Update, Based on Insyde XpressROM

Power Management ACPI 2.0 with Battery support

Operating Systems Microsoft® Windows® XP, Windows® 2000, Windows® XP embedded, Windows® CE 5.0/6.0, LINUX, QNX

Power Consumption typ. application 5.5W @ 5V, see manual for full details, CMOS Battery Backup

Temperature Operating: 0 .. +60°C Storage: -20 .. +80°C

Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond.

Size 95 x 95 mm² (3.74" x 3.74") COM Express XTX / ETX

25 www.congatec.com COM Express™ Engineering Tools

conga-CEVAL conga-CKIT

Evaluation Carrier Board for COM Express™ modules. To This complete kit provides the ability to start evaluating achieve a quick start with COM Express™ congatec offers COM Express™ modules immediately. an evaluation carrier board, which routes all the COM Contents: Express™ signals to standard interface connectors. Sup- ports COM Express™ Compact and Basic modules using conga-CEVAL evaluation carrier board connector Pinout Type 2. conga-Cdebug Post-Code and debug card with cables

4x1 PCI Express, 1xExpress Card, 1x 16 PCI Express conga-FPA1 flat panel adapter with cables Graphics (PEG), 1x Mini PCI Express Card, 4x 32 PCI HDA (High Definition Audio) adapter card Gigabit Ethernet Dual DVI-D ADD2 card 8x USB ATX power supply with cables AC97 compatible codec DVD drive HDA optional via connector USB Memory Stick 128 MByte 4x SATA, 1x PATA Cable set for IDE, SATA 4x COM, 1x LPT, 1x Floppy, PS2 kbd./mouse congatec software tools & Quick Installation Guide PCI display for download on our website: System speaker, Power button, Reset button, CMOS Battery www.congatec.com/ckit.html CRT connector, LVDS interface

ATX connector,12V/GND banana jacks

26 Battery Management for COM Express™ congatec Technology

SMART Battery Manager conga-SBM2C-Kit

Module This battery manager kit can be operated in conjunction with the congatec COM Express™ starter kit. Qseven conga-SBM²C is a complete battery manager sub system implemented as a plug in module. This COM Express™ When used together they provide a fast and simple way version supports 12V power line. of evaluationg all the features and configurations offered by the COM Express™ and conga-SBM2C modules. Contents: Supports battery configurations 2S1P up to 4S3P

Parallel battery operation (sequential on request) SMART Battery Manager Module conga-SBM2C S3 support (Suspend to RAM) SMART Battery LEDs provide a direct view of charging and battery Complete set of cables required for testing in conjunction capacity status with the conga-CEVAL evaluation carrier board Input voltage of 19V DC, with input power delimitation COM Express Output 12V / ~70W and 5V / ~30W, 5V Standby ~1W

Battery charging max. 17V, max. 3A total

Size 68 mm x 110 mm x 12.5 mm XTX / ETX

27 www.congatec.com COM Express™ Engineering Tools

conga-IVI Starterkit

The Low-Power Intel® In-Vehicle Infotainment (IVI) Reference Design (Low-Power Intel® IVI Reference Design) enables development of an OIP (Open Infotainment Platform) that addresses requirements for in-car operating conditions, as well as quality and reliability standards. The integrated platform incorporates a variety of IVI features and comes with complete schematics and bill of materials (BOM) to simplify development and speed time-to-market. Items:

Intel® Low Power IVI Reference Carrier Board + conga-CA Embedded CPU Module + Heatsink

Automotive system controller board supporting NEC V850

NEC 800x480 7" LVDS display with touch screen

Power supply 12V ~5A operating system

USB stick or DVDs from OS vendors

Slimline DVD drive

160 GByte disk drive

GPS Receiver (for USB connection)

BT and radio tuner antenna

Intel® Wireless WiFi Link PCIe Mini Card

Rear panel wiring harness plus system cables

28 congatec

conga-Cdebug conga-FPA2 Cooling Solutions

COM Express™ Debug Platform. The conga-Cdebug conga-FPA2 is a universal flat panel adapter board that congatec cooling solutions are available for all COM provides a debug platform for your application specific has been designed to be EPI (Embedded Panel Interface) Express modules. Technology carrier board. Simply use it as a transparent debug inter- compliant. It can be used for either prototyping, demon- face between your carrier board and the COM Express™ stration purposes, or for debugging certain issues. It may Heatspreader module. also serve as a reference for the implementation of panel Active cooling solution adaptations on customer specific carrier boards. Postcode display for LPC or PCI Passive cooling solution Multiple I/O Combinations LPC Firmware Hub Flash (FWH) Thermal stacks LVDS to TTL 2x SATA connector 18 and 24 Bit single-pixel support

Power connector for carrier board independent operation 18 and 24 Bit single/dual-pixel support Qseven

VGA Configuration Memory EPI compliant EEPROM for custom panel settings 2x USB Power Management Power and reset switch All typ. supply voltages selectable LED`s: Fully s/w controlled power sequencing • 4x GPIO status Backlight Connector: Supports most backlight converters conga-LDVI • 4x Command Byte Enable (CBE=PCI bus activity) Software controlled brightness adjustment Size 95 x 95 mm2 DVI Converter Module for LVDS

Compact module to convert LVDS to DVI-D. It can be used with either XTX™ or COM Express™ modules. It`s now

possible to realize a dual port DVI-D system independent COM Express conga-ADD2DP of the typical Video Output Ports (SDVO or DVO).

Add2 Card for DisplayPort

The conga-ADD2DP provides two DisplayPort and two HDMI interfaces when used in conjunction with the conga-CEVAL and the conga-BM45. XTX / ETX

29 www.congatec.com XTX™ - the concept

XTX™ is an expansion and continuation of the well established and highly successful ETX® standard. XTX™ offers the newest I/O technologies on this proven form factor. Now that the ISA bus is being used less and less in modern embedded applications, congatec offers different features on the X2 connector instead of the ISA bus currently found on the ETX® platform.

PCI Express Backwards Compatible to ETX® Identical Mechanics to ETX® In addition to the 32 bit parallel PCI bus, XTX™ XTX™ is 100% backwards compatible to the The size (95x114 mm), the mounting, the height, offers 4 PCI Express™ lanes. This allows the cus- ETX® standard. Most customer specific carrier the connectors and the heatspreader are exactly tomer to equip their embedded PC application boards will not require a redesign in order to use the same as defined in the ETX® specification. with next generation of PC performance. PCI congatec’s XTX™ modules. The additional XTX™ Existing ETX® solutions can easily switch to the Express™ is a low pin count interface with maxi- signals do not affect the onboard ISA functions. innovative XTX™ platform without any mechani- mum bandwidth per pin. This results in cost The ISA bus can be implemented through the cal change. optimization and very compact solutions with use of a PCI-ISA bridge on the customer specific the highest I/O performance. The scalable band- carrier board. As an alternative to this the cus- width is 2.5 GBit/s per lane and direction. tomer can use the readily available XTX™ LPC bus. Serial ATA Interfaces (SATA) SATA is an enhancement of the parallel ATA therefore offering higher performance. As a result of this enhancement the traditional restrictions of parallel ATA are overcome with respect to speed 4x PCI Express and EMI. 4x Serial ATA EIDE 1+2 ExpressCard™ 2x USB 2.0 Ethernet XTX™ supports up to two ExpressCard™ slots. (2x ExpressCard) SM Bus ExpressCard™ is the successor to PCMCIA. This High Definition Audio I²C Bus 400 kHz interface allows the use of USB 2.0 and PCI LPC Bus Speaker Express™ applications as well. X2 Ext. System Management Power Control X4 High Speed USB Fan Control Power Management XTX™ offers two additional USB 2.0 ports thereby increasing the total amount of USB ports available to 6. X1 PCI Bus VGA X3 4x USB 2.0 LPC Bus TV-Out As a replacement to the no longer supported ISA Mic In (Mono) LCD (LVDS or TTL) bus, XTX™ offers the LPC (Low Pin Count) bus. The Line In (Stereo) COM1+2 LPC bus corresponds approximately to a serialized Line Out (Stereo) IrDA ISA bus yet with a significantly reduced number of LPT/Floppy (shared) signals. Due to the software compatibility to the ISA bus, I/O extensions such as additional serial ports can be easily implemented using the LPC bus.

30 XTX™ - Product Overview congatec

XTX™ conga-X965 conga-X945 conga-XA945 conga-X915 conga-X855 conga-XLX Technology Formfactor ETX® with XTX™ Extensions ETX® with XTX™ Extensions ETX® with XTX™ Extensions ETX® with XTX™ Extensions ETX® with XTX™ Extensions ETX® with XTX™ Extensions Processor Intel® Core™ 2 Duo U7500 Intel® Celeron® M423 1.06 Intel® Atom™ N270, 1.6 GHz, Intel® Celeron® M 600 MHz Intel® Celeron® M 600 MHz AMD Geode™ LX800 1.06 GHz up to GHz up to 512 MByte cache, 533 MHz up to up to 500 MHz Intel® Core™ 2 Duo L7500 Intel® Core™ 2 Duo L7400 FSB, 45nm, 2.5W TDP Intel® Pentium® M 745 1.8 Intel® Celeron® M 1.0 GHz 128 kByte L2 cache 1.6 GHz 1.5 GHz GHz Chipset Intel® GME965 / ICH8-M Intel® 945GME / ICH7-M Intel® 945GME / ICH7-M Intel® 915GME / ICH6-M Intel® 852GM / ICH4 AMD Geode™ CS5536 Intel® 855GME / ICH4 DRAM max. 2 GByte DDR2 667 max. 2 GByte DDR2 667 max. 2 GByte DDR2 533 MHz max. 2 GByte DDR2 400 max. 1 GByte DDR333 max. 1 GByte DDR333 Mass storage 3x SATA 2x SATA 2x SATA 2x SATA 2x SATA 2x SATA

1x EIDE 1x EIDE 1x EIDE 1x EIDE 2x EIDE 2x EIDE Qseven Bus 4x PCI Express Lanes, PCI, 4x PCI Express Lanes, PCI, 4x PCI Express Lanes, PCI, 4x PCI Express Lanes, PCI, PCI, LPC, I²C PCI, LPC, I²C LPC, I²C LPC, I²C LPC, I²C LPC, I²C Ethernet 10/100BaseT 10/100BaseT 10/100BaseT 10/100BaseT 10/100BaseT 10/100BaseT I/O 2x ExpressCard support 2x ExpressCard support 2x ExpressCard support 2x ExpressCard support 6x USB 2.0 6x USB 2.0 6x USB 2.0 6x USB 2.0 6x USB 2.0 4x USB 2.0 Floppy / LPT Floppy / LPT Floppy / LPT Floppy / LPT Floppy / LPT Floppy / LPT 2x COM (TTL) 2x COM (TTL) 2x COM (TTL) 2x COM (TTL) 2x COM (TTL) 2x COM (TTL) Keyboard/Mouse Keyboard/Mouse Keyboard/Mouse Keyboard/Mouse Keyboard/Mouse Keyboard/Mouse Graphics integrated, EPI support integrated, EPI support integrated, EPI support integrated, EPI support integrated, EPI support integrated, EPI support max. Memory 256 MByte 224 MByte 224 MByte 128 MByte 64 MByte 254 MByte CRT/LVDS 2x24/TV- CRT/LVDS 2x24/TV- CRT/LVDS 2x24/TV- Panel Interface CRT/LVDS 2x24/2xSDVO CRT/ LVDS 2x24/DVO CRT/LVDS 1x18/TTL/TV-Out Out/2xSDVO Out/2xSDVO Out/2xSDVO COM Express max. FP Resolution 1920x1200 1920x1200 1920x1200 1920x1200 1600x1200 1024x768 Audio AC'97 digital audio AC'97 digital audio AC'97 digital audio AC'97 digital audio AC'97 digital audio AC'97 digital audio AC'97 Rev. 2.2 AC'97 Rev. 2.2 AC'97 Rev. 2.2 AC'97 Rev. 2.2 AC'97 Rev. 2.2 AC'97 Rev. 2.2 Line In, Line Out, Mic Line In, Line Out, Mic Line In, Line Out, Mic Line In, Line Out, Mic Line In, Line Out, Mic Line In, Line Out, Mic HDA digital audio HDA digital audio HDA digital audio HDA digital audio Power ACPI 2.0 w. Battery Support, ACPI 2.0 w. Battery Support, ACPI 2.0 w. Battery Support, ACPI 2.0 w. Battery Support, ACPI 2.0 w. Battery Support ACPI 2.0 w. Battery Support, Management S3 Support (Supend to RAM), S3 Support (Supend to RAM), S3 Support (Supend to RAM), S3 Support (Supend to RAM), APM 1.2 S3 Support (Supend to RAM) APM 1.2 APM 1.2 APM 1.2 APM 1.2 APM 1.2 Others Board Controller, TPM option Board Controller, TPM option Board Controller, TPM option Board Controller, TPM option Board Controller Board Controller XTX / ETX

31 www.congatec.com conga-X965 High Graphics Performance

Provides latest graphics Formfactor ETX® Spec 2.7. without ISA Support, XTX™ Extensions performance featuring the CPU Intel® Core™ 2 Duo U7500 1.06 GHz, (2M cache, 533 MHz FSB, 65nm) ® latest Intel GME 965 chipset Intel® Core™ 2 Duo L7500 1.6 GHz, (4M cache, 800 MHz FSB, 65nm) Intel® Celeron® M 550, 2.0 GHz, (1M cache, 533 MHz FSB, 65nm)

Intel® Core™ 2 Duo Processors DRAM SO-DIMM DDR2 667/PC 5300 up to 2 GByte up to 4 MByte L2 cache Chipset Graphics & Memory Controller Hub: Intel® GME965 I/O Controller Hub: Intel® 82801HBM (ICH8-M) I/O Controller: Winbond 83627HG Ethernet PHY: Intel® 82562

ACPI Battery Support, Ethernet IEEE 802.3u 100Base-Tx, Fast Ethernet compatible Flat Panel detection ... I/O Interfaces 4x PCI Express™ Lanes, 3x Serial ATA® (AHCI), 1x EIDE (UDMA-66/100), 2x Express Card® (uses 2x USB & 2x PCI Express), 6x USB 2.0 (EHCI), PCI Bus Rev. 2.3, no ISA Bus, LPC Bus, I²C (Fast Mode, 400 kHz, Multi Master), Floppy (Shared with LPT), LPT (EPP/ECP, Shared with Floppy), 2x COM Ports TTL Level, 1x IrDA Port, PS/2 Keyboard, Mouse

Sound AC‘97 Rev.2.2 Compatible, Line In, Line Out, Mic In, Digital High Definition Audio Interface with support for multiple audio codecs

Graphics Intel® Graphics Media Accelerator X3100 max. Resolution 2048 x 1536 (QXGA) @ 60Hz and 32bpp, 500MHz core render clock with Intel® Display Power Saving Technology (DPST 3.0), max. 384 MByte 64 Bit Video RAM (DVMT 4.0), Dynamic Display Modes for flat-panel, wide-screen and Digital TV support Two independent pipelines for full dual view support

Motion Video Support MPEG-2 Hardware Acceleration, High Definition Hardware Motion Compensation to support high definition hi-bitrate MPEG2 media playback, Up and Down Scaling of Video Content, High Definition Content Decode, HDTV (1080i/p) Support

Flat panel Interface Dual 112 MHz LVDS Transmitter, Supports all Support for 18 and 24 bit panels, VESA- and openLDI-Mappings, Resolution up to WUXGA (1920x1200 @ 60Hz), Automatic Panel Detection via EPI, (Embedded Panel Interface, based on VESA EDID™ 1.3)

CRT Interface 300 MHz RAMDAC

AUX Output 2x SDVO, True HDTV 1080p support

TV Out On ETX® X3 connector, Three integrated 10-bit DACs, True HDTV 1080p support

Security TPM 1.2/TCPA Security Functions, tor Hash, RSA, Keys and Random Numbers (optional)

Power Management ACPI 2.0 with Battery support

Operating Systems Microsoft® Windows® Vista™, Windows® XP, Windows® 2000, Windows® XP embedded, Windows® CE 5.0/6.0, LINUX, QNX

Power Consumption max. 30W @ 5V, CMOS Battery Backup

Temperature Operating: 0 .. +60°C Storage: -20 .. +80°C

Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond.

Size 95 x 114 mm² (3.7" x 4.5")

32 High Performance conga-X945 congatec

Formfactor ETX® Spec 2.7. without ISA Support, XTX™ Extensions Featuring the latest Intel® Core™ 2 Duo LV Processors up to 1.5 GHz CPU Intel® Core™ 2 Duo L7400 LV, 1.5 GHz, (4M cache, 667 MHz FSB, 65nm) Intel® Core™ 2 Duo U7500 ULV, 1.06 GHz, (2M cache, 533 MHz FSB, 65nm) Intel® Core™ Duo L2400 LV, 1.66 GHz, (2M cache, 667 MHz FSB, 65nm) Provides up to 2 GByte top of the Intel® Celeron® M440, 1.86 GHz, (1M cache, 533 MHz FSB, 65nm) Intel® Celeron® M423 ULV, 1.06 GHz, (1M cache, 533 MHz FSB, 65nm) line DRAM performance

DRAM SO-DIMM DDR2 667/PC 5300 up to 2 GByte ACPI Battery Support, Chipset Graphics & Memory Controller Hub: Intel® 945GME I/O Controller Hub: Intel® 82801GBM (ICH7-M)

I/O Controller: Winbond 83627HG Ethernet PHY: Intel® 82562 Flat Panel detection ... Technology

Ethernet IEEE 802.3u 100Base-Tx, Fast Ethernet compatible

I/O Interfaces 4x PCI Express™ Lanes, 2x Serial ATA® (AHCI), 1x EIDE (UDMA-66/100), 2x Express Card® (uses 2x USB & 2x PCI Express), 6x USB 2.0 (EHCI), PCI Bus Rev. 2.3, no ISA Bus, LPC Bus, I²C (Fast Mode, 400 kHz, Multi Master), Floppy (Shared with LPT), LPT (EPP/ECP, Shared with Floppy), 2x COM Ports TTL Level, 1x IrDA Port, PS/2 Keyboard, Mouse

Sound AC‘97 Rev.2.2 Compatible, Line In, Line Out, Mic In, Digital High Definition Audio Interface with support for multiple audio codecs

Graphics Enhanced 256 Bit 3D Video Controller, Intel® Graphics Media Accelerator 950, Up to 10.6 GB/sec memory bandwidth, 256-bit graphics core, max. 224 MByte 64 Bit Video RAM (DVMT 3.0), Dynamic Display Modes for flat-panel, wide-screen and Digital TV support Two independent pipelines for full dual view support Qseven Motion Video Support High Definition Hardware Motion Compensation to support high definition hi-bitrate MPEG2 media playback, Up and Down Scaling of Video Content, High Definition Content Decode, HDTV (1080i/p) Support

CRT Interface 400 MHz RAMDAC, Resolutions up to 2048x1536 @ 75 Hz, including 1920x1080 @ >85 Hz (HDTV)

AUX Output 2x SDVO

TV Out On ETX® X3 connector congatec Board Controller Multi Stage Watchdog, Non-volatile User Data Storage, Manufacturing and Board information, Board Statistics, BIOS Setup Data Backup, I²C (Fast Mode, 400 kHz, Multi Master), Power Loss Control

Embedded BIOS Features OEM Logo, OEM CMOS Defaults, LCD Control, (Auto Detection, Backlight Control), Serial Port Console Redirection, for Remote Setup and Installation, Flash Update, Based on AMIBIOS8® COM Express Security TPM 1.2/TCPA Security Functions, tor Hash, RSA, Keys and Random Numbers (optional)

Power Management ACPI 2.0 with Battery support

Operating Systems Microsoft® Windows® Vista™, Windows® XP, Windows® 2000, Windows® XP embedded, Windows® CE 5.0/6.0, LINUX, QNX

Power Consumption Typ. application: 10.5 W @ 5V, (1.66 GHz Core Duo), CMOS Battery Backup

Temperature Operating: 0 .. +60°C Storage: -20 .. +80°C

Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond.

Size 95 x 114 mm² (3.7" x 4.5") XTX / ETX

33 www.congatec.com conga-XA945 Low Power Consumption

Featuring Intel® Atom® processor Formfactor ETX® Spec 2.7. without ISA Support, XTX™ Extensions N270, 1.6 GHz CPU Intel® Atom™ processor N270, 1.6 GHz, 512kB cache, 533MHz FSB, 45nm, 2.5W TDP

High Graphics Performance DRAM SO-DIMM DDR2 667/PC5300 up to 2 GByte physical memory Chipset Graphics & Memory Controller Hub: Intel® 945GME I/O Controller Hub: Intel® 82801 GBM (ICH7-M) ® ACPI Battery Support, I/O Controller: Winbond 83627DHG Ethernet PHY: Intel 82562 Flat Panel detection ... Ethernet IEEE 802.3u 100Base-Tx, Fast Ethernet compatible I/O Interfaces 3x PCI Express™ Lanes, 2x Serial ATA® (AHCI), 1x EIDE (UDMA-66/100), 2x Express Card® (uses 2x USB & 2x PCI Express), 6x USB 2.0 (EHCI), PCI Bus Rev. 2.3, no ISA Bus, LPC Bus, I²C (Fast Mode, 400 kHz, Multi Master), Floppy (Shared with LPT), LPT (EPP/ECP, Shared with Floppy), 2x COM Ports TTL Level, 1x IrDA Port, PS/2 Keyboard, Mouse, Fan Control

Sound AC‘97 Rev.2.2 Compatible, Line In, Line Out, Mic In, Digital High Definition Audio Interface with support for multiple audio codecs

Graphics Enhanced 256 Bit 3D Video Controller, Intel® Graphics Media Accelerator 950, up to 10.6 GByte/sec memory bandwidth, 256-bit graphics core, max. 224 MByte 64 Bit Video RAM (DVMT 3.0), Dynamic Display Modes for flat-panel, wide-screen and Digital TV support Two independent pipelines for full dual view support

CRT Interface 400 MHz RAMDAC, Resolutions up to 2048x1536 @ 75 Hz, including 1920x1080 @ >85 Hz (HDTV)

AUX Output 2x SDVO

TV Out On ETX® X3 connector

Security TPM 1.2/TCPA Security Functions, tor Hash, RSA, Keys and Random Numbers (optional)

Power Management ACPI 2.0 with Battery support, suspend to RAM (S3)

Operating Systems Microsoft® Windows® Vista™, Windows® XP, Windows® 2000, Windows® XP embedded, Windows® CE 5.0/6.0, LINUX, QNX

Power Consumption Typ. application: <10 W @ 5V, see manual for full details, CMOS Battery Backup

Temperature Operating: 0 .. +60°C Storage: -20 .. +80°C

Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond.

Size 95 x 114 mm² (3.7" x 4.5")

34 Economy Model conga-X915 congatec

Formfactor ETX® Spec 2.7. without ISA Support, XTX™ Extensions Based on Intel® 915 chipset

CPU Intel® Pentium® M 745 1.8 GHz, 2 MByte cache, FSB 400 MHz ® ® Intel® Pentium® M 738 1.4 GHz, LV, 2 MByte cache, FSB 400 MHz Featuring Intel Pentium M Intel® Celeron® M 373 1.0 GHz, ULV, 512 k cache, FSB 400 MHz up to 1.8 GHz Intel® Celeron® M 600 MHz, ULV, 512 kByte cache, FSB 400 MHz (Intel® 910GMLE Chipset)

DRAM SO-DIMM DDR2 DDR400/PC3200 up to 2 GByte High definition Audio, Chipset Graphics & Memory Controller Hub: Intel® 915GME I/O Controller Hub: Intel® 82801FBM (ICH6-M) ACPI Battery Support, I/O Controller: Winbond 83627HG Ethernet PHY: Intel® 82562

Flat Panel detection ... Technology Ethernet IEEE 802.3u 100Base-Tx, Fast Ethernet compatible

I/O Interfaces 4x PCI Express™ Lanes, 2x Serial ATA® (AHCI), 1x EIDE (UDMA-66/100),2x Express Card® (uses 2x USB & 2x PCI Express), 6x USB 2.0 (EHCI), PCI Bus Rev. 2.3, no ISA Bus, LPC Bus, I²C Bus, 400 kHz, Floppy (Shared with LPT), LPT (EPP/ECP, Shared with Floppy), 2x COM Ports TTL Level, 1x IrDA Port, PS/2 Keyboard, Mouse

Sound AC‘97 Rev.2.2 Compatible, Line In, Line Out, Mic In, Digital High Definition Audio Interface with support for multiple audio codecs

Graphics Enhanced 256 Bit 3D Video Controller, Intel® Graphics Media Accelerator 900, 533 MHz Memory Clock, max. 128 MByte 64 Bit Video RAM (DVMT 3.0), Two independent pipelines for full dual view support

Motion Video Support Motion Compensation, Subpicture Support, Dynamic Bob & Weave, HDTV (1920x1080) Support Qseven Flat panel Interface Dual 112 MHz LVDS Transmitter, Supports all 1x18, 2x18, 1x24, 2x24 Bit, VESA- and openLDI-Mappings, Resolutions 640x480 up to 1920x1200, Automatic Panel Detection via EPI, (Embedded Panel Interface, based on VESA EDID™ 1.3)

CRT Interface 400 MHz RAMDAC, Resolutions up to 2048x1536 @ 75 Hz, (QXGA), including 1920x1080 @ >85 Hz (HDTV)

AUX Output 2x SDVO congatec Board Controller Multi Stage Watchdog, Non-volatile User Data Storage, Manufacturing and Board information, Board Statistics, BIOS Setup Data Backup, I²C (Fast Mode, 400 kHz, Multi Master), Power Loss Control

Security TPM 1.2/TCPA Security Functions, tor Hash, RSA, Keys and Random Numbers (optional)

Power Management ACPI 2.0 with Battery support

Operating Systems Microsoft® Windows® XP, 2000, Microsoft® Windows® XP embedded, Microsoft® Windows® CE 5.0, LINUX, QNX COM Express

Power Consumption Typ. application 6.5W @ 5V, (1 GHz Celeron® M), see manual for full details, CMOS Battery Backup

Temperature Operating: 0 .. +60°C Storage: -20 .. +80°C

Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond.

Size 95 x 114 mm² (3.7" x 4.5") XTX / ETX

35 www.congatec.com conga-X855 Economy Model

Full Featured Economy Model Formfactor ETX® Spec 2.7. without ISA Support, XTX™ Extensions

CPU Intel® Pentium® M 1.6 GHz, 1 MByte cache, FSB 400 MHz ® ® Featuring Intel Pentium M Intel® Pentium® M 738 1.4 GHz, LV, 2 MByte cache, FSB 400 MHz up to 1.6 GHz Intel® Pentium® M 1.1 GHz, 1 MByte cache, FSB 400 MHz (Value version utilizing Intel® Pentium® M 1.6 GHz @ 1.1 GHz) Intel® Celeron® M 373 1.0 GHz, ULV, 512 kByte cache, FSB 400 MHz Intel® Celeron® M 600 MHz, ULV, 512 kByte cache, FSB 400 MHz (eco version, with Intel® 852 GM chipset) ACPI Battery Support, DRAM SO-DIMM DDR333/PC2700 max. 1 GByte Flat Panel detection ... Chipset Graphics & Memory Controller Hub: Intel® 855 GME I/O Controller Hub: Intel® 82801DB (ICH4) I/O Controller: Winbond 83627HG Ethernet PHY: Intel® 82562

Ethernet IEEE 802.3u 100Base-Tx, Fast Ethernet compatible

I/O Interfaces 2x Serial ATA®, 2x EIDE (UDMA-66/100), 6x USB 2.0 (EHCI), PCI Bus Rev. 2.2, no ISA Bus, LPC Bus, I²C (Fast Mode, 400 kHz, Multi Master), Floppy (Shared with LPT), LPT (EPP/ECP, Shared with Floppy), 2x COM Ports TTL Level, 1x IrDA Port, PS/2 Keyboard, Mouse

Sound AC‘97 Rev.2.2 Compatible, Line In, Line Out, Mic In, AC’97 Digital Audio Interface

Graphics 3D Video Controller, Intel® Extreme Graphics®, max. 64 MByte 64 Bit UMA Video RAM (DVMT) Two independent pipelines for full dual view support

Motion Video Support Motion Compensation, Subpicture Support

Flat panel Interface 112 MHz LVDS Transmitter, Supports all 1x18, 2x18, 1x24, 2x24 Bit, VESA- and openLDI-Mappings, Resolutions 640x480 up to 1600x1200 Automatic Panel Detection via EPI, (Embedded Panel Interface, based on VESA EDID™ 1.3)

CRT Interface 350 MHz RAMDAC. Resolutions up to 2048x1536 @ 60 Hz (QXGA), incl. 1920x1080 @ 85 Hz (HDTV)

AUX Output Intel® compliant DVO Port (12 Bit DDR), Supports external DVI, up to 165 MHz Pixelclock (UXGA)

TV Out Optional via DVO port

congatec Board Controller Multi Stage Watchdog, Non-volatile User Data Storage, Manufacturing and Board information, Board Statistics, BIOS Setup Data Backup, Fast Mode, Multi Master I2C Bus, 400 kHz, Power Loss Control

Embedded BIOS Features OEM Logo, OEM CMOS Defaults, LCD Control (Backlight Control), Serial Port Console Redirection, for Remote Setup and Installation, Flash Update, Based on AMIBIOS8®

Power Management ACPI 2.0 with Battery Support

Operating Systems Microsoft® Windows® XP, Windows® 2000, Windows® XP Embedded, Windows® CE 5.0/6.0, LINUX, QNX

Power Consumption Typ. application 6.5W @ 5V , (0.6 GHz Celeron® M) see manual for full details CMOS Battery Backup

Temperature Operating: 0 .. +60°C Storage: -20 .. +80°C

Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond.

Size 95 x 114 mm² (3.7" x 4.5")

36 Entry Level Model conga-XLX congatec

Formfactor ETX® Spec 2.7. without ISA Support, XTX™ Extensions Entry level module based on AMD® Geode® LX800 CPU AMD Geode™ LX 800 Processor, 500 MHz, 400 MT/s memory bus speed, 128 kByte L2 Cache

DRAM SO-DIMM DDR333/PC2700 up to 1 GByte Low power consumption Chipset Companion Device: AMD Geode™ CS5536 Ethernet: Realtec RTL8100C I/O Controller: Winbond 83627HG Audio Codec: ALC658 ACPI 2.0, Battery Support, Ethernet IEEE 802.3u 100Base-Tx, Fast Ethernet compatible Flat Panel detection ...

I/O Interfaces 2x Serial ATA , 2x EIDE (UDMA-66/100), 4x USB 2.0 (EHCI), PCI Bus Rev. 2.1, LPC Bus, I²C (Fast Mode, 400 kHz, Multi Master), Technology Floppy (Shared with LPT), LPT (EPP/ECP, Shared with Floppy), 2x COM Ports TTL Level, 1x IrDA Port, PS/2 Keyboard, Mouse

Sound AC‘97 Rev.2.2 compatible, Line In, Line Out, Mic In, AC’97 digital audio interface

Graphics Integrated in chipset, Unified Memory Architecture (UMA), up to 254 MByte graphic memory space

Motion Video Support H/W Up- and Downscaling, High Definition digital video support, alpha blending and color keying

Flat panel Interface 68 MHz LVDS Transmitter Automatic Panel Detection via EPI (Embedded Panel Interface based on VESA EDID™ 1.3), 1x18 Bit TFT, resolutions 320x240 up to 1024x768, optional direct TTL interface

CRT Interface 350 MHz RAMDAC, Resolutions up to, 1920x1440x32bpp @ 85 Hz, 1600x1200x32bpp @ 100 Hz

TV Out Optional onboard TV encoder, supports HDTV (420p, 720p and 1080i), supports component- and s-video, signals on ETX X3 connector Qseven congatec Board Controller Multi Stage Watchdog, Non-volatile User Data Storage, Manufacturing and Board information, Board Statistics, BIOS Setup Data Backup,# I²C (Fast Mode, 400 kHz, Multi Master), Power Loss Control

Embedded BIOS Features OEM Logo, OEM CMOS Defaults, LCD Control, (Auto Detection, Backlight Control), Flash Update, Based on Insyde XpressROM

Power Management Typ. application 5W @ 5V see manuel for full details, ACPI 2.0 with Battery support, APM 1.2

Operating Systems Microsoft® Windows® XP, Windows® 2000, Windows® XP embedded, Windows® CE 5.0/6.0, LINUX, QNX

Power Consumption Typ. application 5W @ 5V see manual for full details, CMOS Battery Backup

Temperature Operating: 0 .. +60°C Storage: -20 .. +80°C

Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond.

Size 95 x 114 mm² (3.7" x 4.5") COM Express XTX / ETX

37 www.congatec.com XTX™ - Starterkits

conga-XEVAL conga-XKIT

Evaluation Board for XTX™ modules. To achieve a quick This complete kit provides the ability to start evaluating start with XTX™ congatec offers an evaluation carrier XTX™ modules immediately. board, which routes all the XTX™ signals to standard inter- Contents: face connectors. With this you`re able to check out all of the innovative XTX™ features and your specific expansions conga-XEVAL evaluation carrier board immediately. conga-Xdebug Post-Code and debug card

2x PCI Express conga-FPA1 flat panel adapter with cables

2x Express Card Socket ATX power supply with cables

4x 32 Bit PCI CD-ROM drive

1x LPT, 2x COM USB Memory Stick 128 MByte

1x PS/2 Keyboard and Mouse conga-XDVI DVI evaluation platform

10/100 Ethernet Cable set for IDE, SATA, Floppy Drives

6x USB (2 routed to Express Card Sockets) congatec software tools & Quick Installation Guide for download on our website: IrDA connector www. congatec.com/xkit.html COM3+4 via carrier board Super I/O

LPT2 via carrier board super I/O

4x SATA, 2x IDE (master/slave)

Audio: • Additional AC`97 Audio Codec • SPDIF optical • Line in/Out (stereo) • Mic in (mono)

38 XTX™ - Engineering Tools congatec

SMART Battery Manager Mini-ITX Carrier Board Module for XTX™ conga-SBM2 is a complete battery manager sub-system The conga-ITX/X is a full featured carrier in the form of a plug-in module. board for XTX™ and is the size of a Mini-ITX board. Technology

Support 2S1P up to 4S3P, parallel or sequential battery Formfactor Mini-ITX operation

S3 support (Suspend to RAM) Supported Modules all XTX™ Embedded Computer Modules Expansion Slots 1x PCI with ATX Riser extension, LEDs provide a direct view of charging and battery 1x PCI Express x1, capacity status 1x miniPCI Express

Input voltage of 19V DC, max. 4.5A with input power Ethernet 1x Gigabit Ethernet 10/100/1000 BaseT, delimitation 1x 10/100 BaseT

Output 5V, 7A and 12V, 2A Mass Storage 1x SATA,

Interface 1x EIDE Qseven Battery charging max. 17V, max. 3A 1x CompactFlash Socket

Size 68 mm x 95 mm x 12.5 mm I/O 4x USB at the front panel, 1x USB pin header 4x COM (1x front panel, 2x RS232 10 pin header, 1x TTL) 1x LPT, PS/2 Keyboard and Mouse, on board system speaker

Sound Line In, Line Out, Mic In at front panel conga-SBM2-Kit Video Analog VGA on front panel LVDS interface (EPI - Embedded Panel Interface) 34 pin 2 mm header This battery manager kit can be operated in Backlight connector, 10 pin 2.54 mm header conjunction with the congatec XTX™ starter CMOS battery on board lithium battery for CMOS backup and real time clock kit. When used together they provide a Battery Support all signals for ACPI battery support (conga-SBM²) at the feature con- fast and simple way of evaluating all nector the functionalities and configurations COM Express Power ATX standard power connector offered by the XTX™ and SBM2 modules. Contents: Fan 3 pin header, 12 V and tacho signal

Temperature Operating: 0 .. +60°C SMART Battery Manager Module conga-SBM2 Storage: -20 .. +80°C

SMART Battery Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond. Complete set of cables required for testing in conjunction Size 170 x 170 mm² (6.7" x 6.7") with the conga-XEVAL evaluation carrier board XTX / ETX

39 www.congatec.com XTX™ - Engineering Tools

conga-Xdebug Cooling Solutions

XTX™ Debug Platform. The conga-Xdebug provides a de- congatec cooling solutions are available for all XTX™ bug platform for your application specific carrier board. modules. Simply use it as a transparent debug interface between your carrier board and the XTX™ module. Heatspreader

Active cooling solution Postcode Display for LPC or PCI LPC Firmware Hub Flash (FWH) Passive cooling solution

1x SATA Connector Thermal stacks

Power connector for carrier board independant operation

VGA / Keyboard / Mouse / COM / USB

Power and Reset Buttons

LED`s • 4x GPIO Status • 4x Command Byte Enable (CBE) for PCI Bus activity

Size: 95 x 114 mm2

40 congatec Technology

conga-XDVI conga-LDVI conga-FPA2

Evaluation Platform to convert SDVO to DVI-D. The DVI Converter Module for LVDS conga-FPA2 is a universal flat panel adapter board that conga-XDVI provides the ability to evaluate the SDVO has been designed to be EPI (Embedded Panel Interface) features found on most of congatec`s XTX™ modules. Compact module to convert LVDS to DVI-D. It can be used compliant. It can be used for either prototyping, demon- Qseven It`s fully supported by the congatec Embedded BIOS. with either Qseven™, XTX™ or COM Express™ modules. It’s stration purposes, or for debugging certain issues. It may now possible to realize a dual port DVI-D system indepent of also serve as a reference for the implementation of panel SDVO to 2x DVI-D the typical Video Output Ports (SDVO or DVO). adaptations on customer specific carrier boards. • 2x Chrontel CH7307C Multiple I/O Combinations LVDS to TTL 18 and 24 Bit single-pixel support

18 and 24 Bit single/dual-pixel support

Configuration Memory EPI compliant EEPROM for custom panel settings

Power Management All typ. supply voltages selectable COM Express Fully s/w controlled power sequencing

Backlight Connector: Supports most backlight converters

Software controlled brightness adjustment XTX / ETX

41 www.congatec.com ETX® - the concept

ETX® was one of the very first Computer-On-Module concepts ever. It was defined in 1998 by JUMPtec as an open standard. ETX® is a well established and highly successful standard. It offers most standard PC I/O’s on a compact form factor.

PCI Bus Graphic Interfaces Upgrade to XTX™ The 32 bit parallel PCI bus can be utilized to Most ETX® modules are equipped with onboard Applications which do not utilize the ISA bus can control multiple I/O devices on the customized graphic controllers. Displays or monitors can be directly upgrade to XTX modules. The signals at carrier board. connected using VGA and LVDS signals. Some connectors X1, X3 and X4 are equal to ETX®. modules offer direct TTL signals as an alternative Only the signals at the X2 connector have been ISA Bus to LVDS. redefined in order to support PCI Express, SATA, The ISA bus is mainly used for slow speed devices. LPC and more. Existing ETX® carrier boards can Heatspreader easily be upgraded to take advantage of these Audio ETX® defines a heatspreader that covers the new and fast interfaces. Most ETX® modules offer onboard audio features. complete top side of the module and acts as a The ETX® specification defines a mono micro- thermal interface to the cooling solution within phone input and stereo line in and line out the application. All heat generating components analog signals. are thermally conducted to the heatspreader in order to avoid hot spots. High Speed USB ETX® offers four USB 2.0 ports.

I²C Bus Many embedded devices such as sensors, EIDE 1+2 converters or data storage can be connected to Ethernet the I²C bus interface. Due to the simple protocol SM Bus and the high availability of devices, the I²C Bus ISA Bus is a frequently used low speed bus interface in I²C Bus 400 kHz embedded applications. congatec understands Speaker this and therefore has chosen to offer 400 kHz X2 Power Control X4 multi-master I²C bus that provides maximum I²C Power Management bandwidth.

Ethernet X1 PCI Bus VGA X3 A 10/100 MBit Ethernet controller is already imple- 4x USB 2.0 TV-Out ® mented at the ETX module. All signals are con- Mic In (Mono) LCD (LVDS or TTL) nected to the customized carrier board utilizing Line In (Stereo) COM1+2 the high density board to board connectors. Line Out (Stereo) IrDA LPT/Floppy (shared)

42 ® ETX - Product Overview congatec Technology ETX® conga -ELX conga-E855 conga-ELX eco

Formfactor ETX® Rev. 2.7 ETX® Rev. 2.7 ETX® Rev. 2.7 Processor AMD Geode™ LX800 Intel® Celeron™ M 600 MHz AMD Geode™ LX800 500 MHz up to 500 MHz 128 kByte L2 cache Intel® Pentium® M 725 1.6 GHz 128 kByte L2 cache Chipset AMD Geode™ CS5536 Intel® 852GM / ICH4 AMD Geode™ CS5536 Intel® 855GME / ICH4 DRAM max. 1 GByte DDR333 max. 1 GByte DDR333 up to 256 MByte DDR onboard memory Qseven Mass storage 1x EIDE 2x EIDE 1x EIDE 1x CompactFlash Socket 1x CompactFlash Socket Bus ISA, PCI, I²C ISA, PCI, I²C ISA (via PCI2ISA Bridge), PCI, I²C Ethernet 10/100BaseT 10/100BaseT 10/100BaseT I/O 4x USB 2.0 4x USB 2.0 4x USB 2.0 Floppy / LPT Floppy / LPT LPT 2x COM (TTL) 2x COM (TTL) 2x COM (TTL) Keyboard/Mouse Keyboard/Mouse Keyboard/Mouse Graphics integrated, EPI support integrated, EPI support integrated, EPI support max. Memory 254 MByte 64 MByte 254 MByte Panel Interface CRT/LVDS 1x18/ CRT/ LVDS 2x24/DVO CRT/ LVDS 2x18 TTL/ TV-Out COM Express max. FP Resolution 1024x768 1600x1200 1024x768 Audio AC'97 Rev. 2.2 AC'97 Rev. 2.2 AC’97 Rev. 2.2 Line In, Line Out, Mic Line In, Line Out, Mic Line In, Line Out, Mic Power Management ACPI 2.0 APM 1.2 APM 1.2 APM 1.2 Others Board Controller Board Controller Board Controller XTX / ETX

43 www.congatec.com conga-E855 Full Featured ETX®

Full Featured Economy Model Formfactor ETX® Spec 2.7

CPU Intel® Celeron® M 373 1.0 GHz, ULV, 512 kByte cache, FSB 400 MHz ® ® Featuring Intel Pentium M Intel® Celeron® M 600 MHz, ULV, 512 kByte cache, FSB 400 MHz (eco version, with Intel® 852 GM chipset) up to 1.6 GHz DRAM SO-DIMM DDR333/PC2700 max. 1 GByte

Chipset Graphics & Memory Controller Hub: Intel® 855 GME I/O Controller Hub: Intel® 82801DB (ICH4) ACPI Battery Support, I/O Controller: Winbond 83627HG Ethernet PHY: Intel® 82562 Flat Panel detection ... Ethernet IEEE 802.3u 100Base-Tx, Fast Ethernet compatible

I/O Interfaces 2x Serial ATA®, 2x EIDE (UDMA-66/100), 4x USB 2.0 (EHCI), PCI Bus Rev. 2.2, ISA Bus, LPC Bus, I²C (Fast Mode, 400 kHz, Multi Master), Floppy (Shared with LPT), LPT (EPP/ECP, Shared with Floppy), 2x COM Ports TTL Level, 1x IrDA Port, PS/2 Keyboard, Mouse

Sound AC‘97 Rev.2.2 Compatible, Line In, Line Out, Mic In

Graphics 3D Video Controller, Intel® Extreme Graphics®, max. 64 MByte 64 Bit UMA Video RAM (DVMT) Two independent pipelines for full dual view support

Motion Video Support Motion Compensation, Subpicture Support

CRT Interface 350 MHz RAMDAC. Resolutions up to 2048x1536 @ 60 Hz (QXGA), incl. 1920x1080 @ 85 Hz (HDTV)

AUX Output Intel® compliant DVO Port (12 Bit), Supports external DVI, up to 165 MHz Pixelclock (UXGA)

TV Out Optional via DVO port ® congatec Board Controller Multi Stage Watchdog, Non-volatile User Data Storage, Manufacturing and Board information, Board Statistics, BIOS Setup Data Backup, I²C Bus (Fast Mode, 400 kHz, Multi Master) 400 kHz, Power Loss Control ETX Embedded BIOS Features OEM Logo, OEM CMOS Defaults, LCD Control (Backlight Control), Serial Port Console Redirection, for Remote Setup and Installation Flash Update, Based on AMIBIOS8®

Power Management ACPI 2.0 with Battery Support, APM 1.2

Operating Systems Microsoft® Windows® XP, Windows® 2000, Windows® XP Embedded, Windows® CE 5.0/6.0, LINUX, QNX

Power Consumption Typ. application 6.5W @ 5V , (0.6 GHz Celeron® M) see manual for full details , CMOS Battery Backup

Temperature Operating: 0 .. +60°C Storage: -20 .. +80°C

Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond.

Size 95 x 114 mm² (3.7" x 4.5")

44 Eco Model conga-ELX congatec

Formfactor ETX® Spec 2.7 Low power consumption

CPU AMD Geode™ LX 800 Processor, 400 MT/s memory bus speed, 128 kByte L2 Cache Featuring AMD® Geode® LX800 DRAM SO-DIMM PC2700 up to 1 GByte Chipset Companion Device: AMD Geode™ CS5536 Ethernet: Davicom DM9102D Up to 1 GByte DRAM I/O Controller: Winbond 83627HG Audio Codec: ALC203

Ethernet IEEE 802.3u 100Base-Tx, Fast Ethernet compatible

I/O Interfaces 1x EIDE (UDMA-66/100), primary, 1x IDE (PIO mode only), secondary 1x CompactFlash Socket onboard, 4x USB 2.0 (EHCI), Technology PCI Bus Rev. 2.1, ISA Bus, I²C (Fast Mode, 400 kHz, Multi Master), Floppy (Shared with LPT), LPT (EPP/ECP, Shared with Floppy), 2x COM Ports TTL Level, 1x IrDA Port, PS/2 Keyboard, Mouse

Sound AC‘97 Rev.2.2 compatible, Line In, Line Out, Mic In

Graphics Integrated in chipset up to 254 MByte graphic memory (UMA)

Motion Video Support H/W Up- and Downscaling, High Definition digital video support, alpha blending and color keying

Flat panel Interface 68 MHz LVDS Transmitter Automatic Panel Detection via EPI Embedded Panel Interface based on VESA EDID™ 1.3 1x18 Bit TFT resolutions 320x240 up to 1024x768 optional direct TTL interface

CRT Interface 350 MHz RAMDAC Resolutions up to 1920x1440x32bpp @ 85 Hz 1600x1200x32bpp @ 100 Hz

TV Out Optional onboard TV encoder supports HDTV (420p, 720p and 1080i) supports component- and Qseven s-video signals on ETX X3 connector congatec Board Controller Multi Stage Watchdog, Non-volatile User Data Storage, Manufacturing and Board information, Board Statistics BIOS Setup Data Backup, I²C (Fast Mode, 400 kHz, Multi Master), Power Loss Control

Embedded BIOS Features OEM Logo, OEM CMOS Defaults, LCD Control (Auto Detection, Backlight Control), Flash Update, ® Based on Insyde XpressROM Power Management APM 1.2 ETX Operating Systems Microsoft® Windows® XP, 2000, Microsoft® Windows® XP embedded, Microsoft® Windows® CE 5.0/6.0, LINUX, QNX

Power Consumption Typ. application 5W @ 5V, see manual for full details, CMOS Battery Backup

Temperature Operating: 0 .. +60°C Storage: -20 .. +80°C

Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond. COM Express

Size 95 x 114 mm² (3.7" x 4.5") XTX / ETX

45 www.congatec.com conga-ELXeco On-board DRAM

Eco version Formfactor ETX® Spec 2.7

CPU AMD Geode™ LX 800 Processor, 400 MT/s memory bus speed, 128 kByte L2 Cache ISA bus provided by PCI2ISA bridge DRAM Up to 256 MByte onboard DDR memory Onboard DRAM Chipset Companion Device: AMD Geode™ CS5536 Ethernet: Davicom DM9102D I/O Controller: Winbond 83627HG Audio Codec: ALC203 Featuring AMD® Geode® LX800 Ethernet IEEE 802.3u 100Base-Tx, Fast Ethernet compatible I/O Interfaces 1x EIDE (UDMA-33), 1x CompactFlash Socket onboard, 4x USB 2.0 (EHCI), PCI Bus Rev. 2.1, ISA Bus generated by PCI2ISA bridge, I²C (Fast Mode, 400 kHz, Multi Master), LPT (EPP/ECP) 2x COM Ports TTL Level, x IrDA Port, PS/2 Keyboard, Mouse

Sound AC‘97 Rev.2.2 compatible, Line In, Line Out, Mic In

Graphics Integrated in chipset up to 254 MByte graphic memory (UMA)

Motion Video Support H/W Up- and Downscaling, High Definition digital video support, alpha blending and color keying

Flat panel Interface 68 MHz LVDS Transmitter Automatic Panel Detection via EPI Embedded Panel Interface based on VESA EDID™ 1.3 1x18 Bit TFT resolutions 320x240 up to 1024x768

CRT Interface 350 MHz RAMDAC Resolutions up to 1920x1440x32bpp @ 85 Hz 1600x1200x32bpp @ 100 Hz

congatec Board Controller Multi Stage Watchdog, Non-volatile User Data Storage, Manufacturing and Board information, Board Statistics BIOS Setup Data Backup, I²C (Fast Mode, 400 kHz, Multi Master), Power Loss Control

Embedded BIOS Features OEM Logo, OEM CMOS Defaults, LCD Control (Auto Detection, Backlight Control), Flash Update, Based on Insyde XpressROM

® Power Management APM 1.2 Operating Systems Microsoft® Windows® XP, 2000, Microsoft® Windows® XP embedded, Microsoft® Windows® CE 5.0/6.0, LINUX, QNX

ETX Power Consumption Typ. application 5W @ 5V, see manual for full details, CMOS Battery Backup

Temperature Operating: 0 .. +60°C Storage: -20 .. +80°C

Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond.

Size 95 x 114 mm² (3.7" x 4.5")

46 ® ETX - Engineering Tools congatec Technology conga-EVAL conga-FPA2 Cooling Solutions

Evaluation Board for ETX® modules. To achieve a quick start conga-FPA2 is a universal flat panel adapter board that congatec cooling solutions are available for all with ETX® congatec offers an evaluation carrier board, which has been designed to be EPI (Embedded Panel Interface) ETX® modules. routes all the ETX® signals to standard interface connectors. compliant. It can be used for either prototyping, demon- With this you‘re able to check out all of the ETX® features and stration purposes, or for debugging certain issues. It may Heatspreader your specific expansions immediately. also serve as a reference for the implementation of panel Active cooling solution Qseven adaptations on customer specific carrier boards. ISA Bus 3 Slots, PCI Bus 4 Slots Passive cooling solution Multiple I/O Combinations 1x LPT, 2x COM Thermal stacks LVDS to TTL 1x PS/2 Keyboard & Mouse 18 and 24 Bit single-pixel support

10/100 Ethernet Configuration Memory EPI compliant EEPROM for custom panel settings LVDS, TVout Power Management CompactFlash all typ. supply voltages selectable 4x USB fully s/w controlled power sequencing

2x IDE (master/slave) Backlight Connector: Supports most backlight converters COM Express Audio Software controlled brightness adjustment • Line In/Out (stereo) • Mic In (mono) XTX / ETX

47 www.congatec.com Headquarter: Subsidiaries: congatec AG congatec AG Asia Pacific congatec, Inc. congatec s.r.o. Auwiesenstraße 5 11F-2, 341, Sec 4, 2187 Newcastle Ave, Suite 201 Brojova 16 94469 Deggendorf, Zhong Xiao E. Rd. Cardiff by the Sea, PSČ 326 00 Plzeň Germany 106 Taipei City, Taiwan CA 92007 USA Czech Republic Phone +49 (991) 2700-0 Phone +886 2 2775 4645 Phone +1 760-635-2600 Fax +49 (991) 2700-111 Fax +886 2 2775 3263 Fax +1 760-635-2601 [email protected] [email protected] [email protected] www.congatec.de www.congatec.tw www.congatec.us