PC/104 and Small Form Factors Buyer’S Guide Implementing an Integrated High Availability and Network Management System November 19, 1 P.M

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Volume 12 • Number 5

COLUMNS FEATURES 54 Editor’s Insight SPECIAL: The latest in Redefining ‘anywhere’ By Don Dingee small form factors 8 SUMIT technology balances high- and low-speed I/O By Bob Burckle and DEPARTMENTS Colin McCracken, SFF-SIG 26-27 Editor’s Choice Products By Don Dingee APPLICATION: Graphics and HMI 14 UGM: Small, scalable graphics modules meet universal EVENTS embedded needs By Matthias Huber, Kontron embedded world March 3-5, 2009 • Nuremberg, Germany 23 Rugged display here, computer www.embedded-world.de somewhere over there By Nigel Dickens, Adder For Single Print Only

BUYER’S GUIDE: E-CASTS 30 2009 PC/104 and Small Form Factors Buyer’s Guide Implementing an integrated high availability and network management system November 19, 1 p.m. EST E-LETTER Enterprise software in embedded applications December 4, 2 p.m. EST Winter: www.smallformfactors.com/eletter  PC/104 ecosystem: Total system design and evolution Register at www.opensystems-publishing.com/ecast By Dr. Paul Haris, Chairman, PC/104 Consortium  Ongoing checkups diagnose system defects On the cover: By Hermann Strass, European Representative In a CGI rendering showing a whole different scale, the vision for  Tiny, low-power COM leaves legacy interfaces behind the Madinat al-Hareer development in Kuwait is shown as it might By Matthias Fellhauer, LiPPERT Embedded Computers appear in a night aerial view. The “City of Silk,” a complex of four cities opposite Kuwait City, is targeted for the world’s tallest structure  Info on the go, rugged by design as one of its highlights. (Photo courtesy Civic Arts, Eric R. Kuhne & By Stephen Cunha, MEN Micro Associates, www.civicarts.com. More information available at www.madinat-al-hareer.com.) WEB RESOURCES Published by: Subscribe to the magazine or E-letter

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4 / Winter 2008 PC/104 and Small Form Factors For Single Print Only ADVERTISER INFORMATION

Page Advertiser/Ad title 17 A CCES I/O Products, Inc. – Boldly go where no system has gone 12 Advantech Corporation – Performance and reliability 26 AIM-USA – 1553 & 429 embedded Milita r y interfaces EMBEDDED SYSTEMS 10 congatec – Highscore for COM Express 36 Connect Tech Inc. – Whatever you need Military & Aerospace Group 2 Diamond Systems Corporation – Chris Ciufo, Group Editorial Director Hermann Strass, European Representative 5 things you’ll love [email protected] [email protected] 34 DIGITAL-LOGIC AG – The Atom based PCI/104-Express board Don Dingee, Contributing Editor Konrad Witte, Senior Web Developer 44 EMAC, Inc. – System on Module [email protected] Matt Avella, Web Content Specialist 30 embedded world – embedded world 2009 Jennifer Hesse, Senior Associate Editor 3 Eurotech Inc. – Eurotech platforms [email protected] Steph Sweet, Creative Director optimized for Intel Atom Joann Toth, Senior Designer 39 Eurotech Inc. – ISIS Sharon Schnakenburg, Associate Editor [email protected] 33 Excalibur Systems, Inc. – Dragons fly David Diomede, Art Director Terri Thorson, Senior Editor (columns) 52 ICOP Technology, Inc. – Lowest power Phyllis Thompson consumption [email protected] Circulation/Office Manager 9 Innovative Integration – [email protected] Instrumentation unleashed Robin DiPerna, Assistant Editor 19-22 Intel – Rethink cool 7 Jacyl Technology Inc. – XG-5000K Sales Group 43 Kontron – Engineering beyond low power Dennis Doyle, Senior Account Manager Regional Sales Managers 52 Lavacore, Inc. – PC/104-Plus FPGA [email protected] Ernest Godsey, Central and Mountain States modules [email protected] 16 LiPP ERT Embedded Computers – Tom Varcie, Senior Account Manager Reduce energy cost [email protected] Barbara Quinlan, Midwest/Southwest [email protected] 38 Logic Supply – Compact, fanless, solid Doug Cordier, Account Manager 5 Micro/sys, Inc. – Dreaming of embedded [email protected] Denis Seger, Southern California super powers [email protected] 25 MPL AG – Rugged 5 port manageable Andrea Stabile Gigabit Ethernet Advertising/Marketing Coordinator Sydele Starr, Northern California 46 PQI Corporation – The flash storage [email protected] [email protected] Print Only leader Christine Long, E-marketing Manager Ron Taylor, East Coast/Mid Atlantic 37 R adian Heatsinks – This may keep [email protected] [email protected] you cool 42 Radicom Research, Inc. – PC/104 modem International Sales Reprints and PDFs 25 R AF Electronic Hardware – Dan Aronovic, Account Manager – Israel Your electronic hardware source [email protected] Nan Lamade 28-29 RT D Embedded Technologies, Inc. – Sam Fan, Account Manager – Asia 800-259-0470 HighRel PC/104 ISA & PCI [email protected] [email protected] 55 RT D Embedded Technologies, Inc. – powerMiser AMD Geode LX 42 SCIDYNE – Analog and digital for PC/104 Editorial/Business Office 53 servo- Halbeck GmbH – POSYS motion 16626 E. Avenue of the Fountains, Ste. 203 Vice President Editorial: Rosemary Kristoff controllers Fountain Hills, AZ 85268 32 SFF-SIG – What is the SFF-SIG? Tel: 480-967-5581 n Fax: 480-837-6466 Vice President Marketing & Sales: Website: www.opensystemsmedia.com Patrick Hopper 15 T echnologic Systems – 7" touch panel [email protected] computer Publishers: John Black, Michael Hopper, 24 T oronto MicroElectronics, Inc. – Wayne Kristoff Business Manager: Karen Layman Peripherals 27 Toronto MicroElectronics, Inc. – DVR301 ISSN: Print 1096-9764, ISSN Online 1550-0373 45 T oronto MicroElectronics, Inc. – PC/104-P3 PC/104 and Small Form Factors is published five times a year by OpenSystems Media, 13 Tri-M Systems Inc. – PC/104 FlexTainer 16626 E. Ave of the Fountains, Ste 203, Fountain Hills, AZ 85268. Subscriptions are free upon request to persons interested in PC/104 and other small form factor single board computer technology. 18 Tri-M Systems Inc. – Intel Pentium M 745 For others inside the US and Canada, subscriptions are $35/year. For 1st class delivery outside the 49 V ector Electronics & Technology, Inc. – US and Canada, subscriptions are $50/year (advance payment in US funds required). Forward thinking 40 VersaLogic Corp. – Exceptional service Canada: Publication agreement number 40048627. Return address WDS, Station A, PO Box 54, Windsor, ON N9A 615 50 VIA Technologies, Inc. – Pico-ITXe 11 WDL Systems – The power inside POSTMASTER: Send address changes to PC104 and Small Form Factors tomorrow’s technology 16626 E. Ave. of the Fountains, Ste 203, Fountain Hills, AZ 85268 56 WinSystems, Inc. – -40° to +70°C Fanless

6 / Winter 2008 PC/104 and Small Form Factors For Single Print Only SPECIAL The latest in small form factors

SUMIT technology balances high- and low-speed I/O

By Bob Burckle and Colin McCracken

Bob and Colin examine a new space-saving SBC expansion interface and explain how to apply its flexible buses to meet a variety of low-power application requirements. For Single Print Only t’s never a good idea to paint your- has plenty of bandwidth headroom to to transition away from the space- self into a corner. Yet that’s exactly exceed requirements for 2009-2010 chip- consuming ISA bus. The SUMIT Type B Iwhat embedded designers tend to do set interfaces, enabling 7-10 years or more connector adds another PCI Express when faced with supporting various I/O of product availability. x1 lane plus a x4 lane, which aligns well interfaces in creating a flexible prod- with VIA’s new VX800 chipset for Nano uct. Whether stacking boards or cabling Under the hood and C7 processors. between the SBC and intelligent periph- SUMIT is defined as two 52-pin high- erals, I/O demands can be complex. density (0.635 mm pitch) connectors The SUMIT-AB configuration with center ground blades for impedance, shown in Figure 1 targets This challenge initiated the genesis of EMI, and DC ground return purposes. storage/RAID, Stackable Unified Module Interconnect Each connector is optional depending on networking, Technology (SUMIT) from the Small Form the SBC’s target applications. surveillance/camera, Factor Special Interest Group (SFF-SIG). data acquisition, SUMIT (pronounced “sum-it”) is an The SUMIT Type A connector contains automation, and electromechanical connector specifica- one PCI Express x1 lane, three USB scientific applications. Figure 1 tion that efficiently integrates high- and ports with a global overcurrent signal, a low-speed serial and legacy expansion Low Pin Count (LPC) bus for expansion buses for next-generation, low-power serial ports and other legacy I/O, a Serial Good things in small packages embedded systems. Peripheral Interface (SPI), and a general- The new Pico-ITXe Specification purpose I2C bus typically connected to (“e” for PCI Express) from SFF-SIG Rather than defining a board form factor, the System Management Bus (SMBus) exemplifies the extreme integration SUMIT specifies an enabling connec- for x86 chipsets. This means that a advancing the state of the art in small tor technology that can be implemented single 52-pin connector, SUMIT-A, maps form factors. Instead of using con- easily across standard and custom SBCs. perfectly to Intel’s Atom processor and ventional 0.1", 2 mm, or 1.25 mm pin headers for I/O exclusively, SUMIT’s SUMIT emphasizes cost per pin, pin System Controller Hub. 0.635 mm pitch (pin spacing) allows density, and signal integrity through the the entire complement of I/O and connector, using much less board space All of these low-speed buses enable those expansion buses to fit, as shown on the than previous solutions. The rugged, cost- using simple I/O for tasks like switch- front edge of the board in Figure 1. effective, and easy-to-assemble connector ing on relays or low-rate data acquisition

8 / Winter 2008 PC/104 and Small Form Factors For Single Print Only SPECIAL The latest in small form factors

Migrating low-speed I/O that multiple modest-speed boards can SUMIT offers several ways to move low- talk to each other without excessive bus speed I/O from the aging ISA bus to the bridges that impact BIOS and operating space-efficient buses integrated into new systems and consume extra power. chipsets. Because SUMIT can coexist with existing ISA-based connectors with- With its long-time usage in microcontrol- out occupying the same board location, the ler, RISC, and DSP markets, SPI already I/O community can redesign all existing has a rich ecosystem of low-cost control- I/O cards at once – a transition that would lers and peripherals from large suppliers have normally taken years to complete. such as National Semiconductor, Texas Instruments, and Freescale Semiconductor. SPI is a welcome addition to the x86 “SUMIT offers several design community. ways to move low-speed As shown in Figure 2, the host SBC contains a SPI controller and generates the I/O from the aging ISA SPI clock, Data Out (DO), and decode lines (chip selects CS0# and CS1#) for bus to the space-efficient two external devices. The selected external device serially shifts data out based buses integrated into on active low CS line and CLK. The host, which contains a serial shift register new chipsets.” to present the next bit, toggles the clock for the target device to latch it. Data can be transmitted in both directions con- SPI and I2C have been used with micro- currently, known as duplex, with simple controllers and RISC processors for years application software. In this setup, 5 Mbps and are now gaining a foothold in the of data throughput is easily achievable x86 arena. LPC is a third alternative for without the expensive bus bridges and PC-style legacy I/O, especially serial ports, BIOS changes required when bridging parallel ports, and PS/2 keyboard and from PCI or PCI Express. Furthermore, Formouse. Bridging from LPC to ISASingle offers 50 Mbps speeds and beyond are possible Print Only most of the needed functionality to reuse in low-cost FPGA implementations. standard and custom I/O cards at a much lower cost than PCI-to-ISA bridging. I2C reaches out to more devices The I2C topology is already widely used A “SPI” in the midst in the x86 architecture. SMBus, an I2C SPI allows multiple ICs to communicate subset interface, is at the heart of low- with each other in a space-efficient man- level control for power management and ner. As applied to SUMIT, this also means system monitoring functions on every PC,

SUMIT expansion interface A/D I/O card #2 CS1# CLK DO DI

DSP I/O card #1 CS0#

SPI SBC master

Figure 2

10 / Winter 2008 PC/104 and Small Form Factors For Single Print Only SPECIAL SUMIT The latest in small form factors expansion interface I2C Sensors workstation, and server manufactured today. SMBus is routed to clock genera- tors, memory sockets, and temperature CLK sensors to handle low-speed functions DATA such as initialization, system manage- ALERT# ment, and monitoring. I2C Battery controller

Data Display Channel (DDC) is another I2C interface included on virtually every PC. Commonly called “plug-and-play,” a Pull-up I2C displays interface’s (VGA, LVDS, SDVO, SBC and similar) timing parameters, reso- controller lution, and color depth are serially loaded from the display device and used to Figure 3

configure the graphics controller properly and automatically.

I2C uses a 3-wire bus and is similar to SPI in that data is shifted serially. However, I2C’s data line is a single bidirectional pin, which limits the throughput compared to SPI. Unlike SPI, interrupts can be generated by the shared ALERT# line (see Figure 3). Also, instead of having separate decodes (chip selects) for target devices, I2C embeds a device address within the serial shift string. With an 8-bit address, up to 256 devices can be addressed, far beyond what is practi- cal with SPI. The only trick is to avoid For Singleaddress conflicts between devices, as off- Print Only the-shelf ICs have built-in addresses that are sometimes settable with a register and other times hardwired.

At their discretion, designers can choose between routing SMBus to SUMIT’s I2C interface or creating a dedicated I2C controller. This design can be used in many applications, such as smart sensors with local processing, storage, and network interfaces. Another usage combines a dedicated I2C controller with the ALERT# support for a smart battery controller to prevent overcharging a battery. This approach enables wearable computers, inventory logistics, communications, and other portable devices based on SUMIT.

LPC rounds out the I/O The LPC bus can completely replace the ISA bus. Memory, I/O, DMA, and interrupts are fully supported by the standard. This multiplexed bus greatly reduces space and pin count for BIOS firmware and legacy super I/O devices. Only 16-bit ISA accesses were not implemented in LPC, instead replaced with back-to-back 8-bit cycles and 4x faster clock speed, as compared to ISA.

12 / Winter 2008 PC/104 and Small Form Factors SUMIT expansion interface

ISA bridge Bridge card AD0-AD3 SERIRQ# FRAME# CLK PRSNT# UART x4 I/O card

Pull-up LPC SBC controller

Figure 4

Figure 4 depicts the LPC architecture Interface solidarity as used in SUMIT. Command, address, Flexible and simple to use, the SUMIT and data are multiplexed on four lines specification breaks the conventional and four cycles at 33 MHz instead of wisdom that a single primary bus or even an inefficient 8.25 MHz bus. Although two buses must be used for SBC-based originally used for motherboard de- expansion. vices, SUMIT takes LPC off-board for optional use, allowing applications that Because SUMIT defines two connectors require legacy PC peripherals to plug in and their respective signal assignments, it a module and those that don’t to forgo does not define a specific board size. Only the additional cost and space burdens. To the relative placement of one connector to reduce power and EMI, the host SBC can the other is specified to ensure mechani- implement the card present line with a cal compatibility and proper signal rout- pull-up resistor and shut off the 33 MHz ing. The interface is compact enough to clock if no cards are present to ground meet a broad range of space- and power- the signal. Forconscious application requirements. Single Print Only SMSC, Winbond, Fintek, and other ven- With a goal of unifying expansion inter- dors supply chips that directly interface faces across many different SBC form to the LPC bus. Embedded controllers for factors and I/O types, SUMIT has the smart battery management or other uses potential to consolidate I/O ecosystems, can be implemented easily on the LPC thereby improving economies of scale for bus. In addition, LPC-to-ISA bridges I/O and benefiting the embedded market allow direct reuse of existing ISA cards as a whole. ➤ using the serial interrupt line (SERIRQ#) shown in Figure 4. Complex program- Bob Burckle is mable logic devices and FPGAs give a member of the designers an easy way to interface custom SFF-SIG Board logic to LPC. of Directors.

Balancing high-speed I/O Because all of these buses occupy different connector pins, I/O cards can be comingled, providing the convenience of easy, low-speed interfacing and some Colin McCracken muscle to boot. is cofounder of the SFF-SIG and an With one PCI Express lane in SUMIT-A industry consultant and two more lanes in SUMIT-B, high- on small form factors. speed devices such as frame grabbers, FireWire ports, RAID controllers, second- SFF-SIG ary graphics controllers (PCI Express x1 408-480-7900 or x4), and GbE are easy to attach without [email protected] • www.sff-sig.org bulky connectors.

PC/104 and Small Form Factors Winter 2008 / 13 APPLICATION Graphics and HMI

UGM: Small, scalable graphics modules meet universal embedded needs

By Matthias Huber For Single Print Only Demand for high-end embedded modular graphics has increased dramatically across an array of applications such as medical and industrial imaging, gaming and entertainment, and Point-Of-Service/Point-Of-Information (POS/POI) terminals. This drive is fueling the quest for custom high-end graphics capabilities that can meet scalability, size, reliability, and long product life-cycle requirements Enhanced graphics easily for embedded applications – the same needs that the Universal Graphics Module exchanged (UGM) specification aims to fulfill. Kontron and XGI Technology Inc. unveiled the UGM 1.0 specification as an open standard in June 2007. The speci- oday’s embedded systems designers Furthermore, most conventional graphics fication, which outlines electrical and must control and feed more high- cards must be installed on the system mechanical characteristics and provides Tend displays with massive amounts baseboard at a 90° angle, which uses a recommended layout, is now freely of information without sacrificing 3D excessive space and opens up additional available to third-party vendors. The graphics performance. Enabling this level points for failure. These cards’ active forthcoming UGM interest group will of capability within an embedded design cooling designs can also pose problems control future specifications and use of poses a number of challenges, given that when simplified cooling is needed. To the UGM brand. standard graphics add-on cards often con- compound matters, all of these design flict with critical requirements such as challenges can lead to delays in bringing UGM supplies monitors with an up-to- compact size, reliability, and longevity. products to market. date range of high-end graphics card signals. The specification defines an 84 mm Boards intended for the consumer mar- Unfortunately for designers, powerful x 95 mm universal graphics interface that ket typically have short life cycles and graphics cards optimized for embed- fulfills the requirements for high reli- contain parts that are often discontinued ded designs simply do not exist. How- ability and a flexible connector design within a few months. These boards can ever, compact graphics controller cards to exchange and replace graphics mod- incur significant expenditures as a result that augment the abilities of integrated ules easily across different PCI Express of frequent driver updates, extremely high graphics such as those found in many systems. This concept is similar to the power consumption (up to as much as Intel advanced chipsets can resolve these COM Express standard, which uses a 150 W), and limited Mean Time Between design challenges and allow for future rugged AMP/Tyco connector to hook up Failure (MTBF) due to fan failures. design flexibility. to a PCI Express x16 port.

14 / Winter 2008 PC/104 and Small Form Factors As illustrated in Figure 1, UGM cards flat and scalable design, but also ensures receive PCI Express signals and video signal integrity and minimizes failures. signals via the connector’s 220 pins over Because the UGM specification is based 1, 4, 8, or 16 lanes. The UGM card pro- on the PICMG-defined COM Express cesses the signals using video capture standard, UGMs should have a height functions and up to 512 MB of DRAM. It of 13 mm, including the PCB. Figure 2 then delivers the converted signals back to shows the height restrictions for the the baseboard via the same 220-pin con- top and bottom, including the height of nector. For playback devices, the UGM cooling and/or components (without the specification supports dual Low Voltage connector). Differential SCSI (LVDS), dual Transi- tion Minimized Differential Signaling UGM includes tested and reliable graphics (TMDS), dual Cathode Ray Tube (CRT), drivers with at least 3-5 years of avail- and TV-out. ability. Because the graphics processing core is finished and all necessary drivers Unlike conventional graphics cards that are are already implemented in the specifica- plugged into the baseboard at a 90° angle, tion, designers can quickly add graphics UGM cards are connected to the base- functions to customized designs, reduc- board in a parallel fashion. This not only ing the effort required for graphics layout saves space and allows for an extremely and BIOS development. All they have 95.00 95.00

84.00 84.00

DRAM Clock DVI-B Interface

DVI-A Interface X’TAL GDDR 1/2/3 TV Interface DRAM ForMemory Clock Single Print Only CRT Interface GPU Chip

LVDS Interface DDR DRAM Interface

PCI Express Interface 1.8 V DRAM Power

UGM 220-Pin Connector nterface Serial Flash SPI BUS ROM MISC. Power VCORE Power Power 12 V ~ 22 V Power Rail Power Transfer Power

Figure 1

13 mm

Heat spreader Top Layer Components

PCB 0 mm

10 mm Bottom Layer Components -3 mm connector area

Figure 2 For Single Print Only APPLICATION Graphics and HMI

to do is allocate the appropriate circuits, DisplayPort and LVDS/TMDS on the high-end ATI products to the embedded plugs, and peripheral components needed same pinouts. Other improvements include market, announced its support for the UGM for additional features, such as High- heightened definition of PCI Express standard in August 2008. With AMD’s bandwidth Digital Content Protection TX/RX to remove any potential confu- long-life ATI product portfolio and experi- (HDCP) to display protected high- sion regarding the sink and source as well ence providing innovative display technol- resolution video material. On the carrier as holes for standard-sized M2.5 screws ogy, this decision is expected to accelerate board, designers can decide which signal that enable easier mounting on the carrier acceptance of the UGM standard. combinations will ultimately be made board. With these upgrades, UGM can available to the external connection. For support extremely high frame rates and Module generates example, a combination of sound, USB, graphics optimization algorithms. realistic graphics Digital Visual Interface Integrated (DVI-I), Kontron introduced the first modular and Video Graphics Array (VGA) can AMD’s Embedded Display Group, which graphics card based on UGM in June 2007. be implemented via the High-Definition is responsible for delivering the company’s The Kontron UGM-M72 uses the ATI M72 Multimedia Interface (HDMI).

“UGM revision 1.1 optimizes system design and reduces costs by defining the height of UGM graphics- on-modules in accordance with the COM Express specification ...”

UGM also eliminates the need for cables. This differs from standard graphics cards For Single Print Only in which interfaces are led out via break- out cables because the narrow expansion card slot brackets do not offer enough room for external interfaces.

Upgrades increase performance, speed Kontron published an updated version of the UGM standard in July 2008. UGM revision 1.1 optimizes system design and reduces costs by defining the height of UGM graphics-on-modules in accordance with the COM Express specification, allowing designers who work with COM Express modules and UGM graphics-on-modules to use a single heat sink for each design. The result is an extremely flat solution that maintains COM scalability within the design as well as reduces development and production costs for fast time to market.

This revision retains all the benefits of the original specification and adds support for dual-link TMDS, doubling the transmis- sion power and providing greater speed and bandwidth for higher resolutions. UGM revision 1.1 also includes enhanced DisplayPort mapping, which implements

PC/104 and Small Form Factors Winter 2008 / 17 APPLICATION Graphics and HMI

chip, which is based on AMD’s flagship ATI R600 Graphics Processing Unit (GPU), with a variable clock speed of 450-700 MHz. The ATI M72 GPU features AMD’s Unified Shader Architecture for advanced vertex and pixel processing. This architecture leverages several different flexible processors that can be scheduled to process a variety of shader types, thereby significantly increasing GPU throughput.

This module can enable full HD visualiza- tion with smooth surfaces, sharp images, and high color fidelity for very realistic graphics. Fully hardware-decoded streams Figure 3 up to 1920 x 1080 pixel resolution are supported by 512 MB/128-bit/500-800 MHz of dual-display support (1x analog and GDDR3. To control more than two dis- 1x LVDS) from the chipset, designers can plays independently, the module allows expand the system’s graphics capabilities PCI Express to be shared with several by adding a UGM, which retains LVDS graphics modules. High-end PEG fea- and analog graphics signals and adds two tures include support for DirectX 10.0 DVI signals. Thus, the system can drive and Shader Model 4.0 to accelerate the four displays from the single system via latest high-end 3D graphics for Windows the UGM. Vista Aero and beyond. A Universal Video Decoding (UVD) engine offers BluRay The UGM specification will continue to support. This high level of integrated 3D evolve as new suppliers join the UGM and video performance significantly helps Consortium. Companies that are already offload the CPU. familiar with modular COM technologies are expected to be the first to implement ForFor optimized performance-per-watt, Single the UGM. In addition to these early adopters, Print Only module is equipped with power-saving designers who have previously avoided features including hardware-managed modular designs due to lack of high-end dynamic power modes and integrated graphics capabilities can now have more PowerPlay 7.0 technology to extend bat- confidence in COM methodology to tery life in rugged mobile applications. meet next-generation embedded graphics An adapter that can connect the module requirements. ➤ to a standard PEG interface as it would on a motherboard (shown in Figure 3) and a Matthias Huber passive heat spreader kit are available to is general manager simplify the design. of the Embedded Modules Division, Future embedded applications leading the Kontron UGM promises to extend scalable, America team at the graphics-driven technologies for long- company’s facility term product deployments to embedded in Silicon Valley. designs. By offering more advanced He currently serves as European VP of graphics and display elements, UGM is the PC/104 Embedded Consortium. His well positioned to find its way into a wide previous experience includes serving as range of areas including medical equip- a member of the R&D team of Boards ment, casino gaming and arcade markets, (now Kontron) and general manager vision control technologies for security of Jumptec Inc. (now Kontron). He and industrial markets, simulation tech- has a degree in Precision and Micro- nologies, commercial outdoor broadcast- Engineering from the University of ing, and high-end residential gateways. Applied Sciences in Munich, Germany.

For example, consider a POI system Kontron that needs to run multiple independent 510-661-2220 displays from a single subsystem. If the [email protected] www.kontron.com computing core already takes advantage

18 / Winter 2008 PC/104 and Small Form Factors For Single Print Only For Single Print Only For Single Print Only For Single Print Only APPLICATION Graphics and HMI

Rugged display here, computer somewhere over there

By Nigel Dickens For Single Print Only

Industrial process control requires To address this need, companies such as technology solutions that enable Coca-Cola Enterprises, Georgia Pacific, businesses and manufacturers to General Mills, Pfizer, Proctor & Gamble, get the job done in rough and tough and Nestle have started using products environments. But sometimes, with display extenders, which allow com- ruggedizing everything isn’t the right puters to be placed as far away as possible answer. Nigel presents an example of from industrial displays while maintain- how implementing display extenders ing superior picture quality and speed. can increase production efficiency and reduce system costs by allowing Covering the distance computers and displays to be placed Roswell, Georgia-based Hope Industrial in different areas. Systems, Inc. incorporates Adder Corpo- ration’s AdderLink X Series X-2 Silver Figure 1 Dual-Access Keyboard, Video, Mouse ndustrial manufacturers need high- (KVM) extenders (Figure 1) into its are used by the modules to convey RGB quality monitors and touch-screen dis- industrial flat-panel monitors and touch video signals to the remote video monitor. Iplays located throughout their factory screens. The KVM extender allows an Because these three pairs have slightly floors. However, the computers that run industrial monitor, keyboard, mouse, and different twist rates, the RGB video sig- these displays often cannot handle expo- serial touch screen to be positioned up nals do not always arrive at precisely the sure to dust, water, humidity, chemicals, to 1,000 feet away from the computer or same time. This effect, which is visible as extreme temperatures, vibrations, and server using a single CatX cable. The dual separate color shadows on high-contrast other conditions characteristic of harsh version enables computer access both screen images, becomes apparent particu- environments without substantial harden- locally and remotely. larly when using higher screen resolutions ing. Rather than ruggedizing computers and some types of Cat 5e cables. to provide all the control needed for these The twisted pair cabling supported by the applications, industrial manufacturers KVM extender (Cat 5 or higher) com- KVM extenders provide internal skew seek a more cost-effective approach. prises four pairs of cables, three of which adjustment that can help rectify this issue.

PC/104 and Small Form Factors Winter 2008 / 23 APPLICATION

The skew adjustment works by delaying or advancing the timing of RGB color signals so that they are all delivered to the monitor at the exact same time. Hope Industrial Systems incorporates this function into its monitors by mating the extender to the monitor using one of the following three methods:

 Mounting the unit behind the panel near the monitor, creating a stand-alone product for use with panel mount displays  Mounting the KVM extender in a modular sealed NEMA 4/4X/12 enclosure attached to the rear of the display, creating a rear mount KVM extender for use with universal mount displays  Inserting the KVM extender into the pedestal where it is hidden, protected, and sealed to NEMA 4/4X/12 specifications, creating a pedestal mount KVM extender (Figure 2) for use with pedestal mount displays

For Single Print Only

Figure 2

24 / Winter 2008 PC/104 and Small Form Factors Graphics and HMI

The KVM extenders’ compatibility with Besides the KVM extenders for standard serial devices, Hope Industrial Systems plans other computers and small form factor to possibly integrate Adder’s KVM extenders for USB devices into its products in the size allowed Hope Industrial Systems to near future. ➤ integrate this technology into its product line. Nigel Dickens is CTO for Adder Corporation in Newburyport, Massachusetts, where he has spearheaded a range of innovative “There are several advantages to using product developments since 1991. With more than 20 years of these products,” remarks John McGraw, experience in the electronics industry, he is a Chartered Engineer director of operations at Hope Indus- and a graduate in Electronics from Cambridge University. trial Systems. “The X-2 Silver KVM extender provides a rugged metal indus- Adder trial enclosure and allows for skew 978-499-2105 adjustment so that our customers can [email protected] fine-tune pictures up to 1,000 feet away. www.adder.com These clean, sharp pictures can with- stand factory electromagnetic interference, which is an important feature in this business.”

Small, fast, and seamless video extension McGraw says the company has received positive feedback from customers who report excellent picture quality, long-term reliability, continually updated software, and substantial cost savings as a result of not needing to purchase rugged computer equipment.

Other industrial manufacturers have noted similar benefits. Controls engineers at Coca-Cola Enterprises state that these extenders are so small, fast, and For Single Print Only seamless that they can’t tell the video is being extended. This efficiency enables technical staff at General Mills Canada Corporation’s plant to put their computers in a dry area and touch screens in wet areas.

PC/104 and Small Form Factors Winter 2008 / 25 p

c s

/ r

1 o 0 t 4 c a a f nd m ¸ sm l for al EDITOR’S CHOICE PRODUCT

Tiny modules configure I/O

/ The “last inch” in I/O can be one of the toughest problems to solve. In many1 cases 4 a a system needs to do more than one thing with several different types of I/O ninterfacesm f involved. Technobox’s Micro Mezzanine System tackles these challenges head on using tiny Electrical Conversion Modules (ECMs) placed on a PMC or other carrierED along T R S with HO C FPGA-based IP to provide the needed interface logic. Each ECM presents 16 pinsRO to UCT the carrier for I/O, and several different functions are available to mix and match. Technobox www.technobox.com RSC# 39395

HMI gets harsh, which is good Lots of PCs have enough horsepower to get an industrial control job done, but relatively few can survive harsh environments. Ocular’s new Denali For SingleHuman-Machine Interface (HMI) system Print Only has a 1 GHz VIA processor and 1 GB or more of memory packaged with a 7" TFT display and a new capacitive touch screen. Using what Ocular calls Crystal Touch technology, the glass- based screen is durable and fully sealed, allowing the system to meet SAE J1455 specifications at both low and high temperatures. The system runs either Windows or Linux. Ocular, Inc. www.ocularlcd.com • RSC# 39396

26 / Winter 2008 PC/104 and Small Form Factors More power, over Ethernet Although the IEEE 802.3af standard for Power over Ethernet (PoE) delivers 13 W, there’s clearly a need for more power (see the article on IEEE 802.3at in the October 2008 issue of Embedded Computing Design for details). To fulfill this need, ON Semiconductor has extended the NCP108x family of devices. NCP1081 and NCP1083 provide up to 40 W of power and improved ESD robustness. These parts are available in an industrial temperature range, align with Draft 3.0 of IEEE 802.3at, and help designers create PoE powered devices like security cameras and industrial networking adapters. ON Semiconductor www.onsemi.com • RSC# 39397 OpenVG hits the dashboard The automotive infotainment space is exploding, as demon- For Single Print Only strated by Freescale’s introduction of its latest device, the i.MX35 application processor, at the recent SAE Convergence 2008. With an ARM1136JF-S core running at up to 532 MHz, the processor features an advanced image processing unit with optional OpenVG graphics acceleration, enabling vector graphics apps like Adobe Flash. The i.MX35 also features other improvements including a DDR2 memory interface, an Enhanced Serial Audio Interface and sample rate conversion, USB host and On-The-Go interfaces, a media local bus (per MOST), Ethernet, and MMC/SD/SDIO and CE-ATA/SDIO interfaces. Freescale Semiconductor www.freescale.com • RSC# 39398

Editor’s Choice Products are drawn from OSM’s product database and press releases. Vendors may add their new products to our website at http://submit.opensystemsmedia.com and submit press releases at http://submit.opensystemsmedia.com. OSM reserves the right to publish products based on editors’ discretion alone, and does not guarantee publication of any product entries.

PC/104 and Small Form Factors Winter 2008 / 27 For Single Print Only For Single Print Only COM Express VIA Technologies, Inc...... 36 MPL AG ...... 47 ADLINK Technology Inc...... 31 WDL Systems ...... 36 VersaLogic Corp...... 47 Pinnacle Data Systems, Inc...... 31 WIN Enterprises ...... 47 Other SFF boards Communications ADLINK Technology Inc...... 37 PCI/104-Express Advanced Micro Peripherals, Ltd...... 31 EMAC, Inc...... 37 Connect Tech, Inc. (CTI) ...... 47 MPL AG ...... 31 Eurotech Inc...... 37 RTD Embedded Technologies, Inc...... 47 Radicom Research, Inc...... 31 Eurotech Inc...... 37 Kontron ...... 37 Rugged and Mil-Spec Digital I/O Kontron ...... 37 AIM-USA ...... 47 ACCES I/O Products, Inc...... 31 VersaLogic Corp...... 38 AIM-USA ...... 47 ACCES I/O Products, Inc...... 31 VIA Technologies, Inc...... 38 ADLINK Technology Inc...... 48 Connect Tech, Inc. (CTI) ...... 31 VIA Technologies, Inc...... 38 ADLINK Technology Inc...... 48 Measurement Computing Corporation . . . . . 32 WDL Systems ...... 38 Excalibur Systems, Inc...... 48 2009 BUYER’S GUIDE Hybricon Corp...... 48 EPIC PC/104 Jacyl Technology Inc...... 48 ADLINK Technology Inc...... 32 ADLINK Technology Inc...... 41 LiPPERT Embedded Computers ...... 48 LiPPERT Embedded Computers ...... 32 EMAC, Inc...... 41 Logic Supply ...... 48 LiPPERT Embedded Computers ...... 32 ICOP Technology, Inc...... 41 Parvus Corporation ...... 48 ICOP Technology, Inc...... 41 Parvus Corporation ...... 51 ETX North Atlantic Industries ...... 41 Roder Electronics ...... 51 (Sponsored by ADLINK Technology Inc.) North Atlantic Industries ...... 41 ADLINK Technology Inc...... 35 RTD Embedded Technologies, Inc...... 41 Stand-alone systems Technologic Systems ...... 41 Eurotech Inc...... 51 Industrial automation Technologic Systems ...... 42 NEXCOM International Co., LTD ...... 51 Dataforth Corporation ...... 35 WinSystems, Inc...... 42 esd gmbh ...... 35 Storage servo-Halbeck GmbH & Co. KG ...... 35 PC/104-Plus WinSystems, Inc...... 51 Data Device Corp. (DDC) ...... 42 Mezzanines Eurotech Inc...... 42 Vision systems and displays Alphi Technology Corporation ...... 35 Eurotech Inc...... 44 Active Silicon Ltd...... 51 Innovative Integration ...... 35 Eurotech Inc...... 44 Advanced Micro Peripherals, Ltd...... 51 Innovative Integration ...... 35 Excalibur Systems, Inc...... 44 Advanced Micro Peripherals, Ltd...... 51 Jacyl Technology Inc...... 44 Advanced Micro Peripherals, Ltd...... 52 Mini-ITX LiPPERT Embedded Computers ...... 44 Sensoray Co., Inc...... 52 ITOX Applied Computing ...... 36 LiPPERT Embedded Computers ...... 44 Sensoray Co., Inc...... 52 Logic Supply ...... 36 MPL AG ...... 47

For Single Print Only

30 / Winter 2008 PC/104 and Small Form Factors PC/104 and Small Form Factors 2009 BUYER’S GUIDE COM Express ADLINK Technology Inc. COM Express Radicom Research, Inc. Communications COM Express RSC# 39233 TinyModem RSC# 37870 Ampro by ADLINK COM Express Computer-On-Module (COM) offerings Measures 0.66" x 1.25" x 0.75" • -40 °C to +85 °C operating temperature provide a variety of price, performance, and durability options • Latest • Enhanced EMC/EMI shielding • Serial TTL interface, data, fax, voice Intel processors including playback, and recording • Standard AT commands support • Generates the Atom and Core 2 Duo and detects DTMF tones in voice mode • Single 3.3 V supply, 5 V tolerant CPUs • CPU speeds up to I/O • 3,750 V high-voltage isolation • Low power consumption, sleep mode 2.2 GHz • Wide OS support

support • Up to 56 Kbps data speeds | including Windows XPe, downstream • Up to 48 Kbps data CE 6.0/5.0, and Ampro speeds upstream • V.42bis and MNP 5 Communications Embedded Linux • Confor- data compression • V.42 LAPM and mal coating and extended MNP 2-4 error correction • Trans- temperature testing ferable FCC68, CS-03, and CTR21 available certifications with CE Marking www.ampro.com www.radi.com

Pinnacle Data Systems, Inc. COM Express ACCES I/O Products, Inc. Digital I/O COMX-S1 COM Express Module RSC# 35178 USB-IDIO-16 RSC# 37770

AMD Socket S1 COM Express Module (COMX-S1) is a low-cost, 16 individually optically isolated inputs and 16 fully protected solid-state | compact, embeddable computing core • Ideal for OEM applications FET outputs capable of switching up to 2 A each • Polarity-insensitive Digital I/O where video output is required • Several performance levels are AC/DC inputs accept up to 31 VDC or AC RMS • Jumper-selectable filtering available, from the ultra-low-watt AMD Sempron processors suitable per input channel for AC or voltage transients • Internal, removable screw for fanless applications to the dual-core muscle of AMD Turion 64 X2 terminal board for easy wiring • USB/104 Mobile Technology form factor for OEM embedded applications • AMD M690 series • 4" x 4" x 1.4" rugged enclosure • OEM version chipset delivers excep- (board only) features PC/104 module size

tional built-in graphics and mounting compatibility • Extended tem- • COMX-S1 significantly perature and DIN rail mounting provisions reduces initial platform • All required power drawn from USB port; design time no external power adapter required www.pinnacle.com www.accesio.com

Advanced Micro Peripherals, Ltd. Communications ACCES I/O Products, Inc. Digital I/O LANSwitch RSC# 39240 USB-DIO-16H RSC# 38258 Industry-standard 5-port 10/100 Mb Ethernet switchFor on a rugged USB/104 digitalSingle I/O unit • 16 high-speed digital I/O lines feature continuous, Print Only PC/104-Plus form factor for harsh environments • Supports up to 16 VLAN sustained throughput up to 16 MBps • Capable of 80 MBps bursts with groups configured as port-based synchronous clock and handshaking capabilities • Continuous streaming or IEEE 802.1Q tag-based VLANs over USB with no maximum waveform length • Onboard embedded • Automatically detects each con- 128 KB FIFO memory • 18 additional digital I/O lines arranged in 4 pro- nected Ethernet device, routing grammable groups • All outputs buffered with 24 mA sink/source data directly to it • Eliminates data capabilities • Type B USB connector features collision and significantly reduces high-retention design • Standard 68-pin SCSI unnecessary network traffic • Can high-density latching connector • 4" x 4" x result in deterministic communica- 1.25" rugged steel industrial enclosure • OEM tions with attached Ethernet version (board only) features PC/104 module devices • Single 5 V supply size and mounting compatibility www.ampltd.com www.accesio.com

MPL AG Communications Connect Tech, Inc. (CTI) Digital I/O MAGBES Gbit switch RSC# 39085 FPGA Computing Platforms RSC# 39241 Rugged 5-port manageable GbE switch • Versatile design allows Reconfigurable FPGA products save time and money • Based on different combinations of fiber and copper LAN ports • Copper and fiber- Virtex-5 or Spartan-3E FPGAs • Versatile platforms for application designs optic versions • Fully manageable through Web interface • Stand-alone • PC/104 or PCI-104 form factors • Up to 3 million gates • Digital I/O or and PC/104 stacked LVDS I/O • Industrial temperature range (-40 °C to +85 °C) • 8 MB flash versions • -40 °C to • DDR2-400 memory +85 °C extended tem- • Counter/timers • Recon- perature option • Use of figurable in the field or SFP transceivers allows through CTI Engineering users to select the Services • Free ISE appropriate fiber-optic WebPACK for complete interface • Low-power FPGA design • Lifetime and fanless operation warranty www.mpl.ch www.connecttech.com

PC/104 and Small Form Factors Winter 2008 / 31 2009 BUYER’S GUIDE PC/104 and Small Form Factors Measurement Computing Corporation Digital I/O LiPPERT Embedded Computers EPIC PCIe-DIO24 RSC# 39193 Hurricane-LX800 RSC# 30128 EPIC

Digital I/O board for the EPIC form factor • Graphics, Ethernet, USB, serial, and expansion ports |

PCI Express bus • 24-bit logic- • AMD Geode LX800 processor at 500 MHz with 1 GB DDR333 RAM maxi- level (3.3 V or 5 V selectable) mum • Integrated graphics with up to 1,920 x 1,440 pixels • Display adapters digital I/O • Fully plug-and-play for VGA, LVDS, parallel TFT • Two 10/100BASE-T Ethernet ports • IDE Ultra • Installed pull-up/pull-down ATA-100 • Four USB 2.0 host ports, resistors with configuration one device port, two RS-232/422/485 stored in nonvolatile memory serial ports • Analog and digital I/O • Digital I/O lines accessed • PC/104 and PC/104-Plus buses Digital I/O through a 37-pin D-type connec- • Mini PCI slot • AC’97 5.1 sound tor • Software and connector • 5.25 W power consumption • -40 °C compatibility with PCI predecessors for seamless migration of existing to +85 °C extended temperature applications to next-generation platforms range optionally available www.measurementcomputing.com www.lippertembedded.com

ADLINK Technology Inc. EPIC LiPPERT Embedded Computers EPIC ReadyBoard EPIC RSC# 39235 Hurricane-PM RSC# 32959 Low-cost Ampro by ADLINK ReadyBoard family of SBCs with EPIC form factor • Intel PC-style connectors for robust I/O • Scalability from 500 MHz to 1.4 GHz Pentium M or Intel Celeron M • Easy migration due to processors • 1 GB DDR333 RAM standardized PC-style maximum • Graphics up to connector block 2,048 x 1,536 pixels, VGA and • Extensive I/O that is LVDS adapters • Two Ethernet not available in nonstan- ports, six USB 2.0 host ports dard mid-size form • PC/104 and PC/104-Plus buses factors • CompactFlash • -40 °C to +85 °C extended socket • SODIMM temperature range optionally memory available www.ampro.com www.lippertembedded.com

For Single Print Only

32 / Winter 2008 PC/104 and Small Form Factors For Single Print Only For Single Print Only PC/104 and Small Form Factors 2009 BUYER’S GUIDE ETX Dataforth Corporation Industrial automation ETX SensorLex 8B42 SCM RSC# 38032 | 2-wire transmitter interface module designed specifically to provide ADLINK Technology Inc. Industrial automation isolation for nonisolated 2-wire transmitters • Instrument class performance • Miniature size: 1.11" x 1.65" x 0.40" (28.1 mm x 41.9 mm x 10.2 mm) Ampro by ADLINK ETX • ±0.05 percent accuracy Scalability from 500 MHz to (typical) • ±0.02 percent linearity • 1,500 Vrms 1.66 GHz • Latest ETX standard transformer isolation compatible • Rugged resistance and up to 40 Vrms field- side protection • 3-pole to shock and vibration; HALT low-pass filter optimized reports available • Optional -40 °C for time and frequency to +85 °C support (ETT) and conformal response www.dataforth.com coating • Utilizing the Intel Core 2 Duo processor, the unit adheres to the latest ETX 3.02 form factor standard,

which allows two additional SATA ports while maintaining

Industrial automation |

esd gmbh full backwards compatibility • With an enhanced graphics CAN-PCI104/200 RSC# 38860 Mezzanines feature set, the unit targets medical, gaming, and instru- CAN interface for PCI-104 • PCI-104-to-CAN interface with 1 or 2 CAN • CAN controller SJA1000 (ISO 11898-1) • CAN interface electrically mentation markets • Extreme Rugged module features a isolated and designed low-power Centrino processor, advanced networking, and according to ISO 11898-2 • Bit rate up to 1 Mbps high-performance graphics • Featuring the AMD Geode LX800 • PC/104-Plus ISA connector CPU, the unit targets mid-performance applications available as an option • Also available: CAN-PCI104/ exposed to harsh environments 200-2 intelligent PCI-104 module with local data management by FPGA www.esd-electronics.com RSC# 39236 www.ampro.com

servo-Halbeck GmbH & Co. KG Industrial automation Innovative Integration Mezzanines POSYS 3004 RSC# 35081 X5-210M RSC# 37419 PC/104 form factor board dedicated to high-performanceFor motion-control XMC I/O moduleSingle • Four 250 MSps 14-bit A/D channels • ±1 V, 50 ohm, Print Only applications with extensive interpolation functionality • Interrupts: IRQ3, SMA inputs and outputs • Xilinx Virtex-5 SX95T FPGA • 512 MB DDR2 IRQ12, IRQ14, IRQ15 • Integrated DOS-like RTOS with 8 MB SDRAM and DRAM • 4 MB QDR-II SRAM • 8 RocketIO private links, 2.5 Gbps each 8 MB flash RAM for custom applications • Web, FTP, SSH, and Telnet server • >1 GBps, 8-lane PCI Express host interface • Power management fea- • Velocity range: 0-4,000,000 counts/second • Acceleration and decelera- tures • 75 mm x 150 mm • PCI Express (VITA 42.3) • Fully customized using tion range: 125-500 x 106 counts/second • Jerk range (S-curve): 954-31.25 VHDL and MATLAB using the FrameWork Logic toolset • Applications:

x 109 counts/second • Acceleration counter Wireless receiver and transmitter; Sponsored by ADLINK Technology Inc. www.ampro.com offset: -32,767 to +32,767 counts • Deceleration WLAN, WCDMA, and WiMAX counter offset: 1 to 65,535 counts • Position front end; radar; electronic war- error tracking window • Digital outputs: 12 gen- fare, high-speed data recording eral purpose and 16 multipurpose • Digital and playback; high-speed servo inputs: 8 general purpose and 24 dedicated controls; and IP development www.servo-halbeck.com www.innovative-dsp.com

Alphi Technology Corporation Mezzanines Innovative Integration Mezzanines IP-CYCLONE II-PIO RSC# 38942 X5-GSPS RSC# 37675 FPGA-based IndustryPack solution for RS-485, RS-422, and parallel I/O XMC I/O module • Two 1.5 GSps 8-bit A/D channels (National ADC08D1500) • Low power, high functionalities • Flexible solution (user-programmable) • ±1 V, 50 ohm, SMA inputs • Xilinx Virtex-5 SX95T FPGA • 512 MB DDR2 • Altera FPGA EP2C20 or EP2C50 • Up to 24x RS-485 or RS-422 drivers/ DRAM • 4 MB QDR-II SRAM • Eight RocketIO private links, 2.5 Gbps each receivers or TTL I/O lines • 512K x 8 x 2 dual-ported SRAM • Each line • >1 GBps, 8-lane PCI Express host interface • Power management features can be separately • 75 mm x 150 mm • PCI Express (VITA 42.3) • Fully customized using VHDL selected as input or and MATLAB using the FrameWork Logic toolset • Applications: Wireless output • FPGA easily receiver; WLAN, WCDMA, programmable through and WiMAX front end; radar; JTAG, onboard serial electronic warfare, high-speed EPROM, or IP bus data recording and playback; • VITA 4 compliant high-speed servo controls; www.alphitech.com and IP development www.innovative-dsp.com

PC/104 and Small Form Factors Winter 2008 / 35 2009 BUYER’S GUIDE PC/104 and Small Form Factors ITOX Applied Computing Mini-ITX VIA Technologies, Inc. Mini-ITX ITOX SR100-L20C RSC# 38850 EPIA-M700 RSC# 37811 Mini-ITX SBC features a value-optimized Mobile Intel GLE960 Express Mini-ITX board with C7 1.8 GHz CPU • MPEG-2/4, WMV9, DVI-I, chipset and 2.0 GHz Intel Celeron M 550 processor with 1 MB L2 cache CompactFlash, and GigaLAN • Features the VIA VX800 digital media Mini-ITX • Mobile Intel GLE960/ICH8M Express chipset provides high performance chipset for enhanced video playback, dual display, and dual GigaLAN with reduced power requirements • Integrated Intel GMA X3100 graphics • Integrated VIA Chrome9 HC DX9 3D/2D graphics with MPEG-2/4, WMV9, accelerator provides dual independent and H.264 video decoding acceleration • Supports one IDE and two SATA, display support • Integrated 4-channel dual PCI Express GbE, one audio with S/PDIF I/O • Damage-free CompactFlash Type 1, and one intelligence provides real-time monitor- DVI-I port • Supports digital I/O, ing of processor and system tempera- SPI, proprietary MFX interfaces, ture, power supply voltage, and fan four USB 2.0 ports, and HD audio speed • Guaranteed availability for • Designed for digital signage five years or more and kiosk applications www.itox.com www.via.com.tw

Logic Supply Mini-ITX WDL Systems Mini-ITX Fanless Mini-ITX RSC# 38948 Mini-ITX Boards RSC# 39216 High-performance, ruggedized Intel Core 2 Duo mobile fanless Technology provides Mini-ITX system • For industrial applications and remote deployments customers with COTS • Supports Intel Core 2 Duo mobile processors up to 2 GHz • Designed products for all embed- around MSI Industrial Series main board • Dual Gigabit LAN, both DVI and ded requirements • VGA, RS-232 COM port, and audio (optional HDMI) • Supports Windows XP, Easily cooled, highly Vista, and Ubuntu Linux OSs • Utilizes heat-pipe technology for system versatile Mini-ITX cooling; enclosure has top and embedded mother- side fins for optimal heat dispersal boards • Main boards • Includes a 120 W DC-DC board feature low-power with 120 W AC adapter • Dimen- processors, onboard sions: 8.86" x 3.15" x 7.68" (225 mm LAN, various integrated x 80 mm x 195 mm) AGP graphics, audio options, slots, and connectors www.logicsupply.com www.wdlsystems.com

For Single Print Only

36 / Winter 2008 PC/104 and Small Form Factors PC/104 and Small Form Factors 2009 BUYER’S GUIDE Other SFF boards ADLINK Technology Inc. Other SFF boards Kontron Other SFF boards Ampro by ADLINK LittleBoard EBX RSC# 39234 microETXexpress-SP RSC# 36939 Extreme Rugged Ampro by ADLINK LittleBoard family of SBCs with Intel Atom processor Z500 long life cycles, broad OS support, and extended temperature option series • Integrated memory • Scalability from 500 MHz controller, graphics engine, and to 1.4 GHz • Industry-leading I/O controller in Intel System three-year warranty on Extreme Controller Hub US15W • Unprec- Rugged products • Rugged edented power consumption/ to shock and vibration; HALT performance ratio for x86-based reports available • Optional ultra-mobile solutions • PCI, -40 °C to +85 °C support (ETT) PCI Express, GbE, USB 2.0, and conformal coating • Ideal SATA, LVDS, and HD audio • for military, aviation, and 100 percent COM Express transportation applications Pinout Type 2 compatible www.ampro.com www.kontron.com

EMAC, Inc. Other SFF boards Kontron Other SFF boards SOM-9307 ARM Module RSC# 38941 nanoETXexpress-SP RSC# 36940 Plugs into a custom or off-the-shelf carrier board containing all the Intel Atom processor Z500 series • Intel System Controller Hub US15W connectors and any additional I/O components required • 200-pin with integrated memory controller, graphics engine, and I/O controller SODIMM form factor (2.66" x 2.375") • Cirrus ARM9 EP9307 200 MHz • Up to 1 GB DDR2 onboard system memory • Up to 4 GB onboard flash processor, Maverick Crunch hardware floating-point math coprocessor, SSD • Wide input voltage range: 4.75-14 V • Unprecedented power and 10/100BASE-T Ethernet with onboard PHY • Three serial ports with consumption/performance ratio for x86-based ultra-mobile solutions handshake and three USB 2.0 host ports • Up to 128 MB SDRAM, 64 MB • PCI Express, GbE, USB 2.0, SATA, LVDS, and HD audio • 100 percent flash, and 128 KB serial flash • Battery-backed COM Express Pinout Type 1 compatible real-time clock, SD/MMC flash card interface, • OS support for Windows XP, XPe, CE, two SPI ports, and one I2S audio port • Timer/ Linux, and VxWorks • Commercial counters and pulse-width modulation ports, temperature range for typical operation 8-channel 12-bit analog-to-digital converter, and storage • ACPI 2.0 and APM S3 hot and graphic LCD interface and cold support www.emacinc.com www.kontron.com

Eurotech Inc. Other SFF boards Catalyst Module RSC# 35845 Intel eMenlow platform with Silverthorne processorFor and Poulsbo Single Print Only chipset up to 1.5 GHz • 67 mm x 100 mm • -40 °C to +85 °C temperature range • Multiple video interfaces (UXGA, XGA, SXGA, HD) • Codecs for H.264, MPEG-4/2/1, Windows Media 9, and DivX • Dual-display output capability, Intel HD audio, and support for 4- and 5-wire touch-screen interface • Support for Microsoft Windows CE, XP, XPe, Linux, and other RTOSs • USB 2.0 ports, analog and digital I/O, CANbus, serial ports, PCI Express, 10/100/1000BASE-T Ethernet, and Mini PCI Express • Up to three SD/MMC cards and two PATA disk drives with up to 1 GB DDR-2 support www.eurotech.com

Eurotech Inc. Other SFF boards QUANTUM RSC# 35860 520/312 MHz Marvell PXA270 XScale processor • 64 MB soldered SDRAM • 256 KB SRAM • SD/SDIO/MMC card interface • Up to 64 MB soldered Spansion MirrorBit flash • TFT/STN flat-panel interface up to 640 x 480 x 16-bit color depth • 4-wire touch-screen interface and AC’97 audio controller • 10/100BASE-TX Ethernet controller and CompactFlash interface bus • Dimensions: SODIMM form factor board (67.6 mm x 50 mm) • Extended temperature range: -40 °C to +85 °C • Offers Embedded Linux 2.6 or Windows CE 5.0 preinstalled www.eurotech.com

PC/104 and Small Form Factors Winter 2008 / 37 2009 BUYER’S GUIDE PC/104 and Small Form Factors VersaLogic Corp. Other SFF boards VIA Technologies, Inc. Other SFF boards Cobra ULV (EBX-12) RSC# 36927 VIA EPIA-N700 RSC# 39013 Intel ULV Celeron M 1.0 GHz processor • Fanless operation • Extreme Nano-ITX C7/Eden ULV board with MPEG-2/4, WMV9, VGA, LVDS, Graphics 2 video • High-speed DDR RAM • Integrated I/O and Ethernet CompactFlash, and GigaLAN • Integrated VIA Chrome9 HC3 DX9 3D/2D • CompactFlash socket • Suitable for a wide range of high-end applications graphics with MPEG-2/4 and WMV9 video decoding acceleration including telecommunications devices and advanced security systems • DDR2 533/667 SDRAM (SODIMM) • Supports one IDE, two SATA, one • Dual 10/100 Ethernet, USB 2.0 support, and RS-232/422/485 COM ports PCI Express, GbE, one • Integrated digital I/O and optional analog I/O reduce the need for CompactFlash Type I, external expansion • RoHS-compliant unit one VGA port, four features an OEM-enhanced embedded USB 2.0 ports (two as pin Other SFF boards BIOS • Compatible with a variety of headers), and HD audio embedded OSs, including Windows, Linux, • Onboard LVDS support: VxWorks, and QNX • Customizable in one dual-channel LVDS OEM quantities as low as 100 pieces panel support www.versalogic.com www.via.com.tw

VIA Technologies, Inc. Other SFF boards WDL Systems Other SFF boards EPIA-P700 RSC# 37810 SBCs RSC# 39215 Ultra-compact Pico-ITX NanoBGA2 C7/Eden ULV board with MPEG-2/4, Technology provides WMV9, and CRT/DVI/LVDS/DC-in support • GigaLAN, SATA, and integrated customers with COTS power adapter • Integrated VIA UniChrome Pro II 3D/2D AGP graphics products for all with MPEG-2/4 and WMV9 video decoding acceleration • DDR2 533/667 embedded requirements SDRAM (SODIMM) • Supports one IDE, one SATA, one GbE or manu- • SBCs feature PC/104, facturing option for 10/100 Mbps Ethernet, one COM port, four USB 2.0 PC/104-Plus, and EPIC ports, and HD audio • Supports form factors with CRT, DVI, and LVDS display Pentium M, Celeron M, • 12 VDC-in • Low-profile design: Vortex86X, and Geode all back-panel I/O in pin header processors format except for the IDE and www.wdlsystems.com SATA connectors www.via.com.tw

For Single Print Only For Single Print Only For Single Print Only PC/104 and Small Form Factors 2009 BUYER’S GUIDE PC/104 ADLINK Technology Inc. PC/104 North Atlantic Industries PC/104 Ampro by ADLINK CoreModule PC/104 RSC# 39232 73DS2 RSC# 36804 Reliable and Extreme Rugged Ampro by ADLINK CoreModule family of 3-channel programmable digital-to-synchro/resolver converter PC/104 SBCs for applications exposed to harsh environments • Extreme available on a PC/104 card • Three independent, transformer-isolated, Rugged design for harsh programmable synchro/resolver simulation channels • Each channel environments • Small PC/104 has 16-bit resolution, ±1 arc-minute accuracy, and a short circuit size, stackable I/O expansion protected output with 1.2 VA drive capability • Includes eight program- • Three-year warranty on mable digital I/O channels, wraparound self-test, programmable output Extreme Rugged products angle rotation, and an optional • Optional -40 °C to +85 °C programmable excitation reference support (ETT) and conformal supply • Provides continuous back- coating • Ideal for military, ground built-in test on all functions aviation, and transportation and channels, including reference applications and signal loss detection www.ampro.com www.naii.com

EMAC, Inc. PC/104 North Atlantic Industries PC/104 PFM-540I CPU Module RSC# 39091 73SD4 RSC# 33294 AMD Geode low-power LX800 processor with fanless 0 °C to +60 °C DSP-based 73SD4 PC/104 card • Six independent, transformer-isolated operation • A wide temperature version (-40 °C to +85 °C) offers a larger programmable synchro/resolver tracking converter measurement range for more harsh environments • Low-power 5 V operation makes it channels • Each channel has 16-bit resolution, ±1 arc-minute accuracy, easier for flexible power sources and industrial applications • Up to 1 GB tracking rate to 150 RPS, accurate DDR SDRAM capacity and one 44-pin digital velocity output, incremental Ultra DMA 33, which supports two IDE encoder (A+B) outputs, and wraparound devices • True PC/104 dimensions and self-test • Channel pairs can be pro- interface, providing a PC/104 (8/16-bit grammed for any speed ratio between ISA) bus • CRT and 18/24-bit LCD 1:1 and 255:1 • Requires a single capability, which supports up to 64 MB +5 VDC power supply • Operates over a (shared) memory and CPU integrated 47 Hz to 10 KHz frequency range • Auto- VGA controller with 2D engine ranging input range from 2 to 28 Vrms www.emacinc.com www.naii.com

ICOP Technology, Inc. PC/104 RTD Embedded Technologies, Inc. PC/104 VDX-6354 RSC# 39367 CME136686LX RSC# 39168 DM&P SoC CPU Vortex86DX 800 MHz PC/104 moduleFor • 90 mm Low-powerSingle CPU module based on the 333 MHz and 500 MHz AMD Print Only x 96 mm (3.54" x 3.77") • Real-time clock with lithium battery backup Geode LX800 • Features up to 512 MB of surface-mount DDR SDRAM • L1: 16K I-cache, 16K D-cache; L2: 128 KB • PC/104 standard compliant, • Full 8/16-bit ISA bus with DMA and interrupts • High-reliability PCB PC/104-Plus (optional) • 256 MB DDR2 • Software programmable from built to IPC-6012 Class III standard • Four RS-232/422/485 ports, dual 30.5 microseconds to 512 seconds x2 sets 10/100 Ethernet, ATA/IDE disk chip • XGI Volari Z9s chipset, VGA and TFT flat- natively supported by all major panel interface support, onboard 32 MB OSs • RTD Enhanced AMI BIOS VGA memory, resolution up to 1,280 x 1,024 with built-in SETUP, Fail-Safe • Integrated 10/100 Mbps Ethernet • CM119 Boot, USB Boot, and Quick Boot USB audio controller • Single voltage 5 V modes • Ultra-low-power PC/104 • Operating temperature: -20 °C to +70 °C; and PC/104-Plus compliant SBC -40 °C to +85 °C (optional) • Operational from -40 °C to +85 °C www.icop.com.tw www.rtd.com

ICOP Technology, Inc. PC/104 Technologic Systems PC/104 VSX-6154 RSC# 39368 TS-7000 ARM9 SBCs RSC# 30234 PC/104 SBC based on Vortex86SX 300 MHz SoC • Low-power SBC Series of rugged SBCs that run on a 200 MHz ARM9 processor • Up to draws 250 mA at 5 VDC • PC/104 standard compliant, PC/104-Plus 128 MB RAM, 256 MB onboard flash, and user-programmable onboard (optional) • Soldered-on RAM, fanless design uses low-profile heat sink FPGA • Two USB ports; up to two 10/100BASE-T Ethernet ports; up to • Software programmable from 30.5 microseconds to 512 seconds 10 serial ports, VGA video-out, SD card, or CompactFlash slot(s); and x2 sets • XGI Volari Z9s chipset, VGA and TFT SPI interface • PC/104 bus with VGA flat-panel interface support, onboard 32 MB video, CANbus, GSM/line modems, VGA memory, resolution up to 1,280 x 1,024 serial ports, DIO lines, and intelligent • Integrated video/LCD, Ethernet, USB 2.0, battery backup • No fan or heat sink four serial ports, parallel, IDE, RTC, and more from -20 °C to +70 °C (optional -40 °C to • Supports Linux and Windows CE; support +85 °C) • 4.5 to 20 VDC input voltage with available for legacy applications running power as low as 1/4 W; under 2 W at older versions of Linux and Windows full speed by default www.icop.com.tw www.embeddedARM.com

PC/104 and Small Form Factors Winter 2008 / 41 2009 BUYER’S GUIDE PC/104 and Small Form Factors Technologic Systems PC/104 Data Device Corp. (DDC) PC/104-Plus

Plus TS-7800 SBC RSC# 33645 BU-65590C RSC# 38031 RoHS-compliant SBC based on a Marvell 500 MHz ARM9 CPU with internal Multiprotocol PC/104-Plus card that provides flexibility for systems PCI bus • 12,000 LUT onboard FPGA user-programmable via Linux soft- interfacing to a MIL-STD-1553 or ARINC 429 data bus, saving valuable ware • Backward compatible with TS-72xx computers • 128 MB DDR-RAM PC/104-Plus space • PC/104-Plus or PCI-104 card • Multiple configura- • 512 MB high-speed NAND flash (17 MBps) • Internal PCI bus, PC/104 tions • IRIG-B input and output connector • Linux utility loads FPGA in 0.6 seconds • One GbE (10/100/1000 • Extended Enhanced Mini-ACE PC/104-

speeds), two SD sockets (one microSD, one full-size SD), two USB 2.0 (E2MA) BC/RT/MT architecture | 480 Mbps high-speed host/ • 1 MB RAM with parity per

slave ports, two SATA ports, and 1553 channel • Built-in self-test 110 GPIO lines (86 arranged as a • 48-bit/1 microsecond time stamp PC/104 bus in the default FPGA • IRIG-106 Chapter 10 monitor load) • Fanless operation from format • DMA engine for low

PC/104 -20 °C to +70 °C CPU and PCI utilization www.embeddedARM.com www.ddc-web.com

WinSystems, Inc. PC/104 Eurotech Inc. PC/104-Plus PCM-MIO RSC# 30336 COM-1480 RSC# 35716 High-density analog and digital PC/104 I/O card that operates from -40 °C Highly integrated low-power PC/104-Plus board with advanced wireless to +85 °C • Two standard configurations available: 16-bit A/D, 12-bit D/A, communication technologies • Tri-band UMTS/HSDPA (up to 3.6 Mbps 48 DIO; or 12-bit A/D, 12-bit D/A, 48 DIO • No adjustment potentiometers downlink) and quad-band EDGE/GPRS/GSM (up to 216 Kbps downlink) or calibration needed • Software-programmable interrupt configuration • Optional dual-band CDMA 1xEV-DO Rev A/1xEV-DO Rel 0/1xRTT (up to • Free software drivers in C, Windows, 3.1 Kbps downlink) • 12-channel low-power GPS receiver • L1 frequency, and Linux • Conversion speed: up to C/A code (SPS) • Tracking sensitivity: 100 KSps, throughput about 85 KSps -156 dBm • GPS position: 1.2 m (CEP95) (processor dependent) • Analog input • Velocity: 0.1 ms • Time: 20 ns RMS (static ranges: 0 to 5 V, 0 to 10 V, ±5 V, and mode) • GPS protocol: NMEA-0183 • Operat- ±10 V • 48 bidirectional TTL-compatible ing temperature: -20 °C to +60 °C • Humidity: DIO lines with 24 capable of event- up to 95 percent • NC power: +5 V ±5 percent sense interrupt generation • Supports Windows CE, XPe, and Linux www.winsystems.com www.eurotech.com

For Single Print Only

42 / Winter 2008 PC/104 and Small Form Factors For Single Print Only 2009 BUYER’S GUIDE PC/104 and Small Form Factors Eurotech Inc. PC/104-Plus Excalibur Systems, Inc. PC/104-Plus

Plus CPU-1484 RSC# 37292 EXC-4000P104Plus/F1 RSC# 34012 Embedded board based on two modules: mezzanine CPU module and Card for PC/104-Plus systems • Supports up to two dual redundant PC/104-Plus form factor carrier • Pentium M 1.4 GHz (2 MB L2 cache) with 1553 channels using the M4K155PxII module • Compatible with all i855GME chipset • 512 MB DDR PC2100 soldered onboard, IDE ATA 100 common variations of 1553 • Multiprotocol • Each channel can operate flash support, onboard VGA and LVDS graphics controller • Two serial simultaneously as a bus ports (RS-232/422/485), four USB 2.0, GbE, controller with up to 32 remote PC/104- Fast Ethernet • AC’97 audio interface, terminals and as a triggerable keyboard, mouse, and programmable monitor • Error injection WD and RTC • Operating temperature: (BC and RT modes) and error 0 °C to +60 °C standard, -40 °C to +85 °C detection (all modes) extended • Humidity: up to 95 percent supported on each channel • NC power: +5 V ±5 percent • Supports www.mil-1553.com Windows CE, XPe, and Linux www.eurotech.com

Eurotech Inc. PC/104-Plus Jacyl Technology Inc. PC/104-Plus ISIS RSC# 39116 XG-5000K RSC# 33237 Based on Intel Atom processor at up to 1.6 GHz processor speed and PC/104-Plus FPGA board • 5 million gate Spartan-3 FPGA • Onboard Intel SCH US15W • PC/104 industry standard offers a broad range of 256 MB Micron SRAM and 32 MB Intel flash • Four 66-pin VHDC expansion capabilities, including ISA-compatible PC/104, PCI-compatible connector banks providing a total of 264 user-programmable I/O PC/104-Plus, LPC, and SMBus • Up to 1 GB DDR2 RAM, 4 GB flash, and • CompactFlash Type 1 connector • Secondary 400K gate Spartan-3 FPGA flash expansion capabilities via SDIO socket • Integrated 10/100BASE-T • 10/100BASE-T Ethernet interface and two RS-232 interfaces • 0 to 25 MHz Ethernet LAN, three high-speed serial ports, PS/2 keyboard and mouse user-programmable DDS FPGA master support, eight USB 2.0 ports, GPS receiver, clock source with a fixed 25 MHz FPGA and Atmel Trusted Platform Module device master clock source • Incorporates Xilinx’s compatible with TCG v1.2 • Intel HD audio, advanced design revisioning technology MPEG-2/3/4, and HDTV encoding with LVDS • Available in industrial temperature and VGA display options • Windows XP, range • Can be powered from the PC/104 XPe, CE, and Linux support connector or an external 5 VDC source www.eurotech.com www.jacyltechnology.com

LiPPERT Embedded Computers PC/104-Plus Cool RoadRunner-LX800 RSC# 32957 For High-performanceSingle PC/104-Plus board • AMD Geode LX800 processor Print Only at 500 MHz • 1 GB DDR333 RAM maximum • Graphics up to 1,920 x 1,440 pixels • CRT, TFT, and LVDS adapters • 10/100BASE-T Ethernet and USB 2.0 • 6.5 W power consumption • Optionally extended temperature range: -40 °C to +85 °C • Runs Windows, Linux, and VxWorks www.lippertembedded.com

LiPPERT Embedded Computers PC/104-Plus Cool RoadRunner-PM RSC# 32956 PC/104-Plus SBC with PCI and ISA bus • Intel Pentium M or Celeron M processors • 1 GB DDR-SODIMM RAM maximum • SXGA: 2,048 x 1,536 pixels • Dual-channel LVDS for displays • 10/100BASE-T Ethernet, six USB 2.0, two RS-232 or RS-485 • Low power consumption: 16 to 32 W depending on processor • Passive cooling possible • Extended temperature range available for 1.0 GHz version www.lippertembedded.com

44 / Winter 2008 PC/104 and Small Form Factors For Single Print Only For Single Print Only PC/104 and Small Form Factors 2009 BUYER’S GUIDE PC/104 PC/104- MPL AG PC/104-Plus Connect Tech, Inc. (CTI) PCI/104-Express MIP10 RSC# 39083 PCI/104-Express Serial Communications RSC# 39242

Powerful, fanless PC/104-Plus CPU board for operating range from Xtreme/104-Express offers options for new and emerging long -40 °C to +75 °C • Offers long-term availability, ruggedness, and reliability life-cycle designs • PCI-104 Plus • Optional with conformal coating • Rugged and fanless PC/104-Plus pass-through connector for board with integrated passive cooling concept • Soldered low-power transitioning PCI-104 cards to Pentium M 1.4 GHz CPU PCI Express stacks • Up to

• Soldered 256 MB ECC 15.625 Mbps RS-232/422/485 |

RAM and additional communications • 9-bit support PCI/104-Express socket for up to 1 GB with 128-byte FIFOs • Filtering on ECC RAM • GbE and all ports for immunity to EMI and CompactFlash slot noise • Fail-safe transceivers onboard • All onboard • Lifetime warranty headers are lockable www.connecttech.com www.mpl.ch

MPL AG PC/104-Plus RTD Embedded Technologies, Inc. PCI/104-Express MIP405 RSC# 18420 DM9820HR RSC# 39169

PC/104-Plus SBC that consumes less than 3 W • PPC405GPr with a CPU PCI/104-Express module with 48 bits of high-speed digital I/O • Uses large |

clock of up to 400 MHz (608 DMIPS at 400 MHz) • Four serial ports, two FIFOs and DMA transfers to allow for efficient digital data management Rugged and Mil-Spec USB ports, two 44-pin IDE ports, and 10/100BASE-T Ethernet • PC/104-Plus • PCI Express x1 interface • 48 diode-protected I/O lines • 2 MB input FIFO (PCI and ISA) interface • Up to 128 MB onboard soldered SDRAM with buffer onboard • Pulse width ECC support • Up to 8 MB onboard modulators, incremental soldered flash; up to 1 GB of encoders, programmable additional flash can be plugged in clocks, 82C54 timer/counters, • Multipurpose socket • Supplied and advanced interrupt with the U-Boot bootloader and an modules • 24 mA source and Embedded Linux distribution and sink current • Operational development chain • -40 °C to from -40 °C to +85 °C +85 °C operating temperature range www.rtd.com www.mpl.ch

VersaLogic Corp. PC/104-Plus AIM-USA Rugged and Mil-Spec Cougar (EPM-14) RSC# 36928 PC104p-1553 RSC# 39097 PC/104-Plus SBC targeted at military, homeland security,For avionics, and Rugged, reliable,Single extended temperature PC/104-Plus module designed Print Only medical applications • AMD LX800 processor • 256 MB soldered-on DDR as a flight-ready MIL-STD-1553A/B interface for avionics applications memory • -40 °C to +85 °C extended temperature range • High-performance • Simulates bus controller, 31 remote terminals, and bus monitor simul- video • Integrated I/O and Ethernet • CompactFlash socket • Draws less taneously • Six fully programmable than 5 W of power • Dual 10/100 Ethernet, USB 2.0 support, and RS-232/ discrete inputs/outputs • -40 °C to 422/485 COM ports • High-resolution video output can be configured for +85 °C extended temperature range standard desktop-type displays or • Software drivers for Windows, LVDS flat panels • RoHS-compliant unit Linux, and various RTOSs (VxWorks, compatible with a variety of embedded Integrity, and LynxOS) • High-level OSs, including Windows, Linux, C and C++ API • IRIG-B time code VxWorks, and QNX • Customizable in decoder for common time source OEM quantities as low as 100 pieces synchronization with other devices www.versalogic.com www.aimusa-online.com

WIN Enterprises PC/104-Plus AIM-USA Rugged and Mil-Spec MB-73030 RSC# 35990 PC104p-CMB-208 RSC# 39099 PC/104-Plus module • Low power consumption, maximum 12 W Rugged combination MIL-STD-1553A/B and ARINC 429 PC/104-Plus • Embedded AMD Geode LX800 CPU up to 500 MHz • One DDR SODIMM module designed as a flight-ready interface for avionics applications up to 1 GB memory • Dual • Single- or dual-channel MIL-STD-1553 dual redundant interface • Each 10/100 Mbps PCI bus Ethernet 1553 channel can independently simulate a bus controller, 31 remote • Supports CRT, 18/24-bit TFT terminals, and bus monitor simultaneously • Four or eight independently interface • Two serial ports programmed as Tx or Rx ARINC 429 channels and four USB 2.0 ports • One • Software device drivers for Windows, LabWin/ Ultra ATA-66 interface and one CVI and LabView/VIs, Linux, and RTOSs CompactFlash Type I/II socket (VxWorks, Integrity, and LynxOS) • High-level • AC’97 audio (optional) C and C++ API delivered with full source code www.win-ent.com • IRIG-B time code decoder for common time synchronization with other devices www.aimusa-online.com

PC/104 and Small Form Factors Winter 2008 / 47 2009 BUYER’S GUIDE PC/104 and Small Form Factors ADLINK Technology Inc. Rugged and Mil-Spec Jacyl Technology Inc. Rugged and Mil-Spec Ampro by ADLINK CoreModule PC/104 RSC# 39232 Mission Workstation RSC# 37071 Reliable and Extreme Rugged Ampro by ADLINK CoreModule family of Multicomputer ruggedized workstation • Incorporates ruggedized air/EMI PC/104 SBCs for applications exposed to harsh environments • Extreme filter system • Production tested to fully powered 3G NAVMAT vibration Rugged design for harsh and environmental stress screening tests • Functionally tested to -10 °C environments • Small PC/104 to +60 °C • Independently configured with Intel Core 2 Duo or Core 2 Quad size, stackable I/O expansion processors up to 3 GHz • Each computer has two PCI, one PCI x16 or two • Three-year warranty on PCI x8, two GbE, four SATA, up to two Extreme Rugged products ESATA, up to 12 USB 2.0 ports, and • Optional -40 °C to +85 °C up to 32 GB RAM • Can be configured support (ETT) and conformal as four individual computer systems coating • Ideal for military, or one cluster/parallel computer with

Rugged and Mil-Spec aviation, and transportation 16 3.0 GHz processors, 32 GB RAM, applications and 5.7 TB HDD space www.ampro.com www.jacyltechnology.com

ADLINK Technology Inc. Rugged and Mil-Spec LiPPERT Embedded Computers Rugged and Mil-Spec RuffSystem RSC# 39237 Cool SpaceRunner-LX800 RSC# 37901 Truly rugged by design • Extreme Rugged system features conductive Fully self-contained rugged SBC • AMD Geode LX800 processor cooling for the Pentium M or Core 2 Duo • Choice of Extreme Rugged at 500 MHz with 256 MB soldered DDR333 RAM • CRT and LVDS with internal boards: COM 840 backlight and resolution up to 1,920 x 1,440 pixels • IDE Ultra ATA-100 – Intel Core 2 Duo • 2 GB solid-state disk and GME965 combo • 10/100BASE-T Ethernet, four or LittleBoard 800 – USB 2.0 ports, and two serial Pentium M or Celeron M ports that support RS-232/422/ CPUs • Optional -40 °C 485 • Low power consumption to +75 °C support (ETT) • Extended temperature range: • Rugged resistance -40 °C to +85 °C to shock and vibration www.lippertembedded.com • Wide OS support www.ampro.com

Excalibur Systems, Inc. Rugged and Mil-Spec Logic Supply Rugged and Mil-Spec ES-6000/x (Dragon) RSC# 34031 Fanless Systems RSC# 35817 Modular, stack-through PC/104 and PC/104-Plus platformFor permits the Ultra-compact,Single ruggedized GS-L08 platform designed around the Print Only integration of other commercially available PC/104 and PC/104-Plus cards VIA Pico-ITX form factor • Small, fanless x86 system suitable for a wide • Can be modified or upgraded at any time as technology and require- range of industrial and embedded applications • Audio, four USB 2.0 ports, ments change • Includes a processor card, power supply, and selection COM port, VGA, and LAN • Solid-state configurable • IDE flash disk drive of ARINC 429 and MIL-STD-1553 boards • Each unit is heat sink protected, extends platform longevity • Built-in 120 W pico DC converter • 146.5 mm x enabling an operational temperature range from -40 °C to +85 °C • Comes 50.0 mm x 109.0 mm (5.77" x 1.97" x 4.29") • Based on Mini-ITX main boards with military-style waterproof connectors • Offers embedded engineers an economical alternative to traditional and seals between rings to impede water industrial systems • Utilizes heat-pipe incursion as well as EMI/RFI protection technology and aluminum fins for for the inner electronics • Compact passive cooling, which creates an footprint allows for versatility • Runs any enclosure suited for environments version of Windows or other OSs prone to dusty or harsh conditions www.mil-1553.com www.logicsupply.com

Hybricon Corp. Rugged and Mil-Spec Parvus Corporation Rugged and Mil-Spec Rugged PC/104 RSC# 34708 DuraCOR 820 RSC# 36887 Rugged enclosure provides thermal and environmental protection for Lightweight metal chassis that weighs less than 3 pounds standard COTS PC/104 boards • Mixed force convection/conduction- • Approximately 7" x 4" x 3" • Low-power 1.4 GHz Intel Pentium M cooled chassis keeps external and internal air paths separate to avoid architecture • Preloaded Linux image or Windows XPe evaluation license condensation forming on printed circuit cards • Primary input power to boot up out of the box • Lightweight, ultra-miniature MIL-D38999-like to the chassis is 28 V DC in accordance with MIL-STD-704F • Avionics connectors • Designed to meet packaging • Lightweight • Compact size (holds up to eight PC/104 modules) MIL-STD-810F, MIL-STD-461E, • Complex system monitoring • Thermal and MIL-STD-704E • Suitable for monitor controls heaters and fans applications such as unmanned • Removable and configurable front panel vehicle mission processors, • Designed to operate at -56 °C to +50 °C command and control on the move, and at 45K ft altitude • Suits defense/ and rugged computing aerospace applications www.parvus.com www.hybricon.com

48 / Winter 2008 PC/104 and Small Form Factors For Single Print Only For Single Print Only PC/104 and Small Form Factors 2009 BUYER’S GUIDE Rugged and Mil-Spec Parvus Corporation Rugged and Mil-Spec WinSystems, Inc. Storage DuraMAR 1000 RSC# 37659 Ext. Temp. CFlash RSC# 35888 Wide protocol support: mobile IP, OSPF, IP multicast, IGMP, IP policy CompactFlash cards with 128 MB to 8 GB storage capacity • Sophisticated routine, Cisco GPM, EIGRP-IP, RIP • Ethernet: one L3 and two L2 E/FE error checking and wear-leveling algorithms • Withstands 2,000 g shock ports; one async and two sync/async serial ports • Lightweight and and 16.3 g vibration • -40 °C to +85 °C operating temperature • In-stock compact (8" x 4" x 6") with availability and RoHS compliance • Fixed disk operation for Windows CE, 9 to 36 VDC power supply XPe, Linux, and other x86-based OSs • Cisco Systems’ industry- • Greater than 2 million program/erase standard IOS software cycles and unlimited reads • Fast transfer • Compliance with speeds up to 16.6 MBps in burst mode EN50155; sealed IP67 • Targeted for applications that need connectors • Extended industrial-grade reliability, industry-standard

temperature available compatibility, and IDE hard disk drive |

www.parvus.com emulation for program and data storage www.winsystems.com Stand-alone systems

Roder Electronics Rugged and Mil-Spec Active Silicon Ltd. Vision systems and displays PC104 Enclosures RSC# 38990 Phoenix & LFG RSC# 35830 Specifically produced to protect PC/104 electronics that work in hostile Phoenix supports single and industrial environments • Rugged anodized aluminum PC/104 enclo- base Camera Link sources sure designed for harsh environments • Securely holds PC/104 modules • Extended temperature • High immunity to electro- range • Extensive opto-isolated magnetic interference and high TTL and LVDS triggering and heat dissipation • Custom sizes I/O lines • LFG captures real- and panels available • Standard time video from PAL/NTSC/ height from 20 mm to 200 mm CCIR/RS-170 video inputs and from 1" to 10" • Variety of • S-video or composite/mono- |

models and panels with different chrome video sources plus openings; custom openings audio capture • 5 V and Storage available • Industrial design 12 V fused output www.roderelectronics.com www.activesilicon.com

Stand-alone systems Vision systems and displays |

Eurotech Inc. Advanced Micro VX-150P RSC# 37416 Peripherals, Ltd. Vision systems and displays Extremely compact panel PC with high brightnessFor 15" display microMPSingleEG4 RSC# 37818 Print Only • Celeron M up to 1.5 GHz, Intel Pentium M 1.8 GHz, Intel Core Duo 2.0 GHz Codec board • 4-channel MPEG-4 encoder/decoder on a Mini PCI • 8-wire resistive touch-screen display form factor • Sub credit card-sized: 60 mm x 45 mm • Tiny, low-power, 15" XGA (1,024 x 768) • SSD flash disk: high-performance board for capturing and compressing up to four CompactFlash Type II socket • 2x K/M concurrent live analog PAL or PS/2, 3x RS-232, 4x plus 1x USB 2.0, NTSC video inputs • Can decom- VGA, audio, parallel • 2x Ethernet 10/100 press and replay recordings from (Celeron/Pentium M), 2x Ethernet storage to display and preview 10/100/1000 (Core Duo) • Slot: one incoming video • Text overlay with Mini PCI or one PCI half size plus one time and date stamping supported Mini PCI • Minimal CPU load www.eurotech.com www.ampltd.com

NEXCOM International Co., LTD Stand-alone systems Advanced Micro Vision systems and displays VTC 6000 RSC# 39194 Peripherals, Ltd. In-vehicle computer for automated vehicle location systems, advanced MPEG4000WA RSC# 39239 driver information systems, emergency message systems, in-vehicle sign- 4-channel PC/104-Plus form factor MPEG codec for capturing and ing, telematics control units, and other in-vehicle applications • Fanless compressing up to four concurrent analog video NTSC or PAL MPEG-4, design with ruggedized aluminum chassis • One PCI-104 and two Mini MPEG-2, or MJPEG inputs • Onboard PCI Express expansion interfaces • Wide-range DC input from 6 to 36 V watermark authentication supports • Power ignition on/off delay control • Circuitry design for low-power pro- evidential recording and law enforce- tection • External smart battery backup support • S3 and S4 suspend mode ment applications • Can decompress support • Built-in heater for low-temperature operation • GSM/GPRS/GPS and replay recordings and preview (optional CDMA/HSDPA) • Multiple incoming video • High-resolution text display connections through VGA, and graphics overlay supported • Up to TV-out, and LVDS • Optional IP54 four full-size .25 frame rate or full frame enclosure • e13 mark certification rate .25 size D1 inputs www.nexcom.com www.ampltd.com

PC/104 and Small Form Factors Winter 2008 / 51 2009 BUYER’S GUIDE PC/104 and Small Form Factors Advanced Micro Vision systems and displays Sensoray Co., Inc. Vision systems and displays Peripherals, Ltd. Model 2251 RSC# 34699 PC/104 VTV2000 RSC# 39238 Provides hardware video capture and compression in a small form PC/104 form factor scan converter board for converting noninterlaced factor • MPEG-1/2/4 and JPEG capture to USB from an analog video VGA signals up to 2,048 x 1,536 resolution from PCs or Macs into broadcast- source at D1 resolution • 30 fps NTSC, 25 fps PAL • Synchronous quality NTSC, PAL, or RS-170/TV audio capture from a line level (stereo) input • Multiple region motion signals • Onboard Frame Store detection • Text overlay features digital scan conversion, (OSD) • Compact form flicker filtering, scaling, color factor for embedded space conversion, and encoding designs • SDK works • Software tunable to application with multiple units requirements • Requires a single www.sensoray.com 5 V power supply; stand-alone operation optional www.ampltd.com Vision systems and displays Sensoray Co., Inc. Vision systems and displays Enter RSC# or search for Model 2255 RSC# 33021 4-channel USB frame grabber • Simultaneous capture from four new products composite video sources • Total capture rate of 60 fps from all channels for NTSC • Two channels at 30 fps each • Four channels at 15 fps each • Full frame rate capture on all channels in monochrome or scaled-down modes • Multiple output formats and resolutions • Powered through USB • Easy-to-use API • Multiple units supported by the driver • Supports Windows and Linux www.sensoray.com www.smallformfactors.com/rsc

For Single Print Only

52 / Winter 2008 PC/104 and Small Form Factors For Single Print Only Redefining ‘anywhere’

It’s been quite an interesting year as small form factor boards and module or system off the shelf because it’s all you’ll have time systems have continued to show up everywhere and anywhere, to do in order to meet deadlines. Wasting months in the devel- redefining what’s possible with the genre. Notable trends in 2008 opment process to save $4.37 on an SBC design for moderate included the completion of the PCI/104-Express specification, volumes won’t lead to a win. emergence of the SUMIT specification, continued growth in COM Express choices, and VITA’s and other organizations’ inter- The last inch is the hardest. What you should be spending time est in developing new small form factors. But as usual, there’s on is the I/O. Ethernet, USB, PCI Express, and similar connectiv- more going on behind the headlines. ity options have not only improved performance and ease, but also made shape much less important than function. Although Extending the PC/104 family with a standard way to interface there are some important differences among these connectors, with PCI Express was a long-awaited and important develop- many small form factors now provide similar interface capabili- ment. We brought you the details on this interface in the article ties. The compute modules and primary I/O pipes are standard, but entitled “An inside look at PCI/104-Express” published in the the last inch of I/O needs to be incredibly flexible and often cus- Summer 2008 issue of PC/104 and Small Form Factors. tom. Winning means embracing and supporting that flexibility.

In this issue starting on page 8, we explore the SFF-SIG’s Solutions step forward. Designers need to consider what SUMIT specification. SUMIT takes a different approach to software goes with the board. There’s a lot to be said for a module PCI Express with some unique twists for other I/O interfaces like with a Real-Time Operating System (RTOS) or Linux board Low Pin Count (LPC) and Serial Peripheral support package already ported to it, ready Interface (SPI). The SFF-SIG is also work- “Wasting months in to work now. SBC and OS vendors have ing on other efforts including Express104, been teaming up and doing this for a while an enhanced Pico-ITX, and the MiniBladeFor the development Single by including drivers for many I/O boards. Print Only storage module. Semiconductor firms and distributors have process to save $4.37 on an also gotten the idea, putting out more and COM Express and its close relatives con- more reference kits with software already tinue to proliferate, with more and more ported. If such a solution works now and modules appearing. Especially prominent SBC design for moderate can shave months off a project, it can make this year are COM Express modules based the difference in winning. on new processors like the Intel Atom chip- volumes won’t set or the VIA Nano with native PCI Express If it’s really rugged, it’s unlikely to be and other integrated interfaces. lead to a win.” standard. I’ve looked at several rugged systems lately, and they all seem to have VITA is reaching into the small form factor space with ideas one thing in common: They’re radically different. Ruggediza- including the FPGA Mezzanine Card (FMC) and Rugged System- tion is often designed and tested into a solution customized for on-Module Express (RSE), both early in their development. the problem at hand. Again, the standards won’t necessarily be inside the board or box, but rather around the edge in things like In the midst of these small form factor developments, we’ve Ethernet, USB, and PCI Express. Working with a vendor who continued to present new and different concepts in our Focus on understands the problem and how to solve it is critical to win. Form Factors feature – concepts like CompactRIO, Qseven, and StackableUSB, among many others. We’ve also looked closely at The boundaries of small form factors are hard to delineate. the low-power processors that are creating new opportunities for I use the smaller-than-my-toaster criteria to state it in lay terms. designers and module users. Despite the ambiguity surrounding the term “small,” one thing in this market remains clear: The “anywhere” where small form No matter what small form factor you’re using or considering, factors show up is being redefined daily, and the wins are increas- everyone needs to step back and think about several overriding ing rapidly. trends in this market.

Who’s got time to recreate wheels? If you’re doing something that someone has already done, like designing an SBC, you’re wasting precious time, and who can afford that? More low- and Don Dingee mid-volume customers should contemplate buying a compute [email protected]

54 / Winter 2008 PC/104 and Small Form Factors For Single Print Only