MEMS based inertial measurement unit for attitude and heading reference Systems 49 J. Bartholomeyczik, S. Zimmermann, U. Breng, W. Gutmann, M. Hafen, E. Handrich, M. Huber, U. Kempfer, H. Kopmann, J. Kunz, P. Leinfelder, R. Ohmberger, U. Probst, M. Ruf, G. Spahlinger, A. Rasch, J. Straub-Kalthoff, M. Stroda, K. Stumpf, C. Weber, M. Zimmermann, Wolfram Geiger, LITEF GmbH, Germany

New high resolution optical incremental rotary encoder 57 Volker Mayer, Marc Schneider, Jonathan Seybold, Tim Botzelmann, Karl-Peter Fritz, Heinz Kück, HSG-IMIT, Germany

Fully-integrated wireless CMOS smart sensor 65 Fredy Segura-Quijano, Jordi Sacristän, Jesus Garcfa-Canton, Teresa Oses, Antonio Baldi, CNIVHMB (CSIC), Spain

A readout cireuit for remote interrogation of capacitance transducers 73 Michel Nowak, Nicolas Delorme, Eric Colinet, CEA LETI - Minatec, France Gilles Jacquemod, Universite Nice, Sophie Antipolis, France Francois Conseil, MBDA Le plessis-Robinson, France

Bibliografische Informationen digitalisiert durch http://d-nb.info/987741438 gescannt durch Cost-driven design of Smart Micro Systems 81 Michael Niedermayer, Jan Hefer, Stephan Guttowski, Fraunhofer IZM, Germany Herbert Reichl, Technical University Berlin, Germany

Session II: Reliability, testing and quality of components and Systems

Approaches of local stress measurement on microsystem devices 89 Dietmar Vogel, Ellen Auerswald, Astrid Gollhardt, Bernd Michel, Fraunhofer IZM, Germany Falk Luczak, Technical University Berlin, Germany Neus Sabate, Universität de Barcelona, Spain

Novel stress measurement System for evaluation of package induced stress 97 Hartmut Kittel, Stefan Endler, Robert Bosch GmbH, Germany Heinz Osterwinter, TransferZentrum Mikroelektronik, Germany Sonja Österle, Arburg GmbH, Germany Florian Schindler-Saefkow, Fraunhofer IZM, Germany

Long-term Performance of ultrasonic transducers used for energy and data transmission 105 Luong van Ngo, Helmut Seidel, Ulrich Schmid, University of Saarland, Germany Martin Kluge, Jordi Sabater, Josef Schalk, EADS Innovation Works, Germany

Reliability improvement in Smart Systems Integration 111 Michael Hertl, Jean-Claude Lecomte, Diane Weidmann, INSIDIX, France

Microsecurity and Nanosecurity - security research using the advantages of Smart System Integration 119 Bernd Michel, Fraunhofer IZM, Germany Thomas Winkler, Berliner Nanotest und Design GmbH, Germany

Application of high-resolution X-ray microscopy to image backend-of-line structures 121 Ehrenfried Zschech, AMD Saxony LLC & Co.KG, Germany Stefan Braun, Fraunhofer IWS, Germany Wenbing Yun, Xradia Inc., USA

Session III: Advanced MEMS and MOEMS technologies I

Smart Micromachined Ultrasonic Probe with advanced imaging Performances ... 129 Cyril Meynier, VERMON SA & Inserm U930/CNRS FRE 2448, France Mathieu Legros, Guillaume Ferin, An Nguyen-Dinh, Remi Dufait, VERMON SA, France Dominique Certon, Inserm U930/CNRS FRE 2448, France

Improved methods of System integration for MEMS-based laser projection Systems 137 Michael Scholles, Heinrich Grüger, Klaus Frommhagen, Christian Gerwig, Jens Knobbe, Hubert Lakner, Dirk Schlebusch, Markus Schwarzenberg, Uwe Vogel, Fraunhofer IPMS, Germany

10 Monolithic integration of MEMS resonators in a 0.35um CMOS technology for gravimetric sensor and radiofrequency applications 145 Gabriel Abadal, Francesc Torres, Joan Lluis Lopez, Arantxa Uranga, Nürio Barniol, Universität Autönoma de Barcelona, Spain Jordi Teva, MIC-lnstitut for Mikro- og Nanoteknologi DTU, Denmark Jaume Verd, Universität de les Illes Balears, Spain Jaume Esteve, Francesc Perez-Murano, CNM-CSIC, Spain

Session IV: System integration and packaging I

MEMS package in a harsh environment for aeronautic applications 153 Alois Friedberger, Christian Gradolph, Florian Klettner, Gerhard Müller, EADS Innovation Works, Germany Jürgen Wilde, University of Freiburg, Germany

Advanced adhesives based on Carbon Nanotube technology 161 Hans-Jörg Fecht, University of Ulm/ Forschungszentrum Karlsruhe, Germany Andreas Leson, Fraunhofer IWS, Germany Bernd Michel, Fraunhofer IZM, Germany Matthias Werner, NMTC- Nano & Micro Technology Consulting, Germany

Integration of optical and microfluidic functions in a hollow waveguide platform 165 Mark McNie, Michael Jenkins, Alan-Shaun Wilkinson, Andrew Turner, QinetiQ Ltd., United Kingdom Guido Spinola Durante, Christian Bosshard, CSEM, Switzerland Tom Harvey, Epigem Ltd., United Kingdom Pavel Janus, Institute of Electron Technology, Poland

3D wafer level System integration - requirements & technologies 173 A. Klumpp, M. Juergen Wolf, Peter Ramm, B. Wunderle, Herbert Reichl, Fraunhofer IZM, Germany

Ultra small system-in-packaging for medical applications 181 Pascal Couderc, Christian Val, 3D Plus, France

Batch fabrication methods for Active Polymer Microsystems 189 Thomas Grund, Manfred Kohl, Forschungszentrum Karlsruhe GmbH, Germany

Implantable packaging technique featuring through wafer interconnects and Iow temperature direct bond 193 James Lee, Applied Microengineering Ltd., United Kingdom

Waferbond technologies and quality assessment 199 Maik Wiemer, Jörg Frömel, Fraunhofer IZM, Germany Thomas Gessner, Fraunhofer IZM/ Technical University of Chemnitz, Germany

11 Session V: Self-sufficient sensor networks

The benefit of MEMS in Wireless Sensor Network applications 207 Xavier Lafontan, NOVA MEMS, France

Electromagnetic inertial microgenerators for vibrational energy scavenging: Implementation of a Si technology based modular process for optimised devices 209 Nürio Fondevilla, Chistophe Serre, Susanna Martfnez, Alejandro Perez-Rodrfguez, Joan Ramön Morante, University of Barcelona, Spain Emile Martincic, Universite Paris-Sud-Xl, France Josep Montserrat, Jaume Esteve, CNM-CSIC, Spain

Wearable self-powered wireless devices with thermoelectric energy scavengers .. 217 Vladimir Leonov, Chris Van Hoof, Tom Torfs, Firat Yazicioglu, Paolo Fiorini, IMEC, Belgium Bert Gyselinckx, Ruud Vullers, Holst Centre, IMEC-NL, The Netherlands

An electromagnetic energy harvester for Iow frequency excitation 225 Dennis Hohlfeld, Ruud Vullers, Jo de Boeck, Holst Centre / IMEC-NL, The Netherlands

Wireiess power transmission for RF-MEMS devices integrated into large-scale radiating apertures 233 Laurent Dussopt, CEA-Leti/ Minatec, France

Presentation of platforms for Wireless Advanced Networks of sensors for aeronautics applicatic-n 239 Katell Moreau, EADS France-Innovation Works, France

Session VI: Emerging nanosystems and processing of new materials

Nanosystems VLSI 247 Michael Roukes, California Institute of Technoloy, USA

Fabrication of nanomechanical sensors monolithically integrated on CMOS by füll wafer nanostencil lithography 249 Julien Arcamone, Francesc Serra-Graells, Francesc Perez-Murano, CNM-IMB (CS1C), Spain Marc A. F. van den Boogaart, Jürgen Brugger, EPFL, Switzerland Jordi Fraxedas, CIN2 (CSIC-ICN), Spain

Optical nanosensors based on organic nanofibers 257 Morten Madsen, University of Southern Denmark, Denmark

Laser machining of thin films on top of flexible Substrate carriers 259 Tino Petsch, Jens Hänel, Bernd Keiper, Karsten Bleul, 3D - Micromac AG, Germany

INKtelligent printing of metal and metal alloys for sensor structures 265 Marcus Maiwald, Bernd Günther, Veronika Ruttkowski, Christian Werner, Matthias Müller, Dirk Godlinski, Ingo Wirth, Volker Zöllmer, Matthias Busse, Fraunhofer IFAM, Germany

12 Session VII: Special aspects of integration for automotive, aeronautics, logistics, life science, RF and bio applications

Smart Power SoC: Technology challenges and innovations 271 Marnix Tack, Peter Moens, Renaud Gillon, Johan Janssens, AMIS, Belgium

MEMS-based spectroscopic ellipsometry 277 Ray Saupe, Thomas Otto, Fraunhofer IZM, Germany Thomas Gessner, Fraunhofer IZM/ Technical University of Chemnitz, Germany Bernd Gruska, Sentech Instruments GmbH, Germany Alexander Weiss, Center for Microtechnologies (ZfM), Germany Volker Stock, COLOUR CONTROL Farbmesstechnik GmbH, Germany

Implantable brain stimulator for epilepsy seizure inhibition 285 Cristina Boero, Marco Mazza, Adrian M. lonescu, EPFL, Switzerland Daniel Bertrand, Geneva University, Switzerland

An all-polymer microfluidic System for protein sensing applications with integrated Iow-cost pumps, surface modification and sealing 291 Jörg Nestler, Karla Hiller, Technical University of Chemnitz, Germany Thomas Gessner, Fraunhofer IZM/Technical University of Chemnitz, Germany Jeröme Gavillet, CEA, France Janko Auerswald, Helmut Knapp, CSEM, Switzerland Christian Griffith.s, Samuel Bigot, Cardiff University, United Kingdom Marie-Claire Beckers, Eurogentec S.A., Belgium

COB vs. Flip Chip - A technology and cost comparison based on a real product .. 299 Joachim Kloeser, AEMtec GmbH, Germany

A smart System based on a lab on a card for detection of salmonella spp. in faeces 307 M. Agirregabiria, M. Tijero, J. Berganzo, L. J. Fernandez, K. Mayora, J. M. Ruano-Löpez, Ikerlan S. Coop., Spain G. Olabarria, L. Verdoy, Gaiker-IK4, Spain

Session VIII: Advanced MEMS and MOEMS technologies II

Tunable/switchable thin film Bulk Acoustic Wave (BAW) resonator using thin electrostrictive film under DC bias for GHz applications 311 Brice Ivira, Alexandre Reinhardt, Emanuel Defay, Marc Aid, CEA-Leti/ Minatec, France Alexandre Volatier, TriQuint, USA Pascal Ancey, STMicroelectronics, France

A 5-bit K-Band MEMS phase shifter in a 1-level plastic package 319 S. Bastioli, Paola Farinelli, Alessandro Ocera, Roberto Sorrentino, University of Perugia, Italy Francesco Di Maggio, Ignazio Pomona, Massimo Russo, Selex Communications Spa, Italy F. Giacomozzi, Benno Margesin, Fondazione Bruno Kessler, Italy

13 Ultrasonic micro hot embossing of polymers exemplified by a micro thermal flow sensor 327 Puttachat Khuntontong, Werner Karl Schomburg, RWTH Aachen, Germany Thomas Blaser, RINCO Ultrasonics AG, Switzerland

Session IX: System integration and packaging II

Liquid chromatography miniaturised System for agrofood applications 335 Antonella Benvenuto, Leandro Lorenzelli, Mattia Malfatti, FBK-irst, Italy Luca Francioso, Pietro Siciliano, IMM-CNR, Italy Anna Vilä, Universität de Barcelona, Spain Giorgio Verrelli, University of Rome "Tor Vergata", Italy

Printing of UHF modulators on embedded Silicon in semi-passive RFID 343 Hans-Erik Nilsson, Claes Mattsson, Johan Siden, U. Geyer, Mid Sweden University, Sweden

Hybrid chip-scale integration of inertial MEMS by Chip-to-Wafer vacuum bonding 351 Norman Marenco, Wolfgang Reinert, Fraunhofer ISIT, Germany Hannes Kostner, Gerhard Hillmann, Datacon Technology GmbH, Austria

Session X: Market trends

Smart System Integration, an Option for a future MEMS-product management ... 359 Johannes Herrnsdorf, HL-Planar Technik GmbH in Measurement Specialties Ine, Germany

MEMS markets and new applications 363 Eric Mounier, Yole Developpement, France

From MST components to Smart Systems: example of IMU 367 Jeremie Bouchaud, Richard Dixon, WTC - Wicht Technologie, Germany

Special Sessions

EPoSS - Presentation of the new research agenda 369 Guenter Lugert, Siemens, Germany Chairman Executive Committee, EPoSS

MNT ERA-Net Conference Improving European MNT program co-operation 371 Roland Brandenburg, FFG Austrian Research Promotion Agency, Austria

Invited Speech

Linking of National and European Innovation Policies - the case of Smart Systems Integration 373 Gerhard Finking, BMBF, Germany

14 Poster Session

Microcantilever-based sensor array for amine detection in agro-food applications 375 Andrea Adami, Massimiliano Decarli, Leandro Lorenzelli, Vittorio Guarnirei, Mattia Malfatti, FBK-irst, Italy Constantin Apetrei, Maria Luz Rodriguez Mendez, University of Valladolid, Spain

Development and characterization of platinum thin films for gas analysis microsystem 378 Ali Badar Alamin Dow, Adam Skiorz, Wolfgang Benecke, Walter Lang, University of Bremen, Germany

Innovative micropower Solutions for Wireless Autonomous Sensor Nodes 381 Geert Altena, Ruud. J. M. Vullers, V. Pop, Holst Centre/ IMEC-NL, The Netherlands T. Sterken, IMEC vzw, Belgium R. Puers, ESAT, Belgium

From the flexible/rigid-flexible circuit board solution to the mechatronic 3D unit 385 Dirk Bäcker, LPKF Laser & Electronics AG, Germany

Efficient wireless powering of single-chip Systems 389 Antonio Baldi, Fredy Segura-Quijano, Jesus Garcia-Canton, Jordi Sacristän, Teresa Oses, CNM-IMB, Spain

A new method for wafer level integration of Silicon components on LTCC 392 Heike Bartsch de Torres, M. Fischer, R. Gade, M. Mach, J. Müller, M. Hoffmann, Technical University of Ilmenau, Germany B. Pawlowski, S. Barth, HITK e. V., Germany

Micro machining technologies for non Silicon materials 395 Mario Baum, Thomas Otto, Fraunhofer IZM, Germany Astrid Rota, Natalie Salk, Fraunhofer IFAM, Germany Thomas Gessner, Fraunhofer IZM/Technical University of Chemnitz, Germany

Integrated multi-domain modeling and Simulation of complex 3D micro- and nanostructures 399 Tomasz Bieniek, Grzegorz Janczyk, Pawel Janus, Andrzej Kociubinski, Piotr Grabiec, Jerzy Szynka, Institute of Electron Technology, Poland

Sensors and actuators based on microcoils 403 Christian Bolzmacher, Karin Bauer, EADS Innovation Works, Germany

Development of a piston type condenser microphone for reconfigurable acoustic arrays 406 Carlos Calaza, FBK-irst, Italy

Micro/nano integration of organic/inorganic hybrid nanostructures on the basis of molecular self-assembly and dielectrophoresis 409 Andrea Csäki, IPHT Institut for Physical High Technologie e.V., Germany

15 MiniMags - microtechnical challenges miniaturizing electro-magnetic valves .... 412 Lars Dittrich, Matthias Kallenbach, Martin Hoffmann, Technical University of Ilmenau, Germany

Planarity optimization of spatial light modulators 415 Peter Duerr, Steffen Wolschke, Thomas Ludewig, Ulrike Dauderstaedt, Detlef Kunze, Michael Wagner, Hubert Lakner, Fraunhofer IPMS, Germany

Tuneable bio-doped sol-gel glasses for the fabrication of photonic sensors 418 Cesar Fernändez-Sänchez, Victor J. Cadarso, Carlos Domfnguez, Andreu Llobera, CNM-IMB (CSIC), Spain Margarita Darder, CNM-ICMM (CSIC), Spain

Novel test structures for stiction characterization by adhesion force 421 measurement Thomas Friedrich, Carsten Raudzis, Roland Müller-Fiedler, Robert Bosch GmbH, Germany Jörg Bagdahn, Fraunhofer IMM, Germany

Closed loop controlled liquid dosing system 424 Martin Götz, Matthias Ashauer, Matthias Storz, Michael Kleiser, Roland Zengerle, HSG - IMIT, Germany

Smart microscopic slide providing electro-acoustic actuation of a small fluidic sample and various microscopic illumination schemes 427 Christian Bonerz, Matthias Gruber, University of Hagen, Germany

Optoelectronic Sensors based on OLED-on-CMOS 430 Uwe Vogel, Daniel Kreye, Sven Reckziegel, Heinrich Grüger, Tino Pügner, Michael Törker, Jörg Amelung, Michael Scholles, Fraunhofer Institute for Photonic Microsystems (IPMS), Depts. Sensor & Actuator Systems and Organic Materials and Systems, Dresden, Germany

A multilayer process for the connection of fine-pitch-elements on three- dimensionally molded interconnect devices (3D-MIDs) 433 Thomas Leneke, Soeren Majcherek, Sören Hirsch, Bertram Schmidt, Otto-von-Guericke-University Magdeburg, Germany

Analysis of thermomechanical stress in Bare Die Assemblies on polymer Substrates 436 Soeren Majcherek, Thomas Leneke, Sören Hirsch, Bertram Schmidt, Otto-von-Guericke-University Magdeburg, Germany

Technology of hybrid integration of Silicon MEMS and CMOS structures using polymer 439 Pavel Janus, Piotr Grabiec, K. Domanski, Andrzej Kociubinski, D. Szmigiel, Institute of Electron Technology, Poland

Fabrication of a Iow-frequency ultrasonic transducer 443 Chenping Jia, Karla Hiller, Technical University of Chemnitz, Germany Maik Wiemer, Thomas Otto, Fraunhofer IZM, Germany Thomas Gessner, Technical University of Chemnitz/ Fraunhofer IZM, Germany

16 Microsystems-engineering Solutions for inductive components with high ampacity 447 Matthias Kallenbach, Christian Mühlke, Martin Hoffmann, Technical University of Ilmenau, Germany

Intelligent Silicon Substrates for a shorter microsystem design cycle 451 Jani Karttunen, Jari Maekinen, Markku Tilli, Okmetic Oyj, Finland

A NEMS array for a signal to noise ratio imporvement and mechanical filter design 454 Chady Kharrat, Eric Colinet, CEA LETI - Minatec, France Alina Voda, GIPSA-lab, LAG, France

Application of higher order sensitivity FE method for parametric MEMS design ... 457 Vladimir Kolchuzhin, Wolfram Dötzel, Jan Mehner, Technical University of Chemnitz, Germany

Thermal mass flow sensor for measurement of liquids (water) 460 Peter Lange, Fraunhofer ISIT, Germany Massimiliano Melani, Lorenzo Bertini, Marco De Marinis, SensoDynamics AG, Italy

Multimedia SIM card testing 463 Rachid Laqli, Gemalto, France

Complex miniaturized analysis System for nuclear magnetic resonance spectroscopy of nanoliter amounts of biological sample material 466 Stefan Leidich, Technical University of Chemnitz, Germany Thomas Riemer, University of Leipzig, Germany Marco Braun, NMR-Service, Germany Steffen Kurth, Fraunhofer IZM, Germany Thomas Gessner, Fraunhofer IZM/Technical University of Chemnitz, Germany

Smart multihop communication for wireless sensor networks 470 Zdravko Karakehayov, Niels Lervad Andersen, University of Southern Denmark, Denmark

Reliability improvement of Sub 100 um lead free FC solder Joint by a pre-bonding technique 473 Le Luo, Xiaoqin Lin, Shanghai Institute of Microsystem and Information Technology, CAS, China

Minimizing the impact of fabrication tolerance on embedded filters 477 Gerhard Fotheringham, Uwe Maass, Ivan Ndip, Stephan Guttowski, Fraunhofer IZM, Germany Herbert Reichl, Technical University Berlin, Germany

802.15.4 wireless sensor network 480 Alfredo Maglione, Nicola Battisti, Optoelettronica Italia S.r.l., Italy

Integrated microneedle arrays and assembly techniques for drug delivery applications 483 Geetha Mahadevan, Ponnambalam Selvaganapathy, Heather Sheardown, McMaster University, Canada

17 Systemintegration for electromechanical actuator in automobiles 486 Johann Maier, AB Mikroelektronik GmbH, Austria

Thermo-mechanical modelling of Chip to Wafer hermetic vacuum bonding process 489 Krzysztof Malecki, Kazimierz Friedel, Technical University of Wroclaw, Poland Gernot Bock, Gerhard Hillmann, Datacon Technology AG, Austria

Broadband Parameters of compact FT spectrometer based on fabry-perot interferometer integrated with detector 492 Anatoüy Manuilskiy, Henrik Andersson, Göran Thungström, Hans-Erik Nilsson, Mid Sweden University, Sweden

Time-dependent reliability of ultra-scaled CMOS devices and its impact on circuit Performance 495 Javier Martfn-Martfnez, R. Rodrfguez, M. Nafrfa, Universität Autonoma de Barcelona, Spain S. Gerardin, A. Paccagnella, X. Aymerich, Universita di Padova, Italy G. Ghidini, ST Microelectronics, Italy

Integration of micro-optical components for a blue ray DVD pickup System 498 Matthias Mohaupt, Erik Beckert, Ramona Eberhardt, Andreas Tünnermann, Fraunhofer IOF, Germany

Evaluation of a Iow cost piezorresistive material for high resolution tactile sensors 501 Julian Castellanos, Rafael Navas-Gonzälez, Fernando Vidal-Verdü, University of Malaga, Spain Estibalitz Ochoteco, Cidetec, Spain

Highly integrated polymer-based technology platform for in-vitro diagnostics 504 Thomas Otto, Joerg Nestler, A. Morschhauser, M. Schueller, Thomas Gessner, J. Krissler, F. Ebling, Fraunhofer IZM, Germany M. Wegener, A. Grzesiak, M. Burgard, Fraunhofer IAP, Germany A. Brandenburg, G. Sulz, Fraunhofer IPM, Germany E. Nebling, R. Hintsche, Fraunhofer ISIT, Germany I. Wirth, D. Godlinski, Fraunhofer IFAM, Germany G. Tovar, A. Weber, Fraunhofer IGB, Germany E. Ehrentreich-Foerster, N. Gajovic-Eichelmann, F.F. Bier, Fraunhofer IBMT, Germany

In-Situ determination of multiple properties of films using Hot-Stage optical microscopy and micromachined test structures 508 Chi Hsiang Pan, National Chin-Yi University of Technology, Taiwan

Low power tracking system for advanced health monitoring 511 Vincent Rouet, EADS France-Innovation Works, France Julien Venet, EADS France-Innovation Works (now with Oberthurr), France

Selective deposition of pH Sensitive Nanostructurated films 514 Carlos Ruiz Zamarrefio, Public University of Navarra, Spain

18 Fabrication and characterization of a passive silicon-based direct methanol fuel cell 517 Neus Sabate, Juan Pablo Esquivel, Joaquin Santander, N. Torres, I. Gräcia, P. Ivanov, L. Fonseca, E. Figueras, Carles Cane, CNM-CSIC, Spain

Package induced stress Simulation an experimental verification 521 Florian Schindler-Saefkow, Fraunhofer IZM, Germany

Design and implementation of a micro structure printer for rapid prototyping of microimplantable medical devices 525 Leander Kraaijeveld, Markus Schwarz, University of Applied Sciences Niederrhein, Germany

Test-structures for wafer level microsystems characterization 528 Alexey Shaporin, Roman Forke, Ralf Schmiedel, Wolfram Dötzel, Jan Mehner, Technical University of Chemnitz, Germany Detlef Billep, Fraunhofer IZM, Germany Thomas Gessner, Fraunhofer IZM/Technical University of Chemnitz, Germany

Concepts and realization of a rotational micropump System in LTCC (Iow temperature cofired ceramicsj-technology 532 Walter Smetana, Technical University of Wien, Austria

Integration of an elasotmer in micromachining technology 533 Sofiane Soulimane, S. Charlot, D. Bourrier, A. Bancaud, A.-M. Gue, H. Camon, LAAS - CNRS, France J. Sudor, CEA-Leti/ MINATEC, France

Self-powered wireless sensor module 537 Peter Spies, Loreto Mateu, Fraunhofer IIS, Germany Dirk Ebeling, Fraunhofer IPM, Germany

Electron beam machining of microsystem products 540 Gheorghe Tanasie, Stefan Boehm, Jan Baertle, Thorsten Loewer, Andrea Reiter, Michael Franzkowiak, Günther Reinhart, Technical University of Braunschweig, Germany

Achievements and perspectives of the DRIE technology of the microsystems market 543 Michel Puech, Jean-Marc Thevenoud, Jean-Marc Gruffat, Nicolas Launay, Pierrick Godinat, Oliver Le Barillec, Alcatel Micro Machining Systems, France

Calibration in a MEMS based measurement System or how to make a sensor-ASIC loop of high resolution work 546 Lars M. Vosskaemper, Dolphin Integration GmbH, Germany Christian Domingues, Lucille Engels, Loic Sibeud, Dolphin Integration SA, France

Changes in the MEMS industry 2007-2012 550 Henning Wicht, Jeremie Bouchaud, WTC - Wicht Technologie Consulting, Germany

Thin Substrate handling by electrostatic force 553 Robert Wieland, Karlheinz Bock, Erwin Hacker, Christof Landsberger, Peter Ramm, Fraunhofer IZM, Germany

19 Integrated planar Iow-cost sensor for reflection interference spectroscopy 557 Matthias Will, Olaf Brodersen, Arndt Steinke, CiS Institut for Microsensoric GmbH, Germany Florian Pröll, Lutz Steinte, Günter Gauglitz, Eberhard Karls University of Tuebingen, Germany

A miniaturized atmospheric Dielectric Barrier Discharge (DBD) plasma system for mass spectrometry analysis of biosamples 560 Chao-Chi Yang, Jen-Taie Shiea, Che-Hsin Lin, National Sun Yat-Sen University, Taiwan

Author Index 563

Exhibition Preview 569

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