Feature Benefit

Industry leading 0.13 micron Enables Cool Processing by minimizing power manufacturing process consumption and heat generation while maximizing total system cost efficiency

PadLock Data Encryption First x86 processor on the market to feature built-in Shield Hardware Random Number Generator

Highly efficient CoolStream World's smallest x86 processor die size of 52mm2 architecture

Ultra low power Industry leading typical power consumption of a mere consumption 11.25 watts

Ultra low heat Low heat, so less active cooling is required. Ideal for quiet and silent PC designs

Clock speeds of 1GHz and Superior digital media and productivity application beyond performance

16 Pipeline Stages Faster CPU speed and efficiency

StepAhead Advanced Looks ahead and gathers the data needs to optimally Branch Prediction run applications

Efficiency enhanced 64KB Improved memory and streaming performance Sales Information Full-Speed Exclusive L2 cache with 16-way associativity Contact one of these offices SSE Instructions Enhanced 3D and multimedia performance for information on VIA C3™ Introducing the next generation VIA C3™ processor integrating the new "Nehemiah" core. With its powerful processors Full Speed FPU Additional processing power for 3D graphics, PadLock™ Data Encryption Engine, the new VIA C3 is the first native x86 processor on the market with embedded multimedia, and streaming functions security features that enhance the protection of sensitive corporate and personal data. Based on an advanced VIA Headquarters VIA Technologies, Inc. Full x86 Operating System & Leverages the richest and most cost-effective software new VIA CoolStream™ architecture, the new VIA C3 delivers all the necessary performance for running even the software application development platforms, including Microsoft® 533 Chung Cheng Road 8F compatibility Windows® and Linux most demanding digital media applications while maintaining ultra low levels of power consumption and effective heat Hsin Tien, Taipei dissipation - making it the ideal solution for powering a new wave of innovation in secure, quiet running, small form factor PCs Taiwan EBGA/Socket 370 package Affordable, low power and small footprint platform Tel: 886 2 2218 5452 and digital entertainment devices. Fax: 886 2 2218 5453 [email protected] Continuing in the traditions of Cool influence, providing greater assurance to Processing, the new VIA C3 processor based end-users. USA on the Nehemiah core boasts even lower VIA Technologies, Inc. levels of power consumption combined with The new VIA C3 is based on the highly 940 Mission Court, Fremont, higher digital media performance and the efficient CoolStream architecture that is CA 94539, USA first ever on-die hardware Random Number specifically designed to minimize power Tel: 1-510-683-3300 Generator (RNG). Its low power consumption consumption and optimize heat dissipation - Fax: 1-510-687-4654 means that it does not require a noisy and while reducing overall system noise. Offering PadLock™ Data low levels of noise from architecture, the new multimedia instructions, [email protected] expensive CPU cooler allowing greater a typical design power of just over 10W and Encryption Engine system cooling fans. generation VIA C3 processor StepAhead™ Advanced freedom in system design, reduced overall a maximum design power of 15W at 1GHz, The new generation VIA C3 is is packed with new digital Branch Prediction, an system costs and lower total cost of the new VIA C3 requires minimal cooling the first native x86 processor Enhanced Digital media performance features, efficiency- enhanced 64KB China in the world to integrate a Media Performance including support for four Full-Speed Exclusive L2 cache VIA Technologies, Inc. ownership. Based on the industry standard enabling a new wave of stylish, quiet- high performance, hardware- With its VIA CoolStream™ new pipeline stages, SSE with 16-way associativity, and 6F, Dascom Tower, 9 Shangdi Socket 370 architecture, the new VIA C3 is running, small form factor system designs based Random Number a full-speed FPU. East Road, Haidian District, available in either EBGA (Enhanced Ball Grid helping to create a healthier and more stress- Generator with the Performance comparison between Ezra-T and Nehemiah core VIA C3™ processors Beijing, 100085 Array) or CPGA (Ceramic Pin Grid Array- free working and living environment. Ezra-T 1GHz Nehemiah 1GHz introduction of the VIA 732 Platform for Tel: 86-10-6296 3088 Socket 370) packages. PadLock™ Data Encryption Innovation Fax: 86-10-6297 2929 When coupled with the VIA Apollo CLE266 Engine that helps ensure With its industry leading low [email protected] + 9.6% + 12.6% + 11.0% + 11.0% + 12.9% + 73.0% The hardware RNG of the VIA PadLock Data chipset, the VIA C3 delivers performance greater confidentiality, 195 power consumption, 28.3 15.1 61.7 50.7 Encryption Engine is particularly important increases of up to 20% over the current integrity, and authenticity of 25.8 13.4 55.6 162 44.9 423 exceptional application Europe for embedded systems, as it does not rely on version of the VIA C3 processor in electronic data. performance, rock solid VIA Technologies GmbH less random seed data such as keystroke mainstream productivity applications and up reliability, and robust security Mottmann Strasse 12. timing or mouse events typically used to to 73% for 3D graphics applications. With its Ultra Low Power, features, the new VIA C3 53842 Troisdorf-Oberlar Low Heat and Low processor is unleashing a new Germany seed software-based RNGs (called highly efficient design, the new VIA C3 also Noise wave of innovation in secure, Tel: 49 2241 397780 pseudorandom number generators). runs up to 40% faster clock-for-clock than With a typical maximum A B C D E F stylish, quiet running small Fax: 49 2241 3977819 Integrating the RNG directly onto the die of the Intel® Pentium®4 Celeron processor design power of just over 10 form factor systems that are [email protected] the microprocessor makes it much more making it the most efficient native x86 watts at 1GHz, the new WinStone WinBench99 v1.1 3DMark expanding the PC platform [email protected] difficult for an attacker to probe or processor available today. generation VIA C3 runs A: Business Winstone 2001, v1.0.2 D: BusinessGraphics (Under Win2K) into exciting new market B: Business Winstone 2002, v1.0 E: High-End Business Graphics (Under Win2K) extremely cool, enabling ultra C: CPUMark99 (Under Win2K) F: 3DMark 2001 SE segments.