WIRELESS SOLUTIONS Complete and Custom Made Solutions for the Internet of Things (Iot) Discover More About the Other Atlantik Elektronik Semiconductor Solutions!

WIRELESS SOLUTIONS Complete and custom made solutions for the Internet of Things (IoT) Discover more about the other Atlantik Elektronik Semiconductor Solutions!

AUDIO & VIDEO DISPLAYS

EMBEDDED & PC MEMORIES PERIPHERALS

MICROCONTROLLER SENSORS & ANALOG (SoC, SoM, SBC) FRONT ENDS

WIRED CONNECTIVITY WIRELESS CONNECTIVITY

02 Atlantik Elektronik Wireless Solutions Content

4 About us

8 System on Chip Solutions 18 12 10 Bluetooth System on Chip 12 System in Packages Solutions

14 IoT Modules

16 Atlantik Wireless Lighting Solutions

19 Bluetooth Modules

20 Cellular Modules

22 RF Modules

30 24 PCI Express Front End Modules

26 USB Front End Modules

28 M.2 Front End Modules

30 SDIO Front End Modules

32 System on Modules

34 Single Board Computer 20 36 Cellular M2M Solutions 38 Antenna Solutions

39 Our Partner

03 About us

Atlantik Elektronik is a leading marketer of technology, and an expert in design- in of innovative semiconductor products and semiconductor solutions, notably in the high-end markets where growth is strong.

Being a provider of solutions, the company offers a range of services and products that deliver benefit to customers along their entire value chain. So as well as standard dis- tribution services, we also design technical concepts, plan projects, develop bespoke hardware and software and help our customers with their production.

Atlantik Elektronik is an international operator with branches in Germany, Austria, the Netherlands and Denmark. The company’s legal form is a GmbH; like its three sister companies, which are also active in tech environments, Atlantik Elektronik is part of Atlantik Networxx AG.

04 Business Model

Our business model is based on the principle of providing customers with services, products and expertise throughout the entire product life cycle, with practicable ad- vice to make things work. Our services range from product kickoff (the product idea, brainstorming, ideation) to EOL and re-design.

Product Idea: Development: Feasibility Studies Customized HW & SW Development Market Surveys Project Planning Marketing Concepts Technical Design In Support App Development Purchasing: International Production Production: International Production Sales: High qualified technical sales team Tight relationship to market leaders International customer support trough native speakers

Logistics Single & Frame Order Handling Delivery Schedule Handling Vendor Managed Inventory (VMI), Consigment Stock & Buffer Stock EDI

End of Life (EOL): Last Time Buy Re-design

05 Core Competencies & Market Segments

Key Technologies Key Market Segments Audio& Video Automotive Displays Consumer Embedded & PC Peripherals Industrial Memories Health / Fitness Microcontroller, SOCs, SOMs & SBCs Sensors & Analog Front Ends Wired Connectivity Wireless Connectivity

Key Services Customized Hardware/Software Development Product Definition Prototype and Series Production App Design/ Cloud Integration

06 Atlantik Services Bundlings for Embedded Single Board Computer

Benefit from Atlantiks Know How in embedded System development. To all of our Single Board Computers we can offer you a wide range of additional components like displays, memories, cellular solutions, RF Modules or antennas. We make sure that all components match together and provide all drivers needed for a fast and flawless development to significantly shorten your time to market. All components are available in industrial versions covering market requirements like wide temperature range, long term availability and system stability. Our experience in international sourcing will help you to get all key components of your product wherever, whenever you need them.

Benefits: One Stop Shopping – Reduce Sourcing Costs Matching Components – Reduce Development Time HW and SW Design Support App Design Seminars & Trainings

07 Wi-Fi System on Chip

Atlantik´s low-power Wi-Fi hosted and hostless SoC solutions posess optimized features for applications like smart home – appliances, home automation, security, energy management and many more. Comprehensive RTOS-based networking platforms provide full-featured dual band Wi-Fi and Bluetooth capabilities for a wide variety of products. Powerful integrated MCUs & large memories can eliminate the need for an additional MCU reducing the system cost. Atlantik provides a flexible set of configurations to meet every requirement.

Green Tx compatible Allows to save power when communica- ting with a nearby station or access point by reducing Tx power level while maintai- ning uplink throughput Tx power can be adjusted automatically to the minimum required level Tx power can be adjusted for a specific use case

Benefits IoT interoperability protocols Apple HomeKit Google WEAVE AllJoyn Advanced power saving modes & „Hosted vs. hostless designs“ fast wake-up times Wide range of middleware, utilities, applications & demos Hosted and hostless designs

08 IoT Wi-Fi Solutions

QCA4002/4 Low Power Wi-Fi QCA4010/12 Large 802.11a/b/g/n 1x1 dual-band Wi-Fi Memory Solution On-chip 130 MHz processor 802.11a/b/g/n 1x1 dual-band Hosted Architecture: Wi-Fi Offloads TCP/IP from host/SPI to MCU On-chip 130 MHz processor QCA4002 - 2.4 GHz Wi-Fi Hostless Architecture: QCA4004 - dual-band Wi-Fi On-chip 800kB free application memory QCA4010 - 2.4 GHz Wi-Fi QCA4012 - dual-band Wi-Fi

QCA4020 Next Gen RTOS Platform QCA4024 Next Gen RTOS Q2/17 Platform Q2/17 Multi connectivity: WLAN, BLE, 15.4 Multi connectivity: BLE, 15.4 ARM M4 CPU for application SW ARM M4 CPU for application SW CSRmesh™ Separate secured M0 CPU for Low Power 11n DB WLAN connectivity Concurrent BLE + 15.4 CSRmesh™ Multi-ecosystem, Cloud ready

QCA4531 SoC for IoT applications using Linux 2x2 11n Wi-Fi 2.4GHz 650 MHz MIPS 24Kc CPU Hostless Architecture Wide range of peripherals SPI, GPIO, UART, Ethernet, USB 2.0 Host, PCIe

09 Bluetooth System on Chip

In 1999, a small group of engineers had a big idea – to create a Bluetooth® product on a single chip. Everyone said that it couldn’t be done, but they went ahead and did it anyway. And that was how CSR was born. From those early beginnings, CSR (now Qual- comm) transformed and extended its reach beyond world-leading expertise in Blue- tooth technology, to become a diversified platform provider at the very center of the Internet of Things (IoT).

Atlantik has been a partner for CSR from the beginning. As the core of our Bluetooth offering we have build a large portfolio and expertise around the Bluetooth SoCs from CSR/ Qualcomm including modules, antennas, software, engineering and even own Bluetooth products (Blue LiteContol; see page 15) which are based on the Qualcomm CSR102x platform.

10 Bluetooth Smart/Smart Ready Solutions

CSR8510/8811 CSR101x BT4.1/4.2 Smart Ready chip BT4.1 Smart Chip USB2.0 / UART 64k RAM, 64kB ROM HCI Stack <18 mA Tx/Rx peak current Industrial grade <1 uA Dormant sleep mode 4x PWMs, 3x AIO

CSR8311 CSR102x BT4.1/4.2 Smart Ready chip BT4.2 Smart SoC USB2.0/UART 84kB RAM 256kB flash + OTP HCI Stack <5mA Tx/Rx peak current Industrial & automotive grade 4x multi links, 4x PWMs

CSR86xx Audio ROM CSR8350 BT4.1 Smart Ready chip BT4.1/4.2 Smart Ready chip SBC, AAC & AptX codecs USB2.0/UART Audio Stack with A2DP & HFP HCI Stack Industrial grade Industrial & automotive grade CVC & classic aptX support

CSRA63/64xxx Audio ROM CSR86xx BT4.2 Smart Ready chip BT4.2 Smart Ready chip SBC, AAC & LL-aptX codecs USB2.0 + UART Audio Stack Stack with A2DP & HFP 16MB eFlash Industrial grade CVC, LL-aptX & TWS support

CSRB534x BT4.1/4.2 Smart Ready chip USB2.0/UART Ideal for HID applications Industrial grade

11 System in Package

A system in package (SiP) or system-in-a-package is a number of integrated circuits enclosed in a single module (package). The SiP performs all or most of the functions of an electronic system, and is typically used inside small products where space matters. Dies containing integrated circuits may be stacked vertically on a substrate. They are internally connected by fine wires that are bonded to the package. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together.

Clever chip packaging means mobile devices can be smaller and smarter Qualcomm´s advanced packaging technology makes the SiP modules very thin and allow a very small footprint. The SiPs can be connected direct to the antenna and direct to the battery. An integrated reference and sleep clock combined with pre-calibration allow to use them without external RF tuning to have the smallest possible over- all footprint on the board making it ideal for very small form factor Internet of Everything devices.

Benefits High throughput SDIO interface Low power consumption Extended range Near-zero RBOM Integrated reference & sleep clock System tested & precision individually calibrated from factory Integrated RF shielding (>25dB isolation)

12 Lowest total price

QCA6104 QCA6134 802.11 a/b/g/n, 1T1R QCA6104 + BT (UART) SDIO 2.0 BT4.0 LE Throughput: 90 Mbps (HT40) Footprint compatible with 9.2mmx9.2mmx1.1 mm QCA6234 2x2 combo Designed for mobile/portable CE Near-Zero RBOM Integrated RF shielding (>25dB isolation) Precision individual calibration Power accuracy +1.5 dB@2 GHz, +2 dB @5 GHz

QCA6234 802.11a/b/g/n 2T2R BT4.0 LE (Low Energy), Class 1.5 (high power) Hardware RF+BB+MAC High Throughput: 110 Mbps (SDIO, UDP) / 180 Mbps (HSIC(1), UDP) Low Power Consumption: Deep Sleep/BT Idle: 0.08/0.09mA connected Sleep: 1.3 mA

SX-SDPAC 802.11a/b/g/n/ac 1T1R BT4.1+HS “Smart Ready” Based on the QCA9377 Chipset SDIO 3.0 WLAN Host Interface UART/PCM BT Interface Land-grid-array (LGA) Package 6.9mmx6.9mmx1.082mm Internal 48 MHz XTAL On-chip Power Management Unit (PMU)

13 IoT Modules

Our IoT Wi-Fi modules are the fastest path to production with many different approa- ches of integration. From consumer drones to medical devices to industrial air conditio- ners, our Wi-Fi modules get them to production. They are designed for those with expertise in their field who want connectivity in their application that just works. With hardened, field-proven network applications that don’t require man years just on the network piece.

No additional microcontroller Highlights: required for a wide range of Simultaneous SoftAP and Client access to applications serial ports HTTP Server with custom web pages With ready to use RTOS, TCP/IP Built-in encryption and wireless stack developers can Safe Over The Air firmware upgrade get their custom network applica- Ceramic antenna for best performance tions and services working on the (U.FL or pin for external antenna option) module or add an additional MCU Webserver for further flexibility. Low Power and Dynamic Power Management Hosted und hosteless Modules Benefits Fully certified modular RF certification Modules 100% fully tested Extended temperature (-40°C to +85°C) 5 year limited warranty Production ready solutions No RF engineering experience required Product longevity Optimized hardware for M2M and IoT applications Software rich: Network services Benefit from Atlantik´s huge portfolio Application suites and know-how in Wi-Fi IoT solutions. Security Robust and hardened BSP 14 Your fastest way to production

xPico Wi-Fi xPico Wi-Fi next Gen. (Q3/17) 120 MHz Cortex-M3 ARM Cortex-R4 802.11b/g/n Broadcom 802.11a/b/g/n (optional + BT4.2) SPI(x1), I2C, Analog (x2), GPIO (x8) up to 2 MB SRAM / 8MB Flash 1+1 MByte/ 128 Kbyte RAM 10/100 MB Ethernet MAC Wi-Fi Modes: STA, AP, AP+STA USB2.0 High Speed, UART, SDIO, SPI, Field-proven network applications I2C, 18 GPIOS Hosted and hostless Mode On Module antenna or U.FL Dual network support -40°C to +85°C

XBee® Wi-Fi WSDB-104GNI(BT) 802.11b/g/n BCM43438 chipset UART, SPI, DIO and 4x ADC interfaces 802.11 b/g/n + BLE4.1 Plug and Play Firmware Host interface: SDIO (WLAN), BT Wi-Fi Modes: STA, AP (UART) ZigBee, DigiMesh, Proprietary RF, Linux driver support and Wi-Fi in the same footprint

WSDQ-103GN(I) SX-ULPAN Qualcomm Atheros QCA4010 Qualcomm Atheros QCA4004 802.11b/g/n 802.11a/b/g/n Host Interface: UART SPI Slave (10 Mbps) Antenna: PCB printed ANT or Supports roaming, Wi-Fi direct and U.FL connector Smart antenna selection Qualcomm AllJoyn Platform Helps offload the host microcontroller

SX-ULPGN BC187 / BC188 Qualcomm Atheros QCA4010 Low Power Wi-Fi module with Micro- 802.11b/g/n controller and antenna UART, SPI, I2C, I2S, PWM, ADC, JTAG, IEEE 802.11n/g/b, 1x1 SISO, 2.4 GHz and GPIO interfaces and HT20 Qualcomm AllJoyn Platform Small form factor (22x 15.5x 1.5mm) BC187: 80 MHz processor, 36 kB RAM, 8 Mbit Flash BC188: Cortex-M4F CPU with integrated 512 KB RAM, 320 KB ROM 15 Atlantik Wireless Lighting Solutions

Our BlueLite Controller Series is addressing the dedicated Light Controlling application market. All over where is the need to get rid of the cable media but still need to use the standard protocolls i.e. DALI, DMX or a ordinary 0 - 10 V interface the BlueLite Control- ler is the most cost effective smart and certified solution. Controlling the lights via an App using an iPad User Interface of the App (iPAD) Features: Up to 192 light nodes addressable 64 groups definable 6 scens definable 5 sequences programmable Lights (Nodes) can be allocated to multiple groups OTAU (Over The Air Update support) Share Function (configuration transmittable)

User Mode View

Benefits Defining groups (assigning nodes to groups) Defining scenes & sequences (auto run of multiple scenes) Defining dimming cross points for scene switching, scene & fading Storing last dimming values & all parameters in configuration file Support of calendar functions Config Mode View (e.g. Auto On@8:00 & Off@20:00)

16 BlueLite Control Boards

BWHW-BLC-DC-P-A BWHW-BLC-AC-Da-B Driver-interface: 0-10 V, PWM Driver-interface: Dali-Rx Driving current up to 0.2 A AC supply 230 V DC supply 12 V Onboard antenna and U.FL Onboard antenna 7.5 dBm Tx power 7.5 dBm Tx power 44x30x13mm 55x25x9mm

BWHW-BLC-AC-Dx-B BWHW-BLC-CB-DMX Driver-interface: DMX Driver-interface: DMX AC supply 230 V DC supply 12 V Onboard antenna and U.FL Onboard antenna and U.FL 7.5 dBm Tx power 7.5 dBm Tx power 44x30x13mm 44x30x13mm

BWHW-SR-v1 BWHW-BLC-Dongle Smart relay USB Dongle (USB2.0) AC supply 230 V Embedded BLE HCI-stack 2700 W load capacity Win7 OS support Onboard antenna 7.5 dBm Tx power 7.5 dBm Tx power 40x35x22mm

17 Leading Bluetooth technology based on CSR / Qualcomm chipsets

1. Synchron Audio stream

2. True Wireless Audio stream A2DP audio l & r ch A2DP audio only r ch

3. Controlling / Remote / Automation Bluetooth Low Energy - BT4.0 (Bluetooth Smart) certified solutions with over the air Mesh -net working upgrade with lowest power consumption.

Bluetooth Smart / Smart Ready module

18 Bluetooth Modules

BTM501 BTM101 CSR-BC5MM Flash based Audio CSR1010 based BLE single mode module module AT# command set to control Output power 7.5 dBm, -92.5 dBm Supported profiles: PBAP, A2DP, OPP, sensivity AVRCP, and HS/HF CE, FCC, IC and BQB certified For Appl. Microphone and speakers Dimensions: 22mm x 13.4mm with Antenna via pad and strip line antenna CE and BQB certified Dimensions: 23.2mm x 11.9mm

BTM805 BTM201 CSR8811 based dual mode Host Latest Qualcomm/CSR single mode Controller Interface module Chip based (CSR1024) module with w/o antenna 256KB Flash for Applications Output power 7dBm Full BT4.2 compatible, full CSRmesh/ Antenna via pad and strip line BTmesh support UART interface Audio capture mode G.722 codec CE and BQB certified Dimensions: 10.6mm x 18mm Dimensions: 7mm x 7mm x 1.5mm

BC118 BC127/128 BT4.0 only, single mode BT4.1/BT4.2 (audio & data), UART, I2C, analog and GPIO Inter- with Melody Stack, dual mode faces UART, AIO, GPIO, USB, SPI, Audio In, Mic In, PCM, I2S, SPDIF, I2C

19 Cellular Modules

Cellular connectivitywith 2G (GSM), 3G (UMTS), 4G (LTE) and Narrowband IoT (NB-IoT) is serving mobile and embedded applications with necessary data. These Technologies are mainly driven by module manufacturers with the highly skilled quality products and their extreme fast and excellent technical support for integrating such technology. GSM/GPRS MC60 plus GNSS und Bluetooth 4.0 M95 44-pin LCC package 40-pin LCC package 18.7×16×2.1mm 19.9x23.6x2.65mm Quad-band GSM 850 to 1900 MHz Option for 3G Migration to UG95 GPS/GLONASS L1 Band Quad-band GSM 850 to 1900 MHz BT4.0 dual mode

M66 44-pin LCC package 17.7x15.8×2.1mm Quad-band GSM 850 to 1900 MHz BT3.0 Profile: SPP, OPP

NB-IoT BC95 BG96 based on NB-IoT /LTE CatM module Dual mode NB-IoT (CAT-M1 + NB1) 19.9mmx23.6mmx2.2mm MDM9206 chipset Extrem low power, bandwith Data rate of 375 kbps downlink and 100bps - 100 kbps (TBC) supports GSM 900 MHz now uplink 1800 MHz/700 MHz/850 MHz/ Ultra-low power consumption 800 MHz in the future IZatTM location technology

(US only, EU under development)

20 LTE/4G EC21 LTE Cat.1 based on EC20 LTE Cat.3 based on Worldwide UMTS/HSPA and GSM/ Worldwide UMTS/HSPA and GSM/ GPRS/EDGE coverage GPRS/EDGE coverage LCC Package 32.0x29.0x2.4mm LCC Package 32.0x29.0x2.4mm LTE 10 Mbps DL / 5 Mbps UL 100 Mbps DL / 50 Mbps UL UMTS / HSDPA -E / -A UMTS / HSDPA -E / -A DL MIMO 2x2, supports Rx-diversity DL MIMO 2x2, supports Rx-diversity GNSS support GNSS support

EC25 LTE Cat.4 based on SC20 LTE Cat.4 based on Worldwide UMTS/HSPA and GSM/ Snapdragon ARM Cortex-A7 GPRS/EDGE coverage @4x1.1GHz LCC Package 32.0x29.0x2.4mm High performance Adreno 304 gra- 150 Mbps DL / 50 Mbps UL phics processing unit UMTS / HSDPA -E / -A / -G 8 GB EMMC+8 GB LPDDR3 DL MIMO 2x2, supports Rx-diversity 2.4G/5.8G, 802.11a/b/g/n/ac GNSS support Cat.4 LTE Module - 150Mbps (DL) BT2.1+EDR/3.0/4.1LE GPS/GLONASS/BeiDou -40°C to +85°C Android OS opt. auch als SC20-W Variante - Wi-Fi und Bluetooth only EG91 LTE Cat.1 based on Low Power LTE Module with fall- back pin-to-pin compatible UMTS UG95/96 module Worldwide UMTS/HSPA and GSM/ All LTE EC2x modules GPRS/EDGE coverage also available as LCC Package 25.0x29.0x2.25mm Mini PCIe modules. 10 Mbps DL/5 Mbps UL DL MIMO 2x2, supports Rx-diversity EC2x Mini PCIe GNSS support GNSS

L70 based on L76 based on High sensitivity -165 dBm@Tracking, High sensitivity -165 dBm@Tracking, -148 dBm@Acquisition -148 dBm@Acquisition Compact size: 10.1×9.7×2.5mm Compact size: 10.1×9.7×2.5mm 166 acquisition channels, 22 tracking 166 acquisition channels, 22 tracking channels channels Ultra low power consumption, 12 mA Ultra low power consumption, 12 mA Active or Passive antenna support Active or Passive antenna support

L80 based on L86 based on High sensitivity -165 dBm@Tracking, High sensitivity -167 dBm@Tracking, -148 dBm@Acquisition -149 dBm@Acquisition Compact size: 16.0×16.0×6.45mm Compact size: 16.0×16.0×6.45mm 166 acquisition channels, 22 tracking Multi-GNSS engine channels 99 acquisition channels, 33 tracking Low power consumption, 20 mA, 7 µA@ channels backup mode 21 RF Modules

XBee is a series of easy-to-use RF embedded modules with a common footprint and fully interoperable with compatible XBee® products providing always the best RF solution depending on your system installation requirements.

No additional micro controller required XBee Grove Boards for a wide range of applications Quickly interface XBee with PC or Automatically sending analog microcontroller voltages (sensor values) Six grove module connectors Automatically sending digital I/O Available in each new XBee Dev Kit status Expand your prototyping with hundreds Automatically sending battery of widely available grove sensors voltage warnings

Benefits UART Data Input (3.3 V) 4 ADC’s (incl. auto sample) 8-16 DIO lines (incl. change detect) Supply voltage monitoring OTA configuration & firmware update Grove is a modular, ready-to-use tool set. Transparent AT mode/API mode for Much like Lego, it takes a building block full control, diagnostics and monitoring approach to assembling electronics. 22 XBee Series of Pin-Compatible RF Modules

XBee® ZigBee / 802.15.4 XBee® DigiMesh® 2.4 250 Kbps 250 Kbps Draw Tx/Rx 33 mA/28 mA Draw Tx/Rx 45 mA/50 mA ZigBee mesh networking Extended-range peer-to-peer Point to Multipoint mesh sleeping routers LoS: 1.2 km LoS: 90m (PRO Version: 1 km 150 mA/55 mA )

XBee® Cellular XBee® Thread Ready 921 Kbps via UART 250 Kbps LTE Cat.1 Draw Tx/Rx 33 mA/28 mA SSL/TLS for secure ZigBee protocol (upgradable to communications Thread protocol) Draw Tx/Rx 860 mA / 520 mA Low cost, low power Deep sleep approximately 10 μA LoS: 1.2 km

XBee® 868LP XBee® Wi-Fi Up to 80 Kbps 802.11b/g/n Draw Tx/Rx 48 mA/27 mA Up to 72 Mbps Low-power peer-to-peer mesh Draw Tx/Rx 309 mA / 100 mA for Europe Point-to-multipoint LoS: 4 km

23 PCI Express Front End Modules

PCI Express (PCIe), is a high-speed serial computer expansion bus standard. PCIe has numerous improvements over the older standards, including higher maximum system bus throughput, lower I/O pin count and smaller physical footprint, better performance scaling for bus devices and a more detailed error detection and reporting mechanism. Our next generation dual-band 802.11 a/b/g/n/ac PCIe modules with industrial temperature support are designed for devices that require wireless connectivity in a small form factor combined with high data throughput at extreme temperatures. They are ideal for high performance applications e.g. based on the NXP i.MX6 or In- tel/AMD x86 platform. They meet the demanding performance requirements of critical embedded applications including, but are not limited to, Medical devices, Security Sys- tems, Industrial, PoS, Digital Signs, Set-Top/Net-Top Box, Embedded/Industrial/Tablet PC, Handheld devices, Thin Client devices, and many more.

Minimizing efforts, time and cost during system approval by using our prompt Linux testing tool, porting and usage support and worldwide approval regulations consultation.

Benefits Industrial Versions available Longevity Industrial temperature range Improved drivers Testing Tool and porting support Highest througput Certifications

PCIe enables ultra-high data rates for 3T3R 802.11ac modules

24 Designed for highest data rates

WPET-232ACN WPEQ-256ACNI 802.11ac/b/g/n Mini Card 802.11ac/b/g/n Mini Card Realtek RTL8812AE Qualcomm Atheros QCA9892-BR4B Data rate up to 867 Mbps Data rate up to 867 Mbps Antenna: 2 x U.FL connectors, 2T2R Antenna: 2 x U.FL connectors, 2T2R 0°C to +40°C (operating) -40°C to +85°C (operating)

WPEQ-257ACN (Q4/16) WPEA-252NI 802.11ac/b/g/n Mini Card Qualcomm Atheros AR9592-AR1B Qualcomm Atheros QCA9882 802.11a/b/g/n Data rate up to 867 Mbps Data rate up to 300 Mbps Antenna: 2 x U.FL connectors, 2T2R Antenna: 2 x U.FL connectors, 2T2R -20°C to +55°C (operating) -40°C to +85°C (operating)

WPEA-121N WPEQ-353ACNI Qualcomm Atheros AR9382 Qualcomm Atheros QCA9890-BR4 802.11a/b/g/n 802.11ac/b/g/n Mini Card Data rate up to 300 Mbps Data rate up to 1.3 Gbps Antenna: 2 x U.FL connectors, 2T2R Antenna: 3 x U.FL connectors, 3T3R -20°C to +65°C (operating) -40°C to +85°C (operating)

WPEA-127NI WPEA-251N(BT) Qualcomm Atheros AR9390-AL1B Atheros AR9462 + AR5B22 802.11a/b/g/n 802.11a/b/g/n Wi-Fi + BT Mini Card Data rate up to 450 Mbps Data rate up to 300 Mbps Antenna: 3 x U.FL connectors, 3T3R Antenna: 2 x U.FL connectors, 2T2R -40°C to +85°C (operating) 0°C to +75°C (operating)

SX-PCEAC SX-PCEAN2 802.11ac/n Mini Card 802.11a/b/g/n Mini card Qualcomm Atheros QCA9880 Qualcomm Atheros QCA9592 or Data rate up to 1.3 Gbps QCA9582 0°C to +60°C (operating) Data rate up to 300 Mbps 3 x U.FL connectors, 3T3R -40°C to +85°C (operating) 2 x U.FL connectors, 2T2R

SX-PCEGN SX-PCEGN-BT 802.11b/g/n Mini card 802.11bgn 1x1 + BT4.0 Qualcomm Atheros QCA9287 Qualcomm Atheros QCA9485 + Data rate up to 300 Mbps QCA3012 0°C to +60°C (operating) Data rate up to 150 Mbps 2 x U.FL connectors, 2T2R -40°C to +80°C (operating) 2 x U.FL-R-SMT connectors, Wi-Fi:1T2R, BT:1T1R

25 USB Front End Modules

USB is an industry standard developed in the mid of the 1990s that defines the cables, connectors and communications protocols used in a bus for connection, communication, and power supply between computers and electronic devices. USB was designed to standardize the connection of computer peripherals (including network adapters) to personal computers to communicate and to supply electric power. USB has effectively replaced a variety of earlier interfaces, such as parallel ports, as well as separate power chargers for portable devices.

Higher throughput for Multimedia Different USB connectors for increased application flexibility Adopting the latest 802.11ac soluti- Like USB 2.0 Type A, 7-pin header (optio- on, WUBM-273ACN is ideal for high nal), 7-pin wafer connector (optional), USB throughput networking and multimedia 2.0 5-pin connector. applications that requires better Wi-Fi performance.

Benefits Industrial versions available Longevity Industrial temperature range Improved drivers Certifications

USB enables ultra-high data rates for 2T2R 802.11ac modules

26 Designed for highest data rates

WUBA-171GN 802.11b/g/n High-Power USB Module Atheros AR9271 Data rate up to 150 Mbps USB 2.0 5-Pin connector -30°C to +75°C (operating) 1 x U.FL connector 1T1R

WUBM-273ACN 802.11ac/b/g/n USB Module MediaTek MT7612U Data rate up to 867 Mbps USB Type A or 12-pin wafer connector 0°C to +50°C (operating) 2 x U.FL connectors, or printed antennas 2T2R

WUBR-508N Module WUBR-508N Dongle 802.11a/b/g/n USB Module 802.11a/b/g/n USB Dongle Ralink RT5572 Ralink RT5572 Data rate up to 300 Mbps Integrated printed antennas, USB 2.0 Type A (optional), 4-Pin or 2T2R 4-Pin Wafer connector (optional) Data rate up to 300 Mbps Printed antennas or 0°C to +50°C (operating) 2 x U.FL connectors (optional), 2T2R 0°C to +50°C (operating)

New Upcoming in Q2/2017 WUBQ-159ACN Dongle 802.11a/b/g/n USB Dongle WUBQ-159ACN Ralink RT5572 802.11ac/a/b/g/n Wi-Fi Integrated printed antennas, USB Embedded Module/USB Dongle 2T2R Qualcomm Atheros QCA9377 Data rate up to 300 Mbps Data rate up to 433 Mbps 0°C to +50°C (operating) U.FL connector or printed antenna, 1T1R Wide temperature range

27 M.2 Front End Modules

M.2, formerly known as the Next Generation Form Factor (NGFF), is a specification for internally mounted computer expansion cards and associated connectors. It replaces the mSATA standard, which uses the PCI Express Mini Card physical layout and connectors. M.2‘s more flexible physical specification allows different module widths and lengths, makes the M.2 more suitable particularly for the use in small devices such as ultrabooks or tablets. Dual - Band 802.11ac Solution 802.11ac/b/g/n Dual-Band WiFi + Bluetooth M.2 cards based on Qualcomm Atheros chipset supports 2T2R MIMO (Support WiFi/BT co-existence) technology, which runs up to 867Mbps and 1~3Mbps EDR for BT using 20/40/80MHz bandwidth and 256-QAM to maximize bandwidth efficiency. Higher throughput for Enterprise Networking Adopting the latest 802.11ac solution is ideal for next-generation high throughput enterprise networking solution.

Benefits Industrial Versions available Longevity Industrial temperature range Improved drivers Very small footprint Low cost

M.2 saves space for ultra-small mobile devices

28 Designed for highest data rates

WNFQ-255ACN(BT) 802.11ac/b/g/n Dual-Band Wi-Fi + Bluetooth M.2 module Qualcomm Atheros QCA6174 Data rate up to 300Mbps (2.4 GHz) / 867Mbps (5GHz) Bluetooth V4.1,V4.0 LE, V3.0+HS, V2.1+EDR Concurrent Wi-Fi and BT co-existence 0°C to +70°C (operating) 2 x IPEX MHF4 connector, 2T2R Drivers for Win7/Win8.1/Win10

WNFQ-158ACN(BT) 802.11ac/b/g/n Wi-Fi + Bluetooth M.2 module Qualcomm Atheros QCA9377A Data rate up to 150Mbps (2.4 GHz) / 433Mbps (5GHz) Bluetooth V4.1,V4.0 LE, V3.0+HS, V2.1+EDR Concurrent Wi-Fi and BT co-existence 0°C to +70°C (operating) 2 x IPEX MHF4 connector, 1T1R with RX diversity Drivers for Win7/Win8.1/Win10

WNFQ-258ACN(BT) 802.11ac/a/b/g/n WiFi + Bluetooth M.2 Card (WLAN: PCIe; Bluetooth: USB2.0) Qualcomm Atheros QCA6174A-5 Bluetooth V4.1,V4.0 LE, V3.0+HS, V2.1+EDR Supports for BT & WLAN Co-existence 0°C to + 70°C (operating) Antenna: 2 x IPEX MHF4 connector, 2T2R Drivers for Win7/Win8.1/Win10

29 SDIO Front End Modules

SDIO (Secure Digital Input Output) is an extension of the SD specification to cover I/O functions. SDIO cards are only fully functional in host devices designed to support their input-output functions. The digital interface will be connected to the system processor in the device. Nowadays it‘s extensively used to connect WiFi/Bluetooth chips on ARM boards. Our SDIO Wi-Fi modules bring 802.11n throughput, range and power efficiency to portable devices. Enables robust low power wireless connectivity for medical, commercial and industrial applications. Designed for battery operated devices like portable medical devices, industrial tablet devices, barcode scanners, mobile printers, and many more, our SDIO modules integ- rate both WLAN and BT functionality in single board designs to provide a cost-effective WiFi and Bluetooth co-existence implementation.

Benefits Industrial Versions available Longevity Industrial temperature range Improved drivers Freescale-recommended wireless connectivity solution for the i.MX 6 Each module is individually tested during the production process Low cost 802.11ac solutions

Different integration depths based on the same Wi-Fi chip offer a migration path from prototyping and pre-series to mass production.

30 Designed for highest data rates

SX-SDMAC SX-SDMAN2 802.11 a/b/g/n/ac + Bluetooth 802.11 a/b/g/n + BT Qualcomm QCA9377-3 Qualcomm Atheros AR6233 Bluetooth 4.1 BR/EDR/LE Smart Ready BT4.0 + LE dual mode Data rate up to 433Mbps Data rate up to 300Mbps -40°C to +85°C (operating) Connector Mount and SMT Versions Connector Mount and SMT Versions 2 x U.FL + Onboard 2T2R 2 x U.FL or 1x U.FL + Onboard 1T1R

SX-SDMGN SX-SDCAN2 802.11 b/g/n 802.11 a/b/g/n + BT Card Qualcomm AR6103 Qualcomm Atheros AR6234 Data rate up to 72Mbps BT3.0+HS, BT4.0, Class 1.5 -25°C to +85°C (operating) Data rate up to 300Mbps Connector Mount -40°C to +80°C (operating) 2 x U.FL connectors (dual diversity) SD Card Edge: 9 pins FFC Connector: 20 pins 2 x U.FL connectors, 2T2R

SX-SDCAC FC20 802.11a/b/g/n/ac + Bluetooth SDIO Card 802.11a/b/g/n/ac + BT4.1 Bluetooth 4.1 BR/EDR/LE Smart Ready (or b/g/n only) Qualcomm QCA9377-3 -40°C to +85°C (operating) Data rate up to 433 Mbps 16.6 × 13.0 × 2.1mm -10°C to +70°C (operating) Easier soldering and testing process MHF connector/ Chip antenna with LCC package

31 System on Modules

Atlantik Elektronik offers latest ultra-compact and highly integrated system-on-module solutions based on NXP/Freescale i.MX and Atmel ARM Cortex processors. With processor speeds up to 1.2 GHz and fully pin-compatible single-/dual-/quad-core variants, we offer truly future-proof platform solutions with scalable performance and pre-certified wireless 802.11a/b/g/n/ac and Bluetooth 4.x connectivity, including Bluetooth Low Energy. Low-profile and surface-mount designs maximize the integration flexibility and significantly reduce design risk in a highly cost- effective, reliable form factor with optimized heat dissipation capabilities even in the most demanding quad-core system configurations. Embedded Device Security: Trust Fence Embedded device security is a critical design aspect for the growing number of connected applications (“IoT”) and the ConnectCore for i.MX6 System on Modules remove the implementation barriers by providing you with a fully integrated, secure module platform with complete Linux software support.

Benefits Independent Cortex-M0+/Cortex-M4 Microcontroller Assist™ subsystem for advanced power management solutions Smart Power Management Architecture with PMIC Cost-effective, reliable, low-profile surface-mount module form factor Pre-certified 802.11a/b/g/n/ac and Bluetooth 4.x Compact software platform support Reliable design with IEC 60068 and HALT verification While operating systems like Windows, Designed for long-term availability Linux and Android offer the most flexi- 10+ years bility, plug and play Firmware brings out of the box wireless connectivity.

32 Designed for reliability and long-term availability

ConnectCore® 6 ConnectCard ® for i.MX28 NXP i.MX6 Cortex-A9 @4x1.2 GHz NXP i.MX28 ARM9 @454 MHz 802.11a/b/g/n and Bluetooth 4.0 802.11a/b/g/n and Bluetooth 4.0 1 Gbit Ethernet Dual Ethernet (10/100Base-T) Up to 64 GB flash, up to 2 GB DDR3 Up to 256 MB Flash / RAM Cost-effective SMT form factor PCI card form factor Linux, Android and Windows Linux and Android support Embedded support

ConnectCore® for i.MX6UL PremierWave 2050 NXP i.MX6UL Cortex-A7 @528 MHz Atmel ARM9 @400 MHz 802.11a/b/g/n/ac and Bluetooth 4.2 802.11a/b/g/n/ac Dual Ethernet (10/100Base-T) Ethernet (10/100Base-T) Up to 2 GB flash, up to 1 GB DDR3 128 MB Flash/32 MB DDR2 Cost-effective SMT form factor Simultaneous AP + Client On-module security + authentication Production Ready Software controller Linux support

SX-582 SC20 LTE Cat.4 based on NXP i.MX28 ARM9 @454 MHz Snapdragon ARM Cortex-A7 802.11a/b/g/n @4x1.1GHz Ethernet (10/100Base-T) High performance Adreno 304 gra- 8MB ROM/16 MB RAM phics processing unit PCI card form factor 8GB EMMC+8Gb LPDDR3 Linux operating system with user 2.4G/5.8G, 802.11a/b/g/n/ac programmability Cat.4 LTE Module - 150Mbps (DL) BT2.1+EDR/3.0/4.1LE GPS/GLONASS/BeiDou -40°C to +85°C Android OS

33 Single Board Computer

The ConnectCore 6 SBC is an ultra-compact and versatile off-the-shelf single board computer (SBC) family. It offers significantly reduced time to market by virtually eliminating the traditional risk, effort and complexity of custom board designs without sacrificing flexibility or capabilities. Built on the ConnectCore 6 (UL) modules, they provide a common platform with scalable NXP i.MX6 (UL) performance, pre-certified Bluetooth 4.x and Wi- Fi integration, XBee RF module and cellular connectivity options, Gigabit Ethernet, multi display/camera and audio support, external storage and expansion connectors, and reliability in harsh environments. Leading innovative features such as the Kinetis Micro Controller Assist™ (MCA) enable the development of connected products with highly optimized power footprints. Optional Digi Device Cloud integration provides secure remote management and device health monitoring capabilities for the Internet of Things. Benefits Compact off-the-shelf SBC family Scalable capabilities and i.MX6Quad/ Dual/DualLite performance Gigabit Ethernet and pre-certified dual-band Wi-Fi + Bluetooth 4.x Ready for cellular connectivity and XBee RF Complete set of available peripherals and interfaces with customization Product Life Cycles of over 10 years allow the options cost efficient development of products with very Designed for flexibility and reliability high certification costs like medical devices. Windows Embedded Compact, Linux and Android software platform support Industrial operating temperature available

34 Designed for flexibility and reliability

ConnectCore® 6 NXP i.MX6 Cortex-A9 @up to 4x1.2 GHz 802.11a/b/g/n and Bluetooth 4.0 incl. LE Up to 64 GB flash, up to 2 GB DDR3 Up to -40°C to +85°C Ready for cellular and XBee RF module integration Pico-ITX form factor, 72mm x 100mm Linux, Android and Windows Embedded support

Standard interface availability HDMI, Gigabit Ethernet, dual USB 2.0 Host, USB OTG, pin header for addt’l USB 2.0 host, SATA w/power, audio, USB OTG, CAN header, dual-camera (MIPI/parallel), multi-display (LVDS/MIPI/parallel/HDMI), Micro SD card slot, PCI Express Mini Card slot, I2C, SPI, GPIO, UART, console, JTAG , SWD

ConnectCore® for i.MX6UL Starter Board NXP i.MX6UL Cortex-A7 @528 MHz 802.11a/b/g/n/ac and Bluetooth 4.2 incl. LE 256 MB SLC NAND, 256 MB DDR3 -40°C to +85°C 87mm x 63mm, On-module security + authentication controller Linux support

Standard interface availability Single 10/100 Ethernet, PCB antenna, USB , UART, microSD, Pi HAT and Grove connectors, power (USB + header), and accessories

ConnectCore® for i.MX6UL SBC Based on the same module as the ConnectCore® for i.MX6UL Starter Board Pico-ITX form factor, 72mm x 100mm

Standard interface availability Dual 10/100 Ethernet, XBee socket, cellular connectivity support via PCI Express Mini Card, SIM, NFC, mi- croSD, USB Host, USB OTG, UART, DualCAN, SPI, I2C, LVDS, camera, antenna connector, battery connector, power supply, and accessories

35 Cellular M2M Solutions

Our extensive line of 3G, 4G LTE and LTE-Advanced (LTE-A) cellular M2M solutions offers an impressive selection of secure cellular routers and gateways for both commercial and industrial application needs. Our cellular M2M solutions feature intelligent engineering, consistent operability to keep your machines and devices connected 24/7 in the most demanding environments and reliable connectivity. Perform secure business transactions such as PCI compliant Point of Sale (POS), Data Capture and Remote Management and more without worry. Our commercial grade and enterprise class cellular routers and gateways are built for applications in industrial, energy, transportation, retail and more.

Connect® Sensor Easy-to-install and roll-out ready, battery-powered sensor monitoring cellular gateway solution. Weatherproof enclosure with wide temperature range makes it ideal for use in all environments Configurable read and report intervals with threshold and delta alarms Low cellular data usage that is consistent and predictable

Connect® Tank Fully Integrated Cellular-Enabled Tank Monitoring Solution.

Remote access to tanks located virtually anywhere Fully integrated sensor/long life-battery/global cellular in NEMA 4X enclosure for broad tank application support Tank location and level provides logistical and operational optimization

36 Cellular Enterprise Router

TransPort® WR11 Secure 3G/4G LTE cellular router for retail, kiosk and industrial control applications. Compact global 3G/4G LTE networking platform License-free enterprise software supporting advanced routing protocols, VPN, logging/ authentication, and stateful firewall Digi Remote Manager provides centralized configuration, security management, and network analytics

TransPort® WR21 Compact, flexible, low-cost 3G/4G LTE M2M enterprise router. Software-defined multicarrier and global 3G/4G LTE support License-free enterprise software supporting advanced routing protocols, VPN, logging/ authentication, and stateful firewall Digi Remote Manager provides centralized configuration, security management, and network analytics

TransPort® WR31 Secure 3G/4G LTE cellular router for retail, kiosk and industrial control applications. Compact global 3G/4G LTE networking platform License-free enterprise software supporting advanced routing protocols, VPN, logging/ authentication, and stateful firewall Digi Remote Manager provides centralized configuration, security management, and network analytics

TransPort® WR44 Family Enterprise class, commercial grade Wi-Fi to cellular router with flexible interface options ideal for distributed branch applications. Enterprise class cellular routers with advanced dynamic routing, security and firewall features High speed cellular interfaces: HSPA+ and 4G LTE Optional integrated 802.11 b/g/n; a/n Wi-Fi access point and 4-port Ethernet switch Heavy-duty enclosure and connectors designed for shock and high vibration environments

TransPort® LR54 High-speed LTE-Advanced (LTE-A) router with rock-solid stability and unmatched value. Maximum speed - LTE-Advanced (LTE-A) radio provides CAT 6 speeds up to 300Mbps - 2X the speed of current CAT 3 LTE Powerful and reliable Wi-Fi - featuring dual 2.4 and 5GHz radios, with 802.11ac Automated fail-over/fail-back - between Ethernet, Cellular (dual SIMs) and IPsec tunnels

37 Antenna Solutions

Our standard ranges of antennas for WLAN, Wi-Fi, GPS, ISM and telecoms applications are viewed as leaders in their markets. gigaNOVA

The gigaNOVA is market leading miniature embedded antenna family. They are used in traditional wireless applications as well as the newer M2M and IoT requirements. 868 / 915 MHz, 2.4-2.5 GHz, 4.9-5.9 GHz Frequencies GSM850 / 900 / 1800 / 1900/ WCDMA M2M and IoT requirements

lamiiANT

The lamiiANT is a family of SMD antennas, manufactured from FR4 materials. They use the latest in dielectric constant laminate substrates and are suitable for all wireless applications. 680-2700 MHz Frequencies Bluetooth, Wi-Fi, Zigbee, cellular, GNSS and more

ceriiANT

ceriiANT is a new family of miniature ceramic antennas that have been scaled down to amazingly small sizes. They are tiny and highly efficient antennas that designed for connected consumer devices, wearable technology and M2M applications. Extremely compact antennas Highly efficient Perform well close to the human body flexiiANT

flexiiANT is a new group of flexible FPC antennas with a cable and a connector, which are attached to the underside covering or housing of a customer’s product. Antennas of various sizes WLAN, ISM, telecoms, GPS and tracking

38 Our Partner - Your Benefits

39 Atlantik Locations

Headquarters Munich Atlantik Elektronik GmbH Fraunhoferstraße 11a 82152 Planegg, Germany Phone: +49 89 89 505-0 email: [email protected] Web: www.atlantikelektronik.com

Office Hamburg Office Benelux Deichstraße 17 Mgr. Ariensstraaat 1-02 20459 Hamburg, Germany NL-5104 KA Dongen, Netherlands

Office Austria Office Scandinavia Liebermannstraße A01 303-5 Postboks 58 A-2345 Brunn am Gebirge, Austria DK-2860 Søborg, Denmark

Issue 2017.3

Text and illustrations are not binding. Changes reserved, caused by technical advantages. All data in this brochure match the current status at time of printing.